Skip navigation

Items where Greenwich Author is "Bailey, Christopher"

Items where Greenwich Author is "Bailey, Christopher"

Up a level
Export as [feed] RSS
Group by: Item Type | Date | Funders | Uncontrolled Keywords | No Grouping
Jump to: 3D biochip separator, flow behaviour, flow fields | 3D printing; Electronics packaging; Design tools; Modelling; Reliability | 3D printing; electronics manufacture; machine learning; condition based monitoring; prognostics | ACF, failure, contact resistance, ageing, computer modelling | AMLCD, thermo-mechanics, optical performance | Additive Manufacturing, Numerical Analysis, Microfluidics, Microelectronics | Advanced packaging and integration technologies; modelling methodologies | Ball grid arrays, Failure analysis, Nitrogen, Reliability, risk management, Tin alloys | Big Data; Data Veracity; Data Validity; FMEA; Statistics; Electronics Manufacturing; Quality Assurance; Test Limits Optimisation | Black Box, Classification, Veracity, Feature Selection, KNN, Stepwise | CCFL, LEDs, thermal, mechanical, optical behaviour | CFD, electrodeposition, level set method, megasonic agitation, microsystems, LIGA | COMSOL, Electric Field Assisted Capillarity (EFAC), Encapsulating Dielectric Fluid, inhomogeneities, Lithographically Induced Self-Construction (LISC), microcapsules, microfluidics, microstructures, Polydimethylsiloxane (PDMS), UV-LIGA process | Coatings, Analytical models, Integrated circuit modeling, Solid modeling, Materials reliability | Cutty Sark, prognostics framework, data-driven prognostics, computer modelling, physics-of-failure, PoF | Damage; Fatigue; Solder joint; Power electronic module | Data driven prognostics; Power semiconductor packages; Machine learning; Reliability test; Failure | Design for Reliability modelling, System-in-Package (SiP) structures, NXP, Wafer Level Packaging (WLP), Finite Element Analysis (FEA) | Electromigration; Thermomigration; Modelling; Solder material; Thin film | Electrothermal models; Life consumption; Mission profile; Physics of failure; Power electronics; real time | FEA, finite element analysis, computational, modelling, historic, ship, composite, structure, Cutty Sark | FMEA, feature engineering, big data, data veracity, data validity, electronics manufacturing | Fluid structure interaction, Finite volume, Transient structural dynamics, Geometric conservation law, Newmark algorithm | Geologic Measurements, Microwave Propagation, Non-Destructive Testing, Permittivity, Radar Applications, Radar Measurements | HPPC, High Performance Primitive Collections, virtual manufacturing | Heat sink design, Genetic algorithm, Shape optimisation, Natural convection, CFD | Historic Ships, Computational Fluid Dynamics, Hull Efficiency | Hot Solder Dip, (HSD), electronic components, Quad Flat Package, (QFP) | IGBT power modules, rainflow algorithm, recursive algorithm, compact thermal models, | Kernel, Numerical models, Analytical models, Microelectronics, Fluids, Graphics processing units, Surface tension | LED displays, adhesive bonding, adhesives, fine-pitch technology, flip-chip devices, microassembling, organic light emitting diodes, semiconductor device packaging, semiconductor device reliability, surface mount technology, thermal management (packaging) | LED driver, LIGBT | LED, Lateral IGBT, Underfill | LED, UNDERFILL | LIGBT; LED; fatigue; underfill | Light Emitting Diodes, (LEDs), accelerated aging, lubricating oils, monitoring, nickel, noise, reliability | Marangoni flow, numerical modelling, surface tension | Maxwell equations, adhesives, conducting polymers, filled polymers, finite difference time-domain analysis, flip-chip devices, heat conduction, microwave heating, modelling polymerisation, temperature distribution, thermal expansion, thermal management (packaging), microwave cure, conductive adhesive | Medway Queen, beam finite element, longitudinal bending, buckling failure | Megasonic Agitation; Printed Circuit Board Fabrication | Micro-electronic displays, thermo-mechanics, amlcd, active matrix liquid crystal display | Microstructures, Microfluidics, Electrostatics, Microfabrication | Model order reduction, wirebond, power electronic module | Modelling; Electronic Packaging; Reliability | Multiphysics modelling; Press-Pack assembly; Electronic Packaging | N/A | Nano-Imprint Forming (NIF), Finite Element Analysis, fabrication | Numerical methods, layered structures, plastic strain. | Numerical software, Mapping, Thermo-mechanical analysis, Power cycling, FEA, CFD, ANSYS, Flotherm XT | OPISA, optoelectronic packaging, laser spot weld formation | Offshore renewable energy; Subsea cables; degradation; prognostics; life expectancy; abrasion; wear; corrosion; scour | Oldroyd-B, unstructured, cell-centred, viscoelastic | Power Electronic Module (PEM), predictive reliability, risk assessment | Power electronics, IGBT, Numerical simulation, CFD, FEA, Reliability | Power electronics, reliability, finite element analysis, wire/ribbon bond | Production technology; Mechanical engineering; Materials; Generative manufacturing; Additive manufacturing; 3D printing; Mechanical engineering; Designers, Production technicians; Materials scientist; manufacturing technicians; Product developers; Designers | QFN, conformal coating, reliability, finite element analysis, thermal cycling | Reduced order models, Power module, Kriging, Radial basis, Damage rule | Reduced order models, system-in-package, risk analysis, probabilistic optimisation, microsystems | Reliability, Wire/ribbon bond, Power electronics, Power cycling, Thermal cycling, Multi-objective optimization | Response Surface, Numerical Optimilation, Electronic Packaging, Reliability,Multi-physics modeling, Thermal Management | SiP structure, package design parameters, thermo-mechanical behaviour, non-linear transient finite element simulations | SiP structure, thermo-mechanical behaviour, reduced order models (ROM) | SiP technology, thermo-mechanical reliability analysis, stacked die, side-by-side dies, embedded die, finite element analysis, numerical optimisation, uncertainty analysis, lead free solder interconnects, accelerated temperature cycle, fatigue life-time, warpage | SiP, packaging design, solder joints, numerical modelling | Silicon Carbide; Press-Pack; Reliability | Stress comparison, silicon carbide, failure analysis, power cycling, life prediction | Surrogate models; Power electronic module; Sensitivity analysis; Finite element analysis | Topological Optimisation | Topology; optimisation; engineering design | Variable Frequency Microwave (VFM) system, cure process, thermosetting polymer, encapsulant, thermal stresses, numerical analysis | Wettability, Sn-2.8Ag-0.5Cu-1.0Bi, wetting force, contact angle, flux, surface, tension, finite element modeling, intermetallic compounds | X-ray diffraction (XRD), synchrotron, intermetallic compounds (IMCs), lead-free solder, reliability, European Synchrotron Radiation Facility (ESRF) | acoustics, coatings, dispersion, morphology, surface morphology, surface topography, surface treatment | additive manufacturing, inkjet printing, microelectronics fabrication, reliability, numerical analysis | adhesion, strength of materials, ageing (materials), films (states of matter) | adhesive bonding, chip scale packaging, conducting materials, fine-pitch technology, integrated circuit interconnections, printing, solders | adhesive bonding, contact resistance, finite element, analysis, flip-chip devices, integrated circuit, interconnections, integrated circuit reliability, reflow soldering | adhesive, curing, glass transition temperature, loss modulus, storage modulus | adhesives in electronics | adhesives, anisotropic media, finite element analysis, flip-chip devices, integrated circuit interconnections, integrated circuit reliability, reflow soldering, thermal expansion | aerospace, ball grid arrays, finite element analysis, integrated circuit interconnections, integrated circuit reliability, life testing, solders thermal stress cracking | agitation method, megasonic acoustic streaming, plating rate, uniformity, electroplating, electrodeposition, metals, copper | anisotropic conductive film (ACF), moisture absorption, flip chip on flex | anisotropic conductive film, (ACF), moisture, flip chip technology | anisotropic conductive films, anisotropic magnetoresistance, assembly, conductive adhesives, contact resistance, flip chip, polymer films, semiconductor device modeling, stress, temperature | assembling, circuit reliability, circuit simulation, failure analysis, flip-chip devices, integrated circuit modelling, integrated optoelectronics, optimisation, thermal management (packaging), virtual prototyping | assembling, circuit reliability, copper, flip-chip devices printed circuit manufacture, reflow soldering, sensitivity analysis | assembly, curing, dielectric losses, dielectric materials, electromagnetic heating, microwave devices, microwave ovens, packaging, polymers, waveguide components | assembly, defects, numerical modelling, printed circuit boards, solder joint, solders | atomic diffusions, atomic vacancies, current loadings, EM simulations, multi-physics, void formation | backlight units, design environment, finite element analysis, human vision models, junction temperatures, just-noticeable difference, key parameters, LED backlighting devices , multi-disciplinary analysis, multi-physics, optical performance, optical simulation, ray tracing calculations, solid state lighting, solid state lighting systems, viewability | ball grid array, printed circuit board reflow, | ball grid arrays, flip-chip devices, packaging, semiconductor device reliability | ball shear test, bond strength, ball grid array (BGA), solder interface strength, Finite Element Analysis(FEA), intermetallic compound (IMC), fracture propogation path, interfacial reaction phenomena, | biofluid behavior, microchannel device, design optimization, particle liquid separation, T-microchannel device, blood plasma separation | biofluid behaviour, microchannel systems, modelling, microchannel biochip separator, blood plasma separation | biofluid separation, bifurcation effect, constriction effect | blood fluid separation, microfluidic device, design optimisation, cross flow filtration, modelling and simulation | blood fluid separation, modelling and simulation, microfluidic device, microchannel device, cross-flow filtration | bridge circuits, failure analysis, insulated gate bipolar transistors, integrated circuit interconnections, integrated circuit modelling, integrated circuit reliability, modules, plastic deformation, power bipolar transistors, power integrated circuits, semiconductor device, reliability, soldering, physics of failure (PoF) | capillarity, dielectric liquids, domains, electric field effects, flow simulation, microfabrication, multiphase flow, polymer solutions, surface tension | ceramic packaging, creep, modules, plastic deformation, resistors, solders, stress analysis, surface mount technology, viscoplasticity | chip-on-board packaging, flip-chip devices, integrated optoelectronics, optical backplanes, optical waveguides photodiodes, surface emitting lasers, thermal expansion | chip-on-board, lateral IGBT, LED drivers, packaging, reliability | chip-on-flex (COF), anisotropic conductive film (ACF), finite element modelling, stress, conductive particle, contact resistance, life-time | circuit optimisation, computational fluid dynamics, CFD, electronic design automation, flow simulation, integrated circuit modelling, integrated circuit packaging, integrated circuit reliability, thermal analysis, thermal management (packaging), turbulence | circuit optimisation, design of experiments, finite element analysis, integrated optoelectronics, optical backplanes optical planar waveguides, surface emitting lasers | circuit reliability, computational fluid dynamics, CFD, creep, design for manufacture, ductility, electromagnetic compatibility, electronic design automation, fatigue, mesh generation, soldering, stress analysis, surface mount technology, thermal management (packaging), thermal stresses | circuit reliability, electromagnetic compatibility, life cycle costing, printed circuit design, quality control | circuits, electromechanical devices, electronics industry, reliability management | commercial off-the shelf components, modelling, refinishing, reliability | compuational fluid dynamics (CFD), wave soldering, gas flow, modelling | computational fluid dynamics (CFD), isotropic conductive adhesives (ICAs), organic light emitting diodes (OLED) | computational fluid dynamics, (CFD), turbulence modelling | computational fluid dynamics, CFD, computer aided analysis, engineering computing, flow, nitrogen, optimisation, oxygen, wave soldering | computational fluid dynamics, CFD, cooling electronics packaging, fluctuations, reliability, shear turbulence | computational fluid dynamics, CFD, cooling, electronic engineering computing, finite volume methods, flow simulation, forced convection, natural convection, temperature distribution, thermal management (packaging), turbulence | computational fluid dynamics, CFD, flip-chip packaging, Oldroyd-B | computational fluid dynamics, CFD, thermal management, turbulence models, heat transfer, transitional flow, Reynolds number, recirculation vortex | computational fluid dynamics, CFD, thermal management, turbulence models, transitional flow, recirculation vortices | computational fluid dynamics, modeling iron, steelmaking processes, ferrous operations, | computational mechanics, design, electronic components | computational mechanics, micro-electronic displays, active matrix liquid crystal display, AMLCD | computational mechanics, numerical optimization material properties, electronic packages | computational modelling, blood flow | computational modelling, computational fluid dynamics, CFD | computational modelling, material deformation | computational modelling, multi-physics processes, high performance, parallel computer systems | computational models | computer aided conservation, computational modelling, ship modelling, smeared shell approach, Cutty Sark, composite structures | computer based simulation, electro-thermal design, electrothermal design, power converters, power electronics components, power electronics devices, thermal management | computer control systems, conversion efficiency, design, differential scanning calorimetry, heating, microwave devices, ovens, stoves | computer modelling, optoelectronic packages | computer modelling, solder joints | computer simulation, curing, delamination, fatigue of materials, interfaces (materials), microelectronic processing, soldered joints; X ray microscopes, scanning acoustic microscopes, flip chip devices | computer simulation, design, industrial plants, interfaces (computer), computational analysis software, materials processing, materials science | constituitive modeling, kinematic-hardening, solder joints, creep curves | constitutive law, fatigue, finite element, life prediction, solder joint, thermal cycling | copper, insulated gate bipolar transistors, multichip modules, reliability, soldering, substrates | copper, modeling, flip-chip devices, lead-free solders | crack detection, finite element analysis, mechanical testing printed circuit testing, resistors, sensitivity analysis, strain measurement, thermal stress cracking | cross-flow filtration, microfluidic device, microchannel device, microfluidics, modelling and simulation, fluid separator | cure kinetics models, encapsulant material, | cure kinetics, cure data, particle swarm optimization | curing of an encapsulant material, dual-section microwave system, packaging, electronic packaging, microwave | damage, fatigue, solder interconnect, power electronic module | damage, solder joints, computer modelling, flexible circuit board, thermal cycling | data analytics, smart test, prognostics, machine learning, electronics product qualification | data driven prognostics, health monitoring, light emitting diodes, LEDs | data driven prognostics, prognostics health management, PHM, light emitting diodes, LEDs | data mining, frequency, life estimation, lLifetime estimation, multichip modules, power electronics, predictive models, temperature, thermal degradation, wire | data mining, machine learning, smart qualification testing, electronic components, intelligent manufacturing, prognostics modelling | data-driven prognostics, data analysis, machine learning, modelling, electronics manufacturing, quality, qualification testing | decision support system, electronic product design, numerical modelling | decision tree, logistic regression, random forest, incomplete dataset, electronic device | design methodology, micro-machining process, Focused Ion Beam (FIB) method, Design of Experiment (DoE) method, Reduced Order Models (ROM) | design of experiments methods, key design parameters, LCD displays, optimal design, optimisations, performance data, quadratic response, simulation technique, heatsink | design of experiments, finite element analysis, integrated optoelectronics, optical backplanes, optical couplers, surface emitting lasers, thermal expansion, thermal management (packaging) | digital simulation, electronic engineering computing, heat transfer, melting, printed circuit manufacture, soldering, multiphysics modeling, solidification, solder, surface tension, thermal stress | dynamic fluid-structure interaction, (DFSI), numerical modelling, finite volume unstructured mesh | dynamic solid mechanics, finite volume methods | effect of reflow process, contact resistance, anisotropic conductive film (ACF) | effective thermal conductivity, axial and transverse coefficients of thermal expansion (CTE), SWCNT (single walled carbon nanotube)-Cu composites, Cu vias, CNT-Cu TSVs, Abaqus® v. 6.9 | electric car, electric aircraft, renewable energy, power electronics, | electrical connections, modelling, moisture | electro thermal model, inverter, IGBT, power module, circuit simulator, finite element analysis, power electronics | electro-migration, metal migration, thermo-mechanical loading | electro-thermal model, IGBT power module, circuit simulator, finite element analysis, DC-DC converter | electrodeposition, electroplating, megasonic agitation, acoustic streaming, aspect ratio | electrodeposition, micro-particle imaging velocimetry (micro-PIV), fluid flow, electrodeposition of copper, megasonic agitation | electrodeposition, microvias, current density, electrolytes, electroplating, printed circuits, vias | electrodeposition, numerical modelling | electrolyte fluid flow, micro-particle imaging velocimetry (micro-PIV), fibre optic hydrophone, printed circuit board (PCB), high aspect ratio microvias | electromagnetic heating, encapsulation, packaging | electromigration, numerical modeling, finite element method, voids evolution | electromigration, simulation, shunt, solder joint | electronic engineering, microwaves, polymers, simulation | electronic packaging thermal management, electronics packaging, energy management, environmental factors, environmental management, power system management, power system modeling, technology management, thermal management, thermal management of electronics | electronics design, design optimistation, numerical modelling, computer modelling | electronics manufacturing, numerical modelling, high aspect ratio microvia, electroplating, megasonic agitation, acoustic streaming | electroplating, electrodeposition, megasonic agitation, high density interconnection technology, microvias | encapsulants, resonant microwave applicator, curing, electromagnetic heating, materials, microwave measurements, microwave ovens, microwave theory and techniques, temperature measurement | encapsulation, microwave curing, microelectronics packaging, reliability testing, open-ended oven, residual stress, accelerated stress test, convection oven | estimate of cure, cure kinetics, differential scanning calorimetry | failure analysis, reliability, solders, thermal management (packaging), tin alloys, whiskers (crystal) | failure analysis, finite element modeling, fracture mechanics, intermetallic compound, reliability, solder joint | failure analysis, flip-chip devices, integrated circuit modelling, integrated circuit reliability, plastic deformation, thermal expansion, flip chip, reliability, Cu column, modelling | fatigue, flip-chip, modeling, reliability, Coffin-Manson, underfill | finite element analysis methods, failure, solder joint | finite element analysis, Cutty Sark, ship, modelling | finite element analysis, reliable electronic packaging | finite element modelling, focal plane array, compression bonding, flip-chip assembly, reliability, cryogenic temperature, compound semiconductors | finite element modelling, matrix, mechanical loading, reinforcement method, reinforcement technique, SAC alloy, second level, solder balls, time to failure, underfilling, vibration test | finite element modelling, reliability, component terminations, hot solder dip refinishing process, tin whiskers, commercial off-the-shelf components, scanning acoustic microscopy | finite element, finite volume, geometrically nonlinear | finite volume, solid mechanics, CFD | finite volume, stress analysis, non-linear, Lagrangian, Eulerian, Newton Raphson | finite volume, vertex-based, computational solid mechanics | five process parameters, post weld stresses, pigtail fibre optic, butterfly module, response surface methodology, Integrated Design of Experiments (DoE), Finite Element Analysis (FEA), Monte Carlo simulation, particle swarm optimisation algorithm | flexible substrates, lead free applications | flexible substrates, thermo-mechanical, lead free solder | flexible-substrates, Flex-No-Lead project, lead-free soldering | flip chip packaging, Cu columns, computer modelling | flip chip, modelling, reflow, reliability, solder paste, underfill | flip chip, optimization, reliability, underfill | flip-chip assembly, isotropic conductive adhesives, (ICA), reliability modelling | flip-chip assembly, no-flow underfill materials | fluid structure interaction, finite volume, transient structural dynamics, geometric conservation law, Newmark algorithm | fluid structure interaction, finite volume, transient structural dynamics, geometric conservation law, newmark algorithm | fluids engineering descriptors, casting, fluid flow, integration, stress, temperature | fluid–structure interaction, finite volume, transient structural dynamics, geometric conservation law, Newmark algorithm | fusion approach, failure mechanisms, parameters, bonding, ceramics, condition monitoring, copper, degradation, failure analysis, fatigue, insulated gate bipolar transistors, multichip modules, wire | heating, microwave curing, resonant cavity, waveguide resonator | heterogeneous electronics based systems, higher-density interconnection, miniaturisation, silicon, carbon-nanotubes, interconnection technology | high current density induced damage, electromigration,on-chip interconnection, off-chip interconnection, solder joints, electron bombardment, thermomigration, current crowding, failure mechanisms, mathematical modelling, | high density packaging, design | hot solder dip, (HSD), leaded components, copper, electronic packaging thermal management, predictive models, stress, thermal stresses, thermomechanical processes, wires | integrated circuit, miniaturized consumer electronic products, electronic packaging, through-hole packages, surface mount packages | integrated software module, stress, electronic products | isotropic conductive adhesive materials, polymer crosslinking, cure kinetics models, Differential Scanning Calorimetry (DSC), particle swarm optimisation method | isotropic conductive adhesives (ICAs), flip-chip packaging, low temperature (T<100 C) | jet impingement cooling system, power electronics modules (PEMs), cooling efficiency, numerical modelling | laser beam welding, semiconductor device packaging, semiconductor lasers, semiconductor process modelling, soldering, modelling, thermal, laser | light emitting diodes (LEDs), ruggedized electronic display | light emitting diodes (LEDs), thermal management, optical and thermal modelling techniques, luminance, ruggedized electronic display, LED, LCD, backlights | liquid crystal displays, light emitting diodes, display | manufacturing systems, nanotechnology, modelling, finite element analysis, deformation, process efficiency | mechanics, mathematics | metals casting, | micro-manufactured, one turn inductor, power supply circuits | microelectronics packaging, polymer cure models, differential scanning calorimetry (DSC), Fourier transform infra-red spectroscopy (FTIR) | microfabricated solenoid inductor, electrodeposition, DC-DC | microfluidics, electrohydrodynamic, instabilities, capillary, hollow microstucture, high-aspect ratio microfabrication | microinductors, DC-DC, manufacturing processes | microsystems, multiphysics, analytical techniques | microvia fabrication, electroplating | microwave energy, microwave curing system | microwave oven, curing process, thermomechanical stress development | microwave systems, micro-electronics manufacture, cure process, thermosetting polymer materials | microwave, polymer, optimisation, multiphysics, simulation | minium wires, design engineers, electrical power, industrial partners, modelling tools, power electronics devices, remaining life, semiconductor technology, solder joints, thermal management, thermo-mechanical behaviors, transport systems, wide area | modeling, copper, diffusion, solder | modeling, isothermal fatigue test, solder joints | modelling biofluids, T-microchannel device, computational fluid dynamics | modelling methodology, thermal analysis, hot solder dip process, tin whiskers | modelling techniques, | modelling technologies, analysis tools, nano-techology, microsystems, fabrication, packaging, testing | modelling, flipchip, curing, reflow | modelling, prototyping, micro-probe | multi-physics modelling, CFD software | multi-physics, multi-disciplinary design, | multi-physics, multi-scale simulations, computational modelling | multi-physics, multi-scale, parallel, casting, granular flow | multi-scale computational simulations, adhesive flows | multiphysics analysis, coupled solution, microwave processing | multiphysics modeling, level set method, solidification, electronic product assembly | multiphysics modelling, finite volumes, computational fluid dynamics, computational solid mechanics | nano-imprint forming (NIF), modelling methodology, 3D-miniaturised systems | nanopatterning, polymeric channels, electrostatic, | novel micro-integrated products, failure, design process | numerical modeling, high aspect ratio microvia, electroplating, megasonic agitation, acoustic streaming | numerical modelling, casting process | numerical modelling, thickening, sedimentation, gravity, thickener, density, | numerical modelling, zinc, lead | numerical simulation, encapsulant curing, Variable Frequency Microwave (VFM) system | open-ended microwave oven, curing | open-ended waveguide cavity oven, curing, radio frequency (RF) curing, variable frequency microwave (VFM) heating, encapsulant, packaging | optical fiber, solder | optimisation, methodology, micro and nano system, focused ion beam | optimization, techniques, prototypes, product reliability | packaging, reliability, prognostic methods, power electronics | particle swarm optimisation algorithm, polymer cure kinetics models, curing process, microelectronics manufacturing, numerical models, evaluation | plasma blood separation, 3D microfluidic device, microchannel device, device design, modelling and simulation | pneumatic microactuator, microfeeder, distributed manipulation, MEMS device, actuator design | polymer encapsulant, curing, convection oven, microwave system | power electronic modules (PEMs), globtop, reliability, computer modelling, aluminium, wirebond | power electronic modules, packaging technology, reliability prediction | power electronic modules, prognostics prediction methodology, design-for-reliability, IGBT module, design for manufacture, power module components, reliability prediction techniques, failure based reliability | power electronics modules (PEMs), reliability prediction, prognostic and health management (PHM)systems, Physics-of-failure (PoF) model, Bayesian Networks (BN) | power electronics modules, globtop design, computer modelling, aluminium wirebonds | power electronics modules, solder joint fatigue, reliability | power electronics, data-driven prognostics, insulated gate bipolar transistors, mathematical model, monitoring, physics, predictive models, prognostics and health management | power module, optimization, electric-thermal | probabilities, prognostics framework, computer modelling, Cutty Sark, conservation | product functionality, electronic production design, software | prognostic, reliability, power modules, physics-of-failure | prognostics framework, Bayesian networks, computer modelling, Cutty Sark, conservation, physics-of-failure, | prognostics framework, computer modelling, Cutty Sark, conservation, heritage structures, | prognostics framework, computer modelling, materials damage, material degradation, prognostic fusion, Cutty Sark, heritage structure, conservation, | prognostics, reliability, light emitting diodes, LEDs, algorithms | reduced order models, power electronic module, life prediction, Kriging, radial basis, microsystems | reduced order models, power electronic module, risk analysis, Particle Swarm Optimisation, Kriging, radial basis | reduced order models, power electronic module, risk analysis, probabilistic optimisation, Kriging, radial basis, microsystems | reliability targets, power modules, wear-out mechanisms, wire-bond lifting, solder degradation, load-induced thermal cycling, real-time thermal models, real-time health management | rheology, solder pastes, stencils | risk mitigation, manufacturing process, focused ion beam | simulation tools, virtual prototyping environment, classical continuum mechanics (e.g., the finite element method), atomistic mechanics [e.g., classical molecular dynamics (MD)], quantum mechanics (e.g., the density functional method) | solder joint failure, electronic packaging, strain on solder joints | solder joint, intermetallic compound, fracture mechanics | solder joint, printed circuit boards, model implementation | solder paste, stencil printing, CFD, computational fluid dynamics, finite volume method, non-Newtonian, dense suspension | solder, intermetallic, pb-free, BGA, electronic package, stress intensity factor, plastic deformation, butt joints | solder, joints, computer modelling, flexible substrates, reliability | solder, joints, electronic packaging, wetting, computer modelling | solder, wetting, aging, intermetallic compound layer | soldering, interfacial reactions, intermetallic compounds, growth rate, aging | solders, computer simulation, reliability, materials properties, geometry, flip-chip, design, event history analysis, solder joints, fatigue | solidification, melting processes, multiphysics, computational modeling, complex geometries | statistical hypothesis testing, refinishing, hot solder dip, leaded component, lead-free | subsea cable scoring, corrosion | thermal cycles, strain, Finite Element, (FE), solder joints | thermal modeling, microinductor, DC-DC power converter, | thermal modelling, hot solder, microelectronics, analytical models, computed tomography, conductivity, heating, lead, materials, thermal analysis | thermal processing, open-ended applicator, microwave oven | thick film chip resistors, SnPb and SnAgCu (solder alloys), Garofalo equation,Miner's law of linear damage accumulation | three-dimensional miniaturised products, reduced order models, micro-probe | topological optimization, microelectronics, thermal management, engineering design, level-set method | topology optimization, level-set method, heat sink, thermal diffusivity | turbulence models, electronic cooling, new two-layer hybrid kE/ki model, zonal model | turbulence models, fluid flow, heat transfer, electronic applications, computational fluid dynamics (CFD) | variable frequency microwave (VFM), chip-on-board (COB) assembly, multiphysics modelling, frequency agile microwave oven bonding system (FAMOBS) | vibration, failure, lead-free solders | vibration, model order reduction | vibration, reliability,lead-free solders | wetting, solder, flux, wetting force, contact angle, modeling | x-rays, diffraction experiments
Number of items: 330.

3D biochip separator, flow behaviour, flow fields

Xue, Xiangdong, Marson, Silvia, Patel, Mayur K., Attia, Usama M., Bailey, Chris ORCID: 0000-0002-9438-3879, O'Neill, William, Topham, David and Desmulliez, Marc P.Y. (2010) Biofluid behaviour in 3D microchannel systems: Numerical analysis and design development of 3D microchannel biochip separators. In: 2010 Proceedings 60th Electronic Components and Technology Conference ECTC. Institute of Electrical and Electronics Engineers Inc., Piscataway, NJ, USA, pp. 1021-1030. ISBN 978-1-4244-6410-4 (print), 978-1-4244-6411-1 (electronic) ISSN 0569-5503 (doi:https://doi.org/10.1109/ECTC.2010.5490827)

3D printing; Electronics packaging; Design tools; Modelling; Reliability

Tilford, Tim ORCID: 0000-0001-8307-6403, Stoyanov, Stoyan ORCID: 0000-0001-6091-1226, Braun, Jessica, Janhsen, Jan Cristophe, Burgard, Matthias, Birch, Richard and Bailey, Chris ORCID: 0000-0002-9438-3879 (2018) Design, manufacture and test for reliable 3D printed electronics packaging. Microelectronics Reliability, 85. pp. 109-117. ISSN 0026-2714 (doi:https://doi.org/10.1016/j.microrel.2018.04.008)

3D printing; electronics manufacture; machine learning; condition based monitoring; prognostics

Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2017) Machine learning for additive manufacturing of electronics. In: Proceedings 2017 40th International Spring Seminar on Electronics Technology (ISSE). IEEE. ISBN 978-1-5386-0583-7 ISSN 2161-2536 (Online) (doi:https://doi.org/10.1109/ISSE.2017.8000936)

ACF, failure, contact resistance, ageing, computer modelling

Rizvi, M.J., Bailey, Christopher ORCID: 0000-0002-9438-3879 and Lu, Hua ORCID: 0000-0002-4392-6562 (2008) Failure mechanisms of ACF joints under isothermal ageing. Microelectronics Journal, 39 (9). pp. 1101-1107. ISSN 0026-2692 (doi:https://doi.org/10.1016/j.mejo.2008.01.045)

AMLCD, thermo-mechanics, optical performance

Lee, Yek, Bailey, Christopher ORCID: 0000-0002-9438-3879, Lu, Hua ORCID: 0000-0002-4392-6562, Riches, Steve, Bartholomew, Martin and Tebbit, Nigel (2006) Analysis of the thermo mechanical effects on packaging process of performance enhanced AMLCD's and the optical performance of the display. Proceedings of the 1st Electronics Systemintegration Technology Conference, 2006. IEEE, pp. 1214-1217. ISBN 9781424405527 (doi:https://doi.org/10.1109/ESTC.2006.280164)

Additive Manufacturing, Numerical Analysis, Microfluidics, Microelectronics

Tilford, T. ORCID: 0000-0001-8307-6403, Bruan, J., Janhsen, J. C., Burgard, M. and Bailey, C. ORCID: 0000-0002-9438-3879 (2018) SPH analysis of inkjet droplet impact dynamics. In: Proceedings of the 13th World Congress on Computational Mechanics (WCCM XIII) and 2nd Pan American Congress on Computational Mechanics (PANACM II). WCCM.

Advanced packaging and integration technologies; modelling methodologies

Bailey, Christopher ORCID: 0000-0002-9438-3879, Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 and Lu, Hua ORCID: 0000-0002-4392-6562 (2017) Co-design And Modelling For Advanced Integration And Packaging: Manufacturing And Reliability. Wspc Series In Advanced Integration And Packaging . World Scientific Publishing. ISBN 978-9814740203 ISSN 2315-473X (doi:https://doi.org/10.1142/9900)

Ball grid arrays, Failure analysis, Nitrogen, Reliability, risk management, Tin alloys

Stoyanov, Stoyan ORCID: 0000-0001-6091-1226, Dabek, Alexander and Bailey, Chris ORCID: 0000-0002-9438-3879 (2014) Hot nitrogen deballing of Ball Grid Arrays. In: Proceedings of the 2014 37th International Spring Seminar on Electronics Technology. Institute of Electrical and Electronics Engineers Inc., Piscataway, NJ, USA, pp. 44-49. ISBN 978-147994455-2 (doi:https://doi.org/10.1109/ISSE.2014.6887559)

Big Data; Data Veracity; Data Validity; FMEA; Statistics; Electronics Manufacturing; Quality Assurance; Test Limits Optimisation

Hinojosa Herrera, Ana ORCID: 0000-0002-0636-1881, Walshaw, Chris ORCID: 0000-0003-0253-7779 and Bailey, Chris ORCID: 0000-0002-9438-3879 (2020) Failure mode & effect analysis and another methodology for improving data veracity and validity. Annals of Emerging Technologies in Computing (AETiC), 4 (3). pp. 9-16. ISSN 2516-0281 (doi:https://doi.org/10.33166/AETiC.2020.03.002)

Black Box, Classification, Veracity, Feature Selection, KNN, Stepwise

Hinojosa Herrera, Ana Elsa ORCID: 0000-0002-0636-1881, Walshaw, Chris ORCID: 0000-0003-0253-7779 and Bailey, Chris ORCID: 0000-0002-9438-3879 (2020) Improving Black Box Classification Model Veracity for Electronics Anomaly Detection. In: 2020 15th IEEE Conference on Industrial Electronics and Applications (ICIEA). IEEE, pp. 1092-1097. ISBN 978-1728151694 ISSN 2156-2318 (Print), 2158-2297 (Online) (doi:https://doi.org/10.1109/ICIEA48937.2020.9248258)

CCFL, LEDs, thermal, mechanical, optical behaviour

Lee, Yek Bing, Strusevich, N., Yan-Yin, Chun and Bailey, C. ORCID: 0000-0002-9438-3879 (2009) Analysis tools for thermal characterization, performance and reliability of rugged electronic displays. In: ISSE 2009: 32nd International Spring Seminar on Electronics Technology: Hetero System Integration, the path to New Solutions in the Modern Electronics - Conference Proceedings. Institute of Electrical and Electronics Engineers, Piscataway, NJ, USA, pp. 1-5. ISBN 978-1-4244-4260-7 (doi:https://doi.org/10.1109/ISSE.2009.5206926)

CFD, electrodeposition, level set method, megasonic agitation, microsystems, LIGA

Hughes, Michael, Strussevich, Nadia, Bailey, Christopher ORCID: 0000-0002-9438-3879, McManus, Kevin, Kaufmann, Jens, Flynn, David and Desmulliez, Marc P.Y. (2009) Numerical algorithms for modelling electrodeposition: Tracking the deposition front under forced convection from megasonic agitation. International Journal for Numerical Methods in Fluids, 64 (3). pp. 237-268. ISSN 0271-2091 (Print), 1097-0363 (Online) (doi:https://doi.org/10.1002/fld.2140)

COMSOL, Electric Field Assisted Capillarity (EFAC), Encapsulating Dielectric Fluid, inhomogeneities, Lithographically Induced Self-Construction (LISC), microcapsules, microfluidics, microstructures, Polydimethylsiloxane (PDMS), UV-LIGA process

Tonry, Catherine, Patel, Mayur K., Bailey, Christopher ORCID: 0000-0002-9438-3879, Desmuliez, Marc P.Y., Cargill, Scott and Yu, Weixing (2013) A method for the micro-encapsulation of dielectric fluids in joined polymer shells. Current Organic Chemistry, 17 (1). pp. 65-71. ISSN 1385-2728 (Print), 1875-5348 (Online)

Coatings, Analytical models, Integrated circuit modeling, Solid modeling, Materials reliability

Yin, Chunyan ORCID: 0000-0003-0298-0420, Stoyanov, Stoyan ORCID: 0000-0001-6091-1226, Bailey, Christopher ORCID: 0000-0002-9438-3879 and Stewart, Paul (2017) Modelling the impact of conformal coating penetration on QFN reliability. In: 2017 18th International Conference on Electronic Packaging Technology (ICEPT). IEEE, pp. 1021-1026. ISBN 978-1-5386-2973-4 (doi:https://doi.org/10.1109/ICEPT.2017.8046616)

Cutty Sark, prognostics framework, data-driven prognostics, computer modelling, physics-of-failure, PoF

Rosunally, Yasmine, Stoyanov, Stoyan ORCID: 0000-0001-6091-1226, Bailey, Chris ORCID: 0000-0002-9438-3879, Mason, Peter, Campbell, Sheelagh, Monger, George and Bell, Ian (2009) Development of a prognostics framework for the iron structural material of the s.v. Cutty Sark. In: Proceedings of Sixth International Conference on Condition Monitoring and Machinery Failure Prevention Technologies – CM/MFPT 2009. The British Institute of Non-Destructive Testing / Coxmoor Publishing, Northampton, UK, pp. 674-685.

Damage; Fatigue; Solder joint; Power electronic module

Rajaguru, Pushparajah ORCID: 0000-0002-6041-0517, Lu, Hua ORCID: 0000-0002-4392-6562 and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2015) A time dependent damage indicator model for Sn3.5Ag solder layer in power electronic module. Microelectronics Reliability, 55 (11). pp. 2371-2381. ISSN 0026-2714 (doi:https://doi.org/10.1016/j.microrel.2015.07.047)

Data driven prognostics; Power semiconductor packages; Machine learning; Reliability test; Failure

Ahsan, Mominul, Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2018) Data driven prognostics for failure of power semiconductor packages. In: Proceedings of 41st Spring Seminar on Electronics Technology (ISSE). IEEE Xplore, pp. 1-6. ISBN 978-1-5386-5730-0 ISSN 2161-2536 (Online) (doi:https://doi.org/10.1109/ISSE.2018.8443612)

Design for Reliability modelling, System-in-Package (SiP) structures, NXP, Wafer Level Packaging (WLP), Finite Element Analysis (FEA)

Stoyanov, Stoyan ORCID: 0000-0001-6091-1226, Strusevitch, Nadia, Rizvi, Jahir, Georgel, Vincent, Yannou, Jean-Marc and Bailey, Chris ORCID: 0000-0002-9438-3879 (2008) Design for reliability for wafer level system in package. In: 2nd Electronics System-Integration Technology Conference, 2008. ESTC 2008. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 293-298. ISBN 978-1-4244-2814-4 (Print), 978-1-4244-2813-7 (Online) (doi:https://doi.org/10.1109/ESTC.2008.4684364)

Electromigration; Thermomigration; Modelling; Solder material; Thin film

Zhu, X., Kotadia, H., Xu, S., Lu, H. ORCID: 0000-0002-4392-6562, Mannan, S. H., Bailey, C. ORCID: 0000-0002-9438-3879 and Chan, Y. C. (2014) Electromigration in Sn-Ag solder thin films under high current density. Thin Solid Films, 565. pp. 193-201. ISSN 0040-6090 (doi:https://doi.org/10.1016/j.tsf.2014.06.030)

Electrothermal models; Life consumption; Mission profile; Physics of failure; Power electronics; real time

Musallam, Mahera, Yin, Chunyan ORCID: 0000-0003-0298-0420, Bailey, Christopher ORCID: 0000-0002-9438-3879 and Johnson, Mark (2014) Mission profile-based reliability design and real-time life consumption estimation in power electronics. IEEE Transactions on Power Electronics, 30 (5). pp. 2601-2613. ISSN 0885-8993 (Print), 1941-0107 (Online) (doi:https://doi.org/10.1109/TPEL.2014.2358555)

FEA, finite element analysis, computational, modelling, historic, ship, composite, structure, Cutty Sark

Stoyanov, S. ORCID: 0000-0001-6091-1226, Mason, P. and Bailey, C. ORCID: 0000-0002-9438-3879 (2006) Computational methodology for analysis of historic composite structures. In: Proceedings of the 5th International Conference on Engineering Computational Technology. Civil-Comp Press, Stirlingshire, UK. ISBN 1905088116 ISSN 1759-3433 (doi:https://doi.org/10.4203/ccp.84.132)

FMEA, feature engineering, big data, data veracity, data validity, electronics manufacturing

Hinojosa Herrera, Ana Elsa ORCID: 0000-0002-0636-1881, Walshaw, Chris ORCID: 0000-0003-0253-7779, Bailey, Chris ORCID: 0000-0002-9438-3879 and Yin, Chunyan ORCID: 0000-0003-0298-0420 (2019) Failure mode & effect analysis for improving data veracity and validity. In: Proceedings of the IEEE International Conference on Computing, Electronics & Communications Engineering 2019 (IEEE iCCECE '19). IEEE, pp. 100-105. ISBN 978-1728121383 (doi:https://doi.org/10.1109/iCCECE46942.2019.8941849)

Fluid structure interaction, Finite volume, Transient structural dynamics, Geometric conservation law, Newmark algorithm

Slone, Avril, Pericleous, Kyriacos A ORCID: 0000-0002-7426-9999, Bailey, Christopher ORCID: 0000-0002-9438-3879, Cross, M. and Bennett, C. (2002) Dynamic fluid-structure interactions using finite volume unstructured mesh procedures. Computers & Structures, 80 (5-6). pp. 371-390. ISSN 0045-7949 (doi:https://doi.org/10.1016/S0045-7949(01)00177-8)

Geologic Measurements, Microwave Propagation, Non-Destructive Testing, Permittivity, Radar Applications, Radar Measurements

Blanche, Jamie, Flynn, David, Lewis, Helen, Couples, Gary, Buckman, Jim, Bailey, Chris ORCID: 0000-0002-9438-3879 and Tilford, Timothy ORCID: 0000-0001-8307-6403 (2018) Analysis of sandstone pore space fluid saturation and mineralogy variation via application of monostatic K-band frequency modulated continuous wave radar. IEEE Access, 6. pp. 44376-44389. ISSN 2169-3536 (Online) (doi:https://doi.org/10.1109/ACCESS.2018.2863024)

HPPC, High Performance Primitive Collections, virtual manufacturing

McManus, K., Cross, M., Walshaw, C. ORCID: 0000-0003-0253-7779, Johnson, S., Bailey, C. ORCID: 0000-0002-9438-3879, Pericleous, K. ORCID: 0000-0002-7426-9999, Slone, A. and Chow, P. (2000) Virtual manufacturing and design in the real world - implementation and scalability on HPPC systems. In: Parallel Computational Fluid Dynamics 1999: Towards Teraflops, Optimization and Novel Formulations. North-Holland, Amsterdam, The Netherlands, pp. 47-56. ISBN 978044482851 (doi:https://doi.org/10.1016/B978-044482851-4.50009-8)

Heat sink design, Genetic algorithm, Shape optimisation, Natural convection, CFD

Santhanakrishnan, Mani Sekara, Tilford, Tim ORCID: 0000-0001-8307-6403 and Bailey, Chris ORCID: 0000-0002-9438-3879 (2021) Multi-objective NSGA-II based shape optimisation of the cross-sectional shape of passively cooled heat sinks. International Journal of Numerical Methods for Heat and Fluid Flow. ISSN 0961-5539 (In Press) (doi:https://doi.org/10.1108/HFF-10-2020-0656)

Historic Ships, Computational Fluid Dynamics, Hull Efficiency

Tonry, Catherine E. H. ORCID: 0000-0002-8214-0845, Patel, Mayur K., Bailey, Christopher ORCID: 0000-0002-9438-3879, Davies, Wynford, Harrap, Jullian, Kentley, Erik and Mason, Peter (2014) Digital modelling in the performance evaluation of 19th Century clipper ships: the Thermopylae and the Cutty Sark. In: Historic Ships 2014. Royal Institution of Naval Architects, pp. 81-86.

Hot Solder Dip, (HSD), electronic components, Quad Flat Package, (QFP)

Stoyanov, Stoyan ORCID: 0000-0001-6091-1226, Best, Chris, Yin, Chunyan ORCID: 0000-0003-0298-0420, Alam, M.O., Bailey, Chris ORCID: 0000-0002-9438-3879 and Tollafield, Peter (2012) Experimental and modelling study on the effects of refinishing lead-free microelectronic components. In: 2012 4th Electronic System-Integration Technology Conference (ESTC). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA. ISBN 9781467346450 (doi:https://doi.org/10.1109/ESTC.2012.6542213)

IGBT power modules, rainflow algorithm, recursive algorithm, compact thermal models,

Musallam, M., Johnson, C.M., Yin, Chunyan ORCID: 0000-0003-0298-0420, Bailey, Christopher ORCID: 0000-0002-9438-3879 and Mermet-Guyennet, M. (2010) Real-time life consumption power modules prognosis using on-line rainflow algorithm in metro applications. In: Energy Conversion Congress and Exposition (ECCE), 2010 IEEE. IEEE Xplore Digital Library, Atlanta GA, pp. 970-977. ISBN 978-1-4244-5286-6 (print) ISSN 978-1-4244-5287-3 (online) (doi:https://doi.org/10.1109/ECCE.2010.5617883)

Kernel, Numerical models, Analytical models, Microelectronics, Fluids, Graphics processing units, Surface tension

Tilford, T. ORCID: 0000-0001-8307-6403, Stoyanov, S. ORCID: 0000-0001-6091-1226, Tourloukis, G. and Bailey, C. ORCID: 0000-0002-9438-3879 (2016) Numerical analysis of droplet deposition in inkjet printed electronics assembly. In: 2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE). IEEE, pp. 1-7. ISBN 978-1-5090-2106-2 (doi:https://doi.org/10.1109/EuroSimE.2016.7463358)

LED displays, adhesive bonding, adhesives, fine-pitch technology, flip-chip devices, microassembling, organic light emitting diodes, semiconductor device packaging, semiconductor device reliability, surface mount technology, thermal management (packaging)

Stoyanov, S. ORCID: 0000-0001-6091-1226, Kay, R., Bailey, C. ORCID: 0000-0002-9438-3879, Desmuilliez, M. and Hendriksen, M. (2003) Ultra-fine pitch flip-chip assembly using isotropic conductive adhesives. In: Proceedings of 5th Electronics Packaging Technology Conference (EPTC 2003). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 797-802. ISBN 0780382056 (doi:https://doi.org/10.1109/EPTC.2003.1271627)

LED driver, LIGBT

Rajaguru, P. ORCID: 0000-0002-6041-0517, Lu, H. ORCID: 0000-0002-4392-6562, Bailey, C. ORCID: 0000-0002-9438-3879, Ortiz-Gonzalez, J. and Alatise, O. (2016) Electro-thermo-mechanical modelling and analysis of the Press Pack Diode in Power Electronics. In: 2015 21st International Workshop on Thermal Investigations of ICs and Systems (THERMINIC). IEEE, pp. 1-6. ISBN 978-1-4673-9706-3 (doi:https://doi.org/10.1109/THERMINIC.2015.7389607)

LED, Lateral IGBT, Underfill

Rajaguru, P. ORCID: 0000-0002-6041-0517, Lu, H. ORCID: 0000-0002-4392-6562, Bailey, C. ORCID: 0000-0002-9438-3879, Castellazzi, A., Pathirana, V., Udugampola, N. and Udrea, F. (2018) Impact of underfill and other physical dimensions on Silicon Lateral IGBT package reliability using computer model with discrete and continuous design variables. Microelectronics Reliability, 83. pp. 146-156. ISSN 0026-2714 (doi:https://doi.org/10.1016/j.microrel.2018.02.024)

LED, UNDERFILL

Rajaguru, P. ORCID: 0000-0002-6041-0517, Bailey, C. ORCID: 0000-0002-9438-3879, Lu, H. ORCID: 0000-0002-4392-6562, Aliyu, A. M., Castellazzi, A., Pathirana, V., Udugampola, N., Trajkovic, T., Udrea, F., Mitcheson, P. D. and Elliott, A. D. T. (2017) Co-design/simulation of flip-chip assembly for high voltage IGBT packages. In: 23rd International workshop on Thermal Investigations of ICs and Systems (THERMINIC). THERMINIC, pp. 1-5.

LIGBT; LED; fatigue; underfill

Bailey, C. ORCID: 0000-0002-9438-3879, Rajaguru, P. ORCID: 0000-0002-6041-0517, Lu, H. ORCID: 0000-0002-4392-6562, Castellazzi, A., Antonini, M., Pathirana, V., Udugampola, N., Udrea, F., Mitchelson, P. D. and Aldhaher, S. (2018) Mechanical modelling of high power lateral IGBT for LED driver applications. In: IEEE Electronic Components and Technology Conference (ECTC). IEEE Electronics Packaging Society (formerly CPMT), pp. 1375-1381. ISBN 978-1-5386-5000-4 ISSN 2377-5726 (Online) (doi:https://doi.org/10.1109/ECTC.2018.00210)

Light Emitting Diodes, (LEDs), accelerated aging, lubricating oils, monitoring, nickel, noise, reliability

Sutharssan, Thamo, Bailey, ChriS ORCID: 0000-0002-9438-3879 and Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 (2012) A comparison study of the prognostics approaches to light emitting diodes under accelerated aging. In: 2012 13th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems. Institute of Electrical and Electronic Engineers, Inc, Piscataway, N.J., USA. ISBN 978-1-4673-1512-8 (doi:https://doi.org/10.1109/ESimE.2012.6191783)

Marangoni flow, numerical modelling, surface tension

Wheeler, D., Bailey, C. ORCID: 0000-0002-9438-3879 and Cross, M. (2000) Numerical modelling and validation of Marangoni and surface tension phenomena using the finite volume method. International Journal for Numerical Methods in Fluids, 32 (8). pp. 1021-1047. ISSN 0271-2091 (Print), 1097-0363 (Online) (doi:https://doi.org/10.1002/(SICI)1097-0363(20000430)32:8<1021::AID-FLD998>3.0.CO;2-1)

Maxwell equations, adhesives, conducting polymers, filled polymers, finite difference time-domain analysis, flip-chip devices, heat conduction, microwave heating, modelling polymerisation, temperature distribution, thermal expansion, thermal management (packaging), microwave cure, conductive adhesive

Glinski, G.P. and Bailey, C. ORCID: 0000-0002-9438-3879 (2002) Microwave cure of conductive adhesives for flip-chip & microsystems applications. In: ITHERM 2002. The Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems [Proceedings]. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, U.S.A., pp. 848-853. ISBN 0780371526 ISSN 1089-9870 (doi:https://doi.org/10.1109/ITHERM.2002.1012543)

Medway Queen, beam finite element, longitudinal bending, buckling failure

Rajaguru, Pushparajah ORCID: 0000-0002-6041-0517, Mason, Peter, Bailey, Chris ORCID: 0000-0002-9438-3879 and Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 (2014) Buckling analysis on the hull of the historic paddle steamer ‘Medway Queen’. Ships and Offshore Structures, 9 (6). pp. 643-654. ISSN 1744-5302 (Print), 1754-212X (Online) (doi:https://doi.org/10.1080/17445302.2013.849065)

Megasonic Agitation; Printed Circuit Board Fabrication

Jones, Thomas D.A., Flynn, David, Desmulliez, Marc P.Y., Price, Dennis, Beadel, Matthew, Strusevich, Nadia, Patel, Mayur, Bailey, Chris ORCID: 0000-0002-9438-3879 and Costello, Suzanne (2016) Morphology and acoustic artefacts of copper deposits electroplated using megasonic assisted agitation. Circuit World, 42 (3). pp. 127-140. ISSN 0305-6120 (doi:https://doi.org/10.1108/CW-03-2016-0006)

Micro-electronic displays, thermo-mechanics, amlcd, active matrix liquid crystal display

Lee, Yek, Bailey, Christopher ORCID: 0000-0002-9438-3879, Lu, Hua ORCID: 0000-0002-4392-6562, Riches, Steve, Bartholomew, Martin and Tebbit, Nigel (2006) Thermo-mechanical analysis of the packaging process for micro-electronic displays. 7th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2006. EuroSime 2006. IEEE Computer Society, pp. 190-195. ISBN 1 4244 0275 1 (doi:https://doi.org/10.1109/ESIME.2006.1644051)

Microstructures, Microfluidics, Electrostatics, Microfabrication

Tonry, Catherine E. H. ORCID: 0000-0002-8214-0845, Patel, Mayur K., Yu, Weixing, Desmulliez, Marc P. Y. and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2019) Fabrication of hollow polymer microstructures using dielectric and capillary forces. Microsystem Technologies. pp. 1-8. ISSN 0946-7076 (Print), 1432-1858 (Online) (doi:https://doi.org/10.1007/s00542-019-04409-z)

Model order reduction, wirebond, power electronic module

Rajaguru, Pushparajah ORCID: 0000-0002-6041-0517, Bailey, Christopher ORCID: 0000-0002-9438-3879 and Bella, Martina (2021) Applying model order reduction to the reliability prediction of power electronic module wire bond structure. In: 27th International workshop on Thermal Investigations of ICs and Systems. Sep 22-24 2021, Berlin. Thermal Investigations of ICs and Systems . THERMINIC & Institute of Electrical and Electronics Engineers (IEEE), Berlin, Germany & Piscataway, NJ, US.. (In Press)

Modelling; Electronic Packaging; Reliability

Stoyanov, Stoyan ORCID: 0000-0001-6091-1226, Bailey, Chris ORCID: 0000-0002-9438-3879 and Tourloukis, Georgios (2016) Similarity approach for reducing qualification tests of electronic components. Microelectronics Reliability, 67. pp. 111-119. ISSN 0026-2714 (doi:https://doi.org/10.1016/j.microrel.2016.10.017)

Multiphysics modelling; Press-Pack assembly; Electronic Packaging

Rajaguru, Pushparajah ORCID: 0000-0002-6041-0517, Ortiz-Gonzalez, Jose Angel, Lu, Hua ORCID: 0000-0002-4392-6562, Bailey, Chris ORCID: 0000-0002-9438-3879 and Alatise, Olawiwola (2017) A multiphysics modeling and experimental analysis of pressure contacts in power electronics applications. IEEE Transactions on Components, Packaging and Manufacturing Technology, 7 (6). pp. 893-900. ISSN 2156-3950 (Print), 2156-3985 (Online) (doi:https://doi.org/10.1109/TCPMT.2017.2688021)

N/A

Rajaguru, Pushparajah ORCID: 0000-0002-6041-0517, Mason, Peter, Bailey, Christopher ORCID: 0000-0002-9438-3879 and Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 (2012) Structural Analysis on the Riveted Hull of the Paddle Steamer Medway Queen. In: Historic Ships Conference 2012. Royal Institution of Naval Architects (RINA).

Nano-Imprint Forming (NIF), Finite Element Analysis, fabrication

Stoyanov, Stoyan ORCID: 0000-0001-6091-1226, Amalou, Farid, Sinclair, Keith I., Bailey, Christopher ORCID: 0000-0002-9438-3879 and Desmulliez, Marc P.Y. (2008) Minimising the risk of defects in nano-imprint forming. 31st International Spring Seminar on Electronics Technology, 2008. ISSE '08. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 367-372. ISBN 978-1-4244-3972-0 (doi:https://doi.org/10.1109/ISSE.2008.5276670)

Numerical methods, layered structures, plastic strain.

Nwanoro, Kenneth C., Lu, Hua ORCID: 0000-0002-4392-6562, Yin, Chunyan ORCID: 0000-0003-0298-0420 and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2018) An approximate numerical method for the prediction of plastic strain in layered structures. In: 2018 7th Electronic System-Integration Technology Conference (ESTC 2018). IEEE, pp. 181-187. ISBN 978-1538668153

Numerical software, Mapping, Thermo-mechanical analysis, Power cycling, FEA, CFD, ANSYS, Flotherm XT

Nwanoro, Kenneth C., Lu, Hua ORCID: 0000-0002-4392-6562, Yin, Chunyan ORCID: 0000-0003-0298-0420 and Bailey, Chris ORCID: 0000-0002-9438-3879 (2018) Using FloTHERM XT and ANSYS workbench to perform Thermo-Mechanical analysis. Engineering Edge. (In Press)

OPISA, optoelectronic packaging, laser spot weld formation

Malik, Asif, Hughes, Michael and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2006) Optoelectronic packaging interfaces for submicron alignment (OPISA) and the dynamics of laser spot weld formation. Proceedings of the 1st Electronics Systemintegration Technology Conference, 2006. IEEE, pp. 387-391. ISBN 1 4244 0552 1 (doi:https://doi.org/10.1109/ESTC.2006.280031)

Offshore renewable energy; Subsea cables; degradation; prognostics; life expectancy; abrasion; wear; corrosion; scour

Bailey, Christopher ORCID: 0000-0002-9438-3879, Yin, Chunyan ORCID: 0000-0003-0298-0420 and Rajaguru, Pushparajah ORCID: 0000-0002-6041-0517 (2019) Predicting damage and life expectancy of subsea power cables in offshore renewable energy applications. IEEE ACCESS, 7. pp. 54658-54669. ISSN 2169-3536 (Online) (doi:https://doi.org/10.1109/ACCESS.2019.2911260)

Oldroyd-B, unstructured, cell-centred, viscoelastic

Edussuriya, S.S., Williams, A.J. and Bailey, C. ORCID: 0000-0002-9438-3879 (2004) A cell-centred finite volume method for modelling viscoelastic flow. Journal of Non-Newtonian Fluid Mechanics, 117 (1). pp. 47-61. ISSN 0377-0257 (doi:https://doi.org/10.1016/j.jnnfm.2003.12.001)

Power Electronic Module (PEM), predictive reliability, risk assessment

Bailey, C. ORCID: 0000-0002-9438-3879, Lu, H. ORCID: 0000-0002-4392-6562, Yin, C. ORCID: 0000-0003-0298-0420 and Ridout, S. (2008) Predictive reliability, prognostics and risk assessment for power modules. CIPS 2008: 5th International Conference on Integrated Power Electronics Systems. Proceedings, March, 11-13, 2008 Nuremberg/Germany. ETG-Fachbericht (111). VDE Verlag GmbH, Berlin-Offenbach, Germany, pp. 19-26. ISBN 9783800730896

Power electronics, IGBT, Numerical simulation, CFD, FEA, Reliability

Nwanoro, Kenneth Chimezie, Lu, Hua ORCID: 0000-0002-4392-6562, Yin, Chunyan ORCID: 0000-0003-0298-0420 and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2018) Numerical simulation of the junction temperature, the coolant flow rate and the reliability of an IGBT module. In: 2018 24th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC 2018). IEEE, pp. 250-255. ISBN 978-1538667606

Power electronics, reliability, finite element analysis, wire/ribbon bond

Nwanoro, Kenneth Chimezie, Lu, Hua ORCID: 0000-0002-4392-6562, Yin, Chunyan ORCID: 0000-0003-0298-0420 and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2017) Computer simulation of the reliability of wire bonds and ribbon bonds in power electronics modules. In: 2017 23rd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC). IEEE, pp. 1-6. ISBN 978-1-5386-1929-2 ISSN 2474-1523 (Online) (doi:https://doi.org/10.1109/THERMINIC.2017.8233827)

Production technology; Mechanical engineering; Materials; Generative manufacturing; Additive manufacturing; 3D printing; Mechanical engineering; Designers, Production technicians; Materials scientist; manufacturing technicians; Product developers; Designers

Bailey, C. ORCID: 0000-0002-9438-3879, Stoyanov, S. ORCID: 0000-0001-6091-1226, Tilford, T. and Tourloukis, G. (2016) Modelling methodologies for quality assessment of 3D inkjet printed electronic products. In: 3rd Fraunhofer Direct Digital Manufacturing Conference, DDMC 2016. Proceedings. Fraunhofer Verlag, Stuttgart. ISBN 978-3-8396-9128-1 ISSN 978-3-8396-1001-5 (Online)

QFN, conformal coating, reliability, finite element analysis, thermal cycling

Yin, Chunyan ORCID: 0000-0003-0298-0420, Stoyanov, Stoyan ORCID: 0000-0001-6091-1226, Bailey, Christopher ORCID: 0000-0002-9438-3879 and Stewart, Paul (2019) Thermo-mechanical analysis of conformally coated QFNs for high reliability applications. IEEE Transactions on Components, Packaging and Manufacturing Technology, 9 (11). pp. 2210-2218. ISSN 2156-3950 (Print), 2156-3985 (Online) (doi:https://doi.org/10.1109/TCPMT.2019.2925874)

Reduced order models, Power module, Kriging, Radial basis, Damage rule

Rajaguru, Pushparajah ORCID: 0000-0002-6041-0517, Lu, Hua ORCID: 0000-0002-4392-6562 and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2014) Application of nonlinear fatigue damage models in power electronic module wirebond structure under various amplitude loadings. Advances in Manufacturing, 2 (3). pp. 239-250. ISSN 2095-3127 (Print), 2195-3597 (Online) (doi:https://doi.org/10.1007/s40436-014-0054-5)

Reduced order models, system-in-package, risk analysis, probabilistic optimisation, microsystems

Stoyanov, Stoyan ORCID: 0000-0001-6091-1226, Rajaguru, Pushpa ORCID: 0000-0002-6041-0517 and Bailey, Chris ORCID: 0000-0002-9438-3879 (2010) Reduced order modelling for reliability optimisation of advanced micro-systems. In: EngOpt2010 2nd International Conference on Engineering Optimization. International Conference on Engineering Optimization (2). EngOpt2010, pp. 1-10.

Reliability, Wire/ribbon bond, Power electronics, Power cycling, Thermal cycling, Multi-objective optimization

Nwanoro, Kenneth, Lu, Hua ORCID: 0000-0002-4392-6562, Yin, Chunyan ORCID: 0000-0003-0298-0420 and Bailey, Chris ORCID: 0000-0002-9438-3879 (2018) An analysis of the reliability and design optimization of aluminium ribbon bonds in power electronics modules using computer simulation method. Microelectronics Reliability, 87. pp. 1-14. ISSN 0026-2714 (doi:https://doi.org/10.1016/j.microrel.2018.05.013)

Response Surface, Numerical Optimilation, Electronic Packaging, Reliability,Multi-physics modeling, Thermal Management

Stoyanov, S. ORCID: 0000-0001-6091-1226 and Bailey, C. ORCID: 0000-0002-9438-3879 (2002) Response Surface Modeling and Optimisation for Reliable Electronic Products. In: The Fifth International IEEE Symposium on High Density Packaging and Component Failure Analysis in Electronics Manufacturing. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 49-57. ISBN 0780398238

SiP structure, package design parameters, thermo-mechanical behaviour, non-linear transient finite element simulations

Stoyanov, Stoyan ORCID: 0000-0001-6091-1226, Bailey, Christopher ORCID: 0000-0002-9438-3879, Strusevitch, Nadia and Yannou, J.-M. (2007) Computational approach for reliable and robust system-in-package design. 2007 30th International Spring Seminar On Electronics Technology. International Spring Seminar on Electronics Technology ISSE . Institute of Electrical and Electronics Engineers, Inc., New York, pp. 40-45. ISBN 9781424412174 (doi:https://doi.org/10.1109/ISSE.2007.4432818)

SiP structure, thermo-mechanical behaviour, reduced order models (ROM)

Stoyanov, Stoyan ORCID: 0000-0001-6091-1226, Yannou, J.-M., Bailey, Christopher ORCID: 0000-0002-9438-3879 and Strusevitch, Nadia (2007) Reliability based design optimisation for system-in-package. In: Ernst, L.J., Zhang, G.Q., Rodgers, P., Meuwissen, M., Marco, S., Van Driel, W.D. and De Saint Leger, O., (eds.) EUROSIME 2007: Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, Proceedings. Institute of Electrical and Electronics Engineers, Inc., New York, pp. 289-296. ISBN 9781424411054 (doi:https://doi.org/10.1109/ESIME.2007.359948)

SiP technology, thermo-mechanical reliability analysis, stacked die, side-by-side dies, embedded die, finite element analysis, numerical optimisation, uncertainty analysis, lead free solder interconnects, accelerated temperature cycle, fatigue life-time, warpage

Bailey, C. ORCID: 0000-0002-9438-3879, Stoyanov, S. ORCID: 0000-0001-6091-1226, Strusevich, N. and Yannou, J.-M. (2007) Reliability analysis of SiP structures. HDP'07: Proceedings of the 2007 International Symposium on High Density Packaging and Microsystem Integration. Institute of Electrical and Electronics Engineers, Inc., New York, p. 38. ISBN 9781424412525 (doi:https://doi.org/10.1109/HDP.2007.4283556)

SiP, packaging design, solder joints, numerical modelling

Strusevitch, Nadia, Stoyanov, Stoyan ORCID: 0000-0001-6091-1226, Liu, D., Bailey, Christopher ORCID: 0000-0002-9438-3879, Richardson, A., Dumas, N., Yannou, J.M. and Georgel, V. (2006) Modelling the behavior of solder joints for wafer level SiP. In: Pang, J.H.L., Vaidyanathan, K., Wong, S.C.K. and Tee, T.Y., (eds.) 2006 8th Electronics Packaging Technology Conference (EPTC 2006) : 6-8 December 2006, Singapore. IEEE, Picsataway, N.J., pp. 127-132. ISBN 1424406641; 142440665X (doi:https://doi.org/10.1109/EPTC.2006.342703)

Silicon Carbide; Press-Pack; Reliability

Ortiz Gonzalez, Jose, Alatise, Olayiwola, Aliyu, Attahir, Rajaguru, Pushparajah ORCID: 0000-0002-6041-0517, Castellazzi, Alberto, Ran, Li, Mawby, Philip and Bailey, Chris ORCID: 0000-0002-9438-3879 (2017) Evaluation of SiC Schottky diodes using pressure contacts. IEEE Transactions on Industrial Electronics, 64 (10). 8213 -8223. ISSN 0278-0046 (Print), 1557-9948 (Online) (doi:https://doi.org/10.1109/TIE.2017.2677348)

Stress comparison, silicon carbide, failure analysis, power cycling, life prediction

Lu, Hua ORCID: 0000-0002-4392-6562 and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2017) Failure and reliability analysis of a SiC power module based on stress comparison to a Si device. IEEE Transactions on Device and Materials Reliability, 17 (4). pp. 727-737. ISSN 1530-4388 (doi:https://doi.org/10.1109/TDMR.2017.2766692)

Surrogate models; Power electronic module; Sensitivity analysis; Finite element analysis

Rajaguru, P. ORCID: 0000-0002-6041-0517, Lu, H. ORCID: 0000-0002-4392-6562, Bailey, C. ORCID: 0000-0002-9438-3879, Ortiz-Gonzalez, J. and Alatise, O. (2016) Evaluation of the impact of the physical dimensions and material of the semiconductor chip on the reliability of Sn3.5Ag solder interconnect in power electronic module: A finite element analysis perspective. Microelectronics Reliability, 68. pp. 77-85. ISSN 0026-2714 (doi:https://doi.org/10.1016/j.microrel.2016.12.002)

Topological Optimisation

Santhakrishnan, M., Tilford, T. ORCID: 0000-0001-8307-6403 and Bailey, C. ORCID: 0000-0002-9438-3879 (2016) On the Application of Topology Optimisation Techniques to Thermal Management of Microelectronics Systems. In: IEEE EuroSimE conference, 17-20 April, 2016, Montpellier, France.

Topology; optimisation; engineering design

Santhanakrishnan, Mani Sekaran, Tilford, Timothy ORCID: 0000-0001-8307-6403 and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2018) Performance assessment of density and level-set topology optimisation methods for 3D heatsink design. Journal of Algorithms and Computational Technology, 12 (3). pp. 273-287. ISSN 1748-3018 (Print), 1748-3026 (Online) (doi:https://doi.org/10.1177/1748301818779019)

Variable Frequency Microwave (VFM) system, cure process, thermosetting polymer, encapsulant, thermal stresses, numerical analysis

Tilford, T., Sinclair, K.I., Goussetis, G., Bailey, C. ORCID: 0000-0002-9438-3879, Desmulliez, M.P.Y., Parrott, A.K. and Sangster, A.J. (2008) Numerical analysis of thermal stresses induced during VFM encapsulant curing. In: 31st International Spring Seminar on Electronics Technology, 2008. ISSE '08. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 348-353. ISBN 978-1-4244-3972-0 (doi:https://doi.org/10.1109/ISSE.2008.5276666)

Wettability, Sn-2.8Ag-0.5Cu-1.0Bi, wetting force, contact angle, flux, surface, tension, finite element modeling, intermetallic compounds

Rizvi, M.J., Chan, Y.C., Bailey, C. ORCID: 0000-0002-9438-3879, Lu, H. ORCID: 0000-0002-4392-6562, Islam, M.N. and Wu, B.Y. (2005) Wetting and Reaction of Sn-2.8Ag-0.5Cu-1.0Bi Solder with Cu and Ni Substrates. IEEE/TMS Journal of Electronic Materials, 34 (8). pp. 1115-1122. ISSN 0361-5235 (Print), 1543-186X (Online) (doi:https://doi.org/10.1007/s11664-005-0239-6)

X-ray diffraction (XRD), synchrotron, intermetallic compounds (IMCs), lead-free solder, reliability, European Synchrotron Radiation Facility (ESRF)

Jackson, Gavin J., Lu, Hua ORCID: 0000-0002-4392-6562, Durairaj, Raj, Hoo, Nick, Bailey, Chris ORCID: 0000-0002-9438-3879, Ekere, Ndy N. and Wright, Jon (2004) Intermetallic phase detection in lead-free solders using synchrotron X-ray diffraction. Journal of Electronic Materials, 33 (12). pp. 1524-1529. ISSN 0361-5235 (Print), 1543-186X (Online) (doi:https://doi.org/10.1007/s11664-004-0094-x)

acoustics, coatings, dispersion, morphology, surface morphology, surface topography, surface treatment

Xu, Sha, Chan, Yan Cheong, Zhu, Xiaoxin, Lu, Hua ORCID: 0000-0002-4392-6562 and Bailey, Chris ORCID: 0000-0002-9438-3879 (2014) Effective method to disperse and incorporate carbon nanotubes in electroless Ni-P deposits. In: 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) Proceedings. Curran Associates, Stoughton, WI, USA, pp. 1342-1347. ISBN 9781479924080 (doi:https://doi.org/10.1109/ECTC.2014.6897466)

additive manufacturing, inkjet printing, microelectronics fabrication, reliability, numerical analysis

Tilford, Tim ORCID: 0000-0001-8307-6403, Stoyanov, Stoyan ORCID: 0000-0001-6091-1226, Braun, Jessica, Janhsen, Jan Christoph, Patel, Mayur K. and Bailey, Chris ORCID: 0000-0002-9438-3879 (2021) Comparative reliability of inkjet-printed electronics packaging. IEEE Transactions on Components, Packaging and Manufacturing Technology, 11 (2). pp. 351-362. ISSN 2156-3950 (Print), 2156-3985 (Online) (doi:https://doi.org/10.1109/TCPMT.2021.3049952)

adhesion, strength of materials, ageing (materials), films (states of matter)

Rizvi, M.J., Chan, Y.C., Bailey, C. ORCID: 0000-0002-9438-3879, Lu, H. ORCID: 0000-0002-4392-6562 and Sharif, A. (2005) The effect of curing on the performance of ACF bonded chip-on-flex assemblies after thermal ageing. Soldering & Surface Mount Technology, 17 (2). pp. 40-48. ISSN 0954-0911 (doi:https://doi.org/10.1108/09540910510597492)

adhesive bonding, chip scale packaging, conducting materials, fine-pitch technology, integrated circuit interconnections, printing, solders

Desmulliez, M.P.Y., Kay, R.W., Stoyanov, S. ORCID: 0000-0001-6091-1226 and Bailey, C. ORCID: 0000-0002-9438-3879 (2004) Stencil printing at sub-100 microns pitch. In: Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 354-358. ISBN 0780388216 (doi:https://doi.org/10.1109/EPTC.2004.1396633)

Desmulliez, M.P.Y., Kay, R.W., Stoyanov, S. ORCID: 0000-0001-6091-1226 and Bailey, C. ORCID: 0000-0002-9438-3879 (2004) Stencil printing at sub-100 microns pitch. In: Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 354-358. ISBN 0780388216 (doi:https://doi.org/10.1109/EPTC.2004.1396633)

adhesive bonding, contact resistance, finite element, analysis, flip-chip devices, integrated circuit, interconnections, integrated circuit reliability, reflow soldering

Yin, C.Y. ORCID: 0000-0003-0298-0420, Lu, H. ORCID: 0000-0002-4392-6562, Bailey, C. ORCID: 0000-0002-9438-3879 and Chan, Y.C. (2004) Effects of reflow process on the reliability of flip chip on flex interconnections using anisotropic conductive adhesives. In: 2004 International IEEE Conference on Asian Green Electronics (AGEC) [Proceedings]. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 240-245. ISBN 0-7803-8203-X (doi:https://doi.org/10.1109/AGEC.2004.1290912)

adhesive, curing, glass transition temperature, loss modulus, storage modulus

Rizvi, M.J., Lu, H. ORCID: 0000-0002-4392-6562, Bailey, C. ORCID: 0000-0002-9438-3879, Chan, Y.C., Lee, M.Y. and Pang, C.H. (2007) Role of bonding time and temperature on the physical properties of coupled anisotropic conductive–nonconductive adhesive film for flip chip on glass technology. Microelectronic Engineering, 85 (1). pp. 238-244. ISSN 0167-9317 (doi:https://doi.org/10.1016/j.mee.2007.05.045)

adhesives in electronics

Alam, M.O. and Bailey, C. ORCID: 0000-0002-9438-3879 (eds.) (2011) Advanced adhesives in electronics, materials, properties and applications. Woodhead Publishing Limited, Cambridge, UK. ISBN 9781845695767

adhesives, anisotropic media, finite element analysis, flip-chip devices, integrated circuit interconnections, integrated circuit reliability, reflow soldering, thermal expansion

Yin, Chunyan ORCID: 0000-0003-0298-0420, Lu, Hua ORCID: 0000-0002-4392-6562, Bailey, Chris ORCID: 0000-0002-9438-3879 and Chan, Yan-Cheong (2004) Effects of solder reflow on the reliability of flip-chip on flex interconnections using anisotropic conductive adhesives. IEEE Transactions on Electronics Packaging Manufacturing, 27 (4). pp. 254-259. ISSN 1521-334X (doi:https://doi.org/10.1109/TEPM.2004.843152)

aerospace, ball grid arrays, finite element analysis, integrated circuit interconnections, integrated circuit reliability, life testing, solders thermal stress cracking

Stoyanov, S. ORCID: 0000-0001-6091-1226, Mackay, W., Bailey, C. ORCID: 0000-0002-9438-3879, Jibb, D. and Gregson, C. (2004) Lifetime assessment of electronic components for high reliability aerospace applications. In: Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 324-329. ISBN 0780388216 (doi:https://doi.org/10.1109/EPTC.2004.1396627)

agitation method, megasonic acoustic streaming, plating rate, uniformity, electroplating, electrodeposition, metals, copper

Kaufmann, Jens Georg, Desmulliez, Marc P.Y., Tian, Yingtao, Price, Dennis, Hughes, Mike, Strusevitch, Nadia, Bailey, Chris ORCID: 0000-0002-9438-3879, Liu, Changqing and Hutt, David (2009) Megasonic agitation for enhanced electrodeposition of copper. Microsystem Technologies, 15 (8). pp. 1245-1254. ISSN 0946-7076 (Print), 1432-1858 (Online) (doi:https://doi.org/10.1007/s00542-009-0886-2)

anisotropic conductive film (ACF), moisture absorption, flip chip on flex

Yin, C.Y. ORCID: 0000-0003-0298-0420, Lu, H. ORCID: 0000-0002-4392-6562, Bailey, C. ORCID: 0000-0002-9438-3879 and Chan, Y.C. (2013) Effects of moisture absorption on anisotropic conductive films interconnection for flip chip on flex applications. Microelectronic Engineering, 107. pp. 17-22. ISSN 0167-9317 (doi:https://doi.org/10.1016/j.mee.2013.02.070)

anisotropic conductive film, (ACF), moisture, flip chip technology

Yin, Chunyan ORCID: 0000-0003-0298-0420, Lu, Hua ORCID: 0000-0002-4392-6562, Bailey, Chris ORCID: 0000-0002-9438-3879 and Chan, Yan-Cheong (2005) Moisture effects on the reliability of ACF interconnections. Electronics World, 111 (1836). pp. 20-24. ISSN 1365-4675

anisotropic conductive films, anisotropic magnetoresistance, assembly, conductive adhesives, contact resistance, flip chip, polymer films, semiconductor device modeling, stress, temperature

Yin, C.Y. ORCID: 0000-0003-0298-0420, Lu, H. ORCID: 0000-0002-4392-6562, Bailey, C. ORCID: 0000-0002-9438-3879 and Chan, Y.C. (2003) Experimental and modeling analysis of the reliability of the anisotropic conductive films. In: 2003 Proceedings 53rd Electronic Components & Technology Conference. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 698-702. ISBN 0780377915 ISSN 0569-5503 (doi:https://doi.org/10.1109/ECTC.2003.1216359)

assembling, circuit reliability, circuit simulation, failure analysis, flip-chip devices, integrated circuit modelling, integrated optoelectronics, optimisation, thermal management (packaging), virtual prototyping

Bailey, Chris ORCID: 0000-0002-9438-3879 (2003) Modelling the effect of temperature on product reliability. In: 2003 Proceedings, Nineteenth IEEE Semiconductor Thermal Measurement and Management Symposium. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 324-331. ISBN 0780377931 ISSN 1065-2221 (doi:https://doi.org/10.1109/STHERM.2003.1194380)

assembling, circuit reliability, copper, flip-chip devices printed circuit manufacture, reflow soldering, sensitivity analysis

Lu, H. ORCID: 0000-0002-4392-6562 and Bailey, C. ORCID: 0000-0002-9438-3879 (2002) Predicting optimal process conditions for flip-chip aassembly using copper column bumped dies. In: Proceedings of 4th Electronics Packaging Technology Conference (EPTC 2002). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 338-343. ISBN 0780374355 (doi:https://doi.org/10.1109/EPTC.2002.1185694)

assembly, curing, dielectric losses, dielectric materials, electromagnetic heating, microwave devices, microwave ovens, packaging, polymers, waveguide components

Sinclair, Keith I., Goussetis, George, Desmulliez, Marc P.Y., Sangster, Alan J., Tilford, Tim, Bailey, Chris ORCID: 0000-0002-9438-3879 and Parrott, Kevin (2009) Polymer curing within an optimised open-ended microwave oven. In: European Microwave Week 2008, “Bridging Gaps”, Conference Proceedings,. Institute of Electrical and Electronics Engineers, Inc., Piscataway, N.J., USA, pp. 17-20. ISBN 978-2874870064 (doi:https://doi.org/10.1109/EUMC.2008.4751375)

assembly, defects, numerical modelling, printed circuit boards, solder joint, solders

Bailey, Chris ORCID: 0000-0002-9438-3879, Wheeler, Daniel and Cross, Mark (1998) Numerical modelling of solder joint formation. Soldering & Surface Mount Technology, 10 (2). pp. 6-13. ISSN 0954-0911 (doi:https://doi.org/10.1108/09540919810219912)

atomic diffusions, atomic vacancies, current loadings, EM simulations, multi-physics, void formation

Zhu, Xiaoxin, Kotadia, H., Xu, Sha, Lu, Hua ORCID: 0000-0002-4392-6562, Mannan, S.H., Chan, Y.C. and Bailey, C. ORCID: 0000-0002-9438-3879 (2011) Multi-physics computer simulation of the electromigration phenomenon. In: ICEPT-HDP 2011 Proceedings - 2011 International Conference on Electronic Packaging Technology and High Density Packaging. IEEE Computer Society, Piscataway, USA, pp. 448-452. ISBN 9781457717703 (Print), 9781457717680 (Online) (doi:https://doi.org/10.1109/ICEPT.2011.6066874)

backlight units, design environment, finite element analysis, human vision models, junction temperatures, just-noticeable difference, key parameters, LED backlighting devices , multi-disciplinary analysis, multi-physics, optical performance, optical simulation, ray tracing calculations, solid state lighting, solid state lighting systems, viewability

Bailey, C. ORCID: 0000-0002-9438-3879, Yin, C. ORCID: 0000-0003-0298-0420, Lu, H. ORCID: 0000-0002-4392-6562 and Cartwright, C. (2011) Multi-physics and multi-disciplinary analysis for solid state lighting. In: 2011 12th Int. Conf. on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2011. IEEE Computer Society, Piscataway, USA. ISBN 9781457701078 (doi:https://doi.org/10.1109/ESIME.2011.5765859)

ball grid array, printed circuit board reflow,

Stoyanov, Stoyan ORCID: 0000-0001-6091-1226, Dabek, Alexander and Bailey, Chris ORCID: 0000-0002-9438-3879 (2013) Thermo–mechanical sub–modelling of BGA components in PCB reflow. In: Proceedings of 36th International Spring Seminar on Electronics Technology, Alba Iulia, Romania, May 8-12, 2013, pp.1-8. Institute of Electrical and Electronics Engineers, Piscataway, NJ, USA, pp. 253-258. ISBN 9781479900367 ISSN 2161-2528 (doi:https://doi.org/10.1109/ISSE.2013.6648252)

ball grid arrays, flip-chip devices, packaging, semiconductor device reliability

Bailey, C. ORCID: 0000-0002-9438-3879, Stoyanov, S. ORCID: 0000-0001-6091-1226 and Lu, H. ORCID: 0000-0002-4392-6562 (2004) Reliability predictions for high density packaging. In: Proceeding of The Sixth IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis (HDP'04). Institute of Electrical and Electronics Engineers, Inc., Piscataway, N.J., U.S.A., pp. 121-128. ISBN 0780386205 (doi:https://doi.org/10.1109/HPD.2004.1346684)

ball shear test, bond strength, ball grid array (BGA), solder interface strength, Finite Element Analysis(FEA), intermetallic compound (IMC), fracture propogation path, interfacial reaction phenomena,

Alam, M. O., Lu, Hua ORCID: 0000-0002-4392-6562, Bailey, Christopher ORCID: 0000-0002-9438-3879, Chan, Y.C. and Wu, B.Y. (2007) Shear strength analysis of ball grid array (BGA) solder interfaces. In: Vaidyanathan, K., Tee, T.Y. and Lee, T.K., (eds.) 2007 9th Electronics Packaging Technology Conference. Electronics Packaging Technology Conference Proceedings . Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 770-773. ISBN 9781424413249 (doi:11.1109/EPTC.2007.4469797)

biofluid behavior, microchannel device, design optimization, particle liquid separation, T-microchannel device, blood plasma separation

Xue, Xiangdong, Patel, Mayur K., Bailey, Chris ORCID: 0000-0002-9438-3879, Kersaudy-Kerhoas, Maïwenn and Desmulliez, Marc P.Y. (2009) Parametrical modeling and design optimization of blood plasma separation device with microchannel mechanism. In: Electronic Components and Technology. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, 1970 -1976. ISBN 978-1-4244-4476-2 (doi:https://doi.org/10.1109/ECTC.2009.5074291)

biofluid behaviour, microchannel systems, modelling, microchannel biochip separator, blood plasma separation

Xue, Xiangdong, Patel, Mayur, Kersaudy-Kerhoas, Maïwenn, Bailey, Christopher ORCID: 0000-0002-9438-3879, Desmulliez, Marc P.Y. and Topham, David (2009) Effect of fluid dynamics and device mechanism on biofluid behaviour in microchannel systems: modelling biofluids in a microchannel biochip separator. International Conference on Electronic Packaging Technology & High Density Packaging, 2009. ICEPT-HDP '09. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 179-186. ISBN 978-1-4244-4659-9 (doi:https://doi.org/10.1109/ICEPT.2009.5270767)

biofluid separation, bifurcation effect, constriction effect

Xue, Xiangdong, Bailey, Chris ORCID: 0000-0002-9438-3879 and Patel, Mayur K. (2010) Design modification of a biochip microchannel separator with integrated curve constrictions for enhanced separation behaviour. In: Proceedings - 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2010. Association for Computing Machinery, New York, pp. 691-697. ISBN 9781424481408 (doi:https://doi.org/10.1109/ICEPT.2010.5582861)

blood fluid separation, microfluidic device, design optimisation, cross flow filtration, modelling and simulation

Xue, Xiangdong, Patel, Mayur K., Bailey, Chris ORCID: 0000-0002-9438-3879 and Desmulliez, Marc P.Y. (2011) Geometrical optimisation of a biochip microchannel fluidic separator. Computer Methods in Biomechanics and Biomedical Engineering, 15 (9). pp. 981-991. ISSN 1025-5842 (Print), 1476-8259 (Online) (doi:https://doi.org/10.1080/10255842.2011.569501)

blood fluid separation, modelling and simulation, microfluidic device, microchannel device, cross-flow filtration

Xue, Xiangdong, Patel, Mayur, Kersaudy-Kerhoas, Maïwenn, Bailey, Christopher ORCID: 0000-0002-9438-3879 and Desmulliez, Marc P.Y. (2011) Modelling and simulation of the behaviour of a biofluid in a microchannel biochip separator. Computer Methods in Biomechanics and Biomedical Engineering, 14 (6). pp. 549-560. ISSN 1025-5842 (Print), 1476-8259 (Online) (doi:https://doi.org/10.1080/10255842.2010.485570)

bridge circuits, failure analysis, insulated gate bipolar transistors, integrated circuit interconnections, integrated circuit modelling, integrated circuit reliability, modules, plastic deformation, power bipolar transistors, power integrated circuits, semiconductor device, reliability, soldering, physics of failure (PoF)

Yin, C.Y, ORCID: 0000-0003-0298-0420, Lu, H. ORCID: 0000-0002-4392-6562, Musallam, M., Bailey, C. ORCID: 0000-0002-9438-3879 and Johnson, C.M. (2008) A physics-of-failure based prognostic method for power modules. In: 10th Electronics Packaging Technology Conference (EPTC 2008). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 1190-1195. ISBN 9781424421176 (doi:https://doi.org/10.1109/EPTC.2008.4763591)

capillarity, dielectric liquids, domains, electric field effects, flow simulation, microfabrication, multiphase flow, polymer solutions, surface tension

Tonry, C.E.H., Patel, M.K., Bailey, C. ORCID: 0000-0002-9438-3879, Desmuliez, M.P.Y. and Yu, W. (2013) Micro-scale modelling challenges in electric field assisted capillarity. In: Proceedings. 12th International Symposium on Distributed Computing and Applications to Business, Engineering & Science. DCABES 2013. IEEE Computer Society. Conference Publishing Services (CPS), Los Alamitos, CA, USA, 40- 43. ISBN 978-0769550602 (doi:https://doi.org/10.1109/DCABES.2013.57)

ceramic packaging, creep, modules, plastic deformation, resistors, solders, stress analysis, surface mount technology, viscoplasticity

Warner, Matt, Parry, John, Bailey, Chris ORCID: 0000-0002-9438-3879 and Lu, Hua ORCID: 0000-0002-4392-6562 (2004) Solder life prediction in a thermal analysis software environment. In: The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena In Electronic Systems (ITHERM 2004) [Proceedings]. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 391-396. ISBN 0780383575 ISSN 1089-9870 (doi:https://doi.org/10.1109/ITHERM.2004.1318309)

chip-on-board packaging, flip-chip devices, integrated optoelectronics, optical backplanes, optical waveguides photodiodes, surface emitting lasers, thermal expansion

Gwyer, D., Misselbrook, P., Philpott, D., Bailey, C. ORCID: 0000-0002-9438-3879, Conway, P.P. and Williams, K. (2004) Thermal, mechanical and optical modelling of VCSEL packaging. In: The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena In Electronic Systems (ITHERM 2004) [Proceedings]. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 405-410. ISBN 0780383575 ISSN 1089-9870 (doi:https://doi.org/10.1109/ITHERM.2004.1318311)

chip-on-board, lateral IGBT, LED drivers, packaging, reliability

Aliyu, A. M., Mouawad, B., Castellazzi, A., Rajaguru, P. ORCID: 0000-0002-6041-0517, Bailey, C. ORCID: 0000-0002-9438-3879, Pathirana, V., Uduampola, N., Trajkovic, T. and Ubrea, F. (2017) Chip-on-board assembly of 800V Si LIGBTs for high performance ultra-compact LED drivers. In: Proceedings of the 2017 29th International Symposium on Power Semiconductor Devices and IC's (ISPSD). IEEE, pp. 431-434. ISBN 978-4-88686-094-1 ISSN 1946-0201 (Online) (doi:https://doi.org/10.23919/ISPSD.2017.7988976)

chip-on-flex (COF), anisotropic conductive film (ACF), finite element modelling, stress, conductive particle, contact resistance, life-time

Rizvi, M.J., Bailey, Christopher ORCID: 0000-0002-9438-3879, Chan, Y.C. and Lu, Hua ORCID: 0000-0002-4392-6562 (2006) Effects of thermal cycling profiles on the performance of chip-on-flex assembly using anisotropic conductive films. Thermal and Thermomechanical Phenomena in Electronics Systems, 2006. ITHERM '06. The Tenth Intersociety Conference on. IEEE, pp. 855-860. ISBN 0780395247 (doi:https://doi.org/10.1109/ITHERM.2006.1645436)

circuit optimisation, computational fluid dynamics, CFD, electronic design automation, flow simulation, integrated circuit modelling, integrated circuit packaging, integrated circuit reliability, thermal analysis, thermal management (packaging), turbulence

Dhinsa, K., Bailey, C. ORCID: 0000-0002-9438-3879 and Pericleous, K. ORCID: 0000-0002-7426-9999 (2004) Low Reynolds number turbulence models for accurate thermal simulations of electronic components. In: Proceedings of the 5th International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems EuroSimE 2004. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 483-490. ISBN 0780384202 (doi:https://doi.org/10.1109/ESIME.2004.1304081)

circuit optimisation, design of experiments, finite element analysis, integrated optoelectronics, optical backplanes optical planar waveguides, surface emitting lasers

Gwyer, D., Misselbrook, P., Bailey, C. ORCID: 0000-0002-9438-3879, Conway, P.P. and Williams, K. (2004) Polymer waveguide and VCSEL array multi-physics modelling for OECB based optical backplanes [opto-electrical circuit boards]. In: Proceedings of the 5th International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems EuroSimE 2004. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 399-406. ISBN 0780384202 (doi:https://doi.org/10.1109/ESIME.2004.1304070)

circuit reliability, computational fluid dynamics, CFD, creep, design for manufacture, ductility, electromagnetic compatibility, electronic design automation, fatigue, mesh generation, soldering, stress analysis, surface mount technology, thermal management (packaging), thermal stresses

Parry, John, Marooney, Chris, Warner, Matt, Bailey, Chris ORCID: 0000-0002-9438-3879 and Pericleous, Koulis ORCID: 0000-0002-7426-9999 (2002) An integrated approach to flow, thermal and mechanical modeling of electronics devices. In: ITHERM 2002. The Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems [Proceedings]. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, U.S.A., pp. 862-868. ISBN 0780371526 ISSN 1089-9870 (doi:https://doi.org/10.1109/ITHERM.2002.1012545)

circuit reliability, electromagnetic compatibility, life cycle costing, printed circuit design, quality control

Parry, John, Bailey, Chris ORCID: 0000-0002-9438-3879 and Addison, Chris (2000) Multiphysics modelling for electronics design. In: ITherm Proceedings. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 86-93. ISBN 0780359127 ISSN 0189-9870 (doi:https://doi.org/10.1109/ITHERM.2000.866175)

circuits, electromechanical devices, electronics industry, reliability management

Richardson, Andrew, Bailey, Christopher ORCID: 0000-0002-9438-3879, Yanou, Jean Marc, Dumas, Norbert, Liu, Dongsheng, Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 and Strusevitch, Nadia (2007) "System in package technology" - design for manufacture challenges. Circuit World, 33 (1). pp. 36-46. ISSN 0305-6120 (doi:https://doi.org/10.1108/03056120710723706)

commercial off-the shelf components, modelling, refinishing, reliability

Stoyanov, S. ORCID: 0000-0001-6091-1226 and Bailey, C. ORCID: 0000-0002-9438-3879 (2015) Modelling the impact of refinishing processes on COTS components for use in aerospace applications. Microelectronics Reliability, 55 (9-10). pp. 1271-1279. ISSN 0026-2714 (doi:https://doi.org/10.1016/j.microrel.2015.07.030)

compuational fluid dynamics (CFD), wave soldering, gas flow, modelling

Stoyanov, S. ORCID: 0000-0001-6091-1226, Bailey, C. ORCID: 0000-0002-9438-3879, Saxena, N. and Adams, S. (2004) Modelling the wave soldering process. In: Proceedings of the 6th International Conference on Electronics Materials and Packaging (EMAP 2004). Institute of Electrical and Electronics Engineers, pp. 553-558. ISBN 983251486X

computational fluid dynamics (CFD), isotropic conductive adhesives (ICAs), organic light emitting diodes (OLED)

Kay, Robert W., Stoyanov, Stoyan ORCID: 0000-0001-6091-1226, Glinski, Greg P., Bailey, Christopher ORCID: 0000-0002-9438-3879 and Desmulliez, Marc P.Y. (2007) Ultra-fine pitch stencil printing for a low cost and low temperature flip-chip assembly process. IEEE Transactions on Components and Packaging Technologies, 30 (1). pp. 129-136. ISSN 1521-3331 (doi:https://doi.org/10.1109/TCAPT.2007.892085)

computational fluid dynamics, (CFD), turbulence modelling

Dhinsa, K., Bailey, C. ORCID: 0000-0002-9438-3879 and Pericleous, K. ORCID: 0000-0002-7426-9999 (2003) Turbulence modelling and its effects on electronic systems. In: Turbulence, Heat and Mass Transfer 4. Begell House, New York, USA. Oxfordshire, UK, pp. 625-632. ISBN 1567001963

computational fluid dynamics, CFD, computer aided analysis, engineering computing, flow, nitrogen, optimisation, oxygen, wave soldering

Stoyanov, S. ORCID: 0000-0001-6091-1226, Bailey, C. ORCID: 0000-0002-9438-3879, Saxena, N. and Adams, S. (2005) Optimising the wave soldering process for lead free solders. In: Proceeding of 2005 International Conference on Asian Green Electronics - Design for Manufacturability and Reliability - (2005 AGEC). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 125-128. ISBN 0780388062 (doi:https://doi.org/10.1109/AGEC.2005.1452331)

computational fluid dynamics, CFD, cooling electronics packaging, fluctuations, reliability, shear turbulence

Dhinsa, Kulvir K., Bailey, Chris J. ORCID: 0000-0002-9438-3879 and Pericleous, Koulis A. ORCID: 0000-0002-7426-9999 (2004) Turbulence modelling and its impact on CFD predictions for cooling of electronic components. In: The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena In Electronic Systems (ITHERM 2004) [Proceedings]. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 487-494. ISBN 0780383575 ISSN 1089-9870 (doi:https://doi.org/10.1109/ITHERM.2004.1319214)

computational fluid dynamics, CFD, cooling, electronic engineering computing, finite volume methods, flow simulation, forced convection, natural convection, temperature distribution, thermal management (packaging), turbulence

Dhinsa, K., Bailey, C. ORCID: 0000-0002-9438-3879 and Pericleous, K. ORCID: 0000-0002-7426-9999 (2003) Accuracy of turbulence models and CFD for thermal characterisation of electronic systems. In: Proceedings of 5th Conference Electronics Packaging Technology (EPTC 2003). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 507-512. ISBN 0780382056 (doi:https://doi.org/10.1109/EPTC.2003.1271573)

computational fluid dynamics, CFD, flip-chip packaging, Oldroyd-B

Edussuriya, S.S., Williams, A.J. and Bailey, C. ORCID: 0000-0002-9438-3879 (2002) A CFD study of the underfill encapsulation process in flip-chip packaging using the Oldroyd-B model. In: Proceedings of the 6th European Conference of Rheology, (eurheo 2002). LSP, Institute of Polymer Materials, Erlangen-Nuremberg, Germany, pp. 285-286.

computational fluid dynamics, CFD, thermal management, turbulence models, heat transfer, transitional flow, Reynolds number, recirculation vortex

Dhinsa, K., Bailey, C. ORCID: 0000-0002-9438-3879 and Pericleous, K. ORCID: 0000-0002-7426-9999 (2004) Investigation into the performance of turbulence models for fluid flow and heat transfer phenomena in electronic applications. In: 2004 Proceedings, Twentieth IEEE Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM). Institute of Electrical and Electronics Engineers, Inc,, Piscataway, NJ, USA, pp. 278-285. ISBN 078038363X ISSN 1065-2221 (doi:https://doi.org/10.1109/STHERM.2004.1291335)

computational fluid dynamics, CFD, thermal management, turbulence models, transitional flow, recirculation vortices

Dhinsa, K., Bailey, C. ORCID: 0000-0002-9438-3879 and Pericleous, K. ORCID: 0000-0002-7426-9999 (2004) Turbulence modelling for thermal management of electronic systems. In: 12th Association of Computational Mechanics in Engineering Annual Conference (ACME 2004), 5-6 April 2004, Cardiff, Wales, UK. (Unpublished)

computational fluid dynamics, modeling iron, steelmaking processes, ferrous operations,

Cross, M., Croft, T. N., McBride, D., Slone, A. K., Williams, A. J., Bailey, C. ORCID: 0000-0002-9438-3879 and Pericleous, K. ORCID: 0000-0002-7426-9999 (2006) Computational fluid dynamics: advancements in technology for modeling iron and steelmaking processes. AIST Transactions - Iron and Steel Technology, 3 (7). pp. 155-163. ISSN 1547-0423

computational mechanics, design, electronic components

Stoyanov, S. ORCID: 0000-0001-6091-1226, Bailey, C. ORCID: 0000-0002-9438-3879, Lu, H. ORCID: 0000-0002-4392-6562 and Cross, M. (2002) Integrated computational mechanics and optimization for design of electronic components. In: Parmee, Ian C. and Hajela, Prabhat, (eds.) Optimization In Industry. Springer Verlag, pp. 57-71. ISBN 9781852338342

computational mechanics, micro-electronic displays, active matrix liquid crystal display, AMLCD

Lee, Yek Bing, Bailey, Christopher ORCID: 0000-0002-9438-3879, Riches, Steve and Bartholomew, Martin (2006) Predicting the behaviour of micro-electronic displays using computational mechanics. In: 14th Annual Joint Conference of the Association for Computational Mechanics in Engineering (ACME) and the Irish Society for Scientific and Engineering Computation (ISSEC), Queen's University of Belfast.

computational mechanics, numerical optimization material properties, electronic packages

Stoyanov, S. ORCID: 0000-0001-6091-1226, Bailey, C. ORCID: 0000-0002-9438-3879 and Cross, M. (2001) Integrating computational mechanics and numerical optimization for the design of material properties in electronic packages. In: Computational Modeling of Materials, Minerals and Metals Processing [Conference Proceedings]. The Mineral, Metals and Materials Society (TMS), Warrendale, PA, USA, pp. 551-562. ISBN 0873395131

computational modelling, blood flow

Grossman, D., Bailey, C. ORCID: 0000-0002-9438-3879, Pericleous, K. ORCID: 0000-0002-7426-9999 and Slone, A. (2002) Computational modelling of blood flow and artery wall interaction. In: FEM Workshop 2002 [Proceedings]. University of Ulm, Germany, Ulm, Germany, pp. 88-94. ISBN 39806183558

computational modelling, computational fluid dynamics, CFD

Patel, M.K., Bailey, C. ORCID: 0000-0002-9438-3879, Djambazov, G. ORCID: 0000-0001-8812-1269, Shrimpton, J. and Jalili, V. (2003) Application of CFD in vacuum dezincing process. In: The 3rd International Conference on CFD in the Minerals and Process Industries [Proceedings]. CSIRO Publishing, Collingwood, Victoria, Australia, pp. 313-318. ISBN 978064309038X

computational modelling, material deformation

Stoyanov, S. ORCID: 0000-0001-6091-1226, Bailey, C. ORCID: 0000-0002-9438-3879, Tang, Y.K., Marson, S., Dyer, A., Allen, D. and Desmulliez, M. (2010) Computational modelling and optimisation of the fabrication of nano-structures using focused ion beam and imprint forming technologies. Journal of Physics: Conference Series (JPCS), 253 (1):012008. ISSN 1742-6588 (Print), 1742-6596 (Online) (doi:https://doi.org/10.1088/1742-6596/252/1/012008)

computational modelling, multi-physics processes, high performance, parallel computer systems

Cross, M., McManus, K., Johnson, S.P., Ierotheou, C.S., Walshaw, C. ORCID: 0000-0003-0253-7779, Bailey, C. ORCID: 0000-0002-9438-3879 and Pericleous, K.A. ORCID: 0000-0002-7426-9999 (1999) Computational modelling of multi-physics processes on high performance parallel computer systems. In: Allan, R.J., Guest, M.F., Simpson, A.D., Henty, D.S. and Nicole, D.A., (eds.) High-Performance Computing. Springer US, pp. 91-102. ISBN 978-0-306-46034-0 (doi:https://doi.org/10.1007/978-1-4615-4873-7_10)

computational models

Stoyanov, Stoyan ORCID: 0000-0001-6091-1226, Tang, Ying Kit, Bailey, Christopher ORCID: 0000-0002-9438-3879, Evans, Robert, Marson, Silvia and Allen, David (2009) Modelling and process capability analysis of focused ion beam. ISSE 2009: 32nd International Spring Seminar on Electronics Technology: Hetero System Integration, the path to New Solutions in the Modern Electronics - Conference Proceedings. IEEE Computer Society, Piscataway, NJ USA. ISBN 97814244 42607 (Print) (doi:https://doi.org/10.1109/ISSE.2009.5206925)

computer aided conservation, computational modelling, ship modelling, smeared shell approach, Cutty Sark, composite structures

Stoyanov, Stoyan ORCID: 0000-0001-6091-1226, Mason, Peter and Bailey, Chris ORCID: 0000-0002-9438-3879 (2010) Smeared shell modelling approach for structural analysis of heritage composite structures – An application to the Cutty Sark conservation. Computers & Structures, 88 (11-12). pp. 649-663. ISSN 0045-7949 (doi:https://doi.org/10.1016/j.compstruc.2010.02.005)

computer based simulation, electro-thermal design, electrothermal design, power converters, power electronics components, power electronics devices, thermal management

Shahjalal, Mohammad, Lu, Hua ORCID: 0000-0002-4392-6562 and Bailey, Chris ORCID: 0000-0002-9438-3879 (2014) A review of the computer based simulation of electro-thermal design of power electronics devices. In: 20th International Workshop on Thermal Investigations of ICs and Systems. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA. ISBN 9781479954155 (doi:https://doi.org/10.1109/THERMINIC.2014.6972515)

computer control systems, conversion efficiency, design, differential scanning calorimetry, heating, microwave devices, ovens, stoves

Pavuluri, S.K., Tilford, T., Goussetis, G., Desmulliez, M.P.Y., Ferenets, M., Adamietz, R., Eicher, F. and Bailey, C. ORCID: 0000-0002-9438-3879 (2010) Advances in the design and test of a novel open ended microwave oven. In: Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2010. IEEE Computer Society, Piscataway, USA, pp. 247-252. ISBN 9781424466368 (Print), 9782355000119 (Online)

computer modelling, optoelectronic packages

Gwyer, D., Bailey, C. ORCID: 0000-0002-9438-3879, Pericleous, K. ORCID: 0000-0002-7426-9999, Philpott, D. and Misselbrook, P. (2003) Modelling the assembly and performance of optoelectronic packages. In: Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-electronics and Micro-systems. Proceedings of EuroSimE 2003. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 77-85. ISBN 0780370546

computer modelling, solder joints

Ridout, Stephen, Dusek, Milos, Bailey, Christopher ORCID: 0000-0002-9438-3879 and Hunt, Chris (2006) Assessing the performance of crack detection tests for solder joints. Microelectronics Reliability, 46 (12). pp. 2122-2130. ISSN 0026-2714 (doi:https://doi.org/10.1016/j.microrel.2006.05.001)

computer simulation, curing, delamination, fatigue of materials, interfaces (materials), microelectronic processing, soldered joints; X ray microscopes, scanning acoustic microscopes, flip chip devices

Lu, H. ORCID: 0000-0002-4392-6562, Hung, K.C., Stoyanov, S. ORCID: 0000-0001-6091-1226, Bailey, C. ORCID: 0000-0002-9438-3879 and Chan, Y.C. (2002) No-flow underfill flip chip assembly–an experimental and modeling analysis. Microelectronics Reliability, 42 (8). pp. 1205-1212. ISSN 0026-2714 (doi:https://doi.org/10.1016/S0026-2714(02)00092-6)

computer simulation, design, industrial plants, interfaces (computer), computational analysis software, materials processing, materials science

Bailey, C. ORCID: 0000-0002-9438-3879, Patel, M. and Kumar, S. (2001) Computational modelling-a key component in materials processing. Transactions of the Institution of Mining and Metallurgy, Section C: Mineral Processing and Extractive Metallurgy, 110 (1). pp. 25-32. ISSN 0371-9553 (Print), 1743-2855 (Online) (doi:https://doi.org/10.1179/mpm.2001.110.1.25)

constituitive modeling, kinematic-hardening, solder joints, creep curves

Ridout, Stephen, Bailey, Christopher ORCID: 0000-0002-9438-3879, Dusek, Milos and Hunt, C (2007) Constitutive modeling of kinematic-hardening and damage in solder joints. Proceedings of the 1st Electronics Systemintegration Technology Conference, 2006. IEEE, pp. 927-933. ISBN 1-4244-0552-1 (doi:https://doi.org/10.1109/ESTC.2006.280122)

constitutive law, fatigue, finite element, life prediction, solder joint, thermal cycling

Ridout, Stephen and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2007) Review of methods to predict solder joint reliability under thermo-mechanical cycling. Fatigue & Fracture of Engineering Materials & Structures, 30 (5). pp. 400-412. ISSN 8756-758X (doi:https://doi.org/10.1111/j.1460-2695.2006.01065.x)

copper, insulated gate bipolar transistors, multichip modules, reliability, soldering, substrates

Newcombe, D.R., Chamund, Dinesh, Bailey, Christopher ORCID: 0000-0002-9438-3879 and Lu, Hua ORCID: 0000-0002-4392-6562 (2010) Reliability metrics for IGBT power modules. In: Proceedings - 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2010. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 670-674. ISBN 9781424481408 (doi:https://doi.org/10.1109/ICEPT.2010.5582869)

copper, modeling, flip-chip devices, lead-free solders

Lu, Hua ORCID: 0000-0002-4392-6562 and Bailey, Chris ORCID: 0000-0002-9438-3879 (2003) Modelling the performance of lead-Free solder interconnects for copper bumped flip-chip devices. In: ASME 2003 International Electronic Packaging Technical Conference and Exhibition. American Society of Mechanical Engineers, New York, USA, pp. 605-610. ISBN 0-7918-3690-8 (doi:https://doi.org/10.1115/IPACK2003-35356)

crack detection, finite element analysis, mechanical testing printed circuit testing, resistors, sensitivity analysis, strain measurement, thermal stress cracking

Ridout, Stephen, Dusek, Milos, Bailey, Chris ORCID: 0000-0002-9438-3879 and Hunt, Chris (2004) Finite element modelling of crack detection tests. In: Proceedings of the 5th International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems EuroSimE 2004. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 141-146. ISBN 0780384202 (doi:https://doi.org/10.1109/ESIME.2004.1304033)

cross-flow filtration, microfluidic device, microchannel device, microfluidics, modelling and simulation, fluid separator

Xue, Xiangdong, Patel, Mayur K., Kersaudy-Kerhoas, Maïwenn, Desmulliez, Marc P.Y., Bailey, Chris ORCID: 0000-0002-9438-3879 and Topham, David (2012) Analysis of fluid separation in microfluidic T-channels. Applied Mathematical Modelling, 36 (2). pp. 743-755. ISSN 0307-904X (doi:https://doi.org/10.1016/j.apm.2011.07.009)

cure kinetics models, encapsulant material,

Tilford, T. ORCID: 0000-0001-8307-6403, Ferenets, M., Adamietz, R., Pavuluri, S. K., Desmulliez, M. P. Y. and Bailey, C. ORCID: 0000-0002-9438-3879 (2012) Assessment of the accuracy of cure kinetics models and fitting approaches utilised in analysis of microelectronics encapsulation materials. In: Electronics Packaging Technology Conference (EPTC), 2011 13th. IEEE Conference Publications . Institute of Electrical and Electronics Engineers, Piscataway, NJ, USA, pp. 262-267. ISBN 978-1-4577-1983-7 (Print), 978-1-4577-1981-3 (Online) (doi:https://doi.org/10.1109/EPTC.2011.6184428)

cure kinetics, cure data, particle swarm optimization

Tilford, T., Morris, J.E., Ferenets, M., Rajaguru, P.R. ORCID: 0000-0002-6041-0517, Pavuluri, S.K., Desmulliez, M.P.Y. and Bailey, C. ORCID: 0000-0002-9438-3879 (2010) On model fitting methods for modeling polymer cure kinetics in microelectronics assembly applications. In: Electronics System Integration Technology Conference, ESTC 2010 - Proceedings. IEEE Computer Society, Piscataway, USA, pp. 1-6. ISBN 9781424485536 (Print), 9781424485543 (Online) (doi:https://doi.org/10.1109/ESTC.2010.5642820)

curing of an encapsulant material, dual-section microwave system, packaging, electronic packaging, microwave

Tilford, T., Ferenets, M., Adamietz, R., Pavuluri, S., Morris, J.E., Desmulliez, M.P.Y. and Bailey, C. ORCID: 0000-0002-9438-3879 (2010) Numerical analysis of microwave-assisted encapsulation processes for ball grid array packages. In: International Microwave Power Institute’s 44th Annual Symposium: 2010 Proceedings. International Microwave Power Institute (IMPI), Mechanicsville, VA, USA, pp. 30-35. ISSN 1070-0129

damage, fatigue, solder interconnect, power electronic module

Rajaguru, Pushpa ORCID: 0000-0002-6041-0517, Lu, Hua ORCID: 0000-0002-4392-6562 and Bailey, Chris ORCID: 0000-0002-9438-3879 (2019) Time integration damage model for Sn3.5Ag solder interconnect in power electronic module. IEEE Transactions on Device and Materials Reliability, 19 (1). ISSN 1530-4388 (Print), 1558-2574 (Online) (doi:https://doi.org/10.1109/TDMR.2019.2891949)

damage, solder joints, computer modelling, flexible circuit board, thermal cycling

Rizvi, M.J., Bailey, C. ORCID: 0000-0002-9438-3879 and Lu, H. ORCID: 0000-0002-4392-6562 (2010) Damage predictions in a chip resistor solder joint on flexible circuit board. Microelectronic Engineering, 87 (10). pp. 1889-1895. ISSN 0167-9317 (doi:https://doi.org/10.1016/j.mee.2009.11.023)

data analytics, smart test, prognostics, machine learning, electronics product qualification

Stoyanov, Stoyan ORCID: 0000-0001-6091-1226, Ahsan, Mominuil and Bailey, Chris ORCID: 0000-0002-9438-3879 (2018) Data analytics approach for optimal qualification testing of electronic components. In: Proceedings EuroSimE 2018. 2018 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) . IEEE Xplore, pp. 1-9. ISBN 978-1-5386-2358-9 (doi:https://doi.org/10.1109/EuroSimE.2018.8369926)

data driven prognostics, health monitoring, light emitting diodes, LEDs

Sutharssan, Thamo, Stoyanov, Stoyan ORCID: 0000-0001-6091-1226, Bailey, Christopher ORCID: 0000-0002-9438-3879 and Rosunally, Yasmine (2012) Prognostics and health monitoring of high power LED. Micromachines, 3 (1). pp. 78-100. ISSN 2072-666X (doi:https://doi.org/10.3390/mi3010078)

data driven prognostics, prognostics health management, PHM, light emitting diodes, LEDs

Sutharssan, T., Stoyanov, S. ORCID: 0000-0001-6091-1226, Bailey, C. ORCID: 0000-0002-9438-3879 and Rosunally, Y. (2012) Data analysis techniques for real-time prognostics and health management of semiconductor devices. In: Microelectronics and Packaging. Institute of Electrical and Electronic Engineers, Inc, Piscataway, NJ, USA, pp. 1-7. ISBN 978-1-4673-0694-2 (print)

data mining, frequency, life estimation, lLifetime estimation, multichip modules, power electronics, predictive models, temperature, thermal degradation, wire

Musallam, Mahera, Johnson, C. Mark, Yin, Chunyan ORCID: 0000-0003-0298-0420, Lu, Hua ORCID: 0000-0002-4392-6562 and Bailey, Chris ORCID: 0000-0002-9438-3879 (2008) Real-time life expectancy estimation in power modules. In: 2nd Electronics System Integration Technology Conference, Greenwich, UK. IEEE Conference Publications, 1 . Institute of Electrical and Electronics Engineers, Inc, Piscataway, NJ, USA, pp. 231-236. ISBN 978-1-4244-2813-7 (Print), 978-1-4244-2814-4 (Electronic) (doi:https://doi.org/10.1109/ESTC.2008.4684355)

data mining, machine learning, smart qualification testing, electronic components, intelligent manufacturing, prognostics modelling

Stoyanov, Stoyan ORCID: 0000-0001-6091-1226, Ahsan, Mominul, Bailey, Chris ORCID: 0000-0002-9438-3879, Wotherspoon, Tracy and Hunt, Craig (2019) Predictive analytics methodology for smart qualification testing of electronic components. Journal of Intelligent Manufacturing, 30 (3). pp. 1497-1514. ISSN 0956-5515 (Print), 1572-8145 (Online) (doi:https://doi.org/10.1007/s10845-018-01462-9)

data-driven prognostics, data analysis, machine learning, modelling, electronics manufacturing, quality, qualification testing

Ahsan, M., Stoyanov, S. ORCID: 0000-0001-6091-1226, Bailey, C. ORCID: 0000-0002-9438-3879 and Albarbar, A. (2020) Developing computational intelligence for smart qualification testing of electronic products. IEEE Access, 8. pp. 16922-16933. ISSN 2169-3536 (Online) (doi:https://doi.org/10.1109/ACCESS.2020.2967858)

decision support system, electronic product design, numerical modelling

Tang, Y.K., Stoyanov, Stoyan ORCID: 0000-0001-6091-1226, Bailey, Christopher ORCID: 0000-0002-9438-3879 and Lu, Hua ORCID: 0000-0002-4392-6562 (2006) Decision support systems for eco-friendly electronic products. Electronic Materials and Packaging, 2006. EMAP 2006. International Conference on. IEEE, Piscataway, N.J., pp. 77-84. ISBN 1424408342; 9781424408344 (doi:https://doi.org/10.1109/EMAP.2006.4430580)

decision tree, logistic regression, random forest, incomplete dataset, electronic device

Hinojosa Herrera, Ana Elsa ORCID: 0000-0002-0636-1881, Stoyanov, Stoyan ORCID: 0000-0001-6091-1226, Bailey, Christopher ORCID: 0000-0002-9438-3879, Walshaw, Christopher ORCID: 0000-0003-0253-7779 and Yin, Chunyan ORCID: 0000-0003-0298-0420 (2019) Data analytics to reduce stop-on-fail test in electronics manufacturing. Open Computer Sciences, 9 (1). pp. 200-211. ISSN 2299-1093 (Online) (doi:https://doi.org/10.1515/comp-2019-0014)

design methodology, micro-machining process, Focused Ion Beam (FIB) method, Design of Experiment (DoE) method, Reduced Order Models (ROM)

Tang, Ying Kit, Stoyanov, S. ORCID: 0000-0001-6091-1226, Bailey, C. ORCID: 0000-0002-9438-3879 and Chan, Y.C. (2008) Uncertainty analysis to minimise risk in designing micro-electronics manufacturing processes. In: 2nd Electronics System-Integration Technology Conference, 2008. ESTC 2008. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 941-946. ISBN 978-1-4244-2814-4 (Print), 978-1-4244-2813-7 (Electronic) (doi:https://doi.org/10.1109/ESTC.2008.4684478)

design of experiments methods, key design parameters, LCD displays, optimal design, optimisations, performance data, quadratic response, simulation technique, heatsink

Lu, Hua ORCID: 0000-0002-4392-6562 and Bailey, C. ORCID: 0000-0002-9438-3879 (2011) Optimisation of heatsink design for a ruggedised LCD display. In: 2011 International Conference on Electronic Packaging Technology & High Density Packaging. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 492-496. ISBN 9781457717703 (doi:https://doi.org/10.1109/ICEPT.2011.6066883)

design of experiments, finite element analysis, integrated optoelectronics, optical backplanes, optical couplers, surface emitting lasers, thermal expansion, thermal management (packaging)

Gwyer, D., Misselbrook, P., Philpott, D., Bailey, C. ORCID: 0000-0002-9438-3879, Conway, P. and Williams, K. (2003) VCSEL to waveguide coupling for optical backplanes. In: Proceedings of 5th Conference Electronics Packaging Technology (EPTC 2003). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 641-646. ISBN 0780382056 (doi:https://doi.org/10.1109/EPTC.2003.1271597)

digital simulation, electronic engineering computing, heat transfer, melting, printed circuit manufacture, soldering, multiphysics modeling, solidification, solder, surface tension, thermal stress

Bailey, Christopher ORCID: 0000-0002-9438-3879, Wheeler, Daniel and Cross, Mark (1999) An integrated modeling approach to solder joint formation. IEEE Transactions on Components and Packaging Technology, 22 (4). pp. 497-502. ISSN 1521-3331 (doi:https://doi.org/10.1109/6144.814964)

dynamic fluid-structure interaction, (DFSI), numerical modelling, finite volume unstructured mesh

Slone, A.K., Pericleous, K. ORCID: 0000-0002-7426-9999, Bailey, C. ORCID: 0000-0002-9438-3879 and Cross, M. (2001) Details of an integrated approach to three-dimensional dynamic fluid structure interaction. In: Fluid Structure Interaction. WIT Press, Southampton, UK, pp. 57-66. ISBN 1853128813 ISSN 1353-808x

dynamic solid mechanics, finite volume methods

Slone, A.K., Bailey, C. ORCID: 0000-0002-9438-3879 and Cross, M. (2002) Dynamic solid mechanics using finite volume methods. Applied Mathematical Modelling, 27 (2). pp. 69-87. ISSN 0307-904X (doi:https://doi.org/10.1016/S0307-904X(02)00060-4)

effect of reflow process, contact resistance, anisotropic conductive film (ACF)

Yin, C.Y. ORCID: 0000-0003-0298-0420, Alam, M.O., Chan, Y.C., Bailey, C. ORCID: 0000-0002-9438-3879 and Lu, Hua ORCID: 0000-0002-4392-6562 (2003) The effect of reflow process on the contact resistance and reliability of anisotropic conductive film interconnection for flip chip on flex applications. Microelectronics Reliability, 43 (4). pp. 625-633. ISSN 0026-2714 (doi:https://doi.org/10.1016/S0026-2714(02)00348-7)

effective thermal conductivity, axial and transverse coefficients of thermal expansion (CTE), SWCNT (single walled carbon nanotube)-Cu composites, Cu vias, CNT-Cu TSVs, Abaqus® v. 6.9

Sinha, A., Mihailovic, J.A., Morris, J.E., Hua, Lu and Bailey, C. ORCID: 0000-0002-9438-3879 (2010) Modeling thermal conductivity and CTE for CNT-Cu composites for 3-D TSV application. In: Nanotechnology Materials and Devices Conference (NMDC), 2010 IEEE. Nanotechnology Materials and Devices Conference (NMDC), 2010 IEEE . IEEE Xplore Digital Library, Monterey, CA, pp. 262-266. ISBN 978-1-4244-8896-4 (doi:https://doi.org/10.1109/NMDC.2010.5652157)

electric car, electric aircraft, renewable energy, power electronics,

Newcombe, D. R. and Bailey, C. ORCID: 0000-0002-9438-3879 (2007) Rapid solutions for application specific IGBT module design. International Exhibition and Conference for Power Electronics, Intelligent Motion and Power Quality (PCIM Europe 2007). Curran Associates, Inc., Red Hook , New York. ISBN 9781604231816

electrical connections, modelling, moisture

Yin, Chunyan ORCID: 0000-0003-0298-0420, Lu, Hua ORCID: 0000-0002-4392-6562, Bailey, Christopher ORCID: 0000-0002-9438-3879 and Chan, Y.C. (2006) Macro-micro modelling of moisture induced stresses in an ACF flip chip assembly. Soldering & Surface Mount Technology, 18 (2). pp. 27-32. ISSN 0954-0911 (doi:https://doi.org/10.1108/09540910610665107)

electro thermal model, inverter, IGBT, power module, circuit simulator, finite element analysis, power electronics

Shahjalal, Mohammad, Lu, Hua ORCID: 0000-0002-4392-6562 and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2017) Electro-thermal modelling of multi chip power modules for high power converter application. In: 2017 18th International Conference on Electronic Packaging Technology (ICEPT), Harbin. IEEE, pp. 940-945. ISBN 978-1-5386-2973-4 (doi:https://doi.org/10.1109/ICEPT.2017.8046599)

electro-migration, metal migration, thermo-mechanical loading

Bailey, C. ORCID: 0000-0002-9438-3879, Zhu, X., Lu, H. ORCID: 0000-0002-4392-6562 and Yin, C. ORCID: 0000-0003-0298-0420 (2012) Modelling metal migration for high reliability components when subjected to thermo-mechanical loading. In: Proceedings of the 2012 IEEE 14th Electronics Packaging Technology Conference. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 474-478. ISBN 9781467345538 (doi:https://doi.org/10.1109/EPTC.2012.6507130)

electro-thermal model, IGBT power module, circuit simulator, finite element analysis, DC-DC converter

Shahjalal, Mohammad, Rishad Ahmed, MD, Lu, Hua ORCID: 0000-0002-4392-6562, Bailey, Chris ORCID: 0000-0002-9438-3879 and Forsyth, Andrew (2020) An analysis of the thermal interaction between components in power converter applications. IEEE Transactions on Power Electronics, 35 (9). pp. 9082-9094. ISSN 0885-8993 (Print), 1941-0107 (Online) (doi:https://doi.org/10.1109/TPEL.2020.2969350)

electrodeposition, electroplating, megasonic agitation, acoustic streaming, aspect ratio

Costello, S., Flynn, D., Kay, R.W., Desmulliez, M.P.Y., Strusevich, N., Patel, M.K., Bailey, C. ORCID: 0000-0002-9438-3879, Jones, A.C., Bennett, M., Price, D., Habeshaw, R., Demore, C. and Cochran, S. (2011) Electrodeposition of copper into PCB vias under megasonic agitation. In: MME 2011. Proceedings of the 22nd Micromechanics and Microsystems Technology Europe Workshop. MME2011, Norway, pp. 266-269. ISBN 9788278602249

electrodeposition, micro-particle imaging velocimetry (micro-PIV), fluid flow, electrodeposition of copper, megasonic agitation

Costello, S., Strusevich, N., Flyyn, D., Kay, R.W., Patel, M.K., Bailey, C. ORCID: 0000-0002-9438-3879, Price, D., Bennet, M., Jones, A.C. and Desmulliez, M.P.Y. (2012) Electrodeposition of copper into high aspect ratio PCB micro-via using megasonic agitation. In: DTIP 2012 Conference 2012: Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS. EDA Publishing Association, Grenoble, France, pp. 98-102. ISBN 9782355000201

electrodeposition, microvias, current density, electrolytes, electroplating, printed circuits, vias

Strusevich, Nadezhda, Patel, Mayur and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2012) Parametric modeling study of basic electrodeposition in microvias. In: The 14th International Conference on Electronic Materials and Packaging, 13-16 December 2012, Citygate, Lantau Island, Hong Kong. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 145-149. ISBN 9781467349444 (doi:https://doi.org/10.1109/EMAP.2012.6507864)

electrodeposition, numerical modelling

Strusevitch, Nadia, Hughes, Michael, Bailey, Christopher ORCID: 0000-0002-9438-3879 and Djambazov, Georgi (2008) Numerical modelling of electrodeposition phenomena. 2nd Electronics System-Integration Technology Conference, Greenwich, UK, 1-4 September 2008. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 281-286. ISBN 978-1-4244-2813-7 (Print) 978-1-4244-2813-7 (Online) (doi:https://doi.org/10.1109/ESTC.2008.4684362)

electrolyte fluid flow, micro-particle imaging velocimetry (micro-PIV), fibre optic hydrophone, printed circuit board (PCB), high aspect ratio microvias

Costello, S., Strusevich, N., Patel, M.K., Bailey, C. ORCID: 0000-0002-9438-3879, Flynn, D., Kay, R.W., Price, D., Bennett, M., Jones, A.C., Habeshaw, R., Demore, C., Cochran, S. and Desmulliez, M.P.Y. (2011) Characterisation of ion transportation during electroplating of high aspect ratio microvias using megasonic agitation. In: EMPC-2011: 18th European Microelectronics and Packaging Conference. Proceedings. IEEE Conference Publications . Institute of Electrical and Electronic Engineers, Inc., Piscataway, NJ, USA, pp. 1-7. ISBN 9780956808606

electromagnetic heating, encapsulation, packaging

Pavuluri, S.K., Ferenets, M., Goussetis, G., Desmulliez, M.P.Y., Tilford, T. ORCID: 0000-0001-8307-6403, Adamietz, R., Muller, G., Eicher, F. and Bailey, C. ORCID: 0000-0002-9438-3879 (2012) Encapsulation of microelectronic components using open-ended microwave oven. IEEE Transactions on Components, Packaging and Manufacturing Technology, 2 (5). pp. 799-806. ISSN 2156-3950 (doi:https://doi.org/10.1109/TCPMT.2011.2177524)

electromigration, numerical modeling, finite element method, voids evolution

Zhu, X., Kotadia, H., Xu, S., Lu, H. ORCID: 0000-0002-4392-6562, Mannan, S.H., Bailey, C. ORCID: 0000-0002-9438-3879 and Chan, Y.C. (2013) Comments on electromigration analysis methods. In: Proceedings of 14th International Conference on Electronic Packaging Technology (ICEPT 2013). Institute of Electrical and Electronics, Inc., Piscataway, NJ, USA, pp. 529-534. ISBN 9781479904983 (doi:https://doi.org/10.1109/ICEPT.2013.6756527)

electromigration, simulation, shunt, solder joint

Zhu, Xiao, Kotadia, Hiren, Xu, Sha, Lu, Hua ORCID: 0000-0002-4392-6562, Mannan, Samjid, Bailey, Chris ORCID: 0000-0002-9438-3879 and Chan, Yancheong (2013) Modelling electromigration for microelectronics design. Journal of Computational Science and Technology, 7 (2). pp. 251-264. ISSN 1881-6894 (doi:https://doi.org/10.1299/jcst.7.251)

electronic engineering, microwaves, polymers, simulation

Tilford, Tim ORCID: 0000-0001-8307-6403, Sinclair, Keith I., Bailey, Christopher ORCID: 0000-0002-9438-3879, Desmulliez, Marc P.Y., Goussetis, George, Parrott, Kevin and Sangster, Alan J. (2007) Multiphysics simulation of microwave curing in micro-electronics packaging applications. Soldering & Surface Mount Technology, 19 (3). pp. 26-33. ISSN 0954-0911 (doi:https://doi.org/10.1108/09540910710843757)

electronic packaging thermal management, electronics packaging, energy management, environmental factors, environmental management, power system management, power system modeling, technology management, thermal management, thermal management of electronics

Bailey, C. ORCID: 0000-0002-9438-3879 (2008) Thermal management technologies for electronic packaging: current capabilities and future challenges for modelling tools. In: 2008 10th Electronics Packaging Technology Conference (EPTC 2008) [Conference Proceedings]. Institute of Electrical and Electronics Engineers, Inc., Piscataway, N.J., USA, pp. 527-532. ISBN 9781424421176 (doi:https://doi.org/10.1109/EPTC.2008.4763487)

electronics design, design optimistation, numerical modelling, computer modelling

Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2006) Optimisation modelling for design of advanced interconnects. 1st Electronics Systemintegration Technology Conference. Dresden, Saxony, Germany. 2006 proceedings. IEEE, Piscataway, NJ, USA, pp. 1108-1117. ISBN 1424405521 (doi:https://doi.org/10.1109/ESTC.2006.280148)

electronics manufacturing, numerical modelling, high aspect ratio microvia, electroplating, megasonic agitation, acoustic streaming

Strusevich, Nadezhda, Desmulliez, Marc P.Y., Abraham, Eitan, Flynn, David, Jones, Thomas, Patel, Mayur and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2013) Electroplating for high aspect ratio vias in PCB manufacturing: enhancement capabilities of acoustic streaming. Advances in Manufacturing, 1 (3). pp. 211-217. ISSN 2095-3127 (Print), 2195-3597 (Online) (doi:https://doi.org/10.1007/s40436-013-0039-9)

electroplating, electrodeposition, megasonic agitation, high density interconnection technology, microvias

Kaufmann, Jens, Desmulliez, Marc P.Y., Price, Dennis, Hughes, Mike, Strusevitch, Nadia and Bailey, Chris ORCID: 0000-0002-9438-3879 (2008) Influence of megasonic agitation on the electrodeposition of high aspect ratio blind vias. 2nd Electronics System-Integration Technology Conference, 2008. ESTC 2008. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 1235-1240. ISBN 978-1-4244-2813-7 (doi:https://doi.org/10.1109/ESTC.2008.4684530)

encapsulants, resonant microwave applicator, curing, electromagnetic heating, materials, microwave measurements, microwave ovens, microwave theory and techniques, temperature measurement

Pavuluri, S.K., Desmulliez, M.P.Y., Goussetis, G., Arrighi, V., Johnston, K., Adamietz, R., Tilford, T. and Bailey, C. ORCID: 0000-0002-9438-3879 (2012) Post cure behaviour of ancapsulants for QFN packages processed by an open-ended single mode resonant microwave applicator. In: Electronics Packaging Technology Conference (EPTC), 2011 13th. Institute of Electrical and Electronics Engineers, Piscataway, NJ, USA, pp. 573-578. ISBN 978-1-4577-1983-7 (Print), 978-1-4577-1981-3 (Online) (doi:https://doi.org/10.1109/EPTC.2011.6184486)

encapsulation, microwave curing, microelectronics packaging, reliability testing, open-ended oven, residual stress, accelerated stress test, convection oven

Desmulliez, Marc P.Y, Adamietz, Raphael, Pavuluri, Sumanth K., Tilford, Tim ORCID: 0000-0001-8307-6403, Bailey, Chris ORCID: 0000-0002-9438-3879, Schreier-Alt, Thomas and Warmuth, Jens (2018) Reliability testing and stress measurement of QFN packages encapsulated by an open-ended microwave curing system. IEEE Transactions on Components, Packaging and Manufacturing Technology, 9 (1). pp. 173-180. ISSN 2156-3950 (Print), 2156-3985 (Online) (doi:https://doi.org/10.1109/TCPMT.2018.2859031)

estimate of cure, cure kinetics, differential scanning calorimetry

Tilford, T., Ferenets, M., Morris, J., Rajaguru, P.R. ORCID: 0000-0002-6041-0517, Pavuluri, S., Desmulliez, M.P.Y. and Bailey, C. ORCID: 0000-0002-9438-3879 (2010) Evaluation of polymer cure models in microelectronics packaging applications. In: International Conference on Electronics Packaging (ICEP2010), 12-14 May 2010, Sapporo, Hokkaido, Japan. (Unpublished)

failure analysis, reliability, solders, thermal management (packaging), tin alloys, whiskers (crystal)

Stoyanov, Stoyan ORCID: 0000-0001-6091-1226, Bailey, Chris ORCID: 0000-0002-9438-3879, Roulston, John, Stewart, Paul and Tollafield, Peter (2014) Study of impact of thermal refinishing process on reliability of COTS components. In: 20th International Workshop on Thermal Investigations of ICs and Systems. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA. ISBN 9781479954155 (doi:https://doi.org/10.1109/THERMINIC.2014.6972531)

failure analysis, finite element modeling, fracture mechanics, intermetallic compound, reliability, solder joint

Alam, M.O., Lu, Hua ORCID: 0000-0002-4392-6562, Bailey, Chris ORCID: 0000-0002-9438-3879 and Chan, Y.C (2009) Finite-element simulation of stress intensity factors in solder joint intermetallic compounds. IEEE Transactions on Device and Materials Reliability, 9 (1). pp. 40-48. ISSN 1530-4388 (doi:https://doi.org/10.1109/TDMR.2008.2010595)

failure analysis, flip-chip devices, integrated circuit modelling, integrated circuit reliability, plastic deformation, thermal expansion, flip chip, reliability, Cu column, modelling

Lu, Hua ORCID: 0000-0002-4392-6562 and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2002) Computer modelling of the reliability of flip chips with metal column bumping. In: ITHERM 2002. The Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems [Proceedings]. Institute of Electrical and Electronics Engineers, Inc., pp. 967-973. ISBN 0780371526 (doi:https://doi.org/10.1109/ITHERM.2002.1012561)

fatigue, flip-chip, modeling, reliability, Coffin-Manson, underfill

Lu, Hua ORCID: 0000-0002-4392-6562 and Bailey, C. ORCID: 0000-0002-9438-3879 (2000) Material properties, geometry and their effect on the fatigue life of two flip-chip models. In: ITHERM Proceedings. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 65-71. ISBN 0780359127 ISSN 0189-9870 (doi:https://doi.org/10.1109/ITHERM.2000.866172)

finite element analysis methods, failure, solder joint

Lu, Hua ORCID: 0000-0002-4392-6562 and Bailey, C. ORCID: 0000-0002-9438-3879 (2009) Lifetime prediction of an IGBT power electronics module under cyclic temperature loading conditions. In: Electronic Packaging Technology & High Density Packaging, 2009. ICEPT-HDP '09. International Conference on. Institute of Electrical and Electronics Engineers, Piscataway, NJ USA, pp. 274-279. ISBN 9781424446582 (print), 9781424446599 (doi:https://doi.org/10.1109/ICEPT.2009.5270749)

finite element analysis, Cutty Sark, ship, modelling

Stoyanov, Stoyan ORCID: 0000-0001-6091-1226, Mason, P. and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2006) Finite element modelling of an historic ship structure - the Cutty Sark. In: Armstrong, Cecil G., (ed.) Proceedings of a joint conference of the Association for Computational Mechanics in Engineering (UK) and the Irish Society for Scientific and Engineeering Computation. 19th-20th April 2006, Queen's University Belfast. ACME/ISSEC, pp. 35-38.

finite element analysis, reliable electronic packaging

Stoyanov, S. ORCID: 0000-0001-6091-1226 and Bailey, C. ORCID: 0000-0002-9438-3879 (2003) Optimization and finite element analysis for reliable electronic packaging. In: Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-electronics and Micro-systems. Proceedings of EuroSimE 2003. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 391-399. ISBN 0780370546

finite element modelling, focal plane array, compression bonding, flip-chip assembly, reliability, cryogenic temperature, compound semiconductors

Stoyanov, Stoyan ORCID: 0000-0001-6091-1226, Bailey, Christopher ORCID: 0000-0002-9438-3879, Waite, Rhys, Hicks, Christopher and Golding, Terry (2020) Packaging challenges and reliability performance of compound semiconductor focal plane arrays. In: 2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC). IEEE, pp. 1-8. ISBN 978-0956808660 (doi:https://doi.org/10.23919/EMPC44848.2019.8951842)

finite element modelling, matrix, mechanical loading, reinforcement method, reinforcement technique, SAC alloy, second level, solder balls, time to failure, underfilling, vibration test

Berthou, M., Lu, H. ORCID: 0000-0002-4392-6562, Retailleau, P., Frémont, H., Guédon-Gracia, A., Davennel, C. and Bailey, C. ORCID: 0000-0002-9438-3879 (2011) Vibration test durability on large BGA assemblies: evaluation of reinforcement techniques. In: 2010 IEEE CPMT Symposium Japan, ICSJ10. IEEE Computer Society, Piscataway, USA, pp. 1-4. ISBN 9781424475933 (doi:https://doi.org/10.1109/CPMTSYMPJ.2010.5679536)

finite element modelling, reliability, component terminations, hot solder dip refinishing process, tin whiskers, commercial off-the-shelf components, scanning acoustic microscopy

Stoyanov, Stoyan ORCID: 0000-0001-6091-1226, Bailey, Christopher ORCID: 0000-0002-9438-3879, Stewart, Paul, Parker, Mike and Roulston, John F. (2020) Experimental and modelling study on delamination risks for refinished electronic packages under hot solder dip loads. IEEE Transactions on Components, Packaging and Manufacturing Technology, 10 (3). pp. 502-515. ISSN 2156-3950 (Print), 2156-3985 (Online) (doi:https://doi.org/10.1109/TCPMT.2020.2972635)

finite element, finite volume, geometrically nonlinear

Fallah, N.A., Bailey, C. ORCID: 0000-0002-9438-3879, Cross, M. and Taylor, G.A. (2000) Comparison of finite element and finite volume methods application in geometrically nonlinear stress analysis. Applied Mathematical Modelling, 24 (7). pp. 439-455. ISSN 0307-904X (doi:https://doi.org/10.1016/S0307-904X(99)00047-5)

finite volume, solid mechanics, CFD

Fallah, N.A., Bailey, C. ORCID: 0000-0002-9438-3879 and Cross, M. (2000) CFD approach for solid mechanics analysis. In: European Congress on Computational Methods in Applied Sciences and Engineering. ECCOMAS 2000. [Proceedings]. ECCOMAS.

finite volume, stress analysis, non-linear, Lagrangian, Eulerian, Newton Raphson

Slone, Avril, Fallah, Nosrat, Bailey, Christopher ORCID: 0000-0002-9438-3879 and Cross, Mark (2002) A finite volume approach to geometrically non-linear stress analysis. In: Finite volumes for complex applications III: problems and perspectives. Hermes Penton Science, London, UK, pp. 663-670. ISBN 9781903996348

finite volume, vertex-based, computational solid mechanics

Taylor, G.A., Bailey, C. ORCID: 0000-0002-9438-3879 and Cross, M. (2002) A vertex-based finite volume method applied to non-linear material problems in computational solid mechanics. International Journal for Numerical Methods in Engineering, 56 (4). pp. 507-529. ISSN 0029-5981 (Print), 1097-0207 (Online) (doi:https://doi.org/10.1002/nme.574)

five process parameters, post weld stresses, pigtail fibre optic, butterfly module, response surface methodology, Integrated Design of Experiments (DoE), Finite Element Analysis (FEA), Monte Carlo simulation, particle swarm optimisation algorithm

Mallik, A., Stoyanov, S. ORCID: 0000-0001-6091-1226, Bailey, C. ORCID: 0000-0002-9438-3879 and Firth, P. (2009) Design for reliability methodology for micro laser welding of pigtail fibres. In: Thermal, Mechanical and Multi-Physics simulation and Experiments in Microelectronics and Microsystems. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 1-7. ISBN 978-1-4244-4161-7 (electronic), 978-1-4244-4160-0 (print) (doi:https://doi.org/10.1109/ESIME.2009.4938409)

flexible substrates, lead free applications

Yin, Chunyan ORCID: 0000-0003-0298-0420, Lu, Hua ORCID: 0000-0002-4392-6562, Bailey, Christopher ORCID: 0000-0002-9438-3879 and Chan, Y. (2006) Analyzing the performance of flexible substrates for lead-free applications. Proceedings of EuroSime 2006 : 7th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems. IEEE, pp. 539-544. ISBN 1 4244 0276 X (doi:https://doi.org/10.1109/ESIME.2006.1644052)

flexible substrates, thermo-mechanical, lead free solder

Yin, Chunyan ORCID: 0000-0003-0298-0420, Rizvi, M.J., Lu, Hua ORCID: 0000-0002-4392-6562 and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2006) Thermal-mechanical analysis of flexible substrates during lead-free solder reflow. Proceedings of the 1st Electronics Systemintegration Technology Conference, 2006. IEEE, pp. 1007-1011. ISBN 1 4244 0552 1 (doi:https://doi.org/10.1109/ESTC.2006.280134)

flexible-substrates, Flex-No-Lead project, lead-free soldering

Rizvi, M.J., Yin, C.Y ORCID: 0000-0003-0298-0420, Bailey, C. ORCID: 0000-0002-9438-3879 and Lu, H. ORCID: 0000-0002-4392-6562 (2007) Performance and reliability of flexible substrates when subjected to lead-free processing. In: 16th European Microelectronics and Packaging Conference and Exhibition 2007(EMPC 2007). Curran Associates, Inc., Red Hook, NY, USA, pp. 589-594. ISBN 9781622764662

flip chip packaging, Cu columns, computer modelling

Lu, H. ORCID: 0000-0002-4392-6562 and Bailey, C. ORCID: 0000-0002-9438-3879 (2002) Predicting the relationship between reliability and geometric parameters of cu column bumped flip-chips. In: The Fifth International IEEE Symposium on High Density Packaging and Component Failure Analysis in Electronics Manufacturing [Proceedings]. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 85-89. ISBN 078039822X

flip chip, modelling, reflow, reliability, solder paste, underfill

Bailey, Christopher ORCID: 0000-0002-9438-3879, Lu, Hua ORCID: 0000-0002-4392-6562, Glinski, Greg, Wheeler, Daniel, Hamilton, Phil, Hendriksen, Mike and Smith, Brian (2002) Using computer models to identify optimal conditions for flip-chip assembly and reliability. Circuit World, 28 (1). pp. 14-20. ISSN 0305-6120 (doi:https://doi.org/10.1108/03056120210696658)

flip chip, optimization, reliability, underfill

Stoyanov, S. ORCID: 0000-0001-6091-1226, Bailey, C. ORCID: 0000-0002-9438-3879 and Cross, M. (2002) Optimisation modelling for flip-chip solder joint reliability. Soldering and Surface Mount Technology, 14 (1). pp. 49-58. ISSN 0954-0911 (doi:https://doi.org/10.1108/09540910210416477)

flip-chip assembly, isotropic conductive adhesives, (ICA), reliability modelling

Stoyanov, Stoyan ORCID: 0000-0001-6091-1226, Bailey, Christopher ORCID: 0000-0002-9438-3879, Kay, Robert, Durairaj, Rajkumar, Hendriksen, Mike, Desmuilliez, Marc and Ekere, Ndy (2004) Assembly and reliability of isotropic conductive adhesives for fine pitch flip-chip applications. In: TMS 2004 133rd TMS Annual Meeting & Exhibition 2004, 14-18 Mar 2004, Charlotte, North Carolina, USA. (Unpublished)

flip-chip assembly, no-flow underfill materials

Lu, H. ORCID: 0000-0002-4392-6562, Stoyanov, S. ORCID: 0000-0001-6091-1226, Bailey, C. ORCID: 0000-0002-9438-3879, Hung, K.C. and Chan, Y.C. (2001) A modelling and experimental analysis of the no-flow underfill process for flip-chip assembly. In: Proceedings of the 4th International Symposium on Electronic Packaging Technology. Institute of Electrical and Electronics Engineers, Inc., pp. 338-343. ISBN 0780398114

fluid structure interaction, finite volume, transient structural dynamics, geometric conservation law, Newmark algorithm

Slone, A.K., Pericleous, K. ORCID: 0000-0002-7426-9999, Bailey, C. ORCID: 0000-0002-9438-3879 and Cross, M. (2002) Dynamic fluid–structure interaction using finite volume unstructured mesh procedures. Computers and Structures, 80 (5-6). pp. 371-390. ISSN 0045-7949 (doi:https://doi.org/10.1016/S0045-7949(01)00177-8)

Slone, A.K., Pericleous, K. ORCID: 0000-0002-7426-9999, Bailey, C. ORCID: 0000-0002-9438-3879 and Cross, M. (2001) Dynamic fluid-structure interaction using finite volume unstructured mesh procedures. In: European Conference on Computational Fluid Dynamics ECCOMAS CFD 2006 Proceedings. ECCOMAS. ISBN 0905091124

fluid structure interaction, finite volume, transient structural dynamics, geometric conservation law, newmark algorithm

Slone, A.K., Cross, M., Pericleous, K.A. ORCID: 0000-0002-7426-9999 and Bailey, C. ORCID: 0000-0002-9438-3879 (2001) A finite volume unstructured mesh approach to dynamic fluid-structure interaction: an assessment of the challenge of flutter analysis. In: Trends in Computational Structural Mechanics. International Center for Numerical Methods in Engineering (CIMNE), Barcelona, Spain, pp. 741-750. ISBN 8489925771

fluids engineering descriptors, casting, fluid flow, integration, stress, temperature

Bailey, C. ORCID: 0000-0002-9438-3879, Bounds, S., Cross, M., Moran, G, Pericleous, K. ORCID: 0000-0002-7426-9999 and Taylor, G. (1999) Multiphysics modeling and its application to the casting process. CMSE: Computer Modelling & Simulation in Engineering, 4 (3). pp. 206-212. ISSN 1083-3455

fluid–structure interaction, finite volume, transient structural dynamics, geometric conservation law, Newmark algorithm

Slone, A.K., Pericleous, K. ORCID: 0000-0002-7426-9999, Bailey, C. ORCID: 0000-0002-9438-3879, Cross, M. and Bennett, C. (2004) A finite volume unstructured mesh approach to dynamic fluid–structure interaction: an assessment of the challenge of predicting the onset of flutter. Applied Mathematical Modelling, 28 (2). pp. 211-239. ISSN 0307-904X (doi:https://doi.org/10.1016/S0307-904X(03)00142-2)

Slone, A.K., Pericleous, K. ORCID: 0000-0002-7426-9999, Bailey, C. ORCID: 0000-0002-9438-3879, Cross, M. and Bennett, C. (2003) A finite volume unstructured mesh approach to dynamic fluid–structure interaction: an assessment of the challenge of predicting the onset of flutter. Applied Mathematical Modelling, 28 (2). pp. 211-239. ISSN 0307-904X (doi:https://doi.org/10.1016/S0307-904X(03)00142-2)

fusion approach, failure mechanisms, parameters, bonding, ceramics, condition monitoring, copper, degradation, failure analysis, fatigue, insulated gate bipolar transistors, multichip modules, wire

Patil, Nishad, Das, Diganta, Yin, Chunyan ORCID: 0000-0003-0298-0420, Lu, Hua ORCID: 0000-0002-4392-6562, Bailey, Chris ORCID: 0000-0002-9438-3879 and Pecht, Michael (2009) A fusion approach to IGBT power module prognostics. In: 10th International Conference on Thermal, Mechanical and Multi-Physics simulation and Experiments in Microelectronics and Microsystems, 2009. EuroSimE 2009. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 195-199. ISBN 9781424441600 (doi:https://doi.org/10.1109/ESIME.2009.4938491)

heating, microwave curing, resonant cavity, waveguide resonator

Sinclair, K.I., Goussetis, G., Desmulliez, M.P.Y., Sangster, A.J., Tilford, T. ORCID: 0000-0001-8307-6403, Bailey, C. ORCID: 0000-0002-9438-3879 and Parrott, A.K. (2008) Optimization of an open-ended microwave oven for microelectronics packaging. IEEE Transactions on Microwave Theory and Techniques, 56 (11). pp. 2635-2641. ISSN 0018-9480 (doi:https://doi.org/10.1109/TMTT.2008.2005925)

heterogeneous electronics based systems, higher-density interconnection, miniaturisation, silicon, carbon-nanotubes, interconnection technology

Bailey, C. ORCID: 0000-0002-9438-3879 and Lu, H. ORCID: 0000-0002-4392-6562 (2011) Interconnect technologies using carbon nanotubes: Current status and future challenges. In: 2011 34th International Spring Seminar on Electronics Technology (ISSE). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA. ISBN 978-1-4577-2111-3 ISSN 2161-2528 (doi:https://doi.org/10.1109/ISSE.2011.6053539)

high current density induced damage, electromigration,on-chip interconnection, off-chip interconnection, solder joints, electron bombardment, thermomigration, current crowding, failure mechanisms, mathematical modelling,

Alam, M. O., Bailey, Christopher ORCID: 0000-0002-9438-3879, Wu, B.Y., Yang, Dan and Chan, Y.C. (2007) High current density induced damage mechanisms in electronic solder joints: a state-of-the-art review. HDP'07: Proceedings of the 2007 International Symposium on High Density Packaging and Microsystem Integration. Institute of Electrical and Electronics Engineers, Inc., New York, pp. 93-99. ISBN 9781424412525 (doi:https://doi.org/10.1109/HDP.2007.4283569)

high density packaging, design

Bailey, Christopher ORCID: 0000-0002-9438-3879 (2006) Design and modeling challenges for high density packaging. 2006 Conference on High Density Microsystem Design and Packaging and Component Failure Analysis. IEEE, Piscataway, NJ, USA, pp. 324-328. ISBN 1424404886 (doi:https://doi.org/10.1109/HDP.2006.1707617)

hot solder dip, (HSD), leaded components, copper, electronic packaging thermal management, predictive models, stress, thermal stresses, thermomechanical processes, wires

Stoyanov, Stoyan ORCID: 0000-0001-6091-1226, Best, Chris, Alam, Mohammad, Bailey, Christopher ORCID: 0000-0002-9438-3879, Tollafield, Peter, Parker, Mike and Scott, Jim (2012) Modelling and testing the impact of hot solder dip process on leaded components. In: 2012 35th International Spring Seminar on Electronics Technology. IEEE Conference Publications . Institute of Electrical and Electronic Engineers, Inc., Piscataway, N.J., USA, pp. 303-308. ISBN 978-1-4673-2241-6 (Print), 978-1-4673-2239-3 (Online) ISSN 2161-2528 (doi:https://doi.org/10.1109/ISSE.2012.6273091)

integrated circuit, miniaturized consumer electronic products, electronic packaging, through-hole packages, surface mount packages

Alam, M.O. and Bailey, C. ORCID: 0000-0002-9438-3879 (2011) Introduction to adhesives joining technology for electronics. In: Alam, M.O. and Bailey, C. ORCID: 0000-0002-9438-3879, (eds.) Advanced adhesives in electronics: Materials, properties and applications. Woodhead Publishing Limited, Cambridge, UK. ISBN 9781845695767

integrated software module, stress, electronic products

Bailey, C. ORCID: 0000-0002-9438-3879, Warner, M., Agha, A., Pericleous, K. ORCID: 0000-0002-7426-9999, Parry, J., Marooney, C., Reeves, H. and Clark, I. (2002) Flo/Stress: an integrated software module to predict stress in electronic products. Computing and Control Engineering Journal, 13 (3). pp. 143-148. ISSN 0956-3385 (doi:https://doi.org/10.1049/ccej:20020306)

isotropic conductive adhesive materials, polymer crosslinking, cure kinetics models, Differential Scanning Calorimetry (DSC), particle swarm optimisation method

Tilford, T., Morris, J.E., Ferenets, M., Rajaguru, P.R. ORCID: 0000-0002-6041-0517, Pavuluri, S., Desmulliez, M.P.Y. and Bailey, C. ORCID: 0000-0002-9438-3879 (2010) Numerical analysis of polymer cure kinetics in isotropic conductive adhesives. In: 33rd International Spring Seminar on Electronics Technology (ISSE), 2010. Polymer Electronics and Nanotechnologies: Towards System Integration . IEEE Xplore, Sovereign House, London, N3 1QB, UK, pp. 412-416. ISBN 978-1-4244-7849-1 (print), 978-1-4244-7850-7 (e-ISBN) (doi:https://doi.org/10.1109/ISSE.2010.5547360)

isotropic conductive adhesives (ICAs), flip-chip packaging, low temperature (T<100 C)

Stoyanov, Stoyan ORCID: 0000-0001-6091-1226, Kay, Robert W., Bailey, Christopher ORCID: 0000-0002-9438-3879 and Desmulliez, Marc P.Y. (2007) Computational modelling for reliable flip-chip packaging at sub-100 micron pitch using isotropic conductive adhesives. Microelectronics Reliability, 47 (1). pp. 132-141. ISSN 0026-2714 (doi:https://doi.org/10.1016/j.microrel.2006.01.004)

jet impingement cooling system, power electronics modules (PEMs), cooling efficiency, numerical modelling

Rizvi, M.J., Skuriat, R., Tilford, Tim ORCID: 0000-0001-8307-6403, Bailey, Christopher ORCID: 0000-0002-9438-3879, Johnson, C. Mark and Lu, Hua ORCID: 0000-0002-4392-6562 (2009) Modelling of jet-impingement cooling for power electronics. In: 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, 2009. EuroSimE 2009. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA. ISBN 978-1-4244-4160-0 (doi:https://doi.org/10.1109/ESIME.2009.4938428)

laser beam welding, semiconductor device packaging, semiconductor lasers, semiconductor process modelling, soldering, modelling, thermal, laser

Gwyer, D., Bailey, C. ORCID: 0000-0002-9438-3879, Pericleous, K. ORCID: 0000-0002-7426-9999, Philpott, D. and Misselbrook, P. (2002) Mathematical modelling: a laser soldering process for an optoelectronics butterfly package. In: ITHERM 2002. The Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems [Proceedings]. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 121-127. ISBN 0780371526 ISSN 1089-9870 (doi:https://doi.org/10.1109/ITHERM.2002.1012447)

light emitting diodes (LEDs), ruggedized electronic display

Yek, Bing Lee, Strusevich, N., Bailey, C. ORCID: 0000-0002-9438-3879, Chun-Yan, Yin and Cartwright, C. (2009) Packaging of light emitting diodes for display backlights: Need for multi-disciplinary design tools. In: Electronic Packaging Technology & High Density Packaging, 2009. Institute of Electrical and Electronic Engineers, Inc, Piscataway, NJ, USA, pp. 205-208. ISBN 978-1-4244-4659-9 (online), 978-1-4244-4658-2 (print) (doi:https://doi.org/10.1109/ICEPT.2009.5270764)

light emitting diodes (LEDs), thermal management, optical and thermal modelling techniques, luminance, ruggedized electronic display, LED, LCD, backlights

Bailey, C. ORCID: 0000-0002-9438-3879, Lee, Y., Lu, H. ORCID: 0000-0002-4392-6562, Strusevich, N. and Yin, C. ORCID: 0000-0003-0298-0420 (2010) Packaging of LED backlights for ruggedised displays. In: International Symposium on Advanced Packaging Materials: Microtech, 2010. APM '10. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 98-101. ISBN 9781424467563 (doi:https://doi.org/10.1109/ISAPM.2010.5441377)

liquid crystal displays, light emitting diodes, display

Bailey, Chris ORCID: 0000-0002-9438-3879, Lu, Hua ORCID: 0000-0002-4392-6562, Yin, Chunyan ORCID: 0000-0003-0298-0420 and Lee, Yek (2010) Multi-physics modelling for packaging of liquid crystal displays in harsh environments. In: Electronics System Integration Technology Conference, ESTC 2010 - Proceedings. IEEE Computer Society, Piscataway, USA, pp. 1-6. ISBN 9781424485536 (Print), 9781424485543 (Online) (doi:https://doi.org/10.1109/ESTC.2010.5642898)

manufacturing systems, nanotechnology, modelling, finite element analysis, deformation, process efficiency

Stoyanov, Stoyan ORCID: 0000-0001-6091-1226, Tilford, Tim ORCID: 0000-0001-8307-6403, Amalou, Farid, Cargill, Scott, Bailey, Chris ORCID: 0000-0002-9438-3879 and Desmulliez, Marc (2011) Modelling and optimisation study on the fabrication of nano-structures using imprint forming process. Engineering Computations, 28 (1). pp. 93-111. ISSN 0264-4401 (doi:https://doi.org/10.1108/02644401111097046)

mechanics, mathematics

Bailey, C. ORCID: 0000-0002-9438-3879, Clapham, S., Cross, M., Dixon, T., Wolfe, S. and Norman, P. (1996) Modelling stress evolution during cable fabrication. ZAMM - Journal of Applied Mathematics and Mechanics / Zeitschrift für Angewandte Mathematik und Mechanik, 76 (S4). pp. 97-100. ISSN 0044-2267 (Print), 1521-4001 (Online) (doi:https://doi.org/10.1002/zamm.19960761408)

metals casting,

Bailey, C. ORCID: 0000-0002-9438-3879, Chow, P., Cross, M., Fryer, Y. and Pericleous, K. ORCID: 0000-0002-7426-9999 (1996) Multiphysics modelling of the metals casting process. Proceedings of the Royal Society A, 452 (1946). pp. 459-486. ISSN Online: 1471-2946 (doi:https://doi.org/10.1098/rspa.1996.0024)

micro-manufactured, one turn inductor, power supply circuits

Lu, Hua ORCID: 0000-0002-4392-6562, Flynn, David, Bailey, Christopher ORCID: 0000-0002-9438-3879 and Desmulliez, Marc P.Y. (2006) Computer modeling of a micro-manufactured one-turn inductor. Proceedings of the Sixth IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, 2006. IEEE. ISBN 1 4244 0489 4 (doi:https://doi.org/10.1109/HDP.2006.1707562)

microelectronics packaging, polymer cure models, differential scanning calorimetry (DSC), Fourier transform infra-red spectroscopy (FTIR)

Morris, J.E., Tilford, T. ORCID: 0000-0001-8307-6403, Bailey, C. ORCID: 0000-0002-9438-3879, Sinclair, K.I. and Desmulliez, M.P.Y. (2009) Polymer cure modeling for microelectronics applications. In: 32nd International Spring Seminar on Electronics Technology, 2009. ISSE 2009. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA. ISBN 978-1-4244-4260-7 (print) (doi:https://doi.org/10.1109/ISSE.2009.5206929)

microfabricated solenoid inductor, electrodeposition, DC-DC

Lu, Hua ORCID: 0000-0002-4392-6562, Flynn, David, Bailey, Christopher ORCID: 0000-0002-9438-3879 and Desmulliez, M.Y. (2006) An analysis of a microfabricated solenoid inductor. Proceedings of the 1st Electronics Systemintegration Technology Conference, 2006. IEEE, pp. 556-561. ISBN 1 4244 0552 1 (doi:https://doi.org/10.1109/ESTC.2006.280058)

microfluidics, electrohydrodynamic, instabilities, capillary, hollow microstucture, high-aspect ratio microfabrication

Chen, H., Yu, W., Cargill, S., Patel, M.K., Bailey, C. ORCID: 0000-0002-9438-3879, Tonry, C. and Desmulliez, M.P.Y. (2012) Self-encapsulated hollow microstructures formed by electric field-assisted capillarity. Microfluidics and Nanofluidics, 13 (1). pp. 75-82. ISSN 1613-4982 (Print), 1613-4990 (Online) (doi:https://doi.org/10.1007/s10404-012-0942-6)

microinductors, DC-DC, manufacturing processes

Flynn, David, Lu, Hua ORCID: 0000-0002-4392-6562, Bailey, Christopher ORCID: 0000-0002-9438-3879 and Desmulliez, Marc P.Y. (2006) Assessment of microInductors for DC-DC converters. Proceedings of 2006 International Conference on Electronic Materials and Packaging (EMAP 2006). IEEE. ISBN 978-1-4244-0834-4

microsystems, multiphysics, analytical techniques

Xue, Xiangdong, Bailey, Chris ORCID: 0000-0002-9438-3879, Lu, Hua ORCID: 0000-0002-4392-6562 and Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 (2011) Integration of analytical techniques in stochastic optimization of microsystem reliability. Microelectronics Reliability, 51 (5). pp. 936-945. ISSN 0026-2714 (doi:https://doi.org/10.1016/j.microrel.2011.01.008)

microvia fabrication, electroplating

Strusevich, Nadia, Bailey, Chris ORCID: 0000-0002-9438-3879, Costello, Suzanne, Patel, Mayur and Desmulliez, Marc (2013) Numerical modeling of the electroplating process for microvia fabrication. In: 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2013. Institute of Electrical and Electronics Engineers, Piscataway, NJ, USA. ISBN 9781467361385 (doi:https://doi.org/10.1109/EuroSimE.2013.6529989)

microwave energy, microwave curing system

Adamietz, R., Müller, G., Othman, N., Eicher, F., Tilford, T. ORCID: 0000-0001-8307-6403, Ferenets, M., Pavuluri, S.K., Desmulliez, M. P.Y. and Bailey, C. ORCID: 0000-0002-9438-3879 (2010) On the integration of microwave curing systems into microelectronics assembly processes. In: Electronics System Integration Technology Conference, ESTC 2010 - Proceedings. IEEE Computer Society, Piscataway, USA, pp. 1-6. ISBN 9781424485536 (Print), 9781424485543 (Online) (doi:https://doi.org/10.1109/ESTC.2010.5642827)

microwave oven, curing process, thermomechanical stress development

Tilford, T. ORCID: 0000-0001-8307-6403, Ferenets, M., Adamietz, R., Pavuluri, S.K., Morris, J.E., Desmulliez, M.P.Y. and Bailey, C. ORCID: 0000-0002-9438-3879 (2010) Numerical analysis of microwave underfill cure in ball-grid packages. In: Electronics System Integration Technology Conference, ESTC 2010 - Proceedings. IEEE Computer Society, Piscataway, USA, pp. 1-6. ISBN 9781424485536 (Print), 9781424485543 (Online) (doi:https://doi.org/10.1109/ESTC.2010.5642822)

microwave systems, micro-electronics manufacture, cure process, thermosetting polymer materials

Sinclair, Keith I., Tilford, Tim ORCID: 0000-0001-8307-6403, Goussetis, George, Bailey, Christopher ORCID: 0000-0002-9438-3879, Desmulliez, Marc P.Y., Parrott, Kevin and Sangster, Alan J. (2008) Advanced microwave oven for rapid curing of encapsulant. 2nd Electronics System-Integration Technology Conference, 2008. ESTC 2008. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 551-556. ISBN 978-1-4244-2814-4 (print) 978-1-4244-2813-7 (online) (doi:https://doi.org/10.1109/ESTC.2008.4684409)

microwave, polymer, optimisation, multiphysics, simulation

Tilford, Tim ORCID: 0000-0001-8307-6403, Sinclair, Keith I., Rajaguru, P.R., Morris, James E., Desmulliez, Marc P.Y. and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2009) Numerical optimisation of polymer curing using a dual-section microwave system. Annual microwave heating symposium (43rd). pp. 129-136. ISSN 1070-0129

minium wires, design engineers, electrical power, industrial partners, modelling tools, power electronics devices, remaining life, semiconductor technology, solder joints, thermal management, thermo-mechanical behaviors, transport systems, wide area

Bailey, Chris ORCID: 0000-0002-9438-3879, Lu, Hua ORCID: 0000-0002-4392-6562 and Yin, Chunyan ORCID: 0000-0003-0298-0420 (2010) Modelling reliability of power electronics packaging. In: Proceedings of the ASME InterPack Conference 2009, IPACK2009. American Society of Mechanical Engineers, New York, USA, pp. 215-220. ISBN 9780791843604 (doi:https://doi.org/10.1115/InterPACK2009-89430)

modeling, copper, diffusion, solder

Rizvi, M.J., Lu, Hua ORCID: 0000-0002-4392-6562 and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2009) Modeling the diffusion of solid copper into liquid solder alloys. Thin Solid Films, 517 (5). pp. 1686-1689. ISSN 0040-6090 (doi:https://doi.org/10.1016/j.tsf.2008.09.105)

modeling, isothermal fatigue test, solder joints

Ridout, Stephen, Dusek, Milos, Bailey, Chris ORCID: 0000-0002-9438-3879 and Hunt, Chris (2005) Modeling and experiments on an isothermal fatigue test for solder joints. In: Proceedings of the 6th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2005. EuroSimE 2005. IEEE, Piscataway, NJ, USA, pp. 478-482. ISBN 0-7803-9062-8 (doi:https://doi.org/10.1109/ESIME.2005.1502852)

modelling biofluids, T-microchannel device, computational fluid dynamics

Xue, Xiangdong, Patel, Mayur K., Bailey, Chris ORCID: 0000-0002-9438-3879, Kersaudy-Kerhoas, Maïwenn and Desmulliez, Marc P.Y. (2008) Challenges in modelling biofluids in microchannels. In: 2nd Electronics System-Integration Technology Conference, 2008. ESTC 2008. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 287-292. ISBN 978-1-4244-2814-4 (Print) 978-1-4244-2813-7 (Online) (doi:https://doi.org/10.1109/ESTC.2008.4684363)

modelling methodology, thermal analysis, hot solder dip process, tin whiskers

Stoyanov, Stoyan ORCID: 0000-0001-6091-1226, Bailey, Chris ORCID: 0000-0002-9438-3879, Alam, M.O., Yin, Chunyan ORCID: 0000-0003-0298-0420, Best, Chris, Tollafield, Peter, Crawford, Rob, Parker, Mike and Scott, Jim (2013) Modelling methodology for thermal analysis of hot solder dip process. Microelectronics Reliability, 53 (8). pp. 1055-1067. ISSN 0026-2714 (doi:https://doi.org/10.1016/j.microrel.2013.02.018)

modelling techniques,

Bailey, C. ORCID: 0000-0002-9438-3879 (2011) Modelling techniques used to assess conductive adhesive properties. In: Alam, M.O. and Bailey, C. ORCID: 0000-0002-9438-3879, (eds.) Advanced adhesives in electronics: Materials, properties and applications. Woodhead Publishing Limited, Cambridge, UK. ISBN 9781845695767

modelling technologies, analysis tools, nano-techology, microsystems, fabrication, packaging, testing

Bailey, Christopher ORCID: 0000-0002-9438-3879, Lu, Hua ORCID: 0000-0002-4392-6562, Stoyanov, Stoyan ORCID: 0000-0001-6091-1226, Tilford, Timothy, Xue, Xiangdong, Alam, M. O., Yin, Chunyan ORCID: 0000-0003-0298-0420 and Hughes, Michael (2008) Modelling technologies and applications. In: Morris, James E., (ed.) Nanopackaging: Nanotechnologies and Electronics Packaging. Springer Science+Business Media, LLC, New York, USA, pp. 15-38. ISBN 978-0-387-47325-3 (Print) 978-0-387-47326-0 (Online) (doi:https://doi.org/10.1007/978-0-387-47325-3_2)

modelling, flipchip, curing, reflow

Wheeler, D. and Bailey, C. ORCID: 0000-0002-9438-3879 (2000) Modelling technology to predict flip-chip assembly. In: ITHERM Proceedings. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 79-85. ISBN 0780359127 ISSN 0189-9870 (doi:https://doi.org/10.1109/ITHERM.2000.866174)

modelling, prototyping, micro-probe

Stoyanov, Stoyan ORCID: 0000-0001-6091-1226, Bailey, Christopher ORCID: 0000-0002-9438-3879, Leach, Richard, Hughes, Ben, Wilson, Alan, O'Neill, William, Dorey, Robert, Shaw, Christopher, Underhill, Daniel and Almond, Heather (2008) Modelling and prototyping the conceptual design of 3D CMM micro-probe. 2nd Electronics System-Integration Technology Conference, 2008. ESTC 2008. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 193-198. ISBN 978-1-4244-2814-4 (Print), 978-1-4244-2813-7 (Online) (doi:https://doi.org/10.1109/ESTC.2008.4684348)

multi-physics modelling, CFD software

Cross, M., Lyster, C, Bailey, C. ORCID: 0000-0002-9438-3879, Croft, N., Ewer, J. ORCID: 0000-0003-0609-272X, Leggett, P., McManus, K., Pericleous, K.A. ORCID: 0000-0002-7426-9999 and Patel, M.K. (1996) PHYSICA - A software environment for the modelling of multi-physics phenomena. ZAMM - Journal of Applied Mathematics and Mechanics / Zeitschrift für Angewandte Mathematik und Mechanik, 76 (S4). pp. 105-108. ISSN 0044-2267 (Print), 1521-4001 (Online) (doi:https://doi.org/10.1002/zamm.19960761408)

multi-physics, multi-disciplinary design,

Bailey, C. ORCID: 0000-0002-9438-3879, Lu, H. ORCID: 0000-0002-4392-6562, Tilford, T. ORCID: 0000-0001-8307-6403, Rizvi, J. and Yin, C. ORCID: 0000-0003-0298-0420 (2009) Co-design and multi-physics analysis for power electronic modules. In: 2009 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2009. IEEE Computer Society, Piscataway, NJ USA. ISBN 9781424441600 (doi:https://doi.org/10.1109/ESIME.2009.4938505)

multi-physics, multi-scale simulations, computational modelling

Cross, Mark, Stoyanov, Stoyan ORCID: 0000-0001-6091-1226, Mouchmov, Apostol, Lu, Hua ORCID: 0000-0002-4392-6562, Croft, Nick, Slone, Avril, Williams, Alison, Bailey, Chris ORCID: 0000-0002-9438-3879 and Pericleous, Koulis ORCID: 0000-0002-7426-9999 (2003) Multi-physics-multi-scale simulation and optimisation: the next generation. In: NAFEMS World Congress, 2003, Orlando, Florida, USA.

multi-physics, multi-scale, parallel, casting, granular flow

Cross, Mark, Croft, Nick, Slone, Avril, Williams, Alison, Christakis, Nicholas, Patel, Mayur, Bailey, Christopher ORCID: 0000-0002-9438-3879 and Pericleous, Koulis A. ORCID: 0000-0002-7426-9999 (2007) Computational modelling of multi-physics and multi-scale processes in parallel. International Journal for Computational Methods and Engineering Science and Mechanics, 8 (2). pp. 63-74. ISSN 1550-2287 (doi:https://doi.org/10.1080/15502280601149510)

multi-scale computational simulations, adhesive flows

Glinski, G.P., Bailey, C. ORCID: 0000-0002-9438-3879, Durairaj, R. and Ekere, N.N. (2002) Rheological characterization and multi-scale computational simulations of electrically conductive adhesive flows. In: IMAPS - Europe Cracow 2002, 16-18 June 2002, Cracow, Poland.

multiphysics analysis, coupled solution, microwave processing

Tilford, T., Parrott, A.K., Bailey, C. ORCID: 0000-0002-9438-3879 and Pericleous, K.A. ORCID: 0000-0002-7426-9999 (2008) Multiphysics simulation of microwave processing using a multidomain coupled solver approach. In: 8th World Congress on Computational Mechanics (WCCM8) and 5th European Congress on Computational Methods in Applied Sciences and Engineering (ECCOMAS 2008). International Center for Numerical Methods in Engineering (CIMNE), Barcelona, Spain. ISBN 978-84-96736-55-9

multiphysics modeling, level set method, solidification, electronic product assembly

Bailey, C. ORCID: 0000-0002-9438-3879, Lu, H. ORCID: 0000-0002-4392-6562 and Wheeler, D. (2001) Computational modeling techniques for reliability of electronic components on printed circuit boards. Applied Numerical Mathematics, 40 (1-2). pp. 101-117. ISSN 0168-9274 (doi:https://doi.org/10.1016/S0168-9274(01)00065-4)

multiphysics modelling, finite volumes, computational fluid dynamics, computational solid mechanics

Bailey, C. ORCID: 0000-0002-9438-3879, Taylor, G.A., Cross, M. and Chow, P. (1999) Discretisation procedures for multi-physics phenomena. Journal of Computational and Applied Mathematics, 103 (1). pp. 3-17. ISSN 0377-0427 (doi:https://doi.org/10.1016/S0377-0427(98)00236-2)

nano-imprint forming (NIF), modelling methodology, 3D-miniaturised systems

Stoyanov, Stoyan ORCID: 0000-0001-6091-1226, Amalou, Farid, Sinclair, Keith I., Bailey, Christopher ORCID: 0000-0002-9438-3879 and Desmulliez, Marc P.Y. (2008) Modelling of nano-imprint forming process for the production of miniaturised 3D structures. International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems, 2008. EuroSimE 2008. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 497-504. ISBN 978-1-4244-2127-5 (doi:https://doi.org/10.1109/ESIME.2008.4525088)

nanopatterning, polymeric channels, electrostatic,

Li, H., Yu, W., Zhang, L., Liu, Z., Brown, K.E., Abraham, E., Cargill, S., Tonry, C., Patel, M.K., Bailey, C. ORCID: 0000-0002-9438-3879 and Desmulliez, M.P.Y. (2013) Simulation and modelling of sub-30 nm polymeric channels fabricated by electrostatic induced lithography. RSC Advances, 3 (29). pp. 11839-11845. ISSN 2046-2069 (doi:https://doi.org/10.1039/c3ra40188j)

novel micro-integrated products, failure, design process

Rajaguru, Pushpa ORCID: 0000-0002-6041-0517, Stoyanov, Stoyan ORCID: 0000-0001-6091-1226, Tang, Ying Kit, Bailey, Chris ORCID: 0000-0002-9438-3879, Claverley, James, Leach, Richard and Topham, David (2010) Numerical modelling methodology for design of miniaturised integrated products - an application to 3D CMM micro-probe development. 2010 11th International Conference on Thermal, Mechanical and Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems, EuroSimE 2010. IEEE Computer Society, Piscataway NJ. ISBN 9781424470266 (doi:https://doi.org/10.1109/ESIME.2010.5464573)

numerical modeling, high aspect ratio microvia, electroplating, megasonic agitation, acoustic streaming

Strusevich, N., Bailey, C. ORCID: 0000-0002-9438-3879 and Patel, M.K. (2013) Computational modeling of electrodepostion in small features under megasonic agitation. In: 2013 European Microelectronics Packaging Conference (EMPC). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA.

numerical modelling, casting process

Chow, P., Bailey, C. ORCID: 0000-0002-9438-3879, Cross, M. and Pericleous, K.A. ORCID: 0000-0002-7426-9999 (1996) The numerical modelling of multi-physics phenomena: The shape casting process. ZAMM - Journal of Applied Mathematics and Mechanics / Zeitschrift für Angewandte Mathematik und Mechanik, 76 (S4). pp. 101-104. ISSN 0044-2267 (Print), 1521-4001 (Online) (doi:https://doi.org/10.1002/zamm.19960761408)

numerical modelling, thickening, sedimentation, gravity, thickener, density,

Bailey, Christopher John ORCID: 0000-0002-9438-3879 (1988) Multi phase numerical modelling of thickening and sedimentation. PhD thesis, Thames Polytechnic.

numerical modelling, zinc, lead

Djambazov, George Stefanov ORCID: 0000-0001-8812-1269, Bailey, Chris ORCID: 0000-0002-9438-3879, Patel, Mayur K. and Shrimpton, Jennifer (2004) Numerical simulation of vacuum dezincing of lead alloy. In: TMS 2004 133rd TMS Annual Meeting & Exhibition 2004, 14-18 Mar 2004, Charlotte, North Carolina, USA. (Unpublished)

numerical simulation, encapsulant curing, Variable Frequency Microwave (VFM) system

Tilford, T., Sinclair, K.I., Goussetis, G., Bailey, C. ORCID: 0000-0002-9438-3879, Desmulliez, M.P.Y., Parrott, A.K. and Sangster, A.J. (2008) Numerical simulation of encapsulant curing within a variable frequency microwave processing system. In: Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems, 2008. EuroSimE 2008. International Conference on. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 447-454. ISBN 978-1-4244-2127-5 (doi:https://doi.org/10.1109/ESIME.2008.4525086)

open-ended microwave oven, curing

Pavuluri, S.K., Ferenets, M., Goussetis, G., Desmulliez, M.P.Y., Tilford, T. ORCID: 0000-0001-8307-6403, Adamietz, R., Muller, G., Eicher, F. and Bailey, C. ORCID: 0000-0002-9438-3879 (2010) Experimental investigation of open-ended microwave oven assisted encapsulation process. In: Electronics System Integration Technology Conference, ESTC 2010 - Proceedings. IEEE Computer Society, Piscataway, NJ, USA, pp. 1-6. ISBN 978-1-4244-8553-6 (print), 978-1-4244-8554-3 (online) (doi:https://doi.org/10.1109/ESTC.2010.5643015)

open-ended waveguide cavity oven, curing, radio frequency (RF) curing, variable frequency microwave (VFM) heating, encapsulant, packaging

Sinclair, K.I., Tilford, T., Desmulliez, M.Y.P., Goussetis, G., Bailey, C. ORCID: 0000-0002-9438-3879, Parrott, K. and Sangster, A.J. (2008) Open ended microwave oven for packaging. In: Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, 2008 (MEMS/MOEMS 2008). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 16-20. ISBN 978-2-3550-0006-5 (doi:https://doi.org/10.1109/DTIP.2008.4752943)

optical fiber, solder

Powell, Adam, Warren, James and Bailey, Christopher ORCID: 0000-0002-9438-3879 (1998) Mechanism of motion of an optical fiber aligned by a solder droplet. In: MRS Spring Meeting - Symposium DD – Reliabilty of Photonics Materials & Structures.

optimisation, methodology, micro and nano system, focused ion beam

Tang, Y.K., Stoyanov, S. ORCID: 0000-0001-6091-1226, Bailey, C. ORCID: 0000-0002-9438-3879 and Chan, Y.C. (2008) Optimisation methodology for risk mitigation in advanced micro-system electronics manufacturing. In: EngOpt 2008 - International Conference on Engineering Optimization. Universidade Federal do Rio de Janeiro, Rio de Janeiro, Brazil. ISBN 978-85-7650-152-7

optimization, techniques, prototypes, product reliability

Stoyanov, Stoyan ORCID: 0000-0001-6091-1226, Bailey, Chris ORCID: 0000-0002-9438-3879 and Desmulliez, Marc (2009) Optimisation modelling for thermal fatigue reliability of lead-free interconnects in fine-pitch flip-chip packaging. Soldering & Surface Mount Technology, 21 (1). pp. 11-24. ISSN 0954-0911 (doi:https://doi.org/10.1108/09540910910928265)

packaging, reliability, prognostic methods, power electronics

Lu, Hua ORCID: 0000-0002-4392-6562, Bailey, Chris ORCID: 0000-0002-9438-3879 and Yin, Chunyan ORCID: 0000-0003-0298-0420 (2009) Design for reliability of power electronics modules. Microelectronics Reliability, 49 (9-11). pp. 1250-1255. ISSN 0026-2714 (doi:https://doi.org/10.1016/j.microrel.2009.07.055)

particle swarm optimisation algorithm, polymer cure kinetics models, curing process, microelectronics manufacturing, numerical models, evaluation

Tilford, T., Ferenets, M., Morris, J.E., Krumme, A., Pavuluri, S., Rajaguru, P.R. ORCID: 0000-0002-6041-0517, Desmulliez, M.P.Y. and Bailey, C. ORCID: 0000-0002-9438-3879 (2010) Application of particle swarm optimisation to evaluation of polymer cure kinetics models. Journal of Algorithms & Computational Technology, 4 (1). pp. 121-146. ISSN 1748-3018 (doi:https://doi.org/10.1260/1748-3018.4.1.121)

plasma blood separation, 3D microfluidic device, microchannel device, device design, modelling and simulation

Xue, Xiangdong, Marson, Silvia, Patel, Mayur K., Bailey, Chris ORCID: 0000-0002-9438-3879, O'Neill, William, Topham, David, Kay, Robert W. and Desmulliez, Marc P.Y. (2011) Progress towards the design and numerical analysis of a 3D microchannel biochip separator. International Journal for Numerical Methods in Biomedical Engineering, 27 (11). pp. 1771-1792. ISSN 2040-7939 (Print), 2040-7947 (Online) (doi:https://doi.org/10.1002/cnm.1439)

pneumatic microactuator, microfeeder, distributed manipulation, MEMS device, actuator design

Xue, Xiangdong, Bailey, Christopher ORCID: 0000-0002-9438-3879, Turitto, Michele and Ratchev, Svetan (2009) Modelling and optimization of a pneumatic microfeeder system. International Journal for Simulation and Multidisciplinary Design Optimization, 3 (1). pp. 307-315. ISSN 1779-627X (Print), 1779-6288 (Online) (doi:https://doi.org/10.1051/ijsmdo/2009003)

polymer encapsulant, curing, convection oven, microwave system

Tilford, Tim ORCID: 0000-0001-8307-6403, Sinclair, Keith I., Goussetis, George, Bailey, Christopher ORCID: 0000-0002-9438-3879, Desmulliez, Marc P.Y., Parrott, Kevin and Sangster, Alan J. (2008) Comparison of encapsulant curing with convention and microwave systems. 33rd IEEE/CPMT International Electronic Manufacturing Technology Symposium (IEMT), 2008. IEEE, Piscataway, NJ, USA. ISBN 9781424433926 (print) 9781424433933 (electronic) (doi:https://doi.org/10.1109/IEMT.2008.5507869)

power electronic modules (PEMs), globtop, reliability, computer modelling, aluminium, wirebond

Lu, Hua ORCID: 0000-0002-4392-6562, Loh, Wei-Sun, Bailey, Christopher ORCID: 0000-0002-9438-3879 and Johnson, C. Mark (2008) Computer simulation of aluminium wirebonds with globtop in power electronics modules. 3rd International Microsystems, Packaging, Assembly & Circuits Technology Conference, 2008. IMPACT 2008. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 348-351. ISBN 978-1-4244-3623-1 (doi:https://doi.org/10.1109/IMPACT.2008.4783883)

power electronic modules, packaging technology, reliability prediction

Tilford, Tim ORCID: 0000-0001-8307-6403, Lu, Hua ORCID: 0000-0002-4392-6562 and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2006) Thermo-mechanical modelling of power electronics module structures. 2006 8th Electronics Packaging Technology Conference (EPTC 2006) : 6-8 December 2006, Singapore. IEEE, Picsataway, N.J., pp. 214-219. ISBN 1424406641 (doi:https://doi.org/10.1109/EPTC.2006.342718)

power electronic modules, prognostics prediction methodology, design-for-reliability, IGBT module, design for manufacture, power module components, reliability prediction techniques, failure based reliability

Bailey, Chris ORCID: 0000-0002-9438-3879, Lu, Hua ORCID: 0000-0002-4392-6562, Yin, Chunyan and Tilford, Timothy (2008) Integrated reliability and prognostics prediction methodology for power electronic modules. In: IET Seminar on Aircraft Health Management for New Operational and Enterprise Solutions. IET Digest, 2008/1 . The Institution of Engineering and Technology, Stevenage, UK, pp. 1-39. ISBN 978-0-86341-936-2 ISSN 0537-9989 (doi:https://doi.org/10.1049/ic:20080638)

power electronics modules (PEMs), reliability prediction, prognostic and health management (PHM)systems, Physics-of-failure (PoF) model, Bayesian Networks (BN)

Yin, C.Y. ORCID: 0000-0003-0298-0420, Lu, H. ORCID: 0000-0002-4392-6562, Musallam, M., Bailey, C. ORCID: 0000-0002-9438-3879 and Johnson, C. M. (2008) A prognostic assessment method for power electronics modules. In: 2nd Electronics System-Integration Technology Conference, 2008. ESTC 2008. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 1353-1358. ISBN 978-1-4244-2814-4 (Print), 978-1-4244-2813-7 (Online) (doi:https://doi.org/10.1109/ESTC.2008.4684552)

power electronics modules, globtop design, computer modelling, aluminium wirebonds

Lu, Hua ORCID: 0000-0002-4392-6562, Loh, Wei-Sun, Bailey, Christopher ORCID: 0000-0002-9438-3879 and Johnson, C. Mark (2008) Computer modelling analysis of the globtop's effects on aluminium wirebond reliability. 2nd Electronics System-Integration Technology Conference, 2008. ESTC 2008. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 1369-1373. ISBN 978-1-4244-2814-4 (Print) 978-1-4244-2813-7 (Online) (doi:https://doi.org/10.1109/ESTC.2008.4684555)

power electronics modules, solder joint fatigue, reliability

Yin, Chunyan ORCID: 0000-0003-0298-0420, Lu, Hua ORCID: 0000-0002-4392-6562, Musallam, M., Bailey, Christopher ORCID: 0000-0002-9438-3879 and Johnson, C.M. (2010) In-service reliability assessment of solder interconnect in power electronics modules. In: 2010 Prognostics and System Health Management Conference, PHM '10. IEEE Conference Publications . Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA. ISBN 9781424447565 (Print), 9781424447589 (Online) (doi:https://doi.org/10.1109/PHM.2010.5413346)

power electronics, data-driven prognostics, insulated gate bipolar transistors, mathematical model, monitoring, physics, predictive models, prognostics and health management

Kabir, Ahsanul, Bailey, Christopher ORCID: 0000-0002-9438-3879, Lu, Hua ORCID: 0000-0002-4392-6562 and Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 (2012) A review of data-driven prognostics in power electronics. In: 2012 35th International Spring Seminar on Electronics Technology. IEEE Conference Publications . Institute of Electrical and Electronic Engineers, Inc., Piscataway, N.J., USA, pp. 189-192. ISBN 978-1-4673-2241-6 (Print), 978-1-4673-2239-3 (Online) ISSN 2161-2528 (doi:https://doi.org/10.1109/ISSE.2012.6273136)

power module, optimization, electric-thermal

Evans, Paul, Castellazzi, Alberto, Johnson, C. Mark, Lu, Hua ORCID: 0000-0002-4392-6562 and Bailey, Chris ORCID: 0000-0002-9438-3879 (2014) The optimization of thermal performance in power electronics modules. In: 2014 15th International Conference on Electronic Packaging Technology. Institute of Electrical and Electronics, Inc., Piscataway, NJ, USA, pp. 734-739. ISBN 978-1-4799-4707-2 (doi:https://doi.org/10.1109/ICEPT.2014.6922755)

probabilities, prognostics framework, computer modelling, Cutty Sark, conservation

Rosunally, Y.Z., Stoyanov, S. ORCID: 0000-0001-6091-1226, Bailey, C. ORCID: 0000-0002-9438-3879, Mason, P., Campbell, S., Monger, G. and Bell, I. (2011) Fusion approach for prognostics framework of heritage structure. IEEE Transactions on Reliability, 60 (1):570453. pp. 3-13. ISSN 0018-9529 (doi:https://doi.org/10.1109/TR.2011.2104451)

product functionality, electronic production design, software

Bailey, C. ORCID: 0000-0002-9438-3879 (2003) Exploiting virtual prototyping for reliability assessment. In: Proceedings of International IEEE Conference on the Business of Product Reliability and Liability. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 2-8. ISBN 078039853X

prognostic, reliability, power modules, physics-of-failure

Yin, Chunyan ORCID: 0000-0003-0298-0420, Lu, Hua ORCID: 0000-0002-4392-6562, Musallam, Mahera, Bailey, Chris ORCID: 0000-0002-9438-3879 and Johnson, C. Mark (2010) Prognostic reliability analysis of power electronics modules. International Journal of Performability Engineering, 6 (5):10. pp. 513-524. ISSN 0973-1318

prognostics framework, Bayesian networks, computer modelling, Cutty Sark, conservation, physics-of-failure,

Rosunally, Yasmine, Stoyanov, Stoyan ORCID: 0000-0001-6091-1226, Bailey, Christopher ORCID: 0000-0002-9438-3879, Mason, Peter, Campbell, Sheelagh, Monger, George and Bell, Ian (2010) Bayesian networks for predicting remaining life. International Journal of Performability Engineering, 6 (5). pp. 499-512. ISSN 0973-1318

prognostics framework, computer modelling, Cutty Sark, conservation, heritage structures,

Rosunally, Yasmine, Stoyanov, Stoyan ORCID: 0000-0001-6091-1226, Bailey, Christopher ORCID: 0000-0002-9438-3879, Mason, Peter, Campbell, Sheelagh, Monger, George and Bell, Ian (2010) Fusion approach for predictive maintenance of heritage structures. Prognostics & Health Management Conference, 2010, PHM '10. IEEE Conference Publications . IEEE, pp. 1-6. ISBN 978-1-4244-4756-5 (print), 978-1-4244-4758-9 (e-book) (doi:https://doi.org/10.1109/PHM.2010.5413403)

prognostics framework, computer modelling, materials damage, material degradation, prognostic fusion, Cutty Sark, heritage structure, conservation,

Rosunally, Yasmine, Stoyanov, Stoyan ORCID: 0000-0001-6091-1226, Bailey, Christopher ORCID: 0000-0002-9438-3879, Mason, Peter, Campbell, Sheelagh and Monger, George (2009) Prognostics framework for remaining life prediction of Cutty Sark iron structures. Annual Conference of the Prognostics and Health Management Society 2009. Prognostics and Health Management Society, 6 pages.

prognostics, reliability, light emitting diodes, LEDs, algorithms

Sutharssan, Thamo, Bailey, Chris ORCID: 0000-0002-9438-3879, Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 and Rosunally, Yasmine (2011) Prognostics and reliability assessment of light emitting diode packaging. In: Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), 2011 12th International Conference on. Institute of Electrical and Electronics Engineers, Piscataway, NJ, USA, pp. 1-7. ISBN 978-1-4577-1770-3 (print), 978-1-4577-1768-0 (eISBN) (doi:https://doi.org/10.1109/ICEPT.2011.6066984)

reduced order models, power electronic module, life prediction, Kriging, radial basis, microsystems

Rajaguru, Pushparajah ORCID: 0000-0002-6041-0517, Lu, Hua ORCID: 0000-0002-4392-6562 and Bailey, Chris ORCID: 0000-0002-9438-3879 (2012) Application of Kriging and radial basis function in power electronic module wire bond structure reliability under various amplitude loading. International Journal of Fatigue, 45. pp. 61-70. ISSN 0142-1123 (doi:https://doi.org/10.1016/j.ijfatigue.2012.06.013)

reduced order models, power electronic module, risk analysis, Particle Swarm Optimisation, Kriging, radial basis

Rajaguru, Pushparajah ORCID: 0000-0002-6041-0517, Lu, Hua ORCID: 0000-0002-4392-6562 and Bailey, Chris ORCID: 0000-0002-9438-3879 (2015) Sintered silver finite element modelling and reliability based design optimisation in power electronic module. Microelectronics Reliability, 55 (6). pp. 919-930. ISSN 0026-2714 (doi:https://doi.org/10.1016/j.microrel.2015.03.011)

reduced order models, power electronic module, risk analysis, probabilistic optimisation, Kriging, radial basis, microsystems

Rajaguru, Pushparajah ORCID: 0000-0002-6041-0517, Stoyanov, Stoyan ORCID: 0000-0001-6091-1226, Lu, Hua ORCID: 0000-0002-4392-6562 and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2013) Application of Kriging and radial basis function for reliability optimization in power modules. Journal of Electronic Packaging, 135 (2):021009. ISSN 1528-9044 (Print), 1043-7398 (Online) (doi:https://doi.org/10.1115/1.4024056)

reliability targets, power modules, wear-out mechanisms, wire-bond lifting, solder degradation, load-induced thermal cycling, real-time thermal models, real-time health management

Musallam, M., Johnson, C.M., Yin, Chunyan ORCID: 0000-0003-0298-0420, Lu, Hua ORCID: 0000-0002-4392-6562 and Bailey, C. ORCID: 0000-0002-9438-3879 (2009) Real-time comparison of power module failure modes under in-service conditions. In: 2009 13th European Conference on Power Electronics and Applications, EPE '09. Institute of Electrical and Electronic Engineers, Inc, Piscataway, NJ, USA, pp. 1-10. ISBN 978-90-75815-13-9 (electronic), 978-1-4244-4432-8 (print)

rheology, solder pastes, stencils

Durairaj, R., Jackson, G.J., Ekere, N.N., Glinski, G. and Bailey, C. ORCID: 0000-0002-9438-3879 (2002) Correlation of solder paste rheology with computational simulations of the stencil printing process. Soldering and Surface Mount Technology, 14 (1). pp. 11-17. ISSN 0954-0911 (doi:https://doi.org/10.1108/09540910210416422)

risk mitigation, manufacturing process, focused ion beam

Narania, Sailesh, Eshahawi, Tarek, Gindy, Nabil, Tang, Ying Kit, Stoyanov, Stoyan ORCID: 0000-0001-6091-1226, Ridout, Stephen and Bailey, Chris ORCID: 0000-0002-9438-3879 (2008) Risk mitigation framework for a robust design process. In: 2nd Electronics System-Integration Technology Conference, 2008. ESTC 2008. IEEE Conference Publications . Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 1075-1080. ISBN 978-1-4244-2814-4 (Print), 978-1-4244-2813-7 (Online) (doi:https://doi.org/10.1109/ESTC.2008.4684501)

simulation tools, virtual prototyping environment, classical continuum mechanics (e.g., the finite element method), atomistic mechanics [e.g., classical molecular dynamics (MD)], quantum mechanics (e.g., the density functional method)

Bailey, C. ORCID: 0000-0002-9438-3879 and Lu, Hua ORCID: 0000-0002-4392-6562 (2009) Nanopackaging simulation: properties and behavior of packaging materials. Nanotechnology Magazine, 3 (2). pp. 34-37. ISSN 1932-4510 (doi:https://doi.org/10.1109/MNANO.2009.932413)

solder joint failure, electronic packaging, strain on solder joints

Shishido, Nobuyuki, Kanno, Toshifumi, Kawahara, Shinya, Ikeda, Toru, Miyazaki, Noriyuki, Lu, Hua ORCID: 0000-0002-4392-6562, Bailey, Chris ORCID: 0000-0002-9438-3879, Thomas, Owen, Di Maio, Davide and Hunt, Chris (2010) An analysis of local deformation of SnAgCu solder joint using digital image correlation. In: Proceedings - 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2010. Association for Computing Machinery, New York, pp. 376-381. ISBN 9781424481408 (doi:https://doi.org/10.1109/ICEPT.2010.5582845)

solder joint, intermetallic compound, fracture mechanics

Alam, M.O., Lu, Hua ORCID: 0000-0002-4392-6562, Bailey, Christopher ORCID: 0000-0002-9438-3879 and Chan, Y.C. (2008) Fracture mechanics analysis of cracks in solder joint intermetallic compounds. In: 2nd Electronics System-Integration Technology Conference, 2008. ESTC 2008. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 757-762. ISBN 978-1-4244-2813-7 (doi:https://doi.org/10.1109/ESTC.2008.4684445)

solder joint, printed circuit boards, model implementation

Wheeler, D., Bailey, C. ORCID: 0000-0002-9438-3879 and Cross, M. (1998) A computational modelling framework to predict macroscopic phenomena in solder joint formation. Proceedings of the Institution of Mechanical Engineers, Part B: Journal of Engineering Manufacture, 212 (2). pp. 141-157. ISSN 0954-4054 (Print), 2041-2975 (Online) (doi:https://doi.org/10.1243/0954405981515563)

solder paste, stencil printing, CFD, computational fluid dynamics, finite volume method, non-Newtonian, dense suspension

Glinski, G.P., Bailey, C. ORCID: 0000-0002-9438-3879 and Pericleous, K.A. ORCID: 0000-0002-7426-9999 (2001) A non-Newtonian computational fluid dynamics study of the stencil printing process. Proceedings of the Institution of Mechanical Engineers, Part C: Journal of Mechanical Engineering Science, 215 (4). pp. 437-446. ISSN 0954-4062 (Print), 2041-2983 (Online) (doi:https://doi.org/10.1243/0954406011520869)

solder, intermetallic, pb-free, BGA, electronic package, stress intensity factor, plastic deformation, butt joints

Alam, M.O., Lu, H. ORCID: 0000-0002-4392-6562, Bailey, Chris ORCID: 0000-0002-9438-3879 and Chan, Y.C. (2009) Fracture mechanics analysis of solder joint intermetallic compounds in shear test. Computational Materials Science, 45 (2). pp. 576-583. ISSN 0927-0256 (doi:https://doi.org/10.1016/j.commatsci.2008.12.001)

solder, joints, computer modelling, flexible substrates, reliability

Rizvi, M.J., Yin, Chunyan ORCID: 0000-0003-0298-0420 and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2006) Modeling the effect of lead-free soldering on flexible substrates. Electronic Materials and Packaging, 2006, EMAP 2006, International Conference on 11-14 Dec. 2006. IEEE, Piscataway, NJ, USA, pp. 1038-1042. ISBN 1424408334; 1424408342 (doi:https://doi.org/10.1109/EMAP.2006.4430695)

solder, joints, electronic packaging, wetting, computer modelling

Rizvi, M.J., Bailey, Christopher ORCID: 0000-0002-9438-3879, Chan, Y.C. and Lu, Hua ORCID: 0000-0002-4392-6562 (2006) Comparative wetting behavior of Sn-0.7Cu and Sn-0.7Cu-0.3Ni solders on Cu and Ni substrates. 1st Electronics Systemintegration Technology Conference. Dresden, Saxony, Germany. 2006 proceedings. IEEE, Piscataway, NJ, USA, pp. 145-151. ISBN 142440553X (doi:https://doi.org/10.1109/ITHERM.2006.1645436)

solder, wetting, aging, intermetallic compound layer

Rizvi, M.J., Bailey, Christopher ORCID: 0000-0002-9438-3879, Chan, Y.C., Islam, M. and Lu, Hua ORCID: 0000-0002-4392-6562 (2007) Effect of adding 0.3wt% Ni into the Sn-0.7wt% Cu solder - Part II: Growth of intermetallic layer with Cu during wetting and aging. Journal of Alloys and Compounds, 438 (1-2). pp. 122-128. ISSN 0925-8388 (doi:https://doi.org/10.1016/j.jallcom.2006.08.071)

soldering, interfacial reactions, intermetallic compounds, growth rate, aging

Rizvi, M.J., Chan, Y.C., Bailey, Christopher ORCID: 0000-0002-9438-3879, Lu, Hua ORCID: 0000-0002-4392-6562 and Islam, M.N. (2006) Effect of adding 1 wt% Bi into the Sn–2.8Ag–0.5Cu solder alloy on the intermetallic formations with Cu-substrate during soldering and isothermal aging. Journal of Alloys and Compounds, 407 (1-2). pp. 208-214. ISSN 0925-8388 (doi:https://doi.org/10.1016/j.jallcom.2005.06.050)

solders, computer simulation, reliability, materials properties, geometry, flip-chip, design, event history analysis, solder joints, fatigue

Lu, Hua ORCID: 0000-0002-4392-6562, Bailey, C. ORCID: 0000-0002-9438-3879 and Cross, M. (2000) Reliability analysis of flip chip designs via computer simulation. Journal of Electronic Packaging, 122 (3). pp. 214-219. ISSN 1528-9044 (Print), 1043-7398 (Online) (doi:https://doi.org/10.1115/1.1286122)

solidification, melting processes, multiphysics, computational modeling, complex geometries

Cross, Mark, Bailey, Christopher ORCID: 0000-0002-9438-3879, Pericleous, Koulis ORCID: 0000-0002-7426-9999, Williams, Alison, Bojarevics, Valdis ORCID: 0000-0002-7326-7748, Croft, Nick and Taylor, Gary (2002) The multiphysics modeling of solidification and melting processes. JOM (The Member Journal of The Minerals, Metals & Materials Society), 2002 (Supp.). ISSN 1047-4838

statistical hypothesis testing, refinishing, hot solder dip, leaded component, lead-free

Yin, Chunyan ORCID: 0000-0003-0298-0420, Best, Chris, Bailey, Chris ORCID: 0000-0002-9438-3879 and Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 (2015) Statistical analysis of the impact of refinishing process on leaded components. Microelectronics Reliability, 55 (2). pp. 424-431. ISSN 0026-2714 (doi:https://doi.org/10.1016/j.microrel.2014.11.001)

subsea cable scoring, corrosion

Flynn, David, Bailey, Christopher ORCID: 0000-0002-9438-3879, Rajaguru, Pushpa ORCID: 0000-0002-6041-0517, Wenshuo, Tang and Yin, Chunyan ORCID: 0000-0003-0298-0420 (2019) Prognostics and health management of subsea cables. In: Goodman, Douglas, Hofmeister, James P. and Szidarovszky, Ferenc, (eds.) Prognostics and Health Management: A Practical Approach to Improving System Reliability Using Condition-Based Data. Quality and Reliability Engineering Series . Wiley-Blackwell. ISBN 978-1119356653

thermal cycles, strain, Finite Element, (FE), solder joints

Ridout, Stephen, Dusek, Milos, Bailey, Chris ORCID: 0000-0002-9438-3879 and Hunt, Chris (2004) The effect of thermal cycle profiles on solder joint damage. In: Proceedings of the 6th International Conference on Electronics Materials and Packaging (EMAP 2004). Institute of Electrical and Electronics Engineers, pp. 436-441. ISBN 983251486X

thermal modeling, microinductor, DC-DC power converter,

Flynn, David, Lu, Hua ORCID: 0000-0002-4392-6562, Bailey, Chris ORCID: 0000-0002-9438-3879 and Desmulliez, Marc P.Y. (2008) Design, modeling and characterization of a microinductor for future DC-DC power converters. In: 2nd Electronics System-Integration Technology Conference, 2008. ESTC 2008. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 577-582. ISBN 978-1-4244-2814-4 (print), 978-1-4244-2813-7 (online) (doi:https://doi.org/10.1109/ESTC.2008.4684414)

thermal modelling, hot solder, microelectronics, analytical models, computed tomography, conductivity, heating, lead, materials, thermal analysis

Stoyanov, Stoyan ORCID: 0000-0001-6091-1226, Bailey, Christopher ORCID: 0000-0002-9438-3879, Tollafield, Peter, Crawford, Rob, Parker, Mike, Scott, Jim and Roulston, John (2012) Thermal modelling and optimisation of hot solder dip process. In: 2012 13th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE 2012). Institute of Electrical and Electronic Engineers, Inc., Piscataway, N.J., USA. ISBN 978-1-4673-1512-8 (doi:https://doi.org/10.1109/ESimE.2012.6191763)

thermal processing, open-ended applicator, microwave oven

Pavuluri, S.K., Goussetis, George, Desmulliez, Marc P.Y., Adamietz, R., Tilford, Tim ORCID: 0000-0001-8307-6403, Ferenets, M., Muller, G., Eicher, F. and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2011) Open-ended single mode resonant applicator for microelectronics packaging applications. Proceedings of the Microwave Heating and Processing of Materials Seminar 2011. IET, pp. 89-91. ISBN 978 1 84919 310 8

thick film chip resistors, SnPb and SnAgCu (solder alloys), Garofalo equation,Miner's law of linear damage accumulation

Rizvi, M.J., Lu, H. ORCID: 0000-0002-4392-6562, Bailey, C. ORCID: 0000-0002-9438-3879, Bevan, E., Poutney, N. and Coates, J. (2010) Finite element modelling of failures in thick film chip resistor solder joints. In: Microsystems Packaging Assembly and Circuits Technology Conference (IMPACT), 2010. in: Microsystems Packaging Assembly and Circuits Technology Conference (IMPACT), 2010 5th International Issue Date: 20-22 Oct. 2010 . IEEE Xplore Digital Library, Taipei, pp. 1-4. ISBN 978-1-4244-9785-0 (electronic), 978-1-4244-9783-6 (print) ISSN 2150-5934 (doi:https://doi.org/10.1109/IMPACT.2010.5699488)

three-dimensional miniaturised products, reduced order models, micro-probe

Stoyanov, Stoyan ORCID: 0000-0001-6091-1226, Rajaguru, Pushpa ORCID: 0000-0002-6041-0517, Tang, Ying Kit, Bailey, Chris ORCID: 0000-0002-9438-3879, Claverley, James and Leach, Richard (2010) Reduced order modelling for risk mitigation in design of miniaturised/integrated products. In: ISSE 2010 - 33rd International Spring Seminar on Electronics Technology: Polymer Electronics and Nanotechnologies: Towards System Integration - Conference Proceedings. IEEE Computer Society, Piscataway, USA, pp. 402-407. ISBN 9781424478491 (print), 9781424478507 (online) (doi:https://doi.org/10.1109/ISSE.2010.5547362)

topological optimization, microelectronics, thermal management, engineering design, level-set method

Santhanakrishnan, Mani sekaran, Tilford, Tim ORCID: 0000-0001-8307-6403 and Bailey, Chris ORCID: 0000-0002-9438-3879 (2019) Multi-material heatsink design using level-set topology optimization. IEEE Transactions on Components, Packaging and Manufacturing Technology, 9 (8). pp. 1504-1513. ISSN 2156-3950 (Print), 2156-3985 (Online) (doi:https://doi.org/10.1109/TCPMT.2019.2929017)

topology optimization, level-set method, heat sink, thermal diffusivity

Rajaguru, Pushparajah ORCID: 0000-0002-6041-0517, Santhanakrishnan, Manisekaran, Tilford, Tim ORCID: 0000-0001-8307-6403 and Bailey, Chris ORCID: 0000-0002-9438-3879 (2019) Design of additively manufactured heatsinks for power electronics thermal management using adjoint level-set topology optimization. In: 2019 25th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC). IEEE. ISBN 978-1728120782 ISSN 2474-1515 (Print), 2474-1523 (Online) (doi:https://doi.org/10.1109/THERMINIC.2019.8923530)

turbulence models, electronic cooling, new two-layer hybrid kE/ki model, zonal model

Dhinsa, K., Bailey, C. ORCID: 0000-0002-9438-3879 and Pericleous, K. ORCID: 0000-0002-7426-9999 (2005) Turbulence modelling for electronic cooling: A review. In: International Symposium on Electronics Materials and Packaging, EMPAS 2005. Institute of Electrical and Electronics Engineers Inc, Piscataway, USA, pp. 275-281. ISBN 1-4244-0107-0

turbulence models, fluid flow, heat transfer, electronic applications, computational fluid dynamics (CFD)

Dhinsa, Kulvir, Bailey, Chris ORCID: 0000-0002-9438-3879 and Pericleous, Koulis ORCID: 0000-0002-7426-9999 (2005) Investigation into the performance of turbulence models for fluid flow and heat transfer phenomena in electronic applications. IEEE Transactions on Components and Packaging Technologies, 28 (4). pp. 686-699. ISSN 1521-3331 (doi:https://doi.org/10.1109/TCAPT.2005.859758)

variable frequency microwave (VFM), chip-on-board (COB) assembly, multiphysics modelling, frequency agile microwave oven bonding system (FAMOBS)

Tilford, Tim ORCID: 0000-0001-8307-6403, Pavuluri, S., Bailey, Christopher ORCID: 0000-0002-9438-3879 and Desmulliez, Marc P.Y. (2009) On variable frequency microwave processing of heterogeneous chip-on-board assemblies. International Conference on Electronic Packaging Technology & High Density Packaging, 2009. ICEPT-HDP '09. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 927-931. ISBN 978-1-4244-4659-9 (doi:https://doi.org/10.1109/ICEPT.2009.5270558)

vibration, failure, lead-free solders

Kamara, Elisha, Lu, Hua ORCID: 0000-0002-4392-6562, Bailey, Chris ORCID: 0000-0002-9438-3879, Hunt, Chris, Di Maio, Davide and Thomas, Owen (2010) Computer simulation and design of a solder joint vibration test machine. In: 2010 11th International Conference on Thermal, Mechanical and Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems, EuroSimE 2010. IEEE Conference Publications . Institute of Electrical and Electronic Engineers, Inc., Piscataway, NJ, USA. ISBN 978-1-4244-7026-6 (doi:https://doi.org/10.1109/ESIME.2010.5464587)

vibration, model order reduction

Rajaguru, Pushpa ORCID: 0000-0002-6041-0517, Lu, Hua ORCID: 0000-0002-4392-6562, Bailey, Chris ORCID: 0000-0002-9438-3879 and Bella, Martina (2020) Modelling and analysis of vibration on power electronic module structure and application of model order reduction. Microelectronics Reliability, 110:113697. ISSN 0026-2714 (doi:https://doi.org/10.1016/j.microrel.2020.113697)

vibration, reliability,lead-free solders

Kamara, E., Lu, H. ORCID: 0000-0002-4392-6562, Bailey, C. ORCID: 0000-0002-9438-3879, Hunt, C., Di Maio, D. and Thomas, O. (2010) A multi-disciplinary study of vibration based reliability of lead-free electronic interconnects. Microelectronics Reliability, 50 (9-11). pp. 1706-1710. ISSN 0026-2714 (doi:https://doi.org/10.1016/j.microrel.2010.07.152)

wetting, solder, flux, wetting force, contact angle, modeling

Rizvi, M.J., Bailey, Christopher ORCID: 0000-0002-9438-3879, Chan, Y.C. and Lu, Hua ORCID: 0000-0002-4392-6562 (2007) Effect of adding 0.3 wt% Ni into the Sn–0.7 wt%Cu solder: part I: wetting behavior on Cu and Ni substrates. Journal of Alloys and Compounds, 438 (1-2). pp. 116-121. ISSN 0925-8388 (doi:https://doi.org/10.1016/j.jallcom.2006.08.048)

x-rays, diffraction experiments

Hoo, Nick, Jackson, Gavin, Hendriksen, Mike, Lu, Hua ORCID: 0000-0002-4392-6562, Durairaj, Rajkumar, Bailey, Chris ORCID: 0000-0002-9438-3879, Ekere, Ndy and Wright, Jonathon (2004) In-situ synchrotron x-ray diffraction during melting and solidification of a lead-free solder paste. In: TMS 2004 133rd TMS Annual Meeting & Exhibition 2004, 14-18 Mar 2004, Charlotte, North Carolina, USA. (Unpublished)

This list was generated on Tue Oct 19 21:50:56 2021 UTC.