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Polymer cure modeling for microelectronics applications

Polymer cure modeling for microelectronics applications

Morris, J.E., Tilford, T. ORCID: 0000-0001-8307-6403, Bailey, C. ORCID: 0000-0002-9438-3879, Sinclair, K.I. and Desmulliez, M.P.Y. (2009) Polymer cure modeling for microelectronics applications. In: 32nd International Spring Seminar on Electronics Technology, 2009. ISSE 2009. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA. ISBN 978-1-4244-4260-7 (print) (doi:https://doi.org/10.1109/ISSE.2009.5206929)

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Abstract

A review of polymer cure models used in microelectronics packaging applications reveals no clear consensus of the chemical rate constants for the cure reactions, or even of an effective model. The problem lies in the contrast between the actual cure process, which involves a sequence of distinct chemical reactions, and the models, which typically assume only one, (or two with some restrictions on the independence of their characteristic constants.) The standard techniques to determine the model parameters are based on differential scanning calorimetry (DSC), which cannot distinguish between the reactions, and hence yields results useful only under the same conditions, which completely misses the point of modeling. The obvious solution is for manufacturers to provide the modeling parameters, but failing that, an alternative experimental technique is required to determine individual reaction parameters, e.g. Fourier transform infra-red spectroscopy (FTIR).

Item Type: Conference Proceedings
Title of Proceedings: 32nd International Spring Seminar on Electronics Technology, 2009. ISSE 2009
Additional Information: [1] This paper forms part of the proceedings of the 32nd International Spring Seminar on Electronics Technology, ISSE 2009 - 'Hetero System Integration, the path to New Solutions in the Modern Electronics', held 13-17 May 2009, Brno, Czech Republic.
Uncontrolled Keywords: microelectronics packaging, polymer cure models, differential scanning calorimetry (DSC), Fourier transform infra-red spectroscopy (FTIR)
Subjects: T Technology > TK Electrical engineering. Electronics Nuclear engineering
Pre-2014 Departments: School of Computing & Mathematical Sciences
School of Computing & Mathematical Sciences > Centre for Numerical Modelling & Process Analysis
School of Computing & Mathematical Sciences > Centre for Numerical Modelling & Process Analysis > Computational Mechanics & Reliability Group
School of Computing & Mathematical Sciences > Centre for Numerical Modelling & Process Analysis > Computational Science & Engineering Group
School of Computing & Mathematical Sciences > Computer & Computational Science Research Group
School of Computing & Mathematical Sciences > Department of Computer Science
School of Computing & Mathematical Sciences > Department of Computer Systems Technology
School of Computing & Mathematical Sciences > Department of Mathematical Sciences
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Last Modified: 12 Jul 2019 14:44
Selected for GREAT 2016: None
Selected for GREAT 2017: None
Selected for GREAT 2018: None
Selected for GREAT 2019: None
URI: http://gala.gre.ac.uk/id/eprint/1648

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