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Mechanical modelling of high power lateral IGBT for LED driver applications

Mechanical modelling of high power lateral IGBT for LED driver applications

Bailey, C. ORCID: 0000-0002-9438-3879, Rajaguru, P. ORCID: 0000-0002-6041-0517, Lu, H. ORCID: 0000-0002-4392-6562, Castellazzi, A., Antonini, M., Pathirana, V., Udugampola, N., Udrea, F., Mitchelson, P. D. and Aldhaher, S. (2018) Mechanical modelling of high power lateral IGBT for LED driver applications. In: IEEE Electronic Components and Technology Conference (ECTC). IEEE Electronics Packaging Society (formerly CPMT), pp. 1375-1381. ISBN 978-1-5386-5000-4 ISSN 2377-5726 (Online) (doi:https://doi.org/10.1109/ECTC.2018.00210)

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Abstract

An assembly exercise was proposed to replace the vertical MOSFET by lateral IGBTs (LIGBT) for LED driver systems which can provide significant advantages in terms of size reduction (LIGBTs are ten times smaller than vertical MOSFETs) and lower component count. A 6 circle, 5V gate, 800 V LIGBT device with dimension of 818μm x 672μm with deposited solder balls that has a radius of around 75μm was selected in this assembly exercise. The driver system uses chip on board (COB) technique to create a compact driver system which can fit into a GU10 bulb housing. The challenging aspect of the LIGBT package in high voltage application is underfill dielectric breakdown and solder fatigue failure. In order to predict the extreme electric field values of the underfill, an electrostatic finite element analysis was undertaken on the LIGBT package structure for various underfill permittivity values. From the electro static finite element analysis, the maximum electric field in the underfill was estimated as 38 V/μm. Five commercial underfills were selected for investigating the trade-off in materials properties that mitigate underfill electrical breakdown and solder joint fatigue failure. These selected underfills have dielectric breakdown higher than the predicted value from electrostatic analysis. The thermo-mechanical finite element analysis were undertaken for solder bump reliability for all the underfill materials. The underfill which can enhance the solder reliability was chosen as prime candidate.

Item Type: Conference Proceedings
Title of Proceedings: IEEE Electronic Components and Technology Conference (ECTC)
Additional Information: Conference held from 29 May - 1 June 2018, San Diego, CA, USA.
Uncontrolled Keywords: LIGBT; LED; fatigue; underfill
Subjects: Q Science > QA Mathematics
Faculty / Department / Research Group: Faculty of Architecture, Computing & Humanities
Faculty of Architecture, Computing & Humanities > Department of Mathematical Sciences
Last Modified: 20 May 2019 16:11
Selected for GREAT 2016: None
Selected for GREAT 2017: None
Selected for GREAT 2018: None
Selected for GREAT 2019: GREAT 4
URI: http://gala.gre.ac.uk/id/eprint/19590

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