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Design for reliability of power electronics modules

Design for reliability of power electronics modules

Lu, Hua ORCID: 0000-0002-4392-6562, Bailey, Chris ORCID: 0000-0002-9438-3879 and Yin, Chunyan ORCID: 0000-0003-0298-0420 (2009) Design for reliability of power electronics modules. Microelectronics Reliability, 49 (9-11). pp. 1250-1255. ISSN 0026-2714 (doi:https://doi.org/10.1016/j.microrel.2009.07.055)

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Abstract

Power electronics uses semiconductor technology to convert and control electrical power. Demands for efficient energy management, conversion and conservation, and the increasing take-up of electronics in transport systems has resulted in tremendous growth in the use of power electronics devices such as Insulated Gate Bipolar Transistors (IGBT’s). The packaging of power electronics devices involves a number of challenges for the design engineer in terms of reliability. For example, IGBT modules will contain a number of semiconductor dies within a small footprint bonded to ubstrates with aluminum wires and wide area solder joints. To a great extent, the reliability of the package will depend on the thermo-mechanical behavior of these materials. This paper details a physics of failure approach to reliability predictions of IGBT modules. It also illustrates the need for a probabilistic approach to reliability predictions that include the effects of design variations. Also discussed are technologies for predicting the remaining life of the package when subjected to qualification stresses or in service stresses using prognostics methods.

Item Type: Article
Additional Information: [1] First published: September 2009. [2] Published as: Microelectronics Reliability, (2009), Vol. 49, (9–11), pp. 1250–1255. [3] This was an invited paper given at the 20th European Symposium on the Reliability of Electron Devices, Failure Physics and Analysis (ESREF 2009), held from 5-9 October 2009, in Arcachon, France. [4] Papers presented 20th European Symposium on the Reliability of Electron Devices, Failure Physics and Analysis, (ESREF 2009), were published in a special issue of the journal Microelectronics Reliability (Volume 49, Issues 9-11, September–November 2009).
Uncontrolled Keywords: packaging, reliability, prognostic methods, power electronics
Subjects: Q Science > QA Mathematics > QA75 Electronic computers. Computer science
T Technology > TK Electrical engineering. Electronics Nuclear engineering
Pre-2014 Departments: School of Computing & Mathematical Sciences
School of Computing & Mathematical Sciences > Department of Computer Systems Technology
School of Computing & Mathematical Sciences > Department of Mathematical Sciences
Related URLs:
Last Modified: 20 Mar 2019 11:54
Selected for GREAT 2016: None
Selected for GREAT 2017: None
Selected for GREAT 2018: None
Selected for GREAT 2019: None
Selected for REF2021: None
URI: http://gala.gre.ac.uk/id/eprint/4470

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