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Encapsulation of microelectronic components using open-ended microwave oven

Encapsulation of microelectronic components using open-ended microwave oven

Pavuluri, S.K., Ferenets, M., Goussetis, G., Desmulliez, M.P.Y., Tilford, T., Adamietz, R., Muller, G., Eicher, F. and Bailey, C. ORCID: 0000-0002-9438-3879 (2012) Encapsulation of microelectronic components using open-ended microwave oven. IEEE Transactions on Components, Packaging and Manufacturing Technology, 2 (5). pp. 799-806. ISSN 2156-3950 (doi:https://doi.org/10.1109/TCPMT.2011.2177524)

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Abstract

An open-ended microwave oven system is presented and characterized for the rapid encapsulation of microelectronic components. In situ real-time measurement of the temperature of the curing materials is carried out by an infrared pyrometer integrated in the microwave head of the oven. An automatic computer-controlled closed feedback loop has been used to measure the temperature in the curing material and modulate the system operating power to obtain predefined curing temperature cycles for efficient curing. Uniform curing of the encapsulant material is achieved with typical cure time of ~300s with a ramp rate of 1.66°C/s and a hold period of ~100s . Differential scanning calorimeter based measurement for the curing of the polymer dielectric indicates a near 100% degree of cure.

Item Type: Article
Uncontrolled Keywords: electromagnetic heating, encapsulation, packaging
Subjects: T Technology > TK Electrical engineering. Electronics Nuclear engineering
Pre-2014 Departments: School of Computing & Mathematical Sciences
Related URLs:
Last Modified: 13 Mar 2019 11:34
Selected for GREAT 2016: None
Selected for GREAT 2017: None
Selected for GREAT 2018: None
Selected for GREAT 2019: None
URI: http://gala.gre.ac.uk/id/eprint/10295

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