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Effects of thermal cycling profiles on the performance of chip-on-flex assembly using anisotropic conductive films

Effects of thermal cycling profiles on the performance of chip-on-flex assembly using anisotropic conductive films

Rizvi, M.J., Bailey, Christopher ORCID: 0000-0002-9438-3879, Chan, Y.C. and Lu, Hua ORCID: 0000-0002-4392-6562 (2006) Effects of thermal cycling profiles on the performance of chip-on-flex assembly using anisotropic conductive films. Thermal and Thermomechanical Phenomena in Electronics Systems, 2006. ITHERM '06. The Tenth Intersociety Conference on. IEEE, pp. 855-860. ISBN 0780395247 (doi:https://doi.org/10.1109/ITHERM.2006.1645436)

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Abstract

Anisotropic conductive films (ACFs) are widely used in the electronic packaging industries because of their fine pitch potential and the assembly process is simpler compared to the soldering process. However, there are still unsolved issues in the volume productions using ACFs. The main reason is that the effects of many factors on the interconnects are not well understood. This work focuses on the performance of ACF-bonded chip-on-flex assemblies subjected to a range of thermal cycling test conditions. Both experimental and three-dimensional finite element computer modelling methods are used. It has been revealed that greater temperature ranges and longer dwell-times give rise to higher stresses in the ACF interconnects. Higher stresses are concentrated along the edges of the chip-ACF interfaces. In the experiments, the results show that higher temperature ranges and prolonged dwell times increase contact resistance values. Close examination of the microstructures along the bond-line through the scanning electron microscope (SEM) indicates that cyclic thermal loads disjoint the conductive particles from the bump of the chip and/or pad of the substrate and this is thought to be related to the increase of the contact resistance value and the failure of the ACF joints.

Item Type: Book Section
Additional Information: Presented at 10th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronics Systems (ITHERM '06). San Diego, CA, May 30-Jun 02, 2006.
Uncontrolled Keywords: chip-on-flex (COF), anisotropic conductive film (ACF), finite element modelling, stress, conductive particle, contact resistance, life-time
Subjects: T Technology > TK Electrical engineering. Electronics Nuclear engineering
Q Science > QA Mathematics
Pre-2014 Departments: School of Computing & Mathematical Sciences
School of Computing & Mathematical Sciences > Centre for Numerical Modelling & Process Analysis
School of Computing & Mathematical Sciences > Centre for Numerical Modelling & Process Analysis > Computational Mechanics & Reliability Group
School of Computing & Mathematical Sciences > Department of Computer Science
School of Computing & Mathematical Sciences > Department of Computer Systems Technology
School of Computing & Mathematical Sciences > Department of Mathematical Sciences
Related URLs:
Last Modified: 30 Sep 2019 14:08
Selected for GREAT 2016: None
Selected for GREAT 2017: None
Selected for GREAT 2018: None
Selected for GREAT 2019: None
URI: http://gala.gre.ac.uk/id/eprint/1040

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