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Impact of underfill and other physical dimensions on Silicon Lateral IGBT package reliability using computer model with discrete and continuous design variables

Impact of underfill and other physical dimensions on Silicon Lateral IGBT package reliability using computer model with discrete and continuous design variables

Rajaguru, P. ORCID: 0000-0002-6041-0517, Lu, H. ORCID: 0000-0002-4392-6562, Bailey, C. ORCID: 0000-0002-9438-3879, Castellazzi, A., Pathirana, V., Udugampola, N. and Udrea, F. (2018) Impact of underfill and other physical dimensions on Silicon Lateral IGBT package reliability using computer model with discrete and continuous design variables. Microelectronics Reliability, 83. pp. 146-156. ISSN 0026-2714 (doi:https://doi.org/10.1016/j.microrel.2018.02.024)

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Abstract

An effort to design and build a prototype LED driver system which is energy efficient, highly compact and with few component count was initiated by a consortium UK universities. The prototype system will be based on Silicon Lateral IGBT (LIGBT) device combined with chip on board technology. Part of this effort, finite element modelling and analysis were undertaken in order to mitigate the underfill dielectric breakdown failure and solder interconnect fatigue failure of the LIGBT package structure. Electro-static analysis was undertaken to predict the extreme electric field distribution in the underfill. Based on electro-static analysis, five commercial underfill were selected for thermo-mechanical finite element analysis on solder joint fatigue failure prediction under cyclic loading. A design optimisation analysis was endeavoured to maximise the solder interconnect reliability by utilising a computer model with continuous variable (physical dimensions) and discrete variables underfill type) and a stochastic optimiser such as multi-objective mixed discrete particle swarm optimisation. From the optimisation analysis best trade off solution are obtained.

Item Type: Article
Uncontrolled Keywords: LED Lateral IGBT Underfill
Subjects: Q Science > QA Mathematics
Faculty / Department / Research Group: Faculty of Architecture, Computing & Humanities
Faculty of Architecture, Computing & Humanities > Centre for Numerical Modelling & Process Analysis (CNMPA)
Faculty of Architecture, Computing & Humanities > Centre for Numerical Modelling & Process Analysis (CNMPA) > Computational Mechanics & Reliability Group (CMRG)
Faculty of Architecture, Computing & Humanities > Department of Mathematical Sciences
Last Modified: 20 May 2019 15:31
Selected for GREAT 2016: None
Selected for GREAT 2017: None
Selected for GREAT 2018: GREAT a
Selected for GREAT 2019: GREAT 5
URI: http://gala.gre.ac.uk/id/eprint/4123

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