Rajaguru, Pushparajah ORCID: 0000-0002-6041-0517, Bailey, Christopher ORCID: 0000-0002-9438-3879 and Bella, Martina (2021) Applying model order reduction to the reliability prediction of power electronic module wire bond structure. In: 2021 27th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC). IEEE, Piscataway, US. ISBN 978-1665418973 ISSN 2474-1515 (Print), 2474-1523 (Online) (doi:https://doi.org/10.1109/THERMINIC52472.2021.9626396)

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Abstract

Predicting the reliability of power electronics module wirebond structures requires accurate computer models to investigate the design space constraints in a computationally efficient manner. This paper details a model-order reduction (MOR) method to solve the governing equations for electro-thermal behaviour of wire-bond structures and a linear-damage rule and fatigue model to predict their wear-out behaviour. Various MOR methods are compared in terms of their accuracy and computational efficiency. Finite element calculations are used to validate the MOR predictions in terms of accuracy and solution times. The paper presents for the first time the significant benefits that MOR techniques can provide to reliability engineers for predicting the electro-thermal and fatigue behaviour of wirebonds in power modules. For the six MOR methods assessed, the Rational Krylov Algorithm (RKA) outperforms all other MOR methods in terms of accuracy and solution times, where it provides a solution 84 times faster than a full finite element solver

Item Type:	Conference Proceedings
Title of Proceedings:	2021 27th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)
Uncontrolled Keywords:	Model order reduction, wirebond, power electronic module
Subjects:	Q Science > QA Mathematics > QA75 Electronic computers. Computer science T Technology > TK Electrical engineering. Electronics Nuclear engineering
Faculty / School / Research Centre / Research Group:	Faculty of Engineering & Science Faculty of Engineering & Science > Centre for Numerical Modelling & Process Analysis (CNMPA) Faculty of Engineering & Science > Centre for Numerical Modelling & Process Analysis (CNMPA) > Computational Science & Engineering Group (CSEG) Faculty of Engineering & Science > School of Computing & Mathematical Sciences (CMS)
Related URLs:	Organisation
Last Modified:	23 May 2022 09:57
URI:	http://gala.gre.ac.uk/id/eprint/33737

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