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Applying model order reduction to the reliability prediction of power electronic module wire bond structure

Applying model order reduction to the reliability prediction of power electronic module wire bond structure

Rajaguru, Pushparajah ORCID: 0000-0002-6041-0517, Bailey, Christopher ORCID: 0000-0002-9438-3879 and Bella, Martina (2021) Applying model order reduction to the reliability prediction of power electronic module wire bond structure. In: 27th International workshop on Thermal Investigations of ICs and Systems. Sep 22-24 2021, Berlin. Thermal Investigations of ICs and Systems . THERMINIC & Institute of Electrical and Electronics Engineers (IEEE), Berlin, Germany & Piscataway, NJ, US.. (In Press)

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Abstract

Predicting the reliability of power electronics module wirebond structures requires accurate computer models to investigate the design space constraints in a computationally efficient manner. This paper details a model-order reduction (MOR) method to solve the governing equations for electro-thermal behaviour of wire-bond structures and a linear-damage rule and fatigue model to predict their wear-out behaviour. Various MOR methods are compared in terms of their accuracy and computational efficiency. Finite element calculations are used to validate the MOR predictions in terms of accuracy and solution times. The paper presents for the first time the significant benefits that MOR techniques can provide to reliability engineers for predicting the electro-thermal and fatigue behaviour of wirebonds in power modules. For the six MOR methods assessed, the Rational Krylov Algorithm (RKA) outperforms all other MOR methods in terms of accuracy and solution times, where it provides a solution 84 times faster than a full finite element solver

Item Type: Conference Proceedings
Title of Proceedings: 27th International workshop on Thermal Investigations of ICs and Systems. Sep 22-24 2021, Berlin.
Uncontrolled Keywords: Model order reduction, wirebond, power electronic module
Subjects: Q Science > QA Mathematics > QA75 Electronic computers. Computer science
T Technology > TK Electrical engineering. Electronics Nuclear engineering
Faculty / School / Research Centre / Research Group: Faculty of Liberal Arts & Sciences
Faculty of Liberal Arts & Sciences > Centre for Numerical Modelling & Process Analysis (CNMPA)
Faculty of Liberal Arts & Sciences > Centre for Numerical Modelling & Process Analysis (CNMPA) > Computational Science & Engineering Group (CSEG)
Related URLs:
Last Modified: 30 Sep 2021 12:16
Selected for GREAT 2016: None
Selected for GREAT 2017: None
Selected for GREAT 2018: None
Selected for GREAT 2019: None
Selected for REF2021: None
URI: http://gala.gre.ac.uk/id/eprint/33737

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