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Effects of moisture absorption on anisotropic conductive films interconnection for flip chip on flex applications

Effects of moisture absorption on anisotropic conductive films interconnection for flip chip on flex applications

Yin, C.Y. ORCID: 0000-0003-0298-0420, Lu, H. ORCID: 0000-0002-4392-6562, Bailey, C. ORCID: 0000-0002-9438-3879 and Chan, Y.C. (2013) Effects of moisture absorption on anisotropic conductive films interconnection for flip chip on flex applications. Microelectronic Engineering, 107. pp. 17-22. ISSN 0167-9317 (doi:https://doi.org/10.1016/j.mee.2013.02.070)

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Abstract

This paper reports the investigations into the moisture induced failures in Flip-Chip-on-Flex interconnections using Anisotropic Conductive Films (ACFs). Both experimental and modelling methods were applied. In the experiments, the joint resistance was used as a quality indicator and was measured continuously during the autoclave test. The test condition was set as 121˚C, 100%RH and 2 atm. The results showed that the joint resistance of the ACF flip chip increased during the tests and nearly 25% of the joints were found open after 168 h’ testing. Visible conduction gaps between the adhesive and substrate pads were observed. Cracks at the adhesive/flex interface were also found. In order to have a better understanding of the experimental results, 3D Finite Element (FE) models of the ACF assembly were constructed and a macro–micro modelling technique was used to overcome the difficulty caused by the multi-length scale in the ACF assembly. The moisture diffusion and moisture-induced stresses in the ACF flip chip during the autoclave test were predicted. Modelling results are consistent with the findings in the experimental work.

Item Type: Article
Additional Information: [1] Published in print: July 2013. [2] Published as: Microelectronic Engineering, (2013), Vol. 107, pp. 17–22.
Uncontrolled Keywords: anisotropic conductive film (ACF), moisture absorption, flip chip on flex
Subjects: Q Science > Q Science (General)
Pre-2014 Departments: School of Computing & Mathematical Sciences
School of Computing & Mathematical Sciences > Centre for Numerical Modelling & Process Analysis > Computational Mechanics & Reliability Group
Related URLs:
Last Modified: 20 Mar 2019 11:54
Selected for GREAT 2016: None
Selected for GREAT 2017: None
Selected for GREAT 2018: None
Selected for GREAT 2019: None
Selected for REF2021: None
URI: http://gala.gre.ac.uk/id/eprint/9964

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