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Effects of reflow process on the reliability of flip chip on flex interconnections using anisotropic conductive adhesives

Effects of reflow process on the reliability of flip chip on flex interconnections using anisotropic conductive adhesives

Yin, C.Y. ORCID: 0000-0003-0298-0420, Lu, H. ORCID: 0000-0002-4392-6562, Bailey, C. ORCID: 0000-0002-9438-3879 and Chan, Y.C. (2004) Effects of reflow process on the reliability of flip chip on flex interconnections using anisotropic conductive adhesives. In: 2004 International IEEE Conference on Asian Green Electronics (AGEC) [Proceedings]. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 240-245. ISBN 0-7803-8203-X (doi:https://doi.org/10.1109/AGEC.2004.1290912)

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Abstract

In this paper, the effects of the solder reflow process on the reliability of anisotropic conductive film (ACF) interconnections for flip chip on flex (FCOF) applications are investigated. Experiments as well as computer modeling methods have been used. In the experiments, it was found that the contact resistance of ACF joints increased after the subsequent reflow process, and the magnitude of this increase was strongly correlated to the peak temperature of the reflow profile. Nearly 40% of the joints were opened (i.e. lifted away from the pad) after the reflow process with 260 °C peak temperature while no opening was observed when the peak temperature was 210 °C. It is believed that the CTE mismatch between the polymer particle and the adhesive matrix is the main cause of this contact degradation. It was also found that the ACF joints after the reflow process with 210 °C peak temperature showed a high ability to resist water absorption under steady state 85 °C/85%RH conditions, probably because the curing degree of the ACF was improved during the reflow process. To give a good understanding, a 3D model of an ACF joint structure was built and finite element analysis was used to predict the stress distribution in the conductive particles, adhesive matrix and metal pads during the reflow process.

Item Type: Conference Proceedings
Title of Proceedings: 2004 International IEEE Conference on Asian Green Electronics (AGEC) [Proceedings]
Additional Information: [1] This paper was first presented at the 2004 International IEEE Conference on Asian Green Electronics (AGEC) held from 5-6 January 2004 in City University of Hong Kong, Hong Kong, China and from 7-9 January 2004 in Mission Hills Resort, Shenzhen, China. It was given within Session 7. [2] ISBN: 078038203X (Bound ed.); 0780382048 (CD-Rom ed.)
Uncontrolled Keywords: adhesive bonding, contact resistance, finite element, analysis, flip-chip devices, integrated circuit, interconnections, integrated circuit reliability, reflow soldering
Subjects: Q Science > QA Mathematics > QA76 Computer software
T Technology > TJ Mechanical engineering and machinery
Pre-2014 Departments: School of Computing & Mathematical Sciences
School of Computing & Mathematical Sciences > Centre for Numerical Modelling & Process Analysis
School of Computing & Mathematical Sciences > Centre for Numerical Modelling & Process Analysis > Computational Mechanics & Reliability Group
School of Computing & Mathematical Sciences > Department of Computer Systems Technology
School of Computing & Mathematical Sciences > Department of Mathematical Sciences
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Last Modified: 20 Mar 2019 11:54
Selected for GREAT 2016: None
Selected for GREAT 2017: None
Selected for GREAT 2018: None
Selected for GREAT 2019: None
URI: http://gala.gre.ac.uk/id/eprint/778

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