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Electro-thermal modelling of multi chip power modules for high power converter application

Electro-thermal modelling of multi chip power modules for high power converter application

Shahjalal, Mohammad, Lu, Hua ORCID: 0000-0002-4392-6562 and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2017) Electro-thermal modelling of multi chip power modules for high power converter application. In: 2017 18th International Conference on Electronic Packaging Technology (ICEPT), Harbin. IEEE, pp. 940-945. ISBN 978-1-5386-2973-4 (doi:https://doi.org/10.1109/ICEPT.2017.8046599)

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Abstract

In a compact power electronics systems such as converters, thermal interaction between components is inevitable. Traditional RC lumped modelling method does not take that into account and this would cause inaccuracy in the predicted temperature in the components of the systems. In this work, numerical simulation have been used to obtain detailed temperature distribution in power devices and the parameters for a Foster network behavior thermal model are extracted so that the thermal interaction can be accounted for and the model can be used to predict temperatures at all critical layers of the components. An ad-hoc conventional three-phase voltage source inverter (DC to AC converter) with a rating of 7.8 KW has been studied in this work as an example of the application of the proposed framework. The key component in the converter is a 75A11200V rated IGBT module. A power electronics circuit simulator is used to predict the power losses in the IGBT module and a Finite Element Analysis software is used to obtain the transient temperature profile in the module and the behaviour thermal model parameters are extracted using curve-fit approach. The resulting combined electro-thermal model is analysed using the circuit simulator again to obtain the temperature for various loading conditions. The results show that the proposed method can significantly improve the accuracy of predicted temperatures in the IGBT modules.

Item Type: Conference Proceedings
Title of Proceedings: 2017 18th International Conference on Electronic Packaging Technology (ICEPT), Harbin
Additional Information: Conference held from 16-19 Aug. 2017, Harbin, China.
Uncontrolled Keywords: electro thermal model, inverter, IGBT, power module, circuit simulator, finite element analysis, power electronics
Subjects: Q Science > QA Mathematics
Faculty / Department / Research Group: Faculty of Architecture, Computing & Humanities
Faculty of Architecture, Computing & Humanities > Centre for Numerical Modelling & Process Analysis (CNMPA)
Faculty of Architecture, Computing & Humanities > Centre for Numerical Modelling & Process Analysis (CNMPA) > Computational Mechanics & Reliability Group (CMRG)
Faculty of Architecture, Computing & Humanities > Department of Mathematical Sciences
Last Modified: 20 Mar 2019 11:54
Selected for GREAT 2016: None
Selected for GREAT 2017: None
Selected for GREAT 2018: None
Selected for GREAT 2019: None
URI: http://gala.gre.ac.uk/id/eprint/20212

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