Skip navigation

Co-design/simulation of flip-chip assembly for high voltage IGBT packages

Co-design/simulation of flip-chip assembly for high voltage IGBT packages

Rajaguru, P. ORCID: 0000-0002-6041-0517, Bailey, C. ORCID: 0000-0002-9438-3879, Lu, H. ORCID: 0000-0002-4392-6562, Aliyu, A. M., Castellazzi, A., Pathirana, V., Udugampola, N., Trajkovic, T., Udrea, F., Mitcheson, P. D. and Elliott, A. D. T. (2017) Co-design/simulation of flip-chip assembly for high voltage IGBT packages. In: 23rd International workshop on Thermal Investigations of ICs and Systems (THERMINIC). THERMINIC, pp. 1-5.

[img] PDF (Publisher's PDF)
8784 RAJAGURU_Co-Design-Simulation of Flip-Chip Assembly_2017.pdf - Published Version
Restricted to Registered users only

Download (2MB) | Request a copy

Abstract

This paper details a co-design and modelling methodology to optimise the flip-chip assembly parameters so that the overall package and system meets performance and reliability specifications for LED lighting applications. A co-design methodology is employed between device level modelling and package level modelling in order enhance the flow of information. As part of this methodology, coupled electrical, thermal and mechniacal predictions are made in order to mitigate underfill dielectric breakdown failure and solder interconnect fatigue failure. Five commercial underfills were selected for investigating the trade-off in materials properties that mitigate underfill electrical breakdown and solder joint fatigue.

Item Type: Conference Proceedings
Title of Proceedings: 23rd International workshop on Thermal Investigations of ICs and Systems (THERMINIC)
Uncontrolled Keywords: LED, UNDERFILL
Subjects: Q Science > QA Mathematics
Faculty / Department / Research Group: Faculty of Liberal Arts & Sciences
Faculty of Liberal Arts & Sciences > Centre for Numerical Modelling & Process Analysis (CNMPA)
Faculty of Liberal Arts & Sciences > Centre for Numerical Modelling & Process Analysis (CNMPA) > Computational Mechanics & Reliability Group (CMRG)
Faculty of Liberal Arts & Sciences > School of Computing & Mathematical Sciences (CAM)
Last Modified: 20 Mar 2019 11:54
Selected for GREAT 2016: None
Selected for GREAT 2017: None
Selected for GREAT 2018: GREAT b
Selected for GREAT 2019: None
Selected for REF2021: None
URI: http://gala.gre.ac.uk/id/eprint/8784

Actions (login required)

View Item View Item

Downloads

Downloads per month over past year

View more statistics