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Electro-thermo-mechanical modelling and analysis of the Press Pack Diode in Power Electronics

Electro-thermo-mechanical modelling and analysis of the Press Pack Diode in Power Electronics

Rajaguru, P. ORCID: 0000-0002-6041-0517, Lu, H. ORCID: 0000-0002-4392-6562, Bailey, C. ORCID: 0000-0002-9438-3879, Ortiz-Gonzalez, J. and Alatise, O. (2016) Electro-thermo-mechanical modelling and analysis of the Press Pack Diode in Power Electronics. In: 2015 21st International Workshop on Thermal Investigations of ICs and Systems (THERMINIC). IEEE, pp. 1-6. ISBN 978-1-4673-9706-3 (doi:https://doi.org/10.1109/THERMINIC.2015.7389607)

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Abstract

This paper details a finite element modelling approach of the press pack assembly process for a diode in a power electronic module. Molybdenum and aluminum graphite have been investigated as suitable materials for the contact pad. Contact analysis has been used to model the pressurized thermal interface in order to extract both the stress and temperature distribution in the diode. Average temperature and von Mises stress on the chip for a combination of clamping pressure, load current and contact pad material have been extracted from the modeling results. At present, based on the assumptions and modeling parameters used, Aluminum Graphite seems to have better performance in comparison with molybdenum in terms of generating a lower average chip temperature. Additionally optimum clamping pressure has been estimated by performing a numerical optimisation analysis in order to minimise both the average temperature and stress in the chip.

Item Type: Conference Proceedings
Title of Proceedings: 2015 21st International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)
Additional Information: The conference was held from 30 Sept - 2 Oct 2015, Paris, France.
Uncontrolled Keywords: LED driver, LIGBT
Subjects: Q Science > QA Mathematics
Faculty / Department / Research Group: Faculty of Architecture, Computing & Humanities
Faculty of Architecture, Computing & Humanities > Centre for Numerical Modelling & Process Analysis (CNMPA)
Faculty of Architecture, Computing & Humanities > Centre for Numerical Modelling & Process Analysis (CNMPA) > Computational Mechanics & Reliability Group (CMRG)
Faculty of Architecture, Computing & Humanities > Department of Mathematical Sciences
Last Modified: 20 Mar 2019 11:54
Selected for GREAT 2016: None
Selected for GREAT 2017: None
Selected for GREAT 2018: None
Selected for GREAT 2019: None
URI: http://gala.gre.ac.uk/id/eprint/19758

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