Skip navigation

Advanced microwave oven for rapid curing of encapsulant

Advanced microwave oven for rapid curing of encapsulant

Sinclair, Keith I., Tilford, Tim ORCID: 0000-0001-8307-6403, Goussetis, George, Bailey, Christopher ORCID: 0000-0002-9438-3879, Desmulliez, Marc P.Y., Parrott, Kevin and Sangster, Alan J. (2008) Advanced microwave oven for rapid curing of encapsulant. 2nd Electronics System-Integration Technology Conference, 2008. ESTC 2008. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 551-556. ISBN 978-1-4244-2814-4 (print) 978-1-4244-2813-7 (online) (doi:https://doi.org/10.1109/ESTC.2008.4684409)

[img] PDF
08_30.pdf
Restricted to Repository staff only

Download (1MB)

Abstract

The curing of a thermosetting polymer materials utilized on micro-electronics packaging applications can be performed using microwave systems. The use of microwave energy enables the cure process to be completed more rapidly than with alternative approaches due to the ability to heat volumetrically. Furthermore, advanced dual-section microwave systems enable curing of individual components on a chip-on-board assembly. The dielectric properties of thermosetting polymer materials, commonly used in microelectronics packaging applications, vary significantly with temperature and degree of cure. The heating rate within a material subjected to an electric field is primarily dependant on the dielectric loss properties of the material itself. This article examines the variation in dielectric properties of a commercially available encapsulant paste with frequency and temperature and the resulting influence on the cure process. The 'FAMOBS' dual section microwave system and its application to microelectronics manufacture are described. The measurement of the dielectric properties of 'Henkel EO1080' encapsulant paste uses a commercially available 'dielectric probe kit' and is described in this paper. The FAMOBS heating system is used to encapsulate a small op-amp chip. A numerical model formulated to assess the cure process in thermosetting polymer materials under microwave heating is outlined. Numerical results showing that the microwave processing systems is capable of rapidly and evenly curing thermosetting polymer materials are presented.

Item Type: Book Section
Additional Information: This paper forms part of the Proceedings of the 2nd Electronics System-Integration Technology Conference, held 1-4 September 2008, at University of Greenwich, London. ©2008 IEEE. Personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or redistribution to servers or lists, or to reuse any copyrighted component of this work in other works must be obtained from the IEEE. This material is presented to ensure timely dissemination of scholarly and technical work. Copyright and all rights therein are retained by authors or by other copyright holders. All persons copying this information are expected to adhere to the terms and constraints invoked by each author's copyright. In most cases, these works may not be reposted without the explicit permission of the copyright holder.
Uncontrolled Keywords: microwave systems, micro-electronics manufacture, cure process, thermosetting polymer materials
Subjects: T Technology > TK Electrical engineering. Electronics Nuclear engineering
Q Science > QA Mathematics
Pre-2014 Departments: School of Computing & Mathematical Sciences
School of Computing & Mathematical Sciences > Centre for Numerical Modelling & Process Analysis
School of Computing & Mathematical Sciences > Centre for Numerical Modelling & Process Analysis > Computational Mechanics & Reliability Group
School of Computing & Mathematical Sciences > Centre for Numerical Modelling & Process Analysis > Computational Science & Engineering Group
School of Computing & Mathematical Sciences > Computer & Computational Science Research Group
School of Computing & Mathematical Sciences > Department of Computer Science
School of Computing & Mathematical Sciences > Department of Computer Systems Technology
School of Computing & Mathematical Sciences > Department of Mathematical Sciences
Related URLs:
Last Modified: 30 Sep 2019 15:12
Selected for GREAT 2016: None
Selected for GREAT 2017: None
Selected for GREAT 2018: None
Selected for GREAT 2019: None
URI: http://gala.gre.ac.uk/id/eprint/1220

Actions (login required)

View Item View Item

Downloads

Downloads per month over past year

View more statistics