A multi-scale approach to microstructure-sensitive thermal fatigue in solder joints
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Xu, Yilun, Xian, Jingwei, Stoyanov, Stoyan 
ORCID: 0000-0001-6091-1226, Bailey, Christopher ORCID: 0000-0002-9438-3879, Coyle, Richard, Gourlay, Christopher and Dunne, Fionn
(2022)
A multi-scale approach to microstructure-sensitive thermal fatigue in solder joints.
International Journal of Plasticity, 155:103308.
ISSN 0749-6419
(doi:https://doi.org/10.1016/j.ijplas.2022.103308)
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PDF (Open Access Article)
35854-STOYANOV-A-multi-scale-approach-to-microstructure-sensitive-thermal-fatigue-in-solder-joints_(OA)_2022.pdf - Published Version Available under License Creative Commons Attribution. Download (12MB) | Preview |
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PDF (Author's Accepted Manuscript)
35854-STOYANOV-A-multi-scale-approach-to-microstructure-sensitive-thermal-fatigue-in-solder-joints.pdf - Accepted Version Available under License Creative Commons Attribution. Download (2MB) | Preview |
Abstract
This paper presents a multi-scale modelling approach to investigate the underpinning mechanisms of microstructure-sensitive damage of single crystal Sn-3Ag-0.5Cu (wt%, SAC305) solder joints of a Ball Grid Array (BGA) board assembly subject to thermal cycling. The multi-scale scheme couples board-scale modelling at the continuum macro-scale and individual solder modelling at the crystal micro-scale. Systematic studies of tin crystal orientation and its role in fatigue damage have been compared to experimental observations. Crystallographic orientation is examined with respect to damage development, providing evidence-based optimal solder microstructural design for in-service thermomechanical fatigue.
| Item Type: | Article |
|---|---|
| Uncontrolled Keywords: | crystal plasticity; solder joints; SAC305; thermal fatigue; microstructure; multi-scale modelling; thermo-mechanical Reliability |
| Subjects: | Q Science > Q Science (General) |
| Faculty / School / Research Centre / Research Group: | Faculty of Engineering & Science Faculty of Engineering & Science > Centre for Numerical Modelling & Process Analysis (CNMPA) Faculty of Engineering & Science > Centre for Numerical Modelling & Process Analysis (CNMPA) > Computational Mechanics & Reliability Group (CMRG) Faculty of Engineering & Science > School of Computing & Mathematical Sciences (CMS) |
| Last Modified: | 07 Jun 2022 11:44 |
| URI: | http://gala.gre.ac.uk/id/eprint/35845 |
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