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Lifetime prediction of an IGBT power electronics module under cyclic temperature loading conditions

Lifetime prediction of an IGBT power electronics module under cyclic temperature loading conditions

Lu, Hua ORCID: 0000-0002-4392-6562 and Bailey, C. ORCID: 0000-0002-9438-3879 (2009) Lifetime prediction of an IGBT power electronics module under cyclic temperature loading conditions. In: Electronic Packaging Technology & High Density Packaging, 2009. ICEPT-HDP '09. International Conference on. Institute of Electrical and Electronics Engineers, Piscataway, NJ USA, pp. 274-279. ISBN 9781424446582 (print), 9781424446599 (doi:https://doi.org/10.1109/ICEPT.2009.5270749)

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Abstract

The lifetime of an IGBT power electronics module under
cyclic temperature loading conditions has been analyzed
using Finite Element Analysis method. The failure
mechanisms that have been taken into account are the fatigue
of the chip-mount-down solder joint, the substrate attach
solder joint, the busbar solder joint and the Aluminum
wirebond. The results show that the lifetime of the module is about 1000 cycles under the -40 to 125C cyclic temperature loading condition. The critical failure location has been found to be the busbar solder joint and the lack of compliance of the busbar design is the cause of the problem. The objective of this paper is to demonstrate the methodology of using physics of failure approach for the reliability analysis of power electronics modules and highlights the important design parameters that affect the thermal-mechanical fatigue failures of these components.

Item Type: Conference Proceedings
Title of Proceedings: Electronic Packaging Technology & High Density Packaging, 2009. ICEPT-HDP '09. International Conference on
Additional Information: This paper forms part of the published proceedings of 2009 International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2009 August 10, 2009 - August 13, 2009 Beijing, China.
Uncontrolled Keywords: finite element analysis methods, failure, solder joint
Subjects: Q Science > QA Mathematics > QA75 Electronic computers. Computer science
T Technology > TK Electrical engineering. Electronics Nuclear engineering
Pre-2014 Departments: School of Computing & Mathematical Sciences
School of Computing & Mathematical Sciences > Department of Computer Systems Technology
School of Computing & Mathematical Sciences > Department of Mathematical Sciences
Related URLs:
Last Modified: 20 Mar 2019 11:54
Selected for GREAT 2016: None
Selected for GREAT 2017: None
Selected for GREAT 2018: None
Selected for GREAT 2019: None
URI: http://gala.gre.ac.uk/id/eprint/4468

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