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Computational approach for reliable and robust system-in-package design

Computational approach for reliable and robust system-in-package design

Stoyanov, Stoyan ORCID: 0000-0001-6091-1226, Bailey, Christopher ORCID: 0000-0002-9438-3879, Strusevitch, Nadia and Yannou, J.-M. (2007) Computational approach for reliable and robust system-in-package design. 2007 30th International Spring Seminar On Electronics Technology. International Spring Seminar on Electronics Technology ISSE . Institute of Electrical and Electronics Engineers, Inc., New York, pp. 40-45. ISBN 9781424412174 (doi:https://doi.org/10.1109/ISSE.2007.4432818)

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Abstract

A computational modelling approach integrated with optimisation and statistical methods that can aid the development of reliable and robust electronic packages and systems is presented. The design for reliability methodology is demonstrated for the design of a SiP structure. In this study the focus is on the procedure for representing the uncertainties in the package design parameters, their impact on reliability and robustness of the package design and how these can be included in the design optimisation modelling framework. The analysis of thermo-mechanical behaviour of the package is conducted using non-linear transient finite element simulations. Key system responses of interest, the fatigue life-time of the lead-free solder interconnects and warpage of the package, are predicted and used subsequently for design purposes. The design tasks are to identify the optimal SiP designs by varying several package input parameters so that the reliability and the robustness of the package are improved and in the same time specified performance criteria are also satisfied

Item Type: Book Section
Additional Information: This paper forms part of the published proceedings of the IEEE 30th International Spring Seminar on Electronics Technology (ISSE 2007), Cluj-Napoca, Romania, May 9-13, 2007
Uncontrolled Keywords: SiP structure, package design parameters, thermo-mechanical behaviour, non-linear transient finite element simulations
Subjects: Q Science > QA Mathematics > QA75 Electronic computers. Computer science
Pre-2014 Departments: School of Computing & Mathematical Sciences
School of Computing & Mathematical Sciences > Centre for Numerical Modelling & Process Analysis
School of Computing & Mathematical Sciences > Centre for Numerical Modelling & Process Analysis > Computational Mechanics & Reliability Group
School of Computing & Mathematical Sciences > Department of Computer Systems Technology
School of Computing & Mathematical Sciences > Department of Mathematical Sciences
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Last Modified: 30 Sep 2019 14:59
URI: http://gala.gre.ac.uk/id/eprint/1154

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