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Numerical analysis of microwave-assisted encapsulation processes for ball grid array packages

Numerical analysis of microwave-assisted encapsulation processes for ball grid array packages

Tilford, T., Ferenets, M., Adamietz, R., Pavuluri, S., Morris, J.E., Desmulliez, M.P.Y. and Bailey, C. ORCID: 0000-0002-9438-3879 (2010) Numerical analysis of microwave-assisted encapsulation processes for ball grid array packages. In: International Microwave Power Institute’s 44th Annual Symposium: 2010 Proceedings. International Microwave Power Institute (IMPI), Mechanicsville, VA, USA, pp. 30-35. ISSN 1070-0129

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Abstract

Microwave cure of thermosetting polymer encapsulant material is assessed using a multiphysics analysis approach. A dual section microwave oven system capable of heating individual components on a printed circuit board assembly is described and its integration into a microelectronics manufacturing line is briefly outlined. Due to the complexity of measuring key process parameters in situ, a numerical approach, described in this article, has been adopted to analyse and optimise the curing process.
The numerical model comprises an unstructured finite volume thermophysical solver linked through an Eulerian- Lagrangian mapping process, to a conformal finite difference time domain electromagnetic solver. A sample analysis is presented that focuses on the curing of an encapsulant material in a simplified ball grid array package. Solutions are presented on the behavior of the package submitted to a range of temperatures and microwave power density, The resulting thermomechanical stress are modelled.

Item Type: Conference Proceedings
Title of Proceedings: International Microwave Power Institute’s 44th Annual Symposium: 2010 Proceedings
Additional Information: [1] Included in International Microwave Power Institute's 44th Annual Symposium 2010. Proceedings : Denver, July 14-16, 2010. [2] Proceedings published on a CD.
Uncontrolled Keywords: curing of an encapsulant material, dual-section microwave system, packaging, electronic packaging, microwave
Subjects: T Technology > T Technology (General)
Pre-2014 Departments: School of Computing & Mathematical Sciences
School of Computing & Mathematical Sciences > Department of Mathematical Sciences
Related URLs:
Last Modified: 13 Mar 2019 11:33
Selected for GREAT 2016: None
Selected for GREAT 2017: None
Selected for GREAT 2018: None
Selected for GREAT 2019: None
URI: http://gala.gre.ac.uk/id/eprint/4309

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