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Chip-on-board assembly of 800V Si LIGBTs for high performance ultra-compact LED drivers

Chip-on-board assembly of 800V Si LIGBTs for high performance ultra-compact LED drivers

Aliyu, A. M., Mouawad, B., Castellazzi, A., Rajaguru, P. ORCID: 0000-0002-6041-0517, Bailey, C. ORCID: 0000-0002-9438-3879, Pathirana, V., Uduampola, N., Trajkovic, T. and Ubrea, F. (2017) Chip-on-board assembly of 800V Si LIGBTs for high performance ultra-compact LED drivers. In: Proceedings of the 2017 29th International Symposium on Power Semiconductor Devices and IC's (ISPSD). IEEE, pp. 431-434. ISBN 978-4-88686-094-1 ISSN 1946-0201 (Online) (doi:https://doi.org/10.23919/ISPSD.2017.7988976)

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Abstract

This paper presents a novel chip on board assembly design for an integrated power switch, based on high power density 800V silicon lateral insulated gate bipolar transistor (Si LIGBT) technology. LIGBTs offer much higher current densities (5-10X), significantly lower leakage currents, lower parasitic device capacitances and gate charge compared to conventional vertical MOSFETs commonly used in LED drivers. The higher voltage ratings offered (up to 1kV), the development of high voltage interconnection between parallel IGBTs, self-isolated nature and absence of termination region unlike in a vertical MOSFET makes these devices ideal for ultra-compact, low bill of materials (BOM) count LED drives. Chip on board LIGBTs also offer significant advantages over MOSFETs due to high temperatures seen on most of the LED lamp enclosures as the LIGBT's on-state losses increase only marginally with temperature. the design is based on a built-in reliability approach which focuses on a compact LED driver as a case study of a cost sensitive large volume production item.

Item Type: Conference Proceedings
Title of Proceedings: Proceedings of the 2017 29th International Symposium on Power Semiconductor Devices and IC's (ISPSD)
Additional Information: Conference held from 28 May-1 June 2017, Sapporo, Japan.
Uncontrolled Keywords: chip-on-board, lateral IGBT, LED drivers, packaging, reliability
Subjects: Q Science > QA Mathematics
Faculty / Department / Research Group: Faculty of Architecture, Computing & Humanities
Faculty of Architecture, Computing & Humanities > Centre for Numerical Modelling & Process Analysis (CNMPA)
Faculty of Architecture, Computing & Humanities > Centre for Numerical Modelling & Process Analysis (CNMPA) > Computational Mechanics & Reliability Group (CMRG)
Faculty of Architecture, Computing & Humanities > Department of Mathematical Sciences
Last Modified: 13 Mar 2019 11:35
Selected for GREAT 2016: None
Selected for GREAT 2017: None
Selected for GREAT 2018: None
Selected for GREAT 2019: None
URI: http://gala.gre.ac.uk/id/eprint/19756

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