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Computer simulation and design of a solder joint vibration test machine

Computer simulation and design of a solder joint vibration test machine

Kamara, Elisha, Lu, Hua ORCID: 0000-0002-4392-6562, Bailey, Chris ORCID: 0000-0002-9438-3879, Hunt, Chris, Di Maio, Davide and Thomas, Owen (2010) Computer simulation and design of a solder joint vibration test machine. In: 2010 11th International Conference on Thermal, Mechanical and Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems, EuroSimE 2010. IEEE Conference Publications . Institute of Electrical and Electronic Engineers, Inc., Piscataway, NJ, USA. ISBN 978-1-4244-7026-6 (doi:https://doi.org/10.1109/ESIME.2010.5464587)

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Abstract

Vibration is commonly encountered during the life time of electronic components. It is a major cause of failure due to cyclic strain and stress that give rise to damage in the materials making up the component. The recent move from lead to lead-free soldering by the electronics industry has necessitated the generation of material properties data that will allow accurate prediction of the lead-free solder's performance under vibration conditions. To assess the reliability of lead-free solders under vibration loading, test equipment has been designed for small solder joints using a piezoelectric cell as the vibration source. This equipment will also be used to produce results that can be used to extract solder mechanical material properties and fatigue lifetime parameters suitable for numerical simulations and prediction of solder joint lifetime under vibration loading.
This paper focuses on the analysis of the structure of the proposed vibration test equipment using Finite Element Analysis method. Modal analysis as well as transient analysis has been undertaken to help understand the equipment response in vibration tests. A number of design variables and loading conditions have been analysed in this work.

Item Type: Conference Proceedings
Title of Proceedings: 2010 11th International Conference on Thermal, Mechanical and Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems, EuroSimE 2010
Additional Information: [1] First published online: 13 May 2010. [2] This paper was presented at the 2010 11th International Conference on Thermal, Mechanical and Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems, (EuroSimE 2010) held from 26-28 April 2010 in Bordeaux, France. [3] INSPEC Accession Number: 11306255
Uncontrolled Keywords: vibration, failure, lead-free solders
Subjects: Q Science > QA Mathematics > QA75 Electronic computers. Computer science
T Technology > TK Electrical engineering. Electronics Nuclear engineering
Pre-2014 Departments: School of Computing & Mathematical Sciences
School of Computing & Mathematical Sciences > Department of Computer Systems Technology
School of Computing & Mathematical Sciences > Department of Mathematical Sciences
Related URLs:
Last Modified: 20 Mar 2019 11:54
Selected for GREAT 2016: None
Selected for GREAT 2017: None
Selected for GREAT 2018: None
Selected for GREAT 2019: None
URI: http://gala.gre.ac.uk/id/eprint/4466

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