Article

Ahsan, M., Stoyanov, S. ORCID: https://orcid.org/0000-0001-6091-1226, Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879 and Albarbar, A. (2020) Developing computational intelligence for smart qualification testing of electronic products. IEEE Access, 8. pp. 16922-16933. ISSN 2169-3536 (Online) (doi:10.1109/ACCESS.2020.2967858)

Rajaguru, P. ORCID: https://orcid.org/0000-0002-6041-0517, Lu, H. ORCID: https://orcid.org/0000-0002-4392-6562, Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879, Castellazzi, A., Pathirana, V., Udugampola, N. and Udrea, F. (2018) Impact of underfill and other physical dimensions on Silicon Lateral IGBT package reliability using computer model with discrete and continuous design variables. Microelectronics Reliability, 83. pp. 146-156. ISSN 0026-2714 (doi:10.1016/j.microrel.2018.02.024)

Rajaguru, P. ORCID: https://orcid.org/0000-0002-6041-0517, Lu, H. ORCID: https://orcid.org/0000-0002-4392-6562, Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879, Ortiz-Gonzalez, J. and Alatise, O. (2016) Evaluation of the impact of the physical dimensions and material of the semiconductor chip on the reliability of Sn3.5Ag solder interconnect in power electronic module: A finite element analysis perspective. Microelectronics Reliability, 68. pp. 77-85. ISSN 0026-2714 (doi:10.1016/j.microrel.2016.12.002)

Stoyanov, S. ORCID: https://orcid.org/0000-0001-6091-1226 and Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879 (2015) Modelling the impact of refinishing processes on COTS components for use in aerospace applications. Microelectronics Reliability, 55 (9-10). pp. 1271-1279. ISSN 0026-2714 (doi:10.1016/j.microrel.2015.07.030)

Madden, Adrian ORCID: https://orcid.org/0000-0002-3193-5808, Bailey, C. and Kerr, R. C. J. (2015) 'For this I was made': Conflict and calling in the role of a woman priest. Work, Employment & Society, 29 (5). pp. 866-874. ISSN 0950-0170 (Print), 1469-8722 (Online) (doi:10.1177/0950017014559962)

Shantz, Amanda, Alfes, K., Bailey, C. and Soane, E. (2015) Drivers and Outcomes of Work Alienation: Reviving a Concept. Journal of Management Inquiry, 24 (4). pp. 382-393. ISSN 1056-4926 (Print), 1552-6542 (Online) (doi:10.1177/1056492615573325)

Zhu, X., Kotadia, H., Xu, S., Lu, H. ORCID: https://orcid.org/0000-0002-4392-6562, Mannan, S. H., Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879 and Chan, Y. C. (2014) Electromigration in Sn-Ag solder thin films under high current density. Thin Solid Films, 565. pp. 193-201. ISSN 0040-6090 (doi:10.1016/j.tsf.2014.06.030)

Yin, C.Y. ORCID: https://orcid.org/0000-0003-0298-0420, Lu, H. ORCID: https://orcid.org/0000-0002-4392-6562, Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879 and Chan, Y.C. (2013) Effects of moisture absorption on anisotropic conductive films interconnection for flip chip on flex applications. Microelectronic Engineering, 107. pp. 17-22. ISSN 0167-9317 (doi:10.1016/j.mee.2013.02.070)

Li, H., Yu, W., Zhang, L., Liu, Z., Brown, K.E., Abraham, E., Cargill, S., Tonry, C., Patel, M.K., Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879 and Desmulliez, M.P.Y. (2013) Simulation and modelling of sub-30 nm polymeric channels fabricated by electrostatic induced lithography. RSC Advances, 3 (29). pp. 11839-11845. ISSN 2046-2069 (doi:10.1039/c3ra40188j)

Costello, S., Strusevich, N., Flynn, D., Kay, R.W., Patel, M.K., Bailey, C., Price, D., Bennet, M., Jones, A.C. and Desmulliez, M.P.Y. (2013) Electrodeposition of copper into high aspect ratio PCB micro-via using megasonic agitation. Microsystem Technologies, 19 (6). pp. 783-790. ISSN 0946-7076 (Print), 1432-1858 (Online) (doi:10.1007/s00542-013-1746-7)

Chen, H., Yu, W., Cargill, S., Patel, M.K., Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879, Tonry, C. and Desmulliez, M.P.Y. (2012) Self-encapsulated hollow microstructures formed by electric field-assisted capillarity. Microfluidics and Nanofluidics, 13 (1). pp. 75-82. ISSN 1613-4982 (Print), 1613-4990 (Online) (doi:10.1007/s10404-012-0942-6)

Pavuluri, S.K., Ferenets, M., Goussetis, G., Desmulliez, M.P.Y., Tilford, T. ORCID: https://orcid.org/0000-0001-8307-6403, Adamietz, R., Muller, G., Eicher, F. and Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879 (2012) Encapsulation of microelectronic components using open-ended microwave oven. IEEE Transactions on Components, Packaging and Manufacturing Technology, 2 (5). pp. 799-806. ISSN 2156-3950 (doi:10.1109/TCPMT.2011.2177524)

Rosunally, Y.Z., Stoyanov, S. ORCID: https://orcid.org/0000-0001-6091-1226, Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879, Mason, P., Campbell, S., Monger, G. and Bell, I. (2011) Fusion approach for prognostics framework of heritage structure. IEEE Transactions on Reliability, 60 (1):570453. pp. 3-13. ISSN 0018-9529 (doi:10.1109/TR.2011.2104451)

Rizvi, M.J., Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879 and Lu, H. ORCID: https://orcid.org/0000-0002-4392-6562 (2010) Damage predictions in a chip resistor solder joint on flexible circuit board. Microelectronic Engineering, 87 (10). pp. 1889-1895. ISSN 0167-9317 (doi:10.1016/j.mee.2009.11.023)

Kamara, E., Lu, H. ORCID: https://orcid.org/0000-0002-4392-6562, Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879, Hunt, C., Di Maio, D. and Thomas, O. (2010) A multi-disciplinary study of vibration based reliability of lead-free electronic interconnects. Microelectronics Reliability, 50 (9-11). pp. 1706-1710. ISSN 0026-2714 (doi:10.1016/j.microrel.2010.07.152)

Tilford, T., Ferenets, M., Morris, J.E., Krumme, A., Pavuluri, S., Rajaguru, P.R. ORCID: https://orcid.org/0000-0002-6041-0517, Desmulliez, M.P.Y. and Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879 (2010) Application of particle swarm optimisation to evaluation of polymer cure kinetics models. Journal of Algorithms & Computational Technology, 4 (1). pp. 121-146. ISSN 1748-3018 (doi:10.1260/1748-3018.4.1.121)

Stoyanov, S. ORCID: https://orcid.org/0000-0001-6091-1226, Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879, Tang, Y.K., Marson, S., Dyer, A., Allen, D. and Desmulliez, M. (2010) Computational modelling and optimisation of the fabrication of nano-structures using focused ion beam and imprint forming technologies. Journal of Physics: Conference Series (JPCS), 253 (1):012008. ISSN 1742-6588 (Print), 1742-6596 (Online) (doi:10.1088/1742-6596/252/1/012008)

Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879 and Lu, Hua ORCID: https://orcid.org/0000-0002-4392-6562 (2009) Nanopackaging simulation: properties and behavior of packaging materials. Nanotechnology Magazine, 3 (2). pp. 34-37. ISSN 1932-4510 (doi:10.1109/MNANO.2009.932413)

Sinclair, K.I., Goussetis, G., Desmulliez, M.P.Y., Sangster, A.J., Tilford, T. ORCID: https://orcid.org/0000-0001-8307-6403, Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879 and Parrott, A.K. (2008) Optimization of an open-ended microwave oven for microelectronics packaging. IEEE Transactions on Microwave Theory and Techniques, 56 (11). pp. 2635-2641. ISSN 0018-9480 (doi:10.1109/TMTT.2008.2005925)

Rizvi, M.J., Lu, H. ORCID: https://orcid.org/0000-0002-4392-6562, Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879, Chan, Y.C., Lee, M.Y. and Pang, C.H. (2007) Role of bonding time and temperature on the physical properties of coupled anisotropic conductive–nonconductive adhesive film for flip chip on glass technology. Microelectronic Engineering, 85 (1). pp. 238-244. ISSN 0167-9317 (doi:10.1016/j.mee.2007.05.045)

Cross, M., Croft, T. N., McBride, D., Slone, A. K., Williams, A. J., Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879 and Pericleous, K. ORCID: https://orcid.org/0000-0002-7426-9999 (2006) Computational fluid dynamics: advancements in technology for modeling iron and steelmaking processes. AIST Transactions - Iron and Steel Technology, 3 (7). pp. 155-163. ISSN 1547-0423

Rizvi, M.J., Chan, Y.C., Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879, Lu, H. ORCID: https://orcid.org/0000-0002-4392-6562, Islam, M.N. and Wu, B.Y. (2005) Wetting and Reaction of Sn-2.8Ag-0.5Cu-1.0Bi Solder with Cu and Ni Substrates. IEEE/TMS Journal of Electronic Materials, 34 (8). pp. 1115-1122. ISSN 0361-5235 (Print), 1543-186X (Online) (doi:10.1007/s11664-005-0239-6)

Rizvi, M.J., Chan, Y.C., Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879, Lu, H. ORCID: https://orcid.org/0000-0002-4392-6562 and Sharif, A. (2005) The effect of curing on the performance of ACF bonded chip-on-flex assemblies after thermal ageing. Soldering & Surface Mount Technology, 17 (2). pp. 40-48. ISSN 0954-0911 (doi:10.1108/09540910510597492)

Slone, A.K., Pericleous, K. ORCID: https://orcid.org/0000-0002-7426-9999, Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879, Cross, M. and Bennett, C. (2004) A finite volume unstructured mesh approach to dynamic fluid–structure interaction: an assessment of the challenge of predicting the onset of flutter. Applied Mathematical Modelling, 28 (2). pp. 211-239. ISSN 0307-904X (doi:10.1016/S0307-904X(03)00142-2)

Edussuriya, S.S., Williams, A.J. and Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879 (2004) A cell-centred finite volume method for modelling viscoelastic flow. Journal of Non-Newtonian Fluid Mechanics, 117 (1). pp. 47-61. ISSN 0377-0257 (doi:10.1016/j.jnnfm.2003.12.001)

Slone, A.K., Pericleous, K. ORCID: https://orcid.org/0000-0002-7426-9999, Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879, Cross, M. and Bennett, C. (2003) A finite volume unstructured mesh approach to dynamic fluid–structure interaction: an assessment of the challenge of predicting the onset of flutter. Applied Mathematical Modelling, 28 (2). pp. 211-239. ISSN 0307-904X (doi:10.1016/S0307-904X(03)00142-2)

Yin, C.Y. ORCID: https://orcid.org/0000-0003-0298-0420, Alam, M.O., Chan, Y.C., Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879 and Lu, Hua ORCID: https://orcid.org/0000-0002-4392-6562 (2003) The effect of reflow process on the contact resistance and reliability of anisotropic conductive film interconnection for flip chip on flex applications. Microelectronics Reliability, 43 (4). pp. 625-633. ISSN 0026-2714 (doi:10.1016/S0026-2714(02)00348-7)

Slone, A.K., Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879 and Cross, M. (2002) Dynamic solid mechanics using finite volume methods. Applied Mathematical Modelling, 27 (2). pp. 69-87. ISSN 0307-904X (doi:10.1016/S0307-904X(02)00060-4)

Taylor, G.A., Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879 and Cross, M. (2002) A vertex-based finite volume method applied to non-linear material problems in computational solid mechanics. International Journal for Numerical Methods in Engineering, 56 (4). pp. 507-529. ISSN 0029-5981 (Print), 1097-0207 (Online) (doi:10.1002/nme.574)

Lu, H. ORCID: https://orcid.org/0000-0002-4392-6562, Hung, K.C., Stoyanov, S. ORCID: https://orcid.org/0000-0001-6091-1226, Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879 and Chan, Y.C. (2002) No-flow underfill flip chip assembly–an experimental and modeling analysis. Microelectronics Reliability, 42 (8). pp. 1205-1212. ISSN 0026-2714 (doi:10.1016/S0026-2714(02)00092-6)

Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879, Warner, M., Agha, A., Pericleous, K. ORCID: https://orcid.org/0000-0002-7426-9999, Parry, J., Marooney, C., Reeves, H. and Clark, I. (2002) Flo/Stress: an integrated software module to predict stress in electronic products. Computing and Control Engineering Journal, 13 (3). pp. 143-148. ISSN 0956-3385 (doi:10.1049/ccej:20020306)

Slone, A.K., Pericleous, K. ORCID: https://orcid.org/0000-0002-7426-9999, Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879 and Cross, M. (2002) Dynamic fluid–structure interaction using finite volume unstructured mesh procedures. Computers and Structures, 80 (5-6). pp. 371-390. ISSN 0045-7949 (doi:10.1016/S0045-7949(01)00177-8)

Durairaj, R., Jackson, G.J., Ekere, N.N., Glinski, G. and Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879 (2002) Correlation of solder paste rheology with computational simulations of the stencil printing process. Soldering and Surface Mount Technology, 14 (1). pp. 11-17. ISSN 0954-0911 (doi:10.1108/09540910210416422)

Stoyanov, S. ORCID: https://orcid.org/0000-0001-6091-1226, Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879 and Cross, M. (2002) Optimisation modelling for flip-chip solder joint reliability. Soldering and Surface Mount Technology, 14 (1). pp. 49-58. ISSN 0954-0911 (doi:10.1108/09540910210416477)

Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879, Lu, H. ORCID: https://orcid.org/0000-0002-4392-6562 and Wheeler, D. (2001) Computational modeling techniques for reliability of electronic components on printed circuit boards. Applied Numerical Mathematics, 40 (1-2). pp. 101-117. ISSN 0168-9274 (doi:10.1016/S0168-9274(01)00065-4)

Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879, Patel, M. and Kumar, S. (2001) Computational modelling-a key component in materials processing. Transactions of the Institution of Mining and Metallurgy, Section C: Mineral Processing and Extractive Metallurgy, 110 (1). pp. 25-32. ISSN 0371-9553 (Print), 1743-2855 (Online) (doi:10.1179/mpm.2001.110.1.25)

Glinski, G.P., Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879 and Pericleous, K.A. ORCID: https://orcid.org/0000-0002-7426-9999 (2001) A non-Newtonian computational fluid dynamics study of the stencil printing process. Proceedings of the Institution of Mechanical Engineers, Part C: Journal of Mechanical Engineering Science, 215 (4). pp. 437-446. ISSN 0954-4062 (Print), 2041-2983 (Online) (doi:10.1243/0954406011520869)

Lu, Hua ORCID: https://orcid.org/0000-0002-4392-6562, Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879 and Cross, M. (2000) Reliability analysis of flip chip designs via computer simulation. Journal of Electronic Packaging, 122 (3). pp. 214-219. ISSN 1528-9044 (Print), 1043-7398 (Online) (doi:10.1115/1.1286122)

Wheeler, D., Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879 and Cross, M. (2000) Numerical modelling and validation of Marangoni and surface tension phenomena using the finite volume method. International Journal for Numerical Methods in Fluids, 32 (8). pp. 1021-1047. ISSN 0271-2091 (Print), 1097-0363 (Online) (doi:10.1002/(SICI)1097-0363(20000430)32:8<1021::AID-FLD998>3.0.CO;2-1)

Fallah, N.A., Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879, Cross, M. and Taylor, G.A. (2000) Comparison of finite element and finite volume methods application in geometrically nonlinear stress analysis. Applied Mathematical Modelling, 24 (7). pp. 439-455. ISSN 0307-904X (doi:10.1016/S0307-904X(99)00047-5)

Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879, Bounds, S., Cross, M., Moran, G, Pericleous, K. ORCID: https://orcid.org/0000-0002-7426-9999 and Taylor, G. (1999) Multiphysics modeling and its application to the casting process. CMSE: Computer Modelling & Simulation in Engineering, 4 (3). pp. 206-212. ISSN 1083-3455

Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879, Taylor, G.A., Cross, M. and Chow, P. (1999) Discretisation procedures for multi-physics phenomena. Journal of Computational and Applied Mathematics, 103 (1). pp. 3-17. ISSN 0377-0427 (doi:10.1016/S0377-0427(98)00236-2)

Wheeler, D., Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879 and Cross, M. (1998) A computational modelling framework to predict macroscopic phenomena in solder joint formation. Proceedings of the Institution of Mechanical Engineers, Part B: Journal of Engineering Manufacture, 212 (2). pp. 141-157. ISSN 0954-4054 (Print), 2041-2975 (Online) (doi:10.1243/0954405981515563)

Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879, Chow, P., Cross, M., Fryer, Y. and Pericleous, K. ORCID: https://orcid.org/0000-0002-7426-9999 (1996) Multiphysics modelling of the metals casting process. Proceedings of the Royal Society A, 452 (1946). pp. 459-486. ISSN Online: 1471-2946 (doi:10.1098/rspa.1996.0024)

Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879, Clapham, S., Cross, M., Dixon, T., Wolfe, S. and Norman, P. (1996) Modelling stress evolution during cable fabrication. ZAMM - Journal of Applied Mathematics and Mechanics / Zeitschrift für Angewandte Mathematik und Mechanik, 76 (S4). pp. 97-100. ISSN 0044-2267 (Print), 1521-4001 (Online) (doi:10.1002/zamm.19960761408)

Cross, M., Lyster, C, Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879, Croft, N., Ewer, J. ORCID: https://orcid.org/0000-0003-0609-272X, Leggett, P., McManus, K., Pericleous, K.A. ORCID: https://orcid.org/0000-0002-7426-9999 and Patel, M.K. (1996) PHYSICA - A software environment for the modelling of multi-physics phenomena. ZAMM - Journal of Applied Mathematics and Mechanics / Zeitschrift für Angewandte Mathematik und Mechanik, 76 (S4). pp. 105-108. ISSN 0044-2267 (Print), 1521-4001 (Online) (doi:10.1002/zamm.19960761408)

Chow, P., Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879, Cross, M. and Pericleous, K.A. ORCID: https://orcid.org/0000-0002-7426-9999 (1996) The numerical modelling of multi-physics phenomena: The shape casting process. ZAMM - Journal of Applied Mathematics and Mechanics / Zeitschrift für Angewandte Mathematik und Mechanik, 76 (S4). pp. 101-104. ISSN 0044-2267 (Print), 1521-4001 (Online) (doi:10.1002/zamm.19960761408)

Book Section

Alam, M.O. and Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879 (2011) Introduction to adhesives joining technology for electronics. In: Alam, M.O. and Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879, (eds.) Advanced adhesives in electronics: Materials, properties and applications. Woodhead Publishing Limited, Cambridge, UK. ISBN 9781845695767

Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879 (2011) Modelling techniques used to assess conductive adhesive properties. In: Alam, M.O. and Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879, (eds.) Advanced adhesives in electronics: Materials, properties and applications. Woodhead Publishing Limited, Cambridge, UK. ISBN 9781845695767

Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879, Lu, H. ORCID: https://orcid.org/0000-0002-4392-6562, Yin, C. ORCID: https://orcid.org/0000-0003-0298-0420 and Ridout, S. (2008) Predictive reliability, prognostics and risk assessment for power modules. CIPS 2008: 5th International Conference on Integrated Power Electronics Systems. Proceedings, March, 11-13, 2008 Nuremberg/Germany. ETG-Fachbericht (111). VDE Verlag GmbH, Berlin-Offenbach, Germany, pp. 19-26. ISBN 9783800730896

Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879, Stoyanov, S. ORCID: https://orcid.org/0000-0001-6091-1226, Strusevich, N. and Yannou, J.-M. (2007) Reliability analysis of SiP structures. HDP'07: Proceedings of the 2007 International Symposium on High Density Packaging and Microsystem Integration. Institute of Electrical and Electronics Engineers, Inc., New York, p. 38. ISBN 9781424412525 (doi:10.1109/HDP.2007.4283556)

Newcombe, D. R. and Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879 (2007) Rapid solutions for application specific IGBT module design. International Exhibition and Conference for Power Electronics, Intelligent Motion and Power Quality (PCIM Europe 2007). Curran Associates, Inc., Red Hook , New York. ISBN 9781604231816

Stoyanov, S. ORCID: https://orcid.org/0000-0001-6091-1226, Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879, Lu, H. ORCID: https://orcid.org/0000-0002-4392-6562 and Cross, M. (2002) Integrated computational mechanics and optimization for design of electronic components. In: Parmee, Ian C. and Hajela, Prabhat, (eds.) Optimization In Industry. Springer Verlag, pp. 57-71. ISBN 9781852338342

Cross, M., Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879, Pericleous, K. ORCID: https://orcid.org/0000-0002-7426-9999, McManus, K., Bounds, S., Moran, G., Taylor, G. and Wheeler, D. (2000) The role of multi-physics simulation in virtual manufacturing. Virtual Design and Manufacture (IMechE Seminar Publications). Wiley-Blackwell, pp. 11-26. ISBN 978-1860583148

Cross, M., McManus, K., Johnson, S.P., Ierotheou, C.S., Walshaw, C. ORCID: https://orcid.org/0000-0003-0253-7779, Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879 and Pericleous, K.A. ORCID: https://orcid.org/0000-0002-7426-9999 (1999) Computational modelling of multi-physics processes on high performance parallel computer systems. In: Allan, R.J., Guest, M.F., Simpson, A.D., Henty, D.S. and Nicole, D.A., (eds.) High-Performance Computing. Springer US, pp. 91-102. ISBN 978-0-306-46034-0 (doi:10.1007/978-1-4615-4873-7_10)

Edited Book

Alam, M.O. and Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879 (eds.) (2011) Advanced adhesives in electronics, materials, properties and applications. Woodhead Publishing Limited, Cambridge, UK. ISBN 9781845695767

Conference Proceedings

Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879, Rajaguru, P. ORCID: https://orcid.org/0000-0002-6041-0517, Lu, H. ORCID: https://orcid.org/0000-0002-4392-6562, Castellazzi, A., Antonini, M., Pathirana, V., Udugampola, N., Udrea, F., Mitchelson, P. D. and Aldhaher, S. (2018) Mechanical modelling of high power lateral IGBT for LED driver applications. In: IEEE Electronic Components and Technology Conference (ECTC). IEEE Electronics Packaging Society (formerly CPMT), pp. 1375-1381. ISBN 978-1-5386-5000-4 ISSN 2377-5726 (Online) (doi:10.1109/ECTC.2018.00210)

Tilford, T. ORCID: https://orcid.org/0000-0001-8307-6403, Bruan, J., Janhsen, J. C., Burgard, M. and Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879 (2018) SPH analysis of inkjet droplet impact dynamics. In: Proceedings of the 13th World Congress on Computational Mechanics (WCCM XIII) and 2nd Pan American Congress on Computational Mechanics (PANACM II). WCCM.

Rajaguru, P. ORCID: https://orcid.org/0000-0002-6041-0517, Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879, Lu, H. ORCID: https://orcid.org/0000-0002-4392-6562, Aliyu, A. M., Castellazzi, A., Pathirana, V., Udugampola, N., Trajkovic, T., Udrea, F., Mitcheson, P. D. and Elliott, A. D. T. (2017) Co-design/simulation of flip-chip assembly for high voltage IGBT packages. In: 23rd International workshop on Thermal Investigations of ICs and Systems (THERMINIC). THERMINIC, pp. 1-5.

Aliyu, A. M., Mouawad, B., Castellazzi, A., Rajaguru, P. ORCID: https://orcid.org/0000-0002-6041-0517, Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879, Pathirana, V., Uduampola, N., Trajkovic, T. and Ubrea, F. (2017) Chip-on-board assembly of 800V Si LIGBTs for high performance ultra-compact LED drivers. In: Proceedings of the 2017 29th International Symposium on Power Semiconductor Devices and IC's (ISPSD). IEEE, pp. 431-434. ISBN 978-4-88686-094-1 ISSN 1946-0201 (Online) (doi:10.23919/ISPSD.2017.7988976)

Tilford, T. ORCID: https://orcid.org/0000-0001-8307-6403, Stoyanov, S. ORCID: https://orcid.org/0000-0001-6091-1226, Tourloukis, G. and Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879 (2016) Numerical analysis of droplet deposition in inkjet printed electronics assembly. In: 2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE). IEEE, pp. 1-7. ISBN 978-1-5090-2106-2 (doi:10.1109/EuroSimE.2016.7463358)

Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879, Stoyanov, S. ORCID: https://orcid.org/0000-0001-6091-1226, Tilford, T. and Tourloukis, G. (2016) Modelling methodologies for quality assessment of 3D inkjet printed electronic products. In: 3rd Fraunhofer Direct Digital Manufacturing Conference, DDMC 2016. Proceedings. Fraunhofer Verlag, Stuttgart. ISBN 978-3-8396-9128-1 ISSN 978-3-8396-1001-5 (Online)

Rajaguru, P. ORCID: https://orcid.org/0000-0002-6041-0517, Lu, H. ORCID: https://orcid.org/0000-0002-4392-6562, Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879, Ortiz-Gonzalez, J. and Alatise, O. (2016) Electro-thermo-mechanical modelling and analysis of the Press Pack Diode in Power Electronics. In: 2015 21st International Workshop on Thermal Investigations of ICs and Systems (THERMINIC). IEEE, pp. 1-6. ISBN 978-1-4673-9706-3 (doi:10.1109/THERMINIC.2015.7389607)

Zhu, X., Lu, H. ORCID: https://orcid.org/0000-0002-4392-6562 and Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879 (2014) Modelling the stress effect during metal migration in electronic interconnects. In: 14th IEEE International Conference on Nanotechnology. IEEE, pp. 108-112. ISSN 1944-9399 (doi:10.1109/NANO.2014.6968180)

Tonry, C.E.H., Patel, M.K., Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879, Desmuliez, M.P.Y. and Yu, W. (2013) Micro-scale modelling challenges in electric field assisted capillarity. In: Proceedings. 12th International Symposium on Distributed Computing and Applications to Business, Engineering & Science. DCABES 2013. IEEE Computer Society. Conference Publishing Services (CPS), Los Alamitos, CA, USA, 40- 43. ISBN 978-0769550602 (doi:10.1109/DCABES.2013.57)

Zhu, X., Kotadia, H., Xu, S., Lu, H. ORCID: https://orcid.org/0000-0002-4392-6562, Mannan, S.H., Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879 and Chan, Y.C. (2013) Comments on electromigration analysis methods. In: Proceedings of 14th International Conference on Electronic Packaging Technology (ICEPT 2013). Institute of Electrical and Electronics, Inc., Piscataway, NJ, USA, pp. 529-534. ISBN 9781479904983 (doi:10.1109/ICEPT.2013.6756527)

Strusevich, N., Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879 and Patel, M.K. (2013) Computational modeling of electrodepostion in small features under megasonic agitation. In: 2013 European Microelectronics Packaging Conference (EMPC). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA.

Tilford, T. ORCID: https://orcid.org/0000-0001-8307-6403, Ferenets, M., Adamietz, R., Pavuluri, S. K., Desmulliez, M. P. Y. and Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879 (2012) Assessment of the accuracy of cure kinetics models and fitting approaches utilised in analysis of microelectronics encapsulation materials. In: Electronics Packaging Technology Conference (EPTC), 2011 13th. IEEE Conference Publications . Institute of Electrical and Electronics Engineers, Piscataway, NJ, USA, pp. 262-267. ISBN 978-1-4577-1983-7 (Print), 978-1-4577-1981-3 (Online) (doi:10.1109/EPTC.2011.6184428)

Pavuluri, S.K., Desmulliez, M.P.Y., Goussetis, G., Arrighi, V., Johnston, K., Adamietz, R., Tilford, T. and Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879 (2012) Post cure behaviour of ancapsulants for QFN packages processed by an open-ended single mode resonant microwave applicator. In: Electronics Packaging Technology Conference (EPTC), 2011 13th. Institute of Electrical and Electronics Engineers, Piscataway, NJ, USA, pp. 573-578. ISBN 978-1-4577-1983-7 (Print), 978-1-4577-1981-3 (Online) (doi:10.1109/EPTC.2011.6184486)

Sutharssan, T., Stoyanov, S. ORCID: https://orcid.org/0000-0001-6091-1226, Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879 and Rosunally, Y. (2012) Data analysis techniques for real-time prognostics and health management of semiconductor devices. In: Microelectronics and Packaging. Institute of Electrical and Electronic Engineers, Inc, Piscataway, NJ, USA, pp. 1-7. ISBN 978-1-4673-0694-2 (print)

Costello, S., Strusevich, N., Flyyn, D., Kay, R.W., Patel, M.K., Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879, Price, D., Bennet, M., Jones, A.C. and Desmulliez, M.P.Y. (2012) Electrodeposition of copper into high aspect ratio PCB micro-via using megasonic agitation. In: DTIP 2012 Conference 2012: Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS. EDA Publishing Association, Grenoble, France, pp. 98-102. ISBN 9782355000201

Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879, Zhu, X., Lu, H. ORCID: https://orcid.org/0000-0002-4392-6562 and Yin, C. ORCID: https://orcid.org/0000-0003-0298-0420 (2012) Modelling metal migration for high reliability components when subjected to thermo-mechanical loading. In: Proceedings of the 2012 IEEE 14th Electronics Packaging Technology Conference. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 474-478. ISBN 9781467345538 (doi:10.1109/EPTC.2012.6507130)

Lu, Hua ORCID: https://orcid.org/0000-0002-4392-6562 and Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879 (2011) Optimisation of heatsink design for a ruggedised LCD display. In: 2011 International Conference on Electronic Packaging Technology & High Density Packaging. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 492-496. ISBN 9781457717703 (doi:10.1109/ICEPT.2011.6066883)

Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879, Yin, C. ORCID: https://orcid.org/0000-0003-0298-0420, Lu, H. ORCID: https://orcid.org/0000-0002-4392-6562 and Cartwright, C. (2011) Multi-physics and multi-disciplinary analysis for solid state lighting. In: 2011 12th Int. Conf. on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2011. IEEE Computer Society, Piscataway, USA. ISBN 9781457701078 (doi:10.1109/ESIME.2011.5765859)

Berthou, M., Lu, H. ORCID: https://orcid.org/0000-0002-4392-6562, Retailleau, P., Frémont, H., Guédon-Gracia, A., Davennel, C. and Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879 (2011) Vibration test durability on large BGA assemblies: evaluation of reinforcement techniques. In: 2010 IEEE CPMT Symposium Japan, ICSJ10. IEEE Computer Society, Piscataway, USA, pp. 1-4. ISBN 9781424475933 (doi:10.1109/CPMTSYMPJ.2010.5679536)

Costello, S., Strusevich, N., Patel, M.K., Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879, Flynn, D., Kay, R.W., Price, D., Bennett, M., Jones, A.C., Habeshaw, R., Demore, C., Cochran, S. and Desmulliez, M.P.Y. (2011) Characterisation of ion transportation during electroplating of high aspect ratio microvias using megasonic agitation. In: EMPC-2011: 18th European Microelectronics and Packaging Conference. Proceedings. IEEE Conference Publications . Institute of Electrical and Electronic Engineers, Inc., Piscataway, NJ, USA, pp. 1-7. ISBN 9780956808606

Costello, S., Flynn, D., Kay, R.W., Desmulliez, M.P.Y., Strusevich, N., Patel, M.K., Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879, Jones, A.C., Bennett, M., Price, D., Habeshaw, R., Demore, C. and Cochran, S. (2011) Electrodeposition of copper into PCB vias under megasonic agitation. In: MME 2011. Proceedings of the 22nd Micromechanics and Microsystems Technology Europe Workshop. MME2011, Norway, pp. 266-269. ISBN 9788278602249

Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879 and Lu, H. ORCID: https://orcid.org/0000-0002-4392-6562 (2011) Interconnect technologies using carbon nanotubes: Current status and future challenges. In: 2011 34th International Spring Seminar on Electronics Technology (ISSE). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA. ISBN 978-1-4577-2111-3 ISSN 2161-2528 (doi:10.1109/ISSE.2011.6053539)

Zhu, Xiaoxin, Kotadia, H., Xu, Sha, Lu, Hua ORCID: https://orcid.org/0000-0002-4392-6562, Mannan, S.H., Chan, Y.C. and Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879 (2011) Multi-physics computer simulation of the electromigration phenomenon. In: ICEPT-HDP 2011 Proceedings - 2011 International Conference on Electronic Packaging Technology and High Density Packaging. IEEE Computer Society, Piscataway, USA, pp. 448-452. ISBN 9781457717703 (Print), 9781457717680 (Online) (doi:10.1109/ICEPT.2011.6066874)

Pavuluri, S.K., Ferenets, M., Goussetis, G., Desmulliez, M.P.Y., Tilford, T. ORCID: https://orcid.org/0000-0001-8307-6403, Adamietz, R., Muller, G., Eicher, F. and Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879 (2010) Experimental investigation of open-ended microwave oven assisted encapsulation process. In: Electronics System Integration Technology Conference, ESTC 2010 - Proceedings. IEEE Computer Society, Piscataway, NJ, USA, pp. 1-6. ISBN 978-1-4244-8553-6 (print), 978-1-4244-8554-3 (online) (doi:10.1109/ESTC.2010.5643015)

Tilford, T. ORCID: https://orcid.org/0000-0001-8307-6403, Ferenets, M., Adamietz, R., Pavuluri, S.K., Morris, J.E., Desmulliez, M.P.Y. and Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879 (2010) Numerical analysis of microwave underfill cure in ball-grid packages. In: Electronics System Integration Technology Conference, ESTC 2010 - Proceedings. IEEE Computer Society, Piscataway, USA, pp. 1-6. ISBN 9781424485536 (Print), 9781424485543 (Online) (doi:10.1109/ESTC.2010.5642822)

Tilford, T., Morris, J.E., Ferenets, M., Rajaguru, P.R. ORCID: https://orcid.org/0000-0002-6041-0517, Pavuluri, S.K., Desmulliez, M.P.Y. and Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879 (2010) On model fitting methods for modeling polymer cure kinetics in microelectronics assembly applications. In: Electronics System Integration Technology Conference, ESTC 2010 - Proceedings. IEEE Computer Society, Piscataway, USA, pp. 1-6. ISBN 9781424485536 (Print), 9781424485543 (Online) (doi:10.1109/ESTC.2010.5642820)

Adamietz, R., Müller, G., Othman, N., Eicher, F., Tilford, T. ORCID: https://orcid.org/0000-0001-8307-6403, Ferenets, M., Pavuluri, S.K., Desmulliez, M. P.Y. and Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879 (2010) On the integration of microwave curing systems into microelectronics assembly processes. In: Electronics System Integration Technology Conference, ESTC 2010 - Proceedings. IEEE Computer Society, Piscataway, USA, pp. 1-6. ISBN 9781424485536 (Print), 9781424485543 (Online) (doi:10.1109/ESTC.2010.5642827)

Rizvi, M.J., Lu, H. ORCID: https://orcid.org/0000-0002-4392-6562, Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879, Bevan, E., Poutney, N. and Coates, J. (2010) Finite element modelling of failures in thick film chip resistor solder joints. In: Microsystems Packaging Assembly and Circuits Technology Conference (IMPACT), 2010. in: Microsystems Packaging Assembly and Circuits Technology Conference (IMPACT), 2010 5th International Issue Date: 20-22 Oct. 2010 . IEEE Xplore Digital Library, Taipei, pp. 1-4. ISBN 978-1-4244-9785-0 (electronic), 978-1-4244-9783-6 (print) ISSN 2150-5934 (doi:10.1109/IMPACT.2010.5699488)

Sinha, A., Mihailovic, J.A., Morris, J.E., Hua, Lu and Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879 (2010) Modeling thermal conductivity and CTE for CNT-Cu composites for 3-D TSV application. In: Nanotechnology Materials and Devices Conference (NMDC), 2010 IEEE. Nanotechnology Materials and Devices Conference (NMDC), 2010 IEEE . IEEE Xplore Digital Library, Monterey, CA, pp. 262-266. ISBN 978-1-4244-8896-4 (doi:10.1109/NMDC.2010.5652157)

Tilford, T., Morris, J.E., Ferenets, M., Rajaguru, P.R. ORCID: https://orcid.org/0000-0002-6041-0517, Pavuluri, S., Desmulliez, M.P.Y. and Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879 (2010) Numerical analysis of polymer cure kinetics in isotropic conductive adhesives. In: 33rd International Spring Seminar on Electronics Technology (ISSE), 2010. Polymer Electronics and Nanotechnologies: Towards System Integration . IEEE Xplore, Sovereign House, London, N3 1QB, UK, pp. 412-416. ISBN 978-1-4244-7849-1 (print), 978-1-4244-7850-7 (e-ISBN) (doi:10.1109/ISSE.2010.5547360)

Pavuluri, S.K., Tilford, T., Goussetis, G., Desmulliez, M.P.Y., Ferenets, M., Adamietz, R., Eicher, F. and Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879 (2010) Advances in the design and test of a novel open ended microwave oven. In: Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2010. IEEE Computer Society, Piscataway, USA, pp. 247-252. ISBN 9781424466368 (Print), 9782355000119 (Online)

Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879, Lee, Y., Lu, H. ORCID: https://orcid.org/0000-0002-4392-6562, Strusevich, N. and Yin, C. ORCID: https://orcid.org/0000-0003-0298-0420 (2010) Packaging of LED backlights for ruggedised displays. In: International Symposium on Advanced Packaging Materials: Microtech, 2010. APM '10. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 98-101. ISBN 9781424467563 (doi:10.1109/ISAPM.2010.5441377)

Tilford, T., Ferenets, M., Adamietz, R., Pavuluri, S., Morris, J.E., Desmulliez, M.P.Y. and Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879 (2010) Numerical analysis of microwave-assisted encapsulation processes for ball grid array packages. In: International Microwave Power Institute’s 44th Annual Symposium: 2010 Proceedings. International Microwave Power Institute (IMPI), Mechanicsville, VA, USA, pp. 30-35. ISSN 1070-0129

Musallam, M., Johnson, C.M., Yin, Chunyan ORCID: https://orcid.org/0000-0003-0298-0420, Lu, Hua ORCID: https://orcid.org/0000-0002-4392-6562 and Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879 (2009) Real-time comparison of power module failure modes under in-service conditions. In: 2009 13th European Conference on Power Electronics and Applications, EPE '09. Institute of Electrical and Electronic Engineers, Inc, Piscataway, NJ, USA, pp. 1-10. ISBN 978-90-75815-13-9 (electronic), 978-1-4244-4432-8 (print)

Yek, Bing Lee, Strusevich, N., Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879, Chun-Yan, Yin and Cartwright, C. (2009) Packaging of light emitting diodes for display backlights: Need for multi-disciplinary design tools. In: Electronic Packaging Technology & High Density Packaging, 2009. Institute of Electrical and Electronic Engineers, Inc, Piscataway, NJ, USA, pp. 205-208. ISBN 978-1-4244-4659-9 (online), 978-1-4244-4658-2 (print) (doi:10.1109/ICEPT.2009.5270764)

Lu, Hua ORCID: https://orcid.org/0000-0002-4392-6562 and Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879 (2009) Lifetime prediction of an IGBT power electronics module under cyclic temperature loading conditions. In: Electronic Packaging Technology & High Density Packaging, 2009. ICEPT-HDP '09. International Conference on. Institute of Electrical and Electronics Engineers, Piscataway, NJ USA, pp. 274-279. ISBN 9781424446582 (print), 9781424446599 (doi:10.1109/ICEPT.2009.5270749)

Morris, J.E., Tilford, T. ORCID: https://orcid.org/0000-0001-8307-6403, Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879, Sinclair, K.I. and Desmulliez, M.P.Y. (2009) Polymer cure modeling for microelectronics applications. In: 32nd International Spring Seminar on Electronics Technology, 2009. ISSE 2009. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA. ISBN 978-1-4244-4260-7 (print) (doi:10.1109/ISSE.2009.5206929)

Mallik, A., Stoyanov, S. ORCID: https://orcid.org/0000-0001-6091-1226, Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879 and Firth, P. (2009) Design for reliability methodology for micro laser welding of pigtail fibres. In: Thermal, Mechanical and Multi-Physics simulation and Experiments in Microelectronics and Microsystems. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 1-7. ISBN 978-1-4244-4161-7 (electronic), 978-1-4244-4160-0 (print) (doi:10.1109/ESIME.2009.4938409)

Lee, Yek Bing, Strusevich, N., Yan-Yin, Chun and Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879 (2009) Analysis tools for thermal characterization, performance and reliability of rugged electronic displays. In: ISSE 2009: 32nd International Spring Seminar on Electronics Technology: Hetero System Integration, the path to New Solutions in the Modern Electronics - Conference Proceedings. Institute of Electrical and Electronics Engineers, Piscataway, NJ, USA, pp. 1-5. ISBN 978-1-4244-4260-7 (doi:10.1109/ISSE.2009.5206926)

Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879, Lu, H. ORCID: https://orcid.org/0000-0002-4392-6562, Tilford, T. ORCID: https://orcid.org/0000-0001-8307-6403, Rizvi, J. and Yin, C. ORCID: https://orcid.org/0000-0003-0298-0420 (2009) Co-design and multi-physics analysis for power electronic modules. In: 2009 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2009. IEEE Computer Society, Piscataway, NJ USA. ISBN 9781424441600 (doi:10.1109/ESIME.2009.4938505)

Tang, Ying Kit, Stoyanov, S. ORCID: https://orcid.org/0000-0001-6091-1226, Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879 and Chan, Y.C. (2008) Uncertainty analysis to minimise risk in designing micro-electronics manufacturing processes. In: 2nd Electronics System-Integration Technology Conference, 2008. ESTC 2008. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 941-946. ISBN 978-1-4244-2814-4 (Print), 978-1-4244-2813-7 (Electronic) (doi:10.1109/ESTC.2008.4684478)

Yin, C.Y. ORCID: https://orcid.org/0000-0003-0298-0420, Lu, H. ORCID: https://orcid.org/0000-0002-4392-6562, Musallam, M., Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879 and Johnson, C. M. (2008) A prognostic assessment method for power electronics modules. In: 2nd Electronics System-Integration Technology Conference, 2008. ESTC 2008. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 1353-1358. ISBN 978-1-4244-2814-4 (Print), 978-1-4244-2813-7 (Online) (doi:10.1109/ESTC.2008.4684552)

Tang, Y.K., Stoyanov, S. ORCID: https://orcid.org/0000-0001-6091-1226, Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879 and Chan, Y.C. (2008) Optimisation methodology for risk mitigation in advanced micro-system electronics manufacturing. In: EngOpt 2008 - International Conference on Engineering Optimization. Universidade Federal do Rio de Janeiro, Rio de Janeiro, Brazil. ISBN 978-85-7650-152-7

Tilford, T., Parrott, A.K., Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879 and Pericleous, K.A. ORCID: https://orcid.org/0000-0002-7426-9999 (2008) Multiphysics simulation of microwave processing using a multidomain coupled solver approach. In: 8th World Congress on Computational Mechanics (WCCM8) and 5th European Congress on Computational Methods in Applied Sciences and Engineering (ECCOMAS 2008). International Center for Numerical Methods in Engineering (CIMNE), Barcelona, Spain. ISBN 978-84-96736-55-9

Tilford, T., Sinclair, K.I., Goussetis, G., Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879, Desmulliez, M.P.Y., Parrott, A.K. and Sangster, A.J. (2008) Numerical analysis of thermal stresses induced during VFM encapsulant curing. In: 31st International Spring Seminar on Electronics Technology, 2008. ISSE '08. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 348-353. ISBN 978-1-4244-3972-0 (doi:10.1109/ISSE.2008.5276666)

Tilford, T., Sinclair, K.I., Goussetis, G., Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879, Desmulliez, M.P.Y., Parrott, A.K. and Sangster, A.J. (2008) Numerical simulation of encapsulant curing within a variable frequency microwave processing system. In: Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems, 2008. EuroSimE 2008. International Conference on. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 447-454. ISBN 978-1-4244-2127-5 (doi:10.1109/ESIME.2008.4525086)

Sinclair, K.I., Tilford, T., Desmulliez, M.Y.P., Goussetis, G., Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879, Parrott, K. and Sangster, A.J. (2008) Open ended microwave oven for packaging. In: Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, 2008 (MEMS/MOEMS 2008). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 16-20. ISBN 978-2-3550-0006-5 (doi:10.1109/DTIP.2008.4752943)

Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879 (2008) Thermal management technologies for electronic packaging: current capabilities and future challenges for modelling tools. In: 2008 10th Electronics Packaging Technology Conference (EPTC 2008) [Conference Proceedings]. Institute of Electrical and Electronics Engineers, Inc., Piscataway, N.J., USA, pp. 527-532. ISBN 9781424421176 (doi:10.1109/EPTC.2008.4763487)

Yin, C.Y, ORCID: https://orcid.org/0000-0003-0298-0420, Lu, H. ORCID: https://orcid.org/0000-0002-4392-6562, Musallam, M., Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879 and Johnson, C.M. (2008) A physics-of-failure based prognostic method for power modules. In: 10th Electronics Packaging Technology Conference (EPTC 2008). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 1190-1195. ISBN 9781424421176 (doi:10.1109/EPTC.2008.4763591)

Rizvi, M.J., Yin, C.Y ORCID: https://orcid.org/0000-0003-0298-0420, Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879 and Lu, H. ORCID: https://orcid.org/0000-0002-4392-6562 (2007) Performance and reliability of flexible substrates when subjected to lead-free processing. In: 16th European Microelectronics and Packaging Conference and Exhibition 2007(EMPC 2007). Curran Associates, Inc., Red Hook, NY, USA, pp. 589-594. ISBN 9781622764662

Stoyanov, S. ORCID: https://orcid.org/0000-0001-6091-1226, Mason, P. and Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879 (2006) Computational methodology for analysis of historic composite structures. In: Proceedings of the 5th International Conference on Engineering Computational Technology. Civil-Comp Press, Stirlingshire, UK. ISBN 1905088116 ISSN 1759-3433 (doi:10.4203/ccp.84.132)

Stoyanov, S. ORCID: https://orcid.org/0000-0001-6091-1226, Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879, Saxena, N. and Adams, S. (2005) Optimising the wave soldering process for lead free solders. In: Proceeding of 2005 International Conference on Asian Green Electronics - Design for Manufacturability and Reliability - (2005 AGEC). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 125-128. ISBN 0780388062 (doi:10.1109/AGEC.2005.1452331)

Dhinsa, K., Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879 and Pericleous, K. ORCID: https://orcid.org/0000-0002-7426-9999 (2005) Turbulence modelling for electronic cooling: A review. In: International Symposium on Electronics Materials and Packaging, EMPAS 2005. Institute of Electrical and Electronics Engineers Inc, Piscataway, USA, pp. 275-281. ISBN 1-4244-0107-0

Yin, C.Y. ORCID: https://orcid.org/0000-0003-0298-0420, Lu, H. ORCID: https://orcid.org/0000-0002-4392-6562, Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879 and Chan, Y.C. (2004) Effects of reflow process on the reliability of flip chip on flex interconnections using anisotropic conductive adhesives. In: 2004 International IEEE Conference on Asian Green Electronics (AGEC) [Proceedings]. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 240-245. ISBN 0-7803-8203-X (doi:10.1109/AGEC.2004.1290912)

Dhinsa, K., Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879 and Pericleous, K. ORCID: https://orcid.org/0000-0002-7426-9999 (2004) Investigation into the performance of turbulence models for fluid flow and heat transfer phenomena in electronic applications. In: 2004 Proceedings, Twentieth IEEE Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM). Institute of Electrical and Electronics Engineers, Inc,, Piscataway, NJ, USA, pp. 278-285. ISBN 078038363X ISSN 1065-2221 (doi:10.1109/STHERM.2004.1291335)

Stoyanov, S. ORCID: https://orcid.org/0000-0001-6091-1226, Mackay, W., Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879, Jibb, D. and Gregson, C. (2004) Lifetime assessment of electronic components for high reliability aerospace applications. In: Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 324-329. ISBN 0780388216 (doi:10.1109/EPTC.2004.1396627)

Dhinsa, K., Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879 and Pericleous, K. ORCID: https://orcid.org/0000-0002-7426-9999 (2004) Low Reynolds number turbulence models for accurate thermal simulations of electronic components. In: Proceedings of the 5th International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems EuroSimE 2004. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 483-490. ISBN 0780384202 (doi:10.1109/ESIME.2004.1304081)

Stoyanov, S. ORCID: https://orcid.org/0000-0001-6091-1226, Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879, Saxena, N. and Adams, S. (2004) Modelling the wave soldering process. In: Proceedings of the 6th International Conference on Electronics Materials and Packaging (EMAP 2004). Institute of Electrical and Electronics Engineers, pp. 553-558. ISBN 983251486X

Gwyer, D., Misselbrook, P., Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879, Conway, P.P. and Williams, K. (2004) Polymer waveguide and VCSEL array multi-physics modelling for OECB based optical backplanes [opto-electrical circuit boards]. In: Proceedings of the 5th International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems EuroSimE 2004. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 399-406. ISBN 0780384202 (doi:10.1109/ESIME.2004.1304070)

Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879, Stoyanov, S. ORCID: https://orcid.org/0000-0001-6091-1226 and Lu, H. ORCID: https://orcid.org/0000-0002-4392-6562 (2004) Reliability predictions for high density packaging. In: Proceeding of The Sixth IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis (HDP'04). Institute of Electrical and Electronics Engineers, Inc., Piscataway, N.J., U.S.A., pp. 121-128. ISBN 0780386205 (doi:10.1109/HPD.2004.1346684)

Desmulliez, M.P.Y., Kay, R.W., Stoyanov, S. ORCID: https://orcid.org/0000-0001-6091-1226 and Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879 (2004) Stencil printing at sub-100 microns pitch. In: Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 354-358. ISBN 0780388216 (doi:10.1109/EPTC.2004.1396633)

Desmulliez, M.P.Y., Kay, R.W., Stoyanov, S. ORCID: https://orcid.org/0000-0001-6091-1226 and Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879 (2004) Stencil printing at sub-100 microns pitch. In: Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 354-358. ISBN 0780388216 (doi:10.1109/EPTC.2004.1396633)

Gwyer, D., Misselbrook, P., Philpott, D., Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879, Conway, P.P. and Williams, K. (2004) Thermal, mechanical and optical modelling of VCSEL packaging. In: The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena In Electronic Systems (ITHERM 2004) [Proceedings]. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 405-410. ISBN 0780383575 ISSN 1089-9870 (doi:10.1109/ITHERM.2004.1318311)

Dhinsa, K., Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879 and Pericleous, K. ORCID: https://orcid.org/0000-0002-7426-9999 (2003) Accuracy of turbulence models and CFD for thermal characterisation of electronic systems. In: Proceedings of 5th Conference Electronics Packaging Technology (EPTC 2003). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 507-512. ISBN 0780382056 (doi:10.1109/EPTC.2003.1271573)

Patel, M.K., Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879, Djambazov, G. ORCID: https://orcid.org/0000-0001-8812-1269, Shrimpton, J. and Jalili, V. (2003) Application of CFD in vacuum dezincing process. In: The 3rd International Conference on CFD in the Minerals and Process Industries [Proceedings]. CSIRO Publishing, Collingwood, Victoria, Australia, pp. 313-318. ISBN 978064309038X

Yin, C.Y. ORCID: https://orcid.org/0000-0003-0298-0420, Lu, H. ORCID: https://orcid.org/0000-0002-4392-6562, Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879 and Chan, Y.C. (2003) Experimental and modeling analysis of the reliability of the anisotropic conductive films. In: 2003 Proceedings 53rd Electronic Components & Technology Conference. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 698-702. ISBN 0780377915 ISSN 0569-5503 (doi:10.1109/ECTC.2003.1216359)

Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879 (2003) Exploiting virtual prototyping for reliability assessment. In: Proceedings of International IEEE Conference on the Business of Product Reliability and Liability. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 2-8. ISBN 078039853X

Gwyer, D., Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879, Pericleous, K. ORCID: https://orcid.org/0000-0002-7426-9999, Philpott, D. and Misselbrook, P. (2003) Modelling the assembly and performance of optoelectronic packages. In: Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-electronics and Micro-systems. Proceedings of EuroSimE 2003. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 77-85. ISBN 0780370546

Stoyanov, S. ORCID: https://orcid.org/0000-0001-6091-1226 and Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879 (2003) Optimization and finite element analysis for reliable electronic packaging. In: Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-electronics and Micro-systems. Proceedings of EuroSimE 2003. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 391-399. ISBN 0780370546

Dhinsa, K., Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879 and Pericleous, K. ORCID: https://orcid.org/0000-0002-7426-9999 (2003) Turbulence modelling and its effects on electronic systems. In: Turbulence, Heat and Mass Transfer 4. Begell House, New York, USA. Oxfordshire, UK, pp. 625-632. ISBN 1567001963

Stoyanov, S. ORCID: https://orcid.org/0000-0001-6091-1226, Kay, R., Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879, Desmuilliez, M. and Hendriksen, M. (2003) Ultra-fine pitch flip-chip assembly using isotropic conductive adhesives. In: Proceedings of 5th Electronics Packaging Technology Conference (EPTC 2003). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 797-802. ISBN 0780382056 (doi:10.1109/EPTC.2003.1271627)

Gwyer, D., Misselbrook, P., Philpott, D., Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879, Conway, P. and Williams, K. (2003) VCSEL to waveguide coupling for optical backplanes. In: Proceedings of 5th Conference Electronics Packaging Technology (EPTC 2003). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 641-646. ISBN 0780382056 (doi:10.1109/EPTC.2003.1271597)

Grossman, D., Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879, Pericleous, K. ORCID: https://orcid.org/0000-0002-7426-9999 and Slone, A. (2002) Computational modelling of blood flow and artery wall interaction. In: FEM Workshop 2002 [Proceedings]. University of Ulm, Germany, Ulm, Germany, pp. 88-94. ISBN 39806183558

Glinski, G.P. and Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879 (2002) Microwave cure of conductive adhesives for flip-chip & microsystems applications. In: ITHERM 2002. The Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems [Proceedings]. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, U.S.A., pp. 848-853. ISBN 0780371526 ISSN 1089-9870 (doi:10.1109/ITHERM.2002.1012543)

Edussuriya, S.S., Williams, A.J. and Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879 (2002) A CFD study of the underfill encapsulation process in flip-chip packaging using the Oldroyd-B model. In: Proceedings of the 6th European Conference of Rheology, (eurheo 2002). LSP, Institute of Polymer Materials, Erlangen-Nuremberg, Germany, pp. 285-286.

Gwyer, D., Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879, Pericleous, K. ORCID: https://orcid.org/0000-0002-7426-9999, Philpott, D. and Misselbrook, P. (2002) Mathematical modelling: a laser soldering process for an optoelectronics butterfly package. In: ITHERM 2002. The Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems [Proceedings]. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 121-127. ISBN 0780371526 ISSN 1089-9870 (doi:10.1109/ITHERM.2002.1012447)

Lu, H. ORCID: https://orcid.org/0000-0002-4392-6562 and Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879 (2002) Predicting optimal process conditions for flip-chip aassembly using copper column bumped dies. In: Proceedings of 4th Electronics Packaging Technology Conference (EPTC 2002). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 338-343. ISBN 0780374355 (doi:10.1109/EPTC.2002.1185694)

Lu, H. ORCID: https://orcid.org/0000-0002-4392-6562 and Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879 (2002) Predicting the relationship between reliability and geometric parameters of cu column bumped flip-chips. In: The Fifth International IEEE Symposium on High Density Packaging and Component Failure Analysis in Electronics Manufacturing [Proceedings]. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 85-89. ISBN 078039822X

Stoyanov, S. ORCID: https://orcid.org/0000-0001-6091-1226 and Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879 (2002) Response Surface Modeling and Optimisation for Reliable Electronic Products. In: The Fifth International IEEE Symposium on High Density Packaging and Component Failure Analysis in Electronics Manufacturing. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 49-57. ISBN 0780398238

Williams, A.J., Croft, T.N. and Cross, M. (2001) Computational modelling of metals extrusion and forging processes. In: Computational Modeling of Materials, Minerals and Metals Processing [Conference Proceedings]. The Mineral, Metals and Materials Society (TMS), Warrendale, PA, USA, pp. 481-490. ISBN 0873395131

Pericleous, K.A. ORCID: https://orcid.org/0000-0002-7426-9999 (2001) Computing the dynamic interaction of magnetic fields and turbulent conducting fluids in metals processing. In: Computational Modeling of Materials, Minerals and Metals Processing [Conference Proceedings]. The Mineral, Metals and Materials Society (TMS), Warrendale, PA, USA, pp. 5-22. ISBN 0873395131

Christakis, N., Patel, M.K., Cross, M., Baxter, J., Abou-Chakra, H. and Tüzün, U. (2001) Continuum modelling of granular flows using PHYSICA, a 3-D unstructured, finite-volume code. In: Computational Modeling of Materials, Minerals and Metals Processing [Conference Proceedings]. The Mineral, Metals and Materials Society (TMS), Warrendale, PA, USA, pp. 129-138. ISBN 0873395131

Slone, A.K., Pericleous, K. ORCID: https://orcid.org/0000-0002-7426-9999, Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879 and Cross, M. (2001) Details of an integrated approach to three-dimensional dynamic fluid structure interaction. In: Fluid Structure Interaction. WIT Press, Southampton, UK, pp. 57-66. ISBN 1853128813 ISSN 1353-808x

Slone, A.K., Pericleous, K. ORCID: https://orcid.org/0000-0002-7426-9999, Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879 and Cross, M. (2001) Dynamic fluid-structure interaction using finite volume unstructured mesh procedures. In: European Conference on Computational Fluid Dynamics ECCOMAS CFD 2006 Proceedings. ECCOMAS. ISBN 0905091124

Stoyanov, S. ORCID: https://orcid.org/0000-0001-6091-1226, Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879 and Cross, M. (2001) Integrating computational mechanics and numerical optimization for the design of material properties in electronic packages. In: Computational Modeling of Materials, Minerals and Metals Processing [Conference Proceedings]. The Mineral, Metals and Materials Society (TMS), Warrendale, PA, USA, pp. 551-562. ISBN 0873395131

Slone, A.K., Cross, M., Pericleous, K.A. ORCID: https://orcid.org/0000-0002-7426-9999 and Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879 (2001) A finite volume unstructured mesh approach to dynamic fluid-structure interaction: an assessment of the challenge of flutter analysis. In: Trends in Computational Structural Mechanics. International Center for Numerical Methods in Engineering (CIMNE), Barcelona, Spain, pp. 741-750. ISBN 8489925771

Lu, H. ORCID: https://orcid.org/0000-0002-4392-6562, Stoyanov, S. ORCID: https://orcid.org/0000-0001-6091-1226, Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879, Hung, K.C. and Chan, Y.C. (2001) A modelling and experimental analysis of the no-flow underfill process for flip-chip assembly. In: Proceedings of the 4th International Symposium on Electronic Packaging Technology. Institute of Electrical and Electronics Engineers, Inc., pp. 338-343. ISBN 0780398114

Fallah, N.A., Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879 and Cross, M. (2000) CFD approach for solid mechanics analysis. In: European Congress on Computational Methods in Applied Sciences and Engineering. ECCOMAS 2000. [Proceedings]. ECCOMAS.

Lu, Hua ORCID: https://orcid.org/0000-0002-4392-6562 and Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879 (2000) Material properties, geometry and their effect on the fatigue life of two flip-chip models. In: ITHERM Proceedings. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 65-71. ISBN 0780359127 ISSN 0189-9870 (doi:10.1109/ITHERM.2000.866172)

Wheeler, D. and Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879 (2000) Modelling technology to predict flip-chip assembly. In: ITHERM Proceedings. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 79-85. ISBN 0780359127 ISSN 0189-9870 (doi:10.1109/ITHERM.2000.866174)

Cross, M., Williams, A., Bailey, C., Taylor, G.A., Pericleous, K. ORCID: https://orcid.org/0000-0002-7426-9999 and Croft, T.N. (2000) Towards a comprehensive model of the direct chill casting process. In: Modeling of Casting, Welding and Advanced Solidification Processes IX [Proceedings]. Shaker, Aachen, Germany, pp. 713-720. ISBN 3826572300

McManus, K., Cross, M., Walshaw, C. ORCID: https://orcid.org/0000-0003-0253-7779, Johnson, S., Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879, Pericleous, K. ORCID: https://orcid.org/0000-0002-7426-9999, Slone, A. and Chow, P. (2000) Virtual manufacturing and design in the real world - implementation and scalability on HPPC systems. In: Parallel Computational Fluid Dynamics 1999: Towards Teraflops, Optimization and Novel Formulations. North-Holland, Amsterdam, The Netherlands, pp. 47-56. ISBN 978044482851 (doi:10.1016/B978-044482851-4.50009-8)

Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879, Cross, M., Pericleous, K. ORCID: https://orcid.org/0000-0002-7426-9999, Taylor, G., Croft, N., Wheeler, D. and Lu, H. ORCID: https://orcid.org/0000-0002-4392-6562 (1999) Finite volume methods for multiphysics problems. In: Finite Volumes for Complex Applications II: Problems and Perspectives. Hermes Science Publications, Paris, France, pp. 585-593. ISBN 978-2746200579

Jalili, V., Patel, M. and Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879 (1999) Numerical modelling of inhaler spacers: A novel study. In: Proceedings of the 3rd Asme/Jsme Joint Fluids Engineering Conference (Fedsm99). American Society of Mechanical Engineers, New York, NY, USA. ISBN 978-0791819616

Jalili, V., Patel, M. and Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879 (1999) A predictive computational fluid dynamics study of carotid artery. In: Proceedings of the 3rd Asme/Jsme Joint Fluids Engineering Conference (Fedsm99). American Society of Mechanical Engineers, New York, NY, USA. ISBN 978-0791819616

Taylor, G., Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879 and Cross, M. (1999) Computational solid mechanics using a vertex-based finite volume method. In: Finite Volumes for Complex Applications II: Problems and Prespectives. Hermes Science Publications, Paris, France, pp. 507-515. ISBN 978-2746200579

Cross, M., Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879, Pericleous, K. ORCID: https://orcid.org/0000-0002-7426-9999, McManus, K., Bounds, S., Moran, G., Taylor, S. and Wheeler, D. (1998) Multi-physics modelling - A vital component of virtual manufacturing. In: AGARD Report 821: Virtual Manufacturing. Advisory Group for Aerospace Research & Development (AGARD), Neuilly-Sur-Seine, France, pp. 13-14. ISBN 92-836-0053-3

Cross, M., Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879, Pericleous, K. ORCID: https://orcid.org/0000-0002-7426-9999, Croft, N., McManus, K., Taylor, G., Bounds, S., Moran, G. and Wheeler, D. (1998) Multi-physics modelling for design optimization and manufacturing on high-performance parallel systems. In: International Conference On Multi-Body Dynamics: New Techniques And Applications. IMechE Conference Transactions, 13 . Institution of Mechanical Engineers, Bury St. Edmunds, UK, pp. 353-363. ISBN 9781860581526

Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879, Cross, M., Lyster, C. and Pericleous, K. ORCID: https://orcid.org/0000-0002-7426-9999 (1997) Multiphysics modelling of materials processing using finite volume unstructured mesh procedures. In: The Mathematics of Finite Elements and Applications: Highlights 1996. Wiley, pp. 285-299. ISBN 978-0471962700

Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879, Norman, P. and Gebreamlak, S. (1997) Computational modelling of defects in fibre optic cables. In: Proceedings of the pacific RIM/ASME international intersociety electronic & photonic packaging conference Interpack '97. The American Society of Mechanical Engineers, New York, NY, US, pp. 621-627. ISBN 0 7918 1559 5

Conference or Conference Paper

Santhakrishnan, M., Tilford, T. ORCID: https://orcid.org/0000-0001-8307-6403 and Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879 (2016) On the Application of Topology Optimisation Techniques to Thermal Management of Microelectronics Systems. In: IEEE EuroSimE conference, 17-20 April, 2016, Montpellier, France.

Tilford, T., Ferenets, M., Morris, J., Rajaguru, P.R. ORCID: https://orcid.org/0000-0002-6041-0517, Pavuluri, S., Desmulliez, M.P.Y. and Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879 (2010) Evaluation of polymer cure models in microelectronics packaging applications. In: International Conference on Electronics Packaging (ICEP2010), 12-14 May 2010, Sapporo, Hokkaido, Japan. (Unpublished)

Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879 (2005) Numerical Modelling for Electronic Packaging - Future Requirements. In: 2005 6th International Conference on Electronic Packaging Technology (ICEPT), 31 Aug - 02 Sep 2005, Shenzhen, China.

Dhinsa, K., Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879 and Pericleous, K. ORCID: https://orcid.org/0000-0002-7426-9999 (2004) Turbulence modelling for thermal management of electronic systems. In: 12th Association of Computational Mechanics in Engineering Annual Conference (ACME 2004), 5-6 April 2004, Cardiff, Wales, UK. (Unpublished)

Glinski, G.P., Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879, Durairaj, R. and Ekere, N.N. (2002) Rheological characterization and multi-scale computational simulations of electrically conductive adhesive flows. In: IMAPS - Europe Cracow 2002, 16-18 June 2002, Cracow, Poland.

Warner, M., Parry, J., Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879, Marooney, C., Reeves, H. and Pericleous, K. ORCID: https://orcid.org/0000-0002-7426-9999 (2001) Flo/Stress: An integrated stress solver for the CFD tool. In: The pacific RlM/ASME International Electronic Packaging Technical Conference and Exhibition, JuIy 8-13 2001, Maui, Hawaii, USA.

Stoyanov, S. ORCID: https://orcid.org/0000-0001-6091-1226, Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879 and Lu, H. ORCID: https://orcid.org/0000-0002-4392-6562 (2001) Optimisation tools for flip-chip design. In: The pacific RlM/ASME International Electronic Packaging Technical Conference and Exhibition, JuIy 8-13 2001, Maui, Hawaii, USA.

Taylor, G., Breiguine, V., Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879 and Cross, M. (2000) An augmented Lagrangian contact algorithm employing a vertex-based finite volume method. In: The 8th Annual Conference of the Association for Computational Mechanics in Engineering (ACME 2000), 16-19 April 2000, University of Greenwich, London, UK.

Glinski, G., Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879 and Pericleous, K. ORCID: https://orcid.org/0000-0002-7426-9999 (2000) A computational fluid dynamics study of the stencil printing process. In: 8th Annual Conference of the Association for Computational Mechanics in Engineering (ACME 2000), 16-19 April 2000, University of Greenwich, London, UK.

Wheeler, D., Lu, H. ORCID: https://orcid.org/0000-0002-4392-6562, Cross, M., Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879 and McManus, K. (1999) Large scale parallel simulations for the assembly of a flip-chip component to a printed circuit. In: The Pacific Rim/ASME International Intersociety Electronic and Photonic Packaging Conference, June 13-19, 1999, Maui, Hawaii.

Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879, Bounds, S., Cross, M., Moran, G., Pericleous, K. ORCID: https://orcid.org/0000-0002-7426-9999 and Taylor, G. A. (1999) Modelling interacting phenomena during the solidification of metals in the casting process. In: Fluid Flow Phenomena in Metals Processing, February 28 - March 4 1999, San Diego, CA, USA.

Pericleous, K. ORCID: https://orcid.org/0000-0002-7426-9999, Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879, Cross, M., Taylor, G., Moran, G. and Bounds, S. (1999) Prediction of defects in steel castings with a multi-physics numerical code. In: 2nd European Conference on Steel Structures - Eurosteel'99, 26 - 29 May 1999, Czech Technical University, Prague, Czech Republic.

Lyster, C., Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879, McManus, K., Addison, C. and Cross, M. (1999) A single-code software model for multiphysics analysis-engine on parallel and distributed computers with the PHYSICA toolkit. In: 11th International Conference on Domain Decomposition Methods in Sciences and Engineering, 1999, Bergen, Norway.

Cross, M., Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879, Pericleous, K. ORCID: https://orcid.org/0000-0002-7426-9999, Bounds, S., Moran, G., Taylo, G. and McManus, K. (1998) Computational modelling of interacting phenomena in the shape casting process. In: Modelling of Casting, Welding and Advanced Solidification Processes - VIII, June 7–12, 1998, San Diego, CA, USA.

Taylor, G. A., Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879 and Cross, M. (1998) A three dimensional finite volume approach to the thermo-mechanical modelling of the shape casting of metals. In: Modelling of Casting, Welding and Advanced Solidification Processes - VIII, June 7–12, 1998, San Diego, CA, USA.

Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879, Taylor, G., Bounds, S., Moran, G. and Cross, M. (1997) PHYSICA: A multiphysics computational framework and its application to casting simulations. In: International Conference on CFD in Mineral and Metal Processing and Power Generation (CSIRO) 1997, 3 - 4 July 1997, Melbourne, Australia.