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Large scale parallel simulations for the assembly of a flip-chip component to a printed circuit

Large scale parallel simulations for the assembly of a flip-chip component to a printed circuit

Wheeler, D., Lu, H. ORCID: 0000-0002-4392-6562, Cross, M., Bailey, C. ORCID: 0000-0002-9438-3879 and McManus, K. (1999) Large scale parallel simulations for the assembly of a flip-chip component to a printed circuit. In: The Pacific Rim/ASME International Intersociety Electronic and Photonic Packaging Conference, June 13-19, 1999, Maui, Hawaii.

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Abstract

Abstract not available

Item Type: Conference or Conference Paper (Paper)
Pre-2014 Departments: School of Computing & Mathematical Sciences
Last Modified: 20 Mar 2019 11:54
Selected for GREAT 2016: None
Selected for GREAT 2017: None
Selected for GREAT 2018: None
Selected for GREAT 2019: None
URI: http://gala.gre.ac.uk/id/eprint/268

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