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Jump to: . | ACF, failure, contact resistance, ageing, computer modelling | AMLCD, thermo-mechanics, optical performance | Advanced packaging and integration technologies; modelling methodologies | Ball Grid Arrays (BGAs), solder isothermal fatigue failure, 96.5Sn3.0Ag0.5Cu lead-free solder, concave joints | Damage; Fatigue; Solder joint; Power electronic module | Electromigration; Thermomigration; Modelling; Solder material; Thin film | LED driver, LIGBT | LED, Lateral IGBT, Underfill | LED, UNDERFILL | LIGBT; LED; fatigue; underfill | Micro-electronic displays, thermo-mechanics, amlcd, active matrix liquid crystal display | Monte Carlo calculations, metal–hydrogen systems, nuclear magnetic relaxation | Multiphysics modelling; Press-Pack assembly; Electronic Packaging | Numerical methods, layered structures, plastic strain. | Numerical software, Mapping, Thermo-mechanical analysis, Power cycling, FEA, CFD, ANSYS, Flotherm XT | Power Electronic Module (PEM), predictive reliability, risk assessment | Power electronics, IGBT, Numerical simulation, CFD, FEA, Reliability | Power electronics, reliability, finite element analysis, wire/ribbon bond | Reduced order models, Power module, Kriging, Radial basis, Damage rule | Reliability, Wire/ribbon bond, Power electronics, Power cycling, Thermal cycling, Multi-objective optimization | Stress comparison, silicon carbide, failure analysis, power cycling, life prediction | Surrogate models; Power electronic module; Sensitivity analysis; Finite element analysis | Wettability, Sn-2.8Ag-0.5Cu-1.0Bi, wetting force, contact angle, flux, surface, tension, finite element modeling, intermetallic compounds | X-ray diffraction (XRD), synchrotron, intermetallic compounds (IMCs), lead-free solder, reliability, European Synchrotron Radiation Facility (ESRF) | acoustics, coatings, dispersion, morphology, surface morphology, surface topography, surface treatment | adhesion, strength of materials, ageing (materials), films (states of matter) | adhesive bonding, contact resistance, finite element, analysis, flip-chip devices, integrated circuit, interconnections, integrated circuit reliability, reflow soldering | adhesive, curing, glass transition temperature, loss modulus, storage modulus | adhesives, anisotropic media, finite element analysis, flip-chip devices, integrated circuit interconnections, integrated circuit reliability, reflow soldering, thermal expansion | anisotropic conductive film (ACF), moisture absorption, flip chip on flex | anisotropic conductive film, (ACF), moisture, flip chip technology | anisotropic conductive films, anisotropic magnetoresistance, assembly, conductive adhesives, contact resistance, flip chip, polymer films, semiconductor device modeling, stress, temperature | assembling, circuit reliability, copper, flip-chip devices printed circuit manufacture, reflow soldering, sensitivity analysis | assembly, heating, material properties, temperature distribution, thermal conductivity | atomic diffusions, atomic vacancies, current loadings, EM simulations, multi-physics, void formation | backlight units, design environment, finite element analysis, human vision models, junction temperatures, just-noticeable difference, key parameters, LED backlighting devices , multi-disciplinary analysis, multi-physics, optical performance, optical simulation, ray tracing calculations, solid state lighting, solid state lighting systems, viewability | ball grid arrays, flip-chip devices, packaging, semiconductor device reliability | ball shear test, bond strength, ball grid array (BGA), solder interface strength, Finite Element Analysis(FEA), intermetallic compound (IMC), fracture propogation path, interfacial reaction phenomena, | bridge circuits, failure analysis, insulated gate bipolar transistors, integrated circuit interconnections, integrated circuit modelling, integrated circuit reliability, modules, plastic deformation, power bipolar transistors, power integrated circuits, semiconductor device, reliability, soldering, physics of failure (PoF) | ceramic packaging, creep, modules, plastic deformation, resistors, solders, stress analysis, surface mount technology, viscoplasticity | chip-on-flex (COF), anisotropic conductive film (ACF), finite element modelling, stress, conductive particle, contact resistance, life-time | computational mechanics, design, electronic components | computer based simulation, electro-thermal design, electrothermal design, power converters, power electronics components, power electronics devices, thermal management | computer simulation, crystal orientation, crystal structure, crystal symmetry, crystals, demagnetization, integration, iron, magnetization, mathematical models, mathematical techniques, metallic films, domain walls, flux symmetries, iron films, micromagnetic simulation, stable equilibrium structures, magnetic domains | computer simulation, curing, delamination, fatigue of materials, interfaces (materials), microelectronic processing, soldered joints; X ray microscopes, scanning acoustic microscopes, flip chip devices | condensed matter: electrical, magnetic and optical, condensed matter: structural, mechanical & thermal | copper, insulated gate bipolar transistors, multichip modules, reliability, soldering, substrates | copper, modeling, flip-chip devices, lead-free solders | damage, fatigue, solder interconnect, power electronic module | damage, solder joints, computer modelling, flexible circuit board, thermal cycling | data mining, frequency, life estimation, lLifetime estimation, multichip modules, power electronics, predictive models, temperature, thermal degradation, wire | decision support system, electronic product design, numerical modelling | design of experiments methods, key design parameters, LCD displays, optimal design, optimisations, performance data, quadratic response, simulation technique, heatsink | effect of reflow process, contact resistance, anisotropic conductive film (ACF) | electrical connections, modelling, moisture | electro thermal model, inverter, IGBT, power module, circuit simulator, finite element analysis, power electronics | electro-migration, metal migration, thermo-mechanical loading | electro-thermal model, IGBT power module, circuit simulator, finite element analysis, DC-DC converter | electromigration, numerical modeling, finite element method, voids evolution | electromigration, simulation, shunt, solder joint | failure analysis, finite element modeling, fracture mechanics, intermetallic compound, reliability, solder joint | failure analysis, flip-chip devices, integrated circuit modelling, integrated circuit reliability, plastic deformation, thermal expansion, flip chip, reliability, Cu column, modelling | fatigue, flip-chip, modeling, reliability, Coffin-Manson, underfill | finite element analysis methods, failure, solder joint | finite element modelling, matrix, mechanical loading, reinforcement method, reinforcement technique, SAC alloy, second level, solder balls, time to failure, underfilling, vibration test | flexible substrates, lead free applications | flexible substrates, thermo-mechanical, lead free solder | flexible-substrates, Flex-No-Lead project, lead-free soldering | flip chip packaging, Cu columns, computer modelling | flip chip, modelling, reflow, reliability, solder paste, underfill | flip-chip assembly, no-flow underfill materials | fusion approach, failure mechanisms, parameters, bonding, ceramics, condition monitoring, copper, degradation, failure analysis, fatigue, insulated gate bipolar transistors, multichip modules, wire | heterogeneous electronics based systems, higher-density interconnection, miniaturisation, silicon, carbon-nanotubes, interconnection technology | jet impingement cooling system, power electronics modules (PEMs), cooling efficiency, numerical modelling | light emitting diodes (LEDs), thermal management, optical and thermal modelling techniques, luminance, ruggedized electronic display, LED, LCD, backlights | liquid crystal displays, light emitting diodes, display | micro-manufactured, one turn inductor, power supply circuits | microfabricated solenoid inductor, electrodeposition, DC-DC | microinductors, DC-DC, manufacturing processes | microsystems, multiphysics, analytical techniques | minium wires, design engineers, electrical power, industrial partners, modelling tools, power electronics devices, remaining life, semiconductor technology, solder joints, thermal management, thermo-mechanical behaviors, transport systems, wide area | modeling, copper, diffusion, solder | modelling technologies, analysis tools, nano-techology, microsystems, fabrication, packaging, testing | modelling, crack propagation | molecular dynamics, fractures, N-body | molecular dynamics, simulation of fracture, N-body potential | multi-physics, multi-disciplinary design, | multi-physics, multi-scale simulations, computational modelling | multiphysics modeling, level set method, solidification, electronic product assembly | neutron quasi-elastic scattering, disordered solids, Monte Carlo study, metal-hydrogen systems | packaging, reliability, prognostic methods, power electronics | pharmacokinetic model, distributed computing, artificial immune network, numerical inverse Laplace, simplex | power electronic modules (PEMs), globtop, reliability, computer modelling, aluminium, wirebond | power electronic modules, packaging technology, reliability prediction | power electronic modules, prognostics prediction methodology, design-for-reliability, IGBT module, design for manufacture, power module components, reliability prediction techniques, failure based reliability | power electronics modules (PEMs), reliability prediction, prognostic and health management (PHM)systems, Physics-of-failure (PoF) model, Bayesian Networks (BN) | power electronics modules, globtop design, computer modelling, aluminium wirebonds | power electronics modules, solder joint fatigue, reliability | power electronics, data-driven prognostics, insulated gate bipolar transistors, mathematical model, monitoring, physics, predictive models, prognostics and health management | power module, optimization, electric-thermal | prognostic, reliability, power modules, physics-of-failure | reduced order models, power electronic module, life prediction, Kriging, radial basis, microsystems | reduced order models, power electronic module, risk analysis, Particle Swarm Optimisation, Kriging, radial basis | reduced order models, power electronic module, risk analysis, probabilistic optimisation, Kriging, radial basis, microsystems | reliability targets, power modules, wear-out mechanisms, wire-bond lifting, solder degradation, load-induced thermal cycling, real-time thermal models, real-time health management | simulation tools, virtual prototyping environment, classical continuum mechanics (e.g., the finite element method), atomistic mechanics [e.g., classical molecular dynamics (MD)], quantum mechanics (e.g., the density functional method) | solder joint failure, electronic packaging, strain on solder joints | solder joint, intermetallic compound, fracture mechanics | solder, intermetallic, pb-free, BGA, electronic package, stress intensity factor, plastic deformation, butt joints | solder, joints, electronic packaging, wetting, computer modelling | solder, wetting, aging, intermetallic compound layer | soldering, interfacial reactions, intermetallic compounds, growth rate, aging | solders, computer simulation, reliability, materials properties, geometry, flip-chip, design, event history analysis, solder joints, fatigue | surface anisotropy, computer simulation, micromagnetism, ripple structures | thermal modeling, microinductor, DC-DC power converter, | thick film chip resistors, SnPb and SnAgCu (solder alloys), Garofalo equation,Miner's law of linear damage accumulation | vibration, failure, lead-free solders | vibration, model order reduction | vibration, reliability,lead-free solders | wetting, solder, flux, wetting force, contact angle, modeling | x-rays, diffraction experiments
Number of items: 122.

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Rafii-Tabar, H., Lu, Hua ORCID: 0000-0002-4392-6562 and Cross, Mark (1998) Multiscale numerical modelling of crack propagation in two-dimensional metal plate. Materials Science and Technology, 14 (6). pp. 544-548. ISSN 0267-0836 (Print), 1743-2847 (Online) (doi:https://doi.org/10.1179/mst.1998.14.6.544)

ACF, failure, contact resistance, ageing, computer modelling

Rizvi, M.J., Bailey, Christopher ORCID: 0000-0002-9438-3879 and Lu, Hua ORCID: 0000-0002-4392-6562 (2008) Failure mechanisms of ACF joints under isothermal ageing. Microelectronics Journal, 39 (9). pp. 1101-1107. ISSN 0026-2692 (doi:https://doi.org/10.1016/j.mejo.2008.01.045)

AMLCD, thermo-mechanics, optical performance

Lee, Yek, Bailey, Christopher ORCID: 0000-0002-9438-3879, Lu, Hua ORCID: 0000-0002-4392-6562, Riches, Steve, Bartholomew, Martin and Tebbit, Nigel (2006) Analysis of the thermo mechanical effects on packaging process of performance enhanced AMLCD's and the optical performance of the display. Proceedings of the 1st Electronics Systemintegration Technology Conference, 2006. IEEE, pp. 1214-1217. ISBN 9781424405527 (doi:https://doi.org/10.1109/ESTC.2006.280164)

Advanced packaging and integration technologies; modelling methodologies

Bailey, Christopher ORCID: 0000-0002-9438-3879, Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 and Lu, Hua ORCID: 0000-0002-4392-6562 (2017) Co-design And Modelling For Advanced Integration And Packaging: Manufacturing And Reliability. Wspc Series In Advanced Integration And Packaging . World Scientific Publishing. ISBN 978-9814740203 ISSN 2315-473X (doi:https://doi.org/10.1142/9900)

Ball Grid Arrays (BGAs), solder isothermal fatigue failure, 96.5Sn3.0Ag0.5Cu lead-free solder, concave joints

Kamara, E., Lu, H. ORCID: 0000-0002-4392-6562, Thomas, O., Di Maio, D., Hunt, C. and Fulton, I. (2012) Modelling and experimental measurement of multiple joint lead free solder interconnects subjected to low cycle mechanical fatigue. In: European Microelectronics and Packaging. Institute of Electrical and Electronics Engineers, Piscataway, NJ, USA, pp. 1-6. ISBN 978-1-4673-0694-2

Damage; Fatigue; Solder joint; Power electronic module

Rajaguru, Pushparajah ORCID: 0000-0002-6041-0517, Lu, Hua ORCID: 0000-0002-4392-6562 and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2015) A time dependent damage indicator model for Sn3.5Ag solder layer in power electronic module. Microelectronics Reliability, 55 (11). pp. 2371-2381. ISSN 0026-2714 (doi:https://doi.org/10.1016/j.microrel.2015.07.047)

Electromigration; Thermomigration; Modelling; Solder material; Thin film

Zhu, X., Kotadia, H., Xu, S., Lu, H. ORCID: 0000-0002-4392-6562, Mannan, S. H., Bailey, C. ORCID: 0000-0002-9438-3879 and Chan, Y. C. (2014) Electromigration in Sn-Ag solder thin films under high current density. Thin Solid Films, 565. pp. 193-201. ISSN 0040-6090 (doi:https://doi.org/10.1016/j.tsf.2014.06.030)

LED driver, LIGBT

Rajaguru, P. ORCID: 0000-0002-6041-0517, Lu, H. ORCID: 0000-0002-4392-6562, Bailey, C. ORCID: 0000-0002-9438-3879, Ortiz-Gonzalez, J. and Alatise, O. (2016) Electro-thermo-mechanical modelling and analysis of the Press Pack Diode in Power Electronics. In: 2015 21st International Workshop on Thermal Investigations of ICs and Systems (THERMINIC). IEEE, pp. 1-6. ISBN 978-1-4673-9706-3 (doi:https://doi.org/10.1109/THERMINIC.2015.7389607)

LED, Lateral IGBT, Underfill

Rajaguru, P. ORCID: 0000-0002-6041-0517, Lu, H. ORCID: 0000-0002-4392-6562, Bailey, C. ORCID: 0000-0002-9438-3879, Castellazzi, A., Pathirana, V., Udugampola, N. and Udrea, F. (2018) Impact of underfill and other physical dimensions on Silicon Lateral IGBT package reliability using computer model with discrete and continuous design variables. Microelectronics Reliability, 83. pp. 146-156. ISSN 0026-2714 (doi:https://doi.org/10.1016/j.microrel.2018.02.024)

LED, UNDERFILL

Rajaguru, P. ORCID: 0000-0002-6041-0517, Bailey, C. ORCID: 0000-0002-9438-3879, Lu, H. ORCID: 0000-0002-4392-6562, Aliyu, A. M., Castellazzi, A., Pathirana, V., Udugampola, N., Trajkovic, T., Udrea, F., Mitcheson, P. D. and Elliott, A. D. T. (2017) Co-design/simulation of flip-chip assembly for high voltage IGBT packages. In: 23rd International workshop on Thermal Investigations of ICs and Systems (THERMINIC). THERMINIC, pp. 1-5.

LIGBT; LED; fatigue; underfill

Bailey, C. ORCID: 0000-0002-9438-3879, Rajaguru, P. ORCID: 0000-0002-6041-0517, Lu, H. ORCID: 0000-0002-4392-6562, Castellazzi, A., Antonini, M., Pathirana, V., Udugampola, N., Udrea, F., Mitchelson, P. D. and Aldhaher, S. (2018) Mechanical modelling of high power lateral IGBT for LED driver applications. In: IEEE Electronic Components and Technology Conference (ECTC). IEEE Electronics Packaging Society (formerly CPMT), pp. 1375-1381. ISBN 978-1-5386-5000-4 ISSN 2377-5726 (Online) (doi:https://doi.org/10.1109/ECTC.2018.00210)

Micro-electronic displays, thermo-mechanics, amlcd, active matrix liquid crystal display

Lee, Yek, Bailey, Christopher ORCID: 0000-0002-9438-3879, Lu, Hua ORCID: 0000-0002-4392-6562, Riches, Steve, Bartholomew, Martin and Tebbit, Nigel (2006) Thermo-mechanical analysis of the packaging process for micro-electronic displays. 7th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2006. EuroSime 2006. IEEE Computer Society, pp. 190-195. ISBN 1 4244 0275 1 (doi:https://doi.org/10.1109/ESIME.2006.1644051)

Monte Carlo calculations, metal–hydrogen systems, nuclear magnetic relaxation

Lu, Hua ORCID: 0000-0002-4392-6562, Zhang, Xiaohong and Titman, J.M. (1997) Measuring distributions of jump rates in disordered metal–hydrogen systems by nuclear magnetic relaxation. Journal of Alloys and Compounds, 253. pp. 425-427. ISSN 0925-8388 (doi:https://doi.org/10.1016/S0925-8388(96)03083-6)

Multiphysics modelling; Press-Pack assembly; Electronic Packaging

Rajaguru, Pushparajah ORCID: 0000-0002-6041-0517, Ortiz-Gonzalez, Jose Angel, Lu, Hua ORCID: 0000-0002-4392-6562, Bailey, Chris ORCID: 0000-0002-9438-3879 and Alatise, Olawiwola (2017) A multiphysics modeling and experimental analysis of pressure contacts in power electronics applications. IEEE Transactions on Components, Packaging and Manufacturing Technology, 7 (6). pp. 893-900. ISSN 2156-3950 (Print), 2156-3985 (Online) (doi:https://doi.org/10.1109/TCPMT.2017.2688021)

Numerical methods, layered structures, plastic strain.

Nwanoro, Kenneth C., Lu, Hua ORCID: 0000-0002-4392-6562, Yin, Chunyan ORCID: 0000-0003-0298-0420 and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2018) An approximate numerical method for the prediction of plastic strain in layered structures. In: 2018 7th Electronic System-Integration Technology Conference (ESTC 2018). IEEE, pp. 181-187. ISBN 978-1538668153

Numerical software, Mapping, Thermo-mechanical analysis, Power cycling, FEA, CFD, ANSYS, Flotherm XT

Nwanoro, Kenneth C., Lu, Hua ORCID: 0000-0002-4392-6562, Yin, Chunyan ORCID: 0000-0003-0298-0420 and Bailey, Chris ORCID: 0000-0002-9438-3879 (2018) Using FloTHERM XT and ANSYS workbench to perform Thermo-Mechanical analysis. Engineering Edge. (In Press)

Power Electronic Module (PEM), predictive reliability, risk assessment

Bailey, C. ORCID: 0000-0002-9438-3879, Lu, H. ORCID: 0000-0002-4392-6562, Yin, C. ORCID: 0000-0003-0298-0420 and Ridout, S. (2008) Predictive reliability, prognostics and risk assessment for power modules. CIPS 2008: 5th International Conference on Integrated Power Electronics Systems. Proceedings, March, 11-13, 2008 Nuremberg/Germany. ETG-Fachbericht (111). VDE Verlag GmbH, Berlin-Offenbach, Germany, pp. 19-26. ISBN 9783800730896

Power electronics, IGBT, Numerical simulation, CFD, FEA, Reliability

Nwanoro, Kenneth Chimezie, Lu, Hua ORCID: 0000-0002-4392-6562, Yin, Chunyan ORCID: 0000-0003-0298-0420 and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2018) Numerical simulation of the junction temperature, the coolant flow rate and the reliability of an IGBT module. In: 2018 24th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC 2018). IEEE, pp. 250-255. ISBN 978-1538667606

Power electronics, reliability, finite element analysis, wire/ribbon bond

Nwanoro, Kenneth Chimezie, Lu, Hua ORCID: 0000-0002-4392-6562, Yin, Chunyan ORCID: 0000-0003-0298-0420 and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2017) Computer simulation of the reliability of wire bonds and ribbon bonds in power electronics modules. In: 2017 23rd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC). IEEE, pp. 1-6. ISBN 978-1-5386-1929-2 ISSN 2474-1523 (Online) (doi:https://doi.org/10.1109/THERMINIC.2017.8233827)

Reduced order models, Power module, Kriging, Radial basis, Damage rule

Rajaguru, Pushparajah ORCID: 0000-0002-6041-0517, Lu, Hua ORCID: 0000-0002-4392-6562 and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2014) Application of nonlinear fatigue damage models in power electronic module wirebond structure under various amplitude loadings. Advances in Manufacturing, 2 (3). pp. 239-250. ISSN 2095-3127 (Print), 2195-3597 (Online) (doi:https://doi.org/10.1007/s40436-014-0054-5)

Reliability, Wire/ribbon bond, Power electronics, Power cycling, Thermal cycling, Multi-objective optimization

Nwanoro, Kenneth, Lu, Hua ORCID: 0000-0002-4392-6562, Yin, Chunyan ORCID: 0000-0003-0298-0420 and Bailey, Chris ORCID: 0000-0002-9438-3879 (2018) An analysis of the reliability and design optimization of aluminium ribbon bonds in power electronics modules using computer simulation method. Microelectronics Reliability, 87. pp. 1-14. ISSN 0026-2714 (doi:https://doi.org/10.1016/j.microrel.2018.05.013)

Stress comparison, silicon carbide, failure analysis, power cycling, life prediction

Lu, Hua ORCID: 0000-0002-4392-6562 and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2017) Failure and reliability analysis of a SiC power module based on stress comparison to a Si device. IEEE Transactions on Device and Materials Reliability, 17 (4). pp. 727-737. ISSN 1530-4388 (doi:https://doi.org/10.1109/TDMR.2017.2766692)

Surrogate models; Power electronic module; Sensitivity analysis; Finite element analysis

Rajaguru, P. ORCID: 0000-0002-6041-0517, Lu, H. ORCID: 0000-0002-4392-6562, Bailey, C. ORCID: 0000-0002-9438-3879, Ortiz-Gonzalez, J. and Alatise, O. (2016) Evaluation of the impact of the physical dimensions and material of the semiconductor chip on the reliability of Sn3.5Ag solder interconnect in power electronic module: A finite element analysis perspective. Microelectronics Reliability, 68. pp. 77-85. ISSN 0026-2714 (doi:https://doi.org/10.1016/j.microrel.2016.12.002)

Wettability, Sn-2.8Ag-0.5Cu-1.0Bi, wetting force, contact angle, flux, surface, tension, finite element modeling, intermetallic compounds

Rizvi, M.J., Chan, Y.C., Bailey, C. ORCID: 0000-0002-9438-3879, Lu, H. ORCID: 0000-0002-4392-6562, Islam, M.N. and Wu, B.Y. (2005) Wetting and Reaction of Sn-2.8Ag-0.5Cu-1.0Bi Solder with Cu and Ni Substrates. IEEE/TMS Journal of Electronic Materials, 34 (8). pp. 1115-1122. ISSN 0361-5235 (Print), 1543-186X (Online) (doi:https://doi.org/10.1007/s11664-005-0239-6)

X-ray diffraction (XRD), synchrotron, intermetallic compounds (IMCs), lead-free solder, reliability, European Synchrotron Radiation Facility (ESRF)

Jackson, Gavin J., Lu, Hua ORCID: 0000-0002-4392-6562, Durairaj, Raj, Hoo, Nick, Bailey, Chris ORCID: 0000-0002-9438-3879, Ekere, Ndy N. and Wright, Jon (2004) Intermetallic phase detection in lead-free solders using synchrotron X-ray diffraction. Journal of Electronic Materials, 33 (12). pp. 1524-1529. ISSN 0361-5235 (Print), 1543-186X (Online) (doi:https://doi.org/10.1007/s11664-004-0094-x)

acoustics, coatings, dispersion, morphology, surface morphology, surface topography, surface treatment

Xu, Sha, Chan, Yan Cheong, Zhu, Xiaoxin, Lu, Hua ORCID: 0000-0002-4392-6562 and Bailey, Chris ORCID: 0000-0002-9438-3879 (2014) Effective method to disperse and incorporate carbon nanotubes in electroless Ni-P deposits. In: 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) Proceedings. Curran Associates, Stoughton, WI, USA, pp. 1342-1347. ISBN 9781479924080 (doi:https://doi.org/10.1109/ECTC.2014.6897466)

adhesion, strength of materials, ageing (materials), films (states of matter)

Rizvi, M.J., Chan, Y.C., Bailey, C. ORCID: 0000-0002-9438-3879, Lu, H. ORCID: 0000-0002-4392-6562 and Sharif, A. (2005) The effect of curing on the performance of ACF bonded chip-on-flex assemblies after thermal ageing. Soldering & Surface Mount Technology, 17 (2). pp. 40-48. ISSN 0954-0911 (doi:https://doi.org/10.1108/09540910510597492)

adhesive bonding, contact resistance, finite element, analysis, flip-chip devices, integrated circuit, interconnections, integrated circuit reliability, reflow soldering

Yin, C.Y. ORCID: 0000-0003-0298-0420, Lu, H. ORCID: 0000-0002-4392-6562, Bailey, C. ORCID: 0000-0002-9438-3879 and Chan, Y.C. (2004) Effects of reflow process on the reliability of flip chip on flex interconnections using anisotropic conductive adhesives. In: 2004 International IEEE Conference on Asian Green Electronics (AGEC) [Proceedings]. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 240-245. ISBN 0-7803-8203-X (doi:https://doi.org/10.1109/AGEC.2004.1290912)

adhesive, curing, glass transition temperature, loss modulus, storage modulus

Rizvi, M.J., Lu, H. ORCID: 0000-0002-4392-6562, Bailey, C. ORCID: 0000-0002-9438-3879, Chan, Y.C., Lee, M.Y. and Pang, C.H. (2007) Role of bonding time and temperature on the physical properties of coupled anisotropic conductive–nonconductive adhesive film for flip chip on glass technology. Microelectronic Engineering, 85 (1). pp. 238-244. ISSN 0167-9317 (doi:https://doi.org/10.1016/j.mee.2007.05.045)

adhesives, anisotropic media, finite element analysis, flip-chip devices, integrated circuit interconnections, integrated circuit reliability, reflow soldering, thermal expansion

Yin, Chunyan ORCID: 0000-0003-0298-0420, Lu, Hua ORCID: 0000-0002-4392-6562, Bailey, Chris ORCID: 0000-0002-9438-3879 and Chan, Yan-Cheong (2004) Effects of solder reflow on the reliability of flip-chip on flex interconnections using anisotropic conductive adhesives. IEEE Transactions on Electronics Packaging Manufacturing, 27 (4). pp. 254-259. ISSN 1521-334X (doi:https://doi.org/10.1109/TEPM.2004.843152)

anisotropic conductive film (ACF), moisture absorption, flip chip on flex

Yin, C.Y. ORCID: 0000-0003-0298-0420, Lu, H. ORCID: 0000-0002-4392-6562, Bailey, C. ORCID: 0000-0002-9438-3879 and Chan, Y.C. (2013) Effects of moisture absorption on anisotropic conductive films interconnection for flip chip on flex applications. Microelectronic Engineering, 107. pp. 17-22. ISSN 0167-9317 (doi:https://doi.org/10.1016/j.mee.2013.02.070)

anisotropic conductive film, (ACF), moisture, flip chip technology

Yin, Chunyan ORCID: 0000-0003-0298-0420, Lu, Hua ORCID: 0000-0002-4392-6562, Bailey, Chris ORCID: 0000-0002-9438-3879 and Chan, Yan-Cheong (2005) Moisture effects on the reliability of ACF interconnections. Electronics World, 111 (1836). pp. 20-24. ISSN 1365-4675

anisotropic conductive films, anisotropic magnetoresistance, assembly, conductive adhesives, contact resistance, flip chip, polymer films, semiconductor device modeling, stress, temperature

Yin, C.Y. ORCID: 0000-0003-0298-0420, Lu, H. ORCID: 0000-0002-4392-6562, Bailey, C. ORCID: 0000-0002-9438-3879 and Chan, Y.C. (2003) Experimental and modeling analysis of the reliability of the anisotropic conductive films. In: 2003 Proceedings 53rd Electronic Components & Technology Conference. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 698-702. ISBN 0780377915 ISSN 0569-5503 (doi:https://doi.org/10.1109/ECTC.2003.1216359)

assembling, circuit reliability, copper, flip-chip devices printed circuit manufacture, reflow soldering, sensitivity analysis

Lu, H. ORCID: 0000-0002-4392-6562 and Bailey, C. ORCID: 0000-0002-9438-3879 (2002) Predicting optimal process conditions for flip-chip aassembly using copper column bumped dies. In: Proceedings of 4th Electronics Packaging Technology Conference (EPTC 2002). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 338-343. ISBN 0780374355 (doi:https://doi.org/10.1109/EPTC.2002.1185694)

assembly, heating, material properties, temperature distribution, thermal conductivity

Tilford, Timothy ORCID: 0000-0001-8307-6403, Cook, A., Lu, H. ORCID: 0000-0002-4392-6562, Ramambasoa, A. and Conseil, F. (2014) Numerical analysis of the performance of highly oriented pyrolytic graphite heat spreader in thermal management of microelectronics assemblies. In: Electronics Systemintegration Technology Conference, 16-18 Sep 2014, Helsinki, Finland. (doi:https://doi.org/10.1109/ESTC.2014.6962815)

atomic diffusions, atomic vacancies, current loadings, EM simulations, multi-physics, void formation

Zhu, Xiaoxin, Kotadia, H., Xu, Sha, Lu, Hua ORCID: 0000-0002-4392-6562, Mannan, S.H., Chan, Y.C. and Bailey, C. ORCID: 0000-0002-9438-3879 (2011) Multi-physics computer simulation of the electromigration phenomenon. In: ICEPT-HDP 2011 Proceedings - 2011 International Conference on Electronic Packaging Technology and High Density Packaging. IEEE Computer Society, Piscataway, USA, pp. 448-452. ISBN 9781457717703 (Print), 9781457717680 (Online) (doi:https://doi.org/10.1109/ICEPT.2011.6066874)

backlight units, design environment, finite element analysis, human vision models, junction temperatures, just-noticeable difference, key parameters, LED backlighting devices , multi-disciplinary analysis, multi-physics, optical performance, optical simulation, ray tracing calculations, solid state lighting, solid state lighting systems, viewability

Bailey, C. ORCID: 0000-0002-9438-3879, Yin, C. ORCID: 0000-0003-0298-0420, Lu, H. ORCID: 0000-0002-4392-6562 and Cartwright, C. (2011) Multi-physics and multi-disciplinary analysis for solid state lighting. In: 2011 12th Int. Conf. on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2011. IEEE Computer Society, Piscataway, USA. ISBN 9781457701078 (doi:https://doi.org/10.1109/ESIME.2011.5765859)

ball grid arrays, flip-chip devices, packaging, semiconductor device reliability

Bailey, C. ORCID: 0000-0002-9438-3879, Stoyanov, S. ORCID: 0000-0001-6091-1226 and Lu, H. ORCID: 0000-0002-4392-6562 (2004) Reliability predictions for high density packaging. In: Proceeding of The Sixth IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis (HDP'04). Institute of Electrical and Electronics Engineers, Inc., Piscataway, N.J., U.S.A., pp. 121-128. ISBN 0780386205 (doi:https://doi.org/10.1109/HPD.2004.1346684)

ball shear test, bond strength, ball grid array (BGA), solder interface strength, Finite Element Analysis(FEA), intermetallic compound (IMC), fracture propogation path, interfacial reaction phenomena,

Alam, M. O., Lu, Hua ORCID: 0000-0002-4392-6562, Bailey, Christopher ORCID: 0000-0002-9438-3879, Chan, Y.C. and Wu, B.Y. (2007) Shear strength analysis of ball grid array (BGA) solder interfaces. In: Vaidyanathan, K., Tee, T.Y. and Lee, T.K., (eds.) 2007 9th Electronics Packaging Technology Conference. Electronics Packaging Technology Conference Proceedings . Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 770-773. ISBN 9781424413249 (doi:11.1109/EPTC.2007.4469797)

bridge circuits, failure analysis, insulated gate bipolar transistors, integrated circuit interconnections, integrated circuit modelling, integrated circuit reliability, modules, plastic deformation, power bipolar transistors, power integrated circuits, semiconductor device, reliability, soldering, physics of failure (PoF)

Yin, C.Y, ORCID: 0000-0003-0298-0420, Lu, H. ORCID: 0000-0002-4392-6562, Musallam, M., Bailey, C. ORCID: 0000-0002-9438-3879 and Johnson, C.M. (2008) A physics-of-failure based prognostic method for power modules. In: 10th Electronics Packaging Technology Conference (EPTC 2008). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 1190-1195. ISBN 9781424421176 (doi:https://doi.org/10.1109/EPTC.2008.4763591)

ceramic packaging, creep, modules, plastic deformation, resistors, solders, stress analysis, surface mount technology, viscoplasticity

Warner, Matt, Parry, John, Bailey, Chris ORCID: 0000-0002-9438-3879 and Lu, Hua ORCID: 0000-0002-4392-6562 (2004) Solder life prediction in a thermal analysis software environment. In: The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena In Electronic Systems (ITHERM 2004) [Proceedings]. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 391-396. ISBN 0780383575 ISSN 1089-9870 (doi:https://doi.org/10.1109/ITHERM.2004.1318309)

chip-on-flex (COF), anisotropic conductive film (ACF), finite element modelling, stress, conductive particle, contact resistance, life-time

Rizvi, M.J., Bailey, Christopher ORCID: 0000-0002-9438-3879, Chan, Y.C. and Lu, Hua ORCID: 0000-0002-4392-6562 (2006) Effects of thermal cycling profiles on the performance of chip-on-flex assembly using anisotropic conductive films. Thermal and Thermomechanical Phenomena in Electronics Systems, 2006. ITHERM '06. The Tenth Intersociety Conference on. IEEE, pp. 855-860. ISBN 0780395247 (doi:https://doi.org/10.1109/ITHERM.2006.1645436)

computational mechanics, design, electronic components

Stoyanov, S. ORCID: 0000-0001-6091-1226, Bailey, C. ORCID: 0000-0002-9438-3879, Lu, H. ORCID: 0000-0002-4392-6562 and Cross, M. (2002) Integrated computational mechanics and optimization for design of electronic components. In: Parmee, Ian C. and Hajela, Prabhat, (eds.) Optimization In Industry. Springer Verlag, pp. 57-71. ISBN 9781852338342

computer based simulation, electro-thermal design, electrothermal design, power converters, power electronics components, power electronics devices, thermal management

Shahjalal, Mohammad, Lu, Hua ORCID: 0000-0002-4392-6562 and Bailey, Chris ORCID: 0000-0002-9438-3879 (2014) A review of the computer based simulation of electro-thermal design of power electronics devices. In: 20th International Workshop on Thermal Investigations of ICs and Systems. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA. ISBN 9781479954155 (doi:https://doi.org/10.1109/THERMINIC.2014.6972515)

computer simulation, crystal orientation, crystal structure, crystal symmetry, crystals, demagnetization, integration, iron, magnetization, mathematical models, mathematical techniques, metallic films, domain walls, flux symmetries, iron films, micromagnetic simulation, stable equilibrium structures, magnetic domains

Lu, Hua ORCID: 0000-0002-4392-6562, Bishop, J.E.L. and Tucker, J.W. (1996) Micromagnetic simulation of domain walls in iron films. Journal of Magnetism and Magnetic Materials, 155 (1-3). pp. 49-51. ISSN 0304-8853 (doi:https://doi.org/10.1016/0304-8853(95)00665-6)

computer simulation, curing, delamination, fatigue of materials, interfaces (materials), microelectronic processing, soldered joints; X ray microscopes, scanning acoustic microscopes, flip chip devices

Lu, H. ORCID: 0000-0002-4392-6562, Hung, K.C., Stoyanov, S. ORCID: 0000-0001-6091-1226, Bailey, C. ORCID: 0000-0002-9438-3879 and Chan, Y.C. (2002) No-flow underfill flip chip assembly–an experimental and modeling analysis. Microelectronics Reliability, 42 (8). pp. 1205-1212. ISSN 0026-2714 (doi:https://doi.org/10.1016/S0026-2714(02)00092-6)

condensed matter: electrical, magnetic and optical, condensed matter: structural, mechanical & thermal

Lu, Hua ORCID: 0000-0002-4392-6562, Zhang, Xiaohong and Titman, J.M. (1997) Rotating-frame nuclear magnetic relaxation of spins diffusing on a disordered lattice: a Monte Carlo model. Journal of Physics: Condensed Matter, 9 (42). pp. 9097-9111. ISSN 0953-8984 (Print), 1361-648X (Online) (doi:https://doi.org/10.1088/0953-8984/9/42/022)

copper, insulated gate bipolar transistors, multichip modules, reliability, soldering, substrates

Newcombe, D.R., Chamund, Dinesh, Bailey, Christopher ORCID: 0000-0002-9438-3879 and Lu, Hua ORCID: 0000-0002-4392-6562 (2010) Reliability metrics for IGBT power modules. In: Proceedings - 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2010. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 670-674. ISBN 9781424481408 (doi:https://doi.org/10.1109/ICEPT.2010.5582869)

copper, modeling, flip-chip devices, lead-free solders

Lu, Hua ORCID: 0000-0002-4392-6562 and Bailey, Chris ORCID: 0000-0002-9438-3879 (2003) Modelling the performance of lead-Free solder interconnects for copper bumped flip-chip devices. In: ASME 2003 International Electronic Packaging Technical Conference and Exhibition. American Society of Mechanical Engineers, New York, USA, pp. 605-610. ISBN 0-7918-3690-8 (doi:https://doi.org/10.1115/IPACK2003-35356)

damage, fatigue, solder interconnect, power electronic module

Rajaguru, Pushpa ORCID: 0000-0002-6041-0517, Lu, Hua ORCID: 0000-0002-4392-6562 and Bailey, Chris ORCID: 0000-0002-9438-3879 (2019) Time integration damage model for Sn3.5Ag solder interconnect in power electronic module. IEEE Transactions on Device and Materials Reliability, 19 (1). ISSN 1530-4388 (Print), 1558-2574 (Online) (doi:https://doi.org/10.1109/TDMR.2019.2891949)

damage, solder joints, computer modelling, flexible circuit board, thermal cycling

Rizvi, M.J., Bailey, C. ORCID: 0000-0002-9438-3879 and Lu, H. ORCID: 0000-0002-4392-6562 (2010) Damage predictions in a chip resistor solder joint on flexible circuit board. Microelectronic Engineering, 87 (10). pp. 1889-1895. ISSN 0167-9317 (doi:https://doi.org/10.1016/j.mee.2009.11.023)

data mining, frequency, life estimation, lLifetime estimation, multichip modules, power electronics, predictive models, temperature, thermal degradation, wire

Musallam, Mahera, Johnson, C. Mark, Yin, Chunyan ORCID: 0000-0003-0298-0420, Lu, Hua ORCID: 0000-0002-4392-6562 and Bailey, Chris ORCID: 0000-0002-9438-3879 (2008) Real-time life expectancy estimation in power modules. In: 2nd Electronics System Integration Technology Conference, Greenwich, UK. IEEE Conference Publications, 1 . Institute of Electrical and Electronics Engineers, Inc, Piscataway, NJ, USA, pp. 231-236. ISBN 978-1-4244-2813-7 (Print), 978-1-4244-2814-4 (Electronic) (doi:https://doi.org/10.1109/ESTC.2008.4684355)

decision support system, electronic product design, numerical modelling

Tang, Y.K., Stoyanov, Stoyan ORCID: 0000-0001-6091-1226, Bailey, Christopher ORCID: 0000-0002-9438-3879 and Lu, Hua ORCID: 0000-0002-4392-6562 (2006) Decision support systems for eco-friendly electronic products. Electronic Materials and Packaging, 2006. EMAP 2006. International Conference on. IEEE, Piscataway, N.J., pp. 77-84. ISBN 1424408342; 9781424408344 (doi:https://doi.org/10.1109/EMAP.2006.4430580)

design of experiments methods, key design parameters, LCD displays, optimal design, optimisations, performance data, quadratic response, simulation technique, heatsink

Lu, Hua ORCID: 0000-0002-4392-6562 and Bailey, C. ORCID: 0000-0002-9438-3879 (2011) Optimisation of heatsink design for a ruggedised LCD display. In: 2011 International Conference on Electronic Packaging Technology & High Density Packaging. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 492-496. ISBN 9781457717703 (doi:https://doi.org/10.1109/ICEPT.2011.6066883)

effect of reflow process, contact resistance, anisotropic conductive film (ACF)

Yin, C.Y. ORCID: 0000-0003-0298-0420, Alam, M.O., Chan, Y.C., Bailey, C. ORCID: 0000-0002-9438-3879 and Lu, Hua ORCID: 0000-0002-4392-6562 (2003) The effect of reflow process on the contact resistance and reliability of anisotropic conductive film interconnection for flip chip on flex applications. Microelectronics Reliability, 43 (4). pp. 625-633. ISSN 0026-2714 (doi:https://doi.org/10.1016/S0026-2714(02)00348-7)

electrical connections, modelling, moisture

Yin, Chunyan ORCID: 0000-0003-0298-0420, Lu, Hua ORCID: 0000-0002-4392-6562, Bailey, Christopher ORCID: 0000-0002-9438-3879 and Chan, Y.C. (2006) Macro-micro modelling of moisture induced stresses in an ACF flip chip assembly. Soldering & Surface Mount Technology, 18 (2). pp. 27-32. ISSN 0954-0911 (doi:https://doi.org/10.1108/09540910610665107)

electro thermal model, inverter, IGBT, power module, circuit simulator, finite element analysis, power electronics

Shahjalal, Mohammad, Lu, Hua ORCID: 0000-0002-4392-6562 and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2017) Electro-thermal modelling of multi chip power modules for high power converter application. In: 2017 18th International Conference on Electronic Packaging Technology (ICEPT), Harbin. IEEE, pp. 940-945. ISBN 978-1-5386-2973-4 (doi:https://doi.org/10.1109/ICEPT.2017.8046599)

electro-migration, metal migration, thermo-mechanical loading

Bailey, C. ORCID: 0000-0002-9438-3879, Zhu, X., Lu, H. ORCID: 0000-0002-4392-6562 and Yin, C. ORCID: 0000-0003-0298-0420 (2012) Modelling metal migration for high reliability components when subjected to thermo-mechanical loading. In: Proceedings of the 2012 IEEE 14th Electronics Packaging Technology Conference. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 474-478. ISBN 9781467345538 (doi:https://doi.org/10.1109/EPTC.2012.6507130)

electro-thermal model, IGBT power module, circuit simulator, finite element analysis, DC-DC converter

Shahjalal, Mohammad, Rishad Ahmed, MD, Lu, Hua ORCID: 0000-0002-4392-6562, Bailey, Chris ORCID: 0000-0002-9438-3879 and Forsyth, Andrew (2020) An analysis of the thermal interaction between components in power converter applications. IEEE Transactions on Power Electronics, 35 (9). pp. 9082-9094. ISSN 0885-8993 (Print), 1941-0107 (Online) (doi:https://doi.org/10.1109/TPEL.2020.2969350)

electromigration, numerical modeling, finite element method, voids evolution

Zhu, X., Kotadia, H., Xu, S., Lu, H. ORCID: 0000-0002-4392-6562, Mannan, S.H., Bailey, C. ORCID: 0000-0002-9438-3879 and Chan, Y.C. (2013) Comments on electromigration analysis methods. In: Proceedings of 14th International Conference on Electronic Packaging Technology (ICEPT 2013). Institute of Electrical and Electronics, Inc., Piscataway, NJ, USA, pp. 529-534. ISBN 9781479904983 (doi:https://doi.org/10.1109/ICEPT.2013.6756527)

electromigration, simulation, shunt, solder joint

Zhu, Xiao, Kotadia, Hiren, Xu, Sha, Lu, Hua ORCID: 0000-0002-4392-6562, Mannan, Samjid, Bailey, Chris ORCID: 0000-0002-9438-3879 and Chan, Yancheong (2013) Modelling electromigration for microelectronics design. Journal of Computational Science and Technology, 7 (2). pp. 251-264. ISSN 1881-6894 (doi:https://doi.org/10.1299/jcst.7.251)

failure analysis, finite element modeling, fracture mechanics, intermetallic compound, reliability, solder joint

Alam, M.O., Lu, Hua ORCID: 0000-0002-4392-6562, Bailey, Chris ORCID: 0000-0002-9438-3879 and Chan, Y.C (2009) Finite-element simulation of stress intensity factors in solder joint intermetallic compounds. IEEE Transactions on Device and Materials Reliability, 9 (1). pp. 40-48. ISSN 1530-4388 (doi:https://doi.org/10.1109/TDMR.2008.2010595)

failure analysis, flip-chip devices, integrated circuit modelling, integrated circuit reliability, plastic deformation, thermal expansion, flip chip, reliability, Cu column, modelling

Lu, Hua ORCID: 0000-0002-4392-6562 and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2002) Computer modelling of the reliability of flip chips with metal column bumping. In: ITHERM 2002. The Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems [Proceedings]. Institute of Electrical and Electronics Engineers, Inc., pp. 967-973. ISBN 0780371526 (doi:https://doi.org/10.1109/ITHERM.2002.1012561)

fatigue, flip-chip, modeling, reliability, Coffin-Manson, underfill

Lu, Hua ORCID: 0000-0002-4392-6562 and Bailey, C. ORCID: 0000-0002-9438-3879 (2000) Material properties, geometry and their effect on the fatigue life of two flip-chip models. In: ITHERM Proceedings. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 65-71. ISBN 0780359127 ISSN 0189-9870 (doi:https://doi.org/10.1109/ITHERM.2000.866172)

finite element analysis methods, failure, solder joint

Lu, Hua ORCID: 0000-0002-4392-6562 and Bailey, C. ORCID: 0000-0002-9438-3879 (2009) Lifetime prediction of an IGBT power electronics module under cyclic temperature loading conditions. In: Electronic Packaging Technology & High Density Packaging, 2009. ICEPT-HDP '09. International Conference on. Institute of Electrical and Electronics Engineers, Piscataway, NJ USA, pp. 274-279. ISBN 9781424446582 (print), 9781424446599 (doi:https://doi.org/10.1109/ICEPT.2009.5270749)

finite element modelling, matrix, mechanical loading, reinforcement method, reinforcement technique, SAC alloy, second level, solder balls, time to failure, underfilling, vibration test

Berthou, M., Lu, H. ORCID: 0000-0002-4392-6562, Retailleau, P., Frémont, H., Guédon-Gracia, A., Davennel, C. and Bailey, C. ORCID: 0000-0002-9438-3879 (2011) Vibration test durability on large BGA assemblies: evaluation of reinforcement techniques. In: 2010 IEEE CPMT Symposium Japan, ICSJ10. IEEE Computer Society, Piscataway, USA, pp. 1-4. ISBN 9781424475933 (doi:https://doi.org/10.1109/CPMTSYMPJ.2010.5679536)

flexible substrates, lead free applications

Yin, Chunyan ORCID: 0000-0003-0298-0420, Lu, Hua ORCID: 0000-0002-4392-6562, Bailey, Christopher ORCID: 0000-0002-9438-3879 and Chan, Y. (2006) Analyzing the performance of flexible substrates for lead-free applications. Proceedings of EuroSime 2006 : 7th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems. IEEE, pp. 539-544. ISBN 1 4244 0276 X (doi:https://doi.org/10.1109/ESIME.2006.1644052)

flexible substrates, thermo-mechanical, lead free solder

Yin, Chunyan ORCID: 0000-0003-0298-0420, Rizvi, M.J., Lu, Hua ORCID: 0000-0002-4392-6562 and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2006) Thermal-mechanical analysis of flexible substrates during lead-free solder reflow. Proceedings of the 1st Electronics Systemintegration Technology Conference, 2006. IEEE, pp. 1007-1011. ISBN 1 4244 0552 1 (doi:https://doi.org/10.1109/ESTC.2006.280134)

flexible-substrates, Flex-No-Lead project, lead-free soldering

Rizvi, M.J., Yin, C.Y ORCID: 0000-0003-0298-0420, Bailey, C. ORCID: 0000-0002-9438-3879 and Lu, H. ORCID: 0000-0002-4392-6562 (2007) Performance and reliability of flexible substrates when subjected to lead-free processing. In: 16th European Microelectronics and Packaging Conference and Exhibition 2007(EMPC 2007). Curran Associates, Inc., Red Hook, NY, USA, pp. 589-594. ISBN 9781622764662

flip chip packaging, Cu columns, computer modelling

Lu, H. ORCID: 0000-0002-4392-6562 and Bailey, C. ORCID: 0000-0002-9438-3879 (2002) Predicting the relationship between reliability and geometric parameters of cu column bumped flip-chips. In: The Fifth International IEEE Symposium on High Density Packaging and Component Failure Analysis in Electronics Manufacturing [Proceedings]. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 85-89. ISBN 078039822X

flip chip, modelling, reflow, reliability, solder paste, underfill

Bailey, Christopher ORCID: 0000-0002-9438-3879, Lu, Hua ORCID: 0000-0002-4392-6562, Glinski, Greg, Wheeler, Daniel, Hamilton, Phil, Hendriksen, Mike and Smith, Brian (2002) Using computer models to identify optimal conditions for flip-chip assembly and reliability. Circuit World, 28 (1). pp. 14-20. ISSN 0305-6120 (doi:https://doi.org/10.1108/03056120210696658)

flip-chip assembly, no-flow underfill materials

Lu, H. ORCID: 0000-0002-4392-6562, Stoyanov, S. ORCID: 0000-0001-6091-1226, Bailey, C. ORCID: 0000-0002-9438-3879, Hung, K.C. and Chan, Y.C. (2001) A modelling and experimental analysis of the no-flow underfill process for flip-chip assembly. In: Proceedings of the 4th International Symposium on Electronic Packaging Technology. Institute of Electrical and Electronics Engineers, Inc., pp. 338-343. ISBN 0780398114

fusion approach, failure mechanisms, parameters, bonding, ceramics, condition monitoring, copper, degradation, failure analysis, fatigue, insulated gate bipolar transistors, multichip modules, wire

Patil, Nishad, Das, Diganta, Yin, Chunyan ORCID: 0000-0003-0298-0420, Lu, Hua ORCID: 0000-0002-4392-6562, Bailey, Chris ORCID: 0000-0002-9438-3879 and Pecht, Michael (2009) A fusion approach to IGBT power module prognostics. In: 10th International Conference on Thermal, Mechanical and Multi-Physics simulation and Experiments in Microelectronics and Microsystems, 2009. EuroSimE 2009. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 195-199. ISBN 9781424441600 (doi:https://doi.org/10.1109/ESIME.2009.4938491)

heterogeneous electronics based systems, higher-density interconnection, miniaturisation, silicon, carbon-nanotubes, interconnection technology

Bailey, C. ORCID: 0000-0002-9438-3879 and Lu, H. ORCID: 0000-0002-4392-6562 (2011) Interconnect technologies using carbon nanotubes: Current status and future challenges. In: 2011 34th International Spring Seminar on Electronics Technology (ISSE). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA. ISBN 978-1-4577-2111-3 ISSN 2161-2528 (doi:https://doi.org/10.1109/ISSE.2011.6053539)

jet impingement cooling system, power electronics modules (PEMs), cooling efficiency, numerical modelling

Rizvi, M.J., Skuriat, R., Tilford, Tim ORCID: 0000-0001-8307-6403, Bailey, Christopher ORCID: 0000-0002-9438-3879, Johnson, C. Mark and Lu, Hua ORCID: 0000-0002-4392-6562 (2009) Modelling of jet-impingement cooling for power electronics. In: 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, 2009. EuroSimE 2009. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA. ISBN 978-1-4244-4160-0 (doi:https://doi.org/10.1109/ESIME.2009.4938428)

light emitting diodes (LEDs), thermal management, optical and thermal modelling techniques, luminance, ruggedized electronic display, LED, LCD, backlights

Bailey, C. ORCID: 0000-0002-9438-3879, Lee, Y., Lu, H. ORCID: 0000-0002-4392-6562, Strusevich, N. and Yin, C. ORCID: 0000-0003-0298-0420 (2010) Packaging of LED backlights for ruggedised displays. In: International Symposium on Advanced Packaging Materials: Microtech, 2010. APM '10. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 98-101. ISBN 9781424467563 (doi:https://doi.org/10.1109/ISAPM.2010.5441377)

liquid crystal displays, light emitting diodes, display

Bailey, Chris ORCID: 0000-0002-9438-3879, Lu, Hua ORCID: 0000-0002-4392-6562, Yin, Chunyan ORCID: 0000-0003-0298-0420 and Lee, Yek (2010) Multi-physics modelling for packaging of liquid crystal displays in harsh environments. In: Electronics System Integration Technology Conference, ESTC 2010 - Proceedings. IEEE Computer Society, Piscataway, USA, pp. 1-6. ISBN 9781424485536 (Print), 9781424485543 (Online) (doi:https://doi.org/10.1109/ESTC.2010.5642898)

micro-manufactured, one turn inductor, power supply circuits

Lu, Hua ORCID: 0000-0002-4392-6562, Flynn, David, Bailey, Christopher ORCID: 0000-0002-9438-3879 and Desmulliez, Marc P.Y. (2006) Computer modeling of a micro-manufactured one-turn inductor. Proceedings of the Sixth IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, 2006. IEEE. ISBN 1 4244 0489 4 (doi:https://doi.org/10.1109/HDP.2006.1707562)

microfabricated solenoid inductor, electrodeposition, DC-DC

Lu, Hua ORCID: 0000-0002-4392-6562, Flynn, David, Bailey, Christopher ORCID: 0000-0002-9438-3879 and Desmulliez, M.Y. (2006) An analysis of a microfabricated solenoid inductor. Proceedings of the 1st Electronics Systemintegration Technology Conference, 2006. IEEE, pp. 556-561. ISBN 1 4244 0552 1 (doi:https://doi.org/10.1109/ESTC.2006.280058)

microinductors, DC-DC, manufacturing processes

Flynn, David, Lu, Hua ORCID: 0000-0002-4392-6562, Bailey, Christopher ORCID: 0000-0002-9438-3879 and Desmulliez, Marc P.Y. (2006) Assessment of microInductors for DC-DC converters. Proceedings of 2006 International Conference on Electronic Materials and Packaging (EMAP 2006). IEEE. ISBN 978-1-4244-0834-4

microsystems, multiphysics, analytical techniques

Xue, Xiangdong, Bailey, Chris ORCID: 0000-0002-9438-3879, Lu, Hua ORCID: 0000-0002-4392-6562 and Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 (2011) Integration of analytical techniques in stochastic optimization of microsystem reliability. Microelectronics Reliability, 51 (5). pp. 936-945. ISSN 0026-2714 (doi:https://doi.org/10.1016/j.microrel.2011.01.008)

minium wires, design engineers, electrical power, industrial partners, modelling tools, power electronics devices, remaining life, semiconductor technology, solder joints, thermal management, thermo-mechanical behaviors, transport systems, wide area

Bailey, Chris ORCID: 0000-0002-9438-3879, Lu, Hua ORCID: 0000-0002-4392-6562 and Yin, Chunyan ORCID: 0000-0003-0298-0420 (2010) Modelling reliability of power electronics packaging. In: Proceedings of the ASME InterPack Conference 2009, IPACK2009. American Society of Mechanical Engineers, New York, USA, pp. 215-220. ISBN 9780791843604 (doi:https://doi.org/10.1115/InterPACK2009-89430)

modeling, copper, diffusion, solder

Rizvi, M.J., Lu, Hua ORCID: 0000-0002-4392-6562 and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2009) Modeling the diffusion of solid copper into liquid solder alloys. Thin Solid Films, 517 (5). pp. 1686-1689. ISSN 0040-6090 (doi:https://doi.org/10.1016/j.tsf.2008.09.105)

modelling technologies, analysis tools, nano-techology, microsystems, fabrication, packaging, testing

Bailey, Christopher ORCID: 0000-0002-9438-3879, Lu, Hua ORCID: 0000-0002-4392-6562, Stoyanov, Stoyan ORCID: 0000-0001-6091-1226, Tilford, Timothy, Xue, Xiangdong, Alam, M. O., Yin, Chunyan ORCID: 0000-0003-0298-0420 and Hughes, Michael (2008) Modelling technologies and applications. In: Morris, James E., (ed.) Nanopackaging: Nanotechnologies and Electronics Packaging. Springer Science+Business Media, LLC, New York, USA, pp. 15-38. ISBN 978-0-387-47325-3 (Print) 978-0-387-47326-0 (Online) (doi:https://doi.org/10.1007/978-0-387-47325-3_2)

modelling, crack propagation

Rafii-Tabar, Hashem, Lu, Hua ORCID: 0000-0002-4392-6562 and Cross, Mark (1998) A multi-scale atomistic-continuum modelling of crack propagation in a two-dimensional macroscopic plate. Journal of Physics: Condensed Matter, 10 (11). pp. 2375-2387. ISSN 0953-8984 (Print), 1361-648X (Online) (doi:https://doi.org/10.1088/0953-8984/10/11/003)

molecular dynamics, fractures, N-body

Lu, Hua ORCID: 0000-0002-4392-6562, Rafii-Tabar, H. and Cross, M. (1997) Molecular dynamics simulation of fractures using an N-body potential. Philosophical Magazine Letters, 75 (5). pp. 237-244. ISSN 0950-0839 (Print), 1362-3036 (Online) (doi:https://doi.org/10.1080/095008397179480)

molecular dynamics, simulation of fracture, N-body potential

Lu, Hua ORCID: 0000-0002-4392-6562, Rafii-Tabar, H. and Cross, M. (1997) Molecular dynamics simulation of fractures using an N-body potential. Philosophical Magazine Letters, 75 (5). pp. 237-244. ISSN 0950-0839 (Print), 1362-3036 (Online) (doi:https://doi.org/10.1080/095008397179480)

multi-physics, multi-disciplinary design,

Bailey, C. ORCID: 0000-0002-9438-3879, Lu, H. ORCID: 0000-0002-4392-6562, Tilford, T. ORCID: 0000-0001-8307-6403, Rizvi, J. and Yin, C. ORCID: 0000-0003-0298-0420 (2009) Co-design and multi-physics analysis for power electronic modules. In: 2009 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2009. IEEE Computer Society, Piscataway, NJ USA. ISBN 9781424441600 (doi:https://doi.org/10.1109/ESIME.2009.4938505)

multi-physics, multi-scale simulations, computational modelling

Cross, Mark, Stoyanov, Stoyan ORCID: 0000-0001-6091-1226, Mouchmov, Apostol, Lu, Hua ORCID: 0000-0002-4392-6562, Croft, Nick, Slone, Avril, Williams, Alison, Bailey, Chris ORCID: 0000-0002-9438-3879 and Pericleous, Koulis ORCID: 0000-0002-7426-9999 (2003) Multi-physics-multi-scale simulation and optimisation: the next generation. In: NAFEMS World Congress, 2003, Orlando, Florida, USA.

multiphysics modeling, level set method, solidification, electronic product assembly

Bailey, C. ORCID: 0000-0002-9438-3879, Lu, H. ORCID: 0000-0002-4392-6562 and Wheeler, D. (2001) Computational modeling techniques for reliability of electronic components on printed circuit boards. Applied Numerical Mathematics, 40 (1-2). pp. 101-117. ISSN 0168-9274 (doi:https://doi.org/10.1016/S0168-9274(01)00065-4)

neutron quasi-elastic scattering, disordered solids, Monte Carlo study, metal-hydrogen systems

Lu, Hua ORCID: 0000-0002-4392-6562, Zhang, Xiaohong and Titman, J.M. (2000) Neutron quasi-elastic scattering in disordered solids: a Monte Carlo study of metal-hydrogen systems. Journal of Physics: Condensed Matter, 12 (11). pp. 2379-2391. ISSN 0953-8984 (Print), 1361-648X (Online) (doi:https://doi.org/10.1088/0953-8984/12/11/304)

packaging, reliability, prognostic methods, power electronics

Lu, Hua ORCID: 0000-0002-4392-6562, Bailey, Chris ORCID: 0000-0002-9438-3879 and Yin, Chunyan ORCID: 0000-0003-0298-0420 (2009) Design for reliability of power electronics modules. Microelectronics Reliability, 49 (9-11). pp. 1250-1255. ISSN 0026-2714 (doi:https://doi.org/10.1016/j.microrel.2009.07.055)

pharmacokinetic model, distributed computing, artificial immune network, numerical inverse Laplace, simplex

Liu, L., Lai, C.-H. ORCID: 0000-0002-7558-6398, Zhou, S.-D., Xie, F. and Lu, H.-W. ORCID: 0000-0002-4392-6562 (2009) PKAIN: An artificial immune network for parameter optimization in pharmacokinetics. In: WIT Transactions on Biomedicine and Health. Modelling in Medicine and Biology VIII. WIT Press, Southampton, UK, pp. 277-285. ISBN 978-1-84564-183-2 ISSN 1743-3525 (doi:https://doi.org/10.2495/BIO090261)

power electronic modules (PEMs), globtop, reliability, computer modelling, aluminium, wirebond

Lu, Hua ORCID: 0000-0002-4392-6562, Loh, Wei-Sun, Bailey, Christopher ORCID: 0000-0002-9438-3879 and Johnson, C. Mark (2008) Computer simulation of aluminium wirebonds with globtop in power electronics modules. 3rd International Microsystems, Packaging, Assembly & Circuits Technology Conference, 2008. IMPACT 2008. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 348-351. ISBN 978-1-4244-3623-1 (doi:https://doi.org/10.1109/IMPACT.2008.4783883)

power electronic modules, packaging technology, reliability prediction

Tilford, Tim ORCID: 0000-0001-8307-6403, Lu, Hua ORCID: 0000-0002-4392-6562 and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2006) Thermo-mechanical modelling of power electronics module structures. 2006 8th Electronics Packaging Technology Conference (EPTC 2006) : 6-8 December 2006, Singapore. IEEE, Picsataway, N.J., pp. 214-219. ISBN 1424406641 (doi:https://doi.org/10.1109/EPTC.2006.342718)

power electronic modules, prognostics prediction methodology, design-for-reliability, IGBT module, design for manufacture, power module components, reliability prediction techniques, failure based reliability

Bailey, Chris ORCID: 0000-0002-9438-3879, Lu, Hua ORCID: 0000-0002-4392-6562, Yin, Chunyan and Tilford, Timothy (2008) Integrated reliability and prognostics prediction methodology for power electronic modules. In: IET Seminar on Aircraft Health Management for New Operational and Enterprise Solutions. IET Digest, 2008/1 . The Institution of Engineering and Technology, Stevenage, UK, pp. 1-39. ISBN 978-0-86341-936-2 ISSN 0537-9989 (doi:https://doi.org/10.1049/ic:20080638)

power electronics modules (PEMs), reliability prediction, prognostic and health management (PHM)systems, Physics-of-failure (PoF) model, Bayesian Networks (BN)

Yin, C.Y. ORCID: 0000-0003-0298-0420, Lu, H. ORCID: 0000-0002-4392-6562, Musallam, M., Bailey, C. ORCID: 0000-0002-9438-3879 and Johnson, C. M. (2008) A prognostic assessment method for power electronics modules. In: 2nd Electronics System-Integration Technology Conference, 2008. ESTC 2008. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 1353-1358. ISBN 978-1-4244-2814-4 (Print), 978-1-4244-2813-7 (Online) (doi:https://doi.org/10.1109/ESTC.2008.4684552)

power electronics modules, globtop design, computer modelling, aluminium wirebonds

Lu, Hua ORCID: 0000-0002-4392-6562, Loh, Wei-Sun, Bailey, Christopher ORCID: 0000-0002-9438-3879 and Johnson, C. Mark (2008) Computer modelling analysis of the globtop's effects on aluminium wirebond reliability. 2nd Electronics System-Integration Technology Conference, 2008. ESTC 2008. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 1369-1373. ISBN 978-1-4244-2814-4 (Print) 978-1-4244-2813-7 (Online) (doi:https://doi.org/10.1109/ESTC.2008.4684555)

power electronics modules, solder joint fatigue, reliability

Yin, Chunyan ORCID: 0000-0003-0298-0420, Lu, Hua ORCID: 0000-0002-4392-6562, Musallam, M., Bailey, Christopher ORCID: 0000-0002-9438-3879 and Johnson, C.M. (2010) In-service reliability assessment of solder interconnect in power electronics modules. In: 2010 Prognostics and System Health Management Conference, PHM '10. IEEE Conference Publications . Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA. ISBN 9781424447565 (Print), 9781424447589 (Online) (doi:https://doi.org/10.1109/PHM.2010.5413346)

power electronics, data-driven prognostics, insulated gate bipolar transistors, mathematical model, monitoring, physics, predictive models, prognostics and health management

Kabir, Ahsanul, Bailey, Christopher ORCID: 0000-0002-9438-3879, Lu, Hua ORCID: 0000-0002-4392-6562 and Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 (2012) A review of data-driven prognostics in power electronics. In: 2012 35th International Spring Seminar on Electronics Technology. IEEE Conference Publications . Institute of Electrical and Electronic Engineers, Inc., Piscataway, N.J., USA, pp. 189-192. ISBN 978-1-4673-2241-6 (Print), 978-1-4673-2239-3 (Online) ISSN 2161-2528 (doi:https://doi.org/10.1109/ISSE.2012.6273136)

power module, optimization, electric-thermal

Evans, Paul, Castellazzi, Alberto, Johnson, C. Mark, Lu, Hua ORCID: 0000-0002-4392-6562 and Bailey, Chris ORCID: 0000-0002-9438-3879 (2014) The optimization of thermal performance in power electronics modules. In: 2014 15th International Conference on Electronic Packaging Technology. Institute of Electrical and Electronics, Inc., Piscataway, NJ, USA, pp. 734-739. ISBN 978-1-4799-4707-2 (doi:https://doi.org/10.1109/ICEPT.2014.6922755)

prognostic, reliability, power modules, physics-of-failure

Yin, Chunyan ORCID: 0000-0003-0298-0420, Lu, Hua ORCID: 0000-0002-4392-6562, Musallam, Mahera, Bailey, Chris ORCID: 0000-0002-9438-3879 and Johnson, C. Mark (2010) Prognostic reliability analysis of power electronics modules. International Journal of Performability Engineering, 6 (5):10. pp. 513-524. ISSN 0973-1318

reduced order models, power electronic module, life prediction, Kriging, radial basis, microsystems

Rajaguru, Pushparajah ORCID: 0000-0002-6041-0517, Lu, Hua ORCID: 0000-0002-4392-6562 and Bailey, Chris ORCID: 0000-0002-9438-3879 (2012) Application of Kriging and radial basis function in power electronic module wire bond structure reliability under various amplitude loading. International Journal of Fatigue, 45. pp. 61-70. ISSN 0142-1123 (doi:https://doi.org/10.1016/j.ijfatigue.2012.06.013)

reduced order models, power electronic module, risk analysis, Particle Swarm Optimisation, Kriging, radial basis

Rajaguru, Pushparajah ORCID: 0000-0002-6041-0517, Lu, Hua ORCID: 0000-0002-4392-6562 and Bailey, Chris ORCID: 0000-0002-9438-3879 (2015) Sintered silver finite element modelling and reliability based design optimisation in power electronic module. Microelectronics Reliability, 55 (6). pp. 919-930. ISSN 0026-2714 (doi:https://doi.org/10.1016/j.microrel.2015.03.011)

reduced order models, power electronic module, risk analysis, probabilistic optimisation, Kriging, radial basis, microsystems

Rajaguru, Pushparajah ORCID: 0000-0002-6041-0517, Stoyanov, Stoyan ORCID: 0000-0001-6091-1226, Lu, Hua ORCID: 0000-0002-4392-6562 and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2013) Application of Kriging and radial basis function for reliability optimization in power modules. Journal of Electronic Packaging, 135 (2):021009. ISSN 1528-9044 (Print), 1043-7398 (Online) (doi:https://doi.org/10.1115/1.4024056)

reliability targets, power modules, wear-out mechanisms, wire-bond lifting, solder degradation, load-induced thermal cycling, real-time thermal models, real-time health management

Musallam, M., Johnson, C.M., Yin, Chunyan ORCID: 0000-0003-0298-0420, Lu, Hua ORCID: 0000-0002-4392-6562 and Bailey, C. ORCID: 0000-0002-9438-3879 (2009) Real-time comparison of power module failure modes under in-service conditions. In: 2009 13th European Conference on Power Electronics and Applications, EPE '09. Institute of Electrical and Electronic Engineers, Inc, Piscataway, NJ, USA, pp. 1-10. ISBN 978-90-75815-13-9 (electronic), 978-1-4244-4432-8 (print)

simulation tools, virtual prototyping environment, classical continuum mechanics (e.g., the finite element method), atomistic mechanics [e.g., classical molecular dynamics (MD)], quantum mechanics (e.g., the density functional method)

Bailey, C. ORCID: 0000-0002-9438-3879 and Lu, Hua ORCID: 0000-0002-4392-6562 (2009) Nanopackaging simulation: properties and behavior of packaging materials. Nanotechnology Magazine, 3 (2). pp. 34-37. ISSN 1932-4510 (doi:https://doi.org/10.1109/MNANO.2009.932413)

solder joint failure, electronic packaging, strain on solder joints

Shishido, Nobuyuki, Kanno, Toshifumi, Kawahara, Shinya, Ikeda, Toru, Miyazaki, Noriyuki, Lu, Hua ORCID: 0000-0002-4392-6562, Bailey, Chris ORCID: 0000-0002-9438-3879, Thomas, Owen, Di Maio, Davide and Hunt, Chris (2010) An analysis of local deformation of SnAgCu solder joint using digital image correlation. In: Proceedings - 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2010. Association for Computing Machinery, New York, pp. 376-381. ISBN 9781424481408 (doi:https://doi.org/10.1109/ICEPT.2010.5582845)

solder joint, intermetallic compound, fracture mechanics

Alam, M.O., Lu, Hua ORCID: 0000-0002-4392-6562, Bailey, Christopher ORCID: 0000-0002-9438-3879 and Chan, Y.C. (2008) Fracture mechanics analysis of cracks in solder joint intermetallic compounds. In: 2nd Electronics System-Integration Technology Conference, 2008. ESTC 2008. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 757-762. ISBN 978-1-4244-2813-7 (doi:https://doi.org/10.1109/ESTC.2008.4684445)

solder, intermetallic, pb-free, BGA, electronic package, stress intensity factor, plastic deformation, butt joints

Alam, M.O., Lu, H. ORCID: 0000-0002-4392-6562, Bailey, Chris ORCID: 0000-0002-9438-3879 and Chan, Y.C. (2009) Fracture mechanics analysis of solder joint intermetallic compounds in shear test. Computational Materials Science, 45 (2). pp. 576-583. ISSN 0927-0256 (doi:https://doi.org/10.1016/j.commatsci.2008.12.001)

solder, joints, electronic packaging, wetting, computer modelling

Rizvi, M.J., Bailey, Christopher ORCID: 0000-0002-9438-3879, Chan, Y.C. and Lu, Hua ORCID: 0000-0002-4392-6562 (2006) Comparative wetting behavior of Sn-0.7Cu and Sn-0.7Cu-0.3Ni solders on Cu and Ni substrates. 1st Electronics Systemintegration Technology Conference. Dresden, Saxony, Germany. 2006 proceedings. IEEE, Piscataway, NJ, USA, pp. 145-151. ISBN 142440553X (doi:https://doi.org/10.1109/ITHERM.2006.1645436)

solder, wetting, aging, intermetallic compound layer

Rizvi, M.J., Bailey, Christopher ORCID: 0000-0002-9438-3879, Chan, Y.C., Islam, M. and Lu, Hua ORCID: 0000-0002-4392-6562 (2007) Effect of adding 0.3wt% Ni into the Sn-0.7wt% Cu solder - Part II: Growth of intermetallic layer with Cu during wetting and aging. Journal of Alloys and Compounds, 438 (1-2). pp. 122-128. ISSN 0925-8388 (doi:https://doi.org/10.1016/j.jallcom.2006.08.071)

soldering, interfacial reactions, intermetallic compounds, growth rate, aging

Rizvi, M.J., Chan, Y.C., Bailey, Christopher ORCID: 0000-0002-9438-3879, Lu, Hua ORCID: 0000-0002-4392-6562 and Islam, M.N. (2006) Effect of adding 1 wt% Bi into the Sn–2.8Ag–0.5Cu solder alloy on the intermetallic formations with Cu-substrate during soldering and isothermal aging. Journal of Alloys and Compounds, 407 (1-2). pp. 208-214. ISSN 0925-8388 (doi:https://doi.org/10.1016/j.jallcom.2005.06.050)

solders, computer simulation, reliability, materials properties, geometry, flip-chip, design, event history analysis, solder joints, fatigue

Lu, Hua ORCID: 0000-0002-4392-6562, Bailey, C. ORCID: 0000-0002-9438-3879 and Cross, M. (2000) Reliability analysis of flip chip designs via computer simulation. Journal of Electronic Packaging, 122 (3). pp. 214-219. ISSN 1528-9044 (Print), 1043-7398 (Online) (doi:https://doi.org/10.1115/1.1286122)

surface anisotropy, computer simulation, micromagnetism, ripple structures

Lu, Hua ORCID: 0000-0002-4392-6562, Bishop, J.E.L. and Tucker, J.W. (1996) Simulation of transverse and longitudinal magnetic ripple structures induced by surface anisotropy. Journal of Magnetism and Magnetic Materials, 163 (3). pp. 285-291. ISSN 0304-8853 (doi:https://doi.org/10.1016/S0304-8853(96)00345-9)

thermal modeling, microinductor, DC-DC power converter,

Flynn, David, Lu, Hua ORCID: 0000-0002-4392-6562, Bailey, Chris ORCID: 0000-0002-9438-3879 and Desmulliez, Marc P.Y. (2008) Design, modeling and characterization of a microinductor for future DC-DC power converters. In: 2nd Electronics System-Integration Technology Conference, 2008. ESTC 2008. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 577-582. ISBN 978-1-4244-2814-4 (print), 978-1-4244-2813-7 (online) (doi:https://doi.org/10.1109/ESTC.2008.4684414)

thick film chip resistors, SnPb and SnAgCu (solder alloys), Garofalo equation,Miner's law of linear damage accumulation

Rizvi, M.J., Lu, H. ORCID: 0000-0002-4392-6562, Bailey, C. ORCID: 0000-0002-9438-3879, Bevan, E., Poutney, N. and Coates, J. (2010) Finite element modelling of failures in thick film chip resistor solder joints. In: Microsystems Packaging Assembly and Circuits Technology Conference (IMPACT), 2010. in: Microsystems Packaging Assembly and Circuits Technology Conference (IMPACT), 2010 5th International Issue Date: 20-22 Oct. 2010 . IEEE Xplore Digital Library, Taipei, pp. 1-4. ISBN 978-1-4244-9785-0 (electronic), 978-1-4244-9783-6 (print) ISSN 2150-5934 (doi:https://doi.org/10.1109/IMPACT.2010.5699488)

vibration, failure, lead-free solders

Kamara, Elisha, Lu, Hua ORCID: 0000-0002-4392-6562, Bailey, Chris ORCID: 0000-0002-9438-3879, Hunt, Chris, Di Maio, Davide and Thomas, Owen (2010) Computer simulation and design of a solder joint vibration test machine. In: 2010 11th International Conference on Thermal, Mechanical and Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems, EuroSimE 2010. IEEE Conference Publications . Institute of Electrical and Electronic Engineers, Inc., Piscataway, NJ, USA. ISBN 978-1-4244-7026-6 (doi:https://doi.org/10.1109/ESIME.2010.5464587)

vibration, model order reduction

Rajaguru, Pushpa ORCID: 0000-0002-6041-0517, Lu, Hua ORCID: 0000-0002-4392-6562, Bailey, Chris ORCID: 0000-0002-9438-3879 and Bella, Martina (2020) Modelling and analysis of vibration on power electronic module structure and application of model order reduction. Microelectronics Reliability, 110:113697. ISSN 0026-2714 (doi:https://doi.org/10.1016/j.microrel.2020.113697)

vibration, reliability,lead-free solders

Kamara, E., Lu, H. ORCID: 0000-0002-4392-6562, Bailey, C. ORCID: 0000-0002-9438-3879, Hunt, C., Di Maio, D. and Thomas, O. (2010) A multi-disciplinary study of vibration based reliability of lead-free electronic interconnects. Microelectronics Reliability, 50 (9-11). pp. 1706-1710. ISSN 0026-2714 (doi:https://doi.org/10.1016/j.microrel.2010.07.152)

wetting, solder, flux, wetting force, contact angle, modeling

Rizvi, M.J., Bailey, Christopher ORCID: 0000-0002-9438-3879, Chan, Y.C. and Lu, Hua ORCID: 0000-0002-4392-6562 (2007) Effect of adding 0.3 wt% Ni into the Sn–0.7 wt%Cu solder: part I: wetting behavior on Cu and Ni substrates. Journal of Alloys and Compounds, 438 (1-2). pp. 116-121. ISSN 0925-8388 (doi:https://doi.org/10.1016/j.jallcom.2006.08.048)

x-rays, diffraction experiments

Hoo, Nick, Jackson, Gavin, Hendriksen, Mike, Lu, Hua ORCID: 0000-0002-4392-6562, Durairaj, Rajkumar, Bailey, Chris ORCID: 0000-0002-9438-3879, Ekere, Ndy and Wright, Jonathon (2004) In-situ synchrotron x-ray diffraction during melting and solidification of a lead-free solder paste. In: TMS 2004 133rd TMS Annual Meeting & Exhibition 2004, 14-18 Mar 2004, Charlotte, North Carolina, USA. (Unpublished)

This list was generated on Sat Jan 22 19:12:02 2022 UTC.