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Items where Greenwich Author is "Lu, Hua"

Items where Greenwich Author is "Lu, Hua"

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Jump to: 3D-Mintegration consortium (supported under EPSRC fund EP/C534212/) | ASM Assembly Automation Ltd. (Hong Kong) | British Council | British Council (UK/HK Joint Research Scheme - Project No: 9050143) | British Council (UK/HK Joint Research Scheme–Project No. 9050143) | CALCE Prognostics and Health Management Consortium at the University of Maryland, College Park | Celestica Limited | Celestica Ltd | Celestica Ltd. | City University of Hong Kong | City University of Hong Kong (ITF Project-Conductive Adhesive Technology Program for Fine Pitch Electronic Packaging Project No: lTS/182/00) | City University of Hong Kong (Strategic Research Grants - Reliability Study of Anisotropic Conductive Joints – Effect of Thermally Induced Warpage (project no: 7001387)) | City University of Hong Kong Research project:7002848 (A study of functionalized CNT/grapheme reinforced composite electronic interconnects: preparation, characterization and integration for green nanoelectronicapplications) | City University of Hong Kong. EPA Centre (Centre for Electronic Packaging and Assemblies, Failure Analysis and Reliability Engineering) | Clean Sky (Grant agreement no: 271788, project: Sample power electronic module construction for testing, characterisation and manufacturability assessment, PEMREL) | Direct Allocation grant (Project No. 7100205) of the City University of Hong Kong) | EC-funded PROFIT project (IST-199942529) | EPA Centre of City University of Hong Kong | EPSRC | EPSRC (through the “Underpinning Power Electronics 2012: Hub” (grant reference: EP/K035304/1) | EPSRC - Innovative Electronics Manufacturing Research Center (IeMRC) (UK) | EPSRC, ROPA-supported post-doctoral fellowship through Grant GR/K64389 (Hua Lu) | EU funded Marie Curie Incoming International Fellowship | EU under the Marie Curie Incoming International Fellowship | Engineering and Physical Science Research Council (EPSRC) | Engineering and Physical Sciences Research Council (EPSRC) | Engineering and Physical Sciences Research Council (EPSRC), UK | Engineering and Physical Sciences Research Council (Grant No. EP/K034804/1) | HK RGC GRF (Project No. 111309; City University of Hong Kong, Ref No: 9041486) (SX) | HK RGC GRF (Project No.111309; City University of Hong Kong, Ref No: 9041486) | Hong Kong Innovation and Technology Commission for Conductive Adhesive Technology Program for Fine Pitch Electronic Interconnect (Project no. ITS/182/00) | Hong Kong Research Grant Council fund for Cooperative Research Center on Conductive Adhesive Technology for High Density Electronic Packaging (Project no. 8720003) | IeMRC | IeMRC (Innovative Electronics Manufacturing Research Centre) | Innovative Electronics Manufacturing Centre (IeMRC) | Innovative Electronics Manufacturing Research Centre | Innovative Electronics Manufacturing Research Centre (IeMRC, SP/03/02/11) grant | Innovative electronic Manufacturing Research Centre (IeMRC Project Number: SP/03/02/11) | Innovative electronics Manufacturing Research Centre (IeMRC) | Innovative electronics Manufacturing Research Centre (IeMRC) - A Prognostic and Diagnostic Environment for High Reliability Electronic Systems Project: [SP/06/03] | Innovative electronics Manufacturing Research Centre (IeMRC) - Power Electronics Flagship Project: [FS/05/01] | Intemational Tin Research Institute | International Tin Research Institute | MBDA | Materials and Components for Missiles, Innovation and Technology Partnership | Multicore Solder Ltd | Multicore Solder Ltd. | National Natural Science Foundation of China (Grant No. 51607016) | National Physical Laboratory | Research Grants Council, Hong Kong, Ref. No. 9041636 (A study of nanostructured electronic interconnects-preparation, characterization and integration) | SP/06/03 (A Prognostic and Diagnostic Environment for High Reliability Electronic Systems) | Scottish Consortium in Integrated Micro Photonic Systems (SCIMPS), funded by the Scottish Funding Council under the Strategic Research Development Grant scheme (SRDG) | Scottish Innovative Manufacturing Research Center (SMI) | TSB UK | Technology Strategy Board | Technology Strategy Board (TSB) | Technology Strategy Board (TSB) - [TP/3/DSM/6/I/16796] | Technology Strategy Board for the ENDVIEW project (ProjectTP11/LLD/6/I/AFOO5K) | The Engineering and Physical Science Research Council (EPSRC) through the Underpinning Power Electronics HUB (Grant No. EP/K035304/1) | The Engineering and Physical Sciences Research Council (EPSRC) | The Engineering and Physical Sciences Research Council (EPSRC) Grant No. EP/K03480411 | The Engineering and Physical Sciences Research Council (EPSRC); "The Underpinning Power Electronics HUB" (Grant Agreement No. EP/K034804/1) | The National Key R&D Program of China (Grant No. 2017YFB0102303) | UK Department of Trade and Indusky under a TCS Programme (Grant #s 2341 and 2976) | UK Engineering and Physical Sciences Research (EPSRC) | UK Engineering and Physical Sciences Research (EPSRC) Grants GR/H26758 and GR/J89859 | UK Engineering and Physical Sciences Research Council (EPSRC) | UK Engineering and Physical Sciences Research Council (EPSRC), (ProJect GRIN 14095/0 I) | UK Engineering and Physical Sciences Research Council (EPSRC). Grant GR/R09190 - Microsystems Assembly Technology for the 21st Century (MAT21) | UK Engineering and Physics Research Council (EPSRC) - EP/ C534212/1 | United Kingdom Technology Strategy Board | University of Greenwich | University of Greenwich (University Bursary Ref. No: RAE Fund 13265-R09803) (XZ) | University of Greenwich (Xiaoxin Zhu)
Number of items: 103.

3D-Mintegration consortium (supported under EPSRC fund EP/C534212/)

Bailey, Christopher ORCID: 0000-0002-9438-3879, Lu, Hua ORCID: 0000-0002-4392-6562, Stoyanov, Stoyan ORCID: 0000-0001-6091-1226, Tilford, Timothy, Xue, Xiangdong, Alam, M. O., Yin, Chunyan ORCID: 0000-0003-0298-0420 and Hughes, Michael (2008) Modelling technologies and applications. In: Morris, James E., (ed.) Nanopackaging: Nanotechnologies and Electronics Packaging. Springer Science+Business Media, LLC, New York, USA, pp. 15-38. ISBN 978-0-387-47325-3 (Print) 978-0-387-47326-0 (Online) (doi:https://doi.org/10.1007/978-0-387-47325-3_2)

ASM Assembly Automation Ltd. (Hong Kong)

Rizvi, M.J., Lu, H. ORCID: 0000-0002-4392-6562, Bailey, C. ORCID: 0000-0002-9438-3879, Chan, Y.C., Lee, M.Y. and Pang, C.H. (2007) Role of bonding time and temperature on the physical properties of coupled anisotropic conductive–nonconductive adhesive film for flip chip on glass technology. Microelectronic Engineering, 85 (1). pp. 238-244. ISSN 0167-9317 (doi:https://doi.org/10.1016/j.mee.2007.05.045)

British Council

Shishido, Nobuyuki, Kanno, Toshifumi, Kawahara, Shinya, Ikeda, Toru, Miyazaki, Noriyuki, Lu, Hua ORCID: 0000-0002-4392-6562, Bailey, Chris ORCID: 0000-0002-9438-3879, Thomas, Owen, Di Maio, Davide and Hunt, Chris (2010) An analysis of local deformation of SnAgCu solder joint using digital image correlation. In: Proceedings - 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2010. Association for Computing Machinery, New York, pp. 376-381. ISBN 9781424481408 (doi:https://doi.org/10.1109/ICEPT.2010.5582845)

British Council (UK/HK Joint Research Scheme - Project No: 9050143)

Lu, H. ORCID: 0000-0002-4392-6562, Stoyanov, S. ORCID: 0000-0001-6091-1226, Bailey, C. ORCID: 0000-0002-9438-3879, Hung, K.C. and Chan, Y.C. (2001) A modelling and experimental analysis of the no-flow underfill process for flip-chip assembly. In: Proceedings of the 4th International Symposium on Electronic Packaging Technology. Institute of Electrical and Electronics Engineers, Inc., pp. 338-343. ISBN 0780398114

British Council (UK/HK Joint Research Scheme–Project No. 9050143)

Lu, H. ORCID: 0000-0002-4392-6562, Hung, K.C., Stoyanov, S. ORCID: 0000-0001-6091-1226, Bailey, C. ORCID: 0000-0002-9438-3879 and Chan, Y.C. (2002) No-flow underfill flip chip assembly–an experimental and modeling analysis. Microelectronics Reliability, 42 (8). pp. 1205-1212. ISSN 0026-2714 (doi:https://doi.org/10.1016/S0026-2714(02)00092-6)

CALCE Prognostics and Health Management Consortium at the University of Maryland, College Park

Patil, Nishad, Das, Diganta, Yin, Chunyan ORCID: 0000-0003-0298-0420, Lu, Hua ORCID: 0000-0002-4392-6562, Bailey, Chris ORCID: 0000-0002-9438-3879 and Pecht, Michael (2009) A fusion approach to IGBT power module prognostics. In: 10th International Conference on Thermal, Mechanical and Multi-Physics simulation and Experiments in Microelectronics and Microsystems, 2009. EuroSimE 2009. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 195-199. ISBN 9781424441600 (doi:https://doi.org/10.1109/ESIME.2009.4938491)

Celestica Limited

Bailey, C. ORCID: 0000-0002-9438-3879, Lu, H. ORCID: 0000-0002-4392-6562 and Wheeler, D. (2001) Computational modeling techniques for reliability of electronic components on printed circuit boards. Applied Numerical Mathematics, 40 (1-2). pp. 101-117. ISSN 0168-9274 (doi:https://doi.org/10.1016/S0168-9274(01)00065-4)

Celestica Ltd

Lu, Hua ORCID: 0000-0002-4392-6562 and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2002) Computer modelling of the reliability of flip chips with metal column bumping. In: ITHERM 2002. The Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems [Proceedings]. Institute of Electrical and Electronics Engineers, Inc., pp. 967-973. ISBN 0780371526 (doi:https://doi.org/10.1109/ITHERM.2002.1012561)

Celestica Ltd.

Lu, H. ORCID: 0000-0002-4392-6562 and Bailey, C. ORCID: 0000-0002-9438-3879 (2002) Predicting optimal process conditions for flip-chip aassembly using copper column bumped dies. In: Proceedings of 4th Electronics Packaging Technology Conference (EPTC 2002). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 338-343. ISBN 0780374355 (doi:https://doi.org/10.1109/EPTC.2002.1185694)

Lu, H. ORCID: 0000-0002-4392-6562 and Bailey, C. ORCID: 0000-0002-9438-3879 (2002) Predicting the relationship between reliability and geometric parameters of cu column bumped flip-chips. In: The Fifth International IEEE Symposium on High Density Packaging and Component Failure Analysis in Electronics Manufacturing [Proceedings]. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 85-89. ISBN 078039822X

Lu, Hua ORCID: 0000-0002-4392-6562 and Bailey, C. ORCID: 0000-0002-9438-3879 (2000) Material properties, geometry and their effect on the fatigue life of two flip-chip models. In: ITHERM Proceedings. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 65-71. ISBN 0780359127 ISSN 0189-9870 (doi:https://doi.org/10.1109/ITHERM.2000.866172)

City University of Hong Kong

Yin, C.Y. ORCID: 0000-0003-0298-0420, Lu, H. ORCID: 0000-0002-4392-6562, Bailey, C. ORCID: 0000-0002-9438-3879 and Chan, Y.C. (2004) Effects of reflow process on the reliability of flip chip on flex interconnections using anisotropic conductive adhesives. In: 2004 International IEEE Conference on Asian Green Electronics (AGEC) [Proceedings]. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 240-245. ISBN 0-7803-8203-X (doi:https://doi.org/10.1109/AGEC.2004.1290912)

City University of Hong Kong (ITF Project-Conductive Adhesive Technology Program for Fine Pitch Electronic Packaging Project No: lTS/182/00)

Yin, C.Y. ORCID: 0000-0003-0298-0420, Lu, H. ORCID: 0000-0002-4392-6562, Bailey, C. ORCID: 0000-0002-9438-3879 and Chan, Y.C. (2003) Experimental and modeling analysis of the reliability of the anisotropic conductive films. In: 2003 Proceedings 53rd Electronic Components & Technology Conference. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 698-702. ISBN 0780377915 ISSN 0569-5503 (doi:https://doi.org/10.1109/ECTC.2003.1216359)

City University of Hong Kong (Strategic Research Grants - Reliability Study of Anisotropic Conductive Joints – Effect of Thermally Induced Warpage (project no: 7001387))

Rizvi, M.J., Chan, Y.C., Bailey, C. ORCID: 0000-0002-9438-3879, Lu, H. ORCID: 0000-0002-4392-6562 and Sharif, A. (2005) The effect of curing on the performance of ACF bonded chip-on-flex assemblies after thermal ageing. Soldering & Surface Mount Technology, 17 (2). pp. 40-48. ISSN 0954-0911 (doi:https://doi.org/10.1108/09540910510597492)

City University of Hong Kong Research project:7002848 (A study of functionalized CNT/grapheme reinforced composite electronic interconnects: preparation, characterization and integration for green nanoelectronicapplications)

Xu, Sha, Chan, Yan Cheong, Zhu, Xiaoxin, Lu, Hua ORCID: 0000-0002-4392-6562 and Bailey, Chris ORCID: 0000-0002-9438-3879 (2014) Effective method to disperse and incorporate carbon nanotubes in electroless Ni-P deposits. In: 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) Proceedings. Curran Associates, Stoughton, WI, USA, pp. 1342-1347. ISBN 9781479924080 (doi:https://doi.org/10.1109/ECTC.2014.6897466)

City University of Hong Kong. EPA Centre (Centre for Electronic Packaging and Assemblies, Failure Analysis and Reliability Engineering)

Rizvi, M.J., Lu, H. ORCID: 0000-0002-4392-6562, Bailey, C. ORCID: 0000-0002-9438-3879, Chan, Y.C., Lee, M.Y. and Pang, C.H. (2007) Role of bonding time and temperature on the physical properties of coupled anisotropic conductive–nonconductive adhesive film for flip chip on glass technology. Microelectronic Engineering, 85 (1). pp. 238-244. ISSN 0167-9317 (doi:https://doi.org/10.1016/j.mee.2007.05.045)

Clean Sky (Grant agreement no: 271788, project: Sample power electronic module construction for testing, characterisation and manufacturability assessment, PEMREL)

Evans, Paul, Castellazzi, Alberto, Johnson, C. Mark, Lu, Hua ORCID: 0000-0002-4392-6562 and Bailey, Chris ORCID: 0000-0002-9438-3879 (2014) The optimization of thermal performance in power electronics modules. In: 2014 15th International Conference on Electronic Packaging Technology. Institute of Electrical and Electronics, Inc., Piscataway, NJ, USA, pp. 734-739. ISBN 978-1-4799-4707-2 (doi:https://doi.org/10.1109/ICEPT.2014.6922755)

Direct Allocation grant (Project No. 7100205) of the City University of Hong Kong)

Lu, H. ORCID: 0000-0002-4392-6562, Hung, K.C., Stoyanov, S. ORCID: 0000-0001-6091-1226, Bailey, C. ORCID: 0000-0002-9438-3879 and Chan, Y.C. (2002) No-flow underfill flip chip assembly–an experimental and modeling analysis. Microelectronics Reliability, 42 (8). pp. 1205-1212. ISSN 0026-2714 (doi:https://doi.org/10.1016/S0026-2714(02)00092-6)

EC-funded PROFIT project (IST-199942529)

Warner, Matt, Parry, John, Bailey, Chris ORCID: 0000-0002-9438-3879 and Lu, Hua ORCID: 0000-0002-4392-6562 (2004) Solder life prediction in a thermal analysis software environment. In: The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena In Electronic Systems (ITHERM 2004) [Proceedings]. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 391-396. ISBN 0780383575 ISSN 1089-9870 (doi:https://doi.org/10.1109/ITHERM.2004.1318309)

EPA Centre of City University of Hong Kong

Rizvi, M.J., Lu, Hua ORCID: 0000-0002-4392-6562 and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2009) Modeling the diffusion of solid copper into liquid solder alloys. Thin Solid Films, 517 (5). pp. 1686-1689. ISSN 0040-6090 (doi:https://doi.org/10.1016/j.tsf.2008.09.105)

EPSRC

Kamara, Elisha, Lu, Hua ORCID: 0000-0002-4392-6562, Bailey, Chris ORCID: 0000-0002-9438-3879, Hunt, Chris, Di Maio, Davide and Thomas, Owen (2010) Computer simulation and design of a solder joint vibration test machine. In: 2010 11th International Conference on Thermal, Mechanical and Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems, EuroSimE 2010. IEEE Conference Publications . Institute of Electrical and Electronic Engineers, Inc., Piscataway, NJ, USA. ISBN 978-1-4244-7026-6 (doi:https://doi.org/10.1109/ESIME.2010.5464587)

EPSRC (through the “Underpinning Power Electronics 2012: Hub” (grant reference: EP/K035304/1)

Shahjalal, Mohammad, Lu, Hua ORCID: 0000-0002-4392-6562 and Bailey, Chris ORCID: 0000-0002-9438-3879 (2014) A review of the computer based simulation of electro-thermal design of power electronics devices. In: 20th International Workshop on Thermal Investigations of ICs and Systems. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA. ISBN 9781479954155 (doi:https://doi.org/10.1109/THERMINIC.2014.6972515)

EPSRC - Innovative Electronics Manufacturing Research Center (IeMRC) (UK)

Musallam, Mahera, Johnson, C. Mark, Yin, Chunyan ORCID: 0000-0003-0298-0420, Lu, Hua ORCID: 0000-0002-4392-6562 and Bailey, Chris ORCID: 0000-0002-9438-3879 (2008) Real-time life expectancy estimation in power modules. In: 2nd Electronics System Integration Technology Conference, Greenwich, UK. IEEE Conference Publications, 1 . Institute of Electrical and Electronics Engineers, Inc, Piscataway, NJ, USA, pp. 231-236. ISBN 978-1-4244-2813-7 (Print), 978-1-4244-2814-4 (Electronic) (doi:https://doi.org/10.1109/ESTC.2008.4684355)

EPSRC, ROPA-supported post-doctoral fellowship through Grant GR/K64389 (Hua Lu)

Rafii-Tabar, Hashem, Lu, Hua ORCID: 0000-0002-4392-6562 and Cross, Mark (1998) A multi-scale atomistic-continuum modelling of crack propagation in a two-dimensional macroscopic plate. Journal of Physics: Condensed Matter, 10 (11). pp. 2375-2387. ISSN 0953-8984 (Print), 1361-648X (Online) (doi:https://doi.org/10.1088/0953-8984/10/11/003)

EU funded Marie Curie Incoming International Fellowship

Alam, M.O., Lu, H. ORCID: 0000-0002-4392-6562, Bailey, Chris ORCID: 0000-0002-9438-3879 and Chan, Y.C. (2009) Fracture mechanics analysis of solder joint intermetallic compounds in shear test. Computational Materials Science, 45 (2). pp. 576-583. ISSN 0927-0256 (doi:https://doi.org/10.1016/j.commatsci.2008.12.001)

Alam, M.O., Lu, Hua ORCID: 0000-0002-4392-6562, Bailey, Christopher ORCID: 0000-0002-9438-3879 and Chan, Y.C. (2008) Fracture mechanics analysis of cracks in solder joint intermetallic compounds. In: 2nd Electronics System-Integration Technology Conference, 2008. ESTC 2008. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 757-762. ISBN 978-1-4244-2813-7 (doi:https://doi.org/10.1109/ESTC.2008.4684445)

EU under the Marie Curie Incoming International Fellowship

Alam, M.O., Lu, Hua ORCID: 0000-0002-4392-6562, Bailey, Chris ORCID: 0000-0002-9438-3879 and Chan, Y.C (2009) Finite-element simulation of stress intensity factors in solder joint intermetallic compounds. IEEE Transactions on Device and Materials Reliability, 9 (1). pp. 40-48. ISSN 1530-4388 (doi:https://doi.org/10.1109/TDMR.2008.2010595)

Engineering and Physical Science Research Council (EPSRC)

Bailey, C. ORCID: 0000-0002-9438-3879, Rajaguru, P. ORCID: 0000-0002-6041-0517, Lu, H. ORCID: 0000-0002-4392-6562, Castellazzi, A., Antonini, M., Pathirana, V., Udugampola, N., Udrea, F., Mitchelson, P. D. and Aldhaher, S. (2018) Mechanical modelling of high power lateral IGBT for LED driver applications. In: IEEE Electronic Components and Technology Conference (ECTC). IEEE Electronics Packaging Society (formerly CPMT), pp. 1375-1381. ISBN 978-1-5386-5000-4 ISSN 2377-5726 (Online) (doi:https://doi.org/10.1109/ECTC.2018.00210)

Rajaguru, P. ORCID: 0000-0002-6041-0517, Lu, H. ORCID: 0000-0002-4392-6562, Bailey, C. ORCID: 0000-0002-9438-3879, Castellazzi, A., Pathirana, V., Udugampola, N. and Udrea, F. (2018) Impact of underfill and other physical dimensions on Silicon Lateral IGBT package reliability using computer model with discrete and continuous design variables. Microelectronics Reliability, 83. pp. 146-156. ISSN 0026-2714 (doi:https://doi.org/10.1016/j.microrel.2018.02.024)

Rajaguru, P. ORCID: 0000-0002-6041-0517, Bailey, C. ORCID: 0000-0002-9438-3879, Lu, H. ORCID: 0000-0002-4392-6562, Aliyu, A. M., Castellazzi, A., Pathirana, V., Udugampola, N., Trajkovic, T., Udrea, F., Mitcheson, P. D. and Elliott, A. D. T. (2017) Co-design/simulation of flip-chip assembly for high voltage IGBT packages. In: 23rd International workshop on Thermal Investigations of ICs and Systems (THERMINIC). THERMINIC, pp. 1-5.

Engineering and Physical Sciences Research Council (EPSRC)

Rajaguru, Pushparajah ORCID: 0000-0002-6041-0517, Lu, Hua ORCID: 0000-0002-4392-6562 and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2015) A time dependent damage indicator model for Sn3.5Ag solder layer in power electronic module. Microelectronics Reliability, 55 (11). pp. 2371-2381. ISSN 0026-2714 (doi:https://doi.org/10.1016/j.microrel.2015.07.047)

Rizvi, M.J., Skuriat, R., Tilford, Tim ORCID: 0000-0001-8307-6403, Bailey, Christopher ORCID: 0000-0002-9438-3879, Johnson, C. Mark and Lu, Hua ORCID: 0000-0002-4392-6562 (2009) Modelling of jet-impingement cooling for power electronics. In: 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, 2009. EuroSimE 2009. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA. ISBN 978-1-4244-4160-0 (doi:https://doi.org/10.1109/ESIME.2009.4938428)

Bailey, Christopher ORCID: 0000-0002-9438-3879, Lu, Hua ORCID: 0000-0002-4392-6562, Stoyanov, Stoyan ORCID: 0000-0001-6091-1226, Tilford, Timothy, Xue, Xiangdong, Alam, M. O., Yin, Chunyan ORCID: 0000-0003-0298-0420 and Hughes, Michael (2008) Modelling technologies and applications. In: Morris, James E., (ed.) Nanopackaging: Nanotechnologies and Electronics Packaging. Springer Science+Business Media, LLC, New York, USA, pp. 15-38. ISBN 978-0-387-47325-3 (Print) 978-0-387-47326-0 (Online) (doi:https://doi.org/10.1007/978-0-387-47325-3_2)

Engineering and Physical Sciences Research Council (EPSRC), UK

Rajaguru, Pushparajah ORCID: 0000-0002-6041-0517, Lu, Hua ORCID: 0000-0002-4392-6562 and Bailey, Chris ORCID: 0000-0002-9438-3879 (2015) Sintered silver finite element modelling and reliability based design optimisation in power electronic module. Microelectronics Reliability, 55 (6). pp. 919-930. ISSN 0026-2714 (doi:https://doi.org/10.1016/j.microrel.2015.03.011)

Engineering and Physical Sciences Research Council (Grant No. EP/K034804/1)

Shahjalal, Mohammad, Rishad Ahmed, MD, Lu, Hua ORCID: 0000-0002-4392-6562, Bailey, Chris ORCID: 0000-0002-9438-3879 and Forsyth, Andrew (2020) An analysis of the thermal interaction between components in power converter applications. IEEE Transactions on Power Electronics, 35 (9). pp. 9082-9094. ISSN 0885-8993 (Print), 1941-0107 (Online) (doi:https://doi.org/10.1109/TPEL.2020.2969350)

HK RGC GRF (Project No. 111309; City University of Hong Kong, Ref No: 9041486) (SX)

Zhu, X., Kotadia, H., Xu, S., Lu, H. ORCID: 0000-0002-4392-6562, Mannan, S. H., Bailey, C. ORCID: 0000-0002-9438-3879 and Chan, Y. C. (2014) Electromigration in Sn-Ag solder thin films under high current density. Thin Solid Films, 565. pp. 193-201. ISSN 0040-6090 (doi:https://doi.org/10.1016/j.tsf.2014.06.030)

HK RGC GRF (Project No.111309; City University of Hong Kong, Ref No: 9041486)

Zhu, X., Kotadia, H., Xu, S., Lu, H. ORCID: 0000-0002-4392-6562, Mannan, S.H., Bailey, C. ORCID: 0000-0002-9438-3879 and Chan, Y.C. (2013) Comments on electromigration analysis methods. In: Proceedings of 14th International Conference on Electronic Packaging Technology (ICEPT 2013). Institute of Electrical and Electronics, Inc., Piscataway, NJ, USA, pp. 529-534. ISBN 9781479904983 (doi:https://doi.org/10.1109/ICEPT.2013.6756527)

Hong Kong Innovation and Technology Commission for Conductive Adhesive Technology Program for Fine Pitch Electronic Interconnect (Project no. ITS/182/00)

Yin, C.Y. ORCID: 0000-0003-0298-0420, Alam, M.O., Chan, Y.C., Bailey, C. ORCID: 0000-0002-9438-3879 and Lu, Hua ORCID: 0000-0002-4392-6562 (2003) The effect of reflow process on the contact resistance and reliability of anisotropic conductive film interconnection for flip chip on flex applications. Microelectronics Reliability, 43 (4). pp. 625-633. ISSN 0026-2714 (doi:https://doi.org/10.1016/S0026-2714(02)00348-7)

Hong Kong Research Grant Council fund for Cooperative Research Center on Conductive Adhesive Technology for High Density Electronic Packaging (Project no. 8720003)

Yin, C.Y. ORCID: 0000-0003-0298-0420, Alam, M.O., Chan, Y.C., Bailey, C. ORCID: 0000-0002-9438-3879 and Lu, Hua ORCID: 0000-0002-4392-6562 (2003) The effect of reflow process on the contact resistance and reliability of anisotropic conductive film interconnection for flip chip on flex applications. Microelectronics Reliability, 43 (4). pp. 625-633. ISSN 0026-2714 (doi:https://doi.org/10.1016/S0026-2714(02)00348-7)

IeMRC

Newcombe, D.R., Chamund, Dinesh, Bailey, Christopher ORCID: 0000-0002-9438-3879 and Lu, Hua ORCID: 0000-0002-4392-6562 (2010) Reliability metrics for IGBT power modules. In: Proceedings - 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2010. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 670-674. ISBN 9781424481408 (doi:https://doi.org/10.1109/ICEPT.2010.5582869)

Kamara, E., Lu, H. ORCID: 0000-0002-4392-6562, Bailey, C. ORCID: 0000-0002-9438-3879, Hunt, C., Di Maio, D. and Thomas, O. (2010) A multi-disciplinary study of vibration based reliability of lead-free electronic interconnects. Microelectronics Reliability, 50 (9-11). pp. 1706-1710. ISSN 0026-2714 (doi:https://doi.org/10.1016/j.microrel.2010.07.152)

Kamara, Elisha, Lu, Hua ORCID: 0000-0002-4392-6562, Bailey, Chris ORCID: 0000-0002-9438-3879, Hunt, Chris, Di Maio, Davide and Thomas, Owen (2010) Computer simulation and design of a solder joint vibration test machine. In: 2010 11th International Conference on Thermal, Mechanical and Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems, EuroSimE 2010. IEEE Conference Publications . Institute of Electrical and Electronic Engineers, Inc., Piscataway, NJ, USA. ISBN 978-1-4244-7026-6 (doi:https://doi.org/10.1109/ESIME.2010.5464587)

IeMRC (Innovative Electronics Manufacturing Research Centre)

Yin, Chunyan ORCID: 0000-0003-0298-0420, Lu, Hua ORCID: 0000-0002-4392-6562, Musallam, Mahera, Bailey, Chris ORCID: 0000-0002-9438-3879 and Johnson, C. Mark (2010) Prognostic reliability analysis of power electronics modules. International Journal of Performability Engineering, 6 (5):10. pp. 513-524. ISSN 0973-1318

Innovative Electronics Manufacturing Centre (IeMRC)

Yin, C.Y. ORCID: 0000-0003-0298-0420, Lu, H. ORCID: 0000-0002-4392-6562, Musallam, M., Bailey, C. ORCID: 0000-0002-9438-3879 and Johnson, C. M. (2008) A prognostic assessment method for power electronics modules. In: 2nd Electronics System-Integration Technology Conference, 2008. ESTC 2008. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 1353-1358. ISBN 978-1-4244-2814-4 (Print), 978-1-4244-2813-7 (Online) (doi:https://doi.org/10.1109/ESTC.2008.4684552)

Innovative Electronics Manufacturing Research Centre

Yin, Chunyan ORCID: 0000-0003-0298-0420, Lu, Hua ORCID: 0000-0002-4392-6562, Musallam, M., Bailey, Christopher ORCID: 0000-0002-9438-3879 and Johnson, C.M. (2010) In-service reliability assessment of solder interconnect in power electronics modules. In: 2010 Prognostics and System Health Management Conference, PHM '10. IEEE Conference Publications . Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA. ISBN 9781424447565 (Print), 9781424447589 (Online) (doi:https://doi.org/10.1109/PHM.2010.5413346)

Innovative Electronics Manufacturing Research Centre (IeMRC, SP/03/02/11) grant

Rajaguru, Pushparajah ORCID: 0000-0002-6041-0517, Lu, Hua ORCID: 0000-0002-4392-6562 and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2015) A time dependent damage indicator model for Sn3.5Ag solder layer in power electronic module. Microelectronics Reliability, 55 (11). pp. 2371-2381. ISSN 0026-2714 (doi:https://doi.org/10.1016/j.microrel.2015.07.047)

Innovative electronic Manufacturing Research Centre (IeMRC Project Number: SP/03/02/11)

Rajaguru, Pushparajah ORCID: 0000-0002-6041-0517, Lu, Hua ORCID: 0000-0002-4392-6562 and Bailey, Chris ORCID: 0000-0002-9438-3879 (2015) Sintered silver finite element modelling and reliability based design optimisation in power electronic module. Microelectronics Reliability, 55 (6). pp. 919-930. ISSN 0026-2714 (doi:https://doi.org/10.1016/j.microrel.2015.03.011)

Innovative electronics Manufacturing Research Centre (IeMRC)

Rizvi, M.J., Skuriat, R., Tilford, Tim ORCID: 0000-0001-8307-6403, Bailey, Christopher ORCID: 0000-0002-9438-3879, Johnson, C. Mark and Lu, Hua ORCID: 0000-0002-4392-6562 (2009) Modelling of jet-impingement cooling for power electronics. In: 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, 2009. EuroSimE 2009. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA. ISBN 978-1-4244-4160-0 (doi:https://doi.org/10.1109/ESIME.2009.4938428)

Lu, Hua ORCID: 0000-0002-4392-6562, Loh, Wei-Sun, Bailey, Christopher ORCID: 0000-0002-9438-3879 and Johnson, C. Mark (2008) Computer simulation of aluminium wirebonds with globtop in power electronics modules. 3rd International Microsystems, Packaging, Assembly & Circuits Technology Conference, 2008. IMPACT 2008. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 348-351. ISBN 978-1-4244-3623-1 (doi:https://doi.org/10.1109/IMPACT.2008.4783883)

Lu, Hua ORCID: 0000-0002-4392-6562, Loh, Wei-Sun, Bailey, Christopher ORCID: 0000-0002-9438-3879 and Johnson, C. Mark (2008) Computer modelling analysis of the globtop's effects on aluminium wirebond reliability. 2nd Electronics System-Integration Technology Conference, 2008. ESTC 2008. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 1369-1373. ISBN 978-1-4244-2814-4 (Print) 978-1-4244-2813-7 (Online) (doi:https://doi.org/10.1109/ESTC.2008.4684555)

Bailey, C. ORCID: 0000-0002-9438-3879, Lu, H. ORCID: 0000-0002-4392-6562, Yin, C. ORCID: 0000-0003-0298-0420 and Ridout, S. (2008) Predictive reliability, prognostics and risk assessment for power modules. CIPS 2008: 5th International Conference on Integrated Power Electronics Systems. Proceedings, March, 11-13, 2008 Nuremberg/Germany. ETG-Fachbericht (111). VDE Verlag GmbH, Berlin-Offenbach, Germany, pp. 19-26. ISBN 9783800730896

Yin, C.Y, ORCID: 0000-0003-0298-0420, Lu, H. ORCID: 0000-0002-4392-6562, Musallam, M., Bailey, C. ORCID: 0000-0002-9438-3879 and Johnson, C.M. (2008) A physics-of-failure based prognostic method for power modules. In: 10th Electronics Packaging Technology Conference (EPTC 2008). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 1190-1195. ISBN 9781424421176 (doi:https://doi.org/10.1109/EPTC.2008.4763591)

Innovative electronics Manufacturing Research Centre (IeMRC) - A Prognostic and Diagnostic Environment for High Reliability Electronic Systems Project: [SP/06/03]

Lu, Hua ORCID: 0000-0002-4392-6562, Bailey, Chris ORCID: 0000-0002-9438-3879 and Yin, Chunyan ORCID: 0000-0003-0298-0420 (2009) Design for reliability of power electronics modules. Microelectronics Reliability, 49 (9-11). pp. 1250-1255. ISSN 0026-2714 (doi:https://doi.org/10.1016/j.microrel.2009.07.055)

Innovative electronics Manufacturing Research Centre (IeMRC) - Power Electronics Flagship Project: [FS/05/01]

Lu, Hua ORCID: 0000-0002-4392-6562, Bailey, Chris ORCID: 0000-0002-9438-3879 and Yin, Chunyan ORCID: 0000-0003-0298-0420 (2009) Design for reliability of power electronics modules. Microelectronics Reliability, 49 (9-11). pp. 1250-1255. ISSN 0026-2714 (doi:https://doi.org/10.1016/j.microrel.2009.07.055)

Intemational Tin Research Institute

Lu, Hua ORCID: 0000-0002-4392-6562 and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2002) Computer modelling of the reliability of flip chips with metal column bumping. In: ITHERM 2002. The Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems [Proceedings]. Institute of Electrical and Electronics Engineers, Inc., pp. 967-973. ISBN 0780371526 (doi:https://doi.org/10.1109/ITHERM.2002.1012561)

International Tin Research Institute

Lu, H. ORCID: 0000-0002-4392-6562 and Bailey, C. ORCID: 0000-0002-9438-3879 (2002) Predicting optimal process conditions for flip-chip aassembly using copper column bumped dies. In: Proceedings of 4th Electronics Packaging Technology Conference (EPTC 2002). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 338-343. ISBN 0780374355 (doi:https://doi.org/10.1109/EPTC.2002.1185694)

Lu, H. ORCID: 0000-0002-4392-6562 and Bailey, C. ORCID: 0000-0002-9438-3879 (2002) Predicting the relationship between reliability and geometric parameters of cu column bumped flip-chips. In: The Fifth International IEEE Symposium on High Density Packaging and Component Failure Analysis in Electronics Manufacturing [Proceedings]. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 85-89. ISBN 078039822X

MBDA

Lu, Hua ORCID: 0000-0002-4392-6562 and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2002) Computer modelling of the reliability of flip chips with metal column bumping. In: ITHERM 2002. The Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems [Proceedings]. Institute of Electrical and Electronics Engineers, Inc., pp. 967-973. ISBN 0780371526 (doi:https://doi.org/10.1109/ITHERM.2002.1012561)

Lu, H. ORCID: 0000-0002-4392-6562 and Bailey, C. ORCID: 0000-0002-9438-3879 (2002) Predicting optimal process conditions for flip-chip aassembly using copper column bumped dies. In: Proceedings of 4th Electronics Packaging Technology Conference (EPTC 2002). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 338-343. ISBN 0780374355 (doi:https://doi.org/10.1109/EPTC.2002.1185694)

Lu, H. ORCID: 0000-0002-4392-6562 and Bailey, C. ORCID: 0000-0002-9438-3879 (2002) Predicting the relationship between reliability and geometric parameters of cu column bumped flip-chips. In: The Fifth International IEEE Symposium on High Density Packaging and Component Failure Analysis in Electronics Manufacturing [Proceedings]. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 85-89. ISBN 078039822X

Materials and Components for Missiles, Innovation and Technology Partnership

Tilford, Timothy ORCID: 0000-0001-8307-6403, Cook, A., Lu, H. ORCID: 0000-0002-4392-6562, Ramambasoa, A. and Conseil, F. (2014) Numerical analysis of the performance of highly oriented pyrolytic graphite heat spreader in thermal management of microelectronics assemblies. In: Electronics Systemintegration Technology Conference, 16-18 Sep 2014, Helsinki, Finland. (doi:https://doi.org/10.1109/ESTC.2014.6962815)

Multicore Solder Ltd

Lu, Hua ORCID: 0000-0002-4392-6562 and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2002) Computer modelling of the reliability of flip chips with metal column bumping. In: ITHERM 2002. The Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems [Proceedings]. Institute of Electrical and Electronics Engineers, Inc., pp. 967-973. ISBN 0780371526 (doi:https://doi.org/10.1109/ITHERM.2002.1012561)

Multicore Solder Ltd.

Lu, H. ORCID: 0000-0002-4392-6562 and Bailey, C. ORCID: 0000-0002-9438-3879 (2002) Predicting optimal process conditions for flip-chip aassembly using copper column bumped dies. In: Proceedings of 4th Electronics Packaging Technology Conference (EPTC 2002). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 338-343. ISBN 0780374355 (doi:https://doi.org/10.1109/EPTC.2002.1185694)

Lu, H. ORCID: 0000-0002-4392-6562 and Bailey, C. ORCID: 0000-0002-9438-3879 (2002) Predicting the relationship between reliability and geometric parameters of cu column bumped flip-chips. In: The Fifth International IEEE Symposium on High Density Packaging and Component Failure Analysis in Electronics Manufacturing [Proceedings]. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 85-89. ISBN 078039822X

National Natural Science Foundation of China (Grant No. 51607016)

Lu, Hua ORCID: 0000-0002-4392-6562 and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2017) Failure and reliability analysis of a SiC power module based on stress comparison to a Si device. IEEE Transactions on Device and Materials Reliability, 17 (4). pp. 727-737. ISSN 1530-4388 (doi:https://doi.org/10.1109/TDMR.2017.2766692)

National Physical Laboratory

Kamara, E., Lu, H. ORCID: 0000-0002-4392-6562, Bailey, C. ORCID: 0000-0002-9438-3879, Hunt, C., Di Maio, D. and Thomas, O. (2010) A multi-disciplinary study of vibration based reliability of lead-free electronic interconnects. Microelectronics Reliability, 50 (9-11). pp. 1706-1710. ISSN 0026-2714 (doi:https://doi.org/10.1016/j.microrel.2010.07.152)

Kamara, Elisha, Lu, Hua ORCID: 0000-0002-4392-6562, Bailey, Chris ORCID: 0000-0002-9438-3879, Hunt, Chris, Di Maio, Davide and Thomas, Owen (2010) Computer simulation and design of a solder joint vibration test machine. In: 2010 11th International Conference on Thermal, Mechanical and Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems, EuroSimE 2010. IEEE Conference Publications . Institute of Electrical and Electronic Engineers, Inc., Piscataway, NJ, USA. ISBN 978-1-4244-7026-6 (doi:https://doi.org/10.1109/ESIME.2010.5464587)

Research Grants Council, Hong Kong, Ref. No. 9041636 (A study of nanostructured electronic interconnects-preparation, characterization and integration)

Xu, Sha, Chan, Yan Cheong, Zhu, Xiaoxin, Lu, Hua ORCID: 0000-0002-4392-6562 and Bailey, Chris ORCID: 0000-0002-9438-3879 (2014) Effective method to disperse and incorporate carbon nanotubes in electroless Ni-P deposits. In: 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) Proceedings. Curran Associates, Stoughton, WI, USA, pp. 1342-1347. ISBN 9781479924080 (doi:https://doi.org/10.1109/ECTC.2014.6897466)

SP/06/03 (A Prognostic and Diagnostic Environment for High Reliability Electronic Systems)

Yin, Chunyan ORCID: 0000-0003-0298-0420, Lu, Hua ORCID: 0000-0002-4392-6562, Musallam, Mahera, Bailey, Chris ORCID: 0000-0002-9438-3879 and Johnson, C. Mark (2010) Prognostic reliability analysis of power electronics modules. International Journal of Performability Engineering, 6 (5):10. pp. 513-524. ISSN 0973-1318

Scottish Consortium in Integrated Micro Photonic Systems (SCIMPS), funded by the Scottish Funding Council under the Strategic Research Development Grant scheme (SRDG)

Flynn, David, Lu, Hua ORCID: 0000-0002-4392-6562, Bailey, Chris ORCID: 0000-0002-9438-3879 and Desmulliez, Marc P.Y. (2008) Design, modeling and characterization of a microinductor for future DC-DC power converters. In: 2nd Electronics System-Integration Technology Conference, 2008. ESTC 2008. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 577-582. ISBN 978-1-4244-2814-4 (print), 978-1-4244-2813-7 (online) (doi:https://doi.org/10.1109/ESTC.2008.4684414)

Scottish Innovative Manufacturing Research Center (SMI)

Flynn, David, Lu, Hua ORCID: 0000-0002-4392-6562, Bailey, Chris ORCID: 0000-0002-9438-3879 and Desmulliez, Marc P.Y. (2008) Design, modeling and characterization of a microinductor for future DC-DC power converters. In: 2nd Electronics System-Integration Technology Conference, 2008. ESTC 2008. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 577-582. ISBN 978-1-4244-2814-4 (print), 978-1-4244-2813-7 (online) (doi:https://doi.org/10.1109/ESTC.2008.4684414)

TSB UK

Newcombe, D.R., Chamund, Dinesh, Bailey, Christopher ORCID: 0000-0002-9438-3879 and Lu, Hua ORCID: 0000-0002-4392-6562 (2010) Reliability metrics for IGBT power modules. In: Proceedings - 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2010. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 670-674. ISBN 9781424481408 (doi:https://doi.org/10.1109/ICEPT.2010.5582869)

Technology Strategy Board

Lu, Hua ORCID: 0000-0002-4392-6562 and Bailey, C. ORCID: 0000-0002-9438-3879 (2011) Optimisation of heatsink design for a ruggedised LCD display. In: 2011 International Conference on Electronic Packaging Technology & High Density Packaging. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 492-496. ISBN 9781457717703 (doi:https://doi.org/10.1109/ICEPT.2011.6066883)

Bailey, C. ORCID: 0000-0002-9438-3879, Lee, Y., Lu, H. ORCID: 0000-0002-4392-6562, Strusevich, N. and Yin, C. ORCID: 0000-0003-0298-0420 (2010) Packaging of LED backlights for ruggedised displays. In: International Symposium on Advanced Packaging Materials: Microtech, 2010. APM '10. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 98-101. ISBN 9781424467563 (doi:https://doi.org/10.1109/ISAPM.2010.5441377)

Technology Strategy Board (TSB)

Bailey, C. ORCID: 0000-0002-9438-3879, Lu, H. ORCID: 0000-0002-4392-6562, Yin, C. ORCID: 0000-0003-0298-0420 and Ridout, S. (2008) Predictive reliability, prognostics and risk assessment for power modules. CIPS 2008: 5th International Conference on Integrated Power Electronics Systems. Proceedings, March, 11-13, 2008 Nuremberg/Germany. ETG-Fachbericht (111). VDE Verlag GmbH, Berlin-Offenbach, Germany, pp. 19-26. ISBN 9783800730896

Technology Strategy Board (TSB) - [TP/3/DSM/6/I/16796]

Lu, Hua ORCID: 0000-0002-4392-6562, Bailey, Chris ORCID: 0000-0002-9438-3879 and Yin, Chunyan ORCID: 0000-0003-0298-0420 (2009) Design for reliability of power electronics modules. Microelectronics Reliability, 49 (9-11). pp. 1250-1255. ISSN 0026-2714 (doi:https://doi.org/10.1016/j.microrel.2009.07.055)

Technology Strategy Board for the ENDVIEW project (ProjectTP11/LLD/6/I/AFOO5K)

Bailey, Chris ORCID: 0000-0002-9438-3879, Lu, Hua ORCID: 0000-0002-4392-6562, Yin, Chunyan ORCID: 0000-0003-0298-0420 and Lee, Yek (2010) Multi-physics modelling for packaging of liquid crystal displays in harsh environments. In: Electronics System Integration Technology Conference, ESTC 2010 - Proceedings. IEEE Computer Society, Piscataway, USA, pp. 1-6. ISBN 9781424485536 (Print), 9781424485543 (Online) (doi:https://doi.org/10.1109/ESTC.2010.5642898)

The Engineering and Physical Science Research Council (EPSRC) through the Underpinning Power Electronics HUB (Grant No. EP/K035304/1)

Rajaguru, P. ORCID: 0000-0002-6041-0517, Lu, H. ORCID: 0000-0002-4392-6562, Bailey, C. ORCID: 0000-0002-9438-3879, Ortiz-Gonzalez, J. and Alatise, O. (2016) Electro-thermo-mechanical modelling and analysis of the Press Pack Diode in Power Electronics. In: 2015 21st International Workshop on Thermal Investigations of ICs and Systems (THERMINIC). IEEE, pp. 1-6. ISBN 978-1-4673-9706-3 (doi:https://doi.org/10.1109/THERMINIC.2015.7389607)

The Engineering and Physical Sciences Research Council (EPSRC)

Lu, Hua ORCID: 0000-0002-4392-6562 and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2017) Failure and reliability analysis of a SiC power module based on stress comparison to a Si device. IEEE Transactions on Device and Materials Reliability, 17 (4). pp. 727-737. ISSN 1530-4388 (doi:https://doi.org/10.1109/TDMR.2017.2766692)

Rajaguru, Pushparajah ORCID: 0000-0002-6041-0517, Ortiz-Gonzalez, Jose Angel, Lu, Hua ORCID: 0000-0002-4392-6562, Bailey, Chris ORCID: 0000-0002-9438-3879 and Alatise, Olawiwola (2017) A multiphysics modeling and experimental analysis of pressure contacts in power electronics applications. IEEE Transactions on Components, Packaging and Manufacturing Technology, 7 (6). pp. 893-900. ISSN 2156-3950 (Print), 2156-3985 (Online) (doi:https://doi.org/10.1109/TCPMT.2017.2688021)

Rajaguru, P. ORCID: 0000-0002-6041-0517, Lu, H. ORCID: 0000-0002-4392-6562, Bailey, C. ORCID: 0000-0002-9438-3879, Ortiz-Gonzalez, J. and Alatise, O. (2016) Evaluation of the impact of the physical dimensions and material of the semiconductor chip on the reliability of Sn3.5Ag solder interconnect in power electronic module: A finite element analysis perspective. Microelectronics Reliability, 68. pp. 77-85. ISSN 0026-2714 (doi:https://doi.org/10.1016/j.microrel.2016.12.002)

The Engineering and Physical Sciences Research Council (EPSRC) Grant No. EP/K03480411

Shahjalal, Mohammad, Lu, Hua ORCID: 0000-0002-4392-6562 and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2017) Electro-thermal modelling of multi chip power modules for high power converter application. In: 2017 18th International Conference on Electronic Packaging Technology (ICEPT), Harbin. IEEE, pp. 940-945. ISBN 978-1-5386-2973-4 (doi:https://doi.org/10.1109/ICEPT.2017.8046599)

The Engineering and Physical Sciences Research Council (EPSRC); "The Underpinning Power Electronics HUB" (Grant Agreement No. EP/K034804/1)

Rajaguru, Pushpa ORCID: 0000-0002-6041-0517, Lu, Hua ORCID: 0000-0002-4392-6562 and Bailey, Chris ORCID: 0000-0002-9438-3879 (2019) Time integration damage model for Sn3.5Ag solder interconnect in power electronic module. IEEE Transactions on Device and Materials Reliability, 19 (1). ISSN 1530-4388 (Print), 1558-2574 (Online) (doi:https://doi.org/10.1109/TDMR.2019.2891949)

The National Key R&D Program of China (Grant No. 2017YFB0102303)

Lu, Hua ORCID: 0000-0002-4392-6562 and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2017) Failure and reliability analysis of a SiC power module based on stress comparison to a Si device. IEEE Transactions on Device and Materials Reliability, 17 (4). pp. 727-737. ISSN 1530-4388 (doi:https://doi.org/10.1109/TDMR.2017.2766692)

UK Department of Trade and Indusky under a TCS Programme (Grant #s 2341 and 2976)

Warner, Matt, Parry, John, Bailey, Chris ORCID: 0000-0002-9438-3879 and Lu, Hua ORCID: 0000-0002-4392-6562 (2004) Solder life prediction in a thermal analysis software environment. In: The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena In Electronic Systems (ITHERM 2004) [Proceedings]. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 391-396. ISBN 0780383575 ISSN 1089-9870 (doi:https://doi.org/10.1109/ITHERM.2004.1318309)

UK Engineering and Physical Sciences Research (EPSRC)

Lu, Hua ORCID: 0000-0002-4392-6562, Zhang, Xiaohong and Titman, J.M. (1997) Rotating-frame nuclear magnetic relaxation of spins diffusing on a disordered lattice: a Monte Carlo model. Journal of Physics: Condensed Matter, 9 (42). pp. 9097-9111. ISSN 0953-8984 (Print), 1361-648X (Online) (doi:https://doi.org/10.1088/0953-8984/9/42/022)

UK Engineering and Physical Sciences Research (EPSRC) Grants GR/H26758 and GR/J89859

Lu, Hua ORCID: 0000-0002-4392-6562, Bishop, J.E.L. and Tucker, J.W. (1996) Simulation of transverse and longitudinal magnetic ripple structures induced by surface anisotropy. Journal of Magnetism and Magnetic Materials, 163 (3). pp. 285-291. ISSN 0304-8853 (doi:https://doi.org/10.1016/S0304-8853(96)00345-9)

UK Engineering and Physical Sciences Research Council (EPSRC)

Newcombe, D.R., Chamund, Dinesh, Bailey, Christopher ORCID: 0000-0002-9438-3879 and Lu, Hua ORCID: 0000-0002-4392-6562 (2010) Reliability metrics for IGBT power modules. In: Proceedings - 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2010. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 670-674. ISBN 9781424481408 (doi:https://doi.org/10.1109/ICEPT.2010.5582869)

Kamara, E., Lu, H. ORCID: 0000-0002-4392-6562, Bailey, C. ORCID: 0000-0002-9438-3879, Hunt, C., Di Maio, D. and Thomas, O. (2010) A multi-disciplinary study of vibration based reliability of lead-free electronic interconnects. Microelectronics Reliability, 50 (9-11). pp. 1706-1710. ISSN 0026-2714 (doi:https://doi.org/10.1016/j.microrel.2010.07.152)

Lu, Hua ORCID: 0000-0002-4392-6562 and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2002) Computer modelling of the reliability of flip chips with metal column bumping. In: ITHERM 2002. The Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems [Proceedings]. Institute of Electrical and Electronics Engineers, Inc., pp. 967-973. ISBN 0780371526 (doi:https://doi.org/10.1109/ITHERM.2002.1012561)

Lu, H. ORCID: 0000-0002-4392-6562 and Bailey, C. ORCID: 0000-0002-9438-3879 (2002) Predicting optimal process conditions for flip-chip aassembly using copper column bumped dies. In: Proceedings of 4th Electronics Packaging Technology Conference (EPTC 2002). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 338-343. ISBN 0780374355 (doi:https://doi.org/10.1109/EPTC.2002.1185694)

Bailey, C. ORCID: 0000-0002-9438-3879, Lu, H. ORCID: 0000-0002-4392-6562 and Wheeler, D. (2001) Computational modeling techniques for reliability of electronic components on printed circuit boards. Applied Numerical Mathematics, 40 (1-2). pp. 101-117. ISSN 0168-9274 (doi:https://doi.org/10.1016/S0168-9274(01)00065-4)

Lu, Hua ORCID: 0000-0002-4392-6562 and Bailey, C. ORCID: 0000-0002-9438-3879 (2000) Material properties, geometry and their effect on the fatigue life of two flip-chip models. In: ITHERM Proceedings. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 65-71. ISBN 0780359127 ISSN 0189-9870 (doi:https://doi.org/10.1109/ITHERM.2000.866172)

Lu, Hua ORCID: 0000-0002-4392-6562, Bishop, J.E.L. and Tucker, J.W. (1996) Micromagnetic simulation of domain walls in iron films. Journal of Magnetism and Magnetic Materials, 155 (1-3). pp. 49-51. ISSN 0304-8853 (doi:https://doi.org/10.1016/0304-8853(95)00665-6)

UK Engineering and Physical Sciences Research Council (EPSRC), (ProJect GRIN 14095/0 I)

Lu, H. ORCID: 0000-0002-4392-6562 and Bailey, C. ORCID: 0000-0002-9438-3879 (2002) Predicting the relationship between reliability and geometric parameters of cu column bumped flip-chips. In: The Fifth International IEEE Symposium on High Density Packaging and Component Failure Analysis in Electronics Manufacturing [Proceedings]. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 85-89. ISBN 078039822X

UK Engineering and Physical Sciences Research Council (EPSRC). Grant GR/R09190 - Microsystems Assembly Technology for the 21st Century (MAT21)

Bailey, C. ORCID: 0000-0002-9438-3879, Stoyanov, S. ORCID: 0000-0001-6091-1226 and Lu, H. ORCID: 0000-0002-4392-6562 (2004) Reliability predictions for high density packaging. In: Proceeding of The Sixth IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis (HDP'04). Institute of Electrical and Electronics Engineers, Inc., Piscataway, N.J., U.S.A., pp. 121-128. ISBN 0780386205 (doi:https://doi.org/10.1109/HPD.2004.1346684)

UK Engineering and Physics Research Council (EPSRC) - EP/ C534212/1

Xue, Xiangdong, Bailey, Chris ORCID: 0000-0002-9438-3879, Lu, Hua ORCID: 0000-0002-4392-6562 and Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 (2011) Integration of analytical techniques in stochastic optimization of microsystem reliability. Microelectronics Reliability, 51 (5). pp. 936-945. ISSN 0026-2714 (doi:https://doi.org/10.1016/j.microrel.2011.01.008)

United Kingdom Technology Strategy Board

Lu, Hua ORCID: 0000-0002-4392-6562, Loh, Wei-Sun, Bailey, Christopher ORCID: 0000-0002-9438-3879 and Johnson, C. Mark (2008) Computer simulation of aluminium wirebonds with globtop in power electronics modules. 3rd International Microsystems, Packaging, Assembly & Circuits Technology Conference, 2008. IMPACT 2008. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 348-351. ISBN 978-1-4244-3623-1 (doi:https://doi.org/10.1109/IMPACT.2008.4783883)

Lu, Hua ORCID: 0000-0002-4392-6562, Loh, Wei-Sun, Bailey, Christopher ORCID: 0000-0002-9438-3879 and Johnson, C. Mark (2008) Computer modelling analysis of the globtop's effects on aluminium wirebond reliability. 2nd Electronics System-Integration Technology Conference, 2008. ESTC 2008. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 1369-1373. ISBN 978-1-4244-2814-4 (Print) 978-1-4244-2813-7 (Online) (doi:https://doi.org/10.1109/ESTC.2008.4684555)

University of Greenwich

Yin, C.Y. ORCID: 0000-0003-0298-0420, Lu, H. ORCID: 0000-0002-4392-6562, Bailey, C. ORCID: 0000-0002-9438-3879 and Chan, Y.C. (2004) Effects of reflow process on the reliability of flip chip on flex interconnections using anisotropic conductive adhesives. In: 2004 International IEEE Conference on Asian Green Electronics (AGEC) [Proceedings]. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 240-245. ISBN 0-7803-8203-X (doi:https://doi.org/10.1109/AGEC.2004.1290912)

Yin, C.Y. ORCID: 0000-0003-0298-0420, Lu, H. ORCID: 0000-0002-4392-6562, Bailey, C. ORCID: 0000-0002-9438-3879 and Chan, Y.C. (2003) Experimental and modeling analysis of the reliability of the anisotropic conductive films. In: 2003 Proceedings 53rd Electronic Components & Technology Conference. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 698-702. ISBN 0780377915 ISSN 0569-5503 (doi:https://doi.org/10.1109/ECTC.2003.1216359)

University of Greenwich (University Bursary Ref. No: RAE Fund 13265-R09803) (XZ)

Zhu, X., Kotadia, H., Xu, S., Lu, H. ORCID: 0000-0002-4392-6562, Mannan, S. H., Bailey, C. ORCID: 0000-0002-9438-3879 and Chan, Y. C. (2014) Electromigration in Sn-Ag solder thin films under high current density. Thin Solid Films, 565. pp. 193-201. ISSN 0040-6090 (doi:https://doi.org/10.1016/j.tsf.2014.06.030)

University of Greenwich (Xiaoxin Zhu)

Zhu, X., Kotadia, H., Xu, S., Lu, H. ORCID: 0000-0002-4392-6562, Mannan, S.H., Bailey, C. ORCID: 0000-0002-9438-3879 and Chan, Y.C. (2013) Comments on electromigration analysis methods. In: Proceedings of 14th International Conference on Electronic Packaging Technology (ICEPT 2013). Institute of Electrical and Electronics, Inc., Piscataway, NJ, USA, pp. 529-534. ISBN 9781479904983 (doi:https://doi.org/10.1109/ICEPT.2013.6756527)

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