Article

Santhanakrishnan, Mani Sekaran, Tilford, Timothy ORCID: 0000-0001-8307-6403 and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2022) Heat transfer characteristics of plate fin heat sink with longitudinal vortex generators. International Journal of Numerical Methods for Heat and Fluid Flow, 33 (3). pp. 1203-1228. ISSN 0961-5539 (doi:https://doi.org/10.1108/HFF-06-2022-0386)

Xu, Yilun, Xian, Jingwei, Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Bailey, Christopher ORCID: 0000-0002-9438-3879 , Coyle, Richard, Gourlay, Christopher and Dunne, Fionn (2022) A multi-scale approach to microstructure-sensitive thermal fatigue in solder joints. International Journal of Plasticity, 155:103308. ISSN 0749-6419 (doi:https://doi.org/10.1016/j.ijplas.2022.103308)

Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Bailey, Christopher ORCID: 0000-0002-9438-3879 , Stewart, Paul, Parker, Mike and Roulston, John F. (2020) Experimental and modelling study on delamination risks for refinished electronic packages under hot solder dip loads. IEEE Transactions on Components, Packaging and Manufacturing Technology, 10 (3). pp. 502-515. ISSN 2156-3950 (Print), 2156-3985 (Online) (doi:https://doi.org/10.1109/TCPMT.2020.2972635)

Hinojosa Herrera, Ana Elsa ORCID: 0000-0002-0636-1881 , Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Bailey, Christopher ORCID: 0000-0002-9438-3879 , Walshaw, Christopher ORCID: 0000-0003-0253-7779 and Yin, Chunyan ORCID: 0000-0003-0298-0420 (2019) Data analytics to reduce stop-on-fail test in electronics manufacturing. Open Computer Sciences, 9 (1). pp. 200-211. ISSN 2299-1093 (Online) (doi:https://doi.org/10.1515/comp-2019-0014)

Yin, Chunyan ORCID: 0000-0003-0298-0420 , Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Bailey, Christopher ORCID: 0000-0002-9438-3879 and Stewart, Paul (2019) Thermo-mechanical analysis of conformally coated QFNs for high reliability applications. IEEE Transactions on Components, Packaging and Manufacturing Technology, 9 (11). pp. 2210-2218. ISSN 2156-3950 (Print), 2156-3985 (Online) (doi:https://doi.org/10.1109/TCPMT.2019.2925874)

Bailey, Christopher ORCID: 0000-0002-9438-3879 , Yin, Chunyan ORCID: 0000-0003-0298-0420 and Rajaguru, Pushparajah ORCID: 0000-0002-6041-0517 (2019) Predicting damage and life expectancy of subsea power cables in offshore renewable energy applications. IEEE ACCESS, 7. pp. 54658-54669. ISSN 2169-3536 (Online) (doi:https://doi.org/10.1109/ACCESS.2019.2911260)

Tonry, Catherine E. H. ORCID: 0000-0002-8214-0845 , Patel, Mayur K., Yu, Weixing, Desmulliez, Marc P. Y. and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2019) Fabrication of hollow polymer microstructures using dielectric and capillary forces. Microsystem Technologies. pp. 1-8. ISSN 0946-7076 (Print), 1432-1858 (Online) (doi:https://doi.org/10.1007/s00542-019-04409-z)

Santhanakrishnan, Mani Sekaran, Tilford, Timothy ORCID: 0000-0001-8307-6403 and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2018) Performance assessment of density and level-set topology optimisation methods for 3D heatsink design. Journal of Algorithms and Computational Technology, 12 (3). pp. 273-287. ISSN 1748-3018 (Print), 1748-3026 (Online) (doi:https://doi.org/10.1177/1748301818779019)

Lu, Hua ORCID: 0000-0002-4392-6562 and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2017) Failure and reliability analysis of a SiC power module based on stress comparison to a Si device. IEEE Transactions on Device and Materials Reliability, 17 (4). pp. 727-737. ISSN 1530-4388 (doi:https://doi.org/10.1109/TDMR.2017.2766692)

Rajaguru, Pushparajah ORCID: 0000-0002-6041-0517 , Lu, Hua ORCID: 0000-0002-4392-6562 and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2015) A time dependent damage indicator model for Sn3.5Ag solder layer in power electronic module. Microelectronics Reliability, 55 (11). pp. 2371-2381. ISSN 0026-2714 (doi:https://doi.org/10.1016/j.microrel.2015.07.047)

Musallam, Mahera, Yin, Chunyan ORCID: 0000-0003-0298-0420 , Bailey, Christopher ORCID: 0000-0002-9438-3879 and Johnson, Mark (2014) Mission profile-based reliability design and real-time life consumption estimation in power electronics. IEEE Transactions on Power Electronics, 30 (5). pp. 2601-2613. ISSN 0885-8993 (Print), 1941-0107 (Online) (doi:https://doi.org/10.1109/TPEL.2014.2358555)

Rajaguru, Pushparajah ORCID: 0000-0002-6041-0517 , Lu, Hua ORCID: 0000-0002-4392-6562 and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2014) Application of nonlinear fatigue damage models in power electronic module wirebond structure under various amplitude loadings. Advances in Manufacturing, 2 (3). pp. 239-250. ISSN 2095-3127 (Print), 2195-3597 (Online) (doi:https://doi.org/10.1007/s40436-014-0054-5)

Strusevich, Nadezhda, Desmulliez, Marc P.Y., Abraham, Eitan, Flynn, David, Jones, Thomas, Patel, Mayur and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2013) Electroplating for high aspect ratio vias in PCB manufacturing: enhancement capabilities of acoustic streaming. Advances in Manufacturing, 1 (3). pp. 211-217. ISSN 2095-3127 (Print), 2195-3597 (Online) (doi:https://doi.org/10.1007/s40436-013-0039-9)

Rajaguru, Pushparajah ORCID: 0000-0002-6041-0517 , Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Lu, Hua ORCID: 0000-0002-4392-6562 and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2013) Application of Kriging and radial basis function for reliability optimization in power modules. Journal of Electronic Packaging, 135 (2):021009. ISSN 1528-9044 (Print), 1043-7398 (Online) (doi:https://doi.org/10.1115/1.4024056)

Tonry, Catherine, Patel, Mayur K., Bailey, Christopher ORCID: 0000-0002-9438-3879 , Desmuliez, Marc P.Y., Cargill, Scott and Yu, Weixing (2013) A method for the micro-encapsulation of dielectric fluids in joined polymer shells. Current Organic Chemistry, 17 (1). pp. 65-71. ISSN 1385-2728 (Print), 1875-5348 (Online)

Sutharssan, Thamo, Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Bailey, Christopher ORCID: 0000-0002-9438-3879 and Rosunally, Yasmine (2012) Prognostics and health monitoring of high power LED. Micromachines, 3 (1). pp. 78-100. ISSN 2072-666X (doi:https://doi.org/10.3390/mi3010078)

Xue, Xiangdong, Patel, Mayur, Kersaudy-Kerhoas, Maïwenn, Bailey, Christopher ORCID: 0000-0002-9438-3879 and Desmulliez, Marc P.Y. (2011) Modelling and simulation of the behaviour of a biofluid in a microchannel biochip separator. Computer Methods in Biomechanics and Biomedical Engineering, 14 (6). pp. 549-560. ISSN 1025-5842 (Print), 1476-8259 (Online) (doi:https://doi.org/10.1080/10255842.2010.485570)

Rosunally, Yasmine, Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Bailey, Christopher ORCID: 0000-0002-9438-3879 , Mason, Peter, Campbell, Sheelagh, Monger, George and Bell, Ian (2010) Bayesian networks for predicting remaining life. International Journal of Performability Engineering, 6 (5). pp. 499-512. ISSN 0973-1318

Hughes, Michael, Strussevich, Nadia, Bailey, Christopher ORCID: 0000-0002-9438-3879 , McManus, Kevin, Kaufmann, Jens, Flynn, David and Desmulliez, Marc P.Y. (2009) Numerical algorithms for modelling electrodeposition: Tracking the deposition front under forced convection from megasonic agitation. International Journal for Numerical Methods in Fluids, 64 (3). pp. 237-268. ISSN 0271-2091 (Print), 1097-0363 (Online) (doi:https://doi.org/10.1002/fld.2140)

Tilford, Tim ORCID: 0000-0001-8307-6403 , Sinclair, Keith I., Rajaguru, P.R., Morris, James E., Desmulliez, Marc P.Y. and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2009) Numerical optimisation of polymer curing using a dual-section microwave system. Annual microwave heating symposium (43rd). pp. 129-136. ISSN 1070-0129

Rizvi, M.J., Lu, Hua ORCID: 0000-0002-4392-6562 and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2009) Modeling the diffusion of solid copper into liquid solder alloys. Thin Solid Films, 517 (5). pp. 1686-1689. ISSN 0040-6090 (doi:https://doi.org/10.1016/j.tsf.2008.09.105)

Xue, Xiangdong, Bailey, Christopher ORCID: 0000-0002-9438-3879 , Turitto, Michele and Ratchev, Svetan (2009) Modelling and optimization of a pneumatic microfeeder system. International Journal for Simulation and Multidisciplinary Design Optimization, 3 (1). pp. 307-315. ISSN 1779-627X (Print), 1779-6288 (Online) (doi:https://doi.org/10.1051/ijsmdo/2009003)

Rizvi, M.J., Bailey, Christopher ORCID: 0000-0002-9438-3879 and Lu, Hua ORCID: 0000-0002-4392-6562 (2008) Failure mechanisms of ACF joints under isothermal ageing. Microelectronics Journal, 39 (9). pp. 1101-1107. ISSN 0026-2692 (doi:https://doi.org/10.1016/j.mejo.2008.01.045)

Tilford, Tim, Sinclair, Keith I., Bailey, Christopher, Desmulliez, Marc P.Y., Parrott, Kevin and Sangster, Alan J. (2007) Coupled FDTD-FVM simulation of microwave heating of polymer materials for micro-systems packaging applications. Annual microwave heating symposium (41st). pp. 7-11. ISSN 1070-0129

Rizvi, M.J., Bailey, Christopher ORCID: 0000-0002-9438-3879 , Chan, Y.C. and Lu, Hua ORCID: 0000-0002-4392-6562 (2007) Effect of adding 0.3 wt% Ni into the Sn–0.7 wt%Cu solder: part I: wetting behavior on Cu and Ni substrates. Journal of Alloys and Compounds, 438 (1-2). pp. 116-121. ISSN 0925-8388 (doi:https://doi.org/10.1016/j.jallcom.2006.08.048)

Ridout, Stephen and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2007) Review of methods to predict solder joint reliability under thermo-mechanical cycling. Fatigue & Fracture of Engineering Materials & Structures, 30 (5). pp. 400-412. ISSN 8756-758X (doi:https://doi.org/10.1111/j.1460-2695.2006.01065.x)

Cross, Mark, Croft, Nick, Slone, Avril, Williams, Alison, Christakis, Nicholas, Patel, Mayur, Bailey, Christopher ORCID: 0000-0002-9438-3879 and Pericleous, Koulis A. ORCID: 0000-0002-7426-9999 (2007) Computational modelling of multi-physics and multi-scale processes in parallel. International Journal for Computational Methods and Engineering Science and Mechanics, 8 (2). pp. 63-74. ISSN 1550-2287 (doi:https://doi.org/10.1080/15502280601149510)

Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Kay, Robert W., Bailey, Christopher ORCID: 0000-0002-9438-3879 and Desmulliez, Marc P.Y. (2007) Computational modelling for reliable flip-chip packaging at sub-100 micron pitch using isotropic conductive adhesives. Microelectronics Reliability, 47 (1). pp. 132-141. ISSN 0026-2714 (doi:https://doi.org/10.1016/j.microrel.2006.01.004)

Rizvi, M.J., Bailey, Christopher ORCID: 0000-0002-9438-3879 , Chan, Y.C., Islam, M. and Lu, Hua ORCID: 0000-0002-4392-6562 (2007) Effect of adding 0.3wt% Ni into the Sn-0.7wt% Cu solder - Part II: Growth of intermetallic layer with Cu during wetting and aging. Journal of Alloys and Compounds, 438 (1-2). pp. 122-128. ISSN 0925-8388 (doi:https://doi.org/10.1016/j.jallcom.2006.08.071)

Tilford, Tim ORCID: 0000-0001-8307-6403 , Sinclair, Keith I., Bailey, Christopher ORCID: 0000-0002-9438-3879 , Desmulliez, Marc P.Y., Goussetis, George, Parrott, Kevin and Sangster, Alan J. (2007) Multiphysics simulation of microwave curing in micro-electronics packaging applications. Soldering & Surface Mount Technology, 19 (3). pp. 26-33. ISSN 0954-0911 (doi:https://doi.org/10.1108/09540910710843757)

Richardson, Andrew, Bailey, Christopher ORCID: 0000-0002-9438-3879 , Yanou, Jean Marc, Dumas, Norbert, Liu, Dongsheng, Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 and Strusevitch, Nadia (2007) "System in package technology" - design for manufacture challenges. Circuit World, 33 (1). pp. 36-46. ISSN 0305-6120 (doi:https://doi.org/10.1108/03056120710723706)

Kay, Robert W., Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Glinski, Greg P., Bailey, Christopher ORCID: 0000-0002-9438-3879 and Desmulliez, Marc P.Y. (2007) Ultra-fine pitch stencil printing for a low cost and low temperature flip-chip assembly process. IEEE Transactions on Components and Packaging Technologies, 30 (1). pp. 129-136. ISSN 1521-3331 (doi:https://doi.org/10.1109/TCAPT.2007.892085)

Ridout, Stephen, Dusek, Milos, Bailey, Christopher ORCID: 0000-0002-9438-3879 and Hunt, Chris (2006) Assessing the performance of crack detection tests for solder joints. Microelectronics Reliability, 46 (12). pp. 2122-2130. ISSN 0026-2714 (doi:https://doi.org/10.1016/j.microrel.2006.05.001)

Rizvi, M.J., Chan, Y.C., Bailey, Christopher ORCID: 0000-0002-9438-3879 , Lu, Hua ORCID: 0000-0002-4392-6562 and Islam, M.N. (2006) Effect of adding 1 wt% Bi into the Sn–2.8Ag–0.5Cu solder alloy on the intermetallic formations with Cu-substrate during soldering and isothermal aging. Journal of Alloys and Compounds, 407 (1-2). pp. 208-214. ISSN 0925-8388 (doi:https://doi.org/10.1016/j.jallcom.2005.06.050)

Yin, Chunyan ORCID: 0000-0003-0298-0420 , Lu, Hua ORCID: 0000-0002-4392-6562 , Bailey, Christopher ORCID: 0000-0002-9438-3879 and Chan, Y.C. (2006) Macro-micro modelling of moisture induced stresses in an ACF flip chip assembly. Soldering & Surface Mount Technology, 18 (2). pp. 27-32. ISSN 0954-0911 (doi:https://doi.org/10.1108/09540910610665107)

Lu, Hua ORCID: 0000-0002-4392-6562 and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2005) Dynamic analysis of Flip-Chip Self-Alignment. IEEE Transactions on Advanced Packaging, 28 (3). pp. 475-480. ISSN 1521-3323 (doi:https://doi.org/10.1109/TADVP.2005.848371)

Rizvi, M.J., Chan, Y.C., Bailey, Christopher ORCID: 0000-0002-9438-3879 and Lu, Hua ORCID: 0000-0002-4392-6562 (2005) Study of Anisotropic Conductive Adhesive Joint Behaviour under 3-Point Bending. Microelectronics Reliability, 4 (5). pp. 589-596. ISSN 0026-2714 (doi:https://doi.org/10.1016/j.microrel.2004.10.015)

Slone, Avril, Pericleous, Kyriacos A ORCID: 0000-0002-7426-9999 , Bailey, Christopher ORCID: 0000-0002-9438-3879 , Cross, M. and Bennett, C. (2002) Dynamic fluid-structure interactions using finite volume unstructured mesh procedures. Computers & Structures, 80 (5-6). pp. 371-390. ISSN 0045-7949 (doi:https://doi.org/10.1016/S0045-7949(01)00177-8)

Cross, Mark, Bailey, Christopher ORCID: 0000-0002-9438-3879 , Pericleous, Koulis ORCID: 0000-0002-7426-9999 , Williams, Alison, Bojarevics, Valdis ORCID: 0000-0002-7326-7748 , Croft, Nick and Taylor, Gary (2002) The multiphysics modeling of solidification and melting processes. JOM (The Member Journal of The Minerals, Metals & Materials Society), 2002 (Supp.). ISSN 1047-4838

Bailey, Christopher ORCID: 0000-0002-9438-3879 , Lu, Hua ORCID: 0000-0002-4392-6562 , Glinski, Greg, Wheeler, Daniel, Hamilton, Phil, Hendriksen, Mike and Smith, Brian (2002) Using computer models to identify optimal conditions for flip-chip assembly and reliability. Circuit World, 28 (1). pp. 14-20. ISSN 0305-6120 (doi:https://doi.org/10.1108/03056120210696658)

Bailey, Christopher ORCID: 0000-0002-9438-3879 , Wheeler, Daniel and Cross, Mark (1999) An integrated modeling approach to solder joint formation. IEEE Transactions on Components and Packaging Technology, 22 (4). pp. 497-502. ISSN 1521-3331 (doi:https://doi.org/10.1109/6144.814964)

Book Section

Flynn, David, Bailey, Christopher ORCID: 0000-0002-9438-3879 , Rajaguru, Pushpa ORCID: 0000-0002-6041-0517 , Wenshuo, Tang and Yin, Chunyan ORCID: 0000-0003-0298-0420 (2019) Prognostics and health management of subsea cables. In: Goodman, Douglas, Hofmeister, James P. and Szidarovszky, Ferenc, (eds.) Prognostics and Health Management: A Practical Approach to Improving System Reliability Using Condition-Based Data. Quality and Reliability Engineering Series . Wiley-Blackwell. ISBN 978-1119356653

Pavuluri, S.K., Goussetis, George, Desmulliez, Marc P.Y., Adamietz, R., Tilford, Tim ORCID: 0000-0001-8307-6403 , Ferenets, M., Muller, G., Eicher, F. and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2011) Open-ended single mode resonant applicator for microelectronics packaging applications. Proceedings of the Microwave Heating and Processing of Materials Seminar 2011. IET, pp. 89-91. ISBN 978 1 84919 310 8

Rosunally, Yasmine, Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Bailey, Christopher ORCID: 0000-0002-9438-3879 , Mason, Peter, Campbell, Sheelagh, Monger, George and Bell, Ian (2010) Fusion approach for predictive maintenance of heritage structures. Prognostics & Health Management Conference, 2010, PHM '10. IEEE Conference Publications . IEEE, pp. 1-6. ISBN 978-1-4244-4756-5 (print), 978-1-4244-4758-9 (e-book) (doi:https://doi.org/10.1109/PHM.2010.5413403)

Xue, Xiangdong, Patel, Mayur, Kersaudy-Kerhoas, Maïwenn, Bailey, Christopher ORCID: 0000-0002-9438-3879 , Desmulliez, Marc P.Y. and Topham, David (2009) Effect of fluid dynamics and device mechanism on biofluid behaviour in microchannel systems: modelling biofluids in a microchannel biochip separator. International Conference on Electronic Packaging Technology & High Density Packaging, 2009. ICEPT-HDP '09. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 179-186. ISBN 978-1-4244-4659-9 (doi:https://doi.org/10.1109/ICEPT.2009.5270767)

Tilford, Tim ORCID: 0000-0001-8307-6403 , Pavuluri, S., Bailey, Christopher ORCID: 0000-0002-9438-3879 and Desmulliez, Marc P.Y. (2009) On variable frequency microwave processing of heterogeneous chip-on-board assemblies. International Conference on Electronic Packaging Technology & High Density Packaging, 2009. ICEPT-HDP '09. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 927-931. ISBN 978-1-4244-4659-9 (doi:https://doi.org/10.1109/ICEPT.2009.5270558)

Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Tang, Ying Kit, Bailey, Christopher ORCID: 0000-0002-9438-3879 , Evans, Robert, Marson, Silvia and Allen, David (2009) Modelling and process capability analysis of focused ion beam. ISSE 2009: 32nd International Spring Seminar on Electronics Technology: Hetero System Integration, the path to New Solutions in the Modern Electronics - Conference Proceedings. IEEE Computer Society, Piscataway, NJ USA. ISBN 97814244 42607 (Print) (doi:https://doi.org/10.1109/ISSE.2009.5206925)

Rosunally, Yasmine, Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Bailey, Christopher ORCID: 0000-0002-9438-3879 , Mason, Peter, Campbell, Sheelagh and Monger, George (2009) Prognostics framework for remaining life prediction of Cutty Sark iron structures. Annual Conference of the Prognostics and Health Management Society 2009. Prognostics and Health Management Society, 6 pages.

Bailey, Christopher ORCID: 0000-0002-9438-3879 , Lu, Hua ORCID: 0000-0002-4392-6562 , Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Tilford, Timothy, Xue, Xiangdong, Alam, M. O., Yin, Chunyan ORCID: 0000-0003-0298-0420 and Hughes, Michael (2008) Modelling technologies and applications. In: Morris, James E., (ed.) Nanopackaging: Nanotechnologies and Electronics Packaging. Springer Science+Business Media, LLC, New York, USA, pp. 15-38. ISBN 978-0-387-47325-3 (Print) 978-0-387-47326-0 (Online) (doi:https://doi.org/10.1007/978-0-387-47325-3_2)

Tilford, Tim ORCID: 0000-0001-8307-6403 , Sinclair, Keith I., Goussetis, George, Bailey, Christopher ORCID: 0000-0002-9438-3879 , Desmulliez, Marc P.Y., Parrott, Kevin and Sangster, Alan J. (2008) Comparison of encapsulant curing with convention and microwave systems. 33rd IEEE/CPMT International Electronic Manufacturing Technology Symposium (IEMT), 2008. IEEE, Piscataway, NJ, USA. ISBN 9781424433926 (print) 9781424433933 (electronic) (doi:https://doi.org/10.1109/IEMT.2008.5507869)

Lu, Hua ORCID: 0000-0002-4392-6562 , Loh, Wei-Sun, Bailey, Christopher ORCID: 0000-0002-9438-3879 and Johnson, C. Mark (2008) Computer simulation of aluminium wirebonds with globtop in power electronics modules. 3rd International Microsystems, Packaging, Assembly & Circuits Technology Conference, 2008. IMPACT 2008. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 348-351. ISBN 978-1-4244-3623-1 (doi:https://doi.org/10.1109/IMPACT.2008.4783883)

Sinclair, Keith I., Tilford, Tim ORCID: 0000-0001-8307-6403 , Goussetis, George, Bailey, Christopher ORCID: 0000-0002-9438-3879 , Desmulliez, Marc P.Y., Parrott, Kevin and Sangster, Alan J. (2008) Advanced microwave oven for rapid curing of encapsulant. 2nd Electronics System-Integration Technology Conference, 2008. ESTC 2008. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 551-556. ISBN 978-1-4244-2814-4 (print) 978-1-4244-2813-7 (online) (doi:https://doi.org/10.1109/ESTC.2008.4684409)

Lu, Hua ORCID: 0000-0002-4392-6562 , Loh, Wei-Sun, Bailey, Christopher ORCID: 0000-0002-9438-3879 and Johnson, C. Mark (2008) Computer modelling analysis of the globtop's effects on aluminium wirebond reliability. 2nd Electronics System-Integration Technology Conference, 2008. ESTC 2008. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 1369-1373. ISBN 978-1-4244-2814-4 (Print) 978-1-4244-2813-7 (Online) (doi:https://doi.org/10.1109/ESTC.2008.4684555)

Kersaudy-Kerhoas, Maïwenn, Kavanagh, Deirdre, Xue, Xiangdong, Patel, Mayur, Bailey, Christopher, Dhariwal, Resham and Desmulliez, Marc P.Y. (2008) Integrated biomedical device for blood preparation. 2nd Electronics System-Integration Technology Conference, 2008. ESTC 2008. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 447-452. ISBN 978-1-4244-2814-4 (Print) 978-1-4244-2813-7 (Online) (doi:https://doi.org/10.1109/ESTC.2008.4684389)

Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Bailey, Christopher ORCID: 0000-0002-9438-3879 , Leach, Richard, Hughes, Ben, Wilson, Alan, O'Neill, William, Dorey, Robert, Shaw, Christopher, Underhill, Daniel and Almond, Heather (2008) Modelling and prototyping the conceptual design of 3D CMM micro-probe. 2nd Electronics System-Integration Technology Conference, 2008. ESTC 2008. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 193-198. ISBN 978-1-4244-2814-4 (Print), 978-1-4244-2813-7 (Online) (doi:https://doi.org/10.1109/ESTC.2008.4684348)

Strusevitch, Nadia, Hughes, Michael, Bailey, Christopher ORCID: 0000-0002-9438-3879 and Djambazov, Georgi (2008) Numerical modelling of electrodeposition phenomena. 2nd Electronics System-Integration Technology Conference, Greenwich, UK, 1-4 September 2008. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 281-286. ISBN 978-1-4244-2813-7 (Print) 978-1-4244-2813-7 (Online) (doi:https://doi.org/10.1109/ESTC.2008.4684362)

Lu, Hua, Ridout, Stephen, Bailey, Christopher, Loh, Wei-Sun, Pearl, Agyakwa and Johnson, C. Mark (2008) Computer simulation of crack propagation in power electronics module solder joints. International Conference on Electronic Packaging Technology & High Density Packaging, 2008. ICEPT-HDP 2008. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 1-6. ISBN 978-1-4244-2740-6 (print) 978-1-4244-2739-0 (online) (doi:https://doi.org/10.1109/ICEPT.2008.4606983)

Tilford, Tim, Bailey, Christopher, Parrott, Kevin, Rizvi, M.J., Yin, Chunyan, Sinclair, Keith I. and Desmulliez, Marc P.Y. (2008) Impact of assembly process technologies on electronic packaging materials. International Conference on Electronic Packaging Technology & High Density Packaging, 2008. ICEPT-HDP 2008. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 1-6. ISBN 978-1-4244-2739-0 (online) 978-1-4244-2740-6 (print) (doi:https://doi.org/10.1109/ICEPT.2008.4607039)

Bailey, Christopher, Stoyanov, Stoyan, Tang, Ying Kit, Xue, Xiangdong and Tilford, Tim (2008) Multi-physics modelling for the fabrication, packaging and reliability of micro-systems components. In: Schrefler, B.A. and Perego, U., (eds.) 8th World Congress on Computational Mechanics (WCCM8) and 5th European Congress on Computational Methods in Applied Sciences and Engineering (ECCOMAS 2008), 30 June - 4 July 2008, Venice, Italy. International Center for Numerical Methods in Engineering (CIMNE), Barcelona, Spain. ISBN 978-84-96736-55-9

Bailey, Christopher, Tilford, Tim, Ridout, Stephen and Lu, Hua (2008) Optimizing the reliability of power electronics module isolation substrates. EngOpt 2008: International Conference on Engineering Optimization. Universidade Federal do Rio de Janeiro, Rio de Janeiro, Brazil. ISBN 978-85-7650-152-7 (print and CD ROM)

Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Amalou, Farid, Sinclair, Keith I., Bailey, Christopher ORCID: 0000-0002-9438-3879 and Desmulliez, Marc P.Y. (2008) Minimising the risk of defects in nano-imprint forming. 31st International Spring Seminar on Electronics Technology, 2008. ISSE '08. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 367-372. ISBN 978-1-4244-3972-0 (doi:https://doi.org/10.1109/ISSE.2008.5276670)

Bailey, Christopher, Lu, Hua, Stoyanov, Stoyan, Yin, Chunyan, Tilford, Tim and Ridout, Stephen (2008) Predictive reliability and prognostics for electronic components: current capabilities and future challenges. 31st International Spring Seminar on Electronics Technology, 2008. ISSE '08. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 67-72. ISBN 978-1-4244-3972-0 (doi:https://doi.org/10.1109/ISSE.2008.5276460)

Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Amalou, Farid, Sinclair, Keith I., Bailey, Christopher ORCID: 0000-0002-9438-3879 and Desmulliez, Marc P.Y. (2008) Modelling of nano-imprint forming process for the production of miniaturised 3D structures. International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems, 2008. EuroSimE 2008. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 497-504. ISBN 978-1-4244-2127-5 (doi:https://doi.org/10.1109/ESIME.2008.4525088)

Alam, M. O., Lu, Hua ORCID: 0000-0002-4392-6562 , Bailey, Christopher ORCID: 0000-0002-9438-3879 , Chan, Y.C. and Wu, B.Y. (2007) Shear strength analysis of ball grid array (BGA) solder interfaces. In: Vaidyanathan, K., Tee, T.Y. and Lee, T.K., (eds.) 2007 9th Electronics Packaging Technology Conference. Electronics Packaging Technology Conference Proceedings . Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 770-773. ISBN 9781424413249 (doi:11.1109/EPTC.2007.4469797)

Turitto, Michele, Ratchev, Svetan, Xue, Xiangdong, Hughes, Michael and Bailey, Christopher (2007) Pneumatic contactless microfeeder design refinement through CFD simulation. In: Dimov, Stefan, Menz, Wolfgang and Toshev, Yuli, (eds.) 4M 2007 Proceedings of the 3rd International Conference on Multi-Material Micro Manufacture. Whittles Publishing, Dunbeath, Scotland, pp. 65-68. ISBN 9781904445531

Sinclair, Keith I., Sangster, Alan J., Goussetis, George, Desmulliez, Marc P.Y., Tilford, Tim, Parrott, Kevin and Bailey, Christopher (2007) Open ended microwave oven for flip-chip assembly. 2007 European Microwave Conference. Institute of Electrical and Electronics Engineers, Inc., New York, pp. 620-623. ISBN 9782874870019

Ridout, Stephen, Bailey, Christopher ORCID: 0000-0002-9438-3879 , Dusek, Milos and Hunt, C (2007) Constitutive modeling of kinematic-hardening and damage in solder joints. Proceedings of the 1st Electronics Systemintegration Technology Conference, 2006. IEEE, pp. 927-933. ISBN 1-4244-0552-1 (doi:https://doi.org/10.1109/ESTC.2006.280122)

Yin, Chunyan, Lee, Youngjo, Bailey, Christopher, Riches, Steve, Cartwright, C., Sharpe, R. and Orr, H. (2007) Thermal analysis of LEDS for liquid crystal display's backlighting. ICEPT: 2007 8th International Conference On Electronics Packaging Technology, Proceedings. Institute of Electrical and Electronics Engineers, Inc., New York, pp. 212-216. ISBN 9781424413911 (doi:https://doi.org/10.1109/ICEPT.2007.444141)

Lu, Hua, Loh, Wei-Sun, Tilford, Tim, Johnson, M. and Bailey, Christopher (2007) Reliability of power electronic modules. ASME 2007 InterPACK Conference. American Society of Mechanical Engineers, New York, pp. 883-888. ISBN 0791842789 (doi:https://doi.org/10.1115/IPACK2007-33817)

Alam, M. O., Bailey, Christopher ORCID: 0000-0002-9438-3879 , Wu, B.Y., Yang, Dan and Chan, Y.C. (2007) High current density induced damage mechanisms in electronic solder joints: a state-of-the-art review. HDP'07: Proceedings of the 2007 International Symposium on High Density Packaging and Microsystem Integration. Institute of Electrical and Electronics Engineers, Inc., New York, pp. 93-99. ISBN 9781424412525 (doi:https://doi.org/10.1109/HDP.2007.4283569)

Lu, Hua, Tilford, Tim, Bailey, Christopher and Newcombe, David (2007) Lifetime prediction for power electronics module substrate mount-down solder interconnect. HDP'07: Proceedings Of The 2007 International Symposium On High Density Packaging And Microsystem Integration. Institute of Electrical and Electronics Engineers, Inc., New York, pp. 40-45. ISBN 9781424412525 (doi:https://doi.org/10.1109/HDP.2007.4283558)

Bailey, Christopher, Lu, Hua, Stoyanov, Stoyan, Hughes, Michael, Yin, Chunyan and Gwyer, David (2007) Multi-physics modelling for microelectronics and microsystems - current capabilities and future challenges. In: Ernst, L.J., Zhang, G.Q., Rodgers, P., Meuwissen, M., Marco, S., Van Driel, W.D. and De Saint Leger, O., (eds.) EUROSIME 2007: Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, Proceedings. Institute of Electrical and Electronics Engineers, Inc., New York, pp. 4-11. ISBN 9781424411054 (doi:https://doi.org/10.1109/ESIME.2007.360048)

Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Yannou, J.-M., Bailey, Christopher ORCID: 0000-0002-9438-3879 and Strusevitch, Nadia (2007) Reliability based design optimisation for system-in-package. In: Ernst, L.J., Zhang, G.Q., Rodgers, P., Meuwissen, M., Marco, S., Van Driel, W.D. and De Saint Leger, O., (eds.) EUROSIME 2007: Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, Proceedings. Institute of Electrical and Electronics Engineers, Inc., New York, pp. 289-296. ISBN 9781424411054 (doi:https://doi.org/10.1109/ESIME.2007.359948)

Lu, Hua, Tilford, Tim, Xue, Xiangdong and Bailey, Christopher (2007) Thermal-mechanical modelling of power electronic module packaging. In: Ernst, L.J., Zhang, G.Q., Rodgers, P., Meuwissen, M., Marco, S., Van Driel, W.D. and De Saint Leger, O., (eds.) EUROSIME 2007: Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, Proceedings. Institute of Electrical and Electronics Engineers, Inc., New York, pp. 317-322. ISBN 9781424411054 (doi:https://doi.org/10.1109/ESIME.2007.359960)

Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Bailey, Christopher ORCID: 0000-0002-9438-3879 , Strusevitch, Nadia and Yannou, J.-M. (2007) Computational approach for reliable and robust system-in-package design. 2007 30th International Spring Seminar On Electronics Technology. International Spring Seminar on Electronics Technology ISSE . Institute of Electrical and Electronics Engineers, Inc., New York, pp. 40-45. ISBN 9781424412174 (doi:https://doi.org/10.1109/ISSE.2007.4432818)

Bailey, Christopher, Tilford, Tim and Lu, Hua (2007) Reliability analysis for power electronics modules. 2007 30th International Spring Seminar On Electronics Technology. Institute of Electrical and Electronics Engineers, Inc., New York, pp. 12-17. ISBN 9781424412174 (doi:https://doi.org/10.1109/ISSE.2007.4432813)

Bailey, Christopher, Lu, Hua and Tilford, Tim (2007) Predicting the reliability of power electronic modules. In: Keyun, Bi and Ming, Li, (eds.) ICEPT: 2007 8th International Conference On Electronics Packaging Technology, Proceedings. Institute of Electrical and Electronics Engineers, Inc., New York, pp. 809-813. ISBN 9781424413911 (doi:https://doi.org/10.1109/ICEPT.2007.4441543)

Bailey, Christopher, Rizvi, M.J., Yin, Chunyan, Lu, Hua and Stoyanov, Stoyan (2007) Application of modelling for predicting the behaviour of polymers and adhesives in microelectronic and photonic devices. 6th International Conference on Polymers and Adhesives in Microelectronics and Photonics. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 240-244. ISBN 9781424411863 (doi:https://doi.org/10.1109/POLYTR.2007.4339175)

Goussetis, George, Sinclair, Keith I., Sangster, Alan J., Desmulliez, Marc P.Y., Tilford, Tim, Parrott, Kevin and Bailey, Christopher (2007) Microwave curing for high density package. 2007 International Symposium on High Density Design Packaging and Microsystem Integration. Institute of Electrical and Electronics Engineers, Inc., New York, p. 1. ISBN 9781424412525 (doi:https://doi.org/10.1109/HDP.2007.4283552)

Rizvi, M.J., Yin, Chunyan, Bailey, Christopher and Lu, Hua (2007) Modelling the reliability of components on flexible substrates. IPACK 2007: proceedings of the ASME Interpack Conference 2007. American Society of Mechanical Engineers, New York, pp. 375-380. ISBN 9780791842775 (doi:https://doi.org/10.1115/IPACK2007-33820)

Tilford, Tim, Sinclair, Keith I., Bailey, Christopher, Desmulliez, Marc P.Y., Parrott, Kevin and Sangster, Alan J. (2007) Multiphysics simulation of microwave curing of polymer materials in micro-electronics packaging applications. In: Silaghi, Alexandru Marius and Gordan, Ioan Mircea, (eds.) Proceedings book 11th International Conference on Microwave and High Frequency Heating, Oradea, Romania, September, 3-6 2007. University of Oradea, Romania, Oradea, Romania, pp. 189-192. ISBN 9789737593337

Misselbrook, P., Gwyer, David, Bailey, Christopher, Conway, P.P. and Williams, K. (2007) Review of the technology and reliability issues arising as optical interconnects migrate onto the circuit board. In: Lee, Y. C., Wong, C. P. and Suhir, Ephraim, (eds.) Micro- and opto-electronic materials and structures: physics, mechanics, design, reliability, packaging. Springer, Boston, pp. 361-382. ISBN 978038727974 9 (doi:https://doi.org/10.1007/0-387-32989-7_34)

Tilford, Tim, Sinclair, Keith I., Goussetis, George, Bailey, Christopher, Desmulliez, Marc P.Y., Parrott, Kevin and Sangster, Alan J. (2007) Variable frequency microwave curing of polymer materials in microelectronics packaging applications. 2007 9th Electronics Packaging Technology Conference. Electronics Packaging Technology Conference Proceedings . Institute of Electrical and Electronics Engineers, Inc., New York, pp. 791-796. ISBN 9781424413232 (doi:https://doi.org/10.1109/EPTC.2007.446975)

Xue, Xiangdong, Lu, Hua and Bailey, Christopher (2007) A modelling approach for coupling numerical analytical techniques applied in microsystems. ICEPT: 2007 8th International Conference On Electronics Packaging Technology, Proceedings. Institute of Electrical and Electronics Engineers, Inc., New York, pp. 204-211. ISBN 9781424413911 (doi:https://doi.org/10.1109/ICEPT.2007.4441412)

Bailey, Christopher ORCID: 0000-0002-9438-3879 (2006) Design and modeling challenges for high density packaging. 2006 Conference on High Density Microsystem Design and Packaging and Component Failure Analysis. IEEE, Piscataway, NJ, USA, pp. 324-328. ISBN 1424404886 (doi:https://doi.org/10.1109/HDP.2006.1707617)

Lee, Yek, Bailey, Christopher ORCID: 0000-0002-9438-3879 , Lu, Hua ORCID: 0000-0002-4392-6562 , Riches, Steve, Bartholomew, Martin and Tebbit, Nigel (2006) Analysis of the thermo mechanical effects on packaging process of performance enhanced AMLCD's and the optical performance of the display. Proceedings of the 1st Electronics Systemintegration Technology Conference, 2006. IEEE, pp. 1214-1217. ISBN 9781424405527 (doi:https://doi.org/10.1109/ESTC.2006.280164)

Rizvi, M.J., Bailey, Christopher ORCID: 0000-0002-9438-3879 , Chan, Y.C. and Lu, Hua ORCID: 0000-0002-4392-6562 (2006) Effects of thermal cycling profiles on the performance of chip-on-flex assembly using anisotropic conductive films. Thermal and Thermomechanical Phenomena in Electronics Systems, 2006. ITHERM '06. The Tenth Intersociety Conference on. IEEE, pp. 855-860. ISBN 0780395247 (doi:https://doi.org/10.1109/ITHERM.2006.1645436)

Yin, Chunyan ORCID: 0000-0003-0298-0420 , Lu, Hua ORCID: 0000-0002-4392-6562 , Bailey, Christopher ORCID: 0000-0002-9438-3879 and Chan, Y. (2006) Analyzing the performance of flexible substrates for lead-free applications. Proceedings of EuroSime 2006 : 7th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems. IEEE, pp. 539-544. ISBN 1 4244 0276 X (doi:https://doi.org/10.1109/ESIME.2006.1644052)

Flynn, David, Lu, Hua ORCID: 0000-0002-4392-6562 , Bailey, Christopher ORCID: 0000-0002-9438-3879 and Desmulliez, Marc P.Y. (2006) Assessment of microInductors for DC-DC converters. Proceedings of 2006 International Conference on Electronic Materials and Packaging (EMAP 2006). IEEE. ISBN 978-1-4244-0834-4

Rizvi, M.J., Bailey, Christopher ORCID: 0000-0002-9438-3879 , Chan, Y.C. and Lu, Hua ORCID: 0000-0002-4392-6562 (2006) Comparative wetting behavior of Sn-0.7Cu and Sn-0.7Cu-0.3Ni solders on Cu and Ni substrates. 1st Electronics Systemintegration Technology Conference. Dresden, Saxony, Germany. 2006 proceedings. IEEE, Piscataway, NJ, USA, pp. 145-151. ISBN 142440553X (doi:https://doi.org/10.1109/ITHERM.2006.1645436)

Lu, Hua ORCID: 0000-0002-4392-6562 , Flynn, David, Bailey, Christopher ORCID: 0000-0002-9438-3879 and Desmulliez, Marc P.Y. (2006) Computer modeling of a micro-manufactured one-turn inductor. Proceedings of the Sixth IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, 2006. IEEE. ISBN 1 4244 0489 4 (doi:https://doi.org/10.1109/HDP.2006.1707562)

Tang, Y.K., Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Bailey, Christopher ORCID: 0000-0002-9438-3879 and Lu, Hua ORCID: 0000-0002-4392-6562 (2006) Decision support systems for eco-friendly electronic products. Electronic Materials and Packaging, 2006. EMAP 2006. International Conference on. IEEE, Piscataway, N.J., pp. 77-84. ISBN 1424408342; 9781424408344 (doi:https://doi.org/10.1109/EMAP.2006.4430580)

Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Mason, P. and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2006) Finite element modelling of an historic ship structure - the Cutty Sark. In: Armstrong, Cecil G., (ed.) Proceedings of a joint conference of the Association for Computational Mechanics in Engineering (UK) and the Irish Society for Scientific and Engineeering Computation. 19th-20th April 2006, Queen's University Belfast. ACME/ISSEC, pp. 35-38.

Rizvi, M.J., Yin, Chunyan ORCID: 0000-0003-0298-0420 and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2006) Modeling the effect of lead-free soldering on flexible substrates. Electronic Materials and Packaging, 2006, EMAP 2006, International Conference on 11-14 Dec. 2006. IEEE, Piscataway, NJ, USA, pp. 1038-1042. ISBN 1424408334; 1424408342 (doi:https://doi.org/10.1109/EMAP.2006.4430695)

Strusevitch, Nadia, Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Liu, D., Bailey, Christopher ORCID: 0000-0002-9438-3879 , Richardson, A., Dumas, N., Yannou, J.M. and Georgel, V. (2006) Modelling the behavior of solder joints for wafer level SiP. In: Pang, J.H.L., Vaidyanathan, K., Wong, S.C.K. and Tee, T.Y., (eds.) 2006 8th Electronics Packaging Technology Conference (EPTC 2006) : 6-8 December 2006, Singapore. IEEE, Picsataway, N.J., pp. 127-132. ISBN 1424406641; 142440665X (doi:https://doi.org/10.1109/EPTC.2006.342703)

Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2006) Optimisation modelling for design of advanced interconnects. 1st Electronics Systemintegration Technology Conference. Dresden, Saxony, Germany. 2006 proceedings. IEEE, Piscataway, NJ, USA, pp. 1108-1117. ISBN 1424405521 (doi:https://doi.org/10.1109/ESTC.2006.280148)

Malik, Asif, Hughes, Michael and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2006) Optoelectronic packaging interfaces for submicron alignment (OPISA) and the dynamics of laser spot weld formation. Proceedings of the 1st Electronics Systemintegration Technology Conference, 2006. IEEE, pp. 387-391. ISBN 1 4244 0552 1 (doi:https://doi.org/10.1109/ESTC.2006.280031)

Yin, Chunyan ORCID: 0000-0003-0298-0420 , Rizvi, M.J., Lu, Hua ORCID: 0000-0002-4392-6562 and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2006) Thermal-mechanical analysis of flexible substrates during lead-free solder reflow. Proceedings of the 1st Electronics Systemintegration Technology Conference, 2006. IEEE, pp. 1007-1011. ISBN 1 4244 0552 1 (doi:https://doi.org/10.1109/ESTC.2006.280134)

Lee, Yek, Bailey, Christopher ORCID: 0000-0002-9438-3879 , Lu, Hua ORCID: 0000-0002-4392-6562 , Riches, Steve, Bartholomew, Martin and Tebbit, Nigel (2006) Thermo-mechanical analysis of the packaging process for micro-electronic displays. 7th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2006. EuroSime 2006. IEEE Computer Society, pp. 190-195. ISBN 1 4244 0275 1 (doi:https://doi.org/10.1109/ESIME.2006.1644051)

Tilford, Tim ORCID: 0000-0001-8307-6403 , Lu, Hua ORCID: 0000-0002-4392-6562 and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2006) Thermo-mechanical modelling of power electronics module structures. 2006 8th Electronics Packaging Technology Conference (EPTC 2006) : 6-8 December 2006, Singapore. IEEE, Picsataway, N.J., pp. 214-219. ISBN 1424406641 (doi:https://doi.org/10.1109/EPTC.2006.342718)

Lu, Hua ORCID: 0000-0002-4392-6562 , Flynn, David, Bailey, Christopher ORCID: 0000-0002-9438-3879 and Desmulliez, M.Y. (2006) An analysis of a microfabricated solenoid inductor. Proceedings of the 1st Electronics Systemintegration Technology Conference, 2006. IEEE, pp. 556-561. ISBN 1 4244 0552 1 (doi:https://doi.org/10.1109/ESTC.2006.280058)

Bailey, Christopher ORCID: 0000-0002-9438-3879 , Cross, Mark, Taylor, G. and Wheeler, D. (1997) Modelling inter-body contacts in a multiphysics framework. In: Rahnejat, Homer and Whalley, Robert, (eds.) Multi-body dynamics: monitoring and simulation techniques. Mechanical Engineering Publications, pp. 149-160. ISBN 1 86058 064 5

Book

Bailey, Christopher ORCID: 0000-0002-9438-3879 , Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 and Lu, Hua ORCID: 0000-0002-4392-6562 (2017) Co-design And Modelling For Advanced Integration And Packaging: Manufacturing And Reliability. Wspc Series In Advanced Integration And Packaging . World Scientific Publishing. ISBN 978-9814740203 ISSN 2315-473X (doi:https://doi.org/10.1142/9900)

Conference Proceedings

Hassan, Sheikh ORCID: 0000-0002-6215-7340 , Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Rajaguru, Pushparajah ORCID: 0000-0002-6041-0517 and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2024) Reduced-order modelling for coupled thermal-mechanical analysis and reliability assessment of power electronic modules with nonlinear material behaviours. In: 2024 IEEE 10th Electronics System-Integration Technology Conference (ESTC). Electronics System-Integration Technology Conference, ESTC . Institute of Electrical and Electronics Engineers (IEEE), Berlin, Germany; Piscataway, New Jersey, pp. 1-8. ISBN 979-8350390360 ISSN 2687-9700 (Print), 2687-9727 (Online) (doi:https://doi.org/10.1109/ESTC60143.2024.10712079)

Hassan, Sheikh ORCID: 0000-0002-6215-7340 , Rajaguru, Pushparajah ORCID: 0000-0002-6041-0517 , Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2024) Thermal-mechanical analysis of a power module with parametric model order reduction. In: 24th European Microelectronics and Packaging Conference & Exhibition (EMPC). 11-14 September 2023. Cambridge, United Kingdom. IEEE Xplore . The Institute of Electrical and Electronics Engineers (IEEE), Piscataway, New Jersey, pp. 1-6. ISBN 978-0956808691; 978-1665487368 (doi:https://doi.org/10.23919/EMPC55870.2023.10418328)

Hassan, Sheikh ORCID: 0000-0002-6215-7340 , Rajaguru, Pushparajah ORCID: 0000-0002-6041-0517 , Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2023) Parametrising temperature dependent properties in thermal-mechanical analysis of power electronics modules using parametric Model Order Reduction. In: 2023 46th International Spring Seminar on Electronics Technology (ISSE). 10th - 14th May 2023. Timisoara, Romania. IEEE Xplore . Institute of Electrical and Electronics Engineers IEEE, Piscataway, NJ, pp. 1-7. ISBN 979-8350334845; 979-8350334852 ISSN 2161-2528 (Print), 2161-2536 (Online) (doi:https://doi.org/10.1109/ISSE57496.2023.10168468)

Rajaguru, Pushparajah ORCID: 0000-0002-6041-0517 , Bailey, Christopher ORCID: 0000-0002-9438-3879 and Bella, Martina (2021) Applying model order reduction to the reliability prediction of power electronic module wire bond structure. In: 2021 27th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC). IEEE, Piscataway, US. ISBN 978-1665418973 ISSN 2474-1515 (Print), 2474-1523 (Online) (doi:https://doi.org/10.1109/THERMINIC52472.2021.9626396)

Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Stewart†, Paul and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2021) Reliability optimisation and lifetime modelling of micro-BGA assemblies in harsh environment applications. In: 2021 23rd European Microelectronics and Packaging Conference & Exhibition (EMPC). 13-16 Sept. 2021. Gothenburg, Sweden. IEEE Xplore . Institute of Electrical and Electronics Engineers (IEEE), Piscataway, New Jersey, pp. 1-8. ISBN 978-0956808677 ; 978-1665423687 (doi:https://doi.org/10.23919/EMPC53418.2021.9584970)

Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Bailey, Christopher ORCID: 0000-0002-9438-3879 , Waite, Rhys, Hicks, Christopher and Golding, Terry (2020) Packaging challenges and reliability performance of compound semiconductor focal plane arrays. In: 2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC). IEEE, pp. 1-8. ISBN 978-0956808660 (doi:https://doi.org/10.23919/EMPC44848.2019.8951842)

Hua, Lu, Rajaguru, Pushparajah ORCID: 0000-0002-6041-0517 and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2018) A numerical procedure for the optimization of IGBT module packaging. In: 2018 19th International Conference on Electronic Packaging Technology (ICEPT). 08-11 August 2018. Shanghai, China. IEEE Xplore (CFP 18553-ART) (18553). Institute of Electrical and Electronics Engineers (IEEE), Piscataway, New Jersey, pp. 156-160. ISBN 978-1538663868; 978-1538663851; 978-1538663875 (doi:https://doi.org/10.1109/ICEPT.2018.8480746)

Nwanoro, Kenneth Chimezie, Lu, Hua ORCID: 0000-0002-4392-6562 , Yin, Chunyan ORCID: 0000-0003-0298-0420 and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2018) Numerical simulation of the junction temperature, the coolant flow rate and the reliability of an IGBT module. In: 2018 24th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC 2018). IEEE, pp. 250-255. ISBN 978-1538667606

Nwanoro, Kenneth C., Lu, Hua ORCID: 0000-0002-4392-6562 , Yin, Chunyan ORCID: 0000-0003-0298-0420 and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2018) An approximate numerical method for the prediction of plastic strain in layered structures. In: 2018 7th Electronic System-Integration Technology Conference (ESTC 2018). IEEE, pp. 181-187. ISBN 978-1538668153

Ahsan, Mominul, Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2018) Data driven prognostics for failure of power semiconductor packages. In: Proceedings of 41st Spring Seminar on Electronics Technology (ISSE). IEEE Xplore, pp. 1-6. ISBN 978-1-5386-5730-0 ISSN 2161-2536 (Online) (doi:https://doi.org/10.1109/ISSE.2018.8443612)

Nwanoro, Kenneth Chimezie, Lu, Hua ORCID: 0000-0002-4392-6562 , Yin, Chunyan ORCID: 0000-0003-0298-0420 and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2017) Computer simulation of the reliability of wire bonds and ribbon bonds in power electronics modules. In: 2017 23rd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC). IEEE, pp. 1-6. ISBN 978-1-5386-1929-2 ISSN 2474-1523 (Online) (doi:https://doi.org/10.1109/THERMINIC.2017.8233827)

Shahjalal, Mohammad, Lu, Hua ORCID: 0000-0002-4392-6562 and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2017) Electro-thermal modelling of multi chip power modules for high power converter application. In: 2017 18th International Conference on Electronic Packaging Technology (ICEPT), Harbin. IEEE, pp. 940-945. ISBN 978-1-5386-2973-4 (doi:https://doi.org/10.1109/ICEPT.2017.8046599)

Yin, Chunyan ORCID: 0000-0003-0298-0420 , Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Bailey, Christopher ORCID: 0000-0002-9438-3879 and Stewart, Paul (2017) Modelling the impact of conformal coating penetration on QFN reliability. In: 2017 18th International Conference on Electronic Packaging Technology (ICEPT). IEEE, pp. 1021-1026. ISBN 978-1-5386-2973-4 (doi:https://doi.org/10.1109/ICEPT.2017.8046616)

Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2017) Machine learning for additive manufacturing of electronics. In: Proceedings 2017 40th International Spring Seminar on Electronics Technology (ISSE). IEEE. ISBN 978-1-5386-0583-7 ISSN 2161-2536 (Online) (doi:https://doi.org/10.1109/ISSE.2017.8000936)

Tonry, Catherine E. H. ORCID: 0000-0002-8214-0845 , Patel, Mayur K., Bailey, Christopher ORCID: 0000-0002-9438-3879 , Davies, Wynford, Harrap, Jullian, Kentley, Erik and Mason, Peter (2014) Digital modelling in the performance evaluation of 19th Century clipper ships: the Thermopylae and the Cutty Sark. In: Historic Ships 2014. Royal Institution of Naval Architects, pp. 81-86.

Rajaguru, Pushparajah ORCID: 0000-0002-6041-0517 , Mason, Peter, Bailey, Christopher ORCID: 0000-0002-9438-3879 and Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 (2012) Structural Analysis on the Riveted Hull of the Paddle Steamer Medway Queen. In: Historic Ships Conference 2012. Royal Institution of Naval Architects (RINA).

Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Best, Chris, Alam, Mohammad, Bailey, Christopher ORCID: 0000-0002-9438-3879 , Tollafield, Peter, Parker, Mike and Scott, Jim (2012) Modelling and testing the impact of hot solder dip process on leaded components. In: 2012 35th International Spring Seminar on Electronics Technology. IEEE Conference Publications . Institute of Electrical and Electronic Engineers, Inc., Piscataway, N.J., USA, pp. 303-308. ISBN 978-1-4673-2241-6 (Print), 978-1-4673-2239-3 (Online) ISSN 2161-2528 (doi:https://doi.org/10.1109/ISSE.2012.6273091)

Kabir, Ahsanul, Bailey, Christopher ORCID: 0000-0002-9438-3879 , Lu, Hua ORCID: 0000-0002-4392-6562 and Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 (2012) A review of data-driven prognostics in power electronics. In: 2012 35th International Spring Seminar on Electronics Technology. IEEE Conference Publications . Institute of Electrical and Electronic Engineers, Inc., Piscataway, N.J., USA, pp. 189-192. ISBN 978-1-4673-2241-6 (Print), 978-1-4673-2239-3 (Online) ISSN 2161-2528 (doi:https://doi.org/10.1109/ISSE.2012.6273136)

Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Bailey, Christopher ORCID: 0000-0002-9438-3879 , Tollafield, Peter, Crawford, Rob, Parker, Mike, Scott, Jim and Roulston, John (2012) Thermal modelling and optimisation of hot solder dip process. In: 2012 13th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE 2012). Institute of Electrical and Electronic Engineers, Inc., Piscataway, N.J., USA. ISBN 978-1-4673-1512-8 (doi:https://doi.org/10.1109/ESimE.2012.6191763)

Strusevich, Nadezhda, Patel, Mayur and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2012) Parametric modeling study of basic electrodeposition in microvias. In: The 14th International Conference on Electronic Materials and Packaging, 13-16 December 2012, Citygate, Lantau Island, Hong Kong. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 145-149. ISBN 9781467349444 (doi:https://doi.org/10.1109/EMAP.2012.6507864)

Newcombe, D.R., Chamund, Dinesh, Bailey, Christopher ORCID: 0000-0002-9438-3879 and Lu, Hua ORCID: 0000-0002-4392-6562 (2010) Reliability metrics for IGBT power modules. In: Proceedings - 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2010. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 670-674. ISBN 9781424481408 (doi:https://doi.org/10.1109/ICEPT.2010.5582869)

Musallam, M., Johnson, C.M., Yin, Chunyan ORCID: 0000-0003-0298-0420 , Bailey, Christopher ORCID: 0000-0002-9438-3879 and Mermet-Guyennet, M. (2010) Real-time life consumption power modules prognosis using on-line rainflow algorithm in metro applications. In: Energy Conversion Congress and Exposition (ECCE), 2010 IEEE. IEEE Xplore Digital Library, Atlanta GA, pp. 970-977. ISBN 978-1-4244-5286-6 (print) ISSN 978-1-4244-5287-3 (online) (doi:https://doi.org/10.1109/ECCE.2010.5617883)

Yin, Chunyan ORCID: 0000-0003-0298-0420 , Lu, Hua ORCID: 0000-0002-4392-6562 , Musallam, M., Bailey, Christopher ORCID: 0000-0002-9438-3879 and Johnson, C.M. (2010) In-service reliability assessment of solder interconnect in power electronics modules. In: 2010 Prognostics and System Health Management Conference, PHM '10. IEEE Conference Publications . Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA. ISBN 9781424447565 (Print), 9781424447589 (Online) (doi:https://doi.org/10.1109/PHM.2010.5413346)

Rizvi, M.J., Skuriat, R., Tilford, Tim ORCID: 0000-0001-8307-6403 , Bailey, Christopher ORCID: 0000-0002-9438-3879 , Johnson, C. Mark and Lu, Hua ORCID: 0000-0002-4392-6562 (2009) Modelling of jet-impingement cooling for power electronics. In: 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, 2009. EuroSimE 2009. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA. ISBN 978-1-4244-4160-0 (doi:https://doi.org/10.1109/ESIME.2009.4938428)

Alam, M.O., Lu, Hua ORCID: 0000-0002-4392-6562 , Bailey, Christopher ORCID: 0000-0002-9438-3879 and Chan, Y.C. (2008) Fracture mechanics analysis of cracks in solder joint intermetallic compounds. In: 2nd Electronics System-Integration Technology Conference, 2008. ESTC 2008. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 757-762. ISBN 978-1-4244-2813-7 (doi:https://doi.org/10.1109/ESTC.2008.4684445)

Yin, C ORCID: 0000-0003-0298-0420 , Lu, Hua ORCID: 0000-0002-4392-6562 , Bailey, Christopher ORCID: 0000-0002-9438-3879 and Chan, Y.C. (2005) Moisture Effects on the Reliability of Anisotropic Conductive Films. In: Proceedings of the 6th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2005. EuroSimE 2005. IEEE, pp. 162-167. ISBN 0780390628 (doi:https://doi.org/10.1109/ESIME.2005.1502793)

Yin, Chunyan ORCID: 0000-0003-0298-0420 , Lu, Hua ORCID: 0000-0002-4392-6562 , Bailey, Christopher ORCID: 0000-0002-9438-3879 and Chan, Y.C. (2005) Experimental and Modelling Analysis on the Moisture Induced Failures in Flip Chip on Flex Interconnections with Anisotropic Conductive Film. In: Proceedings of 2005 International Conference on Asian Green Electronics, 2005. AGEC. IEEE, pp. 172-177. ISBN 0780388062 (doi:https://doi.org/10.1109/AGEC.2005.1452340)

Yin, Chunyan ORCID: 0000-0003-0298-0420 , Lu, Hua ORCID: 0000-0002-4392-6562 , Bailey, Christopher ORCID: 0000-0002-9438-3879 and ChaN, Y.C. (2005) Macro-Micro Modelling Analysis for High Density Packaged Flip Chips. In: Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, 2005. IEEE, pp. 1-4. ISBN 0780392922 (doi:https://doi.org/10.1109/HDP.2005.251383)

Lee, Yek Bing, Bailey, Christopher ORCID: 0000-0002-9438-3879 , Lu, Hua ORCID: 0000-0002-4392-6562 , Riches, Steve and Bartholomew, Martin (2005) Modelling the Lamination Process for Ruggedised Displays. In: International Symposium on Electronic Materials and Packaging 2005 (EMAP 2005). IEEE, pp. 243-246. ISBN 1424401070 (doi:https://doi.org/10.1109/EMAP.2005.1598269)

Yin, Chunyan ORCID: 0000-0003-0298-0420 , Lu, Hua ORCID: 0000-0002-4392-6562 and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2005) Modelling the Performance of Flexible Substrates for Lead-Free Applications. In: Proceedings of 7th Electronic Packaging Technology Conference, 2005. EPTC 2005. IEEE, pp. 342-346. ISBN 0780395786 (doi:https://doi.org/10.1109/EPTC.2005.1614418)

Yin, Chunyan ORCID: 0000-0003-0298-0420 , Lu, Hua ORCID: 0000-0002-4392-6562 , Bailey, Christopher ORCID: 0000-0002-9438-3879 and Chan, Yan-Cheong (2005) Moisture Effects on the Reliability of Anisotropic Conductive Film Interconnection for Flip Chip on Flex Applications. In: ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems collocated with the ASME 2005 Heat Transfer Summer Conference Advances in Electronic Packaging, Parts A, B, and C. ASME, pp. 1293-1298. ISBN 0791842002 (doi:https://doi.org/10.1115/IPACK2005-73367)

Lu, Hua ORCID: 0000-0002-4392-6562 and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2002) Computer modelling of the reliability of flip chips with metal column bumping. In: ITHERM 2002. The Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems [Proceedings]. Institute of Electrical and Electronics Engineers, Inc., pp. 967-973. ISBN 0780371526 (doi:https://doi.org/10.1109/ITHERM.2002.1012561)

Slone, Avril, Fallah, Nosrat, Bailey, Christopher ORCID: 0000-0002-9438-3879 and Cross, Mark (2002) A finite volume approach to geometrically non-linear stress analysis. In: Finite volumes for complex applications III: problems and perspectives. Hermes Penton Science, London, UK, pp. 663-670. ISBN 9781903996348

Kumar, Suman, Bailey, Christopher ORCID: 0000-0002-9438-3879 and Patel, Mayur (1999) Modelling the mixing of lead bullion during the refining process. In: Fluid Flow Phenomena in Metals Processing: A Collection of Papers from the 1999 TMS Annual Meeting and Exhibition in San Diego, California, February 28-March 4, 1999. The Minerals, Metals & Materials Society (TMS), Warrendale, PA, USA, pp. 187-194. ISBN 978-0471188667

Wheeler, Daniel and Bailey, Christopher ORCID: 0000-0002-9438-3879 (1999) Modelling the melting and solidification of solder material. In: Advances in Electronic Packaging 1999: Proceedings of the Pacific Rim/Asme International Intersociety Electronic & Photonic Packaging Conference. American Society of Mechanical Engineers, New York, NY, USA, pp. 397-404. ISBN 978-0791816127

Bailey, Christopher ORCID: 0000-0002-9438-3879 and Boettinger, W. (1999) Modelling the fillet lifting defect. In: Advances in electronic packaging, 1999: Proceedings of the Pacific Rim/ASME International Intersociety Electronic & Photonic Packaging Conference, INTERpack '99. American Society of Mechanical Engineers, New Yor, NY, USA, pp. 405-413. ISBN 9780791816127

Bailey, Christopher ORCID: 0000-0002-9438-3879 , Cross, Mark and Lu, Hua ORCID: 0000-0002-4392-6562 (1999) A parametric study of flip-chip reliability via computer simulation. In: Advances in electronic packaging, 1999: Proceedings of the Pacific RIM/ASME International Intersociety Electronic & Photonic Packaging Conference, InterPACK '99. American Society of Mechanical Engineers, New York, NY, USA, pp. 263-269. ISBN 9780791816127

Conference or Conference Paper

Ferenets, M., Tilford, Tim, Sinclair, Keith I., Bailey, Christopher and Desmulliez, Marc P.Y. (2009) Microwave curing of thermosetting polymer materials in microelectronics applications. In: Baltic Polymer Symposium 2009, 22-25 September 2009, Ventspils, Latvia.

Morris, James E., Tilford, Tim, Ferenets, M. and Bailey, Christopher (2009) A critical analysis of polymer cure modeling for microelectronics applications. In: IMAPS Nordic Conference 2009, 13-15 September 2009, Tønsberg, Norway.

Tilford, Tim, Sinclair, Keith I., Bailey, Christopher, Pavuluri, S. and Desmulliez, Marc P.Y. (2009) On the application of variable frequency microwave technology for processing of individual surface mount components. In: 2009 International Conference on Electronics Packaging.

Lee, Yek Bing, Bailey, Christopher ORCID: 0000-0002-9438-3879 , Riches, Steve and Bartholomew, Martin (2006) Predicting the behaviour of micro-electronic displays using computational mechanics. In: 14th Annual Joint Conference of the Association for Computational Mechanics in Engineering (ACME) and the Irish Society for Scientific and Engineering Computation (ISSEC), Queen's University of Belfast.

Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Bailey, Christopher ORCID: 0000-0002-9438-3879 , Kay, Robert, Durairaj, Rajkumar, Hendriksen, Mike, Desmuilliez, Marc and Ekere, Ndy (2004) Assembly and reliability of isotropic conductive adhesives for fine pitch flip-chip applications. In: TMS 2004 133rd TMS Annual Meeting & Exhibition 2004, 14-18 Mar 2004, Charlotte, North Carolina, USA. (Unpublished)

Slone, Avril, Pericleous, Kyriacos A. ORCID: 0000-0002-7426-9999 , Bailey, Christopher ORCID: 0000-0002-9438-3879 , Cross, Mark and Bennett, Christopher (1999) A finite volume approach to dynamic fluid structure interaction. In: Conference on the Mathematics of Finite Elements and Applications, 22-25 June 1999, Brunel Institute of Computational Mathematics, London, UK.

Powell, Adam, Warren, James and Bailey, Christopher ORCID: 0000-0002-9438-3879 (1998) Mechanism of motion of an optical fiber aligned by a solder droplet. In: MRS Spring Meeting - Symposium DD – Reliabilty of Photonics Materials & Structures.

Bailey, Christopher ORCID: 0000-0002-9438-3879 , Cross, Mark and Pericleous, Koulis ORCID: 0000-0002-7426-9999 (1998) A finite-volume computational mechanics framework for multi-physics coupled fluid-stress problems. In: The 27th Israel Mechanical Engineering Conference, 19 - 20 May 1998, Haifa, Israel.

Slone, Avril, Pericleous, Koulis ORCID: 0000-0002-7426-9999 , Bailey, Christopher ORCID: 0000-0002-9438-3879 and Cross, Mark (1997) Dynamic fluid-structure interactions using finite volume unstructured mesh procedures. In: International Forum on Aeroelasticity and Structural Dynamics, June 1997, Rome, Italy.

Cross, Mark, McManus, Kevin, Bailey, Christopher ORCID: 0000-0002-9438-3879 , Pericleous, Koulis ORCID: 0000-0002-7426-9999 and Lyster, C. (1997) Multi-physics modelling of materials processes on high performance parallel computers. In: 5th ACME - Computational Mechanics, 7 - 8 April 1997, London, UK.

Bailey, Christopher ORCID: 0000-0002-9438-3879 , Wheeler, Daniel and Cross, Mark (1997) Multiphysics modelling of solder joint formation. In: ASME, EEP - Advances in Electronic Packaging, 15 -19 June 1997, Kohala coast, Hawaii.