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Open ended microwave oven for flip-chip assembly

Open ended microwave oven for flip-chip assembly

Sinclair, Keith I., Sangster, Alan J., Goussetis, George, Desmulliez, Marc P.Y., Tilford, Tim, Parrott, Kevin and Bailey, Christopher (2007) Open ended microwave oven for flip-chip assembly. 2007 European Microwave Conference. Institute of Electrical and Electronics Engineers, Inc., New York, pp. 620-623. ISBN 9782874870019

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Abstract

A novel open-ended waveguide cavity resonator for the microwave curing of bumps, underfills and encapsulants is described. The open oven has the potential to provide fast alignment of devices during flip-chip assembly, direct chip attach, surface mount assembly or wafer-scale level packaging. The prototype microwave oven was designed to operate at X-band for ease of testing, although a higher frequency version is planned. The device described in the paper takes the form of a waveguide cavity resonator. It is approximately square in cross-section and is filled with a low-loss dielectric with a relative permittivity of 6. It is excited by end-fed probes in order to couple power preferentially into the TM3,3,k mode with the object of forming nine 'hot-spots' in the open end. Low power tests using heat sensitive film demonstrate clearly that selective heating in multiple locations in the open end of the oven is achievable

Item Type: Book Section
Additional Information: This paper forms part of the published proceedings from the 37th European Microwave Conference held in Munich October 9-12 2007
Uncontrolled Keywords: open-ended microwave oven, flip-chip assembly, waveguide cavity resonator, microwave curing, wafer scale level packaging, end-fed probes, low power tests, heat sensitive film, relative permittivity, low-loss dielectric
Subjects: Q Science > QA Mathematics > QA75 Electronic computers. Computer science
Pre-2014 Departments: School of Computing & Mathematical Sciences > Centre for Numerical Modelling & Process Analysis
School of Computing & Mathematical Sciences
School of Computing & Mathematical Sciences > Centre for Numerical Modelling & Process Analysis > Computational Mechanics & Reliability Group
School of Computing & Mathematical Sciences > Department of Computer Systems Technology
School of Computing & Mathematical Sciences > Department of Mathematical Sciences
School of Computing & Mathematical Sciences > Computer & Computational Science Research Group
School of Computing & Mathematical Sciences > Department of Computer Science
School of Computing & Mathematical Sciences > Centre for Numerical Modelling & Process Analysis > Computational Science & Engineering Group
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Last Modified: 14 Oct 2016 09:03
Selected for GREAT 2016: None
Selected for GREAT 2017: None
Selected for GREAT 2018: None
Selected for GREAT 2019: None
URI: http://gala.gre.ac.uk/id/eprint/1123

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