Tilford, Tim, Sinclair, Keith I., Goussetis, George, Bailey, Christopher, Desmulliez, Marc P.Y., Parrott, Kevin and Sangster, Alan J. (2007) Variable frequency microwave curing of polymer materials in microelectronics packaging applications. 2007 9th Electronics Packaging Technology Conference. Electronics Packaging Technology Conference Proceedings . Institute of Electrical and Electronics Engineers, Inc., New York, pp. 791-796. ISBN 9781424413232 (doi:https://doi.org/10.1109/EPTC.2007.446975)

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Abstract

The use of variable frequency microwave technology in curing of polymer materials used in microelectronics applications is discussed. A revolutionary open-ended microwave curing system is outlined and assessed using experimental and numerical approaches. Experimental and numerical results are presented, demonstrating the feasibility of the system

Item Type:	Book Section
Additional Information:	This paper forms part of the published proceedings from 9th Electronics Packaging Technology Conference (EPTC 2007) December 10-12, 2007; Singapore
Uncontrolled Keywords:	variable frequency microwave technology, polymer materials curing, open-ended microwave curing system
Subjects:	T Technology > TK Electrical engineering. Electronics Nuclear engineering Q Science > QA Mathematics > QA75 Electronic computers. Computer science
Pre-2014 Departments:	School of Computing & Mathematical Sciences > Centre for Numerical Modelling & Process Analysis School of Computing & Mathematical Sciences School of Computing & Mathematical Sciences > Centre for Numerical Modelling & Process Analysis > Computational Mechanics & Reliability Group School of Computing & Mathematical Sciences > Department of Computer Systems Technology School of Computing & Mathematical Sciences > Department of Mathematical Sciences School of Computing & Mathematical Sciences > Computer & Computational Science Research Group School of Computing & Mathematical Sciences > Department of Computer Science School of Computing & Mathematical Sciences > Centre for Numerical Modelling & Process Analysis > Computational Science & Engineering Group
Related URLs:	Publisher Organisation Organisation Organisation
Last Modified:	14 Oct 2016 09:03
URI:	http://gala.gre.ac.uk/id/eprint/1117

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