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Modelling the melting and solidification of solder material

Modelling the melting and solidification of solder material

Wheeler, Daniel and Bailey, Christopher ORCID: 0000-0002-9438-3879 (1999) Modelling the melting and solidification of solder material. In: Advances in Electronic Packaging 1999: Proceedings of the Pacific Rim/Asme International Intersociety Electronic & Photonic Packaging Conference. American Society of Mechanical Engineers, New York, NY, USA, pp. 397-404. ISBN 978-0791816127

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Abstract

Abstract not available

Item Type: Conference Proceedings
Title of Proceedings: Advances in Electronic Packaging 1999: Proceedings of the Pacific Rim/Asme International Intersociety Electronic & Photonic Packaging Conference
Additional Information: International Intersociety Electronic and Photonic Packaging Conference, Maui, Hawaii, June 13-19, 1999.
Pre-2014 Departments: School of Computing & Mathematical Sciences
Last Modified: 13 Mar 2019 11:30
Selected for GREAT 2016: None
Selected for GREAT 2017: None
Selected for GREAT 2018: None
Selected for GREAT 2019: None
URI: http://gala.gre.ac.uk/id/eprint/344

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