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Items where Faculty / School / Research Centre / Research Groups is "Computational Mechanics & Reliability Group (CMRG)"

Items where Faculty / School / Research Centre / Research Groups is "Computational Mechanics & Reliability Group (CMRG)"

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3D printing abrasion accelerated stress test Additive manufacturing Analytical models Artificial Intelligence assembly Big Data Black Box CFD chip-on-board circuit simulator Classification Coatings commercial off-the shelf components commercial off-the-shelf components compliant PCB component terminations composite properties compound semiconductors compression bonding compression bonding simulation computational fluid computational modelling condition based monitoring conductive layer convection oven convolutional neural network copper pattern corrosion cryogenic temperature crystal plasticity Damage Damage rule data analysis data analytics Data driven prognostics data mining Data Validity Data Veracity data-driven prognostics DC-DC converter decision tree degradation Design tools Designers digital twin dynamics edgebond Electric Field Assisted Capillarity (EFAC) electro thermal model electro-thermal model Electrohydrodynamic Induced Patterning (EHDIP) Electromigration electronic components electronic device electronic device qualification Electronic Packaging electronics manufacture electronics manufacturing Electronics packaging electronics product qualification electronics reliability Electrostatics Electrothermal models encapsulation engineering design Failure failure analysis fatigue FEA feature engineering Feature Selection finite element analysis finite element modelling flip-chip assembly Fluids FMEA Focal Plane Array Generative manufacturing genetic algorithm Geologic Measurements Graphics processing units heat exchanger heat sink heat sink design heat transfer heating hot solder dip hot solder dip refinishing process IGBT IGBT power module incomplete dataset indium joints inkjet printing Integrated circuit modeling intelligent manufacturing inverter IR detectors Kernel KNN Kriging lateral IGBT layered structures lead-free leaded component LED LED driver LED drivers level-set method Life consumption life expectancy life prediction lifetime modelling LIGBT logistic regression machine learning manufacturing technicians material properties Materials Materials reliability Materials scientist Mechanical engineering Megasonic Agitation micro-BGA Microelectronics microelectronics fabrication microelectronics packaging Microfabrication Microfluidics microstructure Microstructures microsystems microwave curing Microwave Propagation Mission profile model order reduction modelling Multi-objective optimization multi-scale modelling Multiphysics modelling N/A natural convection neural nets Non-Destructive Testing Numerical Analysis Numerical methods Numerical models Numerical simulation Offshore renewable energy open-ended oven optimisation packaging Particle Swarm Optimisation PCB Permittivity Physics of failure physics-of-failure plastic strain plate fin heat sink power cycling Power electronic module Power electronics Power module power modules Power semiconductor packages Press-Pack Press-Pack assembly printed circuit board Printed Circuit Board Fabrication Product developers Production technicians Production technology production test set compaction prognostics prognostics modelling qualification testing quality Quality Assurance Radar Applications Radar Measurements radial basis random forest real time redistribution layer reduced order models refinishing reflow self-alignment modeling reliability Reliability test reliability testing residual stress response surface model risk analysis robotics ROMARA software SAC305 scanning acoustic microscopy scour Sensitivity analysis shape optimisation silicon carbide smart manufacturing smart qualification testing smart test SnPbAgCu quaternary solder alloy Solder joint solder joint reliability solder joints Solder material Solid modeling statistical hypothesis testing Statistics Stepwise stop-on-fail test Stress comparison subsea cable scoring Subsea cables Surface tension Surrogate models sustainability temperature distribution Test Limits Optimisation thermal conductivity Thermal cycling thermal diffusivity thermal fatigue thermo-mechanical Reliability Thermomigration Thin film tin whiskers Topological Optimisation Topology topology optimization ultra-fine pitch flip chip assembly underfill Veracity vibration Vortex generator wear Wire/ribbon bond
Number of items at this level: 317.

3D printing

Bailey, C. ORCID: 0000-0002-9438-3879 , Stoyanov, S. ORCID: 0000-0001-6091-1226 , Tilford, T. and Tourloukis, G. (2016) Modelling methodologies for quality assessment of 3D inkjet printed electronic products. In: 3rd Fraunhofer Direct Digital Manufacturing Conference, DDMC 2016. Proceedings. Fraunhofer Verlag, Stuttgart. ISBN 978-3-8396-9128-1 ISSN 978-3-8396-1001-5 (Online)

Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2017) Machine learning for additive manufacturing of electronics. In: Proceedings 2017 40th International Spring Seminar on Electronics Technology (ISSE). IEEE. ISBN 978-1-5386-0583-7 ISSN 2161-2536 (Online) (doi:https://doi.org/10.1109/ISSE.2017.8000936)

Tilford, Tim ORCID: 0000-0001-8307-6403 , Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Braun, Jessica, Janhsen, Jan Cristophe, Burgard, Matthias, Birch, Richard and Bailey, Chris ORCID: 0000-0002-9438-3879 (2018) Design, manufacture and test for reliable 3D printed electronics packaging. Microelectronics Reliability, 85. pp. 109-117. ISSN 0026-2714 (doi:https://doi.org/10.1016/j.microrel.2018.04.008)

abrasion

Bailey, Christopher ORCID: 0000-0002-9438-3879 , Yin, Chunyan ORCID: 0000-0003-0298-0420 and Rajaguru, Pushparajah ORCID: 0000-0002-6041-0517 (2019) Predicting damage and life expectancy of subsea power cables in offshore renewable energy applications. IEEE ACCESS, 7. pp. 54658-54669. ISSN 2169-3536 (Online) (doi:https://doi.org/10.1109/ACCESS.2019.2911260)

accelerated stress test

Desmulliez, Marc P.Y, Adamietz, Raphael, Pavuluri, Sumanth K., Tilford, Tim ORCID: 0000-0001-8307-6403 , Bailey, Chris ORCID: 0000-0002-9438-3879 , Schreier-Alt, Thomas and Warmuth, Jens (2018) Reliability testing and stress measurement of QFN packages encapsulated by an open-ended microwave curing system. IEEE Transactions on Components, Packaging and Manufacturing Technology, 9 (1). pp. 173-180. ISSN 2156-3950 (Print), 2156-3985 (Online) (doi:https://doi.org/10.1109/TCPMT.2018.2859031)

Additive manufacturing

Bailey, C. ORCID: 0000-0002-9438-3879 , Stoyanov, S. ORCID: 0000-0001-6091-1226 , Tilford, T. and Tourloukis, G. (2016) Modelling methodologies for quality assessment of 3D inkjet printed electronic products. In: 3rd Fraunhofer Direct Digital Manufacturing Conference, DDMC 2016. Proceedings. Fraunhofer Verlag, Stuttgart. ISBN 978-3-8396-9128-1 ISSN 978-3-8396-1001-5 (Online)

Tilford, T. ORCID: 0000-0001-8307-6403 , Bruan, J., Janhsen, J. C., Burgard, M. and Bailey, C. ORCID: 0000-0002-9438-3879 (2018) SPH analysis of inkjet droplet impact dynamics. In: Proceedings of the 13th World Congress on Computational Mechanics (WCCM XIII) and 2nd Pan American Congress on Computational Mechanics (PANACM II). WCCM.

Tilford, Tim ORCID: 0000-0001-8307-6403 , Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Braun, Jessica, Janhsen, Jan Christoph, Patel, Mayur K. and Bailey, Chris ORCID: 0000-0002-9438-3879 (2021) Comparative reliability of inkjet-printed electronics packaging. IEEE Transactions on Components, Packaging and Manufacturing Technology, 11 (2). pp. 351-362. ISSN 2156-3950 (Print), 2156-3985 (Online) (doi:https://doi.org/10.1109/TCPMT.2021.3049952)

Analytical models

Tilford, T. ORCID: 0000-0001-8307-6403 , Stoyanov, S. ORCID: 0000-0001-6091-1226 , Tourloukis, G. and Bailey, C. ORCID: 0000-0002-9438-3879 (2016) Numerical analysis of droplet deposition in inkjet printed electronics assembly. In: 2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE). IEEE, pp. 1-7. ISBN 978-1-5090-2106-2 (doi:https://doi.org/10.1109/EuroSimE.2016.7463358)

Yin, Chunyan ORCID: 0000-0003-0298-0420 , Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Bailey, Christopher ORCID: 0000-0002-9438-3879 and Stewart, Paul (2017) Modelling the impact of conformal coating penetration on QFN reliability. In: 2017 18th International Conference on Electronic Packaging Technology (ICEPT). IEEE, pp. 1021-1026. ISBN 978-1-5386-2973-4 (doi:https://doi.org/10.1109/ICEPT.2017.8046616)

Artificial Intelligence

Malik, Asif, Rajaguru, Pushparajah ORCID: 0000-0002-6041-0517 and Azzawi, Rula (2022) Smart manufacturing with Artificial Intelligence and digital twin: a brief review. In: 8th International Conference on Information Technology Trends, 25th - 26th May 2022, Dubai, UAE.

assembly

Tilford, Timothy ORCID: 0000-0001-8307-6403 , Cook, A., Lu, H. ORCID: 0000-0002-4392-6562 , Ramambasoa, A. and Conseil, F. (2014) Numerical analysis of the performance of highly oriented pyrolytic graphite heat spreader in thermal management of microelectronics assemblies. In: Electronics Systemintegration Technology Conference, 16-18 Sep 2014, Helsinki, Finland. (doi:https://doi.org/10.1109/ESTC.2014.6962815)

Big Data

Hinojosa Herrera, Ana ORCID: 0000-0002-0636-1881 , Walshaw, Chris ORCID: 0000-0003-0253-7779 and Bailey, Chris ORCID: 0000-0002-9438-3879 (2020) Failure mode & effect analysis and another methodology for improving data veracity and validity. Annals of Emerging Technologies in Computing (AETiC), 4 (3). pp. 9-16. ISSN 2516-0281 (doi:https://doi.org/10.33166/AETiC.2020.03.002)

Hinojosa Herrera, Ana Elsa ORCID: 0000-0002-0636-1881 , Walshaw, Chris ORCID: 0000-0003-0253-7779 , Bailey, Chris ORCID: 0000-0002-9438-3879 and Yin, Chunyan ORCID: 0000-0003-0298-0420 (2019) Failure mode & effect analysis for improving data veracity and validity. In: Proceedings of the IEEE International Conference on Computing, Electronics & Communications Engineering 2019 (IEEE iCCECE '19). IEEE, pp. 100-105. ISBN 978-1728121383 (doi:https://doi.org/10.1109/iCCECE46942.2019.8941849)

Black Box

Hinojosa Herrera, Ana Elsa ORCID: 0000-0002-0636-1881 , Walshaw, Chris ORCID: 0000-0003-0253-7779 and Bailey, Chris ORCID: 0000-0002-9438-3879 (2020) Improving Black Box Classification Model Veracity for Electronics Anomaly Detection. In: 2020 15th IEEE Conference on Industrial Electronics and Applications (ICIEA). IEEE, pp. 1092-1097. ISBN 978-1728151694 ISSN 2156-2318 (Print), 2158-2297 (Online) (doi:https://doi.org/10.1109/ICIEA48937.2020.9248258)

CFD

Nwanoro, Kenneth Chimezie, Lu, Hua ORCID: 0000-0002-4392-6562 , Yin, Chunyan ORCID: 0000-0003-0298-0420 and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2018) Numerical simulation of the junction temperature, the coolant flow rate and the reliability of an IGBT module. In: 2018 24th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC 2018). IEEE, pp. 250-255. ISBN 978-1538667606

Santhanakrishnan, Mani Sekara, Tilford, Tim ORCID: 0000-0001-8307-6403 and Bailey, Chris ORCID: 0000-0002-9438-3879 (2021) Multi-objective NSGA-II based shape optimisation of the cross-sectional shape of passively cooled heat sinks. International Journal of Numerical Methods for Heat and Fluid Flow, 32 (3). pp. 1025-1045. ISSN 0961-5539 (doi:https://doi.org/10.1108/HFF-10-2020-0656)

chip-on-board

Aliyu, A. M., Mouawad, B., Castellazzi, A., Rajaguru, P. ORCID: 0000-0002-6041-0517 , Bailey, C. ORCID: 0000-0002-9438-3879 , Pathirana, V., Uduampola, N., Trajkovic, T. and Ubrea, F. (2017) Chip-on-board assembly of 800V Si LIGBTs for high performance ultra-compact LED drivers. In: Proceedings of the 2017 29th International Symposium on Power Semiconductor Devices and IC's (ISPSD). IEEE, pp. 431-434. ISBN 978-4-88686-094-1 ISSN 1946-0201 (Online) (doi:https://doi.org/10.23919/ISPSD.2017.7988976)

circuit simulator

Shahjalal, Mohammad, Lu, Hua ORCID: 0000-0002-4392-6562 and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2017) Electro-thermal modelling of multi chip power modules for high power converter application. In: 2017 18th International Conference on Electronic Packaging Technology (ICEPT), Harbin. IEEE, pp. 940-945. ISBN 978-1-5386-2973-4 (doi:https://doi.org/10.1109/ICEPT.2017.8046599)

Shahjalal, Mohammad, Rishad Ahmed, MD, Lu, Hua ORCID: 0000-0002-4392-6562 , Bailey, Chris ORCID: 0000-0002-9438-3879 and Forsyth, Andrew (2020) An analysis of the thermal interaction between components in power converter applications. IEEE Transactions on Power Electronics, 35 (9). pp. 9082-9094. ISSN 0885-8993 (Print), 1941-0107 (Online) (doi:https://doi.org/10.1109/TPEL.2020.2969350)

Classification

Hinojosa Herrera, Ana Elsa ORCID: 0000-0002-0636-1881 , Walshaw, Chris ORCID: 0000-0003-0253-7779 and Bailey, Chris ORCID: 0000-0002-9438-3879 (2020) Improving Black Box Classification Model Veracity for Electronics Anomaly Detection. In: 2020 15th IEEE Conference on Industrial Electronics and Applications (ICIEA). IEEE, pp. 1092-1097. ISBN 978-1728151694 ISSN 2156-2318 (Print), 2158-2297 (Online) (doi:https://doi.org/10.1109/ICIEA48937.2020.9248258)

Coatings

Yin, Chunyan ORCID: 0000-0003-0298-0420 , Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Bailey, Christopher ORCID: 0000-0002-9438-3879 and Stewart, Paul (2017) Modelling the impact of conformal coating penetration on QFN reliability. In: 2017 18th International Conference on Electronic Packaging Technology (ICEPT). IEEE, pp. 1021-1026. ISBN 978-1-5386-2973-4 (doi:https://doi.org/10.1109/ICEPT.2017.8046616)

commercial off-the shelf components

Stoyanov, S. ORCID: 0000-0001-6091-1226 and Bailey, C. ORCID: 0000-0002-9438-3879 (2015) Modelling the impact of refinishing processes on COTS components for use in aerospace applications. Microelectronics Reliability, 55 (9-10). pp. 1271-1279. ISSN 0026-2714 (doi:https://doi.org/10.1016/j.microrel.2015.07.030)

commercial off-the-shelf components

Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Bailey, Christopher ORCID: 0000-0002-9438-3879 , Stewart, Paul, Parker, Mike and Roulston, John F. (2020) Experimental and modelling study on delamination risks for refinished electronic packages under hot solder dip loads. IEEE Transactions on Components, Packaging and Manufacturing Technology, 10 (3). pp. 502-515. ISSN 2156-3950 (Print), 2156-3985 (Online) (doi:https://doi.org/10.1109/TCPMT.2020.2972635)

compliant PCB

Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Stewart†, Paul and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2021) Reliability optimisation and lifetime modelling of micro-BGA assemblies in harsh environment applications. In: 2021 23rd European Microelectronics and Packaging Conference & Exhibition (EMPC). 13-16 Sept. 2021. Gothenburg, Sweden. IEEE Xplore . Institute of Electrical and Electronics Engineers (IEEE), Piscataway, New Jersey, pp. 1-8. ISBN 978-0956808677 ; 978-1665423687 (doi:https://doi.org/10.23919/EMPC53418.2021.9584970)

component terminations

Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Bailey, Christopher ORCID: 0000-0002-9438-3879 , Stewart, Paul, Parker, Mike and Roulston, John F. (2020) Experimental and modelling study on delamination risks for refinished electronic packages under hot solder dip loads. IEEE Transactions on Components, Packaging and Manufacturing Technology, 10 (3). pp. 502-515. ISSN 2156-3950 (Print), 2156-3985 (Online) (doi:https://doi.org/10.1109/TCPMT.2020.2972635)

composite properties

Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 and Bailey, Chris ORCID: 0000-0002-9438-3879 (2022) Deep learning modelling for composite properties of PCB conductive layers. In: 2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE). Institute of Electrical and Electronics Engineers (IEEE), Piscataway, New Jersey, pp. 1-7. ISBN 978-1665458375 (doi:https://doi.org/10.1109/EuroSimE54907.2022.9758885)

compound semiconductors

Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 and Bailey, Chris (2023) Modeling Insights into the assembly challenges of focal plane arrays. IEEE Access. pp. 35207-35219. ISSN 2169-3536 (Online) (doi:https://doi.org/10.1109/ACCESS.2023.3264806)

Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Bailey, Christopher ORCID: 0000-0002-9438-3879 , Waite, Rhys, Hicks, Christopher and Golding, Terry (2020) Packaging challenges and reliability performance of compound semiconductor focal plane arrays. In: 2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC). IEEE, pp. 1-8. ISBN 978-0956808660 (doi:https://doi.org/10.23919/EMPC44848.2019.8951842)

compression bonding

Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Bailey, Christopher ORCID: 0000-0002-9438-3879 , Waite, Rhys, Hicks, Christopher and Golding, Terry (2020) Packaging challenges and reliability performance of compound semiconductor focal plane arrays. In: 2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC). IEEE, pp. 1-8. ISBN 978-0956808660 (doi:https://doi.org/10.23919/EMPC44848.2019.8951842)

compression bonding simulation

Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 and Bailey, Chris (2023) Modeling Insights into the assembly challenges of focal plane arrays. IEEE Access. pp. 35207-35219. ISSN 2169-3536 (Online) (doi:https://doi.org/10.1109/ACCESS.2023.3264806)

computational fluid

Santhanakrishnan, Mani Sekaran, Tilford, Timothy ORCID: 0000-0001-8307-6403 and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2022) Heat transfer characteristics of plate fin heat sink with longitudinal vortex generators. International Journal of Numerical Methods for Heat and Fluid Flow, 33 (3). pp. 1203-1228. ISSN 0961-5539 (doi:https://doi.org/10.1108/HFF-06-2022-0386)

computational modelling

Tonry, Catherine Elizabeth Henzell ORCID: 0000-0002-8214-0845 (2015) Computational electrohydrodynamics for fabricating polymer microstructures. PhD thesis, University of Greenwich.

condition based monitoring

Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2017) Machine learning for additive manufacturing of electronics. In: Proceedings 2017 40th International Spring Seminar on Electronics Technology (ISSE). IEEE. ISBN 978-1-5386-0583-7 ISSN 2161-2536 (Online) (doi:https://doi.org/10.1109/ISSE.2017.8000936)

conductive layer

Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 and Bailey, Chris ORCID: 0000-0002-9438-3879 (2022) Deep learning modelling for composite properties of PCB conductive layers. In: 2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE). Institute of Electrical and Electronics Engineers (IEEE), Piscataway, New Jersey, pp. 1-7. ISBN 978-1665458375 (doi:https://doi.org/10.1109/EuroSimE54907.2022.9758885)

convection oven

Desmulliez, Marc P.Y, Adamietz, Raphael, Pavuluri, Sumanth K., Tilford, Tim ORCID: 0000-0001-8307-6403 , Bailey, Chris ORCID: 0000-0002-9438-3879 , Schreier-Alt, Thomas and Warmuth, Jens (2018) Reliability testing and stress measurement of QFN packages encapsulated by an open-ended microwave curing system. IEEE Transactions on Components, Packaging and Manufacturing Technology, 9 (1). pp. 173-180. ISSN 2156-3950 (Print), 2156-3985 (Online) (doi:https://doi.org/10.1109/TCPMT.2018.2859031)

convolutional neural network

Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 and Bailey, Chris ORCID: 0000-0002-9438-3879 (2022) Deep learning modelling for composite properties of PCB conductive layers. In: 2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE). Institute of Electrical and Electronics Engineers (IEEE), Piscataway, New Jersey, pp. 1-7. ISBN 978-1665458375 (doi:https://doi.org/10.1109/EuroSimE54907.2022.9758885)

copper pattern

Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 and Bailey, Chris ORCID: 0000-0002-9438-3879 (2022) Deep learning modelling for composite properties of PCB conductive layers. In: 2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE). Institute of Electrical and Electronics Engineers (IEEE), Piscataway, New Jersey, pp. 1-7. ISBN 978-1665458375 (doi:https://doi.org/10.1109/EuroSimE54907.2022.9758885)

corrosion

Bailey, Christopher ORCID: 0000-0002-9438-3879 , Yin, Chunyan ORCID: 0000-0003-0298-0420 and Rajaguru, Pushparajah ORCID: 0000-0002-6041-0517 (2019) Predicting damage and life expectancy of subsea power cables in offshore renewable energy applications. IEEE ACCESS, 7. pp. 54658-54669. ISSN 2169-3536 (Online) (doi:https://doi.org/10.1109/ACCESS.2019.2911260)

Flynn, David, Bailey, Christopher ORCID: 0000-0002-9438-3879 , Rajaguru, Pushpa ORCID: 0000-0002-6041-0517 , Wenshuo, Tang and Yin, Chunyan ORCID: 0000-0003-0298-0420 (2019) Prognostics and health management of subsea cables. In: Goodman, Douglas, Hofmeister, James P. and Szidarovszky, Ferenc, (eds.) Prognostics and Health Management: A Practical Approach to Improving System Reliability Using Condition-Based Data. Quality and Reliability Engineering Series . Wiley-Blackwell. ISBN 978-1119356653

cryogenic temperature

Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Bailey, Christopher ORCID: 0000-0002-9438-3879 , Waite, Rhys, Hicks, Christopher and Golding, Terry (2020) Packaging challenges and reliability performance of compound semiconductor focal plane arrays. In: 2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC). IEEE, pp. 1-8. ISBN 978-0956808660 (doi:https://doi.org/10.23919/EMPC44848.2019.8951842)

crystal plasticity

Xu, Yilun, Xian, Jingwei, Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Bailey, Christopher ORCID: 0000-0002-9438-3879 , Coyle, Richard, Gourlay, Christopher and Dunne, Fionn (2022) A multi-scale approach to microstructure-sensitive thermal fatigue in solder joints. International Journal of Plasticity, 155:103308. ISSN 0749-6419 (doi:https://doi.org/10.1016/j.ijplas.2022.103308)

Damage

Rajaguru, Pushparajah ORCID: 0000-0002-6041-0517 , Lu, Hua ORCID: 0000-0002-4392-6562 and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2015) A time dependent damage indicator model for Sn3.5Ag solder layer in power electronic module. Microelectronics Reliability, 55 (11). pp. 2371-2381. ISSN 0026-2714 (doi:https://doi.org/10.1016/j.microrel.2015.07.047)

Damage rule

Rajaguru, Pushparajah ORCID: 0000-0002-6041-0517 , Lu, Hua ORCID: 0000-0002-4392-6562 and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2014) Application of nonlinear fatigue damage models in power electronic module wirebond structure under various amplitude loadings. Advances in Manufacturing, 2 (3). pp. 239-250. ISSN 2095-3127 (Print), 2195-3597 (Online) (doi:https://doi.org/10.1007/s40436-014-0054-5)

data analysis

Ahsan, M., Stoyanov, S. ORCID: 0000-0001-6091-1226 , Bailey, C. ORCID: 0000-0002-9438-3879 and Albarbar, A. (2020) Developing computational intelligence for smart qualification testing of electronic products. IEEE Access, 8. pp. 16922-16933. ISSN 2169-3536 (Online) (doi:https://doi.org/10.1109/ACCESS.2020.2967858)

data analytics

Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Ahsan, Mominuil and Bailey, Chris ORCID: 0000-0002-9438-3879 (2018) Data analytics approach for optimal qualification testing of electronic components. In: Proceedings EuroSimE 2018. 2018 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) . IEEE Xplore, pp. 1-9. ISBN 978-1-5386-2358-9 (doi:https://doi.org/10.1109/EuroSimE.2018.8369926)

Data driven prognostics

Ahsan, Mominul, Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2018) Data driven prognostics for failure of power semiconductor packages. In: Proceedings of 41st Spring Seminar on Electronics Technology (ISSE). IEEE Xplore, pp. 1-6. ISBN 978-1-5386-5730-0 ISSN 2161-2536 (Online) (doi:https://doi.org/10.1109/ISSE.2018.8443612)

data mining

Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Ahsan, Mominul, Bailey, Chris ORCID: 0000-0002-9438-3879 , Wotherspoon, Tracy and Hunt, Craig (2019) Predictive analytics methodology for smart qualification testing of electronic components. Journal of Intelligent Manufacturing, 30 (3). pp. 1497-1514. ISSN 0956-5515 (Print), 1572-8145 (Online) (doi:https://doi.org/10.1007/s10845-018-01462-9)

Data Validity

Hinojosa Herrera, Ana ORCID: 0000-0002-0636-1881 , Walshaw, Chris ORCID: 0000-0003-0253-7779 and Bailey, Chris ORCID: 0000-0002-9438-3879 (2020) Failure mode & effect analysis and another methodology for improving data veracity and validity. Annals of Emerging Technologies in Computing (AETiC), 4 (3). pp. 9-16. ISSN 2516-0281 (doi:https://doi.org/10.33166/AETiC.2020.03.002)

Hinojosa Herrera, Ana Elsa ORCID: 0000-0002-0636-1881 , Walshaw, Chris ORCID: 0000-0003-0253-7779 , Bailey, Chris ORCID: 0000-0002-9438-3879 and Yin, Chunyan ORCID: 0000-0003-0298-0420 (2019) Failure mode & effect analysis for improving data veracity and validity. In: Proceedings of the IEEE International Conference on Computing, Electronics & Communications Engineering 2019 (IEEE iCCECE '19). IEEE, pp. 100-105. ISBN 978-1728121383 (doi:https://doi.org/10.1109/iCCECE46942.2019.8941849)

Data Veracity

Hinojosa Herrera, Ana ORCID: 0000-0002-0636-1881 , Walshaw, Chris ORCID: 0000-0003-0253-7779 and Bailey, Chris ORCID: 0000-0002-9438-3879 (2020) Failure mode & effect analysis and another methodology for improving data veracity and validity. Annals of Emerging Technologies in Computing (AETiC), 4 (3). pp. 9-16. ISSN 2516-0281 (doi:https://doi.org/10.33166/AETiC.2020.03.002)

Hinojosa Herrera, Ana Elsa ORCID: 0000-0002-0636-1881 , Walshaw, Chris ORCID: 0000-0003-0253-7779 , Bailey, Chris ORCID: 0000-0002-9438-3879 and Yin, Chunyan ORCID: 0000-0003-0298-0420 (2019) Failure mode & effect analysis for improving data veracity and validity. In: Proceedings of the IEEE International Conference on Computing, Electronics & Communications Engineering 2019 (IEEE iCCECE '19). IEEE, pp. 100-105. ISBN 978-1728121383 (doi:https://doi.org/10.1109/iCCECE46942.2019.8941849)

data-driven prognostics

Ahsan, M., Stoyanov, S. ORCID: 0000-0001-6091-1226 , Bailey, C. ORCID: 0000-0002-9438-3879 and Albarbar, A. (2020) Developing computational intelligence for smart qualification testing of electronic products. IEEE Access, 8. pp. 16922-16933. ISSN 2169-3536 (Online) (doi:https://doi.org/10.1109/ACCESS.2020.2967858)

DC-DC converter

Shahjalal, Mohammad, Rishad Ahmed, MD, Lu, Hua ORCID: 0000-0002-4392-6562 , Bailey, Chris ORCID: 0000-0002-9438-3879 and Forsyth, Andrew (2020) An analysis of the thermal interaction between components in power converter applications. IEEE Transactions on Power Electronics, 35 (9). pp. 9082-9094. ISSN 0885-8993 (Print), 1941-0107 (Online) (doi:https://doi.org/10.1109/TPEL.2020.2969350)

decision tree

Hinojosa Herrera, Ana Elsa ORCID: 0000-0002-0636-1881 and Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 (2019) Data driven predictive model to compact a production stop-on-fail test set for an electronic device. In: Proceedings of the 2018 International Conference on Computing, Electronics & Communications Engineering (iCCECE). IEEE Xplore, pp. 59-64. ISBN 9781538649046 (doi:https://doi.org/10.1109/iCCECOME.2018.8658941)

Hinojosa Herrera, Ana Elsa ORCID: 0000-0002-0636-1881 , Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Bailey, Christopher ORCID: 0000-0002-9438-3879 , Walshaw, Christopher ORCID: 0000-0003-0253-7779 and Yin, Chunyan ORCID: 0000-0003-0298-0420 (2019) Data analytics to reduce stop-on-fail test in electronics manufacturing. Open Computer Sciences, 9 (1). pp. 200-211. ISSN 2299-1093 (Online) (doi:https://doi.org/10.1515/comp-2019-0014)

degradation

Bailey, Christopher ORCID: 0000-0002-9438-3879 , Yin, Chunyan ORCID: 0000-0003-0298-0420 and Rajaguru, Pushparajah ORCID: 0000-0002-6041-0517 (2019) Predicting damage and life expectancy of subsea power cables in offshore renewable energy applications. IEEE ACCESS, 7. pp. 54658-54669. ISSN 2169-3536 (Online) (doi:https://doi.org/10.1109/ACCESS.2019.2911260)

Design tools

Tilford, Tim ORCID: 0000-0001-8307-6403 , Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Braun, Jessica, Janhsen, Jan Cristophe, Burgard, Matthias, Birch, Richard and Bailey, Chris ORCID: 0000-0002-9438-3879 (2018) Design, manufacture and test for reliable 3D printed electronics packaging. Microelectronics Reliability, 85. pp. 109-117. ISSN 0026-2714 (doi:https://doi.org/10.1016/j.microrel.2018.04.008)

Designers

Bailey, C. ORCID: 0000-0002-9438-3879 , Stoyanov, S. ORCID: 0000-0001-6091-1226 , Tilford, T. and Tourloukis, G. (2016) Modelling methodologies for quality assessment of 3D inkjet printed electronic products. In: 3rd Fraunhofer Direct Digital Manufacturing Conference, DDMC 2016. Proceedings. Fraunhofer Verlag, Stuttgart. ISBN 978-3-8396-9128-1 ISSN 978-3-8396-1001-5 (Online)

Bailey, C. ORCID: 0000-0002-9438-3879 , Stoyanov, S. ORCID: 0000-0001-6091-1226 , Tilford, T. and Tourloukis, G. (2016) Modelling methodologies for quality assessment of 3D inkjet printed electronic products. In: 3rd Fraunhofer Direct Digital Manufacturing Conference, DDMC 2016. Proceedings. Fraunhofer Verlag, Stuttgart. ISBN 978-3-8396-9128-1 ISSN 978-3-8396-1001-5 (Online)

digital twin

Malik, Asif, Rajaguru, Pushparajah ORCID: 0000-0002-6041-0517 and Azzawi, Rula (2022) Smart manufacturing with Artificial Intelligence and digital twin: a brief review. In: 8th International Conference on Information Technology Trends, 25th - 26th May 2022, Dubai, UAE.

dynamics

Santhanakrishnan, Mani Sekaran, Tilford, Timothy ORCID: 0000-0001-8307-6403 and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2022) Heat transfer characteristics of plate fin heat sink with longitudinal vortex generators. International Journal of Numerical Methods for Heat and Fluid Flow, 33 (3). pp. 1203-1228. ISSN 0961-5539 (doi:https://doi.org/10.1108/HFF-06-2022-0386)

edgebond

Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Stewart†, Paul and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2021) Reliability optimisation and lifetime modelling of micro-BGA assemblies in harsh environment applications. In: 2021 23rd European Microelectronics and Packaging Conference & Exhibition (EMPC). 13-16 Sept. 2021. Gothenburg, Sweden. IEEE Xplore . Institute of Electrical and Electronics Engineers (IEEE), Piscataway, New Jersey, pp. 1-8. ISBN 978-0956808677 ; 978-1665423687 (doi:https://doi.org/10.23919/EMPC53418.2021.9584970)

Electric Field Assisted Capillarity (EFAC)

Tonry, Catherine Elizabeth Henzell ORCID: 0000-0002-8214-0845 (2015) Computational electrohydrodynamics for fabricating polymer microstructures. PhD thesis, University of Greenwich.

electro thermal model

Shahjalal, Mohammad, Lu, Hua ORCID: 0000-0002-4392-6562 and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2017) Electro-thermal modelling of multi chip power modules for high power converter application. In: 2017 18th International Conference on Electronic Packaging Technology (ICEPT), Harbin. IEEE, pp. 940-945. ISBN 978-1-5386-2973-4 (doi:https://doi.org/10.1109/ICEPT.2017.8046599)

electro-thermal model

Shahjalal, Mohammad, Rishad Ahmed, MD, Lu, Hua ORCID: 0000-0002-4392-6562 , Bailey, Chris ORCID: 0000-0002-9438-3879 and Forsyth, Andrew (2020) An analysis of the thermal interaction between components in power converter applications. IEEE Transactions on Power Electronics, 35 (9). pp. 9082-9094. ISSN 0885-8993 (Print), 1941-0107 (Online) (doi:https://doi.org/10.1109/TPEL.2020.2969350)

Electrohydrodynamic Induced Patterning (EHDIP)

Tonry, Catherine Elizabeth Henzell ORCID: 0000-0002-8214-0845 (2015) Computational electrohydrodynamics for fabricating polymer microstructures. PhD thesis, University of Greenwich.

Electromigration

Zhu, X., Kotadia, H., Xu, S., Lu, H. ORCID: 0000-0002-4392-6562 , Mannan, S. H., Bailey, C. ORCID: 0000-0002-9438-3879 and Chan, Y. C. (2014) Electromigration in Sn-Ag solder thin films under high current density. Thin Solid Films, 565. pp. 193-201. ISSN 0040-6090 (doi:https://doi.org/10.1016/j.tsf.2014.06.030)

electronic components

Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Ahsan, Mominul, Bailey, Chris ORCID: 0000-0002-9438-3879 , Wotherspoon, Tracy and Hunt, Craig (2019) Predictive analytics methodology for smart qualification testing of electronic components. Journal of Intelligent Manufacturing, 30 (3). pp. 1497-1514. ISSN 0956-5515 (Print), 1572-8145 (Online) (doi:https://doi.org/10.1007/s10845-018-01462-9)

electronic device

Hinojosa Herrera, Ana Elsa ORCID: 0000-0002-0636-1881 , Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Bailey, Christopher ORCID: 0000-0002-9438-3879 , Walshaw, Christopher ORCID: 0000-0003-0253-7779 and Yin, Chunyan ORCID: 0000-0003-0298-0420 (2019) Data analytics to reduce stop-on-fail test in electronics manufacturing. Open Computer Sciences, 9 (1). pp. 200-211. ISSN 2299-1093 (Online) (doi:https://doi.org/10.1515/comp-2019-0014)

electronic device qualification

Hinojosa Herrera, Ana Elsa ORCID: 0000-0002-0636-1881 and Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 (2019) Data driven predictive model to compact a production stop-on-fail test set for an electronic device. In: Proceedings of the 2018 International Conference on Computing, Electronics & Communications Engineering (iCCECE). IEEE Xplore, pp. 59-64. ISBN 9781538649046 (doi:https://doi.org/10.1109/iCCECOME.2018.8658941)

Electronic Packaging

Rajaguru, Pushparajah ORCID: 0000-0002-6041-0517 , Ortiz-Gonzalez, Jose Angel, Lu, Hua ORCID: 0000-0002-4392-6562 , Bailey, Chris ORCID: 0000-0002-9438-3879 and Alatise, Olawiwola (2017) A multiphysics modeling and experimental analysis of pressure contacts in power electronics applications. IEEE Transactions on Components, Packaging and Manufacturing Technology, 7 (6). pp. 893-900. ISSN 2156-3950 (Print), 2156-3985 (Online) (doi:https://doi.org/10.1109/TCPMT.2017.2688021)

Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Bailey, Chris ORCID: 0000-0002-9438-3879 and Tourloukis, Georgios (2016) Similarity approach for reducing qualification tests of electronic components. Microelectronics Reliability, 67. pp. 111-119. ISSN 0026-2714 (doi:https://doi.org/10.1016/j.microrel.2016.10.017)

electronics manufacture

Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2017) Machine learning for additive manufacturing of electronics. In: Proceedings 2017 40th International Spring Seminar on Electronics Technology (ISSE). IEEE. ISBN 978-1-5386-0583-7 ISSN 2161-2536 (Online) (doi:https://doi.org/10.1109/ISSE.2017.8000936)

electronics manufacturing

Ahsan, M., Stoyanov, S. ORCID: 0000-0001-6091-1226 , Bailey, C. ORCID: 0000-0002-9438-3879 and Albarbar, A. (2020) Developing computational intelligence for smart qualification testing of electronic products. IEEE Access, 8. pp. 16922-16933. ISSN 2169-3536 (Online) (doi:https://doi.org/10.1109/ACCESS.2020.2967858)

Hinojosa Herrera, Ana ORCID: 0000-0002-0636-1881 , Walshaw, Chris ORCID: 0000-0003-0253-7779 and Bailey, Chris ORCID: 0000-0002-9438-3879 (2020) Failure mode & effect analysis and another methodology for improving data veracity and validity. Annals of Emerging Technologies in Computing (AETiC), 4 (3). pp. 9-16. ISSN 2516-0281 (doi:https://doi.org/10.33166/AETiC.2020.03.002)

Hinojosa Herrera, Ana Elsa ORCID: 0000-0002-0636-1881 , Walshaw, Chris ORCID: 0000-0003-0253-7779 , Bailey, Chris ORCID: 0000-0002-9438-3879 and Yin, Chunyan ORCID: 0000-0003-0298-0420 (2019) Failure mode & effect analysis for improving data veracity and validity. In: Proceedings of the IEEE International Conference on Computing, Electronics & Communications Engineering 2019 (IEEE iCCECE '19). IEEE, pp. 100-105. ISBN 978-1728121383 (doi:https://doi.org/10.1109/iCCECE46942.2019.8941849)

Electronics packaging

Tilford, Tim ORCID: 0000-0001-8307-6403 , Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Braun, Jessica, Janhsen, Jan Cristophe, Burgard, Matthias, Birch, Richard and Bailey, Chris ORCID: 0000-0002-9438-3879 (2018) Design, manufacture and test for reliable 3D printed electronics packaging. Microelectronics Reliability, 85. pp. 109-117. ISSN 0026-2714 (doi:https://doi.org/10.1016/j.microrel.2018.04.008)

electronics product qualification

Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Ahsan, Mominuil and Bailey, Chris ORCID: 0000-0002-9438-3879 (2018) Data analytics approach for optimal qualification testing of electronic components. In: Proceedings EuroSimE 2018. 2018 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) . IEEE Xplore, pp. 1-9. ISBN 978-1-5386-2358-9 (doi:https://doi.org/10.1109/EuroSimE.2018.8369926)

electronics reliability

Santhanakrishnan, Mani Sekaran, Tilford, Timothy ORCID: 0000-0001-8307-6403 and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2022) Heat transfer characteristics of plate fin heat sink with longitudinal vortex generators. International Journal of Numerical Methods for Heat and Fluid Flow, 33 (3). pp. 1203-1228. ISSN 0961-5539 (doi:https://doi.org/10.1108/HFF-06-2022-0386)

Electrostatics

Tonry, Catherine E. H. ORCID: 0000-0002-8214-0845 , Patel, Mayur K., Yu, Weixing, Desmulliez, Marc P. Y. and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2019) Fabrication of hollow polymer microstructures using dielectric and capillary forces. Microsystem Technologies. pp. 1-8. ISSN 0946-7076 (Print), 1432-1858 (Online) (doi:https://doi.org/10.1007/s00542-019-04409-z)

Electrothermal models

Musallam, Mahera, Yin, Chunyan ORCID: 0000-0003-0298-0420 , Bailey, Christopher ORCID: 0000-0002-9438-3879 and Johnson, Mark (2014) Mission profile-based reliability design and real-time life consumption estimation in power electronics. IEEE Transactions on Power Electronics, 30 (5). pp. 2601-2613. ISSN 0885-8993 (Print), 1941-0107 (Online) (doi:https://doi.org/10.1109/TPEL.2014.2358555)

encapsulation

Desmulliez, Marc P.Y, Adamietz, Raphael, Pavuluri, Sumanth K., Tilford, Tim ORCID: 0000-0001-8307-6403 , Bailey, Chris ORCID: 0000-0002-9438-3879 , Schreier-Alt, Thomas and Warmuth, Jens (2018) Reliability testing and stress measurement of QFN packages encapsulated by an open-ended microwave curing system. IEEE Transactions on Components, Packaging and Manufacturing Technology, 9 (1). pp. 173-180. ISSN 2156-3950 (Print), 2156-3985 (Online) (doi:https://doi.org/10.1109/TCPMT.2018.2859031)

engineering design

Santhanakrishnan, Mani Sekaran, Tilford, Timothy ORCID: 0000-0001-8307-6403 and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2018) Performance assessment of density and level-set topology optimisation methods for 3D heatsink design. Journal of Algorithms and Computational Technology, 12 (3). pp. 273-287. ISSN 1748-3018 (Print), 1748-3026 (Online) (doi:https://doi.org/10.1177/1748301818779019)

Failure

Ahsan, Mominul, Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2018) Data driven prognostics for failure of power semiconductor packages. In: Proceedings of 41st Spring Seminar on Electronics Technology (ISSE). IEEE Xplore, pp. 1-6. ISBN 978-1-5386-5730-0 ISSN 2161-2536 (Online) (doi:https://doi.org/10.1109/ISSE.2018.8443612)

failure analysis

Lu, Hua ORCID: 0000-0002-4392-6562 and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2017) Failure and reliability analysis of a SiC power module based on stress comparison to a Si device. IEEE Transactions on Device and Materials Reliability, 17 (4). pp. 727-737. ISSN 1530-4388 (doi:https://doi.org/10.1109/TDMR.2017.2766692)

fatigue

Bailey, C. ORCID: 0000-0002-9438-3879 , Rajaguru, P. ORCID: 0000-0002-6041-0517 , Lu, H. ORCID: 0000-0002-4392-6562 , Castellazzi, A., Antonini, M., Pathirana, V., Udugampola, N., Udrea, F., Mitchelson, P. D. and Aldhaher, S. (2018) Mechanical modelling of high power lateral IGBT for LED driver applications. In: IEEE Electronic Components and Technology Conference (ECTC). IEEE Electronics Packaging Society (formerly CPMT), pp. 1375-1381. ISBN 978-1-5386-5000-4 ISSN 2377-5726 (Online) (doi:https://doi.org/10.1109/ECTC.2018.00210)

Rajaguru, Pushparajah ORCID: 0000-0002-6041-0517 , Lu, Hua ORCID: 0000-0002-4392-6562 and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2015) A time dependent damage indicator model for Sn3.5Ag solder layer in power electronic module. Microelectronics Reliability, 55 (11). pp. 2371-2381. ISSN 0026-2714 (doi:https://doi.org/10.1016/j.microrel.2015.07.047)

FEA

Nwanoro, Kenneth Chimezie, Lu, Hua ORCID: 0000-0002-4392-6562 , Yin, Chunyan ORCID: 0000-0003-0298-0420 and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2018) Numerical simulation of the junction temperature, the coolant flow rate and the reliability of an IGBT module. In: 2018 24th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC 2018). IEEE, pp. 250-255. ISBN 978-1538667606

feature engineering

Hinojosa Herrera, Ana Elsa ORCID: 0000-0002-0636-1881 , Walshaw, Chris ORCID: 0000-0003-0253-7779 , Bailey, Chris ORCID: 0000-0002-9438-3879 and Yin, Chunyan ORCID: 0000-0003-0298-0420 (2019) Failure mode & effect analysis for improving data veracity and validity. In: Proceedings of the IEEE International Conference on Computing, Electronics & Communications Engineering 2019 (IEEE iCCECE '19). IEEE, pp. 100-105. ISBN 978-1728121383 (doi:https://doi.org/10.1109/iCCECE46942.2019.8941849)

Feature Selection

Hinojosa Herrera, Ana Elsa ORCID: 0000-0002-0636-1881 , Walshaw, Chris ORCID: 0000-0003-0253-7779 and Bailey, Chris ORCID: 0000-0002-9438-3879 (2020) Improving Black Box Classification Model Veracity for Electronics Anomaly Detection. In: 2020 15th IEEE Conference on Industrial Electronics and Applications (ICIEA). IEEE, pp. 1092-1097. ISBN 978-1728151694 ISSN 2156-2318 (Print), 2158-2297 (Online) (doi:https://doi.org/10.1109/ICIEA48937.2020.9248258)

finite element analysis

Nwanoro, Kenneth Chimezie, Lu, Hua ORCID: 0000-0002-4392-6562 , Yin, Chunyan ORCID: 0000-0003-0298-0420 and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2017) Computer simulation of the reliability of wire bonds and ribbon bonds in power electronics modules. In: 2017 23rd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC). IEEE, pp. 1-6. ISBN 978-1-5386-1929-2 ISSN 2474-1523 (Online) (doi:https://doi.org/10.1109/THERMINIC.2017.8233827)

Rajaguru, P. ORCID: 0000-0002-6041-0517 , Lu, H. ORCID: 0000-0002-4392-6562 , Bailey, C. ORCID: 0000-0002-9438-3879 , Ortiz-Gonzalez, J. and Alatise, O. (2016) Evaluation of the impact of the physical dimensions and material of the semiconductor chip on the reliability of Sn3.5Ag solder interconnect in power electronic module: A finite element analysis perspective. Microelectronics Reliability, 68. pp. 77-85. ISSN 0026-2714 (doi:https://doi.org/10.1016/j.microrel.2016.12.002)

Shahjalal, Mohammad, Lu, Hua ORCID: 0000-0002-4392-6562 and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2017) Electro-thermal modelling of multi chip power modules for high power converter application. In: 2017 18th International Conference on Electronic Packaging Technology (ICEPT), Harbin. IEEE, pp. 940-945. ISBN 978-1-5386-2973-4 (doi:https://doi.org/10.1109/ICEPT.2017.8046599)

Shahjalal, Mohammad, Rishad Ahmed, MD, Lu, Hua ORCID: 0000-0002-4392-6562 , Bailey, Chris ORCID: 0000-0002-9438-3879 and Forsyth, Andrew (2020) An analysis of the thermal interaction between components in power converter applications. IEEE Transactions on Power Electronics, 35 (9). pp. 9082-9094. ISSN 0885-8993 (Print), 1941-0107 (Online) (doi:https://doi.org/10.1109/TPEL.2020.2969350)

finite element modelling

Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Bailey, Christopher ORCID: 0000-0002-9438-3879 , Stewart, Paul, Parker, Mike and Roulston, John F. (2020) Experimental and modelling study on delamination risks for refinished electronic packages under hot solder dip loads. IEEE Transactions on Components, Packaging and Manufacturing Technology, 10 (3). pp. 502-515. ISSN 2156-3950 (Print), 2156-3985 (Online) (doi:https://doi.org/10.1109/TCPMT.2020.2972635)

Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Bailey, Christopher ORCID: 0000-0002-9438-3879 , Waite, Rhys, Hicks, Christopher and Golding, Terry (2020) Packaging challenges and reliability performance of compound semiconductor focal plane arrays. In: 2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC). IEEE, pp. 1-8. ISBN 978-0956808660 (doi:https://doi.org/10.23919/EMPC44848.2019.8951842)

flip-chip assembly

Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Bailey, Christopher ORCID: 0000-0002-9438-3879 , Waite, Rhys, Hicks, Christopher and Golding, Terry (2020) Packaging challenges and reliability performance of compound semiconductor focal plane arrays. In: 2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC). IEEE, pp. 1-8. ISBN 978-0956808660 (doi:https://doi.org/10.23919/EMPC44848.2019.8951842)

Fluids

Tilford, T. ORCID: 0000-0001-8307-6403 , Stoyanov, S. ORCID: 0000-0001-6091-1226 , Tourloukis, G. and Bailey, C. ORCID: 0000-0002-9438-3879 (2016) Numerical analysis of droplet deposition in inkjet printed electronics assembly. In: 2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE). IEEE, pp. 1-7. ISBN 978-1-5090-2106-2 (doi:https://doi.org/10.1109/EuroSimE.2016.7463358)

FMEA

Hinojosa Herrera, Ana ORCID: 0000-0002-0636-1881 , Walshaw, Chris ORCID: 0000-0003-0253-7779 and Bailey, Chris ORCID: 0000-0002-9438-3879 (2020) Failure mode & effect analysis and another methodology for improving data veracity and validity. Annals of Emerging Technologies in Computing (AETiC), 4 (3). pp. 9-16. ISSN 2516-0281 (doi:https://doi.org/10.33166/AETiC.2020.03.002)

Hinojosa Herrera, Ana Elsa ORCID: 0000-0002-0636-1881 , Walshaw, Chris ORCID: 0000-0003-0253-7779 , Bailey, Chris ORCID: 0000-0002-9438-3879 and Yin, Chunyan ORCID: 0000-0003-0298-0420 (2019) Failure mode & effect analysis for improving data veracity and validity. In: Proceedings of the IEEE International Conference on Computing, Electronics & Communications Engineering 2019 (IEEE iCCECE '19). IEEE, pp. 100-105. ISBN 978-1728121383 (doi:https://doi.org/10.1109/iCCECE46942.2019.8941849)

Focal Plane Array

Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 and Bailey, Chris (2023) Modeling Insights into the assembly challenges of focal plane arrays. IEEE Access. pp. 35207-35219. ISSN 2169-3536 (Online) (doi:https://doi.org/10.1109/ACCESS.2023.3264806)

Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Bailey, Christopher ORCID: 0000-0002-9438-3879 , Waite, Rhys, Hicks, Christopher and Golding, Terry (2020) Packaging challenges and reliability performance of compound semiconductor focal plane arrays. In: 2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC). IEEE, pp. 1-8. ISBN 978-0956808660 (doi:https://doi.org/10.23919/EMPC44848.2019.8951842)

Generative manufacturing

Bailey, C. ORCID: 0000-0002-9438-3879 , Stoyanov, S. ORCID: 0000-0001-6091-1226 , Tilford, T. and Tourloukis, G. (2016) Modelling methodologies for quality assessment of 3D inkjet printed electronic products. In: 3rd Fraunhofer Direct Digital Manufacturing Conference, DDMC 2016. Proceedings. Fraunhofer Verlag, Stuttgart. ISBN 978-3-8396-9128-1 ISSN 978-3-8396-1001-5 (Online)

genetic algorithm

Santhanakrishnan, Mani Sekara, Tilford, Tim ORCID: 0000-0001-8307-6403 and Bailey, Chris ORCID: 0000-0002-9438-3879 (2021) Multi-objective NSGA-II based shape optimisation of the cross-sectional shape of passively cooled heat sinks. International Journal of Numerical Methods for Heat and Fluid Flow, 32 (3). pp. 1025-1045. ISSN 0961-5539 (doi:https://doi.org/10.1108/HFF-10-2020-0656)

Geologic Measurements

Blanche, Jamie, Flynn, David, Lewis, Helen, Couples, Gary, Buckman, Jim, Bailey, Chris ORCID: 0000-0002-9438-3879 and Tilford, Timothy ORCID: 0000-0001-8307-6403 (2018) Analysis of sandstone pore space fluid saturation and mineralogy variation via application of monostatic K-band frequency modulated continuous wave radar. IEEE Access, 6. pp. 44376-44389. ISSN 2169-3536 (Online) (doi:https://doi.org/10.1109/ACCESS.2018.2863024)

Graphics processing units

Tilford, T. ORCID: 0000-0001-8307-6403 , Stoyanov, S. ORCID: 0000-0001-6091-1226 , Tourloukis, G. and Bailey, C. ORCID: 0000-0002-9438-3879 (2016) Numerical analysis of droplet deposition in inkjet printed electronics assembly. In: 2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE). IEEE, pp. 1-7. ISBN 978-1-5090-2106-2 (doi:https://doi.org/10.1109/EuroSimE.2016.7463358)

heat exchanger

Santhanakrishnan, Mani Sekaran, Tilford, Timothy ORCID: 0000-0001-8307-6403 and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2022) Heat transfer characteristics of plate fin heat sink with longitudinal vortex generators. International Journal of Numerical Methods for Heat and Fluid Flow, 33 (3). pp. 1203-1228. ISSN 0961-5539 (doi:https://doi.org/10.1108/HFF-06-2022-0386)

heat sink

Rajaguru, Pushparajah ORCID: 0000-0002-6041-0517 , Santhanakrishnan, Manisekaran, Tilford, Tim ORCID: 0000-0001-8307-6403 and Bailey, Chris ORCID: 0000-0002-9438-3879 (2019) Design of additively manufactured heatsinks for power electronics thermal management using adjoint level-set topology optimization. In: 2019 25th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC). IEEE. ISBN 978-1728120782 ISSN 2474-1515 (Print), 2474-1523 (Online) (doi:https://doi.org/10.1109/THERMINIC.2019.8923530)

heat sink design

Santhanakrishnan, Mani Sekara, Tilford, Tim ORCID: 0000-0001-8307-6403 and Bailey, Chris ORCID: 0000-0002-9438-3879 (2021) Multi-objective NSGA-II based shape optimisation of the cross-sectional shape of passively cooled heat sinks. International Journal of Numerical Methods for Heat and Fluid Flow, 32 (3). pp. 1025-1045. ISSN 0961-5539 (doi:https://doi.org/10.1108/HFF-10-2020-0656)

heat transfer

Santhanakrishnan, Mani Sekaran, Tilford, Timothy ORCID: 0000-0001-8307-6403 and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2022) Heat transfer characteristics of plate fin heat sink with longitudinal vortex generators. International Journal of Numerical Methods for Heat and Fluid Flow, 33 (3). pp. 1203-1228. ISSN 0961-5539 (doi:https://doi.org/10.1108/HFF-06-2022-0386)

heating

Tilford, Timothy ORCID: 0000-0001-8307-6403 , Cook, A., Lu, H. ORCID: 0000-0002-4392-6562 , Ramambasoa, A. and Conseil, F. (2014) Numerical analysis of the performance of highly oriented pyrolytic graphite heat spreader in thermal management of microelectronics assemblies. In: Electronics Systemintegration Technology Conference, 16-18 Sep 2014, Helsinki, Finland. (doi:https://doi.org/10.1109/ESTC.2014.6962815)

hot solder dip

Yin, Chunyan ORCID: 0000-0003-0298-0420 , Best, Chris, Bailey, Chris ORCID: 0000-0002-9438-3879 and Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 (2015) Statistical analysis of the impact of refinishing process on leaded components. Microelectronics Reliability, 55 (2). pp. 424-431. ISSN 0026-2714 (doi:https://doi.org/10.1016/j.microrel.2014.11.001)

hot solder dip refinishing process

Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Bailey, Christopher ORCID: 0000-0002-9438-3879 , Stewart, Paul, Parker, Mike and Roulston, John F. (2020) Experimental and modelling study on delamination risks for refinished electronic packages under hot solder dip loads. IEEE Transactions on Components, Packaging and Manufacturing Technology, 10 (3). pp. 502-515. ISSN 2156-3950 (Print), 2156-3985 (Online) (doi:https://doi.org/10.1109/TCPMT.2020.2972635)

IGBT

Nwanoro, Kenneth Chimezie, Lu, Hua ORCID: 0000-0002-4392-6562 , Yin, Chunyan ORCID: 0000-0003-0298-0420 and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2018) Numerical simulation of the junction temperature, the coolant flow rate and the reliability of an IGBT module. In: 2018 24th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC 2018). IEEE, pp. 250-255. ISBN 978-1538667606

Shahjalal, Mohammad, Lu, Hua ORCID: 0000-0002-4392-6562 and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2017) Electro-thermal modelling of multi chip power modules for high power converter application. In: 2017 18th International Conference on Electronic Packaging Technology (ICEPT), Harbin. IEEE, pp. 940-945. ISBN 978-1-5386-2973-4 (doi:https://doi.org/10.1109/ICEPT.2017.8046599)

IGBT power module

Shahjalal, Mohammad, Rishad Ahmed, MD, Lu, Hua ORCID: 0000-0002-4392-6562 , Bailey, Chris ORCID: 0000-0002-9438-3879 and Forsyth, Andrew (2020) An analysis of the thermal interaction between components in power converter applications. IEEE Transactions on Power Electronics, 35 (9). pp. 9082-9094. ISSN 0885-8993 (Print), 1941-0107 (Online) (doi:https://doi.org/10.1109/TPEL.2020.2969350)

incomplete dataset

Hinojosa Herrera, Ana Elsa ORCID: 0000-0002-0636-1881 and Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 (2019) Data driven predictive model to compact a production stop-on-fail test set for an electronic device. In: Proceedings of the 2018 International Conference on Computing, Electronics & Communications Engineering (iCCECE). IEEE Xplore, pp. 59-64. ISBN 9781538649046 (doi:https://doi.org/10.1109/iCCECOME.2018.8658941)

Hinojosa Herrera, Ana Elsa ORCID: 0000-0002-0636-1881 , Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Bailey, Christopher ORCID: 0000-0002-9438-3879 , Walshaw, Christopher ORCID: 0000-0003-0253-7779 and Yin, Chunyan ORCID: 0000-0003-0298-0420 (2019) Data analytics to reduce stop-on-fail test in electronics manufacturing. Open Computer Sciences, 9 (1). pp. 200-211. ISSN 2299-1093 (Online) (doi:https://doi.org/10.1515/comp-2019-0014)

indium joints

Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 and Bailey, Chris (2023) Modeling Insights into the assembly challenges of focal plane arrays. IEEE Access. pp. 35207-35219. ISSN 2169-3536 (Online) (doi:https://doi.org/10.1109/ACCESS.2023.3264806)

inkjet printing

Tilford, Tim ORCID: 0000-0001-8307-6403 , Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Braun, Jessica, Janhsen, Jan Christoph, Patel, Mayur K. and Bailey, Chris ORCID: 0000-0002-9438-3879 (2021) Comparative reliability of inkjet-printed electronics packaging. IEEE Transactions on Components, Packaging and Manufacturing Technology, 11 (2). pp. 351-362. ISSN 2156-3950 (Print), 2156-3985 (Online) (doi:https://doi.org/10.1109/TCPMT.2021.3049952)

Integrated circuit modeling

Yin, Chunyan ORCID: 0000-0003-0298-0420 , Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Bailey, Christopher ORCID: 0000-0002-9438-3879 and Stewart, Paul (2017) Modelling the impact of conformal coating penetration on QFN reliability. In: 2017 18th International Conference on Electronic Packaging Technology (ICEPT). IEEE, pp. 1021-1026. ISBN 978-1-5386-2973-4 (doi:https://doi.org/10.1109/ICEPT.2017.8046616)

intelligent manufacturing

Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Ahsan, Mominul, Bailey, Chris ORCID: 0000-0002-9438-3879 , Wotherspoon, Tracy and Hunt, Craig (2019) Predictive analytics methodology for smart qualification testing of electronic components. Journal of Intelligent Manufacturing, 30 (3). pp. 1497-1514. ISSN 0956-5515 (Print), 1572-8145 (Online) (doi:https://doi.org/10.1007/s10845-018-01462-9)

inverter

Shahjalal, Mohammad, Lu, Hua ORCID: 0000-0002-4392-6562 and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2017) Electro-thermal modelling of multi chip power modules for high power converter application. In: 2017 18th International Conference on Electronic Packaging Technology (ICEPT), Harbin. IEEE, pp. 940-945. ISBN 978-1-5386-2973-4 (doi:https://doi.org/10.1109/ICEPT.2017.8046599)

IR detectors

Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 and Bailey, Chris (2023) Modeling Insights into the assembly challenges of focal plane arrays. IEEE Access. pp. 35207-35219. ISSN 2169-3536 (Online) (doi:https://doi.org/10.1109/ACCESS.2023.3264806)

Kernel

Tilford, T. ORCID: 0000-0001-8307-6403 , Stoyanov, S. ORCID: 0000-0001-6091-1226 , Tourloukis, G. and Bailey, C. ORCID: 0000-0002-9438-3879 (2016) Numerical analysis of droplet deposition in inkjet printed electronics assembly. In: 2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE). IEEE, pp. 1-7. ISBN 978-1-5090-2106-2 (doi:https://doi.org/10.1109/EuroSimE.2016.7463358)

KNN

Hinojosa Herrera, Ana Elsa ORCID: 0000-0002-0636-1881 , Walshaw, Chris ORCID: 0000-0003-0253-7779 and Bailey, Chris ORCID: 0000-0002-9438-3879 (2020) Improving Black Box Classification Model Veracity for Electronics Anomaly Detection. In: 2020 15th IEEE Conference on Industrial Electronics and Applications (ICIEA). IEEE, pp. 1092-1097. ISBN 978-1728151694 ISSN 2156-2318 (Print), 2158-2297 (Online) (doi:https://doi.org/10.1109/ICIEA48937.2020.9248258)

Kriging

Rajaguru, Pushparajah ORCID: 0000-0002-6041-0517 , Lu, Hua ORCID: 0000-0002-4392-6562 and Bailey, Chris ORCID: 0000-0002-9438-3879 (2015) Sintered silver finite element modelling and reliability based design optimisation in power electronic module. Microelectronics Reliability, 55 (6). pp. 919-930. ISSN 0026-2714 (doi:https://doi.org/10.1016/j.microrel.2015.03.011)

Rajaguru, Pushparajah ORCID: 0000-0002-6041-0517 , Lu, Hua ORCID: 0000-0002-4392-6562 and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2014) Application of nonlinear fatigue damage models in power electronic module wirebond structure under various amplitude loadings. Advances in Manufacturing, 2 (3). pp. 239-250. ISSN 2095-3127 (Print), 2195-3597 (Online) (doi:https://doi.org/10.1007/s40436-014-0054-5)

lateral IGBT

Aliyu, A. M., Mouawad, B., Castellazzi, A., Rajaguru, P. ORCID: 0000-0002-6041-0517 , Bailey, C. ORCID: 0000-0002-9438-3879 , Pathirana, V., Uduampola, N., Trajkovic, T. and Ubrea, F. (2017) Chip-on-board assembly of 800V Si LIGBTs for high performance ultra-compact LED drivers. In: Proceedings of the 2017 29th International Symposium on Power Semiconductor Devices and IC's (ISPSD). IEEE, pp. 431-434. ISBN 978-4-88686-094-1 ISSN 1946-0201 (Online) (doi:https://doi.org/10.23919/ISPSD.2017.7988976)

Rajaguru, P. ORCID: 0000-0002-6041-0517 , Lu, H. ORCID: 0000-0002-4392-6562 , Bailey, C. ORCID: 0000-0002-9438-3879 , Castellazzi, A., Pathirana, V., Udugampola, N. and Udrea, F. (2018) Impact of underfill and other physical dimensions on Silicon Lateral IGBT package reliability using computer model with discrete and continuous design variables. Microelectronics Reliability, 83. pp. 146-156. ISSN 0026-2714 (doi:https://doi.org/10.1016/j.microrel.2018.02.024)

layered structures

Nwanoro, Kenneth C., Lu, Hua ORCID: 0000-0002-4392-6562 , Yin, Chunyan ORCID: 0000-0003-0298-0420 and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2018) An approximate numerical method for the prediction of plastic strain in layered structures. In: 2018 7th Electronic System-Integration Technology Conference (ESTC 2018). IEEE, pp. 181-187. ISBN 978-1538668153

lead-free

Yin, Chunyan ORCID: 0000-0003-0298-0420 , Best, Chris, Bailey, Chris ORCID: 0000-0002-9438-3879 and Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 (2015) Statistical analysis of the impact of refinishing process on leaded components. Microelectronics Reliability, 55 (2). pp. 424-431. ISSN 0026-2714 (doi:https://doi.org/10.1016/j.microrel.2014.11.001)

leaded component

Yin, Chunyan ORCID: 0000-0003-0298-0420 , Best, Chris, Bailey, Chris ORCID: 0000-0002-9438-3879 and Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 (2015) Statistical analysis of the impact of refinishing process on leaded components. Microelectronics Reliability, 55 (2). pp. 424-431. ISSN 0026-2714 (doi:https://doi.org/10.1016/j.microrel.2014.11.001)

LED

Bailey, C. ORCID: 0000-0002-9438-3879 , Rajaguru, P. ORCID: 0000-0002-6041-0517 , Lu, H. ORCID: 0000-0002-4392-6562 , Castellazzi, A., Antonini, M., Pathirana, V., Udugampola, N., Udrea, F., Mitchelson, P. D. and Aldhaher, S. (2018) Mechanical modelling of high power lateral IGBT for LED driver applications. In: IEEE Electronic Components and Technology Conference (ECTC). IEEE Electronics Packaging Society (formerly CPMT), pp. 1375-1381. ISBN 978-1-5386-5000-4 ISSN 2377-5726 (Online) (doi:https://doi.org/10.1109/ECTC.2018.00210)

Rajaguru, P. ORCID: 0000-0002-6041-0517 , Bailey, C. ORCID: 0000-0002-9438-3879 , Lu, H. ORCID: 0000-0002-4392-6562 , Aliyu, A. M., Castellazzi, A., Pathirana, V., Udugampola, N., Trajkovic, T., Udrea, F., Mitcheson, P. D. and Elliott, A. D. T. (2017) Co-design/simulation of flip-chip assembly for high voltage IGBT packages. In: 23rd International workshop on Thermal Investigations of ICs and Systems (THERMINIC). THERMINIC, pp. 1-5.

Rajaguru, P. ORCID: 0000-0002-6041-0517 , Lu, H. ORCID: 0000-0002-4392-6562 , Bailey, C. ORCID: 0000-0002-9438-3879 , Castellazzi, A., Pathirana, V., Udugampola, N. and Udrea, F. (2018) Impact of underfill and other physical dimensions on Silicon Lateral IGBT package reliability using computer model with discrete and continuous design variables. Microelectronics Reliability, 83. pp. 146-156. ISSN 0026-2714 (doi:https://doi.org/10.1016/j.microrel.2018.02.024)

LED driver

Rajaguru, P. ORCID: 0000-0002-6041-0517 , Lu, H. ORCID: 0000-0002-4392-6562 , Bailey, C. ORCID: 0000-0002-9438-3879 , Ortiz-Gonzalez, J. and Alatise, O. (2016) Electro-thermo-mechanical modelling and analysis of the Press Pack Diode in Power Electronics. In: 2015 21st International Workshop on Thermal Investigations of ICs and Systems (THERMINIC). IEEE, pp. 1-6. ISBN 978-1-4673-9706-3 (doi:https://doi.org/10.1109/THERMINIC.2015.7389607)

LED drivers

Aliyu, A. M., Mouawad, B., Castellazzi, A., Rajaguru, P. ORCID: 0000-0002-6041-0517 , Bailey, C. ORCID: 0000-0002-9438-3879 , Pathirana, V., Uduampola, N., Trajkovic, T. and Ubrea, F. (2017) Chip-on-board assembly of 800V Si LIGBTs for high performance ultra-compact LED drivers. In: Proceedings of the 2017 29th International Symposium on Power Semiconductor Devices and IC's (ISPSD). IEEE, pp. 431-434. ISBN 978-4-88686-094-1 ISSN 1946-0201 (Online) (doi:https://doi.org/10.23919/ISPSD.2017.7988976)

level-set method

Rajaguru, Pushparajah ORCID: 0000-0002-6041-0517 , Santhanakrishnan, Manisekaran, Tilford, Tim ORCID: 0000-0001-8307-6403 and Bailey, Chris ORCID: 0000-0002-9438-3879 (2019) Design of additively manufactured heatsinks for power electronics thermal management using adjoint level-set topology optimization. In: 2019 25th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC). IEEE. ISBN 978-1728120782 ISSN 2474-1515 (Print), 2474-1523 (Online) (doi:https://doi.org/10.1109/THERMINIC.2019.8923530)

Life consumption

Musallam, Mahera, Yin, Chunyan ORCID: 0000-0003-0298-0420 , Bailey, Christopher ORCID: 0000-0002-9438-3879 and Johnson, Mark (2014) Mission profile-based reliability design and real-time life consumption estimation in power electronics. IEEE Transactions on Power Electronics, 30 (5). pp. 2601-2613. ISSN 0885-8993 (Print), 1941-0107 (Online) (doi:https://doi.org/10.1109/TPEL.2014.2358555)

life expectancy

Bailey, Christopher ORCID: 0000-0002-9438-3879 , Yin, Chunyan ORCID: 0000-0003-0298-0420 and Rajaguru, Pushparajah ORCID: 0000-0002-6041-0517 (2019) Predicting damage and life expectancy of subsea power cables in offshore renewable energy applications. IEEE ACCESS, 7. pp. 54658-54669. ISSN 2169-3536 (Online) (doi:https://doi.org/10.1109/ACCESS.2019.2911260)

life prediction

Lu, Hua ORCID: 0000-0002-4392-6562 and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2017) Failure and reliability analysis of a SiC power module based on stress comparison to a Si device. IEEE Transactions on Device and Materials Reliability, 17 (4). pp. 727-737. ISSN 1530-4388 (doi:https://doi.org/10.1109/TDMR.2017.2766692)

lifetime modelling

Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Stewart†, Paul and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2021) Reliability optimisation and lifetime modelling of micro-BGA assemblies in harsh environment applications. In: 2021 23rd European Microelectronics and Packaging Conference & Exhibition (EMPC). 13-16 Sept. 2021. Gothenburg, Sweden. IEEE Xplore . Institute of Electrical and Electronics Engineers (IEEE), Piscataway, New Jersey, pp. 1-8. ISBN 978-0956808677 ; 978-1665423687 (doi:https://doi.org/10.23919/EMPC53418.2021.9584970)

LIGBT

Bailey, C. ORCID: 0000-0002-9438-3879 , Rajaguru, P. ORCID: 0000-0002-6041-0517 , Lu, H. ORCID: 0000-0002-4392-6562 , Castellazzi, A., Antonini, M., Pathirana, V., Udugampola, N., Udrea, F., Mitchelson, P. D. and Aldhaher, S. (2018) Mechanical modelling of high power lateral IGBT for LED driver applications. In: IEEE Electronic Components and Technology Conference (ECTC). IEEE Electronics Packaging Society (formerly CPMT), pp. 1375-1381. ISBN 978-1-5386-5000-4 ISSN 2377-5726 (Online) (doi:https://doi.org/10.1109/ECTC.2018.00210)

Rajaguru, P. ORCID: 0000-0002-6041-0517 , Lu, H. ORCID: 0000-0002-4392-6562 , Bailey, C. ORCID: 0000-0002-9438-3879 , Ortiz-Gonzalez, J. and Alatise, O. (2016) Electro-thermo-mechanical modelling and analysis of the Press Pack Diode in Power Electronics. In: 2015 21st International Workshop on Thermal Investigations of ICs and Systems (THERMINIC). IEEE, pp. 1-6. ISBN 978-1-4673-9706-3 (doi:https://doi.org/10.1109/THERMINIC.2015.7389607)

logistic regression

Hinojosa Herrera, Ana Elsa ORCID: 0000-0002-0636-1881 , Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Bailey, Christopher ORCID: 0000-0002-9438-3879 , Walshaw, Christopher ORCID: 0000-0003-0253-7779 and Yin, Chunyan ORCID: 0000-0003-0298-0420 (2019) Data analytics to reduce stop-on-fail test in electronics manufacturing. Open Computer Sciences, 9 (1). pp. 200-211. ISSN 2299-1093 (Online) (doi:https://doi.org/10.1515/comp-2019-0014)

machine learning

Ahsan, M., Stoyanov, S. ORCID: 0000-0001-6091-1226 , Bailey, C. ORCID: 0000-0002-9438-3879 and Albarbar, A. (2020) Developing computational intelligence for smart qualification testing of electronic products. IEEE Access, 8. pp. 16922-16933. ISSN 2169-3536 (Online) (doi:https://doi.org/10.1109/ACCESS.2020.2967858)

Ahsan, Mominul, Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2018) Data driven prognostics for failure of power semiconductor packages. In: Proceedings of 41st Spring Seminar on Electronics Technology (ISSE). IEEE Xplore, pp. 1-6. ISBN 978-1-5386-5730-0 ISSN 2161-2536 (Online) (doi:https://doi.org/10.1109/ISSE.2018.8443612)

Malik, Asif, Rajaguru, Pushparajah ORCID: 0000-0002-6041-0517 and Azzawi, Rula (2022) Smart manufacturing with Artificial Intelligence and digital twin: a brief review. In: 8th International Conference on Information Technology Trends, 25th - 26th May 2022, Dubai, UAE.

Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Ahsan, Mominuil and Bailey, Chris ORCID: 0000-0002-9438-3879 (2018) Data analytics approach for optimal qualification testing of electronic components. In: Proceedings EuroSimE 2018. 2018 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) . IEEE Xplore, pp. 1-9. ISBN 978-1-5386-2358-9 (doi:https://doi.org/10.1109/EuroSimE.2018.8369926)

Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Ahsan, Mominul, Bailey, Chris ORCID: 0000-0002-9438-3879 , Wotherspoon, Tracy and Hunt, Craig (2019) Predictive analytics methodology for smart qualification testing of electronic components. Journal of Intelligent Manufacturing, 30 (3). pp. 1497-1514. ISSN 0956-5515 (Print), 1572-8145 (Online) (doi:https://doi.org/10.1007/s10845-018-01462-9)

Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 and Bailey, Chris ORCID: 0000-0002-9438-3879 (2022) Deep learning modelling for composite properties of PCB conductive layers. In: 2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE). Institute of Electrical and Electronics Engineers (IEEE), Piscataway, New Jersey, pp. 1-7. ISBN 978-1665458375 (doi:https://doi.org/10.1109/EuroSimE54907.2022.9758885)

Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2017) Machine learning for additive manufacturing of electronics. In: Proceedings 2017 40th International Spring Seminar on Electronics Technology (ISSE). IEEE. ISBN 978-1-5386-0583-7 ISSN 2161-2536 (Online) (doi:https://doi.org/10.1109/ISSE.2017.8000936)

manufacturing technicians

Bailey, C. ORCID: 0000-0002-9438-3879 , Stoyanov, S. ORCID: 0000-0001-6091-1226 , Tilford, T. and Tourloukis, G. (2016) Modelling methodologies for quality assessment of 3D inkjet printed electronic products. In: 3rd Fraunhofer Direct Digital Manufacturing Conference, DDMC 2016. Proceedings. Fraunhofer Verlag, Stuttgart. ISBN 978-3-8396-9128-1 ISSN 978-3-8396-1001-5 (Online)

material properties

Tilford, Timothy ORCID: 0000-0001-8307-6403 , Cook, A., Lu, H. ORCID: 0000-0002-4392-6562 , Ramambasoa, A. and Conseil, F. (2014) Numerical analysis of the performance of highly oriented pyrolytic graphite heat spreader in thermal management of microelectronics assemblies. In: Electronics Systemintegration Technology Conference, 16-18 Sep 2014, Helsinki, Finland. (doi:https://doi.org/10.1109/ESTC.2014.6962815)

Materials

Bailey, C. ORCID: 0000-0002-9438-3879 , Stoyanov, S. ORCID: 0000-0001-6091-1226 , Tilford, T. and Tourloukis, G. (2016) Modelling methodologies for quality assessment of 3D inkjet printed electronic products. In: 3rd Fraunhofer Direct Digital Manufacturing Conference, DDMC 2016. Proceedings. Fraunhofer Verlag, Stuttgart. ISBN 978-3-8396-9128-1 ISSN 978-3-8396-1001-5 (Online)

Materials reliability

Yin, Chunyan ORCID: 0000-0003-0298-0420 , Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Bailey, Christopher ORCID: 0000-0002-9438-3879 and Stewart, Paul (2017) Modelling the impact of conformal coating penetration on QFN reliability. In: 2017 18th International Conference on Electronic Packaging Technology (ICEPT). IEEE, pp. 1021-1026. ISBN 978-1-5386-2973-4 (doi:https://doi.org/10.1109/ICEPT.2017.8046616)

Materials scientist

Bailey, C. ORCID: 0000-0002-9438-3879 , Stoyanov, S. ORCID: 0000-0001-6091-1226 , Tilford, T. and Tourloukis, G. (2016) Modelling methodologies for quality assessment of 3D inkjet printed electronic products. In: 3rd Fraunhofer Direct Digital Manufacturing Conference, DDMC 2016. Proceedings. Fraunhofer Verlag, Stuttgart. ISBN 978-3-8396-9128-1 ISSN 978-3-8396-1001-5 (Online)

Mechanical engineering

Bailey, C. ORCID: 0000-0002-9438-3879 , Stoyanov, S. ORCID: 0000-0001-6091-1226 , Tilford, T. and Tourloukis, G. (2016) Modelling methodologies for quality assessment of 3D inkjet printed electronic products. In: 3rd Fraunhofer Direct Digital Manufacturing Conference, DDMC 2016. Proceedings. Fraunhofer Verlag, Stuttgart. ISBN 978-3-8396-9128-1 ISSN 978-3-8396-1001-5 (Online)

Bailey, C. ORCID: 0000-0002-9438-3879 , Stoyanov, S. ORCID: 0000-0001-6091-1226 , Tilford, T. and Tourloukis, G. (2016) Modelling methodologies for quality assessment of 3D inkjet printed electronic products. In: 3rd Fraunhofer Direct Digital Manufacturing Conference, DDMC 2016. Proceedings. Fraunhofer Verlag, Stuttgart. ISBN 978-3-8396-9128-1 ISSN 978-3-8396-1001-5 (Online)

Megasonic Agitation

Jones, Thomas D.A., Flynn, David, Desmulliez, Marc P.Y., Price, Dennis, Beadel, Matthew, Strusevich, Nadia, Patel, Mayur, Bailey, Chris ORCID: 0000-0002-9438-3879 and Costello, Suzanne (2016) Morphology and acoustic artefacts of copper deposits electroplated using megasonic assisted agitation. Circuit World, 42 (3). pp. 127-140. ISSN 0305-6120 (doi:https://doi.org/10.1108/CW-03-2016-0006)

micro-BGA

Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Stewart†, Paul and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2021) Reliability optimisation and lifetime modelling of micro-BGA assemblies in harsh environment applications. In: 2021 23rd European Microelectronics and Packaging Conference & Exhibition (EMPC). 13-16 Sept. 2021. Gothenburg, Sweden. IEEE Xplore . Institute of Electrical and Electronics Engineers (IEEE), Piscataway, New Jersey, pp. 1-8. ISBN 978-0956808677 ; 978-1665423687 (doi:https://doi.org/10.23919/EMPC53418.2021.9584970)

Microelectronics

Tilford, T. ORCID: 0000-0001-8307-6403 , Bruan, J., Janhsen, J. C., Burgard, M. and Bailey, C. ORCID: 0000-0002-9438-3879 (2018) SPH analysis of inkjet droplet impact dynamics. In: Proceedings of the 13th World Congress on Computational Mechanics (WCCM XIII) and 2nd Pan American Congress on Computational Mechanics (PANACM II). WCCM.

Tilford, T. ORCID: 0000-0001-8307-6403 , Stoyanov, S. ORCID: 0000-0001-6091-1226 , Tourloukis, G. and Bailey, C. ORCID: 0000-0002-9438-3879 (2016) Numerical analysis of droplet deposition in inkjet printed electronics assembly. In: 2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE). IEEE, pp. 1-7. ISBN 978-1-5090-2106-2 (doi:https://doi.org/10.1109/EuroSimE.2016.7463358)

microelectronics fabrication

Tilford, Tim ORCID: 0000-0001-8307-6403 , Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Braun, Jessica, Janhsen, Jan Christoph, Patel, Mayur K. and Bailey, Chris ORCID: 0000-0002-9438-3879 (2021) Comparative reliability of inkjet-printed electronics packaging. IEEE Transactions on Components, Packaging and Manufacturing Technology, 11 (2). pp. 351-362. ISSN 2156-3950 (Print), 2156-3985 (Online) (doi:https://doi.org/10.1109/TCPMT.2021.3049952)

microelectronics packaging

Desmulliez, Marc P.Y, Adamietz, Raphael, Pavuluri, Sumanth K., Tilford, Tim ORCID: 0000-0001-8307-6403 , Bailey, Chris ORCID: 0000-0002-9438-3879 , Schreier-Alt, Thomas and Warmuth, Jens (2018) Reliability testing and stress measurement of QFN packages encapsulated by an open-ended microwave curing system. IEEE Transactions on Components, Packaging and Manufacturing Technology, 9 (1). pp. 173-180. ISSN 2156-3950 (Print), 2156-3985 (Online) (doi:https://doi.org/10.1109/TCPMT.2018.2859031)

Microfabrication

Tonry, Catherine E. H. ORCID: 0000-0002-8214-0845 , Patel, Mayur K., Yu, Weixing, Desmulliez, Marc P. Y. and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2019) Fabrication of hollow polymer microstructures using dielectric and capillary forces. Microsystem Technologies. pp. 1-8. ISSN 0946-7076 (Print), 1432-1858 (Online) (doi:https://doi.org/10.1007/s00542-019-04409-z)

Microfluidics

Tilford, T. ORCID: 0000-0001-8307-6403 , Bruan, J., Janhsen, J. C., Burgard, M. and Bailey, C. ORCID: 0000-0002-9438-3879 (2018) SPH analysis of inkjet droplet impact dynamics. In: Proceedings of the 13th World Congress on Computational Mechanics (WCCM XIII) and 2nd Pan American Congress on Computational Mechanics (PANACM II). WCCM.

Tonry, Catherine E. H. ORCID: 0000-0002-8214-0845 , Patel, Mayur K., Yu, Weixing, Desmulliez, Marc P. Y. and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2019) Fabrication of hollow polymer microstructures using dielectric and capillary forces. Microsystem Technologies. pp. 1-8. ISSN 0946-7076 (Print), 1432-1858 (Online) (doi:https://doi.org/10.1007/s00542-019-04409-z)

microstructure

Xu, Yilun, Xian, Jingwei, Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Bailey, Christopher ORCID: 0000-0002-9438-3879 , Coyle, Richard, Gourlay, Christopher and Dunne, Fionn (2022) A multi-scale approach to microstructure-sensitive thermal fatigue in solder joints. International Journal of Plasticity, 155:103308. ISSN 0749-6419 (doi:https://doi.org/10.1016/j.ijplas.2022.103308)

Microstructures

Tonry, Catherine E. H. ORCID: 0000-0002-8214-0845 , Patel, Mayur K., Yu, Weixing, Desmulliez, Marc P. Y. and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2019) Fabrication of hollow polymer microstructures using dielectric and capillary forces. Microsystem Technologies. pp. 1-8. ISSN 0946-7076 (Print), 1432-1858 (Online) (doi:https://doi.org/10.1007/s00542-019-04409-z)

microsystems

Rajaguru, Pushparajah ORCID: 0000-0002-6041-0517 (2014) Reduced order modelling and numerical optimisation approach to reliability analysis of microsystems and power modules. PhD thesis, University of Greenwich.

microwave curing

Desmulliez, Marc P.Y, Adamietz, Raphael, Pavuluri, Sumanth K., Tilford, Tim ORCID: 0000-0001-8307-6403 , Bailey, Chris ORCID: 0000-0002-9438-3879 , Schreier-Alt, Thomas and Warmuth, Jens (2018) Reliability testing and stress measurement of QFN packages encapsulated by an open-ended microwave curing system. IEEE Transactions on Components, Packaging and Manufacturing Technology, 9 (1). pp. 173-180. ISSN 2156-3950 (Print), 2156-3985 (Online) (doi:https://doi.org/10.1109/TCPMT.2018.2859031)

Microwave Propagation

Blanche, Jamie, Flynn, David, Lewis, Helen, Couples, Gary, Buckman, Jim, Bailey, Chris ORCID: 0000-0002-9438-3879 and Tilford, Timothy ORCID: 0000-0001-8307-6403 (2018) Analysis of sandstone pore space fluid saturation and mineralogy variation via application of monostatic K-band frequency modulated continuous wave radar. IEEE Access, 6. pp. 44376-44389. ISSN 2169-3536 (Online) (doi:https://doi.org/10.1109/ACCESS.2018.2863024)

Mission profile

Musallam, Mahera, Yin, Chunyan ORCID: 0000-0003-0298-0420 , Bailey, Christopher ORCID: 0000-0002-9438-3879 and Johnson, Mark (2014) Mission profile-based reliability design and real-time life consumption estimation in power electronics. IEEE Transactions on Power Electronics, 30 (5). pp. 2601-2613. ISSN 0885-8993 (Print), 1941-0107 (Online) (doi:https://doi.org/10.1109/TPEL.2014.2358555)

model order reduction

Rajaguru, Pushpa ORCID: 0000-0002-6041-0517 , Lu, Hua ORCID: 0000-0002-4392-6562 , Bailey, Chris ORCID: 0000-0002-9438-3879 and Bella, Martina (2020) Modelling and analysis of vibration on power electronic module structure and application of model order reduction. Microelectronics Reliability, 110:113697. ISSN 0026-2714 (doi:https://doi.org/10.1016/j.microrel.2020.113697)

modelling

Ahsan, M., Stoyanov, S. ORCID: 0000-0001-6091-1226 , Bailey, C. ORCID: 0000-0002-9438-3879 and Albarbar, A. (2020) Developing computational intelligence for smart qualification testing of electronic products. IEEE Access, 8. pp. 16922-16933. ISSN 2169-3536 (Online) (doi:https://doi.org/10.1109/ACCESS.2020.2967858)

Rajaguru, Pushparajah ORCID: 0000-0002-6041-0517 (2014) Reduced order modelling and numerical optimisation approach to reliability analysis of microsystems and power modules. PhD thesis, University of Greenwich.

Stoyanov, S. ORCID: 0000-0001-6091-1226 and Bailey, C. ORCID: 0000-0002-9438-3879 (2015) Modelling the impact of refinishing processes on COTS components for use in aerospace applications. Microelectronics Reliability, 55 (9-10). pp. 1271-1279. ISSN 0026-2714 (doi:https://doi.org/10.1016/j.microrel.2015.07.030)

Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Bailey, Chris ORCID: 0000-0002-9438-3879 and Tourloukis, Georgios (2016) Similarity approach for reducing qualification tests of electronic components. Microelectronics Reliability, 67. pp. 111-119. ISSN 0026-2714 (doi:https://doi.org/10.1016/j.microrel.2016.10.017)

Tilford, Tim ORCID: 0000-0001-8307-6403 , Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Braun, Jessica, Janhsen, Jan Cristophe, Burgard, Matthias, Birch, Richard and Bailey, Chris ORCID: 0000-0002-9438-3879 (2018) Design, manufacture and test for reliable 3D printed electronics packaging. Microelectronics Reliability, 85. pp. 109-117. ISSN 0026-2714 (doi:https://doi.org/10.1016/j.microrel.2018.04.008)

Zhu, X., Kotadia, H., Xu, S., Lu, H. ORCID: 0000-0002-4392-6562 , Mannan, S. H., Bailey, C. ORCID: 0000-0002-9438-3879 and Chan, Y. C. (2014) Electromigration in Sn-Ag solder thin films under high current density. Thin Solid Films, 565. pp. 193-201. ISSN 0040-6090 (doi:https://doi.org/10.1016/j.tsf.2014.06.030)

Multi-objective optimization

Nwanoro, Kenneth, Lu, Hua ORCID: 0000-0002-4392-6562 , Yin, Chunyan ORCID: 0000-0003-0298-0420 and Bailey, Chris ORCID: 0000-0002-9438-3879 (2018) An analysis of the reliability and design optimization of aluminium ribbon bonds in power electronics modules using computer simulation method. Microelectronics Reliability, 87. pp. 1-14. ISSN 0026-2714 (doi:https://doi.org/10.1016/j.microrel.2018.05.013)

multi-scale modelling

Xu, Yilun, Xian, Jingwei, Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Bailey, Christopher ORCID: 0000-0002-9438-3879 , Coyle, Richard, Gourlay, Christopher and Dunne, Fionn (2022) A multi-scale approach to microstructure-sensitive thermal fatigue in solder joints. International Journal of Plasticity, 155:103308. ISSN 0749-6419 (doi:https://doi.org/10.1016/j.ijplas.2022.103308)

Multiphysics modelling

Rajaguru, Pushparajah ORCID: 0000-0002-6041-0517 , Ortiz-Gonzalez, Jose Angel, Lu, Hua ORCID: 0000-0002-4392-6562 , Bailey, Chris ORCID: 0000-0002-9438-3879 and Alatise, Olawiwola (2017) A multiphysics modeling and experimental analysis of pressure contacts in power electronics applications. IEEE Transactions on Components, Packaging and Manufacturing Technology, 7 (6). pp. 893-900. ISSN 2156-3950 (Print), 2156-3985 (Online) (doi:https://doi.org/10.1109/TCPMT.2017.2688021)

N/A

Rajaguru, Pushparajah ORCID: 0000-0002-6041-0517 , Mason, Peter, Bailey, Christopher ORCID: 0000-0002-9438-3879 and Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 (2012) Structural Analysis on the Riveted Hull of the Paddle Steamer Medway Queen. In: Historic Ships Conference 2012. Royal Institution of Naval Architects (RINA).

natural convection

Santhanakrishnan, Mani Sekara, Tilford, Tim ORCID: 0000-0001-8307-6403 and Bailey, Chris ORCID: 0000-0002-9438-3879 (2021) Multi-objective NSGA-II based shape optimisation of the cross-sectional shape of passively cooled heat sinks. International Journal of Numerical Methods for Heat and Fluid Flow, 32 (3). pp. 1025-1045. ISSN 0961-5539 (doi:https://doi.org/10.1108/HFF-10-2020-0656)

neural nets

Malik, Asif, Rajaguru, Pushparajah ORCID: 0000-0002-6041-0517 and Azzawi, Rula (2022) Smart manufacturing with Artificial Intelligence and digital twin: a brief review. In: 8th International Conference on Information Technology Trends, 25th - 26th May 2022, Dubai, UAE.

Non-Destructive Testing

Blanche, Jamie, Flynn, David, Lewis, Helen, Couples, Gary, Buckman, Jim, Bailey, Chris ORCID: 0000-0002-9438-3879 and Tilford, Timothy ORCID: 0000-0001-8307-6403 (2018) Analysis of sandstone pore space fluid saturation and mineralogy variation via application of monostatic K-band frequency modulated continuous wave radar. IEEE Access, 6. pp. 44376-44389. ISSN 2169-3536 (Online) (doi:https://doi.org/10.1109/ACCESS.2018.2863024)

Numerical Analysis

Tilford, T. ORCID: 0000-0001-8307-6403 , Bruan, J., Janhsen, J. C., Burgard, M. and Bailey, C. ORCID: 0000-0002-9438-3879 (2018) SPH analysis of inkjet droplet impact dynamics. In: Proceedings of the 13th World Congress on Computational Mechanics (WCCM XIII) and 2nd Pan American Congress on Computational Mechanics (PANACM II). WCCM.

Tilford, Tim ORCID: 0000-0001-8307-6403 , Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Braun, Jessica, Janhsen, Jan Christoph, Patel, Mayur K. and Bailey, Chris ORCID: 0000-0002-9438-3879 (2021) Comparative reliability of inkjet-printed electronics packaging. IEEE Transactions on Components, Packaging and Manufacturing Technology, 11 (2). pp. 351-362. ISSN 2156-3950 (Print), 2156-3985 (Online) (doi:https://doi.org/10.1109/TCPMT.2021.3049952)

Numerical methods

Nwanoro, Kenneth C., Lu, Hua ORCID: 0000-0002-4392-6562 , Yin, Chunyan ORCID: 0000-0003-0298-0420 and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2018) An approximate numerical method for the prediction of plastic strain in layered structures. In: 2018 7th Electronic System-Integration Technology Conference (ESTC 2018). IEEE, pp. 181-187. ISBN 978-1538668153

Numerical models

Tilford, T. ORCID: 0000-0001-8307-6403 , Stoyanov, S. ORCID: 0000-0001-6091-1226 , Tourloukis, G. and Bailey, C. ORCID: 0000-0002-9438-3879 (2016) Numerical analysis of droplet deposition in inkjet printed electronics assembly. In: 2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE). IEEE, pp. 1-7. ISBN 978-1-5090-2106-2 (doi:https://doi.org/10.1109/EuroSimE.2016.7463358)

Numerical simulation

Nwanoro, Kenneth Chimezie, Lu, Hua ORCID: 0000-0002-4392-6562 , Yin, Chunyan ORCID: 0000-0003-0298-0420 and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2018) Numerical simulation of the junction temperature, the coolant flow rate and the reliability of an IGBT module. In: 2018 24th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC 2018). IEEE, pp. 250-255. ISBN 978-1538667606

Offshore renewable energy

Bailey, Christopher ORCID: 0000-0002-9438-3879 , Yin, Chunyan ORCID: 0000-0003-0298-0420 and Rajaguru, Pushparajah ORCID: 0000-0002-6041-0517 (2019) Predicting damage and life expectancy of subsea power cables in offshore renewable energy applications. IEEE ACCESS, 7. pp. 54658-54669. ISSN 2169-3536 (Online) (doi:https://doi.org/10.1109/ACCESS.2019.2911260)

open-ended oven

Desmulliez, Marc P.Y, Adamietz, Raphael, Pavuluri, Sumanth K., Tilford, Tim ORCID: 0000-0001-8307-6403 , Bailey, Chris ORCID: 0000-0002-9438-3879 , Schreier-Alt, Thomas and Warmuth, Jens (2018) Reliability testing and stress measurement of QFN packages encapsulated by an open-ended microwave curing system. IEEE Transactions on Components, Packaging and Manufacturing Technology, 9 (1). pp. 173-180. ISSN 2156-3950 (Print), 2156-3985 (Online) (doi:https://doi.org/10.1109/TCPMT.2018.2859031)

optimisation

Rajaguru, Pushparajah ORCID: 0000-0002-6041-0517 (2014) Reduced order modelling and numerical optimisation approach to reliability analysis of microsystems and power modules. PhD thesis, University of Greenwich.

Santhanakrishnan, Mani Sekaran, Tilford, Timothy ORCID: 0000-0001-8307-6403 and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2022) Heat transfer characteristics of plate fin heat sink with longitudinal vortex generators. International Journal of Numerical Methods for Heat and Fluid Flow, 33 (3). pp. 1203-1228. ISSN 0961-5539 (doi:https://doi.org/10.1108/HFF-06-2022-0386)

Santhanakrishnan, Mani Sekaran, Tilford, Timothy ORCID: 0000-0001-8307-6403 and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2018) Performance assessment of density and level-set topology optimisation methods for 3D heatsink design. Journal of Algorithms and Computational Technology, 12 (3). pp. 273-287. ISSN 1748-3018 (Print), 1748-3026 (Online) (doi:https://doi.org/10.1177/1748301818779019)

packaging

Aliyu, A. M., Mouawad, B., Castellazzi, A., Rajaguru, P. ORCID: 0000-0002-6041-0517 , Bailey, C. ORCID: 0000-0002-9438-3879 , Pathirana, V., Uduampola, N., Trajkovic, T. and Ubrea, F. (2017) Chip-on-board assembly of 800V Si LIGBTs for high performance ultra-compact LED drivers. In: Proceedings of the 2017 29th International Symposium on Power Semiconductor Devices and IC's (ISPSD). IEEE, pp. 431-434. ISBN 978-4-88686-094-1 ISSN 1946-0201 (Online) (doi:https://doi.org/10.23919/ISPSD.2017.7988976)

Particle Swarm Optimisation

Rajaguru, Pushparajah ORCID: 0000-0002-6041-0517 , Lu, Hua ORCID: 0000-0002-4392-6562 and Bailey, Chris ORCID: 0000-0002-9438-3879 (2015) Sintered silver finite element modelling and reliability based design optimisation in power electronic module. Microelectronics Reliability, 55 (6). pp. 919-930. ISSN 0026-2714 (doi:https://doi.org/10.1016/j.microrel.2015.03.011)

PCB

Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 and Bailey, Chris ORCID: 0000-0002-9438-3879 (2022) Deep learning modelling for composite properties of PCB conductive layers. In: 2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE). Institute of Electrical and Electronics Engineers (IEEE), Piscataway, New Jersey, pp. 1-7. ISBN 978-1665458375 (doi:https://doi.org/10.1109/EuroSimE54907.2022.9758885)

Permittivity

Blanche, Jamie, Flynn, David, Lewis, Helen, Couples, Gary, Buckman, Jim, Bailey, Chris ORCID: 0000-0002-9438-3879 and Tilford, Timothy ORCID: 0000-0001-8307-6403 (2018) Analysis of sandstone pore space fluid saturation and mineralogy variation via application of monostatic K-band frequency modulated continuous wave radar. IEEE Access, 6. pp. 44376-44389. ISSN 2169-3536 (Online) (doi:https://doi.org/10.1109/ACCESS.2018.2863024)

Physics of failure

Musallam, Mahera, Yin, Chunyan ORCID: 0000-0003-0298-0420 , Bailey, Christopher ORCID: 0000-0002-9438-3879 and Johnson, Mark (2014) Mission profile-based reliability design and real-time life consumption estimation in power electronics. IEEE Transactions on Power Electronics, 30 (5). pp. 2601-2613. ISSN 0885-8993 (Print), 1941-0107 (Online) (doi:https://doi.org/10.1109/TPEL.2014.2358555)

physics-of-failure

Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Stewart†, Paul and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2021) Reliability optimisation and lifetime modelling of micro-BGA assemblies in harsh environment applications. In: 2021 23rd European Microelectronics and Packaging Conference & Exhibition (EMPC). 13-16 Sept. 2021. Gothenburg, Sweden. IEEE Xplore . Institute of Electrical and Electronics Engineers (IEEE), Piscataway, New Jersey, pp. 1-8. ISBN 978-0956808677 ; 978-1665423687 (doi:https://doi.org/10.23919/EMPC53418.2021.9584970)

plastic strain

Nwanoro, Kenneth C., Lu, Hua ORCID: 0000-0002-4392-6562 , Yin, Chunyan ORCID: 0000-0003-0298-0420 and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2018) An approximate numerical method for the prediction of plastic strain in layered structures. In: 2018 7th Electronic System-Integration Technology Conference (ESTC 2018). IEEE, pp. 181-187. ISBN 978-1538668153

plate fin heat sink

Santhanakrishnan, Mani Sekaran, Tilford, Timothy ORCID: 0000-0001-8307-6403 and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2022) Heat transfer characteristics of plate fin heat sink with longitudinal vortex generators. International Journal of Numerical Methods for Heat and Fluid Flow, 33 (3). pp. 1203-1228. ISSN 0961-5539 (doi:https://doi.org/10.1108/HFF-06-2022-0386)

power cycling

Lu, Hua ORCID: 0000-0002-4392-6562 and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2017) Failure and reliability analysis of a SiC power module based on stress comparison to a Si device. IEEE Transactions on Device and Materials Reliability, 17 (4). pp. 727-737. ISSN 1530-4388 (doi:https://doi.org/10.1109/TDMR.2017.2766692)

Nwanoro, Kenneth, Lu, Hua ORCID: 0000-0002-4392-6562 , Yin, Chunyan ORCID: 0000-0003-0298-0420 and Bailey, Chris ORCID: 0000-0002-9438-3879 (2018) An analysis of the reliability and design optimization of aluminium ribbon bonds in power electronics modules using computer simulation method. Microelectronics Reliability, 87. pp. 1-14. ISSN 0026-2714 (doi:https://doi.org/10.1016/j.microrel.2018.05.013)

Power electronic module

Rajaguru, P. ORCID: 0000-0002-6041-0517 , Lu, H. ORCID: 0000-0002-4392-6562 , Bailey, C. ORCID: 0000-0002-9438-3879 , Ortiz-Gonzalez, J. and Alatise, O. (2016) Evaluation of the impact of the physical dimensions and material of the semiconductor chip on the reliability of Sn3.5Ag solder interconnect in power electronic module: A finite element analysis perspective. Microelectronics Reliability, 68. pp. 77-85. ISSN 0026-2714 (doi:https://doi.org/10.1016/j.microrel.2016.12.002)

Rajaguru, Pushparajah ORCID: 0000-0002-6041-0517 , Lu, Hua ORCID: 0000-0002-4392-6562 and Bailey, Chris ORCID: 0000-0002-9438-3879 (2015) Sintered silver finite element modelling and reliability based design optimisation in power electronic module. Microelectronics Reliability, 55 (6). pp. 919-930. ISSN 0026-2714 (doi:https://doi.org/10.1016/j.microrel.2015.03.011)

Rajaguru, Pushparajah ORCID: 0000-0002-6041-0517 , Lu, Hua ORCID: 0000-0002-4392-6562 and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2015) A time dependent damage indicator model for Sn3.5Ag solder layer in power electronic module. Microelectronics Reliability, 55 (11). pp. 2371-2381. ISSN 0026-2714 (doi:https://doi.org/10.1016/j.microrel.2015.07.047)

Power electronics

Musallam, Mahera, Yin, Chunyan ORCID: 0000-0003-0298-0420 , Bailey, Christopher ORCID: 0000-0002-9438-3879 and Johnson, Mark (2014) Mission profile-based reliability design and real-time life consumption estimation in power electronics. IEEE Transactions on Power Electronics, 30 (5). pp. 2601-2613. ISSN 0885-8993 (Print), 1941-0107 (Online) (doi:https://doi.org/10.1109/TPEL.2014.2358555)

Nwanoro, Kenneth, Lu, Hua ORCID: 0000-0002-4392-6562 , Yin, Chunyan ORCID: 0000-0003-0298-0420 and Bailey, Chris ORCID: 0000-0002-9438-3879 (2018) An analysis of the reliability and design optimization of aluminium ribbon bonds in power electronics modules using computer simulation method. Microelectronics Reliability, 87. pp. 1-14. ISSN 0026-2714 (doi:https://doi.org/10.1016/j.microrel.2018.05.013)

Nwanoro, Kenneth Chimezie, Lu, Hua ORCID: 0000-0002-4392-6562 , Yin, Chunyan ORCID: 0000-0003-0298-0420 and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2017) Computer simulation of the reliability of wire bonds and ribbon bonds in power electronics modules. In: 2017 23rd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC). IEEE, pp. 1-6. ISBN 978-1-5386-1929-2 ISSN 2474-1523 (Online) (doi:https://doi.org/10.1109/THERMINIC.2017.8233827)

Nwanoro, Kenneth Chimezie, Lu, Hua ORCID: 0000-0002-4392-6562 , Yin, Chunyan ORCID: 0000-0003-0298-0420 and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2018) Numerical simulation of the junction temperature, the coolant flow rate and the reliability of an IGBT module. In: 2018 24th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC 2018). IEEE, pp. 250-255. ISBN 978-1538667606

Shahjalal, Mohammad, Lu, Hua ORCID: 0000-0002-4392-6562 and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2017) Electro-thermal modelling of multi chip power modules for high power converter application. In: 2017 18th International Conference on Electronic Packaging Technology (ICEPT), Harbin. IEEE, pp. 940-945. ISBN 978-1-5386-2973-4 (doi:https://doi.org/10.1109/ICEPT.2017.8046599)

Power module

Rajaguru, Pushparajah ORCID: 0000-0002-6041-0517 , Lu, Hua ORCID: 0000-0002-4392-6562 and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2014) Application of nonlinear fatigue damage models in power electronic module wirebond structure under various amplitude loadings. Advances in Manufacturing, 2 (3). pp. 239-250. ISSN 2095-3127 (Print), 2195-3597 (Online) (doi:https://doi.org/10.1007/s40436-014-0054-5)

Shahjalal, Mohammad, Lu, Hua ORCID: 0000-0002-4392-6562 and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2017) Electro-thermal modelling of multi chip power modules for high power converter application. In: 2017 18th International Conference on Electronic Packaging Technology (ICEPT), Harbin. IEEE, pp. 940-945. ISBN 978-1-5386-2973-4 (doi:https://doi.org/10.1109/ICEPT.2017.8046599)

power modules

Rajaguru, Pushparajah ORCID: 0000-0002-6041-0517 (2014) Reduced order modelling and numerical optimisation approach to reliability analysis of microsystems and power modules. PhD thesis, University of Greenwich.

Power semiconductor packages

Ahsan, Mominul, Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2018) Data driven prognostics for failure of power semiconductor packages. In: Proceedings of 41st Spring Seminar on Electronics Technology (ISSE). IEEE Xplore, pp. 1-6. ISBN 978-1-5386-5730-0 ISSN 2161-2536 (Online) (doi:https://doi.org/10.1109/ISSE.2018.8443612)

Press-Pack

Ortiz Gonzalez, Jose, Alatise, Olayiwola, Aliyu, Attahir, Rajaguru, Pushparajah ORCID: 0000-0002-6041-0517 , Castellazzi, Alberto, Ran, Li, Mawby, Philip and Bailey, Chris ORCID: 0000-0002-9438-3879 (2017) Evaluation of SiC Schottky diodes using pressure contacts. IEEE Transactions on Industrial Electronics, 64 (10). 8213 -8223. ISSN 0278-0046 (Print), 1557-9948 (Online) (doi:https://doi.org/10.1109/TIE.2017.2677348)

Press-Pack assembly

Rajaguru, Pushparajah ORCID: 0000-0002-6041-0517 , Ortiz-Gonzalez, Jose Angel, Lu, Hua ORCID: 0000-0002-4392-6562 , Bailey, Chris ORCID: 0000-0002-9438-3879 and Alatise, Olawiwola (2017) A multiphysics modeling and experimental analysis of pressure contacts in power electronics applications. IEEE Transactions on Components, Packaging and Manufacturing Technology, 7 (6). pp. 893-900. ISSN 2156-3950 (Print), 2156-3985 (Online) (doi:https://doi.org/10.1109/TCPMT.2017.2688021)

printed circuit board

Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 and Bailey, Chris ORCID: 0000-0002-9438-3879 (2022) Deep learning modelling for composite properties of PCB conductive layers. In: 2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE). Institute of Electrical and Electronics Engineers (IEEE), Piscataway, New Jersey, pp. 1-7. ISBN 978-1665458375 (doi:https://doi.org/10.1109/EuroSimE54907.2022.9758885)

Printed Circuit Board Fabrication

Jones, Thomas D.A., Flynn, David, Desmulliez, Marc P.Y., Price, Dennis, Beadel, Matthew, Strusevich, Nadia, Patel, Mayur, Bailey, Chris ORCID: 0000-0002-9438-3879 and Costello, Suzanne (2016) Morphology and acoustic artefacts of copper deposits electroplated using megasonic assisted agitation. Circuit World, 42 (3). pp. 127-140. ISSN 0305-6120 (doi:https://doi.org/10.1108/CW-03-2016-0006)

Product developers

Bailey, C. ORCID: 0000-0002-9438-3879 , Stoyanov, S. ORCID: 0000-0001-6091-1226 , Tilford, T. and Tourloukis, G. (2016) Modelling methodologies for quality assessment of 3D inkjet printed electronic products. In: 3rd Fraunhofer Direct Digital Manufacturing Conference, DDMC 2016. Proceedings. Fraunhofer Verlag, Stuttgart. ISBN 978-3-8396-9128-1 ISSN 978-3-8396-1001-5 (Online)

Production technicians

Bailey, C. ORCID: 0000-0002-9438-3879 , Stoyanov, S. ORCID: 0000-0001-6091-1226 , Tilford, T. and Tourloukis, G. (2016) Modelling methodologies for quality assessment of 3D inkjet printed electronic products. In: 3rd Fraunhofer Direct Digital Manufacturing Conference, DDMC 2016. Proceedings. Fraunhofer Verlag, Stuttgart. ISBN 978-3-8396-9128-1 ISSN 978-3-8396-1001-5 (Online)

Production technology

Bailey, C. ORCID: 0000-0002-9438-3879 , Stoyanov, S. ORCID: 0000-0001-6091-1226 , Tilford, T. and Tourloukis, G. (2016) Modelling methodologies for quality assessment of 3D inkjet printed electronic products. In: 3rd Fraunhofer Direct Digital Manufacturing Conference, DDMC 2016. Proceedings. Fraunhofer Verlag, Stuttgart. ISBN 978-3-8396-9128-1 ISSN 978-3-8396-1001-5 (Online)

production test set compaction

Hinojosa Herrera, Ana Elsa ORCID: 0000-0002-0636-1881 and Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 (2019) Data driven predictive model to compact a production stop-on-fail test set for an electronic device. In: Proceedings of the 2018 International Conference on Computing, Electronics & Communications Engineering (iCCECE). IEEE Xplore, pp. 59-64. ISBN 9781538649046 (doi:https://doi.org/10.1109/iCCECOME.2018.8658941)

prognostics

Bailey, Christopher ORCID: 0000-0002-9438-3879 , Yin, Chunyan ORCID: 0000-0003-0298-0420 and Rajaguru, Pushparajah ORCID: 0000-0002-6041-0517 (2019) Predicting damage and life expectancy of subsea power cables in offshore renewable energy applications. IEEE ACCESS, 7. pp. 54658-54669. ISSN 2169-3536 (Online) (doi:https://doi.org/10.1109/ACCESS.2019.2911260)

Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Ahsan, Mominuil and Bailey, Chris ORCID: 0000-0002-9438-3879 (2018) Data analytics approach for optimal qualification testing of electronic components. In: Proceedings EuroSimE 2018. 2018 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) . IEEE Xplore, pp. 1-9. ISBN 978-1-5386-2358-9 (doi:https://doi.org/10.1109/EuroSimE.2018.8369926)

Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2017) Machine learning for additive manufacturing of electronics. In: Proceedings 2017 40th International Spring Seminar on Electronics Technology (ISSE). IEEE. ISBN 978-1-5386-0583-7 ISSN 2161-2536 (Online) (doi:https://doi.org/10.1109/ISSE.2017.8000936)

prognostics modelling

Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Ahsan, Mominul, Bailey, Chris ORCID: 0000-0002-9438-3879 , Wotherspoon, Tracy and Hunt, Craig (2019) Predictive analytics methodology for smart qualification testing of electronic components. Journal of Intelligent Manufacturing, 30 (3). pp. 1497-1514. ISSN 0956-5515 (Print), 1572-8145 (Online) (doi:https://doi.org/10.1007/s10845-018-01462-9)

qualification testing

Ahsan, M., Stoyanov, S. ORCID: 0000-0001-6091-1226 , Bailey, C. ORCID: 0000-0002-9438-3879 and Albarbar, A. (2020) Developing computational intelligence for smart qualification testing of electronic products. IEEE Access, 8. pp. 16922-16933. ISSN 2169-3536 (Online) (doi:https://doi.org/10.1109/ACCESS.2020.2967858)

quality

Ahsan, M., Stoyanov, S. ORCID: 0000-0001-6091-1226 , Bailey, C. ORCID: 0000-0002-9438-3879 and Albarbar, A. (2020) Developing computational intelligence for smart qualification testing of electronic products. IEEE Access, 8. pp. 16922-16933. ISSN 2169-3536 (Online) (doi:https://doi.org/10.1109/ACCESS.2020.2967858)

Quality Assurance

Hinojosa Herrera, Ana ORCID: 0000-0002-0636-1881 , Walshaw, Chris ORCID: 0000-0003-0253-7779 and Bailey, Chris ORCID: 0000-0002-9438-3879 (2020) Failure mode & effect analysis and another methodology for improving data veracity and validity. Annals of Emerging Technologies in Computing (AETiC), 4 (3). pp. 9-16. ISSN 2516-0281 (doi:https://doi.org/10.33166/AETiC.2020.03.002)

Radar Applications

Blanche, Jamie, Flynn, David, Lewis, Helen, Couples, Gary, Buckman, Jim, Bailey, Chris ORCID: 0000-0002-9438-3879 and Tilford, Timothy ORCID: 0000-0001-8307-6403 (2018) Analysis of sandstone pore space fluid saturation and mineralogy variation via application of monostatic K-band frequency modulated continuous wave radar. IEEE Access, 6. pp. 44376-44389. ISSN 2169-3536 (Online) (doi:https://doi.org/10.1109/ACCESS.2018.2863024)

Radar Measurements

Blanche, Jamie, Flynn, David, Lewis, Helen, Couples, Gary, Buckman, Jim, Bailey, Chris ORCID: 0000-0002-9438-3879 and Tilford, Timothy ORCID: 0000-0001-8307-6403 (2018) Analysis of sandstone pore space fluid saturation and mineralogy variation via application of monostatic K-band frequency modulated continuous wave radar. IEEE Access, 6. pp. 44376-44389. ISSN 2169-3536 (Online) (doi:https://doi.org/10.1109/ACCESS.2018.2863024)

radial basis

Rajaguru, Pushparajah ORCID: 0000-0002-6041-0517 , Lu, Hua ORCID: 0000-0002-4392-6562 and Bailey, Chris ORCID: 0000-0002-9438-3879 (2015) Sintered silver finite element modelling and reliability based design optimisation in power electronic module. Microelectronics Reliability, 55 (6). pp. 919-930. ISSN 0026-2714 (doi:https://doi.org/10.1016/j.microrel.2015.03.011)

Rajaguru, Pushparajah ORCID: 0000-0002-6041-0517 , Lu, Hua ORCID: 0000-0002-4392-6562 and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2014) Application of nonlinear fatigue damage models in power electronic module wirebond structure under various amplitude loadings. Advances in Manufacturing, 2 (3). pp. 239-250. ISSN 2095-3127 (Print), 2195-3597 (Online) (doi:https://doi.org/10.1007/s40436-014-0054-5)

random forest

Hinojosa Herrera, Ana Elsa ORCID: 0000-0002-0636-1881 , Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Bailey, Christopher ORCID: 0000-0002-9438-3879 , Walshaw, Christopher ORCID: 0000-0003-0253-7779 and Yin, Chunyan ORCID: 0000-0003-0298-0420 (2019) Data analytics to reduce stop-on-fail test in electronics manufacturing. Open Computer Sciences, 9 (1). pp. 200-211. ISSN 2299-1093 (Online) (doi:https://doi.org/10.1515/comp-2019-0014)

real time

Musallam, Mahera, Yin, Chunyan ORCID: 0000-0003-0298-0420 , Bailey, Christopher ORCID: 0000-0002-9438-3879 and Johnson, Mark (2014) Mission profile-based reliability design and real-time life consumption estimation in power electronics. IEEE Transactions on Power Electronics, 30 (5). pp. 2601-2613. ISSN 0885-8993 (Print), 1941-0107 (Online) (doi:https://doi.org/10.1109/TPEL.2014.2358555)

redistribution layer

Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 and Bailey, Chris ORCID: 0000-0002-9438-3879 (2022) Deep learning modelling for composite properties of PCB conductive layers. In: 2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE). Institute of Electrical and Electronics Engineers (IEEE), Piscataway, New Jersey, pp. 1-7. ISBN 978-1665458375 (doi:https://doi.org/10.1109/EuroSimE54907.2022.9758885)

reduced order models

Rajaguru, Pushparajah ORCID: 0000-0002-6041-0517 , Lu, Hua ORCID: 0000-0002-4392-6562 and Bailey, Chris ORCID: 0000-0002-9438-3879 (2015) Sintered silver finite element modelling and reliability based design optimisation in power electronic module. Microelectronics Reliability, 55 (6). pp. 919-930. ISSN 0026-2714 (doi:https://doi.org/10.1016/j.microrel.2015.03.011)

Rajaguru, Pushparajah ORCID: 0000-0002-6041-0517 , Lu, Hua ORCID: 0000-0002-4392-6562 and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2014) Application of nonlinear fatigue damage models in power electronic module wirebond structure under various amplitude loadings. Advances in Manufacturing, 2 (3). pp. 239-250. ISSN 2095-3127 (Print), 2195-3597 (Online) (doi:https://doi.org/10.1007/s40436-014-0054-5)

refinishing

Stoyanov, S. ORCID: 0000-0001-6091-1226 and Bailey, C. ORCID: 0000-0002-9438-3879 (2015) Modelling the impact of refinishing processes on COTS components for use in aerospace applications. Microelectronics Reliability, 55 (9-10). pp. 1271-1279. ISSN 0026-2714 (doi:https://doi.org/10.1016/j.microrel.2015.07.030)

Yin, Chunyan ORCID: 0000-0003-0298-0420 , Best, Chris, Bailey, Chris ORCID: 0000-0002-9438-3879 and Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 (2015) Statistical analysis of the impact of refinishing process on leaded components. Microelectronics Reliability, 55 (2). pp. 424-431. ISSN 0026-2714 (doi:https://doi.org/10.1016/j.microrel.2014.11.001)

reflow self-alignment modeling

Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 and Bailey, Chris (2023) Modeling Insights into the assembly challenges of focal plane arrays. IEEE Access. pp. 35207-35219. ISSN 2169-3536 (Online) (doi:https://doi.org/10.1109/ACCESS.2023.3264806)

reliability

Aliyu, A. M., Mouawad, B., Castellazzi, A., Rajaguru, P. ORCID: 0000-0002-6041-0517 , Bailey, C. ORCID: 0000-0002-9438-3879 , Pathirana, V., Uduampola, N., Trajkovic, T. and Ubrea, F. (2017) Chip-on-board assembly of 800V Si LIGBTs for high performance ultra-compact LED drivers. In: Proceedings of the 2017 29th International Symposium on Power Semiconductor Devices and IC's (ISPSD). IEEE, pp. 431-434. ISBN 978-4-88686-094-1 ISSN 1946-0201 (Online) (doi:https://doi.org/10.23919/ISPSD.2017.7988976)

Nwanoro, Kenneth, Lu, Hua ORCID: 0000-0002-4392-6562 , Yin, Chunyan ORCID: 0000-0003-0298-0420 and Bailey, Chris ORCID: 0000-0002-9438-3879 (2018) An analysis of the reliability and design optimization of aluminium ribbon bonds in power electronics modules using computer simulation method. Microelectronics Reliability, 87. pp. 1-14. ISSN 0026-2714 (doi:https://doi.org/10.1016/j.microrel.2018.05.013)

Nwanoro, Kenneth Chimezie, Lu, Hua ORCID: 0000-0002-4392-6562 , Yin, Chunyan ORCID: 0000-0003-0298-0420 and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2017) Computer simulation of the reliability of wire bonds and ribbon bonds in power electronics modules. In: 2017 23rd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC). IEEE, pp. 1-6. ISBN 978-1-5386-1929-2 ISSN 2474-1523 (Online) (doi:https://doi.org/10.1109/THERMINIC.2017.8233827)

Nwanoro, Kenneth Chimezie, Lu, Hua ORCID: 0000-0002-4392-6562 , Yin, Chunyan ORCID: 0000-0003-0298-0420 and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2018) Numerical simulation of the junction temperature, the coolant flow rate and the reliability of an IGBT module. In: 2018 24th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC 2018). IEEE, pp. 250-255. ISBN 978-1538667606

Ortiz Gonzalez, Jose, Alatise, Olayiwola, Aliyu, Attahir, Rajaguru, Pushparajah ORCID: 0000-0002-6041-0517 , Castellazzi, Alberto, Ran, Li, Mawby, Philip and Bailey, Chris ORCID: 0000-0002-9438-3879 (2017) Evaluation of SiC Schottky diodes using pressure contacts. IEEE Transactions on Industrial Electronics, 64 (10). 8213 -8223. ISSN 0278-0046 (Print), 1557-9948 (Online) (doi:https://doi.org/10.1109/TIE.2017.2677348)

Stoyanov, S. ORCID: 0000-0001-6091-1226 and Bailey, C. ORCID: 0000-0002-9438-3879 (2015) Modelling the impact of refinishing processes on COTS components for use in aerospace applications. Microelectronics Reliability, 55 (9-10). pp. 1271-1279. ISSN 0026-2714 (doi:https://doi.org/10.1016/j.microrel.2015.07.030)

Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Bailey, Chris ORCID: 0000-0002-9438-3879 and Tourloukis, Georgios (2016) Similarity approach for reducing qualification tests of electronic components. Microelectronics Reliability, 67. pp. 111-119. ISSN 0026-2714 (doi:https://doi.org/10.1016/j.microrel.2016.10.017)

Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Bailey, Christopher ORCID: 0000-0002-9438-3879 , Stewart, Paul, Parker, Mike and Roulston, John F. (2020) Experimental and modelling study on delamination risks for refinished electronic packages under hot solder dip loads. IEEE Transactions on Components, Packaging and Manufacturing Technology, 10 (3). pp. 502-515. ISSN 2156-3950 (Print), 2156-3985 (Online) (doi:https://doi.org/10.1109/TCPMT.2020.2972635)

Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Bailey, Christopher ORCID: 0000-0002-9438-3879 , Waite, Rhys, Hicks, Christopher and Golding, Terry (2020) Packaging challenges and reliability performance of compound semiconductor focal plane arrays. In: 2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC). IEEE, pp. 1-8. ISBN 978-0956808660 (doi:https://doi.org/10.23919/EMPC44848.2019.8951842)

Tilford, Tim ORCID: 0000-0001-8307-6403 , Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Braun, Jessica, Janhsen, Jan Christoph, Patel, Mayur K. and Bailey, Chris ORCID: 0000-0002-9438-3879 (2021) Comparative reliability of inkjet-printed electronics packaging. IEEE Transactions on Components, Packaging and Manufacturing Technology, 11 (2). pp. 351-362. ISSN 2156-3950 (Print), 2156-3985 (Online) (doi:https://doi.org/10.1109/TCPMT.2021.3049952)

Tilford, Tim ORCID: 0000-0001-8307-6403 , Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Braun, Jessica, Janhsen, Jan Cristophe, Burgard, Matthias, Birch, Richard and Bailey, Chris ORCID: 0000-0002-9438-3879 (2018) Design, manufacture and test for reliable 3D printed electronics packaging. Microelectronics Reliability, 85. pp. 109-117. ISSN 0026-2714 (doi:https://doi.org/10.1016/j.microrel.2018.04.008)

Reliability test

Ahsan, Mominul, Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2018) Data driven prognostics for failure of power semiconductor packages. In: Proceedings of 41st Spring Seminar on Electronics Technology (ISSE). IEEE Xplore, pp. 1-6. ISBN 978-1-5386-5730-0 ISSN 2161-2536 (Online) (doi:https://doi.org/10.1109/ISSE.2018.8443612)

reliability testing

Desmulliez, Marc P.Y, Adamietz, Raphael, Pavuluri, Sumanth K., Tilford, Tim ORCID: 0000-0001-8307-6403 , Bailey, Chris ORCID: 0000-0002-9438-3879 , Schreier-Alt, Thomas and Warmuth, Jens (2018) Reliability testing and stress measurement of QFN packages encapsulated by an open-ended microwave curing system. IEEE Transactions on Components, Packaging and Manufacturing Technology, 9 (1). pp. 173-180. ISSN 2156-3950 (Print), 2156-3985 (Online) (doi:https://doi.org/10.1109/TCPMT.2018.2859031)

residual stress

Desmulliez, Marc P.Y, Adamietz, Raphael, Pavuluri, Sumanth K., Tilford, Tim ORCID: 0000-0001-8307-6403 , Bailey, Chris ORCID: 0000-0002-9438-3879 , Schreier-Alt, Thomas and Warmuth, Jens (2018) Reliability testing and stress measurement of QFN packages encapsulated by an open-ended microwave curing system. IEEE Transactions on Components, Packaging and Manufacturing Technology, 9 (1). pp. 173-180. ISSN 2156-3950 (Print), 2156-3985 (Online) (doi:https://doi.org/10.1109/TCPMT.2018.2859031)

response surface model

Santhanakrishnan, Mani Sekaran, Tilford, Timothy ORCID: 0000-0001-8307-6403 and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2022) Heat transfer characteristics of plate fin heat sink with longitudinal vortex generators. International Journal of Numerical Methods for Heat and Fluid Flow, 33 (3). pp. 1203-1228. ISSN 0961-5539 (doi:https://doi.org/10.1108/HFF-06-2022-0386)

risk analysis

Rajaguru, Pushparajah ORCID: 0000-0002-6041-0517 , Lu, Hua ORCID: 0000-0002-4392-6562 and Bailey, Chris ORCID: 0000-0002-9438-3879 (2015) Sintered silver finite element modelling and reliability based design optimisation in power electronic module. Microelectronics Reliability, 55 (6). pp. 919-930. ISSN 0026-2714 (doi:https://doi.org/10.1016/j.microrel.2015.03.011)

robotics

Malik, Asif, Rajaguru, Pushparajah ORCID: 0000-0002-6041-0517 and Azzawi, Rula (2022) Smart manufacturing with Artificial Intelligence and digital twin: a brief review. In: 8th International Conference on Information Technology Trends, 25th - 26th May 2022, Dubai, UAE.

ROMARA software

Rajaguru, Pushparajah ORCID: 0000-0002-6041-0517 (2014) Reduced order modelling and numerical optimisation approach to reliability analysis of microsystems and power modules. PhD thesis, University of Greenwich.

SAC305

Xu, Yilun, Xian, Jingwei, Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Bailey, Christopher ORCID: 0000-0002-9438-3879 , Coyle, Richard, Gourlay, Christopher and Dunne, Fionn (2022) A multi-scale approach to microstructure-sensitive thermal fatigue in solder joints. International Journal of Plasticity, 155:103308. ISSN 0749-6419 (doi:https://doi.org/10.1016/j.ijplas.2022.103308)

scanning acoustic microscopy

Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Bailey, Christopher ORCID: 0000-0002-9438-3879 , Stewart, Paul, Parker, Mike and Roulston, John F. (2020) Experimental and modelling study on delamination risks for refinished electronic packages under hot solder dip loads. IEEE Transactions on Components, Packaging and Manufacturing Technology, 10 (3). pp. 502-515. ISSN 2156-3950 (Print), 2156-3985 (Online) (doi:https://doi.org/10.1109/TCPMT.2020.2972635)

scour

Bailey, Christopher ORCID: 0000-0002-9438-3879 , Yin, Chunyan ORCID: 0000-0003-0298-0420 and Rajaguru, Pushparajah ORCID: 0000-0002-6041-0517 (2019) Predicting damage and life expectancy of subsea power cables in offshore renewable energy applications. IEEE ACCESS, 7. pp. 54658-54669. ISSN 2169-3536 (Online) (doi:https://doi.org/10.1109/ACCESS.2019.2911260)

Sensitivity analysis

Rajaguru, P. ORCID: 0000-0002-6041-0517 , Lu, H. ORCID: 0000-0002-4392-6562 , Bailey, C. ORCID: 0000-0002-9438-3879 , Ortiz-Gonzalez, J. and Alatise, O. (2016) Evaluation of the impact of the physical dimensions and material of the semiconductor chip on the reliability of Sn3.5Ag solder interconnect in power electronic module: A finite element analysis perspective. Microelectronics Reliability, 68. pp. 77-85. ISSN 0026-2714 (doi:https://doi.org/10.1016/j.microrel.2016.12.002)

shape optimisation

Santhanakrishnan, Mani Sekara, Tilford, Tim ORCID: 0000-0001-8307-6403 and Bailey, Chris ORCID: 0000-0002-9438-3879 (2021) Multi-objective NSGA-II based shape optimisation of the cross-sectional shape of passively cooled heat sinks. International Journal of Numerical Methods for Heat and Fluid Flow, 32 (3). pp. 1025-1045. ISSN 0961-5539 (doi:https://doi.org/10.1108/HFF-10-2020-0656)

silicon carbide

Lu, Hua ORCID: 0000-0002-4392-6562 and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2017) Failure and reliability analysis of a SiC power module based on stress comparison to a Si device. IEEE Transactions on Device and Materials Reliability, 17 (4). pp. 727-737. ISSN 1530-4388 (doi:https://doi.org/10.1109/TDMR.2017.2766692)

Ortiz Gonzalez, Jose, Alatise, Olayiwola, Aliyu, Attahir, Rajaguru, Pushparajah ORCID: 0000-0002-6041-0517 , Castellazzi, Alberto, Ran, Li, Mawby, Philip and Bailey, Chris ORCID: 0000-0002-9438-3879 (2017) Evaluation of SiC Schottky diodes using pressure contacts. IEEE Transactions on Industrial Electronics, 64 (10). 8213 -8223. ISSN 0278-0046 (Print), 1557-9948 (Online) (doi:https://doi.org/10.1109/TIE.2017.2677348)

smart manufacturing

Malik, Asif, Rajaguru, Pushparajah ORCID: 0000-0002-6041-0517 and Azzawi, Rula (2022) Smart manufacturing with Artificial Intelligence and digital twin: a brief review. In: 8th International Conference on Information Technology Trends, 25th - 26th May 2022, Dubai, UAE.

smart qualification testing

Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Ahsan, Mominul, Bailey, Chris ORCID: 0000-0002-9438-3879 , Wotherspoon, Tracy and Hunt, Craig (2019) Predictive analytics methodology for smart qualification testing of electronic components. Journal of Intelligent Manufacturing, 30 (3). pp. 1497-1514. ISSN 0956-5515 (Print), 1572-8145 (Online) (doi:https://doi.org/10.1007/s10845-018-01462-9)

smart test

Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Ahsan, Mominuil and Bailey, Chris ORCID: 0000-0002-9438-3879 (2018) Data analytics approach for optimal qualification testing of electronic components. In: Proceedings EuroSimE 2018. 2018 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) . IEEE Xplore, pp. 1-9. ISBN 978-1-5386-2358-9 (doi:https://doi.org/10.1109/EuroSimE.2018.8369926)

SnPbAgCu quaternary solder alloy

Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Stewart†, Paul and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2021) Reliability optimisation and lifetime modelling of micro-BGA assemblies in harsh environment applications. In: 2021 23rd European Microelectronics and Packaging Conference & Exhibition (EMPC). 13-16 Sept. 2021. Gothenburg, Sweden. IEEE Xplore . Institute of Electrical and Electronics Engineers (IEEE), Piscataway, New Jersey, pp. 1-8. ISBN 978-0956808677 ; 978-1665423687 (doi:https://doi.org/10.23919/EMPC53418.2021.9584970)

Solder joint

Rajaguru, Pushparajah ORCID: 0000-0002-6041-0517 , Lu, Hua ORCID: 0000-0002-4392-6562 and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2015) A time dependent damage indicator model for Sn3.5Ag solder layer in power electronic module. Microelectronics Reliability, 55 (11). pp. 2371-2381. ISSN 0026-2714 (doi:https://doi.org/10.1016/j.microrel.2015.07.047)

solder joint reliability

Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Stewart†, Paul and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2021) Reliability optimisation and lifetime modelling of micro-BGA assemblies in harsh environment applications. In: 2021 23rd European Microelectronics and Packaging Conference & Exhibition (EMPC). 13-16 Sept. 2021. Gothenburg, Sweden. IEEE Xplore . Institute of Electrical and Electronics Engineers (IEEE), Piscataway, New Jersey, pp. 1-8. ISBN 978-0956808677 ; 978-1665423687 (doi:https://doi.org/10.23919/EMPC53418.2021.9584970)

solder joints

Xu, Yilun, Xian, Jingwei, Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Bailey, Christopher ORCID: 0000-0002-9438-3879 , Coyle, Richard, Gourlay, Christopher and Dunne, Fionn (2022) A multi-scale approach to microstructure-sensitive thermal fatigue in solder joints. International Journal of Plasticity, 155:103308. ISSN 0749-6419 (doi:https://doi.org/10.1016/j.ijplas.2022.103308)

Solder material

Zhu, X., Kotadia, H., Xu, S., Lu, H. ORCID: 0000-0002-4392-6562 , Mannan, S. H., Bailey, C. ORCID: 0000-0002-9438-3879 and Chan, Y. C. (2014) Electromigration in Sn-Ag solder thin films under high current density. Thin Solid Films, 565. pp. 193-201. ISSN 0040-6090 (doi:https://doi.org/10.1016/j.tsf.2014.06.030)

Solid modeling

Yin, Chunyan ORCID: 0000-0003-0298-0420 , Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Bailey, Christopher ORCID: 0000-0002-9438-3879 and Stewart, Paul (2017) Modelling the impact of conformal coating penetration on QFN reliability. In: 2017 18th International Conference on Electronic Packaging Technology (ICEPT). IEEE, pp. 1021-1026. ISBN 978-1-5386-2973-4 (doi:https://doi.org/10.1109/ICEPT.2017.8046616)

statistical hypothesis testing

Yin, Chunyan ORCID: 0000-0003-0298-0420 , Best, Chris, Bailey, Chris ORCID: 0000-0002-9438-3879 and Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 (2015) Statistical analysis of the impact of refinishing process on leaded components. Microelectronics Reliability, 55 (2). pp. 424-431. ISSN 0026-2714 (doi:https://doi.org/10.1016/j.microrel.2014.11.001)

Statistics

Hinojosa Herrera, Ana ORCID: 0000-0002-0636-1881 , Walshaw, Chris ORCID: 0000-0003-0253-7779 and Bailey, Chris ORCID: 0000-0002-9438-3879 (2020) Failure mode & effect analysis and another methodology for improving data veracity and validity. Annals of Emerging Technologies in Computing (AETiC), 4 (3). pp. 9-16. ISSN 2516-0281 (doi:https://doi.org/10.33166/AETiC.2020.03.002)

Stepwise

Hinojosa Herrera, Ana Elsa ORCID: 0000-0002-0636-1881 , Walshaw, Chris ORCID: 0000-0003-0253-7779 and Bailey, Chris ORCID: 0000-0002-9438-3879 (2020) Improving Black Box Classification Model Veracity for Electronics Anomaly Detection. In: 2020 15th IEEE Conference on Industrial Electronics and Applications (ICIEA). IEEE, pp. 1092-1097. ISBN 978-1728151694 ISSN 2156-2318 (Print), 2158-2297 (Online) (doi:https://doi.org/10.1109/ICIEA48937.2020.9248258)

stop-on-fail test

Hinojosa Herrera, Ana Elsa ORCID: 0000-0002-0636-1881 and Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 (2019) Data driven predictive model to compact a production stop-on-fail test set for an electronic device. In: Proceedings of the 2018 International Conference on Computing, Electronics & Communications Engineering (iCCECE). IEEE Xplore, pp. 59-64. ISBN 9781538649046 (doi:https://doi.org/10.1109/iCCECOME.2018.8658941)

Stress comparison

Lu, Hua ORCID: 0000-0002-4392-6562 and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2017) Failure and reliability analysis of a SiC power module based on stress comparison to a Si device. IEEE Transactions on Device and Materials Reliability, 17 (4). pp. 727-737. ISSN 1530-4388 (doi:https://doi.org/10.1109/TDMR.2017.2766692)

subsea cable scoring

Flynn, David, Bailey, Christopher ORCID: 0000-0002-9438-3879 , Rajaguru, Pushpa ORCID: 0000-0002-6041-0517 , Wenshuo, Tang and Yin, Chunyan ORCID: 0000-0003-0298-0420 (2019) Prognostics and health management of subsea cables. In: Goodman, Douglas, Hofmeister, James P. and Szidarovszky, Ferenc, (eds.) Prognostics and Health Management: A Practical Approach to Improving System Reliability Using Condition-Based Data. Quality and Reliability Engineering Series . Wiley-Blackwell. ISBN 978-1119356653

Subsea cables

Bailey, Christopher ORCID: 0000-0002-9438-3879 , Yin, Chunyan ORCID: 0000-0003-0298-0420 and Rajaguru, Pushparajah ORCID: 0000-0002-6041-0517 (2019) Predicting damage and life expectancy of subsea power cables in offshore renewable energy applications. IEEE ACCESS, 7. pp. 54658-54669. ISSN 2169-3536 (Online) (doi:https://doi.org/10.1109/ACCESS.2019.2911260)

Surface tension

Tilford, T. ORCID: 0000-0001-8307-6403 , Stoyanov, S. ORCID: 0000-0001-6091-1226 , Tourloukis, G. and Bailey, C. ORCID: 0000-0002-9438-3879 (2016) Numerical analysis of droplet deposition in inkjet printed electronics assembly. In: 2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE). IEEE, pp. 1-7. ISBN 978-1-5090-2106-2 (doi:https://doi.org/10.1109/EuroSimE.2016.7463358)

Surrogate models

Rajaguru, P. ORCID: 0000-0002-6041-0517 , Lu, H. ORCID: 0000-0002-4392-6562 , Bailey, C. ORCID: 0000-0002-9438-3879 , Ortiz-Gonzalez, J. and Alatise, O. (2016) Evaluation of the impact of the physical dimensions and material of the semiconductor chip on the reliability of Sn3.5Ag solder interconnect in power electronic module: A finite element analysis perspective. Microelectronics Reliability, 68. pp. 77-85. ISSN 0026-2714 (doi:https://doi.org/10.1016/j.microrel.2016.12.002)

sustainability

Malik, Asif, Rajaguru, Pushparajah ORCID: 0000-0002-6041-0517 and Azzawi, Rula (2022) Smart manufacturing with Artificial Intelligence and digital twin: a brief review. In: 8th International Conference on Information Technology Trends, 25th - 26th May 2022, Dubai, UAE.

temperature distribution

Tilford, Timothy ORCID: 0000-0001-8307-6403 , Cook, A., Lu, H. ORCID: 0000-0002-4392-6562 , Ramambasoa, A. and Conseil, F. (2014) Numerical analysis of the performance of highly oriented pyrolytic graphite heat spreader in thermal management of microelectronics assemblies. In: Electronics Systemintegration Technology Conference, 16-18 Sep 2014, Helsinki, Finland. (doi:https://doi.org/10.1109/ESTC.2014.6962815)

Test Limits Optimisation

Hinojosa Herrera, Ana ORCID: 0000-0002-0636-1881 , Walshaw, Chris ORCID: 0000-0003-0253-7779 and Bailey, Chris ORCID: 0000-0002-9438-3879 (2020) Failure mode & effect analysis and another methodology for improving data veracity and validity. Annals of Emerging Technologies in Computing (AETiC), 4 (3). pp. 9-16. ISSN 2516-0281 (doi:https://doi.org/10.33166/AETiC.2020.03.002)

thermal conductivity

Tilford, Timothy ORCID: 0000-0001-8307-6403 , Cook, A., Lu, H. ORCID: 0000-0002-4392-6562 , Ramambasoa, A. and Conseil, F. (2014) Numerical analysis of the performance of highly oriented pyrolytic graphite heat spreader in thermal management of microelectronics assemblies. In: Electronics Systemintegration Technology Conference, 16-18 Sep 2014, Helsinki, Finland. (doi:https://doi.org/10.1109/ESTC.2014.6962815)

Thermal cycling

Nwanoro, Kenneth, Lu, Hua ORCID: 0000-0002-4392-6562 , Yin, Chunyan ORCID: 0000-0003-0298-0420 and Bailey, Chris ORCID: 0000-0002-9438-3879 (2018) An analysis of the reliability and design optimization of aluminium ribbon bonds in power electronics modules using computer simulation method. Microelectronics Reliability, 87. pp. 1-14. ISSN 0026-2714 (doi:https://doi.org/10.1016/j.microrel.2018.05.013)

thermal diffusivity

Rajaguru, Pushparajah ORCID: 0000-0002-6041-0517 , Santhanakrishnan, Manisekaran, Tilford, Tim ORCID: 0000-0001-8307-6403 and Bailey, Chris ORCID: 0000-0002-9438-3879 (2019) Design of additively manufactured heatsinks for power electronics thermal management using adjoint level-set topology optimization. In: 2019 25th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC). IEEE. ISBN 978-1728120782 ISSN 2474-1515 (Print), 2474-1523 (Online) (doi:https://doi.org/10.1109/THERMINIC.2019.8923530)

thermal fatigue

Xu, Yilun, Xian, Jingwei, Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Bailey, Christopher ORCID: 0000-0002-9438-3879 , Coyle, Richard, Gourlay, Christopher and Dunne, Fionn (2022) A multi-scale approach to microstructure-sensitive thermal fatigue in solder joints. International Journal of Plasticity, 155:103308. ISSN 0749-6419 (doi:https://doi.org/10.1016/j.ijplas.2022.103308)

thermo-mechanical Reliability

Xu, Yilun, Xian, Jingwei, Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Bailey, Christopher ORCID: 0000-0002-9438-3879 , Coyle, Richard, Gourlay, Christopher and Dunne, Fionn (2022) A multi-scale approach to microstructure-sensitive thermal fatigue in solder joints. International Journal of Plasticity, 155:103308. ISSN 0749-6419 (doi:https://doi.org/10.1016/j.ijplas.2022.103308)

Thermomigration

Zhu, X., Kotadia, H., Xu, S., Lu, H. ORCID: 0000-0002-4392-6562 , Mannan, S. H., Bailey, C. ORCID: 0000-0002-9438-3879 and Chan, Y. C. (2014) Electromigration in Sn-Ag solder thin films under high current density. Thin Solid Films, 565. pp. 193-201. ISSN 0040-6090 (doi:https://doi.org/10.1016/j.tsf.2014.06.030)

Thin film

Zhu, X., Kotadia, H., Xu, S., Lu, H. ORCID: 0000-0002-4392-6562 , Mannan, S. H., Bailey, C. ORCID: 0000-0002-9438-3879 and Chan, Y. C. (2014) Electromigration in Sn-Ag solder thin films under high current density. Thin Solid Films, 565. pp. 193-201. ISSN 0040-6090 (doi:https://doi.org/10.1016/j.tsf.2014.06.030)

tin whiskers

Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Bailey, Christopher ORCID: 0000-0002-9438-3879 , Stewart, Paul, Parker, Mike and Roulston, John F. (2020) Experimental and modelling study on delamination risks for refinished electronic packages under hot solder dip loads. IEEE Transactions on Components, Packaging and Manufacturing Technology, 10 (3). pp. 502-515. ISSN 2156-3950 (Print), 2156-3985 (Online) (doi:https://doi.org/10.1109/TCPMT.2020.2972635)

Topological Optimisation

Santhakrishnan, M., Tilford, T. ORCID: 0000-0001-8307-6403 and Bailey, C. ORCID: 0000-0002-9438-3879 (2016) On the Application of Topology Optimisation Techniques to Thermal Management of Microelectronics Systems. In: IEEE EuroSimE conference, 17-20 April, 2016, Montpellier, France.

Topology

Santhanakrishnan, Mani Sekaran, Tilford, Timothy ORCID: 0000-0001-8307-6403 and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2018) Performance assessment of density and level-set topology optimisation methods for 3D heatsink design. Journal of Algorithms and Computational Technology, 12 (3). pp. 273-287. ISSN 1748-3018 (Print), 1748-3026 (Online) (doi:https://doi.org/10.1177/1748301818779019)

topology optimization

Rajaguru, Pushparajah ORCID: 0000-0002-6041-0517 , Santhanakrishnan, Manisekaran, Tilford, Tim ORCID: 0000-0001-8307-6403 and Bailey, Chris ORCID: 0000-0002-9438-3879 (2019) Design of additively manufactured heatsinks for power electronics thermal management using adjoint level-set topology optimization. In: 2019 25th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC). IEEE. ISBN 978-1728120782 ISSN 2474-1515 (Print), 2474-1523 (Online) (doi:https://doi.org/10.1109/THERMINIC.2019.8923530)

ultra-fine pitch flip chip assembly

Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 and Bailey, Chris (2023) Modeling Insights into the assembly challenges of focal plane arrays. IEEE Access. pp. 35207-35219. ISSN 2169-3536 (Online) (doi:https://doi.org/10.1109/ACCESS.2023.3264806)

underfill

Bailey, C. ORCID: 0000-0002-9438-3879 , Rajaguru, P. ORCID: 0000-0002-6041-0517 , Lu, H. ORCID: 0000-0002-4392-6562 , Castellazzi, A., Antonini, M., Pathirana, V., Udugampola, N., Udrea, F., Mitchelson, P. D. and Aldhaher, S. (2018) Mechanical modelling of high power lateral IGBT for LED driver applications. In: IEEE Electronic Components and Technology Conference (ECTC). IEEE Electronics Packaging Society (formerly CPMT), pp. 1375-1381. ISBN 978-1-5386-5000-4 ISSN 2377-5726 (Online) (doi:https://doi.org/10.1109/ECTC.2018.00210)

Rajaguru, P. ORCID: 0000-0002-6041-0517 , Bailey, C. ORCID: 0000-0002-9438-3879 , Lu, H. ORCID: 0000-0002-4392-6562 , Aliyu, A. M., Castellazzi, A., Pathirana, V., Udugampola, N., Trajkovic, T., Udrea, F., Mitcheson, P. D. and Elliott, A. D. T. (2017) Co-design/simulation of flip-chip assembly for high voltage IGBT packages. In: 23rd International workshop on Thermal Investigations of ICs and Systems (THERMINIC). THERMINIC, pp. 1-5.

Rajaguru, P. ORCID: 0000-0002-6041-0517 , Lu, H. ORCID: 0000-0002-4392-6562 , Bailey, C. ORCID: 0000-0002-9438-3879 , Castellazzi, A., Pathirana, V., Udugampola, N. and Udrea, F. (2018) Impact of underfill and other physical dimensions on Silicon Lateral IGBT package reliability using computer model with discrete and continuous design variables. Microelectronics Reliability, 83. pp. 146-156. ISSN 0026-2714 (doi:https://doi.org/10.1016/j.microrel.2018.02.024)

Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Stewart†, Paul and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2021) Reliability optimisation and lifetime modelling of micro-BGA assemblies in harsh environment applications. In: 2021 23rd European Microelectronics and Packaging Conference & Exhibition (EMPC). 13-16 Sept. 2021. Gothenburg, Sweden. IEEE Xplore . Institute of Electrical and Electronics Engineers (IEEE), Piscataway, New Jersey, pp. 1-8. ISBN 978-0956808677 ; 978-1665423687 (doi:https://doi.org/10.23919/EMPC53418.2021.9584970)

Veracity

Hinojosa Herrera, Ana Elsa ORCID: 0000-0002-0636-1881 , Walshaw, Chris ORCID: 0000-0003-0253-7779 and Bailey, Chris ORCID: 0000-0002-9438-3879 (2020) Improving Black Box Classification Model Veracity for Electronics Anomaly Detection. In: 2020 15th IEEE Conference on Industrial Electronics and Applications (ICIEA). IEEE, pp. 1092-1097. ISBN 978-1728151694 ISSN 2156-2318 (Print), 2158-2297 (Online) (doi:https://doi.org/10.1109/ICIEA48937.2020.9248258)

vibration

Rajaguru, Pushpa ORCID: 0000-0002-6041-0517 , Lu, Hua ORCID: 0000-0002-4392-6562 , Bailey, Chris ORCID: 0000-0002-9438-3879 and Bella, Martina (2020) Modelling and analysis of vibration on power electronic module structure and application of model order reduction. Microelectronics Reliability, 110:113697. ISSN 0026-2714 (doi:https://doi.org/10.1016/j.microrel.2020.113697)

Vortex generator

Santhanakrishnan, Mani Sekaran, Tilford, Timothy ORCID: 0000-0001-8307-6403 and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2022) Heat transfer characteristics of plate fin heat sink with longitudinal vortex generators. International Journal of Numerical Methods for Heat and Fluid Flow, 33 (3). pp. 1203-1228. ISSN 0961-5539 (doi:https://doi.org/10.1108/HFF-06-2022-0386)

wear

Bailey, Christopher ORCID: 0000-0002-9438-3879 , Yin, Chunyan ORCID: 0000-0003-0298-0420 and Rajaguru, Pushparajah ORCID: 0000-0002-6041-0517 (2019) Predicting damage and life expectancy of subsea power cables in offshore renewable energy applications. IEEE ACCESS, 7. pp. 54658-54669. ISSN 2169-3536 (Online) (doi:https://doi.org/10.1109/ACCESS.2019.2911260)

Wire/ribbon bond

Nwanoro, Kenneth, Lu, Hua ORCID: 0000-0002-4392-6562 , Yin, Chunyan ORCID: 0000-0003-0298-0420 and Bailey, Chris ORCID: 0000-0002-9438-3879 (2018) An analysis of the reliability and design optimization of aluminium ribbon bonds in power electronics modules using computer simulation method. Microelectronics Reliability, 87. pp. 1-14. ISSN 0026-2714 (doi:https://doi.org/10.1016/j.microrel.2018.05.013)

Nwanoro, Kenneth Chimezie, Lu, Hua ORCID: 0000-0002-4392-6562 , Yin, Chunyan ORCID: 0000-0003-0298-0420 and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2017) Computer simulation of the reliability of wire bonds and ribbon bonds in power electronics modules. In: 2017 23rd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC). IEEE, pp. 1-6. ISBN 978-1-5386-1929-2 ISSN 2474-1523 (Online) (doi:https://doi.org/10.1109/THERMINIC.2017.8233827)

This list was generated on Sat Nov 2 03:37:22 2024 UTC.