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Items where Faculty / School / Research Centre / Research Groups is "Computational Mechanics & Reliability Group (CMRG)"

Items where Faculty / School / Research Centre / Research Groups is "Computational Mechanics & Reliability Group (CMRG)"

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Number of items at this level: 62.

2023

Stoyanov, Stoyan ORCID logoORCID: https://orcid.org/0000-0001-6091-1226 and Bailey, Chris (2023) Modeling Insights into the assembly challenges of focal plane arrays. IEEE Access. pp. 35207-35219. ISSN 2169-3536 (Online) (doi:10.1109/ACCESS.2023.3264806)

2022

Malik, Asif, Rajaguru, Pushparajah ORCID logoORCID: https://orcid.org/0000-0002-6041-0517 and Azzawi, Rula (2022) Smart manufacturing with Artificial Intelligence and digital twin: a brief review. In: 8th International Conference on Information Technology Trends, 25th - 26th May 2022, Dubai, UAE.

Santhanakrishnan, Mani Sekaran, Tilford, Timothy ORCID logoORCID: https://orcid.org/0000-0001-8307-6403 and Bailey, Christopher ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 (2022) Heat transfer characteristics of plate fin heat sink with longitudinal vortex generators. International Journal of Numerical Methods for Heat and Fluid Flow, 33 (3). pp. 1203-1228. ISSN 0961-5539 (doi:10.1108/HFF-06-2022-0386)

Stoyanov, Stoyan ORCID logoORCID: https://orcid.org/0000-0001-6091-1226 and Bailey, Chris ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 (2022) Deep learning modelling for composite properties of PCB conductive layers. In: 2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE). Institute of Electrical and Electronics Engineers (IEEE), Piscataway, New Jersey, pp. 1-7. ISBN 978-1665458375 (doi:10.1109/EuroSimE54907.2022.9758885)

Xu, Yilun, Xian, Jingwei, Stoyanov, Stoyan ORCID logoORCID: https://orcid.org/0000-0001-6091-1226, Bailey, Christopher ORCID logoORCID: https://orcid.org/0000-0002-9438-3879, Coyle, Richard, Gourlay, Christopher and Dunne, Fionn (2022) A multi-scale approach to microstructure-sensitive thermal fatigue in solder joints. International Journal of Plasticity, 155:103308. ISSN 0749-6419 (doi:10.1016/j.ijplas.2022.103308)

2021

Santhanakrishnan, Mani Sekara, Tilford, Tim ORCID logoORCID: https://orcid.org/0000-0001-8307-6403 and Bailey, Chris ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 (2021) Multi-objective NSGA-II based shape optimisation of the cross-sectional shape of passively cooled heat sinks. International Journal of Numerical Methods for Heat and Fluid Flow, 32 (3). pp. 1025-1045. ISSN 0961-5539 (doi:10.1108/HFF-10-2020-0656)

Stoyanov, Stoyan ORCID logoORCID: https://orcid.org/0000-0001-6091-1226, Stewart†, Paul and Bailey, Christopher ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 (2021) Reliability optimisation and lifetime modelling of micro-BGA assemblies in harsh environment applications. In: 2021 23rd European Microelectronics and Packaging Conference & Exhibition (EMPC). 13-16 Sept. 2021. Gothenburg, Sweden. IEEE Xplore . Institute of Electrical and Electronics Engineers (IEEE), Piscataway, New Jersey, pp. 1-8. ISBN 978-0956808677 ; 978-1665423687 (doi:10.23919/EMPC53418.2021.9584970)

Tilford, Tim ORCID logoORCID: https://orcid.org/0000-0001-8307-6403, Stoyanov, Stoyan ORCID logoORCID: https://orcid.org/0000-0001-6091-1226, Braun, Jessica, Janhsen, Jan Christoph, Patel, Mayur K. and Bailey, Chris ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 (2021) Comparative reliability of inkjet-printed electronics packaging. IEEE Transactions on Components, Packaging and Manufacturing Technology, 11 (2). pp. 351-362. ISSN 2156-3950 (Print), 2156-3985 (Online) (doi:10.1109/TCPMT.2021.3049952)

2020

Ahsan, M., Stoyanov, S. ORCID logoORCID: https://orcid.org/0000-0001-6091-1226, Bailey, C. ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 and Albarbar, A. (2020) Developing computational intelligence for smart qualification testing of electronic products. IEEE Access, 8. pp. 16922-16933. ISSN 2169-3536 (Online) (doi:10.1109/ACCESS.2020.2967858)

Hinojosa Herrera, Ana ORCID logoORCID: https://orcid.org/0000-0002-0636-1881, Walshaw, Chris ORCID logoORCID: https://orcid.org/0000-0003-0253-7779 and Bailey, Chris ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 (2020) Failure mode & effect analysis and another methodology for improving data veracity and validity. Annals of Emerging Technologies in Computing (AETiC), 4 (3). pp. 9-16. ISSN 2516-0281 (doi:10.33166/AETiC.2020.03.002)

Hinojosa Herrera, Ana Elsa ORCID logoORCID: https://orcid.org/0000-0002-0636-1881, Walshaw, Chris ORCID logoORCID: https://orcid.org/0000-0003-0253-7779 and Bailey, Chris ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 (2020) Improving Black Box Classification Model Veracity for Electronics Anomaly Detection. In: 2020 15th IEEE Conference on Industrial Electronics and Applications (ICIEA). IEEE, pp. 1092-1097. ISBN 978-1728151694 ISSN 2156-2318 (Print), 2158-2297 (Online) (doi:10.1109/ICIEA48937.2020.9248258)

Rajaguru, Pushpa ORCID logoORCID: https://orcid.org/0000-0002-6041-0517, Lu, Hua ORCID logoORCID: https://orcid.org/0000-0002-4392-6562, Bailey, Chris ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 and Bella, Martina (2020) Modelling and analysis of vibration on power electronic module structure and application of model order reduction. Microelectronics Reliability, 110:113697. ISSN 0026-2714 (doi:10.1016/j.microrel.2020.113697)

Shahjalal, Mohammad, Rishad Ahmed, MD, Lu, Hua ORCID logoORCID: https://orcid.org/0000-0002-4392-6562, Bailey, Chris ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 and Forsyth, Andrew (2020) An analysis of the thermal interaction between components in power converter applications. IEEE Transactions on Power Electronics, 35 (9). pp. 9082-9094. ISSN 0885-8993 (Print), 1941-0107 (Online) (doi:10.1109/TPEL.2020.2969350)

Stoyanov, Stoyan ORCID logoORCID: https://orcid.org/0000-0001-6091-1226, Bailey, Christopher ORCID logoORCID: https://orcid.org/0000-0002-9438-3879, Stewart, Paul, Parker, Mike and Roulston, John F. (2020) Experimental and modelling study on delamination risks for refinished electronic packages under hot solder dip loads. IEEE Transactions on Components, Packaging and Manufacturing Technology, 10 (3). pp. 502-515. ISSN 2156-3950 (Print), 2156-3985 (Online) (doi:10.1109/TCPMT.2020.2972635)

Stoyanov, Stoyan ORCID logoORCID: https://orcid.org/0000-0001-6091-1226, Bailey, Christopher ORCID logoORCID: https://orcid.org/0000-0002-9438-3879, Waite, Rhys, Hicks, Christopher and Golding, Terry (2020) Packaging challenges and reliability performance of compound semiconductor focal plane arrays. In: 2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC). IEEE, pp. 1-8. ISBN 978-0956808660 (doi:10.23919/EMPC44848.2019.8951842)

2019

Bailey, Christopher ORCID logoORCID: https://orcid.org/0000-0002-9438-3879, Yin, Chunyan ORCID logoORCID: https://orcid.org/0000-0003-0298-0420 and Rajaguru, Pushparajah ORCID logoORCID: https://orcid.org/0000-0002-6041-0517 (2019) Predicting damage and life expectancy of subsea power cables in offshore renewable energy applications. IEEE ACCESS, 7. pp. 54658-54669. ISSN 2169-3536 (Online) (doi:10.1109/ACCESS.2019.2911260)

Flynn, David, Bailey, Christopher ORCID logoORCID: https://orcid.org/0000-0002-9438-3879, Rajaguru, Pushpa ORCID logoORCID: https://orcid.org/0000-0002-6041-0517, Wenshuo, Tang and Yin, Chunyan ORCID logoORCID: https://orcid.org/0000-0003-0298-0420 (2019) Prognostics and health management of subsea cables. In: Goodman, Douglas, Hofmeister, James P. and Szidarovszky, Ferenc, (eds.) Prognostics and Health Management: A Practical Approach to Improving System Reliability Using Condition-Based Data. Quality and Reliability Engineering Series . Wiley-Blackwell. ISBN 978-1119356653

Hinojosa Herrera, Ana Elsa ORCID logoORCID: https://orcid.org/0000-0002-0636-1881 and Stoyanov, Stoyan ORCID logoORCID: https://orcid.org/0000-0001-6091-1226 (2019) Data driven predictive model to compact a production stop-on-fail test set for an electronic device. In: Proceedings of the 2018 International Conference on Computing, Electronics & Communications Engineering (iCCECE). IEEE Xplore, pp. 59-64. ISBN 9781538649046 (doi:10.1109/iCCECOME.2018.8658941)

Hinojosa Herrera, Ana Elsa ORCID logoORCID: https://orcid.org/0000-0002-0636-1881, Stoyanov, Stoyan ORCID logoORCID: https://orcid.org/0000-0001-6091-1226, Bailey, Christopher ORCID logoORCID: https://orcid.org/0000-0002-9438-3879, Walshaw, Christopher ORCID logoORCID: https://orcid.org/0000-0003-0253-7779 and Yin, Chunyan ORCID logoORCID: https://orcid.org/0000-0003-0298-0420 (2019) Data analytics to reduce stop-on-fail test in electronics manufacturing. Open Computer Sciences, 9 (1). pp. 200-211. ISSN 2299-1093 (Online) (doi:10.1515/comp-2019-0014)

Hinojosa Herrera, Ana Elsa ORCID logoORCID: https://orcid.org/0000-0002-0636-1881, Walshaw, Chris ORCID logoORCID: https://orcid.org/0000-0003-0253-7779, Bailey, Chris ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 and Yin, Chunyan ORCID logoORCID: https://orcid.org/0000-0003-0298-0420 (2019) Failure mode & effect analysis for improving data veracity and validity. In: Proceedings of the IEEE International Conference on Computing, Electronics & Communications Engineering 2019 (IEEE iCCECE '19). IEEE, pp. 100-105. ISBN 978-1728121383 (doi:10.1109/iCCECE46942.2019.8941849)

Rajaguru, Pushparajah ORCID logoORCID: https://orcid.org/0000-0002-6041-0517, Santhanakrishnan, Manisekaran, Tilford, Tim ORCID logoORCID: https://orcid.org/0000-0001-8307-6403 and Bailey, Chris ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 (2019) Design of additively manufactured heatsinks for power electronics thermal management using adjoint level-set topology optimization. In: 2019 25th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC). IEEE. ISBN 978-1728120782 ISSN 2474-1515 (Print), 2474-1523 (Online) (doi:10.1109/THERMINIC.2019.8923530)

Stoyanov, Stoyan ORCID logoORCID: https://orcid.org/0000-0001-6091-1226, Ahsan, Mominul, Bailey, Chris ORCID logoORCID: https://orcid.org/0000-0002-9438-3879, Wotherspoon, Tracy and Hunt, Craig (2019) Predictive analytics methodology for smart qualification testing of electronic components. Journal of Intelligent Manufacturing, 30 (3). pp. 1497-1514. ISSN 0956-5515 (Print), 1572-8145 (Online) (doi:10.1007/s10845-018-01462-9)

Tonry, Catherine E. H. ORCID logoORCID: https://orcid.org/0000-0002-8214-0845, Patel, Mayur K., Yu, Weixing, Desmulliez, Marc P. Y. and Bailey, Christopher ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 (2019) Fabrication of hollow polymer microstructures using dielectric and capillary forces. Microsystem Technologies. pp. 1-8. ISSN 0946-7076 (Print), 1432-1858 (Online) (doi:10.1007/s00542-019-04409-z)

2018

Ahsan, Mominul, Stoyanov, Stoyan ORCID logoORCID: https://orcid.org/0000-0001-6091-1226 and Bailey, Christopher ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 (2018) Data driven prognostics for failure of power semiconductor packages. In: Proceedings of 41st Spring Seminar on Electronics Technology (ISSE). IEEE Xplore, pp. 1-6. ISBN 978-1-5386-5730-0 ISSN 2161-2536 (Online) (doi:10.1109/ISSE.2018.8443612)

Bailey, C. ORCID logoORCID: https://orcid.org/0000-0002-9438-3879, Rajaguru, P. ORCID logoORCID: https://orcid.org/0000-0002-6041-0517, Lu, H. ORCID logoORCID: https://orcid.org/0000-0002-4392-6562, Castellazzi, A., Antonini, M., Pathirana, V., Udugampola, N., Udrea, F., Mitchelson, P. D. and Aldhaher, S. (2018) Mechanical modelling of high power lateral IGBT for LED driver applications. In: IEEE Electronic Components and Technology Conference (ECTC). IEEE Electronics Packaging Society (formerly CPMT), pp. 1375-1381. ISBN 978-1-5386-5000-4 ISSN 2377-5726 (Online) (doi:10.1109/ECTC.2018.00210)

Blanche, Jamie, Flynn, David, Lewis, Helen, Couples, Gary, Buckman, Jim, Bailey, Chris ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 and Tilford, Timothy ORCID logoORCID: https://orcid.org/0000-0001-8307-6403 (2018) Analysis of sandstone pore space fluid saturation and mineralogy variation via application of monostatic K-band frequency modulated continuous wave radar. IEEE Access, 6. pp. 44376-44389. ISSN 2169-3536 (Online) (doi:10.1109/ACCESS.2018.2863024)

Desmulliez, Marc P.Y, Adamietz, Raphael, Pavuluri, Sumanth K., Tilford, Tim ORCID logoORCID: https://orcid.org/0000-0001-8307-6403, Bailey, Chris ORCID logoORCID: https://orcid.org/0000-0002-9438-3879, Schreier-Alt, Thomas and Warmuth, Jens (2018) Reliability testing and stress measurement of QFN packages encapsulated by an open-ended microwave curing system. IEEE Transactions on Components, Packaging and Manufacturing Technology, 9 (1). pp. 173-180. ISSN 2156-3950 (Print), 2156-3985 (Online) (doi:10.1109/TCPMT.2018.2859031)

Nwanoro, Kenneth, Lu, Hua ORCID logoORCID: https://orcid.org/0000-0002-4392-6562, Yin, Chunyan ORCID logoORCID: https://orcid.org/0000-0003-0298-0420 and Bailey, Chris ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 (2018) An analysis of the reliability and design optimization of aluminium ribbon bonds in power electronics modules using computer simulation method. Microelectronics Reliability, 87. pp. 1-14. ISSN 0026-2714 (doi:10.1016/j.microrel.2018.05.013)

Nwanoro, Kenneth C., Lu, Hua ORCID logoORCID: https://orcid.org/0000-0002-4392-6562, Yin, Chunyan ORCID logoORCID: https://orcid.org/0000-0003-0298-0420 and Bailey, Christopher ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 (2018) An approximate numerical method for the prediction of plastic strain in layered structures. In: 2018 7th Electronic System-Integration Technology Conference (ESTC 2018). IEEE, pp. 181-187. ISBN 978-1538668153

Nwanoro, Kenneth Chimezie, Lu, Hua ORCID logoORCID: https://orcid.org/0000-0002-4392-6562, Yin, Chunyan ORCID logoORCID: https://orcid.org/0000-0003-0298-0420 and Bailey, Christopher ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 (2018) Numerical simulation of the junction temperature, the coolant flow rate and the reliability of an IGBT module. In: 2018 24th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC 2018). IEEE, pp. 250-255. ISBN 978-1538667606

Rajaguru, P. ORCID logoORCID: https://orcid.org/0000-0002-6041-0517, Lu, H. ORCID logoORCID: https://orcid.org/0000-0002-4392-6562, Bailey, C. ORCID logoORCID: https://orcid.org/0000-0002-9438-3879, Castellazzi, A., Pathirana, V., Udugampola, N. and Udrea, F. (2018) Impact of underfill and other physical dimensions on Silicon Lateral IGBT package reliability using computer model with discrete and continuous design variables. Microelectronics Reliability, 83. pp. 146-156. ISSN 0026-2714 (doi:10.1016/j.microrel.2018.02.024)

Santhanakrishnan, Mani Sekaran, Tilford, Timothy ORCID logoORCID: https://orcid.org/0000-0001-8307-6403 and Bailey, Christopher ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 (2018) Performance assessment of density and level-set topology optimisation methods for 3D heatsink design. Journal of Algorithms and Computational Technology, 12 (3). pp. 273-287. ISSN 1748-3018 (Print), 1748-3026 (Online) (doi:10.1177/1748301818779019)

Stoyanov, Stoyan ORCID logoORCID: https://orcid.org/0000-0001-6091-1226, Ahsan, Mominuil and Bailey, Chris ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 (2018) Data analytics approach for optimal qualification testing of electronic components. In: Proceedings EuroSimE 2018. 2018 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) . IEEE Xplore, pp. 1-9. ISBN 978-1-5386-2358-9 (doi:10.1109/EuroSimE.2018.8369926)

Tilford, T. ORCID logoORCID: https://orcid.org/0000-0001-8307-6403, Bruan, J., Janhsen, J. C., Burgard, M. and Bailey, C. ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 (2018) SPH analysis of inkjet droplet impact dynamics. In: Proceedings of the 13th World Congress on Computational Mechanics (WCCM XIII) and 2nd Pan American Congress on Computational Mechanics (PANACM II). WCCM.

Tilford, Tim ORCID logoORCID: https://orcid.org/0000-0001-8307-6403, Stoyanov, Stoyan ORCID logoORCID: https://orcid.org/0000-0001-6091-1226, Braun, Jessica, Janhsen, Jan Cristophe, Burgard, Matthias, Birch, Richard and Bailey, Chris ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 (2018) Design, manufacture and test for reliable 3D printed electronics packaging. Microelectronics Reliability, 85. pp. 109-117. ISSN 0026-2714 (doi:10.1016/j.microrel.2018.04.008)

2017

Aliyu, A. M., Mouawad, B., Castellazzi, A., Rajaguru, P. ORCID logoORCID: https://orcid.org/0000-0002-6041-0517, Bailey, C. ORCID logoORCID: https://orcid.org/0000-0002-9438-3879, Pathirana, V., Uduampola, N., Trajkovic, T. and Ubrea, F. (2017) Chip-on-board assembly of 800V Si LIGBTs for high performance ultra-compact LED drivers. In: Proceedings of the 2017 29th International Symposium on Power Semiconductor Devices and IC's (ISPSD). IEEE, pp. 431-434. ISBN 978-4-88686-094-1 ISSN 1946-0201 (Online) (doi:10.23919/ISPSD.2017.7988976)

Lu, Hua ORCID logoORCID: https://orcid.org/0000-0002-4392-6562 and Bailey, Christopher ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 (2017) Failure and reliability analysis of a SiC power module based on stress comparison to a Si device. IEEE Transactions on Device and Materials Reliability, 17 (4). pp. 727-737. ISSN 1530-4388 (doi:10.1109/TDMR.2017.2766692)

Nwanoro, Kenneth Chimezie, Lu, Hua ORCID logoORCID: https://orcid.org/0000-0002-4392-6562, Yin, Chunyan ORCID logoORCID: https://orcid.org/0000-0003-0298-0420 and Bailey, Christopher ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 (2017) Computer simulation of the reliability of wire bonds and ribbon bonds in power electronics modules. In: 2017 23rd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC). IEEE, pp. 1-6. ISBN 978-1-5386-1929-2 ISSN 2474-1523 (Online) (doi:10.1109/THERMINIC.2017.8233827)

Ortiz Gonzalez, Jose, Alatise, Olayiwola, Aliyu, Attahir, Rajaguru, Pushparajah ORCID logoORCID: https://orcid.org/0000-0002-6041-0517, Castellazzi, Alberto, Ran, Li, Mawby, Philip and Bailey, Chris ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 (2017) Evaluation of SiC Schottky diodes using pressure contacts. IEEE Transactions on Industrial Electronics, 64 (10). 8213 -8223. ISSN 0278-0046 (Print), 1557-9948 (Online) (doi:10.1109/TIE.2017.2677348)

Rajaguru, P. ORCID logoORCID: https://orcid.org/0000-0002-6041-0517, Bailey, C. ORCID logoORCID: https://orcid.org/0000-0002-9438-3879, Lu, H. ORCID logoORCID: https://orcid.org/0000-0002-4392-6562, Aliyu, A. M., Castellazzi, A., Pathirana, V., Udugampola, N., Trajkovic, T., Udrea, F., Mitcheson, P. D. and Elliott, A. D. T. (2017) Co-design/simulation of flip-chip assembly for high voltage IGBT packages. In: 23rd International workshop on Thermal Investigations of ICs and Systems (THERMINIC). THERMINIC, pp. 1-5.

Rajaguru, Pushparajah ORCID logoORCID: https://orcid.org/0000-0002-6041-0517, Ortiz-Gonzalez, Jose Angel, Lu, Hua ORCID logoORCID: https://orcid.org/0000-0002-4392-6562, Bailey, Chris ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 and Alatise, Olawiwola (2017) A multiphysics modeling and experimental analysis of pressure contacts in power electronics applications. IEEE Transactions on Components, Packaging and Manufacturing Technology, 7 (6). pp. 893-900. ISSN 2156-3950 (Print), 2156-3985 (Online) (doi:10.1109/TCPMT.2017.2688021)

Shahjalal, Mohammad, Lu, Hua ORCID logoORCID: https://orcid.org/0000-0002-4392-6562 and Bailey, Christopher ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 (2017) Electro-thermal modelling of multi chip power modules for high power converter application. In: 2017 18th International Conference on Electronic Packaging Technology (ICEPT), Harbin. IEEE, pp. 940-945. ISBN 978-1-5386-2973-4 (doi:10.1109/ICEPT.2017.8046599)

Stoyanov, Stoyan ORCID logoORCID: https://orcid.org/0000-0001-6091-1226 and Bailey, Christopher ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 (2017) Machine learning for additive manufacturing of electronics. In: Proceedings 2017 40th International Spring Seminar on Electronics Technology (ISSE). IEEE. ISBN 978-1-5386-0583-7 ISSN 2161-2536 (Online) (doi:10.1109/ISSE.2017.8000936)

Yin, Chunyan ORCID logoORCID: https://orcid.org/0000-0003-0298-0420, Stoyanov, Stoyan ORCID logoORCID: https://orcid.org/0000-0001-6091-1226, Bailey, Christopher ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 and Stewart, Paul (2017) Modelling the impact of conformal coating penetration on QFN reliability. In: 2017 18th International Conference on Electronic Packaging Technology (ICEPT). IEEE, pp. 1021-1026. ISBN 978-1-5386-2973-4 (doi:10.1109/ICEPT.2017.8046616)

2016

Bailey, C. ORCID logoORCID: https://orcid.org/0000-0002-9438-3879, Stoyanov, S. ORCID logoORCID: https://orcid.org/0000-0001-6091-1226, Tilford, T. and Tourloukis, G. (2016) Modelling methodologies for quality assessment of 3D inkjet printed electronic products. In: 3rd Fraunhofer Direct Digital Manufacturing Conference, DDMC 2016. Proceedings. Fraunhofer Verlag, Stuttgart. ISBN 978-3-8396-9128-1 ISSN 978-3-8396-1001-5 (Online)

Jones, Thomas D.A., Flynn, David, Desmulliez, Marc P.Y., Price, Dennis, Beadel, Matthew, Strusevich, Nadia, Patel, Mayur, Bailey, Chris ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 and Costello, Suzanne (2016) Morphology and acoustic artefacts of copper deposits electroplated using megasonic assisted agitation. Circuit World, 42 (3). pp. 127-140. ISSN 0305-6120 (doi:10.1108/CW-03-2016-0006)

Rajaguru, P. ORCID logoORCID: https://orcid.org/0000-0002-6041-0517, Lu, H. ORCID logoORCID: https://orcid.org/0000-0002-4392-6562, Bailey, C. ORCID logoORCID: https://orcid.org/0000-0002-9438-3879, Ortiz-Gonzalez, J. and Alatise, O. (2016) Electro-thermo-mechanical modelling and analysis of the Press Pack Diode in Power Electronics. In: 2015 21st International Workshop on Thermal Investigations of ICs and Systems (THERMINIC). IEEE, pp. 1-6. ISBN 978-1-4673-9706-3 (doi:10.1109/THERMINIC.2015.7389607)

Rajaguru, P. ORCID logoORCID: https://orcid.org/0000-0002-6041-0517, Lu, H. ORCID logoORCID: https://orcid.org/0000-0002-4392-6562, Bailey, C. ORCID logoORCID: https://orcid.org/0000-0002-9438-3879, Ortiz-Gonzalez, J. and Alatise, O. (2016) Evaluation of the impact of the physical dimensions and material of the semiconductor chip on the reliability of Sn3.5Ag solder interconnect in power electronic module: A finite element analysis perspective. Microelectronics Reliability, 68. pp. 77-85. ISSN 0026-2714 (doi:10.1016/j.microrel.2016.12.002)

Santhakrishnan, M., Tilford, T. ORCID logoORCID: https://orcid.org/0000-0001-8307-6403 and Bailey, C. ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 (2016) On the Application of Topology Optimisation Techniques to Thermal Management of Microelectronics Systems. In: IEEE EuroSimE conference, 17-20 April, 2016, Montpellier, France.

Stoyanov, Stoyan ORCID logoORCID: https://orcid.org/0000-0001-6091-1226, Bailey, Chris ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 and Tourloukis, Georgios (2016) Similarity approach for reducing qualification tests of electronic components. Microelectronics Reliability, 67. pp. 111-119. ISSN 0026-2714 (doi:10.1016/j.microrel.2016.10.017)

Tilford, T. ORCID logoORCID: https://orcid.org/0000-0001-8307-6403, Stoyanov, S. ORCID logoORCID: https://orcid.org/0000-0001-6091-1226, Tourloukis, G. and Bailey, C. ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 (2016) Numerical analysis of droplet deposition in inkjet printed electronics assembly. In: 2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE). IEEE, pp. 1-7. ISBN 978-1-5090-2106-2 (doi:10.1109/EuroSimE.2016.7463358)

2015

Rajaguru, Pushparajah ORCID logoORCID: https://orcid.org/0000-0002-6041-0517, Lu, Hua ORCID logoORCID: https://orcid.org/0000-0002-4392-6562 and Bailey, Chris ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 (2015) Sintered silver finite element modelling and reliability based design optimisation in power electronic module. Microelectronics Reliability, 55 (6). pp. 919-930. ISSN 0026-2714 (doi:10.1016/j.microrel.2015.03.011)

Rajaguru, Pushparajah ORCID logoORCID: https://orcid.org/0000-0002-6041-0517, Lu, Hua ORCID logoORCID: https://orcid.org/0000-0002-4392-6562 and Bailey, Christopher ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 (2015) A time dependent damage indicator model for Sn3.5Ag solder layer in power electronic module. Microelectronics Reliability, 55 (11). pp. 2371-2381. ISSN 0026-2714 (doi:10.1016/j.microrel.2015.07.047)

Stoyanov, S. ORCID logoORCID: https://orcid.org/0000-0001-6091-1226 and Bailey, C. ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 (2015) Modelling the impact of refinishing processes on COTS components for use in aerospace applications. Microelectronics Reliability, 55 (9-10). pp. 1271-1279. ISSN 0026-2714 (doi:10.1016/j.microrel.2015.07.030)

Tonry, Catherine Elizabeth Henzell ORCID logoORCID: https://orcid.org/0000-0002-8214-0845 (2015) Computational electrohydrodynamics for fabricating polymer microstructures. PhD thesis, University of Greenwich.

Yin, Chunyan ORCID logoORCID: https://orcid.org/0000-0003-0298-0420, Best, Chris, Bailey, Chris ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 and Stoyanov, Stoyan ORCID logoORCID: https://orcid.org/0000-0001-6091-1226 (2015) Statistical analysis of the impact of refinishing process on leaded components. Microelectronics Reliability, 55 (2). pp. 424-431. ISSN 0026-2714 (doi:10.1016/j.microrel.2014.11.001)

2014

Musallam, Mahera, Yin, Chunyan ORCID logoORCID: https://orcid.org/0000-0003-0298-0420, Bailey, Christopher ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 and Johnson, Mark (2014) Mission profile-based reliability design and real-time life consumption estimation in power electronics. IEEE Transactions on Power Electronics, 30 (5). pp. 2601-2613. ISSN 0885-8993 (Print), 1941-0107 (Online) (doi:10.1109/TPEL.2014.2358555)

Rajaguru, Pushparajah ORCID logoORCID: https://orcid.org/0000-0002-6041-0517 (2014) Reduced order modelling and numerical optimisation approach to reliability analysis of microsystems and power modules. PhD thesis, University of Greenwich.

Rajaguru, Pushparajah ORCID logoORCID: https://orcid.org/0000-0002-6041-0517, Lu, Hua ORCID logoORCID: https://orcid.org/0000-0002-4392-6562 and Bailey, Christopher ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 (2014) Application of nonlinear fatigue damage models in power electronic module wirebond structure under various amplitude loadings. Advances in Manufacturing, 2 (3). pp. 239-250. ISSN 2095-3127 (Print), 2195-3597 (Online) (doi:10.1007/s40436-014-0054-5)

Tilford, Timothy ORCID logoORCID: https://orcid.org/0000-0001-8307-6403, Cook, A., Lu, H. ORCID logoORCID: https://orcid.org/0000-0002-4392-6562, Ramambasoa, A. and Conseil, F. (2014) Numerical analysis of the performance of highly oriented pyrolytic graphite heat spreader in thermal management of microelectronics assemblies. In: Electronics Systemintegration Technology Conference, 16-18 Sep 2014, Helsinki, Finland. (doi:10.1109/ESTC.2014.6962815)

Zhu, X., Kotadia, H., Xu, S., Lu, H. ORCID logoORCID: https://orcid.org/0000-0002-4392-6562, Mannan, S. H., Bailey, C. ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 and Chan, Y. C. (2014) Electromigration in Sn-Ag solder thin films under high current density. Thin Solid Films, 565. pp. 193-201. ISSN 0040-6090 (doi:10.1016/j.tsf.2014.06.030)

2012

Rajaguru, Pushparajah ORCID logoORCID: https://orcid.org/0000-0002-6041-0517, Mason, Peter, Bailey, Christopher ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 and Stoyanov, Stoyan ORCID logoORCID: https://orcid.org/0000-0001-6091-1226 (2012) Structural Analysis on the Riveted Hull of the Paddle Steamer Medway Queen. In: Historic Ships Conference 2012. Royal Institution of Naval Architects (RINA).

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