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Items where Faculty / Department / Research Groups is "Faculty of Architecture, Computing & Humanities > Centre for Numerical Modelling & Process Analysis (CNMPA) > Computational Mechanics & Reliability Group (CMRG)"

Items where Faculty / Department / Research Groups is "Faculty of Architecture, Computing & Humanities > Centre for Numerical Modelling & Process Analysis (CNMPA) > Computational Mechanics & Reliability Group (CMRG)"

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Number of items at this level: 24.


Rajaguru, P., Lu, H., Bailey, C., Castellazzi, A., Pathirana, V., Udugampola, N. and Udrea, F. (2018) Impact of underfill and other physical dimensions on Silicon Lateral IGBT package reliability using computer model with discrete and continuous design variables. Microelectronics Reliability, 83. pp. 146-156. ISSN 0026-2714 (doi:10.1016/j.microrel.2018.02.024)

Santhanakrishnan, M., Tilford, T. and Bailey, C. (2018) Performance assessment of density and level-set topology optimisation methods for 3D heatsink design. Journal of Algorithms and Computational Technology. ISSN 1748-3018 (Print), 1748-3026 (Online) (In Press)

Stoyanov, Stoyan, Ahsan, Mominuil and Bailey, Chris (2018) Data analytics approach for optimal qualification testing of electronic components. In: Proceedings EuroSimE 2018. IEEE Xplore, pp. 1-9. (In Press)

Tilford, Timothy, Stoyanov, Stoyan, Braun, Jessica, Janhsen, Jan Cristophe, Burgard, Matthias, Birch, Richard and Bailey, Christopher (2018) Design, manufacture and test for reliable 3D printed electronics packaging. Microelectronics Reliability, 85. pp. 109-117. ISSN 0026-2714 (doi:10.1016/j.microrel.2018.04.008)


Aliyu, A. M., Mouawad, B., Castellazzi, A., Rajaguru, P., Bailey, C., Pathirana, V., Uduampola, N., Trajkovic, T. and Ubrea, F. (2017) Chip-on-board assembly of 800V Si LIGBTs for high performance ultra-compact LED drivers. In: Proceedings of the 2017 29th International Symposium on Power Semiconductor Devices and IC's (ISPSD). IEEE, pp. 431-434. ISBN 978-4-88686-094-1 ISSN 1946-0201 (Online) (doi:10.23919/ISPSD.2017.7988976)

Lu, Hua and Bailey, Christopher (2017) Failure and reliability analysis of a SiC power module based on stress comparison to a Si device. IEEE Transactions on Device and Materials Reliability, 17 (4). pp. 727-737. ISSN 1530-4388 (doi:10.1109/TDMR.2017.2766692)

Ortiz Gonzalez, Jose, Alatise, Olayiwola, Aliyu, Attahir, Rajaguru, Pushparajah, Castellazzi, Alberto, Ran, Li, Mawby, Philip and Bailey, Chris (2017) Evaluation of SiC Schottky diodes using pressure contacts. IEEE Transactions on Industrial Electronics, 64 (10). 8213 -8223. ISSN 0278-0046 (Print), 1557-9948 (Online) (doi:10.1109/TIE.2017.2677348)

Rajaguru, P., Bailey, C., Lu, H., Aliyu, A. M., Castellazzi, A., Pathirana, V., Udugampola, N., Trajkovic, T., Udrea, F., Mitcheson, P. D. and Elliott, A. D. T. (2017) Co-Design/Simulation of Flip-Chip Assembly for High Voltage IGBT Packages. In: 23rd International workshop on Thermal Investigations of ICs and Systems (THERMINIC). THERMINIC, pp. 1-5.

Rajaguru, Pushparajah, Ortiz-Gonzalez, Jose Angel, Lu, Hua, Bailey, Chris and Alatise, Olawiwola (2017) A multiphysics modeling and experimental analysis of pressure contacts in power electronics applications. IEEE Transactions on Components, Packaging and Manufacturing Technology, 7 (6). pp. 893-900. ISSN 2156-3950 (Print), 2156-3985 (Online) (doi:10.1109/TCPMT.2017.2688021)

Yin, Chunyan, Stoyanov, Stoyan, Bailey, Christopher and Stewart, Paul (2017) Modelling the impact of conformal coating penetration on QFN reliability. In: 2017 18th International Conference on Electronic Packaging Technology (ICEPT). IEEE, pp. 1021-1026. ISBN 978-1-5386-2973-4 (doi:10.1109/ICEPT.2017.8046616)


Bailey, C., Stoyanov, S., Tilford, T. and Tourloukis, G. (2016) Modelling methodologies for quality assessment of 3D inkjet printed electronic products. In: 3rd Fraunhofer Direct Digital Manufacturing Conference, DDMC 2016. Proceedings. Fraunhofer Verlag, Stuttgart. ISBN 978-3-8396-9128-1 ISSN 978-3-8396-1001-5 (Online)

Jones, Thomas D.A., Flynn, David, Desmulliez, Marc P.Y., Price, Dennis, Beadel, Matthew, Strusevich, Nadia, Patel, Mayur, Bailey, Chris and Costello, Suzanne (2016) Morphology and acoustic artefacts of copper deposits electroplated using megasonic assisted agitation. Circuit World, 42 (3). pp. 127-140. ISSN 0305-6120 (doi:10.1108/CW-03-2016-0006)

Rajaguru, P., Lu, H., Bailey, C., Ortiz-Gonzalez, J. and Alatise, O. (2016) Electro-thermo-mechanical modelling and analysis of the Press Pack Diode in Power Electronics. In: 2015 21st International Workshop on Thermal Investigations of ICs and Systems (THERMINIC). IEEE, pp. 1-6. ISBN 978-1-4673-9706-3 (doi:10.1109/THERMINIC.2015.7389607)

Rajaguru, P., Lu, H., Bailey, C., Ortiz-Gonzalez, J. and Alatise, O. (2016) Evaluation of the impact of the physical dimensions and material of the semiconductor chip on the reliability of Sn3.5Ag solder interconnect in power electronic module: A finite element analysis perspective. Microelectronics Reliability, 68. pp. 77-85. ISSN 0026-2714 (doi:10.1016/j.microrel.2016.12.002)

Stoyanov, Stoyan, Bailey, Chris and Tourloukis, Georgios (2016) Similarity approach for reducing qualification tests of electronic components. Microelectronics Reliability, 67. pp. 111-119. ISSN 0026-2714 (doi:10.1016/j.microrel.2016.10.017)


Rajaguru, Pushparajah, Lu, Hua and Bailey, Christopher (2015) A time dependent damage indicator model for Sn3.5Ag solder layer in power electronic module. Microelectronics Reliability, 55 (11). pp. 2371-2381. ISSN 0026-2714 (doi:10.1016/j.microrel.2015.07.047)

Stoyanov, S. and Bailey, C. (2015) Modelling the impact of refinishing processes on COTS components for use in aerospace applications. Microelectronics Reliability, 55 (9-10). pp. 1271-1279. ISSN 00262714 (doi:10.1016/j.microrel.2015.07.030)

Yin, Chunyan, Best, Chris, Bailey, Chris and Stoyanov, Stoyan (2015) Statistical analysis of the impact of refinishing process on leaded components. Microelectronics Reliability, 55 (2). pp. 424-431. ISSN 0026-2714 (doi:10.1016/j.microrel.2014.11.001)


Musallam, Mahera, Yin, Chunyan, Bailey, Christopher and Johnson, Mark (2014) Mission profile-based reliability design and real-time life consumption estimation in power electronics. IEEE Transactions on Power Electronics, 30 (5). pp. 2601-2613. ISSN 0885-8993 (Print), 1941-0107 (Online) (doi:10.1109/TPEL.2014.2358555)

Rajaguru, Pushparajah (2014) Reduced order modelling and numerical optimisation approach to reliability analysis of microsystems and power modules. PhD thesis, University of Greenwich.

Rajaguru, Pushparajah, Lu, Hua and Bailey, Christopher (2014) Application of nonlinear fatigue damage models in power electronic module wirebond structure under various amplitude loadings. Advances in Manufacturing, 2 (3). pp. 239-250. ISSN 2095-3127 (Print), 2195-3597 (Online) (doi:10.1007/s40436-014-0054-5)

Tilford, T., Cook, A., Lu, H., Ramambasoa, A. and Conseil, F. (2014) Numerical analysis of the performance of highly oriented pyrolytic graphite heat spreader in thermal management of microelectronics assemblies. In: Electronics Systemintegration Technology Conference, 16-18 Sept 2014, Helsinki, Finland. (doi:10.1109/ESTC.2014.6962815)

Zhu, X., Kotadia, H., Xu, S., Lu, H., Mannan, S. H., Bailey, C. and Chan, Y. C. (2014) Electromigration in Sn-Ag solder thin films under high current density. Thin Solid Films, 565. pp. 193-201. ISSN 0040-6090 (doi:10.1016/j.tsf.2014.06.030)


Rajaguru, Pushparajah, Mason, Peter, Bailey, Christopher and Stoyanov, Stoyan (2012) Structural Analysis on the Riveted Hull of the Paddle Steamer Medway Queen. In: Historic Ships Conference 2012. Royal Institution of Naval Architects (RINA).

This list was generated on Tue Jun 19 19:15:23 2018 BST.