Skip navigation

Items where Faculty / Department / Research Groups is "Faculty of Architecture, Computing & Humanities > Centre for Numerical Modelling & Process Analysis (CNMPA) > Computational Mechanics & Reliability Group (CMRG)"

Items where Faculty / Department / Research Groups is "Faculty of Architecture, Computing & Humanities > Centre for Numerical Modelling & Process Analysis (CNMPA) > Computational Mechanics & Reliability Group (CMRG)"

Up a level
Export as [feed] RSS
Jump to: 2018 | 2017 | 2016 | 2015 | 2014
Number of items at this level: 16.


Rajaguru, P., Lu, H., Bailey, C., Castellazzi, A., Pathirana, V., Udugampola, N. and Udrea, F. (2018) Impact of underfill and other physical dimensions on Silicon Lateral IGBT package reliability using computer model with discrete and continuous design variables. Microelectronics Reliability, 83. pp. 146-156. ISSN 0026-2714 (doi:10.1016/j.microrel.2018.02.024)

Stoyanov, Stoyan, Ahsan, Mominuil and Bailey, Chris (2018) Data analytics approach for optimal qualification testing of electronic components. In: EuroSimE 2018 Proceedings. IEEE Xplore, pp. 1-9. (In Press)


Ortiz Gonzalez, Jose, Alatise, Olayiwola, Aliyu, Attahir, Rajaguru, Pushparajah, Castellazzi, Alberto, Ran, Li, Mawby, Philip and Bailey, Chris (2017) Evaluation of SiC Schottky diodes using pressure contacts. IEEE Transactions on Industrial Electronics, 64 (10). 8213 -8223. ISSN 0278-0046 (Print), 1557-9948 (Online) (doi:10.1109/TIE.2017.2677348)

Rajaguru, P., Bailey, C., Lu, H., Aliyu, A. M., Castellazzi, A., Pathirana, V., Udugampola, N., Trajkovic, T., Udrea, F., Mitcheson, P. D. and Elliott, A. D. T. (2017) Co-Design/Simulation of Flip-Chip Assembly for High Voltage IGBT Packages. In: 23rd International Workshop on Thermal Investigations of ICs and Systems, September 2017, Amsterdam /NL.

Rajaguru, Pushparajah, Ortiz-Gonzalez, Jose Angel, Lu, Hua, Bailey, Chris and Alatise, Olawiwola (2017) A multiphysics modeling and experimental analysis of pressure contacts in power electronics applications. IEEE Transactions on Components, Packaging and Manufacturing Technology, 7 (6). pp. 893-900. ISSN 2156-3950 (Print), 2156-3985 (Online) (doi:10.1109/TCPMT.2017.2688021)


Bailey, C., Stoyanov, S., Tilford, T. and Tourloukis, G. (2016) Modelling methodologies for quality assessment of 3D inkjet printed electronic products. In: 3rd Fraunhofer Direct Digital Manufacturing Conference, DDMC 2016. Proceedings. Fraunhofer Verlag, Stuttgart. ISBN 978-3-8396-9128-1 ISSN 978-3-8396-1001-5 (Online)

Jones, Thomas D.A., Flynn, David, Desmulliez, Marc P.Y., Price, Dennis, Beadel, Matthew, Strusevich, Nadia, Patel, Mayur, Bailey, Chris and Costello, Suzanne (2016) Morphology and acoustic artefacts of copper deposits electroplated using megasonic assisted agitation. Circuit World, 42 (3). pp. 127-140. ISSN 0305-6120 (doi:10.1108/CW-03-2016-0006)

Rajaguru, P., Lu, H., Bailey, C., Ortiz-Gonzalez, J. and Alatise, O. (2016) Evaluation of the impact of the physical dimensions and material of the semiconductor chip on the reliability of Sn3.5Ag solder interconnect in power electronic module: A finite element analysis perspective. Microelectronics Reliability, 68. pp. 77-85. ISSN 0026-2714 (doi:10.1016/j.microrel.2016.12.002)

Stoyanov, Stoyan, Bailey, Chris and Tourloukis, Georgios (2016) Similarity approach for reducing qualification tests of electronic components. Microelectronics Reliability, 67. pp. 111-119. ISSN 0026-2714 (doi:10.1016/j.microrel.2016.10.017)


Rajaguru, Pushparajah, Lu, Hua and Bailey, Christopher (2015) A time dependent damage indicator model for Sn3.5Ag solder layer in power electronic module. Microelectronics Reliability, 55 (11). pp. 2371-2381. ISSN 0026-2714 (doi:10.1016/j.microrel.2015.07.047)

Stoyanov, S. and Bailey, C. (2015) Modelling the impact of refinishing processes on COTS components for use in aerospace applications. Microelectronics Reliability, 55 (9-10). pp. 1271-1279. ISSN 00262714 (doi:10.1016/j.microrel.2015.07.030)

Yin, Chunyan, Best, Chris, Bailey, Chris and Stoyanov, Stoyan (2015) Statistical analysis of the impact of refinishing process on leaded components. Microelectronics Reliability, 55 (2). pp. 424-431. ISSN 0026-2714 (doi:10.1016/j.microrel.2014.11.001)


Musallam, Mahera, Yin, Chunyan, Bailey, Christopher and Johnson, Mark (2014) Mission profile-based reliability design and real-time life consumption estimation in power electronics. IEEE Transactions on Power Electronics, 30 (5). pp. 2601-2613. ISSN 0885-8993 (Print), 1941-0107 (Online) (doi:10.1109/TPEL.2014.2358555)

Rajaguru, Pushparajah (2014) Reduced order modelling and numerical optimisation approach to reliability analysis of microsystems and power modules. PhD thesis, University of Greenwich.

Tilford, T., Cook, A., Lu, H., Ramambasoa, A. and Conseil, F. (2014) Numerical analysis of the performance of highly oriented pyrolytic graphite heat spreader in thermal management of microelectronics assemblies. In: Electronics Systemintegration Technology Conference, 16-18 Sept 2014, Helsinki, Finland. (doi:10.1109/ESTC.2014.6962815)

Zhu, X., Kotadia, H., Xu, S., Lu, H., Mannan, S. H., Bailey, C. and Chan, Y. C. (2014) Electromigration in Sn-Ag solder thin films under high current density. Thin Solid Films, 565. pp. 193-201. ISSN 0040-6090 (doi:10.1016/j.tsf.2014.06.030)

This list was generated on Fri Apr 20 08:14:29 2018 BST.