Items where Author is "Lu, Hua"

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(ACF) accelerated testing ACF acoustics active matrix liquid crystal display adhesives Advanced packaging and integration technologies ageing aging aluminium aluminium wirebonds AMLCD analysis tools analytical techniques anisotropic conductive film anisotropic conductive film (ACF) anisotropic media ANSYS atomic diffusions atomic vacancies atomistic mechanics [e.g. ball grid array (BGA) ball shear test bond strength bonding case study ceramic packaging ceramics CFD chip mountdown solder chip-on-flex (COF) circuit simulator classical continuum mechanics (e.g. classical molecular dynamics (MD)] coatings Coffin-Manson computational modelling computer based simulation computer modelling computer simulation condensed matter: electrical condensed matter: structural condition monitoring conductive particle contact angle contact resistance cooling efficiency copper copper track designs coupling crack propagation creep crystal orientation crystal structure crystal symmetry crystals Cu column current loadings cyclic thermal-mechanical loading damage Damage rule data mining data-driven prognostics DC-DC DC-DC converter DC-DC power converter decision support system degradation demagnetization design design engineers design for manufacture design of experiments methods design-for-reliability dielectric material diffraction experiments diffusion disordered solids dispersion display domain walls effect of reflow process electric-thermal electrical configurations electrical connections electrical power electro thermal model electro-thermal design electro-thermal model electrodeposition electromigration electronic components Electronic Packaging electronic product design electrothermal design EM simulations European Synchrotron Radiation Facility (ESRF) event history analysis fabrication failure failure analysis failure based reliability failure mechanisms failure modes failure modes and mechanisms fatigue FEA finite element finite element (FE) method finite element analysis finite element analysis (FEA) finite element analysis methods Finite Element Analysis(FEA) finite element modeling finite element modelling Flex-No-Lead project flexible substrates flip chip flip chip technology flip-chip flip-chip devices Flotherm XT fluid dynamics flux flux symmetries fracture mechanics fracture propogation path fractures frequency fusion approach geometry globtop globtop design growth rate heatsink IGBT IGBT module IGBT power module industrial partners insulated gate bipolar transistors integrated circuit interconnections integrated circuit modelling integrated circuit reliability integration interactions interfacial reaction phenomena interfacial reactions intermetallic compound intermetallic compound (IMC) intermetallic compound layer intermetallic compounds intermetallic compounds (IMCs) inverter iron iron films isolation substrate jet impingement cooling system joints key design parameters Kriging layered structures LCD displays lead free applications lead free solder lead-free solder lead-free soldering lead-free solders life estimation life prediction life-time light emitting diodes liquid crystal displays lLifetime estimation load-induced thermal cycling magnetic and optical magnetic domains magnetization manufacturing processes Mapping materials properties mathematical model mathematical models mathematical techniques mechanical & thermal metal-hydrogen systems metallic films metal–hydrogen systems Micro-electronic displays micro-manufactured microelectronics microfabricated solenoid inductor microinductor microinductors micromagnetic simulation micromagnetism microsystem design microsystems Miner's linear damage accumulation minium wires model order reduction modeling modelling modelling methodologies modelling technologies modelling tools modules moisture molecular dynamics monitoring Monte Carlo calculations Monte Carlo study morphology Multi-objective optimization multi-physics multi-physics modelling multi-scale simulations multichip modules multiphysics Multiphysics modelling N-body N-body potential nano-techology neutron quasi-elastic scattering nuclear magnetic relaxation Numerical methods numerical modelling Numerical simulation Numerical software one turn inductor optical performance optimal design optimisations optimization optimization of solder optimization tools packaged modules packaging packaging technology parameters Particle Swarm Optimisation performance data photonics physics physics of failure techniques physics-of-failure plastic deformation plastic strain polymers power converters Power cycling power electronic module power electronic modules power electronic modules (PEMs) Power electronics power electronics components power electronics devices power electronics module power electronics modules power electronics modules (PEMs) power module power module components power modules power supply circuits predictive models Press-Pack assembly probabilistic optimisation probability based analytical tools prognostic prognostic methods prognostics and health management prognostics prediction methodology quadratic response quantum mechanics (e.g. radial basis real-time health management real-time thermal models reduced order modelling (ROM) reduced order models reflow reflow soldering Reliability reliability prediction reliability prediction techniques reliability targets remaining life resistors ripple structures risk analysis risk mitigation semiconductor technology shunt silicon carbide simulation simulation of fracture simulation technique simulation tools solder solder degradation solder interconnect solder interface strength Solder joint solder joint failure solder joint fatigue solder joints solder paste solder-mask defined joints soldering solders stable equilibrium structures strain on solder joints stress stress analysis stress and strain distribution Stress comparison substrate delamination substrates surface anisotropy surface morphology surface mount technology surface topography surface treatment synchrotron temperature testing the density functional method) the finite element method) Thermal cycling thermal cycling reliability thermal degradation thermal expansion thermal management thermal modeling thermal-mechanical loading thermo-mechanical Thermo-mechanical analysis thermo-mechanical behaviors thermo-mechanics transport systems underfill vibration virtual prototyping environment viscoplasticity void formation wear-out mechanisms wetting wetting force wide area wire wire bond fatigue wire bonds wire-bond lifting Wire/ribbon bond wirebond X-ray diffraction (XRD) x-rays

Number of items: 503.

(ACF)

Yin, Chunyan ORCID: https://orcid.org/0000-0003-0298-0420, Lu, Hua ORCID: https://orcid.org/0000-0002-4392-6562, Bailey, Chris ORCID: https://orcid.org/0000-0002-9438-3879 and Chan, Yan-Cheong (2005) Moisture effects on the reliability of ACF interconnections. Electronics World, 111 (1836). pp. 20-24. ISSN 1365-4675

accelerated testing

Bailey, Christopher, Tilford, Tim and Lu, Hua (2007) Reliability analysis for power electronics modules. 2007 30th International Spring Seminar On Electronics Technology. Institute of Electrical and Electronics Engineers, Inc., New York, pp. 12-17. ISBN 9781424412174 (doi:10.1109/ISSE.2007.4432813)

ACF

Rizvi, M.J., Bailey, Christopher ORCID: https://orcid.org/0000-0002-9438-3879 and Lu, Hua ORCID: https://orcid.org/0000-0002-4392-6562 (2008) Failure mechanisms of ACF joints under isothermal ageing. Microelectronics Journal, 39 (9). pp. 1101-1107. ISSN 0026-2692 (doi:10.1016/j.mejo.2008.01.045)

acoustics

Xu, Sha, Chan, Yan Cheong, Zhu, Xiaoxin, Lu, Hua ORCID: https://orcid.org/0000-0002-4392-6562 and Bailey, Chris ORCID: https://orcid.org/0000-0002-9438-3879 (2014) Effective method to disperse and incorporate carbon nanotubes in electroless Ni-P deposits. In: 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) Proceedings. Curran Associates, Stoughton, WI, USA, pp. 1342-1347. ISBN 9781479924080 (doi:10.1109/ECTC.2014.6897466)

active matrix liquid crystal display

Lee, Yek, Bailey, Christopher ORCID: https://orcid.org/0000-0002-9438-3879, Lu, Hua ORCID: https://orcid.org/0000-0002-4392-6562, Riches, Steve, Bartholomew, Martin and Tebbit, Nigel (2006) Thermo-mechanical analysis of the packaging process for micro-electronic displays. 7th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2006. EuroSime 2006. IEEE Computer Society, pp. 190-195. ISBN 1 4244 0275 1 (doi:10.1109/ESIME.2006.1644051)

adhesives

Bailey, Christopher, Rizvi, M.J., Yin, Chunyan, Lu, Hua and Stoyanov, Stoyan (2007) Application of modelling for predicting the behaviour of polymers and adhesives in microelectronic and photonic devices. 6th International Conference on Polymers and Adhesives in Microelectronics and Photonics. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 240-244. ISBN 9781424411863 (doi:10.1109/POLYTR.2007.4339175)

Yin, Chunyan ORCID: https://orcid.org/0000-0003-0298-0420, Lu, Hua ORCID: https://orcid.org/0000-0002-4392-6562, Bailey, Chris ORCID: https://orcid.org/0000-0002-9438-3879 and Chan, Yan-Cheong (2004) Effects of solder reflow on the reliability of flip-chip on flex interconnections using anisotropic conductive adhesives. IEEE Transactions on Electronics Packaging Manufacturing, 27 (4). pp. 254-259. ISSN 1521-334X (doi:10.1109/TEPM.2004.843152)

Advanced packaging and integration technologies

Bailey, Christopher ORCID: https://orcid.org/0000-0002-9438-3879, Stoyanov, Stoyan ORCID: https://orcid.org/0000-0001-6091-1226 and Lu, Hua ORCID: https://orcid.org/0000-0002-4392-6562 (2017) Co-design And Modelling For Advanced Integration And Packaging: Manufacturing And Reliability. Wspc Series In Advanced Integration And Packaging . World Scientific Publishing. ISBN 978-9814740203 ISSN 2315-473X (doi:10.1142/9900)

ageing

aging

Rizvi, M.J., Bailey, Christopher ORCID: https://orcid.org/0000-0002-9438-3879, Chan, Y.C., Islam, M. and Lu, Hua ORCID: https://orcid.org/0000-0002-4392-6562 (2007) Effect of adding 0.3wt% Ni into the Sn-0.7wt% Cu solder - Part II: Growth of intermetallic layer with Cu during wetting and aging. Journal of Alloys and Compounds, 438 (1-2). pp. 122-128. ISSN 0925-8388 (doi:10.1016/j.jallcom.2006.08.071)

Rizvi, M.J., Chan, Y.C., Bailey, Christopher ORCID: https://orcid.org/0000-0002-9438-3879, Lu, Hua ORCID: https://orcid.org/0000-0002-4392-6562 and Islam, M.N. (2006) Effect of adding 1 wt% Bi into the Sn–2.8Ag–0.5Cu solder alloy on the intermetallic formations with Cu-substrate during soldering and isothermal aging. Journal of Alloys and Compounds, 407 (1-2). pp. 208-214. ISSN 0925-8388 (doi:10.1016/j.jallcom.2005.06.050)

aluminium

Lu, Hua ORCID: https://orcid.org/0000-0002-4392-6562, Loh, Wei-Sun, Bailey, Christopher ORCID: https://orcid.org/0000-0002-9438-3879 and Johnson, C. Mark (2008) Computer simulation of aluminium wirebonds with globtop in power electronics modules. 3rd International Microsystems, Packaging, Assembly & Circuits Technology Conference, 2008. IMPACT 2008. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 348-351. ISBN 978-1-4244-3623-1 (doi:10.1109/IMPACT.2008.4783883)

aluminium wirebonds

Lu, Hua ORCID: https://orcid.org/0000-0002-4392-6562, Loh, Wei-Sun, Bailey, Christopher ORCID: https://orcid.org/0000-0002-9438-3879 and Johnson, C. Mark (2008) Computer modelling analysis of the globtop's effects on aluminium wirebond reliability. 2nd Electronics System-Integration Technology Conference, 2008. ESTC 2008. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 1369-1373. ISBN 978-1-4244-2814-4 (Print) 978-1-4244-2813-7 (Online) (doi:10.1109/ESTC.2008.4684555)

AMLCD

Lee, Yek, Bailey, Christopher ORCID: https://orcid.org/0000-0002-9438-3879, Lu, Hua ORCID: https://orcid.org/0000-0002-4392-6562, Riches, Steve, Bartholomew, Martin and Tebbit, Nigel (2006) Analysis of the thermo mechanical effects on packaging process of performance enhanced AMLCD's and the optical performance of the display. Proceedings of the 1st Electronics Systemintegration Technology Conference, 2006. IEEE, pp. 1214-1217. ISBN 9781424405527 (doi:10.1109/ESTC.2006.280164)

analysis tools

Bailey, Christopher ORCID: https://orcid.org/0000-0002-9438-3879, Lu, Hua ORCID: https://orcid.org/0000-0002-4392-6562, Stoyanov, Stoyan ORCID: https://orcid.org/0000-0001-6091-1226, Tilford, Timothy, Xue, Xiangdong, Alam, M. O., Yin, Chunyan ORCID: https://orcid.org/0000-0003-0298-0420 and Hughes, Michael (2008) Modelling technologies and applications. In: Morris, James E., (ed.) Nanopackaging: Nanotechnologies and Electronics Packaging. Springer Science+Business Media, LLC, New York, USA, pp. 15-38. ISBN 978-0-387-47325-3 (Print) 978-0-387-47326-0 (Online) (doi:10.1007/978-0-387-47325-3_2)

analytical techniques

Xue, Xiangdong, Bailey, Chris ORCID: https://orcid.org/0000-0002-9438-3879, Lu, Hua ORCID: https://orcid.org/0000-0002-4392-6562 and Stoyanov, Stoyan ORCID: https://orcid.org/0000-0001-6091-1226 (2011) Integration of analytical techniques in stochastic optimization of microsystem reliability. Microelectronics Reliability, 51 (5). pp. 936-945. ISSN 0026-2714 (doi:10.1016/j.microrel.2011.01.008)

anisotropic conductive film

anisotropic conductive film (ACF)

Rizvi, M.J., Bailey, Christopher ORCID: https://orcid.org/0000-0002-9438-3879, Chan, Y.C. and Lu, Hua ORCID: https://orcid.org/0000-0002-4392-6562 (2006) Effects of thermal cycling profiles on the performance of chip-on-flex assembly using anisotropic conductive films. Thermal and Thermomechanical Phenomena in Electronics Systems, 2006. ITHERM '06. The Tenth Intersociety Conference on. IEEE, pp. 855-860. ISBN 0780395247 (doi:10.1109/ITHERM.2006.1645436)

Yin, C.Y. ORCID: https://orcid.org/0000-0003-0298-0420, Alam, M.O., Chan, Y.C., Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879 and Lu, Hua ORCID: https://orcid.org/0000-0002-4392-6562 (2003) The effect of reflow process on the contact resistance and reliability of anisotropic conductive film interconnection for flip chip on flex applications. Microelectronics Reliability, 43 (4). pp. 625-633. ISSN 0026-2714 (doi:10.1016/S0026-2714(02)00348-7)

anisotropic media

Yin, Chunyan ORCID: https://orcid.org/0000-0003-0298-0420, Lu, Hua ORCID: https://orcid.org/0000-0002-4392-6562, Bailey, Chris ORCID: https://orcid.org/0000-0002-9438-3879 and Chan, Yan-Cheong (2004) Effects of solder reflow on the reliability of flip-chip on flex interconnections using anisotropic conductive adhesives. IEEE Transactions on Electronics Packaging Manufacturing, 27 (4). pp. 254-259. ISSN 1521-334X (doi:10.1109/TEPM.2004.843152)

ANSYS

Nwanoro, Kenneth C., Lu, Hua ORCID: https://orcid.org/0000-0002-4392-6562, Yin, Chunyan ORCID: https://orcid.org/0000-0003-0298-0420 and Bailey, Chris ORCID: https://orcid.org/0000-0002-9438-3879 (2018) Using FloTHERM XT and ANSYS workbench to perform Thermo-Mechanical analysis. Engineering Edge. (In Press)

atomic diffusions

Zhu, Xiaoxin, Kotadia, H., Xu, Sha, Lu, Hua ORCID: https://orcid.org/0000-0002-4392-6562, Mannan, S.H., Chan, Y.C. and Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879 (2011) Multi-physics computer simulation of the electromigration phenomenon. In: ICEPT-HDP 2011 Proceedings - 2011 International Conference on Electronic Packaging Technology and High Density Packaging. IEEE Computer Society, Piscataway, USA, pp. 448-452. ISBN 9781457717703 (Print), 9781457717680 (Online) (doi:10.1109/ICEPT.2011.6066874)

atomic vacancies

atomistic mechanics [e.g.

Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879 and Lu, Hua ORCID: https://orcid.org/0000-0002-4392-6562 (2009) Nanopackaging simulation: properties and behavior of packaging materials. Nanotechnology Magazine, 3 (2). pp. 34-37. ISSN 1932-4510 (doi:10.1109/MNANO.2009.932413)

ball grid array (BGA)

Alam, M. O., Lu, Hua ORCID: https://orcid.org/0000-0002-4392-6562, Bailey, Christopher ORCID: https://orcid.org/0000-0002-9438-3879, Chan, Y.C. and Wu, B.Y. (2007) Shear strength analysis of ball grid array (BGA) solder interfaces. In: Vaidyanathan, K., Tee, T.Y. and Lee, T.K., (eds.) 2007 9th Electronics Packaging Technology Conference. Electronics Packaging Technology Conference Proceedings . Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 770-773. ISBN 9781424413249 (doi:11.1109/EPTC.2007.4469797)

ball shear test

bond strength

bonding

Patil, Nishad, Das, Diganta, Yin, Chunyan ORCID: https://orcid.org/0000-0003-0298-0420, Lu, Hua ORCID: https://orcid.org/0000-0002-4392-6562, Bailey, Chris ORCID: https://orcid.org/0000-0002-9438-3879 and Pecht, Michael (2009) A fusion approach to IGBT power module prognostics. In: 10th International Conference on Thermal, Mechanical and Multi-Physics simulation and Experiments in Microelectronics and Microsystems, 2009. EuroSimE 2009. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 195-199. ISBN 9781424441600 (doi:10.1109/ESIME.2009.4938491)

case study

Xue, Xiangdong, Lu, Hua and Bailey, Christopher (2007) A modelling approach for coupling numerical analytical techniques applied in microsystems. ICEPT: 2007 8th International Conference On Electronics Packaging Technology, Proceedings. Institute of Electrical and Electronics Engineers, Inc., New York, pp. 204-211. ISBN 9781424413911 (doi:10.1109/ICEPT.2007.4441412)

ceramic packaging

Warner, Matt, Parry, John, Bailey, Chris ORCID: https://orcid.org/0000-0002-9438-3879 and Lu, Hua ORCID: https://orcid.org/0000-0002-4392-6562 (2004) Solder life prediction in a thermal analysis software environment. In: The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena In Electronic Systems (ITHERM 2004) [Proceedings]. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 391-396. ISBN 0780383575 ISSN 1089-9870 (doi:10.1109/ITHERM.2004.1318309)

ceramics

CFD

Nwanoro, Kenneth Chimezie, Lu, Hua ORCID: https://orcid.org/0000-0002-4392-6562, Yin, Chunyan ORCID: https://orcid.org/0000-0003-0298-0420 and Bailey, Christopher ORCID: https://orcid.org/0000-0002-9438-3879 (2018) Numerical simulation of the junction temperature, the coolant flow rate and the reliability of an IGBT module. In: 2018 24th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC 2018). IEEE, pp. 250-255. ISBN 978-1538667606

chip mountdown solder

Lu, Hua, Tilford, Tim, Xue, Xiangdong and Bailey, Christopher (2007) Thermal-mechanical modelling of power electronic module packaging. In: Ernst, L.J., Zhang, G.Q., Rodgers, P., Meuwissen, M., Marco, S., Van Driel, W.D. and De Saint Leger, O., (eds.) EUROSIME 2007: Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, Proceedings. Institute of Electrical and Electronics Engineers, Inc., New York, pp. 317-322. ISBN 9781424411054 (doi:10.1109/ESIME.2007.359960)

chip-on-flex (COF)

circuit simulator

Shahjalal, Mohammad, Rishad Ahmed, MD, Lu, Hua ORCID: https://orcid.org/0000-0002-4392-6562, Bailey, Chris ORCID: https://orcid.org/0000-0002-9438-3879 and Forsyth, Andrew (2020) An analysis of the thermal interaction between components in power converter applications. IEEE Transactions on Power Electronics, 35 (9). pp. 9082-9094. ISSN 0885-8993 (Print), 1941-0107 (Online) (doi:10.1109/TPEL.2020.2969350)

Shahjalal, Mohammad, Lu, Hua ORCID: https://orcid.org/0000-0002-4392-6562 and Bailey, Christopher ORCID: https://orcid.org/0000-0002-9438-3879 (2017) Electro-thermal modelling of multi chip power modules for high power converter application. In: 2017 18th International Conference on Electronic Packaging Technology (ICEPT), Harbin. IEEE, pp. 940-945. ISBN 978-1-5386-2973-4 (doi:10.1109/ICEPT.2017.8046599)

classical continuum mechanics (e.g.

classical molecular dynamics (MD)]

coatings

Coffin-Manson

Lu, Hua ORCID: https://orcid.org/0000-0002-4392-6562 and Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879 (2000) Material properties, geometry and their effect on the fatigue life of two flip-chip models. In: ITHERM Proceedings. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 65-71. ISBN 0780359127 ISSN 0189-9870 (doi:10.1109/ITHERM.2000.866172)

computational modelling

Cross, Mark, Stoyanov, Stoyan ORCID: https://orcid.org/0000-0001-6091-1226, Mouchmov, Apostol, Lu, Hua ORCID: https://orcid.org/0000-0002-4392-6562, Croft, Nick, Slone, Avril, Williams, Alison, Bailey, Chris ORCID: https://orcid.org/0000-0002-9438-3879 and Pericleous, Koulis ORCID: https://orcid.org/0000-0002-7426-9999 (2003) Multi-physics-multi-scale simulation and optimisation: the next generation. In: NAFEMS World Congress, 2003, Orlando, Florida, USA.

computer based simulation

Shahjalal, Mohammad, Lu, Hua ORCID: https://orcid.org/0000-0002-4392-6562 and Bailey, Chris ORCID: https://orcid.org/0000-0002-9438-3879 (2014) A review of the computer based simulation of electro-thermal design of power electronics devices. In: 20th International Workshop on Thermal Investigations of ICs and Systems. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA. ISBN 9781479954155 (doi:10.1109/THERMINIC.2014.6972515)

computer modelling

Lu, Hua ORCID: https://orcid.org/0000-0002-4392-6562, Loh, Wei-Sun, Bailey, Christopher ORCID: https://orcid.org/0000-0002-9438-3879 and Johnson, C. Mark (2008) Computer modelling analysis of the globtop's effects on aluminium wirebond reliability. 2nd Electronics System-Integration Technology Conference, 2008. ESTC 2008. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 1369-1373. ISBN 978-1-4244-2814-4 (Print) 978-1-4244-2813-7 (Online) (doi:10.1109/ESTC.2008.4684555)

Rizvi, M.J., Bailey, Christopher ORCID: https://orcid.org/0000-0002-9438-3879, Chan, Y.C. and Lu, Hua ORCID: https://orcid.org/0000-0002-4392-6562 (2006) Comparative wetting behavior of Sn-0.7Cu and Sn-0.7Cu-0.3Ni solders on Cu and Ni substrates. 1st Electronics Systemintegration Technology Conference. Dresden, Saxony, Germany. 2006 proceedings. IEEE, Piscataway, NJ, USA, pp. 145-151. ISBN 142440553X (doi:10.1109/ITHERM.2006.1645436)

computer simulation

Lu, Hua, Ridout, Stephen, Bailey, Christopher, Loh, Wei-Sun, Pearl, Agyakwa and Johnson, C. Mark (2008) Computer simulation of crack propagation in power electronics module solder joints. International Conference on Electronic Packaging Technology & High Density Packaging, 2008. ICEPT-HDP 2008. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 1-6. ISBN 978-1-4244-2740-6 (print) 978-1-4244-2739-0 (online) (doi:10.1109/ICEPT.2008.4606983)

Lu, Hua ORCID: https://orcid.org/0000-0002-4392-6562, Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879 and Cross, M. (2000) Reliability analysis of flip chip designs via computer simulation. Journal of Electronic Packaging, 122 (3). pp. 214-219. ISSN 1528-9044 (Print), 1043-7398 (Online) (doi:10.1115/1.1286122)

Lu, Hua ORCID: https://orcid.org/0000-0002-4392-6562, Bishop, J.E.L. and Tucker, J.W. (1996) Simulation of transverse and longitudinal magnetic ripple structures induced by surface anisotropy. Journal of Magnetism and Magnetic Materials, 163 (3). pp. 285-291. ISSN 0304-8853 (doi:10.1016/S0304-8853(96)00345-9)

Lu, Hua ORCID: https://orcid.org/0000-0002-4392-6562, Bishop, J.E.L. and Tucker, J.W. (1996) Micromagnetic simulation of domain walls in iron films. Journal of Magnetism and Magnetic Materials, 155 (1-3). pp. 49-51. ISSN 0304-8853 (doi:10.1016/0304-8853(95)00665-6)

condensed matter: electrical

Lu, Hua ORCID: https://orcid.org/0000-0002-4392-6562, Zhang, Xiaohong and Titman, J.M. (1997) Rotating-frame nuclear magnetic relaxation of spins diffusing on a disordered lattice: a Monte Carlo model. Journal of Physics: Condensed Matter, 9 (42). pp. 9097-9111. ISSN 0953-8984 (Print), 1361-648X (Online) (doi:10.1088/0953-8984/9/42/022)

condensed matter: structural

condition monitoring

conductive particle

contact angle

Rizvi, M.J., Bailey, Christopher ORCID: https://orcid.org/0000-0002-9438-3879, Chan, Y.C. and Lu, Hua ORCID: https://orcid.org/0000-0002-4392-6562 (2007) Effect of adding 0.3 wt% Ni into the Sn–0.7 wt%Cu solder: part I: wetting behavior on Cu and Ni substrates. Journal of Alloys and Compounds, 438 (1-2). pp. 116-121. ISSN 0925-8388 (doi:10.1016/j.jallcom.2006.08.048)

contact resistance

cooling efficiency

Rizvi, M.J., Skuriat, R., Tilford, Tim ORCID: https://orcid.org/0000-0001-8307-6403, Bailey, Christopher ORCID: https://orcid.org/0000-0002-9438-3879, Johnson, C. Mark and Lu, Hua ORCID: https://orcid.org/0000-0002-4392-6562 (2009) Modelling of jet-impingement cooling for power electronics. In: 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, 2009. EuroSimE 2009. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA. ISBN 978-1-4244-4160-0 (doi:10.1109/ESIME.2009.4938428)

copper

Newcombe, D.R., Chamund, Dinesh, Bailey, Christopher ORCID: https://orcid.org/0000-0002-9438-3879 and Lu, Hua ORCID: https://orcid.org/0000-0002-4392-6562 (2010) Reliability metrics for IGBT power modules. In: Proceedings - 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2010. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 670-674. ISBN 9781424481408 (doi:10.1109/ICEPT.2010.5582869)

Rizvi, M.J., Lu, Hua ORCID: https://orcid.org/0000-0002-4392-6562 and Bailey, Christopher ORCID: https://orcid.org/0000-0002-9438-3879 (2009) Modeling the diffusion of solid copper into liquid solder alloys. Thin Solid Films, 517 (5). pp. 1686-1689. ISSN 0040-6090 (doi:10.1016/j.tsf.2008.09.105)

Lu, Hua ORCID: https://orcid.org/0000-0002-4392-6562 and Bailey, Chris ORCID: https://orcid.org/0000-0002-9438-3879 (2003) Modelling the performance of lead-Free solder interconnects for copper bumped flip-chip devices. In: ASME 2003 International Electronic Packaging Technical Conference and Exhibition. American Society of Mechanical Engineers, New York, USA, pp. 605-610. ISBN 0-7918-3690-8 (doi:10.1115/IPACK2003-35356)

copper track designs

Rizvi, M.J., Yin, Chunyan, Bailey, Christopher and Lu, Hua (2007) Modelling the reliability of components on flexible substrates. IPACK 2007: proceedings of the ASME Interpack Conference 2007. American Society of Mechanical Engineers, New York, pp. 375-380. ISBN 9780791842775 (doi:10.1115/IPACK2007-33820)

coupling

crack propagation

Rafii-Tabar, Hashem, Lu, Hua ORCID: https://orcid.org/0000-0002-4392-6562 and Cross, Mark (1998) A multi-scale atomistic-continuum modelling of crack propagation in a two-dimensional macroscopic plate. Journal of Physics: Condensed Matter, 10 (11). pp. 2375-2387. ISSN 0953-8984 (Print), 1361-648X (Online) (doi:10.1088/0953-8984/10/11/003)

creep

crystal orientation

crystal structure

crystal symmetry

crystals

Cu column

Lu, Hua ORCID: https://orcid.org/0000-0002-4392-6562 and Bailey, Christopher ORCID: https://orcid.org/0000-0002-9438-3879 (2002) Computer modelling of the reliability of flip chips with metal column bumping. In: ITHERM 2002. The Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems [Proceedings]. Institute of Electrical and Electronics Engineers, Inc., pp. 967-973. ISBN 0780371526 (doi:10.1109/ITHERM.2002.1012561)

current loadings

cyclic thermal-mechanical loading

Lu, Hua, Tilford, Tim, Bailey, Christopher and Newcombe, David (2007) Lifetime prediction for power electronics module substrate mount-down solder interconnect. HDP'07: Proceedings Of The 2007 International Symposium On High Density Packaging And Microsystem Integration. Institute of Electrical and Electronics Engineers, Inc., New York, pp. 40-45. ISBN 9781424412525 (doi:10.1109/HDP.2007.4283558)

damage

Rajaguru, Pushpa ORCID: https://orcid.org/0000-0002-6041-0517, Lu, Hua ORCID: https://orcid.org/0000-0002-4392-6562 and Bailey, Chris ORCID: https://orcid.org/0000-0002-9438-3879 (2019) Time integration damage model for Sn3.5Ag solder interconnect in power electronic module. IEEE Transactions on Device and Materials Reliability, 19 (1). ISSN 1530-4388 (Print), 1558-2574 (Online) (doi:10.1109/TDMR.2019.2891949)

Rajaguru, Pushparajah ORCID: https://orcid.org/0000-0002-6041-0517, Lu, Hua ORCID: https://orcid.org/0000-0002-4392-6562 and Bailey, Christopher ORCID: https://orcid.org/0000-0002-9438-3879 (2015) A time dependent damage indicator model for Sn3.5Ag solder layer in power electronic module. Microelectronics Reliability, 55 (11). pp. 2371-2381. ISSN 0026-2714 (doi:10.1016/j.microrel.2015.07.047)

Damage rule

Rajaguru, Pushparajah ORCID: https://orcid.org/0000-0002-6041-0517, Lu, Hua ORCID: https://orcid.org/0000-0002-4392-6562 and Bailey, Christopher ORCID: https://orcid.org/0000-0002-9438-3879 (2014) Application of nonlinear fatigue damage models in power electronic module wirebond structure under various amplitude loadings. Advances in Manufacturing, 2 (3). pp. 239-250. ISSN 2095-3127 (Print), 2195-3597 (Online) (doi:10.1007/s40436-014-0054-5)

data mining

Musallam, Mahera, Johnson, C. Mark, Yin, Chunyan ORCID: https://orcid.org/0000-0003-0298-0420, Lu, Hua ORCID: https://orcid.org/0000-0002-4392-6562 and Bailey, Chris ORCID: https://orcid.org/0000-0002-9438-3879 (2008) Real-time life expectancy estimation in power modules. In: 2nd Electronics System Integration Technology Conference, Greenwich, UK. IEEE Conference Publications, 1 . Institute of Electrical and Electronics Engineers, Inc, Piscataway, NJ, USA, pp. 231-236. ISBN 978-1-4244-2813-7 (Print), 978-1-4244-2814-4 (Electronic) (doi:10.1109/ESTC.2008.4684355)

data-driven prognostics

Kabir, Ahsanul, Bailey, Christopher ORCID: https://orcid.org/0000-0002-9438-3879, Lu, Hua ORCID: https://orcid.org/0000-0002-4392-6562 and Stoyanov, Stoyan ORCID: https://orcid.org/0000-0001-6091-1226 (2012) A review of data-driven prognostics in power electronics. In: 2012 35th International Spring Seminar on Electronics Technology. IEEE Conference Publications . Institute of Electrical and Electronic Engineers, Inc., Piscataway, N.J., USA, pp. 189-192. ISBN 978-1-4673-2241-6 (Print), 978-1-4673-2239-3 (Online) ISSN 2161-2528 (doi:10.1109/ISSE.2012.6273136)

DC-DC

Flynn, David, Lu, Hua ORCID: https://orcid.org/0000-0002-4392-6562, Bailey, Christopher ORCID: https://orcid.org/0000-0002-9438-3879 and Desmulliez, Marc P.Y. (2006) Assessment of microInductors for DC-DC converters. Proceedings of 2006 International Conference on Electronic Materials and Packaging (EMAP 2006). IEEE. ISBN 978-1-4244-0834-4

Lu, Hua ORCID: https://orcid.org/0000-0002-4392-6562, Flynn, David, Bailey, Christopher ORCID: https://orcid.org/0000-0002-9438-3879 and Desmulliez, M.Y. (2006) An analysis of a microfabricated solenoid inductor. Proceedings of the 1st Electronics Systemintegration Technology Conference, 2006. IEEE, pp. 556-561. ISBN 1 4244 0552 1 (doi:10.1109/ESTC.2006.280058)

DC-DC converter

DC-DC power converter

Flynn, David, Lu, Hua ORCID: https://orcid.org/0000-0002-4392-6562, Bailey, Chris ORCID: https://orcid.org/0000-0002-9438-3879 and Desmulliez, Marc P.Y. (2008) Design, modeling and characterization of a microinductor for future DC-DC power converters. In: 2nd Electronics System-Integration Technology Conference, 2008. ESTC 2008. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 577-582. ISBN 978-1-4244-2814-4 (print), 978-1-4244-2813-7 (online) (doi:10.1109/ESTC.2008.4684414)

decision support system

Tang, Y.K., Stoyanov, Stoyan ORCID: https://orcid.org/0000-0001-6091-1226, Bailey, Christopher ORCID: https://orcid.org/0000-0002-9438-3879 and Lu, Hua ORCID: https://orcid.org/0000-0002-4392-6562 (2006) Decision support systems for eco-friendly electronic products. Electronic Materials and Packaging, 2006. EMAP 2006. International Conference on. IEEE, Piscataway, N.J., pp. 77-84. ISBN 1424408342; 9781424408344 (doi:10.1109/EMAP.2006.4430580)

degradation

demagnetization

design

design engineers

Bailey, Chris ORCID: https://orcid.org/0000-0002-9438-3879, Lu, Hua ORCID: https://orcid.org/0000-0002-4392-6562 and Yin, Chunyan ORCID: https://orcid.org/0000-0003-0298-0420 (2010) Modelling reliability of power electronics packaging. In: Proceedings of the ASME InterPack Conference 2009, IPACK2009. American Society of Mechanical Engineers, New York, USA, pp. 215-220. ISBN 9780791843604 (doi:10.1115/InterPACK2009-89430)

design for manufacture

Bailey, Chris ORCID: https://orcid.org/0000-0002-9438-3879, Lu, Hua ORCID: https://orcid.org/0000-0002-4392-6562, Yin, Chunyan and Tilford, Timothy (2008) Integrated reliability and prognostics prediction methodology for power electronic modules. In: IET Seminar on Aircraft Health Management for New Operational and Enterprise Solutions. IET Digest, 2008/1 . The Institution of Engineering and Technology, Stevenage, UK, pp. 1-39. ISBN 978-0-86341-936-2 ISSN 0537-9989 (doi:10.1049/ic:20080638)

design of experiments methods

Lu, Hua ORCID: https://orcid.org/0000-0002-4392-6562 and Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879 (2011) Optimisation of heatsink design for a ruggedised LCD display. In: 2011 International Conference on Electronic Packaging Technology & High Density Packaging. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 492-496. ISBN 9781457717703 (doi:10.1109/ICEPT.2011.6066883)

design-for-reliability

dielectric material

diffraction experiments

Hoo, Nick, Jackson, Gavin, Hendriksen, Mike, Lu, Hua ORCID: https://orcid.org/0000-0002-4392-6562, Durairaj, Rajkumar, Bailey, Chris ORCID: https://orcid.org/0000-0002-9438-3879, Ekere, Ndy and Wright, Jonathon (2004) In-situ synchrotron x-ray diffraction during melting and solidification of a lead-free solder paste. In: TMS 2004 133rd TMS Annual Meeting & Exhibition 2004, 14-18 Mar 2004, Charlotte, North Carolina, USA. (Unpublished)

diffusion

disordered solids

Lu, Hua ORCID: https://orcid.org/0000-0002-4392-6562, Zhang, Xiaohong and Titman, J.M. (2000) Neutron quasi-elastic scattering in disordered solids: a Monte Carlo study of metal-hydrogen systems. Journal of Physics: Condensed Matter, 12 (11). pp. 2379-2391. ISSN 0953-8984 (Print), 1361-648X (Online) (doi:10.1088/0953-8984/12/11/304)

dispersion

display

Bailey, Chris ORCID: https://orcid.org/0000-0002-9438-3879, Lu, Hua ORCID: https://orcid.org/0000-0002-4392-6562, Yin, Chunyan ORCID: https://orcid.org/0000-0003-0298-0420 and Lee, Yek (2010) Multi-physics modelling for packaging of liquid crystal displays in harsh environments. In: Electronics System Integration Technology Conference, ESTC 2010 - Proceedings. IEEE Computer Society, Piscataway, USA, pp. 1-6. ISBN 9781424485536 (Print), 9781424485543 (Online) (doi:10.1109/ESTC.2010.5642898)

domain walls

effect of reflow process

electric-thermal

Evans, Paul, Castellazzi, Alberto, Johnson, C. Mark, Lu, Hua ORCID: https://orcid.org/0000-0002-4392-6562 and Bailey, Chris ORCID: https://orcid.org/0000-0002-9438-3879 (2014) The optimization of thermal performance in power electronics modules. In: 2014 15th International Conference on Electronic Packaging Technology. Institute of Electrical and Electronics, Inc., Piscataway, NJ, USA, pp. 734-739. ISBN 978-1-4799-4707-2 (doi:10.1109/ICEPT.2014.6922755)

electrical configurations

Lu, Hua, Loh, Wei-Sun, Tilford, Tim, Johnson, M. and Bailey, Christopher (2007) Reliability of power electronic modules. ASME 2007 InterPACK Conference. American Society of Mechanical Engineers, New York, pp. 883-888. ISBN 0791842789 (doi:10.1115/IPACK2007-33817)

electrical connections

Yin, Chunyan ORCID: https://orcid.org/0000-0003-0298-0420, Lu, Hua ORCID: https://orcid.org/0000-0002-4392-6562, Bailey, Christopher ORCID: https://orcid.org/0000-0002-9438-3879 and Chan, Y.C. (2006) Macro-micro modelling of moisture induced stresses in an ACF flip chip assembly. Soldering & Surface Mount Technology, 18 (2). pp. 27-32. ISSN 0954-0911 (doi:10.1108/09540910610665107)

electrical power

electro thermal model

electro-thermal design

electro-thermal model

electrodeposition

electromigration

Zhu, Xiao, Kotadia, Hiren, Xu, Sha, Lu, Hua ORCID: https://orcid.org/0000-0002-4392-6562, Mannan, Samjid, Bailey, Chris ORCID: https://orcid.org/0000-0002-9438-3879 and Chan, Yancheong (2013) Modelling electromigration for microelectronics design. Journal of Computational Science and Technology, 7 (2). pp. 251-264. ISSN 1881-6894 (doi:10.1299/jcst.7.251)

electronic components

Bailey, Christopher, Lu, Hua, Stoyanov, Stoyan, Yin, Chunyan, Tilford, Tim and Ridout, Stephen (2008) Predictive reliability and prognostics for electronic components: current capabilities and future challenges. 31st International Spring Seminar on Electronics Technology, 2008. ISSE '08. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 67-72. ISBN 978-1-4244-3972-0 (doi:10.1109/ISSE.2008.5276460)

Electronic Packaging

Rajaguru, Pushparajah ORCID: https://orcid.org/0000-0002-6041-0517, Ortiz-Gonzalez, Jose Angel, Lu, Hua ORCID: https://orcid.org/0000-0002-4392-6562, Bailey, Chris ORCID: https://orcid.org/0000-0002-9438-3879 and Alatise, Olawiwola (2017) A multiphysics modeling and experimental analysis of pressure contacts in power electronics applications. IEEE Transactions on Components, Packaging and Manufacturing Technology, 7 (6). pp. 893-900. ISSN 2156-3950 (Print), 2156-3985 (Online) (doi:10.1109/TCPMT.2017.2688021)

Shishido, Nobuyuki, Kanno, Toshifumi, Kawahara, Shinya, Ikeda, Toru, Miyazaki, Noriyuki, Lu, Hua ORCID: https://orcid.org/0000-0002-4392-6562, Bailey, Chris ORCID: https://orcid.org/0000-0002-9438-3879, Thomas, Owen, Di Maio, Davide and Hunt, Chris (2010) An analysis of local deformation of SnAgCu solder joint using digital image correlation. In: Proceedings - 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2010. Association for Computing Machinery, New York, pp. 376-381. ISBN 9781424481408 (doi:10.1109/ICEPT.2010.5582845)

electronic product design

electrothermal design

EM simulations

European Synchrotron Radiation Facility (ESRF)

Jackson, Gavin J., Lu, Hua ORCID: https://orcid.org/0000-0002-4392-6562, Durairaj, Raj, Hoo, Nick, Bailey, Chris ORCID: https://orcid.org/0000-0002-9438-3879, Ekere, Ndy N. and Wright, Jon (2004) Intermetallic phase detection in lead-free solders using synchrotron X-ray diffraction. Journal of Electronic Materials, 33 (12). pp. 1524-1529. ISSN 0361-5235 (Print), 1543-186X (Online) (doi:10.1007/s11664-004-0094-x)

event history analysis

fabrication

failure

Kamara, Elisha, Lu, Hua ORCID: https://orcid.org/0000-0002-4392-6562, Bailey, Chris ORCID: https://orcid.org/0000-0002-9438-3879, Hunt, Chris, Di Maio, Davide and Thomas, Owen (2010) Computer simulation and design of a solder joint vibration test machine. In: 2010 11th International Conference on Thermal, Mechanical and Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems, EuroSimE 2010. IEEE Conference Publications . Institute of Electrical and Electronic Engineers, Inc., Piscataway, NJ, USA. ISBN 978-1-4244-7026-6 (doi:10.1109/ESIME.2010.5464587)

Lu, Hua ORCID: https://orcid.org/0000-0002-4392-6562 and Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879 (2009) Lifetime prediction of an IGBT power electronics module under cyclic temperature loading conditions. In: Electronic Packaging Technology & High Density Packaging, 2009. ICEPT-HDP '09. International Conference on. Institute of Electrical and Electronics Engineers, Piscataway, NJ USA, pp. 274-279. ISBN 9781424446582 (print), 9781424446599 (doi:10.1109/ICEPT.2009.5270749)

failure analysis

Lu, Hua ORCID: https://orcid.org/0000-0002-4392-6562 and Bailey, Christopher ORCID: https://orcid.org/0000-0002-9438-3879 (2017) Failure and reliability analysis of a SiC power module based on stress comparison to a Si device. IEEE Transactions on Device and Materials Reliability, 17 (4). pp. 727-737. ISSN 1530-4388 (doi:10.1109/TDMR.2017.2766692)

Alam, M.O., Lu, Hua ORCID: https://orcid.org/0000-0002-4392-6562, Bailey, Chris ORCID: https://orcid.org/0000-0002-9438-3879 and Chan, Y.C (2009) Finite-element simulation of stress intensity factors in solder joint intermetallic compounds. IEEE Transactions on Device and Materials Reliability, 9 (1). pp. 40-48. ISSN 1530-4388 (doi:10.1109/TDMR.2008.2010595)

failure based reliability

failure mechanisms

failure modes

failure modes and mechanisms

Bailey, Christopher, Lu, Hua and Tilford, Tim (2007) Predicting the reliability of power electronic modules. In: Keyun, Bi and Ming, Li, (eds.) ICEPT: 2007 8th International Conference On Electronics Packaging Technology, Proceedings. Institute of Electrical and Electronics Engineers, Inc., New York, pp. 809-813. ISBN 9781424413911 (doi:10.1109/ICEPT.2007.4441543)

fatigue

FEA

finite element

Bailey, Christopher, Tilford, Tim, Ridout, Stephen and Lu, Hua (2008) Optimizing the reliability of power electronics module isolation substrates. EngOpt 2008: International Conference on Engineering Optimization. Universidade Federal do Rio de Janeiro, Rio de Janeiro, Brazil. ISBN 978-85-7650-152-7 (print and CD ROM)

finite element (FE) method

finite element analysis

Nwanoro, Kenneth Chimezie, Lu, Hua ORCID: https://orcid.org/0000-0002-4392-6562, Yin, Chunyan ORCID: https://orcid.org/0000-0003-0298-0420 and Bailey, Christopher ORCID: https://orcid.org/0000-0002-9438-3879 (2017) Computer simulation of the reliability of wire bonds and ribbon bonds in power electronics modules. In: 2017 23rd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC). IEEE, pp. 1-6. ISBN 978-1-5386-1929-2 ISSN 2474-1523 (Online) (doi:10.1109/THERMINIC.2017.8233827)

Yin, Chunyan ORCID: https://orcid.org/0000-0003-0298-0420, Lu, Hua ORCID: https://orcid.org/0000-0002-4392-6562, Bailey, Chris ORCID: https://orcid.org/0000-0002-9438-3879 and Chan, Yan-Cheong (2004) Effects of solder reflow on the reliability of flip-chip on flex interconnections using anisotropic conductive adhesives. IEEE Transactions on Electronics Packaging Manufacturing, 27 (4). pp. 254-259. ISSN 1521-334X (doi:10.1109/TEPM.2004.843152)

finite element analysis (FEA)

finite element analysis methods

Finite Element Analysis(FEA)

finite element modeling

finite element modelling

Flex-No-Lead project

flexible substrates

Yin, Chunyan ORCID: https://orcid.org/0000-0003-0298-0420, Lu, Hua ORCID: https://orcid.org/0000-0002-4392-6562, Bailey, Christopher ORCID: https://orcid.org/0000-0002-9438-3879 and Chan, Y. (2006) Analyzing the performance of flexible substrates for lead-free applications. Proceedings of EuroSime 2006 : 7th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems. IEEE, pp. 539-544. ISBN 1 4244 0276 X (doi:10.1109/ESIME.2006.1644052)

Yin, Chunyan ORCID: https://orcid.org/0000-0003-0298-0420, Rizvi, M.J., Lu, Hua ORCID: https://orcid.org/0000-0002-4392-6562 and Bailey, Christopher ORCID: https://orcid.org/0000-0002-9438-3879 (2006) Thermal-mechanical analysis of flexible substrates during lead-free solder reflow. Proceedings of the 1st Electronics Systemintegration Technology Conference, 2006. IEEE, pp. 1007-1011. ISBN 1 4244 0552 1 (doi:10.1109/ESTC.2006.280134)

flip chip

Bailey, Christopher ORCID: https://orcid.org/0000-0002-9438-3879, Lu, Hua ORCID: https://orcid.org/0000-0002-4392-6562, Glinski, Greg, Wheeler, Daniel, Hamilton, Phil, Hendriksen, Mike and Smith, Brian (2002) Using computer models to identify optimal conditions for flip-chip assembly and reliability. Circuit World, 28 (1). pp. 14-20. ISSN 0305-6120 (doi:10.1108/03056120210696658)

flip chip technology

flip-chip

flip-chip devices

Yin, Chunyan ORCID: https://orcid.org/0000-0003-0298-0420, Lu, Hua ORCID: https://orcid.org/0000-0002-4392-6562, Bailey, Chris ORCID: https://orcid.org/0000-0002-9438-3879 and Chan, Yan-Cheong (2004) Effects of solder reflow on the reliability of flip-chip on flex interconnections using anisotropic conductive adhesives. IEEE Transactions on Electronics Packaging Manufacturing, 27 (4). pp. 254-259. ISSN 1521-334X (doi:10.1109/TEPM.2004.843152)

Flotherm XT

fluid dynamics

flux

flux symmetries

fracture mechanics

Alam, M.O., Lu, Hua ORCID: https://orcid.org/0000-0002-4392-6562, Bailey, Christopher ORCID: https://orcid.org/0000-0002-9438-3879 and Chan, Y.C. (2008) Fracture mechanics analysis of cracks in solder joint intermetallic compounds. In: 2nd Electronics System-Integration Technology Conference, 2008. ESTC 2008. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 757-762. ISBN 978-1-4244-2813-7 (doi:10.1109/ESTC.2008.4684445)

fracture propogation path

fractures

Lu, Hua ORCID: https://orcid.org/0000-0002-4392-6562, Rafii-Tabar, H. and Cross, M. (1997) Molecular dynamics simulation of fractures using an N-body potential. Philosophical Magazine Letters, 75 (5). pp. 237-244. ISSN 0950-0839 (Print), 1362-3036 (Online) (doi:10.1080/095008397179480)

frequency

fusion approach

geometry

globtop

globtop design

Lu, Hua ORCID: https://orcid.org/0000-0002-4392-6562, Loh, Wei-Sun, Bailey, Christopher ORCID: https://orcid.org/0000-0002-9438-3879 and Johnson, C. Mark (2008) Computer modelling analysis of the globtop's effects on aluminium wirebond reliability. 2nd Electronics System-Integration Technology Conference, 2008. ESTC 2008. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 1369-1373. ISBN 978-1-4244-2814-4 (Print) 978-1-4244-2813-7 (Online) (doi:10.1109/ESTC.2008.4684555)

growth rate

heatsink

IGBT

IGBT module

IGBT power module

industrial partners

insulated gate bipolar transistors

integrated circuit interconnections

Yin, Chunyan ORCID: https://orcid.org/0000-0003-0298-0420, Lu, Hua ORCID: https://orcid.org/0000-0002-4392-6562, Bailey, Chris ORCID: https://orcid.org/0000-0002-9438-3879 and Chan, Yan-Cheong (2004) Effects of solder reflow on the reliability of flip-chip on flex interconnections using anisotropic conductive adhesives. IEEE Transactions on Electronics Packaging Manufacturing, 27 (4). pp. 254-259. ISSN 1521-334X (doi:10.1109/TEPM.2004.843152)

integrated circuit modelling

integrated circuit reliability

Yin, Chunyan ORCID: https://orcid.org/0000-0003-0298-0420, Lu, Hua ORCID: https://orcid.org/0000-0002-4392-6562, Bailey, Chris ORCID: https://orcid.org/0000-0002-9438-3879 and Chan, Yan-Cheong (2004) Effects of solder reflow on the reliability of flip-chip on flex interconnections using anisotropic conductive adhesives. IEEE Transactions on Electronics Packaging Manufacturing, 27 (4). pp. 254-259. ISSN 1521-334X (doi:10.1109/TEPM.2004.843152)

integration

interactions

interfacial reaction phenomena

interfacial reactions

intermetallic compound

intermetallic compound (IMC)

intermetallic compound layer

intermetallic compounds

intermetallic compounds (IMCs)

inverter

iron

iron films

isolation substrate

jet impingement cooling system

joints

key design parameters

Kriging

Rajaguru, Pushparajah ORCID: https://orcid.org/0000-0002-6041-0517, Lu, Hua ORCID: https://orcid.org/0000-0002-4392-6562 and Bailey, Chris ORCID: https://orcid.org/0000-0002-9438-3879 (2015) Sintered silver finite element modelling and reliability based design optimisation in power electronic module. Microelectronics Reliability, 55 (6). pp. 919-930. ISSN 0026-2714 (doi:10.1016/j.microrel.2015.03.011)

Rajaguru, Pushparajah ORCID: https://orcid.org/0000-0002-6041-0517, Lu, Hua ORCID: https://orcid.org/0000-0002-4392-6562 and Bailey, Christopher ORCID: https://orcid.org/0000-0002-9438-3879 (2014) Application of nonlinear fatigue damage models in power electronic module wirebond structure under various amplitude loadings. Advances in Manufacturing, 2 (3). pp. 239-250. ISSN 2095-3127 (Print), 2195-3597 (Online) (doi:10.1007/s40436-014-0054-5)

Rajaguru, Pushparajah ORCID: https://orcid.org/0000-0002-6041-0517, Stoyanov, Stoyan ORCID: https://orcid.org/0000-0001-6091-1226, Lu, Hua ORCID: https://orcid.org/0000-0002-4392-6562 and Bailey, Christopher ORCID: https://orcid.org/0000-0002-9438-3879 (2013) Application of Kriging and radial basis function for reliability optimization in power modules. Journal of Electronic Packaging, 135 (2):021009. ISSN 1528-9044 (Print), 1043-7398 (Online) (doi:10.1115/1.4024056)

Rajaguru, Pushparajah ORCID: https://orcid.org/0000-0002-6041-0517, Lu, Hua ORCID: https://orcid.org/0000-0002-4392-6562 and Bailey, Chris ORCID: https://orcid.org/0000-0002-9438-3879 (2012) Application of Kriging and radial basis function in power electronic module wire bond structure reliability under various amplitude loading. International Journal of Fatigue, 45. pp. 61-70. ISSN 0142-1123 (doi:10.1016/j.ijfatigue.2012.06.013)

layered structures

Nwanoro, Kenneth C., Lu, Hua ORCID: https://orcid.org/0000-0002-4392-6562, Yin, Chunyan ORCID: https://orcid.org/0000-0003-0298-0420 and Bailey, Christopher ORCID: https://orcid.org/0000-0002-9438-3879 (2018) An approximate numerical method for the prediction of plastic strain in layered structures. In: 2018 7th Electronic System-Integration Technology Conference (ESTC 2018). IEEE, pp. 181-187. ISBN 978-1538668153

LCD displays

lead free applications

Yin, Chunyan ORCID: https://orcid.org/0000-0003-0298-0420, Lu, Hua ORCID: https://orcid.org/0000-0002-4392-6562, Bailey, Christopher ORCID: https://orcid.org/0000-0002-9438-3879 and Chan, Y. (2006) Analyzing the performance of flexible substrates for lead-free applications. Proceedings of EuroSime 2006 : 7th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems. IEEE, pp. 539-544. ISBN 1 4244 0276 X (doi:10.1109/ESIME.2006.1644052)

lead free solder

lead-free solder

lead-free soldering

lead-free solders

life estimation

life prediction

Rajaguru, Pushparajah ORCID: https://orcid.org/0000-0002-6041-0517, Lu, Hua ORCID: https://orcid.org/0000-0002-4392-6562 and Bailey, Chris ORCID: https://orcid.org/0000-0002-9438-3879 (2012) Application of Kriging and radial basis function in power electronic module wire bond structure reliability under various amplitude loading. International Journal of Fatigue, 45. pp. 61-70. ISSN 0142-1123 (doi:10.1016/j.ijfatigue.2012.06.013)

life-time

light emitting diodes

liquid crystal displays

lLifetime estimation

load-induced thermal cycling

Musallam, M., Johnson, C.M., Yin, Chunyan ORCID: https://orcid.org/0000-0003-0298-0420, Lu, Hua ORCID: https://orcid.org/0000-0002-4392-6562 and Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879 (2009) Real-time comparison of power module failure modes under in-service conditions. In: 2009 13th European Conference on Power Electronics and Applications, EPE '09. Institute of Electrical and Electronic Engineers, Inc, Piscataway, NJ, USA, pp. 1-10. ISBN 978-90-75815-13-9 (electronic), 978-1-4244-4432-8 (print)

magnetic and optical

magnetic domains

magnetization

manufacturing processes

Mapping

materials properties

mathematical model

mathematical models

mathematical techniques

mechanical & thermal

metal-hydrogen systems

metallic films

metal–hydrogen systems

Lu, Hua ORCID: https://orcid.org/0000-0002-4392-6562, Zhang, Xiaohong and Titman, J.M. (1997) Measuring distributions of jump rates in disordered metal–hydrogen systems by nuclear magnetic relaxation. Journal of Alloys and Compounds, 253. pp. 425-427. ISSN 0925-8388 (doi:10.1016/S0925-8388(96)03083-6)

Micro-electronic displays

micro-manufactured

Lu, Hua ORCID: https://orcid.org/0000-0002-4392-6562, Flynn, David, Bailey, Christopher ORCID: https://orcid.org/0000-0002-9438-3879 and Desmulliez, Marc P.Y. (2006) Computer modeling of a micro-manufactured one-turn inductor. Proceedings of the Sixth IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, 2006. IEEE. ISBN 1 4244 0489 4 (doi:10.1109/HDP.2006.1707562)

microelectronics

Bailey, Christopher, Lu, Hua, Stoyanov, Stoyan, Hughes, Michael, Yin, Chunyan and Gwyer, David (2007) Multi-physics modelling for microelectronics and microsystems - current capabilities and future challenges. In: Ernst, L.J., Zhang, G.Q., Rodgers, P., Meuwissen, M., Marco, S., Van Driel, W.D. and De Saint Leger, O., (eds.) EUROSIME 2007: Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, Proceedings. Institute of Electrical and Electronics Engineers, Inc., New York, pp. 4-11. ISBN 9781424411054 (doi:10.1109/ESIME.2007.360048)

microfabricated solenoid inductor

microinductor

microinductors

micromagnetic simulation

micromagnetism

microsystem design

microsystems

Rajaguru, Pushparajah ORCID: https://orcid.org/0000-0002-6041-0517, Lu, Hua ORCID: https://orcid.org/0000-0002-4392-6562 and Bailey, Chris ORCID: https://orcid.org/0000-0002-9438-3879 (2012) Application of Kriging and radial basis function in power electronic module wire bond structure reliability under various amplitude loading. International Journal of Fatigue, 45. pp. 61-70. ISSN 0142-1123 (doi:10.1016/j.ijfatigue.2012.06.013)

Miner's linear damage accumulation

minium wires

model order reduction

Rajaguru, Pushpa ORCID: https://orcid.org/0000-0002-6041-0517, Lu, Hua ORCID: https://orcid.org/0000-0002-4392-6562, Bailey, Chris ORCID: https://orcid.org/0000-0002-9438-3879 and Bella, Martina (2020) Modelling and analysis of vibration on power electronic module structure and application of model order reduction. Microelectronics Reliability, 110:113697. ISSN 0026-2714 (doi:10.1016/j.microrel.2020.113697)

modeling

modelling

modelling methodologies

modelling technologies

modelling tools

modules

moisture

molecular dynamics

monitoring

Monte Carlo calculations

Monte Carlo study

morphology

Multi-objective optimization

Nwanoro, Kenneth, Lu, Hua ORCID: https://orcid.org/0000-0002-4392-6562, Yin, Chunyan ORCID: https://orcid.org/0000-0003-0298-0420 and Bailey, Chris ORCID: https://orcid.org/0000-0002-9438-3879 (2018) An analysis of the reliability and design optimization of aluminium ribbon bonds in power electronics modules using computer simulation method. Microelectronics Reliability, 87. pp. 1-14. ISSN 0026-2714 (doi:10.1016/j.microrel.2018.05.013)

multi-physics

multi-physics modelling

multi-scale simulations

multichip modules

multiphysics

Multiphysics modelling

N-body

N-body potential

nano-techology

neutron quasi-elastic scattering

nuclear magnetic relaxation

Numerical methods

numerical modelling

Numerical simulation

Numerical software

one turn inductor

optical performance

Lee, Yek, Bailey, Christopher ORCID: https://orcid.org/0000-0002-9438-3879, Lu, Hua ORCID: https://orcid.org/0000-0002-4392-6562, Riches, Steve, Bartholomew, Martin and Tebbit, Nigel (2006) Analysis of the thermo mechanical effects on packaging process of performance enhanced AMLCD's and the optical performance of the display. Proceedings of the 1st Electronics Systemintegration Technology Conference, 2006. IEEE, pp. 1214-1217. ISBN 9781424405527 (doi:10.1109/ESTC.2006.280164)

optimal design

optimisations

optimization

optimization of solder

optimization tools

packaged modules

packaging

Lu, Hua ORCID: https://orcid.org/0000-0002-4392-6562, Bailey, Chris ORCID: https://orcid.org/0000-0002-9438-3879 and Yin, Chunyan ORCID: https://orcid.org/0000-0003-0298-0420 (2009) Design for reliability of power electronics modules. Microelectronics Reliability, 49 (9-11). pp. 1250-1255. ISSN 0026-2714 (doi:10.1016/j.microrel.2009.07.055)

packaging technology

Tilford, Tim ORCID: https://orcid.org/0000-0001-8307-6403, Lu, Hua ORCID: https://orcid.org/0000-0002-4392-6562 and Bailey, Christopher ORCID: https://orcid.org/0000-0002-9438-3879 (2006) Thermo-mechanical modelling of power electronics module structures. 2006 8th Electronics Packaging Technology Conference (EPTC 2006) : 6-8 December 2006, Singapore. IEEE, Picsataway, N.J., pp. 214-219. ISBN 1424406641 (doi:10.1109/EPTC.2006.342718)

parameters

Particle Swarm Optimisation

performance data

photonics

physics

physics of failure techniques

physics-of-failure

Yin, Chunyan ORCID: https://orcid.org/0000-0003-0298-0420, Lu, Hua ORCID: https://orcid.org/0000-0002-4392-6562, Musallam, Mahera, Bailey, Chris ORCID: https://orcid.org/0000-0002-9438-3879 and Johnson, C. Mark (2010) Prognostic reliability analysis of power electronics modules. International Journal of Performability Engineering, 6 (5):10. pp. 513-524. ISSN 0973-1318

plastic deformation

plastic strain

polymers

power converters

Power cycling

power electronic module

Rajaguru, Pushparajah ORCID: https://orcid.org/0000-0002-6041-0517, Lu, Hua ORCID: https://orcid.org/0000-0002-4392-6562 and Bailey, Chris ORCID: https://orcid.org/0000-0002-9438-3879 (2012) Application of Kriging and radial basis function in power electronic module wire bond structure reliability under various amplitude loading. International Journal of Fatigue, 45. pp. 61-70. ISSN 0142-1123 (doi:10.1016/j.ijfatigue.2012.06.013)

power electronic modules

power electronic modules (PEMs)

Power electronics

Nwanoro, Kenneth Chimezie, Lu, Hua ORCID: https://orcid.org/0000-0002-4392-6562, Yin, Chunyan ORCID: https://orcid.org/0000-0003-0298-0420 and Bailey, Christopher ORCID: https://orcid.org/0000-0002-9438-3879 (2017) Computer simulation of the reliability of wire bonds and ribbon bonds in power electronics modules. In: 2017 23rd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC). IEEE, pp. 1-6. ISBN 978-1-5386-1929-2 ISSN 2474-1523 (Online) (doi:10.1109/THERMINIC.2017.8233827)

power electronics components

power electronics devices

power electronics module

power electronics modules

Yin, Chunyan ORCID: https://orcid.org/0000-0003-0298-0420, Lu, Hua ORCID: https://orcid.org/0000-0002-4392-6562, Musallam, M., Bailey, Christopher ORCID: https://orcid.org/0000-0002-9438-3879 and Johnson, C.M. (2010) In-service reliability assessment of solder interconnect in power electronics modules. In: 2010 Prognostics and System Health Management Conference, PHM '10. IEEE Conference Publications . Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA. ISBN 9781424447565 (Print), 9781424447589 (Online) (doi:10.1109/PHM.2010.5413346)

Lu, Hua ORCID: https://orcid.org/0000-0002-4392-6562, Loh, Wei-Sun, Bailey, Christopher ORCID: https://orcid.org/0000-0002-9438-3879 and Johnson, C. Mark (2008) Computer modelling analysis of the globtop's effects on aluminium wirebond reliability. 2nd Electronics System-Integration Technology Conference, 2008. ESTC 2008. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 1369-1373. ISBN 978-1-4244-2814-4 (Print) 978-1-4244-2813-7 (Online) (doi:10.1109/ESTC.2008.4684555)

power electronics modules (PEMs)

power module

Rajaguru, Pushparajah ORCID: https://orcid.org/0000-0002-6041-0517, Lu, Hua ORCID: https://orcid.org/0000-0002-4392-6562 and Bailey, Christopher ORCID: https://orcid.org/0000-0002-9438-3879 (2014) Application of nonlinear fatigue damage models in power electronic module wirebond structure under various amplitude loadings. Advances in Manufacturing, 2 (3). pp. 239-250. ISSN 2095-3127 (Print), 2195-3597 (Online) (doi:10.1007/s40436-014-0054-5)

power module components

power modules

power supply circuits

predictive models

Press-Pack assembly

probabilistic optimisation

probability based analytical tools

prognostic

prognostic methods

prognostics and health management

prognostics prediction methodology

quadratic response

quantum mechanics (e.g.

radial basis

Rajaguru, Pushparajah ORCID: https://orcid.org/0000-0002-6041-0517, Lu, Hua ORCID: https://orcid.org/0000-0002-4392-6562 and Bailey, Christopher ORCID: https://orcid.org/0000-0002-9438-3879 (2014) Application of nonlinear fatigue damage models in power electronic module wirebond structure under various amplitude loadings. Advances in Manufacturing, 2 (3). pp. 239-250. ISSN 2095-3127 (Print), 2195-3597 (Online) (doi:10.1007/s40436-014-0054-5)

Rajaguru, Pushparajah ORCID: https://orcid.org/0000-0002-6041-0517, Lu, Hua ORCID: https://orcid.org/0000-0002-4392-6562 and Bailey, Chris ORCID: https://orcid.org/0000-0002-9438-3879 (2012) Application of Kriging and radial basis function in power electronic module wire bond structure reliability under various amplitude loading. International Journal of Fatigue, 45. pp. 61-70. ISSN 0142-1123 (doi:10.1016/j.ijfatigue.2012.06.013)

real-time health management

real-time thermal models

reduced order modelling (ROM)

reduced order models

Rajaguru, Pushparajah ORCID: https://orcid.org/0000-0002-6041-0517, Lu, Hua ORCID: https://orcid.org/0000-0002-4392-6562 and Bailey, Christopher ORCID: https://orcid.org/0000-0002-9438-3879 (2014) Application of nonlinear fatigue damage models in power electronic module wirebond structure under various amplitude loadings. Advances in Manufacturing, 2 (3). pp. 239-250. ISSN 2095-3127 (Print), 2195-3597 (Online) (doi:10.1007/s40436-014-0054-5)

Rajaguru, Pushparajah ORCID: https://orcid.org/0000-0002-6041-0517, Lu, Hua ORCID: https://orcid.org/0000-0002-4392-6562 and Bailey, Chris ORCID: https://orcid.org/0000-0002-9438-3879 (2012) Application of Kriging and radial basis function in power electronic module wire bond structure reliability under various amplitude loading. International Journal of Fatigue, 45. pp. 61-70. ISSN 0142-1123 (doi:10.1016/j.ijfatigue.2012.06.013)

reflow

reflow soldering

Yin, Chunyan ORCID: https://orcid.org/0000-0003-0298-0420, Lu, Hua ORCID: https://orcid.org/0000-0002-4392-6562, Bailey, Chris ORCID: https://orcid.org/0000-0002-9438-3879 and Chan, Yan-Cheong (2004) Effects of solder reflow on the reliability of flip-chip on flex interconnections using anisotropic conductive adhesives. IEEE Transactions on Electronics Packaging Manufacturing, 27 (4). pp. 254-259. ISSN 1521-334X (doi:10.1109/TEPM.2004.843152)

Reliability

Nwanoro, Kenneth Chimezie, Lu, Hua ORCID: https://orcid.org/0000-0002-4392-6562, Yin, Chunyan ORCID: https://orcid.org/0000-0003-0298-0420 and Bailey, Christopher ORCID: https://orcid.org/0000-0002-9438-3879 (2017) Computer simulation of the reliability of wire bonds and ribbon bonds in power electronics modules. In: 2017 23rd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC). IEEE, pp. 1-6. ISBN 978-1-5386-1929-2 ISSN 2474-1523 (Online) (doi:10.1109/THERMINIC.2017.8233827)

reliability prediction

reliability prediction techniques

reliability targets

remaining life

resistors

ripple structures

risk analysis

risk mitigation

semiconductor technology

shunt

silicon carbide

simulation

simulation of fracture

simulation technique

simulation tools

solder

solder degradation

solder interconnect

solder interface strength

Solder joint

solder joint failure

solder joint fatigue

solder joints

solder paste

solder-mask defined joints

soldering

solders

stable equilibrium structures

strain on solder joints

stress

stress analysis

stress and strain distribution

Stress comparison

substrate delamination

substrates

surface anisotropy

surface morphology

surface mount technology

surface topography

surface treatment

synchrotron

temperature

testing

the density functional method)

the finite element method)

Thermal cycling

thermal cycling reliability

Loh, Wei-Sun, Corfield, Martin, Lu, Hua, Hogg, Simon, Tilford, Tim and Johnson, C. Mark (2007) Wire bond reliability for power electronic modules - effect of bonding temperature. In: Ernst, L.J., Zhang, G.Q., Rodgers, P., Meuwissen, M., Marco, S., Van Driel, W.D. and De Saint Leger, O., (eds.) EUROSIME 2007: Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, Proceedings. IEEE, New York, pp. 427-432. ISBN 9781424411054 (doi:10.1109/ESIME.2007.360057)

thermal degradation

thermal expansion

Yin, Chunyan ORCID: https://orcid.org/0000-0003-0298-0420, Lu, Hua ORCID: https://orcid.org/0000-0002-4392-6562, Bailey, Chris ORCID: https://orcid.org/0000-0002-9438-3879 and Chan, Yan-Cheong (2004) Effects of solder reflow on the reliability of flip-chip on flex interconnections using anisotropic conductive adhesives. IEEE Transactions on Electronics Packaging Manufacturing, 27 (4). pp. 254-259. ISSN 1521-334X (doi:10.1109/TEPM.2004.843152)

thermal management

thermal modeling

thermal-mechanical loading

thermo-mechanical

Thermo-mechanical analysis

thermo-mechanical behaviors

thermo-mechanics

Lee, Yek, Bailey, Christopher ORCID: https://orcid.org/0000-0002-9438-3879, Lu, Hua ORCID: https://orcid.org/0000-0002-4392-6562, Riches, Steve, Bartholomew, Martin and Tebbit, Nigel (2006) Analysis of the thermo mechanical effects on packaging process of performance enhanced AMLCD's and the optical performance of the display. Proceedings of the 1st Electronics Systemintegration Technology Conference, 2006. IEEE, pp. 1214-1217. ISBN 9781424405527 (doi:10.1109/ESTC.2006.280164)

transport systems

underfill

vibration

virtual prototyping environment

viscoplasticity

void formation

wear-out mechanisms

wetting

wetting force

wide area

wire

wire bond fatigue

wire bonds

wire-bond lifting

Wire/ribbon bond

Nwanoro, Kenneth Chimezie, Lu, Hua ORCID: https://orcid.org/0000-0002-4392-6562, Yin, Chunyan ORCID: https://orcid.org/0000-0003-0298-0420 and Bailey, Christopher ORCID: https://orcid.org/0000-0002-9438-3879 (2017) Computer simulation of the reliability of wire bonds and ribbon bonds in power electronics modules. In: 2017 23rd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC). IEEE, pp. 1-6. ISBN 978-1-5386-1929-2 ISSN 2474-1523 (Online) (doi:10.1109/THERMINIC.2017.8233827)

wirebond

X-ray diffraction (XRD)

x-rays

This list was generated on Sun Dec 22 14:51:24 2024 UTC.