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Items where Author is "Lu, Hua"

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Article

Rajaguru, Pushpa ORCID logoORCID: https://orcid.org/0000-0002-6041-0517, Lu, Hua ORCID logoORCID: https://orcid.org/0000-0002-4392-6562, Bailey, Chris ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 and Bella, Martina (2020) Modelling and analysis of vibration on power electronic module structure and application of model order reduction. Microelectronics Reliability, 110:113697. ISSN 0026-2714 (doi:10.1016/j.microrel.2020.113697)

Shahjalal, Mohammad, Rishad Ahmed, MD, Lu, Hua ORCID logoORCID: https://orcid.org/0000-0002-4392-6562, Bailey, Chris ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 and Forsyth, Andrew (2020) An analysis of the thermal interaction between components in power converter applications. IEEE Transactions on Power Electronics, 35 (9). pp. 9082-9094. ISSN 0885-8993 (Print), 1941-0107 (Online) (doi:10.1109/TPEL.2020.2969350)

Rajaguru, Pushpa ORCID logoORCID: https://orcid.org/0000-0002-6041-0517, Lu, Hua ORCID logoORCID: https://orcid.org/0000-0002-4392-6562 and Bailey, Chris ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 (2019) Time integration damage model for Sn3.5Ag solder interconnect in power electronic module. IEEE Transactions on Device and Materials Reliability, 19 (1). ISSN 1530-4388 (Print), 1558-2574 (Online) (doi:10.1109/TDMR.2019.2891949)

Nwanoro, Kenneth C., Lu, Hua ORCID logoORCID: https://orcid.org/0000-0002-4392-6562, Yin, Chunyan ORCID logoORCID: https://orcid.org/0000-0003-0298-0420 and Bailey, Chris ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 (2018) Using FloTHERM XT and ANSYS workbench to perform Thermo-Mechanical analysis. Engineering Edge. (In Press)

Nwanoro, Kenneth, Lu, Hua ORCID logoORCID: https://orcid.org/0000-0002-4392-6562, Yin, Chunyan ORCID logoORCID: https://orcid.org/0000-0003-0298-0420 and Bailey, Chris ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 (2018) An analysis of the reliability and design optimization of aluminium ribbon bonds in power electronics modules using computer simulation method. Microelectronics Reliability, 87. pp. 1-14. ISSN 0026-2714 (doi:10.1016/j.microrel.2018.05.013)

Lu, Hua ORCID logoORCID: https://orcid.org/0000-0002-4392-6562 and Bailey, Christopher ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 (2017) Failure and reliability analysis of a SiC power module based on stress comparison to a Si device. IEEE Transactions on Device and Materials Reliability, 17 (4). pp. 727-737. ISSN 1530-4388 (doi:10.1109/TDMR.2017.2766692)

Rajaguru, Pushparajah ORCID logoORCID: https://orcid.org/0000-0002-6041-0517, Ortiz-Gonzalez, Jose Angel, Lu, Hua ORCID logoORCID: https://orcid.org/0000-0002-4392-6562, Bailey, Chris ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 and Alatise, Olawiwola (2017) A multiphysics modeling and experimental analysis of pressure contacts in power electronics applications. IEEE Transactions on Components, Packaging and Manufacturing Technology, 7 (6). pp. 893-900. ISSN 2156-3950 (Print), 2156-3985 (Online) (doi:10.1109/TCPMT.2017.2688021)

Rajaguru, Pushparajah ORCID logoORCID: https://orcid.org/0000-0002-6041-0517, Lu, Hua ORCID logoORCID: https://orcid.org/0000-0002-4392-6562 and Bailey, Christopher ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 (2015) A time dependent damage indicator model for Sn3.5Ag solder layer in power electronic module. Microelectronics Reliability, 55 (11). pp. 2371-2381. ISSN 0026-2714 (doi:10.1016/j.microrel.2015.07.047)

Rajaguru, Pushparajah ORCID logoORCID: https://orcid.org/0000-0002-6041-0517, Lu, Hua ORCID logoORCID: https://orcid.org/0000-0002-4392-6562 and Bailey, Chris ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 (2015) Sintered silver finite element modelling and reliability based design optimisation in power electronic module. Microelectronics Reliability, 55 (6). pp. 919-930. ISSN 0026-2714 (doi:10.1016/j.microrel.2015.03.011)

Rajaguru, Pushparajah ORCID logoORCID: https://orcid.org/0000-0002-6041-0517, Lu, Hua ORCID logoORCID: https://orcid.org/0000-0002-4392-6562 and Bailey, Christopher ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 (2014) Application of nonlinear fatigue damage models in power electronic module wirebond structure under various amplitude loadings. Advances in Manufacturing, 2 (3). pp. 239-250. ISSN 2095-3127 (Print), 2195-3597 (Online) (doi:10.1007/s40436-014-0054-5)

Rajaguru, Pushparajah ORCID logoORCID: https://orcid.org/0000-0002-6041-0517, Stoyanov, Stoyan ORCID logoORCID: https://orcid.org/0000-0001-6091-1226, Lu, Hua ORCID logoORCID: https://orcid.org/0000-0002-4392-6562 and Bailey, Christopher ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 (2013) Application of Kriging and radial basis function for reliability optimization in power modules. Journal of Electronic Packaging, 135 (2):021009. ISSN 1528-9044 (Print), 1043-7398 (Online) (doi:10.1115/1.4024056)

Zhu, Xiao, Kotadia, Hiren, Xu, Sha, Lu, Hua ORCID logoORCID: https://orcid.org/0000-0002-4392-6562, Mannan, Samjid, Bailey, Chris ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 and Chan, Yancheong (2013) Modelling electromigration for microelectronics design. Journal of Computational Science and Technology, 7 (2). pp. 251-264. ISSN 1881-6894 (doi:10.1299/jcst.7.251)

Rajaguru, Pushparajah ORCID logoORCID: https://orcid.org/0000-0002-6041-0517, Lu, Hua ORCID logoORCID: https://orcid.org/0000-0002-4392-6562 and Bailey, Chris ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 (2012) Application of Kriging and radial basis function in power electronic module wire bond structure reliability under various amplitude loading. International Journal of Fatigue, 45. pp. 61-70. ISSN 0142-1123 (doi:10.1016/j.ijfatigue.2012.06.013)

Xue, Xiangdong, Bailey, Chris ORCID logoORCID: https://orcid.org/0000-0002-9438-3879, Lu, Hua ORCID logoORCID: https://orcid.org/0000-0002-4392-6562 and Stoyanov, Stoyan ORCID logoORCID: https://orcid.org/0000-0001-6091-1226 (2011) Integration of analytical techniques in stochastic optimization of microsystem reliability. Microelectronics Reliability, 51 (5). pp. 936-945. ISSN 0026-2714 (doi:10.1016/j.microrel.2011.01.008)

Yin, Chunyan ORCID logoORCID: https://orcid.org/0000-0003-0298-0420, Lu, Hua ORCID logoORCID: https://orcid.org/0000-0002-4392-6562, Musallam, Mahera, Bailey, Chris ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 and Johnson, C. Mark (2010) Prognostic reliability analysis of power electronics modules. International Journal of Performability Engineering, 6 (5):10. pp. 513-524. ISSN 0973-1318

Lu, Hua ORCID logoORCID: https://orcid.org/0000-0002-4392-6562, Bailey, Chris ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 and Yin, Chunyan ORCID logoORCID: https://orcid.org/0000-0003-0298-0420 (2009) Design for reliability of power electronics modules. Microelectronics Reliability, 49 (9-11). pp. 1250-1255. ISSN 0026-2714 (doi:10.1016/j.microrel.2009.07.055)

Bailey, C. ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 and Lu, Hua ORCID logoORCID: https://orcid.org/0000-0002-4392-6562 (2009) Nanopackaging simulation: properties and behavior of packaging materials. Nanotechnology Magazine, 3 (2). pp. 34-37. ISSN 1932-4510 (doi:10.1109/MNANO.2009.932413)

Alam, M.O., Lu, Hua ORCID logoORCID: https://orcid.org/0000-0002-4392-6562, Bailey, Chris ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 and Chan, Y.C (2009) Finite-element simulation of stress intensity factors in solder joint intermetallic compounds. IEEE Transactions on Device and Materials Reliability, 9 (1). pp. 40-48. ISSN 1530-4388 (doi:10.1109/TDMR.2008.2010595)

Rizvi, M.J., Lu, Hua ORCID logoORCID: https://orcid.org/0000-0002-4392-6562 and Bailey, Christopher ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 (2009) Modeling the diffusion of solid copper into liquid solder alloys. Thin Solid Films, 517 (5). pp. 1686-1689. ISSN 0040-6090 (doi:10.1016/j.tsf.2008.09.105)

Rizvi, M.J., Bailey, Christopher ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 and Lu, Hua ORCID logoORCID: https://orcid.org/0000-0002-4392-6562 (2008) Failure mechanisms of ACF joints under isothermal ageing. Microelectronics Journal, 39 (9). pp. 1101-1107. ISSN 0026-2692 (doi:10.1016/j.mejo.2008.01.045)

Rizvi, M.J., Bailey, Christopher ORCID logoORCID: https://orcid.org/0000-0002-9438-3879, Chan, Y.C. and Lu, Hua ORCID logoORCID: https://orcid.org/0000-0002-4392-6562 (2007) Effect of adding 0.3 wt% Ni into the Sn–0.7 wt%Cu solder: part I: wetting behavior on Cu and Ni substrates. Journal of Alloys and Compounds, 438 (1-2). pp. 116-121. ISSN 0925-8388 (doi:10.1016/j.jallcom.2006.08.048)

Rizvi, M.J., Bailey, Christopher ORCID logoORCID: https://orcid.org/0000-0002-9438-3879, Chan, Y.C., Islam, M. and Lu, Hua ORCID logoORCID: https://orcid.org/0000-0002-4392-6562 (2007) Effect of adding 0.3wt% Ni into the Sn-0.7wt% Cu solder - Part II: Growth of intermetallic layer with Cu during wetting and aging. Journal of Alloys and Compounds, 438 (1-2). pp. 122-128. ISSN 0925-8388 (doi:10.1016/j.jallcom.2006.08.071)

Rizvi, M.J., Chan, Y.C., Bailey, Christopher ORCID logoORCID: https://orcid.org/0000-0002-9438-3879, Lu, Hua ORCID logoORCID: https://orcid.org/0000-0002-4392-6562 and Islam, M.N. (2006) Effect of adding 1 wt% Bi into the Sn–2.8Ag–0.5Cu solder alloy on the intermetallic formations with Cu-substrate during soldering and isothermal aging. Journal of Alloys and Compounds, 407 (1-2). pp. 208-214. ISSN 0925-8388 (doi:10.1016/j.jallcom.2005.06.050)

Yin, Chunyan ORCID logoORCID: https://orcid.org/0000-0003-0298-0420, Lu, Hua ORCID logoORCID: https://orcid.org/0000-0002-4392-6562, Bailey, Christopher ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 and Chan, Y.C. (2006) Macro-micro modelling of moisture induced stresses in an ACF flip chip assembly. Soldering & Surface Mount Technology, 18 (2). pp. 27-32. ISSN 0954-0911 (doi:10.1108/09540910610665107)

Yin, Chunyan ORCID logoORCID: https://orcid.org/0000-0003-0298-0420, Lu, Hua ORCID logoORCID: https://orcid.org/0000-0002-4392-6562, Bailey, Chris ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 and Chan, Yan-Cheong (2005) Moisture effects on the reliability of ACF interconnections. Electronics World, 111 (1836). pp. 20-24. ISSN 1365-4675

Lu, Hua ORCID logoORCID: https://orcid.org/0000-0002-4392-6562 and Bailey, Christopher ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 (2005) Dynamic analysis of Flip-Chip Self-Alignment. IEEE Transactions on Advanced Packaging, 28 (3). pp. 475-480. ISSN 1521-3323 (doi:10.1109/TADVP.2005.848371)

Rizvi, M.J., Chan, Y.C., Bailey, Christopher ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 and Lu, Hua ORCID logoORCID: https://orcid.org/0000-0002-4392-6562 (2005) Study of Anisotropic Conductive Adhesive Joint Behaviour under 3-Point Bending. Microelectronics Reliability, 4 (5). pp. 589-596. ISSN 0026-2714 (doi:10.1016/j.microrel.2004.10.015)

Jackson, Gavin J., Lu, Hua ORCID logoORCID: https://orcid.org/0000-0002-4392-6562, Durairaj, Raj, Hoo, Nick, Bailey, Chris ORCID logoORCID: https://orcid.org/0000-0002-9438-3879, Ekere, Ndy N. and Wright, Jon (2004) Intermetallic phase detection in lead-free solders using synchrotron X-ray diffraction. Journal of Electronic Materials, 33 (12). pp. 1524-1529. ISSN 0361-5235 (Print), 1543-186X (Online) (doi:10.1007/s11664-004-0094-x)

Yin, Chunyan ORCID logoORCID: https://orcid.org/0000-0003-0298-0420, Lu, Hua ORCID logoORCID: https://orcid.org/0000-0002-4392-6562, Bailey, Chris ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 and Chan, Yan-Cheong (2004) Effects of solder reflow on the reliability of flip-chip on flex interconnections using anisotropic conductive adhesives. IEEE Transactions on Electronics Packaging Manufacturing, 27 (4). pp. 254-259. ISSN 1521-334X (doi:10.1109/TEPM.2004.843152)

Yin, C.Y. ORCID logoORCID: https://orcid.org/0000-0003-0298-0420, Alam, M.O., Chan, Y.C., Bailey, C. ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 and Lu, Hua ORCID logoORCID: https://orcid.org/0000-0002-4392-6562 (2003) The effect of reflow process on the contact resistance and reliability of anisotropic conductive film interconnection for flip chip on flex applications. Microelectronics Reliability, 43 (4). pp. 625-633. ISSN 0026-2714 (doi:10.1016/S0026-2714(02)00348-7)

Bailey, Christopher ORCID logoORCID: https://orcid.org/0000-0002-9438-3879, Lu, Hua ORCID logoORCID: https://orcid.org/0000-0002-4392-6562, Glinski, Greg, Wheeler, Daniel, Hamilton, Phil, Hendriksen, Mike and Smith, Brian (2002) Using computer models to identify optimal conditions for flip-chip assembly and reliability. Circuit World, 28 (1). pp. 14-20. ISSN 0305-6120 (doi:10.1108/03056120210696658)

Lu, Hua ORCID logoORCID: https://orcid.org/0000-0002-4392-6562, Bailey, C. ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 and Cross, M. (2000) Reliability analysis of flip chip designs via computer simulation. Journal of Electronic Packaging, 122 (3). pp. 214-219. ISSN 1528-9044 (Print), 1043-7398 (Online) (doi:10.1115/1.1286122)

Lu, Hua ORCID logoORCID: https://orcid.org/0000-0002-4392-6562, Zhang, Xiaohong and Titman, J.M. (2000) Neutron quasi-elastic scattering in disordered solids: a Monte Carlo study of metal-hydrogen systems. Journal of Physics: Condensed Matter, 12 (11). pp. 2379-2391. ISSN 0953-8984 (Print), 1361-648X (Online) (doi:10.1088/0953-8984/12/11/304)

Rafii-Tabar, Hashem, Lu, Hua ORCID logoORCID: https://orcid.org/0000-0002-4392-6562 and Cross, Mark (1998) A multi-scale atomistic-continuum modelling of crack propagation in a two-dimensional macroscopic plate. Journal of Physics: Condensed Matter, 10 (11). pp. 2375-2387. ISSN 0953-8984 (Print), 1361-648X (Online) (doi:10.1088/0953-8984/10/11/003)

Rafii-Tabar, H., Lu, Hua ORCID logoORCID: https://orcid.org/0000-0002-4392-6562 and Cross, Mark (1998) Multiscale numerical modelling of crack propagation in two-dimensional metal plate. Materials Science and Technology, 14 (6). pp. 544-548. ISSN 0267-0836 (Print), 1743-2847 (Online) (doi:10.1179/mst.1998.14.6.544)

Lu, Hua ORCID logoORCID: https://orcid.org/0000-0002-4392-6562, Zhang, Xiaohong and Titman, J.M. (1997) Measuring distributions of jump rates in disordered metal–hydrogen systems by nuclear magnetic relaxation. Journal of Alloys and Compounds, 253. pp. 425-427. ISSN 0925-8388 (doi:10.1016/S0925-8388(96)03083-6)

Lu, Hua ORCID logoORCID: https://orcid.org/0000-0002-4392-6562, Rafii-Tabar, H. and Cross, M. (1997) Molecular dynamics simulation of fractures using an N-body potential. Philosophical Magazine Letters, 75 (5). pp. 237-244. ISSN 0950-0839 (Print), 1362-3036 (Online) (doi:10.1080/095008397179480)

Lu, Hua ORCID logoORCID: https://orcid.org/0000-0002-4392-6562, Rafii-Tabar, H. and Cross, M. (1997) Molecular dynamics simulation of fractures using an N-body potential. Philosophical Magazine Letters, 75 (5). pp. 237-244. ISSN 0950-0839 (Print), 1362-3036 (Online) (doi:10.1080/095008397179480)

Lu, Hua ORCID logoORCID: https://orcid.org/0000-0002-4392-6562, Zhang, Xiaohong and Titman, J.M. (1997) Rotating-frame nuclear magnetic relaxation of spins diffusing on a disordered lattice: a Monte Carlo model. Journal of Physics: Condensed Matter, 9 (42). pp. 9097-9111. ISSN 0953-8984 (Print), 1361-648X (Online) (doi:10.1088/0953-8984/9/42/022)

Lu, Hua ORCID logoORCID: https://orcid.org/0000-0002-4392-6562, Bishop, J.E.L. and Tucker, J.W. (1996) Simulation of transverse and longitudinal magnetic ripple structures induced by surface anisotropy. Journal of Magnetism and Magnetic Materials, 163 (3). pp. 285-291. ISSN 0304-8853 (doi:10.1016/S0304-8853(96)00345-9)

Lu, Hua ORCID logoORCID: https://orcid.org/0000-0002-4392-6562, Bishop, J.E.L. and Tucker, J.W. (1996) Micromagnetic simulation of domain walls in iron films. Journal of Magnetism and Magnetic Materials, 155 (1-3). pp. 49-51. ISSN 0304-8853 (doi:10.1016/0304-8853(95)00665-6)

Book Section

Bailey, Christopher ORCID logoORCID: https://orcid.org/0000-0002-9438-3879, Lu, Hua ORCID logoORCID: https://orcid.org/0000-0002-4392-6562, Stoyanov, Stoyan ORCID logoORCID: https://orcid.org/0000-0001-6091-1226, Tilford, Timothy, Xue, Xiangdong, Alam, M. O., Yin, Chunyan ORCID logoORCID: https://orcid.org/0000-0003-0298-0420 and Hughes, Michael (2008) Modelling technologies and applications. In: Morris, James E., (ed.) Nanopackaging: Nanotechnologies and Electronics Packaging. Springer Science+Business Media, LLC, New York, USA, pp. 15-38. ISBN 978-0-387-47325-3 (Print) 978-0-387-47326-0 (Online) (doi:10.1007/978-0-387-47325-3_2)

Lu, Hua ORCID logoORCID: https://orcid.org/0000-0002-4392-6562, Loh, Wei-Sun, Bailey, Christopher ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 and Johnson, C. Mark (2008) Computer simulation of aluminium wirebonds with globtop in power electronics modules. 3rd International Microsystems, Packaging, Assembly & Circuits Technology Conference, 2008. IMPACT 2008. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 348-351. ISBN 978-1-4244-3623-1 (doi:10.1109/IMPACT.2008.4783883)

Lu, Hua ORCID logoORCID: https://orcid.org/0000-0002-4392-6562, Loh, Wei-Sun, Bailey, Christopher ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 and Johnson, C. Mark (2008) Computer modelling analysis of the globtop's effects on aluminium wirebond reliability. 2nd Electronics System-Integration Technology Conference, 2008. ESTC 2008. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 1369-1373. ISBN 978-1-4244-2814-4 (Print) 978-1-4244-2813-7 (Online) (doi:10.1109/ESTC.2008.4684555)

Lu, Hua, Ridout, Stephen, Bailey, Christopher, Loh, Wei-Sun, Pearl, Agyakwa and Johnson, C. Mark (2008) Computer simulation of crack propagation in power electronics module solder joints. International Conference on Electronic Packaging Technology & High Density Packaging, 2008. ICEPT-HDP 2008. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 1-6. ISBN 978-1-4244-2740-6 (print) 978-1-4244-2739-0 (online) (doi:10.1109/ICEPT.2008.4606983)

Bailey, Christopher, Tilford, Tim, Ridout, Stephen and Lu, Hua (2008) Optimizing the reliability of power electronics module isolation substrates. EngOpt 2008: International Conference on Engineering Optimization. Universidade Federal do Rio de Janeiro, Rio de Janeiro, Brazil. ISBN 978-85-7650-152-7 (print and CD ROM)

Bailey, Christopher, Lu, Hua, Stoyanov, Stoyan, Yin, Chunyan, Tilford, Tim and Ridout, Stephen (2008) Predictive reliability and prognostics for electronic components: current capabilities and future challenges. 31st International Spring Seminar on Electronics Technology, 2008. ISSE '08. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 67-72. ISBN 978-1-4244-3972-0 (doi:10.1109/ISSE.2008.5276460)

Alam, M. O., Lu, Hua ORCID logoORCID: https://orcid.org/0000-0002-4392-6562, Bailey, Christopher ORCID logoORCID: https://orcid.org/0000-0002-9438-3879, Chan, Y.C. and Wu, B.Y. (2007) Shear strength analysis of ball grid array (BGA) solder interfaces. In: Vaidyanathan, K., Tee, T.Y. and Lee, T.K., (eds.) 2007 9th Electronics Packaging Technology Conference. Electronics Packaging Technology Conference Proceedings . Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 770-773. ISBN 9781424413249 (doi:11.1109/EPTC.2007.4469797)

Lu, Hua, Loh, Wei-Sun, Tilford, Tim, Johnson, M. and Bailey, Christopher (2007) Reliability of power electronic modules. ASME 2007 InterPACK Conference. American Society of Mechanical Engineers, New York, pp. 883-888. ISBN 0791842789 (doi:10.1115/IPACK2007-33817)

Lu, Hua, Tilford, Tim, Bailey, Christopher and Newcombe, David (2007) Lifetime prediction for power electronics module substrate mount-down solder interconnect. HDP'07: Proceedings Of The 2007 International Symposium On High Density Packaging And Microsystem Integration. Institute of Electrical and Electronics Engineers, Inc., New York, pp. 40-45. ISBN 9781424412525 (doi:10.1109/HDP.2007.4283558)

Bailey, Christopher, Lu, Hua, Stoyanov, Stoyan, Hughes, Michael, Yin, Chunyan and Gwyer, David (2007) Multi-physics modelling for microelectronics and microsystems - current capabilities and future challenges. In: Ernst, L.J., Zhang, G.Q., Rodgers, P., Meuwissen, M., Marco, S., Van Driel, W.D. and De Saint Leger, O., (eds.) EUROSIME 2007: Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, Proceedings. Institute of Electrical and Electronics Engineers, Inc., New York, pp. 4-11. ISBN 9781424411054 (doi:10.1109/ESIME.2007.360048)

Lu, Hua, Tilford, Tim, Xue, Xiangdong and Bailey, Christopher (2007) Thermal-mechanical modelling of power electronic module packaging. In: Ernst, L.J., Zhang, G.Q., Rodgers, P., Meuwissen, M., Marco, S., Van Driel, W.D. and De Saint Leger, O., (eds.) EUROSIME 2007: Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, Proceedings. Institute of Electrical and Electronics Engineers, Inc., New York, pp. 317-322. ISBN 9781424411054 (doi:10.1109/ESIME.2007.359960)

Loh, Wei-Sun, Corfield, Martin, Lu, Hua, Hogg, Simon, Tilford, Tim and Johnson, C. Mark (2007) Wire bond reliability for power electronic modules - effect of bonding temperature. In: Ernst, L.J., Zhang, G.Q., Rodgers, P., Meuwissen, M., Marco, S., Van Driel, W.D. and De Saint Leger, O., (eds.) EUROSIME 2007: Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, Proceedings. IEEE, New York, pp. 427-432. ISBN 9781424411054 (doi:10.1109/ESIME.2007.360057)

Bailey, Christopher, Tilford, Tim and Lu, Hua (2007) Reliability analysis for power electronics modules. 2007 30th International Spring Seminar On Electronics Technology. Institute of Electrical and Electronics Engineers, Inc., New York, pp. 12-17. ISBN 9781424412174 (doi:10.1109/ISSE.2007.4432813)

Bailey, Christopher, Lu, Hua and Tilford, Tim (2007) Predicting the reliability of power electronic modules. In: Keyun, Bi and Ming, Li, (eds.) ICEPT: 2007 8th International Conference On Electronics Packaging Technology, Proceedings. Institute of Electrical and Electronics Engineers, Inc., New York, pp. 809-813. ISBN 9781424413911 (doi:10.1109/ICEPT.2007.4441543)

Bailey, Christopher, Rizvi, M.J., Yin, Chunyan, Lu, Hua and Stoyanov, Stoyan (2007) Application of modelling for predicting the behaviour of polymers and adhesives in microelectronic and photonic devices. 6th International Conference on Polymers and Adhesives in Microelectronics and Photonics. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 240-244. ISBN 9781424411863 (doi:10.1109/POLYTR.2007.4339175)

Rizvi, M.J., Yin, Chunyan, Bailey, Christopher and Lu, Hua (2007) Modelling the reliability of components on flexible substrates. IPACK 2007: proceedings of the ASME Interpack Conference 2007. American Society of Mechanical Engineers, New York, pp. 375-380. ISBN 9780791842775 (doi:10.1115/IPACK2007-33820)

Xue, Xiangdong, Lu, Hua and Bailey, Christopher (2007) A modelling approach for coupling numerical analytical techniques applied in microsystems. ICEPT: 2007 8th International Conference On Electronics Packaging Technology, Proceedings. Institute of Electrical and Electronics Engineers, Inc., New York, pp. 204-211. ISBN 9781424413911 (doi:10.1109/ICEPT.2007.4441412)

Lee, Yek, Bailey, Christopher ORCID logoORCID: https://orcid.org/0000-0002-9438-3879, Lu, Hua ORCID logoORCID: https://orcid.org/0000-0002-4392-6562, Riches, Steve, Bartholomew, Martin and Tebbit, Nigel (2006) Analysis of the thermo mechanical effects on packaging process of performance enhanced AMLCD's and the optical performance of the display. Proceedings of the 1st Electronics Systemintegration Technology Conference, 2006. IEEE, pp. 1214-1217. ISBN 9781424405527 (doi:10.1109/ESTC.2006.280164)

Rizvi, M.J., Bailey, Christopher ORCID logoORCID: https://orcid.org/0000-0002-9438-3879, Chan, Y.C. and Lu, Hua ORCID logoORCID: https://orcid.org/0000-0002-4392-6562 (2006) Effects of thermal cycling profiles on the performance of chip-on-flex assembly using anisotropic conductive films. Thermal and Thermomechanical Phenomena in Electronics Systems, 2006. ITHERM '06. The Tenth Intersociety Conference on. IEEE, pp. 855-860. ISBN 0780395247 (doi:10.1109/ITHERM.2006.1645436)

Yin, Chunyan ORCID logoORCID: https://orcid.org/0000-0003-0298-0420, Lu, Hua ORCID logoORCID: https://orcid.org/0000-0002-4392-6562, Bailey, Christopher ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 and Chan, Y. (2006) Analyzing the performance of flexible substrates for lead-free applications. Proceedings of EuroSime 2006 : 7th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems. IEEE, pp. 539-544. ISBN 1 4244 0276 X (doi:10.1109/ESIME.2006.1644052)

Flynn, David, Lu, Hua ORCID logoORCID: https://orcid.org/0000-0002-4392-6562, Bailey, Christopher ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 and Desmulliez, Marc P.Y. (2006) Assessment of microInductors for DC-DC converters. Proceedings of 2006 International Conference on Electronic Materials and Packaging (EMAP 2006). IEEE. ISBN 978-1-4244-0834-4

Rizvi, M.J., Bailey, Christopher ORCID logoORCID: https://orcid.org/0000-0002-9438-3879, Chan, Y.C. and Lu, Hua ORCID logoORCID: https://orcid.org/0000-0002-4392-6562 (2006) Comparative wetting behavior of Sn-0.7Cu and Sn-0.7Cu-0.3Ni solders on Cu and Ni substrates. 1st Electronics Systemintegration Technology Conference. Dresden, Saxony, Germany. 2006 proceedings. IEEE, Piscataway, NJ, USA, pp. 145-151. ISBN 142440553X (doi:10.1109/ITHERM.2006.1645436)

Lu, Hua ORCID logoORCID: https://orcid.org/0000-0002-4392-6562, Flynn, David, Bailey, Christopher ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 and Desmulliez, Marc P.Y. (2006) Computer modeling of a micro-manufactured one-turn inductor. Proceedings of the Sixth IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, 2006. IEEE. ISBN 1 4244 0489 4 (doi:10.1109/HDP.2006.1707562)

Tang, Y.K., Stoyanov, Stoyan ORCID logoORCID: https://orcid.org/0000-0001-6091-1226, Bailey, Christopher ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 and Lu, Hua ORCID logoORCID: https://orcid.org/0000-0002-4392-6562 (2006) Decision support systems for eco-friendly electronic products. Electronic Materials and Packaging, 2006. EMAP 2006. International Conference on. IEEE, Piscataway, N.J., pp. 77-84. ISBN 1424408342; 9781424408344 (doi:10.1109/EMAP.2006.4430580)

Yin, Chunyan ORCID logoORCID: https://orcid.org/0000-0003-0298-0420, Rizvi, M.J., Lu, Hua ORCID logoORCID: https://orcid.org/0000-0002-4392-6562 and Bailey, Christopher ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 (2006) Thermal-mechanical analysis of flexible substrates during lead-free solder reflow. Proceedings of the 1st Electronics Systemintegration Technology Conference, 2006. IEEE, pp. 1007-1011. ISBN 1 4244 0552 1 (doi:10.1109/ESTC.2006.280134)

Lee, Yek, Bailey, Christopher ORCID logoORCID: https://orcid.org/0000-0002-9438-3879, Lu, Hua ORCID logoORCID: https://orcid.org/0000-0002-4392-6562, Riches, Steve, Bartholomew, Martin and Tebbit, Nigel (2006) Thermo-mechanical analysis of the packaging process for micro-electronic displays. 7th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2006. EuroSime 2006. IEEE Computer Society, pp. 190-195. ISBN 1 4244 0275 1 (doi:10.1109/ESIME.2006.1644051)

Tilford, Tim ORCID logoORCID: https://orcid.org/0000-0001-8307-6403, Lu, Hua ORCID logoORCID: https://orcid.org/0000-0002-4392-6562 and Bailey, Christopher ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 (2006) Thermo-mechanical modelling of power electronics module structures. 2006 8th Electronics Packaging Technology Conference (EPTC 2006) : 6-8 December 2006, Singapore. IEEE, Picsataway, N.J., pp. 214-219. ISBN 1424406641 (doi:10.1109/EPTC.2006.342718)

Lu, Hua ORCID logoORCID: https://orcid.org/0000-0002-4392-6562, Flynn, David, Bailey, Christopher ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 and Desmulliez, M.Y. (2006) An analysis of a microfabricated solenoid inductor. Proceedings of the 1st Electronics Systemintegration Technology Conference, 2006. IEEE, pp. 556-561. ISBN 1 4244 0552 1 (doi:10.1109/ESTC.2006.280058)

Book

Bailey, Christopher ORCID logoORCID: https://orcid.org/0000-0002-9438-3879, Stoyanov, Stoyan ORCID logoORCID: https://orcid.org/0000-0001-6091-1226 and Lu, Hua ORCID logoORCID: https://orcid.org/0000-0002-4392-6562 (2017) Co-design And Modelling For Advanced Integration And Packaging: Manufacturing And Reliability. Wspc Series In Advanced Integration And Packaging . World Scientific Publishing. ISBN 978-9814740203 ISSN 2315-473X (doi:10.1142/9900)

Conference Proceedings

Nwanoro, Kenneth Chimezie, Lu, Hua ORCID logoORCID: https://orcid.org/0000-0002-4392-6562, Yin, Chunyan ORCID logoORCID: https://orcid.org/0000-0003-0298-0420 and Bailey, Christopher ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 (2018) Numerical simulation of the junction temperature, the coolant flow rate and the reliability of an IGBT module. In: 2018 24th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC 2018). IEEE, pp. 250-255. ISBN 978-1538667606

Nwanoro, Kenneth C., Lu, Hua ORCID logoORCID: https://orcid.org/0000-0002-4392-6562, Yin, Chunyan ORCID logoORCID: https://orcid.org/0000-0003-0298-0420 and Bailey, Christopher ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 (2018) An approximate numerical method for the prediction of plastic strain in layered structures. In: 2018 7th Electronic System-Integration Technology Conference (ESTC 2018). IEEE, pp. 181-187. ISBN 978-1538668153

Nwanoro, Kenneth Chimezie, Lu, Hua ORCID logoORCID: https://orcid.org/0000-0002-4392-6562, Yin, Chunyan ORCID logoORCID: https://orcid.org/0000-0003-0298-0420 and Bailey, Christopher ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 (2017) Computer simulation of the reliability of wire bonds and ribbon bonds in power electronics modules. In: 2017 23rd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC). IEEE, pp. 1-6. ISBN 978-1-5386-1929-2 ISSN 2474-1523 (Online) (doi:10.1109/THERMINIC.2017.8233827)

Shahjalal, Mohammad, Lu, Hua ORCID logoORCID: https://orcid.org/0000-0002-4392-6562 and Bailey, Christopher ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 (2017) Electro-thermal modelling of multi chip power modules for high power converter application. In: 2017 18th International Conference on Electronic Packaging Technology (ICEPT), Harbin. IEEE, pp. 940-945. ISBN 978-1-5386-2973-4 (doi:10.1109/ICEPT.2017.8046599)

Xu, Sha, Chan, Yan Cheong, Zhu, Xiaoxin, Lu, Hua ORCID logoORCID: https://orcid.org/0000-0002-4392-6562 and Bailey, Chris ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 (2014) Effective method to disperse and incorporate carbon nanotubes in electroless Ni-P deposits. In: 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) Proceedings. Curran Associates, Stoughton, WI, USA, pp. 1342-1347. ISBN 9781479924080 (doi:10.1109/ECTC.2014.6897466)

Evans, Paul, Castellazzi, Alberto, Johnson, C. Mark, Lu, Hua ORCID logoORCID: https://orcid.org/0000-0002-4392-6562 and Bailey, Chris ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 (2014) The optimization of thermal performance in power electronics modules. In: 2014 15th International Conference on Electronic Packaging Technology. Institute of Electrical and Electronics, Inc., Piscataway, NJ, USA, pp. 734-739. ISBN 978-1-4799-4707-2 (doi:10.1109/ICEPT.2014.6922755)

Shahjalal, Mohammad, Lu, Hua ORCID logoORCID: https://orcid.org/0000-0002-4392-6562 and Bailey, Chris ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 (2014) A review of the computer based simulation of electro-thermal design of power electronics devices. In: 20th International Workshop on Thermal Investigations of ICs and Systems. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA. ISBN 9781479954155 (doi:10.1109/THERMINIC.2014.6972515)

Kabir, Ahsanul, Bailey, Christopher ORCID logoORCID: https://orcid.org/0000-0002-9438-3879, Lu, Hua ORCID logoORCID: https://orcid.org/0000-0002-4392-6562 and Stoyanov, Stoyan ORCID logoORCID: https://orcid.org/0000-0001-6091-1226 (2012) A review of data-driven prognostics in power electronics. In: 2012 35th International Spring Seminar on Electronics Technology. IEEE Conference Publications . Institute of Electrical and Electronic Engineers, Inc., Piscataway, N.J., USA, pp. 189-192. ISBN 978-1-4673-2241-6 (Print), 978-1-4673-2239-3 (Online) ISSN 2161-2528 (doi:10.1109/ISSE.2012.6273136)

Lu, Hua ORCID logoORCID: https://orcid.org/0000-0002-4392-6562 and Bailey, C. ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 (2011) Optimisation of heatsink design for a ruggedised LCD display. In: 2011 International Conference on Electronic Packaging Technology & High Density Packaging. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 492-496. ISBN 9781457717703 (doi:10.1109/ICEPT.2011.6066883)

Zhu, Xiaoxin, Kotadia, H., Xu, Sha, Lu, Hua ORCID logoORCID: https://orcid.org/0000-0002-4392-6562, Mannan, S.H., Chan, Y.C. and Bailey, C. ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 (2011) Multi-physics computer simulation of the electromigration phenomenon. In: ICEPT-HDP 2011 Proceedings - 2011 International Conference on Electronic Packaging Technology and High Density Packaging. IEEE Computer Society, Piscataway, USA, pp. 448-452. ISBN 9781457717703 (Print), 9781457717680 (Online) (doi:10.1109/ICEPT.2011.6066874)

Bailey, Chris ORCID logoORCID: https://orcid.org/0000-0002-9438-3879, Lu, Hua ORCID logoORCID: https://orcid.org/0000-0002-4392-6562, Yin, Chunyan ORCID logoORCID: https://orcid.org/0000-0003-0298-0420 and Lee, Yek (2010) Multi-physics modelling for packaging of liquid crystal displays in harsh environments. In: Electronics System Integration Technology Conference, ESTC 2010 - Proceedings. IEEE Computer Society, Piscataway, USA, pp. 1-6. ISBN 9781424485536 (Print), 9781424485543 (Online) (doi:10.1109/ESTC.2010.5642898)

Newcombe, D.R., Chamund, Dinesh, Bailey, Christopher ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 and Lu, Hua ORCID logoORCID: https://orcid.org/0000-0002-4392-6562 (2010) Reliability metrics for IGBT power modules. In: Proceedings - 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2010. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 670-674. ISBN 9781424481408 (doi:10.1109/ICEPT.2010.5582869)

Shishido, Nobuyuki, Kanno, Toshifumi, Kawahara, Shinya, Ikeda, Toru, Miyazaki, Noriyuki, Lu, Hua ORCID logoORCID: https://orcid.org/0000-0002-4392-6562, Bailey, Chris ORCID logoORCID: https://orcid.org/0000-0002-9438-3879, Thomas, Owen, Di Maio, Davide and Hunt, Chris (2010) An analysis of local deformation of SnAgCu solder joint using digital image correlation. In: Proceedings - 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2010. Association for Computing Machinery, New York, pp. 376-381. ISBN 9781424481408 (doi:10.1109/ICEPT.2010.5582845)

Kamara, Elisha, Lu, Hua ORCID logoORCID: https://orcid.org/0000-0002-4392-6562, Bailey, Chris ORCID logoORCID: https://orcid.org/0000-0002-9438-3879, Hunt, Chris, Di Maio, Davide and Thomas, Owen (2010) Computer simulation and design of a solder joint vibration test machine. In: 2010 11th International Conference on Thermal, Mechanical and Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems, EuroSimE 2010. IEEE Conference Publications . Institute of Electrical and Electronic Engineers, Inc., Piscataway, NJ, USA. ISBN 978-1-4244-7026-6 (doi:10.1109/ESIME.2010.5464587)

Yin, Chunyan ORCID logoORCID: https://orcid.org/0000-0003-0298-0420, Lu, Hua ORCID logoORCID: https://orcid.org/0000-0002-4392-6562, Musallam, M., Bailey, Christopher ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 and Johnson, C.M. (2010) In-service reliability assessment of solder interconnect in power electronics modules. In: 2010 Prognostics and System Health Management Conference, PHM '10. IEEE Conference Publications . Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA. ISBN 9781424447565 (Print), 9781424447589 (Online) (doi:10.1109/PHM.2010.5413346)

Bailey, Chris ORCID logoORCID: https://orcid.org/0000-0002-9438-3879, Lu, Hua ORCID logoORCID: https://orcid.org/0000-0002-4392-6562 and Yin, Chunyan ORCID logoORCID: https://orcid.org/0000-0003-0298-0420 (2010) Modelling reliability of power electronics packaging. In: Proceedings of the ASME InterPack Conference 2009, IPACK2009. American Society of Mechanical Engineers, New York, USA, pp. 215-220. ISBN 9780791843604 (doi:10.1115/InterPACK2009-89430)

Musallam, M., Johnson, C.M., Yin, Chunyan ORCID logoORCID: https://orcid.org/0000-0003-0298-0420, Lu, Hua ORCID logoORCID: https://orcid.org/0000-0002-4392-6562 and Bailey, C. ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 (2009) Real-time comparison of power module failure modes under in-service conditions. In: 2009 13th European Conference on Power Electronics and Applications, EPE '09. Institute of Electrical and Electronic Engineers, Inc, Piscataway, NJ, USA, pp. 1-10. ISBN 978-90-75815-13-9 (electronic), 978-1-4244-4432-8 (print)

Lu, Hua ORCID logoORCID: https://orcid.org/0000-0002-4392-6562 and Bailey, C. ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 (2009) Lifetime prediction of an IGBT power electronics module under cyclic temperature loading conditions. In: Electronic Packaging Technology & High Density Packaging, 2009. ICEPT-HDP '09. International Conference on. Institute of Electrical and Electronics Engineers, Piscataway, NJ USA, pp. 274-279. ISBN 9781424446582 (print), 9781424446599 (doi:10.1109/ICEPT.2009.5270749)

Rizvi, M.J., Skuriat, R., Tilford, Tim ORCID logoORCID: https://orcid.org/0000-0001-8307-6403, Bailey, Christopher ORCID logoORCID: https://orcid.org/0000-0002-9438-3879, Johnson, C. Mark and Lu, Hua ORCID logoORCID: https://orcid.org/0000-0002-4392-6562 (2009) Modelling of jet-impingement cooling for power electronics. In: 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, 2009. EuroSimE 2009. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA. ISBN 978-1-4244-4160-0 (doi:10.1109/ESIME.2009.4938428)

Patil, Nishad, Das, Diganta, Yin, Chunyan ORCID logoORCID: https://orcid.org/0000-0003-0298-0420, Lu, Hua ORCID logoORCID: https://orcid.org/0000-0002-4392-6562, Bailey, Chris ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 and Pecht, Michael (2009) A fusion approach to IGBT power module prognostics. In: 10th International Conference on Thermal, Mechanical and Multi-Physics simulation and Experiments in Microelectronics and Microsystems, 2009. EuroSimE 2009. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 195-199. ISBN 9781424441600 (doi:10.1109/ESIME.2009.4938491)

Musallam, Mahera, Johnson, C. Mark, Yin, Chunyan ORCID logoORCID: https://orcid.org/0000-0003-0298-0420, Lu, Hua ORCID logoORCID: https://orcid.org/0000-0002-4392-6562 and Bailey, Chris ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 (2008) Real-time life expectancy estimation in power modules. In: 2nd Electronics System Integration Technology Conference, Greenwich, UK. IEEE Conference Publications, 1 . Institute of Electrical and Electronics Engineers, Inc, Piscataway, NJ, USA, pp. 231-236. ISBN 978-1-4244-2813-7 (Print), 978-1-4244-2814-4 (Electronic) (doi:10.1109/ESTC.2008.4684355)

Flynn, David, Lu, Hua ORCID logoORCID: https://orcid.org/0000-0002-4392-6562, Bailey, Chris ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 and Desmulliez, Marc P.Y. (2008) Design, modeling and characterization of a microinductor for future DC-DC power converters. In: 2nd Electronics System-Integration Technology Conference, 2008. ESTC 2008. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 577-582. ISBN 978-1-4244-2814-4 (print), 978-1-4244-2813-7 (online) (doi:10.1109/ESTC.2008.4684414)

Alam, M.O., Lu, Hua ORCID logoORCID: https://orcid.org/0000-0002-4392-6562, Bailey, Christopher ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 and Chan, Y.C. (2008) Fracture mechanics analysis of cracks in solder joint intermetallic compounds. In: 2nd Electronics System-Integration Technology Conference, 2008. ESTC 2008. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 757-762. ISBN 978-1-4244-2813-7 (doi:10.1109/ESTC.2008.4684445)

Bailey, Chris ORCID logoORCID: https://orcid.org/0000-0002-9438-3879, Lu, Hua ORCID logoORCID: https://orcid.org/0000-0002-4392-6562, Yin, Chunyan and Tilford, Timothy (2008) Integrated reliability and prognostics prediction methodology for power electronic modules. In: IET Seminar on Aircraft Health Management for New Operational and Enterprise Solutions. IET Digest, 2008/1 . The Institution of Engineering and Technology, Stevenage, UK, pp. 1-39. ISBN 978-0-86341-936-2 ISSN 0537-9989 (doi:10.1049/ic:20080638)

Yin, C ORCID logoORCID: https://orcid.org/0000-0003-0298-0420, Lu, Hua ORCID logoORCID: https://orcid.org/0000-0002-4392-6562, Bailey, Christopher ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 and Chan, Y.C. (2005) Moisture Effects on the Reliability of Anisotropic Conductive Films. In: Proceedings of the 6th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2005. EuroSimE 2005. IEEE, pp. 162-167. ISBN 0780390628 (doi:10.1109/ESIME.2005.1502793)

Yin, Chunyan ORCID logoORCID: https://orcid.org/0000-0003-0298-0420, Lu, Hua ORCID logoORCID: https://orcid.org/0000-0002-4392-6562, Bailey, Christopher ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 and Chan, Y.C. (2005) Experimental and Modelling Analysis on the Moisture Induced Failures in Flip Chip on Flex Interconnections with Anisotropic Conductive Film. In: Proceedings of 2005 International Conference on Asian Green Electronics, 2005. AGEC. IEEE, pp. 172-177. ISBN 0780388062 (doi:10.1109/AGEC.2005.1452340)

Yin, Chunyan ORCID logoORCID: https://orcid.org/0000-0003-0298-0420, Lu, Hua ORCID logoORCID: https://orcid.org/0000-0002-4392-6562, Bailey, Christopher ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 and ChaN, Y.C. (2005) Macro-Micro Modelling Analysis for High Density Packaged Flip Chips. In: Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, 2005. IEEE, pp. 1-4. ISBN 0780392922 (doi:10.1109/HDP.2005.251383)

Lee, Yek Bing, Bailey, Christopher ORCID logoORCID: https://orcid.org/0000-0002-9438-3879, Lu, Hua ORCID logoORCID: https://orcid.org/0000-0002-4392-6562, Riches, Steve and Bartholomew, Martin (2005) Modelling the Lamination Process for Ruggedised Displays. In: International Symposium on Electronic Materials and Packaging 2005 (EMAP 2005). IEEE, pp. 243-246. ISBN 1424401070 (doi:10.1109/EMAP.2005.1598269)

Yin, Chunyan ORCID logoORCID: https://orcid.org/0000-0003-0298-0420, Lu, Hua ORCID logoORCID: https://orcid.org/0000-0002-4392-6562 and Bailey, Christopher ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 (2005) Modelling the Performance of Flexible Substrates for Lead-Free Applications. In: Proceedings of 7th Electronic Packaging Technology Conference, 2005. EPTC 2005. IEEE, pp. 342-346. ISBN 0780395786 (doi:10.1109/EPTC.2005.1614418)

Yin, Chunyan ORCID logoORCID: https://orcid.org/0000-0003-0298-0420, Lu, Hua ORCID logoORCID: https://orcid.org/0000-0002-4392-6562, Bailey, Christopher ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 and Chan, Yan-Cheong (2005) Moisture Effects on the Reliability of Anisotropic Conductive Film Interconnection for Flip Chip on Flex Applications. In: ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems collocated with the ASME 2005 Heat Transfer Summer Conference Advances in Electronic Packaging, Parts A, B, and C. ASME, pp. 1293-1298. ISBN 0791842002 (doi:10.1115/IPACK2005-73367)

Warner, Matt, Parry, John, Bailey, Chris ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 and Lu, Hua ORCID logoORCID: https://orcid.org/0000-0002-4392-6562 (2004) Solder life prediction in a thermal analysis software environment. In: The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena In Electronic Systems (ITHERM 2004) [Proceedings]. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 391-396. ISBN 0780383575 ISSN 1089-9870 (doi:10.1109/ITHERM.2004.1318309)

Lu, Hua ORCID logoORCID: https://orcid.org/0000-0002-4392-6562 and Bailey, Chris ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 (2003) Modelling the performance of lead-Free solder interconnects for copper bumped flip-chip devices. In: ASME 2003 International Electronic Packaging Technical Conference and Exhibition. American Society of Mechanical Engineers, New York, USA, pp. 605-610. ISBN 0-7918-3690-8 (doi:10.1115/IPACK2003-35356)

Lu, Hua ORCID logoORCID: https://orcid.org/0000-0002-4392-6562 and Bailey, Christopher ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 (2002) Computer modelling of the reliability of flip chips with metal column bumping. In: ITHERM 2002. The Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems [Proceedings]. Institute of Electrical and Electronics Engineers, Inc., pp. 967-973. ISBN 0780371526 (doi:10.1109/ITHERM.2002.1012561)

Lu, Hua ORCID logoORCID: https://orcid.org/0000-0002-4392-6562 and Bailey, C. ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 (2000) Material properties, geometry and their effect on the fatigue life of two flip-chip models. In: ITHERM Proceedings. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 65-71. ISBN 0780359127 ISSN 0189-9870 (doi:10.1109/ITHERM.2000.866172)

Bailey, Christopher ORCID logoORCID: https://orcid.org/0000-0002-9438-3879, Cross, Mark and Lu, Hua ORCID logoORCID: https://orcid.org/0000-0002-4392-6562 (1999) A parametric study of flip-chip reliability via computer simulation. In: Advances in electronic packaging, 1999: Proceedings of the Pacific RIM/ASME International Intersociety Electronic & Photonic Packaging Conference, InterPACK '99. American Society of Mechanical Engineers, New York, NY, USA, pp. 263-269. ISBN 9780791816127

Conference or Conference Paper

Hoo, Nick, Jackson, Gavin, Hendriksen, Mike, Lu, Hua ORCID logoORCID: https://orcid.org/0000-0002-4392-6562, Durairaj, Rajkumar, Bailey, Chris ORCID logoORCID: https://orcid.org/0000-0002-9438-3879, Ekere, Ndy and Wright, Jonathon (2004) In-situ synchrotron x-ray diffraction during melting and solidification of a lead-free solder paste. In: TMS 2004 133rd TMS Annual Meeting & Exhibition 2004, 14-18 Mar 2004, Charlotte, North Carolina, USA. (Unpublished)

Cross, Mark, Stoyanov, Stoyan ORCID logoORCID: https://orcid.org/0000-0001-6091-1226, Mouchmov, Apostol, Lu, Hua ORCID logoORCID: https://orcid.org/0000-0002-4392-6562, Croft, Nick, Slone, Avril, Williams, Alison, Bailey, Chris ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 and Pericleous, Koulis ORCID logoORCID: https://orcid.org/0000-0002-7426-9999 (2003) Multi-physics-multi-scale simulation and optimisation: the next generation. In: NAFEMS World Congress, 2003, Orlando, Florida, USA.

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