Items where Greenwich Author is "Rajaguru, Pushparajah"

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Number of items: 36.

Artificial Intelligence; machine learning; neural nets; digital twin; smart manufacturing; robotics; sustainability

Malik, Asif, Rajaguru, Pushparajah ORCID: https://orcid.org/0000-0002-6041-0517 and Azzawi, Rula (2022) Smart manufacturing with Artificial Intelligence and digital twin: a brief review. In: 8th International Conference on Information Technology Trends, 25th - 26th May 2022, Dubai, UAE.

Damage; Fatigue; Solder joint; Power electronic module

Rajaguru, Pushparajah ORCID: https://orcid.org/0000-0002-6041-0517, Lu, Hua ORCID: https://orcid.org/0000-0002-4392-6562 and Bailey, Christopher ORCID: https://orcid.org/0000-0002-9438-3879 (2015) A time dependent damage indicator model for Sn3.5Ag solder layer in power electronic module. Microelectronics Reliability, 55 (11). pp. 2371-2381. ISSN 0026-2714 (doi:10.1016/j.microrel.2015.07.047)

Finite Element Method (FEM), thermal-mechanical analysis, Power Electronics Module (PEM), Model Order Reduction (MOR), reliability assessment

Hassan, Sheikh ORCID: https://orcid.org/0000-0002-6215-7340, Stoyanov, Stoyan ORCID: https://orcid.org/0000-0001-6091-1226, Rajaguru, Pushparajah ORCID: https://orcid.org/0000-0002-6041-0517 and Bailey, Christopher ORCID: https://orcid.org/0000-0002-9438-3879 (2024) Reduced-order modelling for coupled thermal-mechanical analysis and reliability assessment of power electronic modules with nonlinear material behaviours. In: 2024 IEEE 10th Electronics System-Integration Technology Conference (ESTC). Electronics System-Integration Technology Conference, ESTC . Institute of Electrical and Electronics Engineers (IEEE), Berlin, Germany; Piscataway, New Jersey, pp. 1-8. ISBN 979-8350390360 ISSN 2687-9700 (Print), 2687-9727 (Online) (doi:10.1109/ESTC60143.2024.10712079)

Finite Element Method (FEM); thermal-mechanical analysis; Power Electronics Module (PEM); reliability assessment; parametric Model Order Reduction (pMOR)

Hassan, Sheikh ORCID: https://orcid.org/0000-0002-6215-7340, Rajaguru, Pushparajah ORCID: https://orcid.org/0000-0002-6041-0517, Stoyanov, Stoyan ORCID: https://orcid.org/0000-0001-6091-1226 and Bailey, Christopher ORCID: https://orcid.org/0000-0002-9438-3879 (2023) Parametrising temperature dependent properties in thermal-mechanical analysis of power electronics modules using parametric Model Order Reduction. In: 2023 46th International Spring Seminar on Electronics Technology (ISSE). 10th - 14th May 2023. Timisoara, Romania. IEEE Xplore . Institute of Electrical and Electronics Engineers IEEE, Piscataway, NJ, pp. 1-7. ISBN 979-8350334845; 979-8350334852 ISSN 2161-2528 (Print), 2161-2536 (Online) (doi:10.1109/ISSE57496.2023.10168468)

LED driver, LIGBT

Rajaguru, P. ORCID: https://orcid.org/0000-0002-6041-0517, Lu, H. ORCID: https://orcid.org/0000-0002-4392-6562, Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879, Ortiz-Gonzalez, J. and Alatise, O. (2016) Electro-thermo-mechanical modelling and analysis of the Press Pack Diode in Power Electronics. In: 2015 21st International Workshop on Thermal Investigations of ICs and Systems (THERMINIC). IEEE, pp. 1-6. ISBN 978-1-4673-9706-3 (doi:10.1109/THERMINIC.2015.7389607)

LED, Lateral IGBT, Underfill

Rajaguru, P. ORCID: https://orcid.org/0000-0002-6041-0517, Lu, H. ORCID: https://orcid.org/0000-0002-4392-6562, Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879, Castellazzi, A., Pathirana, V., Udugampola, N. and Udrea, F. (2018) Impact of underfill and other physical dimensions on Silicon Lateral IGBT package reliability using computer model with discrete and continuous design variables. Microelectronics Reliability, 83. pp. 146-156. ISSN 0026-2714 (doi:10.1016/j.microrel.2018.02.024)

LED, UNDERFILL

Rajaguru, P. ORCID: https://orcid.org/0000-0002-6041-0517, Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879, Lu, H. ORCID: https://orcid.org/0000-0002-4392-6562, Aliyu, A. M., Castellazzi, A., Pathirana, V., Udugampola, N., Trajkovic, T., Udrea, F., Mitcheson, P. D. and Elliott, A. D. T. (2017) Co-design/simulation of flip-chip assembly for high voltage IGBT packages. In: 23rd International workshop on Thermal Investigations of ICs and Systems (THERMINIC). THERMINIC, pp. 1-5.

LIGBT; LED; fatigue; underfill

Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879, Rajaguru, P. ORCID: https://orcid.org/0000-0002-6041-0517, Lu, H. ORCID: https://orcid.org/0000-0002-4392-6562, Castellazzi, A., Antonini, M., Pathirana, V., Udugampola, N., Udrea, F., Mitchelson, P. D. and Aldhaher, S. (2018) Mechanical modelling of high power lateral IGBT for LED driver applications. In: IEEE Electronic Components and Technology Conference (ECTC). IEEE Electronics Packaging Society (formerly CPMT), pp. 1375-1381. ISBN 978-1-5386-5000-4 ISSN 2377-5726 (Online) (doi:10.1109/ECTC.2018.00210)

Medway Queen, beam finite element, longitudinal bending, buckling failure

Rajaguru, Pushparajah ORCID: https://orcid.org/0000-0002-6041-0517, Mason, Peter, Bailey, Chris ORCID: https://orcid.org/0000-0002-9438-3879 and Stoyanov, Stoyan ORCID: https://orcid.org/0000-0001-6091-1226 (2014) Buckling analysis on the hull of the historic paddle steamer ‘Medway Queen’. Ships and Offshore Structures, 9 (6). pp. 643-654. ISSN 1744-5302 (Print), 1754-212X (Online) (doi:10.1080/17445302.2013.849065)

Model Order Reduction (MOR); Finite Element Method (FEM); thermal-mechanical analysis; Power Electronics Module (PEM); reliability assessment; parametric Model Order Reduction (pMOR)

Model order reduction, wirebond, power electronic module

Rajaguru, Pushparajah ORCID: https://orcid.org/0000-0002-6041-0517, Bailey, Christopher ORCID: https://orcid.org/0000-0002-9438-3879 and Bella, Martina (2021) Applying model order reduction to the reliability prediction of power electronic module wire bond structure. In: 2021 27th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC). IEEE, Piscataway, US. ISBN 978-1665418973 ISSN 2474-1515 (Print), 2474-1523 (Online) (doi:10.1109/THERMINIC52472.2021.9626396)

Multiphysics modelling; Press-Pack assembly; Electronic Packaging

Rajaguru, Pushparajah ORCID: https://orcid.org/0000-0002-6041-0517, Ortiz-Gonzalez, Jose Angel, Lu, Hua ORCID: https://orcid.org/0000-0002-4392-6562, Bailey, Chris ORCID: https://orcid.org/0000-0002-9438-3879 and Alatise, Olawiwola (2017) A multiphysics modeling and experimental analysis of pressure contacts in power electronics applications. IEEE Transactions on Components, Packaging and Manufacturing Technology, 7 (6). pp. 893-900. ISSN 2156-3950 (Print), 2156-3985 (Online) (doi:10.1109/TCPMT.2017.2688021)

N/A

Rajaguru, Pushparajah ORCID: https://orcid.org/0000-0002-6041-0517, Mason, Peter, Bailey, Christopher ORCID: https://orcid.org/0000-0002-9438-3879 and Stoyanov, Stoyan ORCID: https://orcid.org/0000-0001-6091-1226 (2012) Structural Analysis on the Riveted Hull of the Paddle Steamer Medway Queen. In: Historic Ships Conference 2012. Royal Institution of Naval Architects (RINA).

Offshore renewable energy; Subsea cables; degradation; prognostics; life expectancy; abrasion; wear; corrosion; scour

Bailey, Christopher ORCID: https://orcid.org/0000-0002-9438-3879, Yin, Chunyan ORCID: https://orcid.org/0000-0003-0298-0420 and Rajaguru, Pushparajah ORCID: https://orcid.org/0000-0002-6041-0517 (2019) Predicting damage and life expectancy of subsea power cables in offshore renewable energy applications. IEEE ACCESS, 7. pp. 54658-54669. ISSN 2169-3536 (Online) (doi:10.1109/ACCESS.2019.2911260)

Reduced order models, Power module, Kriging, Radial basis, Damage rule

Rajaguru, Pushparajah ORCID: https://orcid.org/0000-0002-6041-0517, Lu, Hua ORCID: https://orcid.org/0000-0002-4392-6562 and Bailey, Christopher ORCID: https://orcid.org/0000-0002-9438-3879 (2014) Application of nonlinear fatigue damage models in power electronic module wirebond structure under various amplitude loadings. Advances in Manufacturing, 2 (3). pp. 239-250. ISSN 2095-3127 (Print), 2195-3597 (Online) (doi:10.1007/s40436-014-0054-5)

Reduced order models, system-in-package, risk analysis, probabilistic optimisation, microsystems

Stoyanov, Stoyan ORCID: https://orcid.org/0000-0001-6091-1226, Rajaguru, Pushpa ORCID: https://orcid.org/0000-0002-6041-0517 and Bailey, Chris ORCID: https://orcid.org/0000-0002-9438-3879 (2010) Reduced order modelling for reliability optimisation of advanced micro-systems. In: EngOpt2010 2nd International Conference on Engineering Optimization. International Conference on Engineering Optimization (2). EngOpt2010, pp. 1-10.

Silicon Carbide; Press-Pack; Reliability

Ortiz Gonzalez, Jose, Alatise, Olayiwola, Aliyu, Attahir, Rajaguru, Pushparajah ORCID: https://orcid.org/0000-0002-6041-0517, Castellazzi, Alberto, Ran, Li, Mawby, Philip and Bailey, Chris ORCID: https://orcid.org/0000-0002-9438-3879 (2017) Evaluation of SiC Schottky diodes using pressure contacts. IEEE Transactions on Industrial Electronics, 64 (10). 8213 -8223. ISSN 0278-0046 (Print), 1557-9948 (Online) (doi:10.1109/TIE.2017.2677348)

Surrogate models; Power electronic module; Sensitivity analysis; Finite element analysis

Rajaguru, P. ORCID: https://orcid.org/0000-0002-6041-0517, Lu, H. ORCID: https://orcid.org/0000-0002-4392-6562, Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879, Ortiz-Gonzalez, J. and Alatise, O. (2016) Evaluation of the impact of the physical dimensions and material of the semiconductor chip on the reliability of Sn3.5Ag solder interconnect in power electronic module: A finite element analysis perspective. Microelectronics Reliability, 68. pp. 77-85. ISSN 0026-2714 (doi:10.1016/j.microrel.2016.12.002)

chip-on-board, lateral IGBT, LED drivers, packaging, reliability

Aliyu, A. M., Mouawad, B., Castellazzi, A., Rajaguru, P. ORCID: https://orcid.org/0000-0002-6041-0517, Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879, Pathirana, V., Uduampola, N., Trajkovic, T. and Ubrea, F. (2017) Chip-on-board assembly of 800V Si LIGBTs for high performance ultra-compact LED drivers. In: Proceedings of the 2017 29th International Symposium on Power Semiconductor Devices and IC's (ISPSD). IEEE, pp. 431-434. ISBN 978-4-88686-094-1 ISSN 1946-0201 (Online) (doi:10.23919/ISPSD.2017.7988976)

cure kinetics, cure data, particle swarm optimization

Tilford, T., Morris, J.E., Ferenets, M., Rajaguru, P.R. ORCID: https://orcid.org/0000-0002-6041-0517, Pavuluri, S.K., Desmulliez, M.P.Y. and Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879 (2010) On model fitting methods for modeling polymer cure kinetics in microelectronics assembly applications. In: Electronics System Integration Technology Conference, ESTC 2010 - Proceedings. IEEE Computer Society, Piscataway, USA, pp. 1-6. ISBN 9781424485536 (Print), 9781424485543 (Online) (doi:10.1109/ESTC.2010.5642820)

damage, fatigue, solder interconnect, power electronic module

Rajaguru, Pushpa ORCID: https://orcid.org/0000-0002-6041-0517, Lu, Hua ORCID: https://orcid.org/0000-0002-4392-6562 and Bailey, Chris ORCID: https://orcid.org/0000-0002-9438-3879 (2019) Time integration damage model for Sn3.5Ag solder interconnect in power electronic module. IEEE Transactions on Device and Materials Reliability, 19 (1). ISSN 1530-4388 (Print), 1558-2574 (Online) (doi:10.1109/TDMR.2019.2891949)

estimate of cure, cure kinetics, differential scanning calorimetry

Tilford, T., Ferenets, M., Morris, J., Rajaguru, P.R. ORCID: https://orcid.org/0000-0002-6041-0517, Pavuluri, S., Desmulliez, M.P.Y. and Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879 (2010) Evaluation of polymer cure models in microelectronics packaging applications. In: International Conference on Electronics Packaging (ICEP2010), 12-14 May 2010, Sapporo, Hokkaido, Japan. (Unpublished)

finite element method; thermal-mechanical analysis; power electronics module; reliability assessment; parametric model order reduction

Hassan, Sheikh ORCID: https://orcid.org/0000-0002-6215-7340, Rajaguru, Pushparajah ORCID: https://orcid.org/0000-0002-6041-0517, Stoyanov, Stoyan ORCID: https://orcid.org/0000-0001-6091-1226 and Bailey, Christopher ORCID: https://orcid.org/0000-0002-9438-3879 (2024) Thermal-mechanical analysis of a power module with parametric model order reduction. In: 24th European Microelectronics and Packaging Conference & Exhibition (EMPC). 11-14 September 2023. Cambridge, United Kingdom. IEEE Xplore . The Institute of Electrical and Electronics Engineers (IEEE), Piscataway, New Jersey, pp. 1-6. ISBN 978-0956808691; 978-1665487368 (doi:10.23919/EMPC55870.2023.10418328)

isotropic conductive adhesive materials, polymer crosslinking, cure kinetics models, Differential Scanning Calorimetry (DSC), particle swarm optimisation method

Tilford, T., Morris, J.E., Ferenets, M., Rajaguru, P.R. ORCID: https://orcid.org/0000-0002-6041-0517, Pavuluri, S., Desmulliez, M.P.Y. and Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879 (2010) Numerical analysis of polymer cure kinetics in isotropic conductive adhesives. In: 33rd International Spring Seminar on Electronics Technology (ISSE), 2010. Polymer Electronics and Nanotechnologies: Towards System Integration . IEEE Xplore, Sovereign House, London, N3 1QB, UK, pp. 412-416. ISBN 978-1-4244-7849-1 (print), 978-1-4244-7850-7 (e-ISBN) (doi:10.1109/ISSE.2010.5547360)

novel micro-integrated products, failure, design process

Rajaguru, Pushpa ORCID: https://orcid.org/0000-0002-6041-0517, Stoyanov, Stoyan ORCID: https://orcid.org/0000-0001-6091-1226, Tang, Ying Kit, Bailey, Chris ORCID: https://orcid.org/0000-0002-9438-3879, Claverley, James, Leach, Richard and Topham, David (2010) Numerical modelling methodology for design of miniaturised integrated products - an application to 3D CMM micro-probe development. 2010 11th International Conference on Thermal, Mechanical and Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems, EuroSimE 2010. IEEE Computer Society, Piscataway NJ. ISBN 9781424470266 (doi:10.1109/ESIME.2010.5464573)

optimisation; ROMARA software; microsystems; power modules; modelling

Rajaguru, Pushparajah ORCID: https://orcid.org/0000-0002-6041-0517 (2014) Reduced order modelling and numerical optimisation approach to reliability analysis of microsystems and power modules. PhD thesis, University of Greenwich.

particle swarm optimisation algorithm, polymer cure kinetics models, curing process, microelectronics manufacturing, numerical models, evaluation

Tilford, T., Ferenets, M., Morris, J.E., Krumme, A., Pavuluri, S., Rajaguru, P.R. ORCID: https://orcid.org/0000-0002-6041-0517, Desmulliez, M.P.Y. and Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879 (2010) Application of particle swarm optimisation to evaluation of polymer cure kinetics models. Journal of Algorithms & Computational Technology, 4 (1). pp. 121-146. ISSN 1748-3018 (doi:10.1260/1748-3018.4.1.121)

power electronic module

Hua, Lu, Rajaguru, Pushparajah ORCID: https://orcid.org/0000-0002-6041-0517 and Bailey, Christopher ORCID: https://orcid.org/0000-0002-9438-3879 (2018) A numerical procedure for the optimization of IGBT module packaging. In: 2018 19th International Conference on Electronic Packaging Technology (ICEPT). 08-11 August 2018. Shanghai, China. IEEE Xplore (CFP 18553-ART) (18553). Institute of Electrical and Electronics Engineers (IEEE), Piscataway, New Jersey, pp. 156-160. ISBN 978-1538663868; 978-1538663851; 978-1538663875 (doi:10.1109/ICEPT.2018.8480746)

power electronic module; wirebond; damage; fatigue failure; viscoplastic behaviour; creep

Rajaguru, Pushpa ORCID: https://orcid.org/0000-0002-6041-0517, Tilford, Tim ORCID: https://orcid.org/0000-0001-8307-6403, Bailey, Chris ORCID: https://orcid.org/0000-0002-9438-3879 and Stoyanov, Stoyan ORCID: https://orcid.org/0000-0001-6091-1226 (2023) Damage mechanics-based failure prediction of wirebond in power electronic module. IEEE Access. ISSN 2169-3536 (doi:10.1109/ACCESS.2023.3342689)

reduced order models, power electronic module, life prediction, Kriging, radial basis, microsystems

Rajaguru, Pushparajah ORCID: https://orcid.org/0000-0002-6041-0517, Lu, Hua ORCID: https://orcid.org/0000-0002-4392-6562 and Bailey, Chris ORCID: https://orcid.org/0000-0002-9438-3879 (2012) Application of Kriging and radial basis function in power electronic module wire bond structure reliability under various amplitude loading. International Journal of Fatigue, 45. pp. 61-70. ISSN 0142-1123 (doi:10.1016/j.ijfatigue.2012.06.013)

reduced order models, power electronic module, risk analysis, Particle Swarm Optimisation, Kriging, radial basis

Rajaguru, Pushparajah ORCID: https://orcid.org/0000-0002-6041-0517, Lu, Hua ORCID: https://orcid.org/0000-0002-4392-6562 and Bailey, Chris ORCID: https://orcid.org/0000-0002-9438-3879 (2015) Sintered silver finite element modelling and reliability based design optimisation in power electronic module. Microelectronics Reliability, 55 (6). pp. 919-930. ISSN 0026-2714 (doi:10.1016/j.microrel.2015.03.011)

reduced order models, power electronic module, risk analysis, probabilistic optimisation, Kriging, radial basis, microsystems

Rajaguru, Pushparajah ORCID: https://orcid.org/0000-0002-6041-0517, Stoyanov, Stoyan ORCID: https://orcid.org/0000-0001-6091-1226, Lu, Hua ORCID: https://orcid.org/0000-0002-4392-6562 and Bailey, Christopher ORCID: https://orcid.org/0000-0002-9438-3879 (2013) Application of Kriging and radial basis function for reliability optimization in power modules. Journal of Electronic Packaging, 135 (2):021009. ISSN 1528-9044 (Print), 1043-7398 (Online) (doi:10.1115/1.4024056)

subsea cable scoring, corrosion

Flynn, David, Bailey, Christopher ORCID: https://orcid.org/0000-0002-9438-3879, Rajaguru, Pushpa ORCID: https://orcid.org/0000-0002-6041-0517, Wenshuo, Tang and Yin, Chunyan ORCID: https://orcid.org/0000-0003-0298-0420 (2019) Prognostics and health management of subsea cables. In: Goodman, Douglas, Hofmeister, James P. and Szidarovszky, Ferenc, (eds.) Prognostics and Health Management: A Practical Approach to Improving System Reliability Using Condition-Based Data. Quality and Reliability Engineering Series . Wiley-Blackwell. ISBN 978-1119356653

three-dimensional miniaturised products, reduced order models, micro-probe

Stoyanov, Stoyan ORCID: https://orcid.org/0000-0001-6091-1226, Rajaguru, Pushpa ORCID: https://orcid.org/0000-0002-6041-0517, Tang, Ying Kit, Bailey, Chris ORCID: https://orcid.org/0000-0002-9438-3879, Claverley, James and Leach, Richard (2010) Reduced order modelling for risk mitigation in design of miniaturised/integrated products. In: ISSE 2010 - 33rd International Spring Seminar on Electronics Technology: Polymer Electronics and Nanotechnologies: Towards System Integration - Conference Proceedings. IEEE Computer Society, Piscataway, USA, pp. 402-407. ISBN 9781424478491 (print), 9781424478507 (online) (doi:10.1109/ISSE.2010.5547362)

topology optimization, level-set method, heat sink, thermal diffusivity

Rajaguru, Pushparajah ORCID: https://orcid.org/0000-0002-6041-0517, Santhanakrishnan, Manisekaran, Tilford, Tim ORCID: https://orcid.org/0000-0001-8307-6403 and Bailey, Chris ORCID: https://orcid.org/0000-0002-9438-3879 (2019) Design of additively manufactured heatsinks for power electronics thermal management using adjoint level-set topology optimization. In: 2019 25th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC). IEEE. ISBN 978-1728120782 ISSN 2474-1515 (Print), 2474-1523 (Online) (doi:10.1109/THERMINIC.2019.8923530)

vibration, model order reduction

Rajaguru, Pushpa ORCID: https://orcid.org/0000-0002-6041-0517, Lu, Hua ORCID: https://orcid.org/0000-0002-4392-6562, Bailey, Chris ORCID: https://orcid.org/0000-0002-9438-3879 and Bella, Martina (2020) Modelling and analysis of vibration on power electronic module structure and application of model order reduction. Microelectronics Reliability, 110:113697. ISSN 0026-2714 (doi:10.1016/j.microrel.2020.113697)

This list was generated on Sun Dec 22 02:25:52 2024 UTC.