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Items where Greenwich Author is "Rajaguru, Pushparajah"

Items where Greenwich Author is "Rajaguru, Pushparajah"

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Number of items: 36.

Article

Hassan, Sheikh ORCID logoORCID: https://orcid.org/0000-0002-6215-7340, Rajaguru, Pushparajah ORCID logoORCID: https://orcid.org/0000-0002-6041-0517, Stoyanov, Stoyan ORCID logoORCID: https://orcid.org/0000-0001-6091-1226, Bailey, Chris and Tilford, Timothy ORCID logoORCID: https://orcid.org/0000-0001-8307-6403 (2024) Coupled thermal-mechanical analysis of power electronic modules with finite element method and parametric model order reduction. Power Electronic Devices and Components:100063. ISSN 2772-3704 (Online) (doi:10.1016/j.pedc.2024.100063)

Rajaguru, Pushpa ORCID logoORCID: https://orcid.org/0000-0002-6041-0517, Tilford, Tim ORCID logoORCID: https://orcid.org/0000-0001-8307-6403, Bailey, Chris ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 and Stoyanov, Stoyan ORCID logoORCID: https://orcid.org/0000-0001-6091-1226 (2023) Damage mechanics-based failure prediction of wirebond in power electronic module. IEEE Access. ISSN 2169-3536 (doi:10.1109/ACCESS.2023.3342689)

Rajaguru, Pushpa ORCID logoORCID: https://orcid.org/0000-0002-6041-0517, Lu, Hua ORCID logoORCID: https://orcid.org/0000-0002-4392-6562, Bailey, Chris ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 and Bella, Martina (2020) Modelling and analysis of vibration on power electronic module structure and application of model order reduction. Microelectronics Reliability, 110:113697. ISSN 0026-2714 (doi:10.1016/j.microrel.2020.113697)

Bailey, Christopher ORCID logoORCID: https://orcid.org/0000-0002-9438-3879, Yin, Chunyan ORCID logoORCID: https://orcid.org/0000-0003-0298-0420 and Rajaguru, Pushparajah ORCID logoORCID: https://orcid.org/0000-0002-6041-0517 (2019) Predicting damage and life expectancy of subsea power cables in offshore renewable energy applications. IEEE ACCESS, 7. pp. 54658-54669. ISSN 2169-3536 (Online) (doi:10.1109/ACCESS.2019.2911260)

Rajaguru, Pushpa ORCID logoORCID: https://orcid.org/0000-0002-6041-0517, Lu, Hua ORCID logoORCID: https://orcid.org/0000-0002-4392-6562 and Bailey, Chris ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 (2019) Time integration damage model for Sn3.5Ag solder interconnect in power electronic module. IEEE Transactions on Device and Materials Reliability, 19 (1). ISSN 1530-4388 (Print), 1558-2574 (Online) (doi:10.1109/TDMR.2019.2891949)

Rajaguru, P. ORCID logoORCID: https://orcid.org/0000-0002-6041-0517, Lu, H. ORCID logoORCID: https://orcid.org/0000-0002-4392-6562, Bailey, C. ORCID logoORCID: https://orcid.org/0000-0002-9438-3879, Castellazzi, A., Pathirana, V., Udugampola, N. and Udrea, F. (2018) Impact of underfill and other physical dimensions on Silicon Lateral IGBT package reliability using computer model with discrete and continuous design variables. Microelectronics Reliability, 83. pp. 146-156. ISSN 0026-2714 (doi:10.1016/j.microrel.2018.02.024)

Rajaguru, Pushparajah ORCID logoORCID: https://orcid.org/0000-0002-6041-0517, Ortiz-Gonzalez, Jose Angel, Lu, Hua ORCID logoORCID: https://orcid.org/0000-0002-4392-6562, Bailey, Chris ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 and Alatise, Olawiwola (2017) A multiphysics modeling and experimental analysis of pressure contacts in power electronics applications. IEEE Transactions on Components, Packaging and Manufacturing Technology, 7 (6). pp. 893-900. ISSN 2156-3950 (Print), 2156-3985 (Online) (doi:10.1109/TCPMT.2017.2688021)

Ortiz Gonzalez, Jose, Alatise, Olayiwola, Aliyu, Attahir, Rajaguru, Pushparajah ORCID logoORCID: https://orcid.org/0000-0002-6041-0517, Castellazzi, Alberto, Ran, Li, Mawby, Philip and Bailey, Chris ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 (2017) Evaluation of SiC Schottky diodes using pressure contacts. IEEE Transactions on Industrial Electronics, 64 (10). 8213 -8223. ISSN 0278-0046 (Print), 1557-9948 (Online) (doi:10.1109/TIE.2017.2677348)

Rajaguru, P. ORCID logoORCID: https://orcid.org/0000-0002-6041-0517, Lu, H. ORCID logoORCID: https://orcid.org/0000-0002-4392-6562, Bailey, C. ORCID logoORCID: https://orcid.org/0000-0002-9438-3879, Ortiz-Gonzalez, J. and Alatise, O. (2016) Evaluation of the impact of the physical dimensions and material of the semiconductor chip on the reliability of Sn3.5Ag solder interconnect in power electronic module: A finite element analysis perspective. Microelectronics Reliability, 68. pp. 77-85. ISSN 0026-2714 (doi:10.1016/j.microrel.2016.12.002)

Rajaguru, Pushparajah ORCID logoORCID: https://orcid.org/0000-0002-6041-0517, Lu, Hua ORCID logoORCID: https://orcid.org/0000-0002-4392-6562 and Bailey, Christopher ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 (2015) A time dependent damage indicator model for Sn3.5Ag solder layer in power electronic module. Microelectronics Reliability, 55 (11). pp. 2371-2381. ISSN 0026-2714 (doi:10.1016/j.microrel.2015.07.047)

Rajaguru, Pushparajah ORCID logoORCID: https://orcid.org/0000-0002-6041-0517, Lu, Hua ORCID logoORCID: https://orcid.org/0000-0002-4392-6562 and Bailey, Chris ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 (2015) Sintered silver finite element modelling and reliability based design optimisation in power electronic module. Microelectronics Reliability, 55 (6). pp. 919-930. ISSN 0026-2714 (doi:10.1016/j.microrel.2015.03.011)

Rajaguru, Pushparajah ORCID logoORCID: https://orcid.org/0000-0002-6041-0517, Mason, Peter, Bailey, Chris ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 and Stoyanov, Stoyan ORCID logoORCID: https://orcid.org/0000-0001-6091-1226 (2014) Buckling analysis on the hull of the historic paddle steamer ‘Medway Queen’. Ships and Offshore Structures, 9 (6). pp. 643-654. ISSN 1744-5302 (Print), 1754-212X (Online) (doi:10.1080/17445302.2013.849065)

Rajaguru, Pushparajah ORCID logoORCID: https://orcid.org/0000-0002-6041-0517, Lu, Hua ORCID logoORCID: https://orcid.org/0000-0002-4392-6562 and Bailey, Christopher ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 (2014) Application of nonlinear fatigue damage models in power electronic module wirebond structure under various amplitude loadings. Advances in Manufacturing, 2 (3). pp. 239-250. ISSN 2095-3127 (Print), 2195-3597 (Online) (doi:10.1007/s40436-014-0054-5)

Rajaguru, Pushparajah ORCID logoORCID: https://orcid.org/0000-0002-6041-0517, Stoyanov, Stoyan ORCID logoORCID: https://orcid.org/0000-0001-6091-1226, Lu, Hua ORCID logoORCID: https://orcid.org/0000-0002-4392-6562 and Bailey, Christopher ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 (2013) Application of Kriging and radial basis function for reliability optimization in power modules. Journal of Electronic Packaging, 135 (2):021009. ISSN 1528-9044 (Print), 1043-7398 (Online) (doi:10.1115/1.4024056)

Rajaguru, Pushparajah ORCID logoORCID: https://orcid.org/0000-0002-6041-0517, Lu, Hua ORCID logoORCID: https://orcid.org/0000-0002-4392-6562 and Bailey, Chris ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 (2012) Application of Kriging and radial basis function in power electronic module wire bond structure reliability under various amplitude loading. International Journal of Fatigue, 45. pp. 61-70. ISSN 0142-1123 (doi:10.1016/j.ijfatigue.2012.06.013)

Tilford, T., Ferenets, M., Morris, J.E., Krumme, A., Pavuluri, S., Rajaguru, P.R. ORCID logoORCID: https://orcid.org/0000-0002-6041-0517, Desmulliez, M.P.Y. and Bailey, C. ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 (2010) Application of particle swarm optimisation to evaluation of polymer cure kinetics models. Journal of Algorithms & Computational Technology, 4 (1). pp. 121-146. ISSN 1748-3018 (doi:10.1260/1748-3018.4.1.121)

Book Section

Flynn, David, Bailey, Christopher ORCID logoORCID: https://orcid.org/0000-0002-9438-3879, Rajaguru, Pushpa ORCID logoORCID: https://orcid.org/0000-0002-6041-0517, Wenshuo, Tang and Yin, Chunyan ORCID logoORCID: https://orcid.org/0000-0003-0298-0420 (2019) Prognostics and health management of subsea cables. In: Goodman, Douglas, Hofmeister, James P. and Szidarovszky, Ferenc, (eds.) Prognostics and Health Management: A Practical Approach to Improving System Reliability Using Condition-Based Data. Quality and Reliability Engineering Series . Wiley-Blackwell. ISBN 978-1119356653

Rajaguru, Pushpa ORCID logoORCID: https://orcid.org/0000-0002-6041-0517, Stoyanov, Stoyan ORCID logoORCID: https://orcid.org/0000-0001-6091-1226, Tang, Ying Kit, Bailey, Chris ORCID logoORCID: https://orcid.org/0000-0002-9438-3879, Claverley, James, Leach, Richard and Topham, David (2010) Numerical modelling methodology for design of miniaturised integrated products - an application to 3D CMM micro-probe development. 2010 11th International Conference on Thermal, Mechanical and Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems, EuroSimE 2010. IEEE Computer Society, Piscataway NJ. ISBN 9781424470266 (doi:10.1109/ESIME.2010.5464573)

Conference Proceedings

Hassan, Sheikh ORCID logoORCID: https://orcid.org/0000-0002-6215-7340, Stoyanov, Stoyan ORCID logoORCID: https://orcid.org/0000-0001-6091-1226, Rajaguru, Pushparajah ORCID logoORCID: https://orcid.org/0000-0002-6041-0517 and Bailey, Christopher ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 (2024) Reduced-order modelling for coupled thermal-mechanical analysis and reliability assessment of power electronic modules with nonlinear material behaviours. In: 2024 IEEE 10th Electronics System-Integration Technology Conference (ESTC). Electronics System-Integration Technology Conference, ESTC . Institute of Electrical and Electronics Engineers (IEEE), Berlin, Germany; Piscataway, New Jersey, pp. 1-8. ISBN 979-8350390360 ISSN 2687-9700 (Print), 2687-9727 (Online) (doi:10.1109/ESTC60143.2024.10712079)

Hassan, Sheikh ORCID logoORCID: https://orcid.org/0000-0002-6215-7340, Rajaguru, Pushparajah ORCID logoORCID: https://orcid.org/0000-0002-6041-0517, Stoyanov, Stoyan ORCID logoORCID: https://orcid.org/0000-0001-6091-1226 and Bailey, Christopher ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 (2024) Thermal-mechanical analysis of a power module with parametric model order reduction. In: 24th European Microelectronics and Packaging Conference & Exhibition (EMPC). 11-14 September 2023. Cambridge, United Kingdom. IEEE Xplore . The Institute of Electrical and Electronics Engineers (IEEE), Piscataway, New Jersey, pp. 1-6. ISBN 978-0956808691; 978-1665487368 (doi:10.23919/EMPC55870.2023.10418328)

Hassan, Sheikh ORCID logoORCID: https://orcid.org/0000-0002-6215-7340, Rajaguru, Pushparajah ORCID logoORCID: https://orcid.org/0000-0002-6041-0517, Stoyanov, Stoyan ORCID logoORCID: https://orcid.org/0000-0001-6091-1226 and Bailey, Christopher ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 (2023) Parametrising temperature dependent properties in thermal-mechanical analysis of power electronics modules using parametric Model Order Reduction. In: 2023 46th International Spring Seminar on Electronics Technology (ISSE). 10th - 14th May 2023. Timisoara, Romania. IEEE Xplore . Institute of Electrical and Electronics Engineers IEEE, Piscataway, NJ, pp. 1-7. ISBN 979-8350334845; 979-8350334852 ISSN 2161-2528 (Print), 2161-2536 (Online) (doi:10.1109/ISSE57496.2023.10168468)

Rajaguru, Pushparajah ORCID logoORCID: https://orcid.org/0000-0002-6041-0517, Bailey, Christopher ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 and Bella, Martina (2021) Applying model order reduction to the reliability prediction of power electronic module wire bond structure. In: 2021 27th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC). IEEE, Piscataway, US. ISBN 978-1665418973 ISSN 2474-1515 (Print), 2474-1523 (Online) (doi:10.1109/THERMINIC52472.2021.9626396)

Rajaguru, Pushparajah ORCID logoORCID: https://orcid.org/0000-0002-6041-0517, Santhanakrishnan, Manisekaran, Tilford, Tim ORCID logoORCID: https://orcid.org/0000-0001-8307-6403 and Bailey, Chris ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 (2019) Design of additively manufactured heatsinks for power electronics thermal management using adjoint level-set topology optimization. In: 2019 25th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC). IEEE. ISBN 978-1728120782 ISSN 2474-1515 (Print), 2474-1523 (Online) (doi:10.1109/THERMINIC.2019.8923530)

Hua, Lu, Rajaguru, Pushparajah ORCID logoORCID: https://orcid.org/0000-0002-6041-0517 and Bailey, Christopher ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 (2018) A numerical procedure for the optimization of IGBT module packaging. In: 2018 19th International Conference on Electronic Packaging Technology (ICEPT). 08-11 August 2018. Shanghai, China. IEEE Xplore (CFP 18553-ART) (18553). Institute of Electrical and Electronics Engineers (IEEE), Piscataway, New Jersey, pp. 156-160. ISBN 978-1538663868; 978-1538663851; 978-1538663875 (doi:10.1109/ICEPT.2018.8480746)

Bailey, C. ORCID logoORCID: https://orcid.org/0000-0002-9438-3879, Rajaguru, P. ORCID logoORCID: https://orcid.org/0000-0002-6041-0517, Lu, H. ORCID logoORCID: https://orcid.org/0000-0002-4392-6562, Castellazzi, A., Antonini, M., Pathirana, V., Udugampola, N., Udrea, F., Mitchelson, P. D. and Aldhaher, S. (2018) Mechanical modelling of high power lateral IGBT for LED driver applications. In: IEEE Electronic Components and Technology Conference (ECTC). IEEE Electronics Packaging Society (formerly CPMT), pp. 1375-1381. ISBN 978-1-5386-5000-4 ISSN 2377-5726 (Online) (doi:10.1109/ECTC.2018.00210)

Rajaguru, P. ORCID logoORCID: https://orcid.org/0000-0002-6041-0517, Bailey, C. ORCID logoORCID: https://orcid.org/0000-0002-9438-3879, Lu, H. ORCID logoORCID: https://orcid.org/0000-0002-4392-6562, Aliyu, A. M., Castellazzi, A., Pathirana, V., Udugampola, N., Trajkovic, T., Udrea, F., Mitcheson, P. D. and Elliott, A. D. T. (2017) Co-design/simulation of flip-chip assembly for high voltage IGBT packages. In: 23rd International workshop on Thermal Investigations of ICs and Systems (THERMINIC). THERMINIC, pp. 1-5.

Aliyu, A. M., Mouawad, B., Castellazzi, A., Rajaguru, P. ORCID logoORCID: https://orcid.org/0000-0002-6041-0517, Bailey, C. ORCID logoORCID: https://orcid.org/0000-0002-9438-3879, Pathirana, V., Uduampola, N., Trajkovic, T. and Ubrea, F. (2017) Chip-on-board assembly of 800V Si LIGBTs for high performance ultra-compact LED drivers. In: Proceedings of the 2017 29th International Symposium on Power Semiconductor Devices and IC's (ISPSD). IEEE, pp. 431-434. ISBN 978-4-88686-094-1 ISSN 1946-0201 (Online) (doi:10.23919/ISPSD.2017.7988976)

Rajaguru, P. ORCID logoORCID: https://orcid.org/0000-0002-6041-0517, Lu, H. ORCID logoORCID: https://orcid.org/0000-0002-4392-6562, Bailey, C. ORCID logoORCID: https://orcid.org/0000-0002-9438-3879, Ortiz-Gonzalez, J. and Alatise, O. (2016) Electro-thermo-mechanical modelling and analysis of the Press Pack Diode in Power Electronics. In: 2015 21st International Workshop on Thermal Investigations of ICs and Systems (THERMINIC). IEEE, pp. 1-6. ISBN 978-1-4673-9706-3 (doi:10.1109/THERMINIC.2015.7389607)

Rajaguru, Pushparajah ORCID logoORCID: https://orcid.org/0000-0002-6041-0517, Mason, Peter, Bailey, Christopher ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 and Stoyanov, Stoyan ORCID logoORCID: https://orcid.org/0000-0001-6091-1226 (2012) Structural Analysis on the Riveted Hull of the Paddle Steamer Medway Queen. In: Historic Ships Conference 2012. Royal Institution of Naval Architects (RINA).

Tilford, T., Morris, J.E., Ferenets, M., Rajaguru, P.R. ORCID logoORCID: https://orcid.org/0000-0002-6041-0517, Pavuluri, S.K., Desmulliez, M.P.Y. and Bailey, C. ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 (2010) On model fitting methods for modeling polymer cure kinetics in microelectronics assembly applications. In: Electronics System Integration Technology Conference, ESTC 2010 - Proceedings. IEEE Computer Society, Piscataway, USA, pp. 1-6. ISBN 9781424485536 (Print), 9781424485543 (Online) (doi:10.1109/ESTC.2010.5642820)

Tilford, T., Morris, J.E., Ferenets, M., Rajaguru, P.R. ORCID logoORCID: https://orcid.org/0000-0002-6041-0517, Pavuluri, S., Desmulliez, M.P.Y. and Bailey, C. ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 (2010) Numerical analysis of polymer cure kinetics in isotropic conductive adhesives. In: 33rd International Spring Seminar on Electronics Technology (ISSE), 2010. Polymer Electronics and Nanotechnologies: Towards System Integration . IEEE Xplore, Sovereign House, London, N3 1QB, UK, pp. 412-416. ISBN 978-1-4244-7849-1 (print), 978-1-4244-7850-7 (e-ISBN) (doi:10.1109/ISSE.2010.5547360)

Stoyanov, Stoyan ORCID logoORCID: https://orcid.org/0000-0001-6091-1226, Rajaguru, Pushpa ORCID logoORCID: https://orcid.org/0000-0002-6041-0517, Tang, Ying Kit, Bailey, Chris ORCID logoORCID: https://orcid.org/0000-0002-9438-3879, Claverley, James and Leach, Richard (2010) Reduced order modelling for risk mitigation in design of miniaturised/integrated products. In: ISSE 2010 - 33rd International Spring Seminar on Electronics Technology: Polymer Electronics and Nanotechnologies: Towards System Integration - Conference Proceedings. IEEE Computer Society, Piscataway, USA, pp. 402-407. ISBN 9781424478491 (print), 9781424478507 (online) (doi:10.1109/ISSE.2010.5547362)

Stoyanov, Stoyan ORCID logoORCID: https://orcid.org/0000-0001-6091-1226, Rajaguru, Pushpa ORCID logoORCID: https://orcid.org/0000-0002-6041-0517 and Bailey, Chris ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 (2010) Reduced order modelling for reliability optimisation of advanced micro-systems. In: EngOpt2010 2nd International Conference on Engineering Optimization. International Conference on Engineering Optimization (2). EngOpt2010, pp. 1-10.

Conference or Conference Paper

Malik, Asif, Rajaguru, Pushparajah ORCID logoORCID: https://orcid.org/0000-0002-6041-0517 and Azzawi, Rula (2022) Smart manufacturing with Artificial Intelligence and digital twin: a brief review. In: 8th International Conference on Information Technology Trends, 25th - 26th May 2022, Dubai, UAE.

Tilford, T., Ferenets, M., Morris, J., Rajaguru, P.R. ORCID logoORCID: https://orcid.org/0000-0002-6041-0517, Pavuluri, S., Desmulliez, M.P.Y. and Bailey, C. ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 (2010) Evaluation of polymer cure models in microelectronics packaging applications. In: International Conference on Electronics Packaging (ICEP2010), 12-14 May 2010, Sapporo, Hokkaido, Japan. (Unpublished)

Thesis

Rajaguru, Pushparajah ORCID logoORCID: https://orcid.org/0000-0002-6041-0517 (2014) Reduced order modelling and numerical optimisation approach to reliability analysis of microsystems and power modules. PhD thesis, University of Greenwich.

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