Skip navigation

Items where Greenwich Author is "Stoyanov, Dr Stoyan"

Items where Greenwich Author is "Stoyanov, Dr Stoyan"

Up a level
Export as [feed] RSS
Group by: Item Type | Date | Funders | Uncontrolled Keywords | No Grouping
Jump to: 3D printing; Electronics packaging; Design tools; Modelling; Reliability | 3D printing; electronics manufacture; machine learning; condition based monitoring; prognostics | Advanced packaging and integration technologies; modelling methodologies | Ball grid arrays, Failure analysis, Nitrogen, Reliability, risk management, Tin alloys | Coatings, Analytical models, Integrated circuit modeling, Solid modeling, Materials reliability | Cutty Sark, prognostics framework, data-driven prognostics, computer modelling, physics-of-failure, PoF | Data driven prognostics; Power semiconductor packages; Machine learning; Reliability test; Failure | Design for Reliability modelling, System-in-Package (SiP) structures, NXP, Wafer Level Packaging (WLP), Finite Element Analysis (FEA) | FEA, finite element analysis, computational, modelling, historic, ship, composite, structure, Cutty Sark | Focused Ion Beam (FIB), micro-fabrication, nano-fabrication, precision engineering, modelling | Hot Solder Dip, (HSD), electronic components, Quad Flat Package, (QFP) | Kernel, Numerical models, Analytical models, Microelectronics, Fluids, Graphics processing units, Surface tension | LED displays, adhesive bonding, adhesives, fine-pitch technology, flip-chip devices, microassembling, organic light emitting diodes, semiconductor device packaging, semiconductor device reliability, surface mount technology, thermal management (packaging) | Light Emitting Diodes, (LEDs), accelerated aging, lubricating oils, monitoring, nickel, noise, reliability | Medway Queen, beam finite element, longitudinal bending, buckling failure | Modelling; Electronic Packaging; Reliability | N/A | Nano-Imprint Forming (NIF), Finite Element Analysis, fabrication | Production technology; Mechanical engineering; Materials; Generative manufacturing; Additive manufacturing; 3D printing; Mechanical engineering; Designers, Production technicians; Materials scientist; manufacturing technicians; Product developers; Designers | QFN, conformal coating, reliability, finite element analysis, thermal cycling | Reduced order models, system-in-package, risk analysis, probabilistic optimisation, microsystems | Response Surface, Numerical Optimilation, Electronic Packaging, Reliability,Multi-physics modeling, Thermal Management | SiP structure, package design parameters, thermo-mechanical behaviour, non-linear transient finite element simulations | SiP structure, thermo-mechanical behaviour, reduced order models (ROM) | SiP technology, thermo-mechanical reliability analysis, stacked die, side-by-side dies, embedded die, finite element analysis, numerical optimisation, uncertainty analysis, lead free solder interconnects, accelerated temperature cycle, fatigue life-time, warpage | SiP, packaging design, solder joints, numerical modelling | additive manufacturing, inkjet printing, microelectronics fabrication, reliability, numerical analysis | adhesive bonding, chip scale packaging, conducting materials, fine-pitch technology, integrated circuit interconnections, printing, solders | aerospace, ball grid arrays, finite element analysis, integrated circuit interconnections, integrated circuit reliability, life testing, solders thermal stress cracking | ball grid array, printed circuit board reflow, | ball grid arrays, flip-chip devices, packaging, semiconductor device reliability | circuits, electromechanical devices, electronics industry, reliability management | commercial off-the shelf components, modelling, refinishing, reliability | compuational fluid dynamics (CFD), wave soldering, gas flow, modelling | computational fluid dynamics (CFD), isotropic conductive adhesives (ICAs), organic light emitting diodes (OLED) | computational fluid dynamics, CFD, computer aided analysis, engineering computing, flow, nitrogen, optimisation, oxygen, wave soldering | computational mechanics, design, electronic components | computational mechanics, numerical optimization material properties, electronic packages | computational modelling, material deformation | computational models | computer aided conservation, computational modelling, ship modelling, smeared shell approach, Cutty Sark, composite structures | computer simulation, curing, delamination, fatigue of materials, interfaces (materials), microelectronic processing, soldered joints; X ray microscopes, scanning acoustic microscopes, flip chip devices | convolutional neural network; machine learning; composite properties; copper pattern; printed circuit board; PCB; conductive layer; redistribution layer | crystal plasticity; solder joints; SAC305; thermal fatigue; microstructure; multi-scale modelling; thermo-mechanical Reliability | data analytics, smart test, prognostics, machine learning, electronics product qualification | data driven prognostics, health monitoring, light emitting diodes, LEDs | data driven prognostics, prognostics health management, PHM, light emitting diodes, LEDs | data mining, machine learning, smart qualification testing, electronic components, intelligent manufacturing, prognostics modelling | data-driven prognostics, data analysis, machine learning, modelling, electronics manufacturing, quality, qualification testing | decision support system, electronic product design, numerical modelling | decision tree, logistic regression, random forest, incomplete dataset, electronic device | decision tree, production test set compaction, incomplete dataset, stop-on-fail test, electronic device qualification | design methodology, micro-machining process, Focused Ion Beam (FIB) method, Design of Experiment (DoE) method, Reduced Order Models (ROM) | electronics design, design optimistation, numerical modelling, computer modelling | failure analysis, reliability, solders, thermal management (packaging), tin alloys, whiskers (crystal) | finite element analysis, Cutty Sark, ship, modelling | finite element analysis, reliable electronic packaging | finite element modelling, focal plane array, compression bonding, flip-chip assembly, reliability, cryogenic temperature, compound semiconductors | finite element modelling, reliability, component terminations, hot solder dip refinishing process, tin whiskers, commercial off-the-shelf components, scanning acoustic microscopy | five process parameters, post weld stresses, pigtail fibre optic, butterfly module, response surface methodology, Integrated Design of Experiments (DoE), Finite Element Analysis (FEA), Monte Carlo simulation, particle swarm optimisation algorithm | flip chip, optimization, reliability, underfill | flip-chip assembly, isotropic conductive adhesives, (ICA), reliability modelling | flip-chip assembly, no-flow underfill materials | hot solder dip, (HSD), leaded components, copper, electronic packaging thermal management, predictive models, stress, thermal stresses, thermomechanical processes, wires | isotropic conductive adhesives (ICAs), flip-chip packaging, low temperature (T<100 C) | manufacturing systems, nanotechnology, modelling, finite element analysis, deformation, process efficiency | micro-BGA; solder joint reliability; compliant PCB; physics-of-failure; lifetime modelling; edgebond; underfill; SnPbAgCu quaternary solder alloy | microsystems, multiphysics, analytical techniques | modelling methodology, thermal analysis, hot solder dip process, tin whiskers | modelling technologies, analysis tools, nano-techology, microsystems, fabrication, packaging, testing | modelling, prototyping, micro-probe | multi-physics, multi-scale simulations, computational modelling | nano-imprint forming (NIF), modelling methodology, 3D-miniaturised systems | novel micro-integrated products, failure, design process | optimisation, methodology, micro and nano system, focused ion beam | optimization, techniques, prototypes, product reliability | power electronics, data-driven prognostics, insulated gate bipolar transistors, mathematical model, monitoring, physics, predictive models, prognostics and health management | probabilities, prognostics framework, computer modelling, Cutty Sark, conservation | product design, prototype, computational fluid dynamics, CFD, computational mechanics, numerical optimisation, statistical methods, computer modelling, | prognostics framework, Bayesian networks, computer modelling, Cutty Sark, conservation, physics-of-failure, | prognostics framework, computer modelling, Cutty Sark, conservation, heritage structures, | prognostics framework, computer modelling, materials damage, material degradation, prognostic fusion, Cutty Sark, heritage structure, conservation, | prognostics, reliability, light emitting diodes, LEDs, algorithms | reduced order models, power electronic module, risk analysis, probabilistic optimisation, Kriging, radial basis, microsystems | risk mitigation, manufacturing process, focused ion beam | statistical hypothesis testing, refinishing, hot solder dip, leaded component, lead-free | thermal modelling, hot solder, microelectronics, analytical models, computed tomography, conductivity, heating, lead, materials, thermal analysis | three-dimensional miniaturised products, reduced order models, micro-probe
Number of items: 89.

3D printing; Electronics packaging; Design tools; Modelling; Reliability

Tilford, Tim ORCID: 0000-0001-8307-6403, Stoyanov, Stoyan ORCID: 0000-0001-6091-1226, Braun, Jessica, Janhsen, Jan Cristophe, Burgard, Matthias, Birch, Richard and Bailey, Chris ORCID: 0000-0002-9438-3879 (2018) Design, manufacture and test for reliable 3D printed electronics packaging. Microelectronics Reliability, 85. pp. 109-117. ISSN 0026-2714 (doi:https://doi.org/10.1016/j.microrel.2018.04.008)

3D printing; electronics manufacture; machine learning; condition based monitoring; prognostics

Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2017) Machine learning for additive manufacturing of electronics. In: Proceedings 2017 40th International Spring Seminar on Electronics Technology (ISSE). IEEE. ISBN 978-1-5386-0583-7 ISSN 2161-2536 (Online) (doi:https://doi.org/10.1109/ISSE.2017.8000936)

Advanced packaging and integration technologies; modelling methodologies

Bailey, Christopher ORCID: 0000-0002-9438-3879, Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 and Lu, Hua ORCID: 0000-0002-4392-6562 (2017) Co-design And Modelling For Advanced Integration And Packaging: Manufacturing And Reliability. Wspc Series In Advanced Integration And Packaging . World Scientific Publishing. ISBN 978-9814740203 ISSN 2315-473X (doi:https://doi.org/10.1142/9900)

Ball grid arrays, Failure analysis, Nitrogen, Reliability, risk management, Tin alloys

Stoyanov, Stoyan ORCID: 0000-0001-6091-1226, Dabek, Alexander and Bailey, Chris ORCID: 0000-0002-9438-3879 (2014) Hot nitrogen deballing of Ball Grid Arrays. In: Proceedings of the 2014 37th International Spring Seminar on Electronics Technology. Institute of Electrical and Electronics Engineers Inc., Piscataway, NJ, USA, pp. 44-49. ISBN 978-147994455-2 (doi:https://doi.org/10.1109/ISSE.2014.6887559)

Coatings, Analytical models, Integrated circuit modeling, Solid modeling, Materials reliability

Yin, Chunyan ORCID: 0000-0003-0298-0420, Stoyanov, Stoyan ORCID: 0000-0001-6091-1226, Bailey, Christopher ORCID: 0000-0002-9438-3879 and Stewart, Paul (2017) Modelling the impact of conformal coating penetration on QFN reliability. In: 2017 18th International Conference on Electronic Packaging Technology (ICEPT). IEEE, pp. 1021-1026. ISBN 978-1-5386-2973-4 (doi:https://doi.org/10.1109/ICEPT.2017.8046616)

Cutty Sark, prognostics framework, data-driven prognostics, computer modelling, physics-of-failure, PoF

Rosunally, Yasmine, Stoyanov, Stoyan ORCID: 0000-0001-6091-1226, Bailey, Chris ORCID: 0000-0002-9438-3879, Mason, Peter, Campbell, Sheelagh, Monger, George and Bell, Ian (2009) Development of a prognostics framework for the iron structural material of the s.v. Cutty Sark. In: Proceedings of Sixth International Conference on Condition Monitoring and Machinery Failure Prevention Technologies – CM/MFPT 2009. The British Institute of Non-Destructive Testing / Coxmoor Publishing, Northampton, UK, pp. 674-685.

Data driven prognostics; Power semiconductor packages; Machine learning; Reliability test; Failure

Ahsan, Mominul, Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2018) Data driven prognostics for failure of power semiconductor packages. In: Proceedings of 41st Spring Seminar on Electronics Technology (ISSE). IEEE Xplore, pp. 1-6. ISBN 978-1-5386-5730-0 ISSN 2161-2536 (Online) (doi:https://doi.org/10.1109/ISSE.2018.8443612)

Design for Reliability modelling, System-in-Package (SiP) structures, NXP, Wafer Level Packaging (WLP), Finite Element Analysis (FEA)

Stoyanov, Stoyan ORCID: 0000-0001-6091-1226, Strusevitch, Nadia, Rizvi, Jahir, Georgel, Vincent, Yannou, Jean-Marc and Bailey, Chris ORCID: 0000-0002-9438-3879 (2008) Design for reliability for wafer level system in package. In: 2nd Electronics System-Integration Technology Conference, 2008. ESTC 2008. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 293-298. ISBN 978-1-4244-2814-4 (Print), 978-1-4244-2813-7 (Online) (doi:https://doi.org/10.1109/ESTC.2008.4684364)

FEA, finite element analysis, computational, modelling, historic, ship, composite, structure, Cutty Sark

Stoyanov, S. ORCID: 0000-0001-6091-1226, Mason, P. and Bailey, C. ORCID: 0000-0002-9438-3879 (2006) Computational methodology for analysis of historic composite structures. In: Proceedings of the 5th International Conference on Engineering Computational Technology. Civil-Comp Press, Stirlingshire, UK. ISBN 1905088116 ISSN 1759-3433 (doi:https://doi.org/10.4203/ccp.84.132)

Focused Ion Beam (FIB), micro-fabrication, nano-fabrication, precision engineering, modelling

Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 and Marson, Silvia (2011) Model assisted process control in micro- and nano-fabrication using focused ion beam. In: Electronics Technology (ISSE), 2011 34th International Spring Seminar on. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 424-429. ISBN 978-1-4577-2111-3 ISSN 2161-2528 (doi:https://doi.org/10.1109/ISSE.2011.6053900)

Hot Solder Dip, (HSD), electronic components, Quad Flat Package, (QFP)

Stoyanov, Stoyan ORCID: 0000-0001-6091-1226, Best, Chris, Yin, Chunyan ORCID: 0000-0003-0298-0420, Alam, M.O., Bailey, Chris ORCID: 0000-0002-9438-3879 and Tollafield, Peter (2012) Experimental and modelling study on the effects of refinishing lead-free microelectronic components. In: 2012 4th Electronic System-Integration Technology Conference (ESTC). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA. ISBN 9781467346450 (doi:https://doi.org/10.1109/ESTC.2012.6542213)

Kernel, Numerical models, Analytical models, Microelectronics, Fluids, Graphics processing units, Surface tension

Tilford, T. ORCID: 0000-0001-8307-6403, Stoyanov, S. ORCID: 0000-0001-6091-1226, Tourloukis, G. and Bailey, C. ORCID: 0000-0002-9438-3879 (2016) Numerical analysis of droplet deposition in inkjet printed electronics assembly. In: 2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE). IEEE, pp. 1-7. ISBN 978-1-5090-2106-2 (doi:https://doi.org/10.1109/EuroSimE.2016.7463358)

LED displays, adhesive bonding, adhesives, fine-pitch technology, flip-chip devices, microassembling, organic light emitting diodes, semiconductor device packaging, semiconductor device reliability, surface mount technology, thermal management (packaging)

Stoyanov, S. ORCID: 0000-0001-6091-1226, Kay, R., Bailey, C. ORCID: 0000-0002-9438-3879, Desmuilliez, M. and Hendriksen, M. (2003) Ultra-fine pitch flip-chip assembly using isotropic conductive adhesives. In: Proceedings of 5th Electronics Packaging Technology Conference (EPTC 2003). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 797-802. ISBN 0780382056 (doi:https://doi.org/10.1109/EPTC.2003.1271627)

Light Emitting Diodes, (LEDs), accelerated aging, lubricating oils, monitoring, nickel, noise, reliability

Sutharssan, Thamo, Bailey, ChriS ORCID: 0000-0002-9438-3879 and Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 (2012) A comparison study of the prognostics approaches to light emitting diodes under accelerated aging. In: 2012 13th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems. Institute of Electrical and Electronic Engineers, Inc, Piscataway, N.J., USA. ISBN 978-1-4673-1512-8 (doi:https://doi.org/10.1109/ESimE.2012.6191783)

Medway Queen, beam finite element, longitudinal bending, buckling failure

Rajaguru, Pushparajah ORCID: 0000-0002-6041-0517, Mason, Peter, Bailey, Chris ORCID: 0000-0002-9438-3879 and Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 (2014) Buckling analysis on the hull of the historic paddle steamer ‘Medway Queen’. Ships and Offshore Structures, 9 (6). pp. 643-654. ISSN 1744-5302 (Print), 1754-212X (Online) (doi:https://doi.org/10.1080/17445302.2013.849065)

Modelling; Electronic Packaging; Reliability

Stoyanov, Stoyan ORCID: 0000-0001-6091-1226, Bailey, Chris ORCID: 0000-0002-9438-3879 and Tourloukis, Georgios (2016) Similarity approach for reducing qualification tests of electronic components. Microelectronics Reliability, 67. pp. 111-119. ISSN 0026-2714 (doi:https://doi.org/10.1016/j.microrel.2016.10.017)

N/A

Rajaguru, Pushparajah ORCID: 0000-0002-6041-0517, Mason, Peter, Bailey, Christopher ORCID: 0000-0002-9438-3879 and Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 (2012) Structural Analysis on the Riveted Hull of the Paddle Steamer Medway Queen. In: Historic Ships Conference 2012. Royal Institution of Naval Architects (RINA).

Nano-Imprint Forming (NIF), Finite Element Analysis, fabrication

Stoyanov, Stoyan ORCID: 0000-0001-6091-1226, Amalou, Farid, Sinclair, Keith I., Bailey, Christopher ORCID: 0000-0002-9438-3879 and Desmulliez, Marc P.Y. (2008) Minimising the risk of defects in nano-imprint forming. 31st International Spring Seminar on Electronics Technology, 2008. ISSE '08. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 367-372. ISBN 978-1-4244-3972-0 (doi:https://doi.org/10.1109/ISSE.2008.5276670)

Production technology; Mechanical engineering; Materials; Generative manufacturing; Additive manufacturing; 3D printing; Mechanical engineering; Designers, Production technicians; Materials scientist; manufacturing technicians; Product developers; Designers

Bailey, C. ORCID: 0000-0002-9438-3879, Stoyanov, S. ORCID: 0000-0001-6091-1226, Tilford, T. and Tourloukis, G. (2016) Modelling methodologies for quality assessment of 3D inkjet printed electronic products. In: 3rd Fraunhofer Direct Digital Manufacturing Conference, DDMC 2016. Proceedings. Fraunhofer Verlag, Stuttgart. ISBN 978-3-8396-9128-1 ISSN 978-3-8396-1001-5 (Online)

QFN, conformal coating, reliability, finite element analysis, thermal cycling

Yin, Chunyan ORCID: 0000-0003-0298-0420, Stoyanov, Stoyan ORCID: 0000-0001-6091-1226, Bailey, Christopher ORCID: 0000-0002-9438-3879 and Stewart, Paul (2019) Thermo-mechanical analysis of conformally coated QFNs for high reliability applications. IEEE Transactions on Components, Packaging and Manufacturing Technology, 9 (11). pp. 2210-2218. ISSN 2156-3950 (Print), 2156-3985 (Online) (doi:https://doi.org/10.1109/TCPMT.2019.2925874)

Reduced order models, system-in-package, risk analysis, probabilistic optimisation, microsystems

Stoyanov, Stoyan ORCID: 0000-0001-6091-1226, Rajaguru, Pushpa ORCID: 0000-0002-6041-0517 and Bailey, Chris ORCID: 0000-0002-9438-3879 (2010) Reduced order modelling for reliability optimisation of advanced micro-systems. In: EngOpt2010 2nd International Conference on Engineering Optimization. International Conference on Engineering Optimization (2). EngOpt2010, pp. 1-10.

Response Surface, Numerical Optimilation, Electronic Packaging, Reliability,Multi-physics modeling, Thermal Management

Stoyanov, S. ORCID: 0000-0001-6091-1226 and Bailey, C. ORCID: 0000-0002-9438-3879 (2002) Response Surface Modeling and Optimisation for Reliable Electronic Products. In: The Fifth International IEEE Symposium on High Density Packaging and Component Failure Analysis in Electronics Manufacturing. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 49-57. ISBN 0780398238

SiP structure, package design parameters, thermo-mechanical behaviour, non-linear transient finite element simulations

Stoyanov, Stoyan ORCID: 0000-0001-6091-1226, Bailey, Christopher ORCID: 0000-0002-9438-3879, Strusevitch, Nadia and Yannou, J.-M. (2007) Computational approach for reliable and robust system-in-package design. 2007 30th International Spring Seminar On Electronics Technology. International Spring Seminar on Electronics Technology ISSE . Institute of Electrical and Electronics Engineers, Inc., New York, pp. 40-45. ISBN 9781424412174 (doi:https://doi.org/10.1109/ISSE.2007.4432818)

SiP structure, thermo-mechanical behaviour, reduced order models (ROM)

Stoyanov, Stoyan ORCID: 0000-0001-6091-1226, Yannou, J.-M., Bailey, Christopher ORCID: 0000-0002-9438-3879 and Strusevitch, Nadia (2007) Reliability based design optimisation for system-in-package. In: Ernst, L.J., Zhang, G.Q., Rodgers, P., Meuwissen, M., Marco, S., Van Driel, W.D. and De Saint Leger, O., (eds.) EUROSIME 2007: Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, Proceedings. Institute of Electrical and Electronics Engineers, Inc., New York, pp. 289-296. ISBN 9781424411054 (doi:https://doi.org/10.1109/ESIME.2007.359948)

SiP technology, thermo-mechanical reliability analysis, stacked die, side-by-side dies, embedded die, finite element analysis, numerical optimisation, uncertainty analysis, lead free solder interconnects, accelerated temperature cycle, fatigue life-time, warpage

Bailey, C. ORCID: 0000-0002-9438-3879, Stoyanov, S. ORCID: 0000-0001-6091-1226, Strusevich, N. and Yannou, J.-M. (2007) Reliability analysis of SiP structures. HDP'07: Proceedings of the 2007 International Symposium on High Density Packaging and Microsystem Integration. Institute of Electrical and Electronics Engineers, Inc., New York, p. 38. ISBN 9781424412525 (doi:https://doi.org/10.1109/HDP.2007.4283556)

SiP, packaging design, solder joints, numerical modelling

Strusevitch, Nadia, Stoyanov, Stoyan ORCID: 0000-0001-6091-1226, Liu, D., Bailey, Christopher ORCID: 0000-0002-9438-3879, Richardson, A., Dumas, N., Yannou, J.M. and Georgel, V. (2006) Modelling the behavior of solder joints for wafer level SiP. In: Pang, J.H.L., Vaidyanathan, K., Wong, S.C.K. and Tee, T.Y., (eds.) 2006 8th Electronics Packaging Technology Conference (EPTC 2006) : 6-8 December 2006, Singapore. IEEE, Picsataway, N.J., pp. 127-132. ISBN 1424406641; 142440665X (doi:https://doi.org/10.1109/EPTC.2006.342703)

additive manufacturing, inkjet printing, microelectronics fabrication, reliability, numerical analysis

Tilford, Tim ORCID: 0000-0001-8307-6403, Stoyanov, Stoyan ORCID: 0000-0001-6091-1226, Braun, Jessica, Janhsen, Jan Christoph, Patel, Mayur K. and Bailey, Chris ORCID: 0000-0002-9438-3879 (2021) Comparative reliability of inkjet-printed electronics packaging. IEEE Transactions on Components, Packaging and Manufacturing Technology, 11 (2). pp. 351-362. ISSN 2156-3950 (Print), 2156-3985 (Online) (doi:https://doi.org/10.1109/TCPMT.2021.3049952)

adhesive bonding, chip scale packaging, conducting materials, fine-pitch technology, integrated circuit interconnections, printing, solders

Desmulliez, M.P.Y., Kay, R.W., Stoyanov, S. ORCID: 0000-0001-6091-1226 and Bailey, C. ORCID: 0000-0002-9438-3879 (2004) Stencil printing at sub-100 microns pitch. In: Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 354-358. ISBN 0780388216 (doi:https://doi.org/10.1109/EPTC.2004.1396633)

Desmulliez, M.P.Y., Kay, R.W., Stoyanov, S. ORCID: 0000-0001-6091-1226 and Bailey, C. ORCID: 0000-0002-9438-3879 (2004) Stencil printing at sub-100 microns pitch. In: Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 354-358. ISBN 0780388216 (doi:https://doi.org/10.1109/EPTC.2004.1396633)

aerospace, ball grid arrays, finite element analysis, integrated circuit interconnections, integrated circuit reliability, life testing, solders thermal stress cracking

Stoyanov, S. ORCID: 0000-0001-6091-1226, Mackay, W., Bailey, C. ORCID: 0000-0002-9438-3879, Jibb, D. and Gregson, C. (2004) Lifetime assessment of electronic components for high reliability aerospace applications. In: Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 324-329. ISBN 0780388216 (doi:https://doi.org/10.1109/EPTC.2004.1396627)

ball grid array, printed circuit board reflow,

Stoyanov, Stoyan ORCID: 0000-0001-6091-1226, Dabek, Alexander and Bailey, Chris ORCID: 0000-0002-9438-3879 (2013) Thermo–mechanical sub–modelling of BGA components in PCB reflow. In: Proceedings of 36th International Spring Seminar on Electronics Technology, Alba Iulia, Romania, May 8-12, 2013, pp.1-8. Institute of Electrical and Electronics Engineers, Piscataway, NJ, USA, pp. 253-258. ISBN 9781479900367 ISSN 2161-2528 (doi:https://doi.org/10.1109/ISSE.2013.6648252)

ball grid arrays, flip-chip devices, packaging, semiconductor device reliability

Bailey, C. ORCID: 0000-0002-9438-3879, Stoyanov, S. ORCID: 0000-0001-6091-1226 and Lu, H. ORCID: 0000-0002-4392-6562 (2004) Reliability predictions for high density packaging. In: Proceeding of The Sixth IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis (HDP'04). Institute of Electrical and Electronics Engineers, Inc., Piscataway, N.J., U.S.A., pp. 121-128. ISBN 0780386205 (doi:https://doi.org/10.1109/HPD.2004.1346684)

circuits, electromechanical devices, electronics industry, reliability management

Richardson, Andrew, Bailey, Christopher ORCID: 0000-0002-9438-3879, Yanou, Jean Marc, Dumas, Norbert, Liu, Dongsheng, Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 and Strusevitch, Nadia (2007) "System in package technology" - design for manufacture challenges. Circuit World, 33 (1). pp. 36-46. ISSN 0305-6120 (doi:https://doi.org/10.1108/03056120710723706)

commercial off-the shelf components, modelling, refinishing, reliability

Stoyanov, S. ORCID: 0000-0001-6091-1226 and Bailey, C. ORCID: 0000-0002-9438-3879 (2015) Modelling the impact of refinishing processes on COTS components for use in aerospace applications. Microelectronics Reliability, 55 (9-10). pp. 1271-1279. ISSN 0026-2714 (doi:https://doi.org/10.1016/j.microrel.2015.07.030)

compuational fluid dynamics (CFD), wave soldering, gas flow, modelling

Stoyanov, S. ORCID: 0000-0001-6091-1226, Bailey, C. ORCID: 0000-0002-9438-3879, Saxena, N. and Adams, S. (2004) Modelling the wave soldering process. In: Proceedings of the 6th International Conference on Electronics Materials and Packaging (EMAP 2004). Institute of Electrical and Electronics Engineers, pp. 553-558. ISBN 983251486X

computational fluid dynamics (CFD), isotropic conductive adhesives (ICAs), organic light emitting diodes (OLED)

Kay, Robert W., Stoyanov, Stoyan ORCID: 0000-0001-6091-1226, Glinski, Greg P., Bailey, Christopher ORCID: 0000-0002-9438-3879 and Desmulliez, Marc P.Y. (2007) Ultra-fine pitch stencil printing for a low cost and low temperature flip-chip assembly process. IEEE Transactions on Components and Packaging Technologies, 30 (1). pp. 129-136. ISSN 1521-3331 (doi:https://doi.org/10.1109/TCAPT.2007.892085)

computational fluid dynamics, CFD, computer aided analysis, engineering computing, flow, nitrogen, optimisation, oxygen, wave soldering

Stoyanov, S. ORCID: 0000-0001-6091-1226, Bailey, C. ORCID: 0000-0002-9438-3879, Saxena, N. and Adams, S. (2005) Optimising the wave soldering process for lead free solders. In: Proceeding of 2005 International Conference on Asian Green Electronics - Design for Manufacturability and Reliability - (2005 AGEC). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 125-128. ISBN 0780388062 (doi:https://doi.org/10.1109/AGEC.2005.1452331)

computational mechanics, design, electronic components

Stoyanov, S. ORCID: 0000-0001-6091-1226, Bailey, C. ORCID: 0000-0002-9438-3879, Lu, H. ORCID: 0000-0002-4392-6562 and Cross, M. (2002) Integrated computational mechanics and optimization for design of electronic components. In: Parmee, Ian C. and Hajela, Prabhat, (eds.) Optimization In Industry. Springer Verlag, pp. 57-71. ISBN 9781852338342

computational mechanics, numerical optimization material properties, electronic packages

Stoyanov, S. ORCID: 0000-0001-6091-1226, Bailey, C. ORCID: 0000-0002-9438-3879 and Cross, M. (2001) Integrating computational mechanics and numerical optimization for the design of material properties in electronic packages. In: Computational Modeling of Materials, Minerals and Metals Processing [Conference Proceedings]. The Mineral, Metals and Materials Society (TMS), Warrendale, PA, USA, pp. 551-562. ISBN 0873395131

computational modelling, material deformation

Stoyanov, S. ORCID: 0000-0001-6091-1226, Bailey, C. ORCID: 0000-0002-9438-3879, Tang, Y.K., Marson, S., Dyer, A., Allen, D. and Desmulliez, M. (2010) Computational modelling and optimisation of the fabrication of nano-structures using focused ion beam and imprint forming technologies. Journal of Physics: Conference Series (JPCS), 253 (1):012008. ISSN 1742-6588 (Print), 1742-6596 (Online) (doi:https://doi.org/10.1088/1742-6596/252/1/012008)

computational models

Stoyanov, Stoyan ORCID: 0000-0001-6091-1226, Tang, Ying Kit, Bailey, Christopher ORCID: 0000-0002-9438-3879, Evans, Robert, Marson, Silvia and Allen, David (2009) Modelling and process capability analysis of focused ion beam. ISSE 2009: 32nd International Spring Seminar on Electronics Technology: Hetero System Integration, the path to New Solutions in the Modern Electronics - Conference Proceedings. IEEE Computer Society, Piscataway, NJ USA. ISBN 97814244 42607 (Print) (doi:https://doi.org/10.1109/ISSE.2009.5206925)

computer aided conservation, computational modelling, ship modelling, smeared shell approach, Cutty Sark, composite structures

Stoyanov, Stoyan ORCID: 0000-0001-6091-1226, Mason, Peter and Bailey, Chris ORCID: 0000-0002-9438-3879 (2010) Smeared shell modelling approach for structural analysis of heritage composite structures – An application to the Cutty Sark conservation. Computers & Structures, 88 (11-12). pp. 649-663. ISSN 0045-7949 (doi:https://doi.org/10.1016/j.compstruc.2010.02.005)

computer simulation, curing, delamination, fatigue of materials, interfaces (materials), microelectronic processing, soldered joints; X ray microscopes, scanning acoustic microscopes, flip chip devices

Lu, H. ORCID: 0000-0002-4392-6562, Hung, K.C., Stoyanov, S. ORCID: 0000-0001-6091-1226, Bailey, C. ORCID: 0000-0002-9438-3879 and Chan, Y.C. (2002) No-flow underfill flip chip assembly–an experimental and modeling analysis. Microelectronics Reliability, 42 (8). pp. 1205-1212. ISSN 0026-2714 (doi:https://doi.org/10.1016/S0026-2714(02)00092-6)

convolutional neural network; machine learning; composite properties; copper pattern; printed circuit board; PCB; conductive layer; redistribution layer

Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 and Bailey, Chris ORCID: 0000-0002-9438-3879 (2022) Deep learning modelling for composite properties of PCB conductive layers. In: 2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE). Institute of Electrical and Electronics Engineers (IEEE), Piscataway, New Jersey, pp. 1-7. ISBN 978-1665458375 (doi:https://doi.org/10.1109/EuroSimE54907.2022.9758885)

crystal plasticity; solder joints; SAC305; thermal fatigue; microstructure; multi-scale modelling; thermo-mechanical Reliability

Xu, Yilun, Xian, Jingwei, Stoyanov, Stoyan ORCID: 0000-0001-6091-1226, Bailey, Christopher ORCID: 0000-0002-9438-3879, Coyle, Richard, Gourlay, Christopher and Dunne, Fionn (2022) A multi-scale approach to microstructure-sensitive thermal fatigue in solder joints. International Journal of Plasticity, 155:103308. ISSN 0749-6419 (doi:https://doi.org/10.1016/j.ijplas.2022.103308)

data analytics, smart test, prognostics, machine learning, electronics product qualification

Stoyanov, Stoyan ORCID: 0000-0001-6091-1226, Ahsan, Mominuil and Bailey, Chris ORCID: 0000-0002-9438-3879 (2018) Data analytics approach for optimal qualification testing of electronic components. In: Proceedings EuroSimE 2018. 2018 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) . IEEE Xplore, pp. 1-9. ISBN 978-1-5386-2358-9 (doi:https://doi.org/10.1109/EuroSimE.2018.8369926)

data driven prognostics, health monitoring, light emitting diodes, LEDs

Sutharssan, Thamo, Stoyanov, Stoyan ORCID: 0000-0001-6091-1226, Bailey, Christopher ORCID: 0000-0002-9438-3879 and Rosunally, Yasmine (2012) Prognostics and health monitoring of high power LED. Micromachines, 3 (1). pp. 78-100. ISSN 2072-666X (doi:https://doi.org/10.3390/mi3010078)

data driven prognostics, prognostics health management, PHM, light emitting diodes, LEDs

Sutharssan, T., Stoyanov, S. ORCID: 0000-0001-6091-1226, Bailey, C. ORCID: 0000-0002-9438-3879 and Rosunally, Y. (2012) Data analysis techniques for real-time prognostics and health management of semiconductor devices. In: Microelectronics and Packaging. Institute of Electrical and Electronic Engineers, Inc, Piscataway, NJ, USA, pp. 1-7. ISBN 978-1-4673-0694-2 (print)

data mining, machine learning, smart qualification testing, electronic components, intelligent manufacturing, prognostics modelling

Stoyanov, Stoyan ORCID: 0000-0001-6091-1226, Ahsan, Mominul, Bailey, Chris ORCID: 0000-0002-9438-3879, Wotherspoon, Tracy and Hunt, Craig (2019) Predictive analytics methodology for smart qualification testing of electronic components. Journal of Intelligent Manufacturing, 30 (3). pp. 1497-1514. ISSN 0956-5515 (Print), 1572-8145 (Online) (doi:https://doi.org/10.1007/s10845-018-01462-9)

data-driven prognostics, data analysis, machine learning, modelling, electronics manufacturing, quality, qualification testing

Ahsan, M., Stoyanov, S. ORCID: 0000-0001-6091-1226, Bailey, C. ORCID: 0000-0002-9438-3879 and Albarbar, A. (2020) Developing computational intelligence for smart qualification testing of electronic products. IEEE Access, 8. pp. 16922-16933. ISSN 2169-3536 (Online) (doi:https://doi.org/10.1109/ACCESS.2020.2967858)

decision support system, electronic product design, numerical modelling

Tang, Y.K., Stoyanov, Stoyan ORCID: 0000-0001-6091-1226, Bailey, Christopher ORCID: 0000-0002-9438-3879 and Lu, Hua ORCID: 0000-0002-4392-6562 (2006) Decision support systems for eco-friendly electronic products. Electronic Materials and Packaging, 2006. EMAP 2006. International Conference on. IEEE, Piscataway, N.J., pp. 77-84. ISBN 1424408342; 9781424408344 (doi:https://doi.org/10.1109/EMAP.2006.4430580)

decision tree, logistic regression, random forest, incomplete dataset, electronic device

Hinojosa Herrera, Ana Elsa ORCID: 0000-0002-0636-1881, Stoyanov, Stoyan ORCID: 0000-0001-6091-1226, Bailey, Christopher ORCID: 0000-0002-9438-3879, Walshaw, Christopher ORCID: 0000-0003-0253-7779 and Yin, Chunyan ORCID: 0000-0003-0298-0420 (2019) Data analytics to reduce stop-on-fail test in electronics manufacturing. Open Computer Sciences, 9 (1). pp. 200-211. ISSN 2299-1093 (Online) (doi:https://doi.org/10.1515/comp-2019-0014)

decision tree, production test set compaction, incomplete dataset, stop-on-fail test, electronic device qualification

Hinojosa Herrera, Ana Elsa ORCID: 0000-0002-0636-1881 and Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 (2019) Data driven predictive model to compact a production stop-on-fail test set for an electronic device. In: Proceedings of the 2018 International Conference on Computing, Electronics & Communications Engineering (iCCECE). IEEE Xplore, pp. 59-64. ISBN 9781538649046 (doi:https://doi.org/10.1109/iCCECOME.2018.8658941)

design methodology, micro-machining process, Focused Ion Beam (FIB) method, Design of Experiment (DoE) method, Reduced Order Models (ROM)

Tang, Ying Kit, Stoyanov, S. ORCID: 0000-0001-6091-1226, Bailey, C. ORCID: 0000-0002-9438-3879 and Chan, Y.C. (2008) Uncertainty analysis to minimise risk in designing micro-electronics manufacturing processes. In: 2nd Electronics System-Integration Technology Conference, 2008. ESTC 2008. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 941-946. ISBN 978-1-4244-2814-4 (Print), 978-1-4244-2813-7 (Electronic) (doi:https://doi.org/10.1109/ESTC.2008.4684478)

electronics design, design optimistation, numerical modelling, computer modelling

Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2006) Optimisation modelling for design of advanced interconnects. 1st Electronics Systemintegration Technology Conference. Dresden, Saxony, Germany. 2006 proceedings. IEEE, Piscataway, NJ, USA, pp. 1108-1117. ISBN 1424405521 (doi:https://doi.org/10.1109/ESTC.2006.280148)

failure analysis, reliability, solders, thermal management (packaging), tin alloys, whiskers (crystal)

Stoyanov, Stoyan ORCID: 0000-0001-6091-1226, Bailey, Chris ORCID: 0000-0002-9438-3879, Roulston, John, Stewart, Paul and Tollafield, Peter (2014) Study of impact of thermal refinishing process on reliability of COTS components. In: 20th International Workshop on Thermal Investigations of ICs and Systems. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA. ISBN 9781479954155 (doi:https://doi.org/10.1109/THERMINIC.2014.6972531)

finite element analysis, Cutty Sark, ship, modelling

Stoyanov, Stoyan ORCID: 0000-0001-6091-1226, Mason, P. and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2006) Finite element modelling of an historic ship structure - the Cutty Sark. In: Armstrong, Cecil G., (ed.) Proceedings of a joint conference of the Association for Computational Mechanics in Engineering (UK) and the Irish Society for Scientific and Engineeering Computation. 19th-20th April 2006, Queen's University Belfast. ACME/ISSEC, pp. 35-38.

finite element analysis, reliable electronic packaging

Stoyanov, S. ORCID: 0000-0001-6091-1226 and Bailey, C. ORCID: 0000-0002-9438-3879 (2003) Optimization and finite element analysis for reliable electronic packaging. In: Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-electronics and Micro-systems. Proceedings of EuroSimE 2003. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 391-399. ISBN 0780370546

finite element modelling, focal plane array, compression bonding, flip-chip assembly, reliability, cryogenic temperature, compound semiconductors

Stoyanov, Stoyan ORCID: 0000-0001-6091-1226, Bailey, Christopher ORCID: 0000-0002-9438-3879, Waite, Rhys, Hicks, Christopher and Golding, Terry (2020) Packaging challenges and reliability performance of compound semiconductor focal plane arrays. In: 2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC). IEEE, pp. 1-8. ISBN 978-0956808660 (doi:https://doi.org/10.23919/EMPC44848.2019.8951842)

finite element modelling, reliability, component terminations, hot solder dip refinishing process, tin whiskers, commercial off-the-shelf components, scanning acoustic microscopy

Stoyanov, Stoyan ORCID: 0000-0001-6091-1226, Bailey, Christopher ORCID: 0000-0002-9438-3879, Stewart, Paul, Parker, Mike and Roulston, John F. (2020) Experimental and modelling study on delamination risks for refinished electronic packages under hot solder dip loads. IEEE Transactions on Components, Packaging and Manufacturing Technology, 10 (3). pp. 502-515. ISSN 2156-3950 (Print), 2156-3985 (Online) (doi:https://doi.org/10.1109/TCPMT.2020.2972635)

five process parameters, post weld stresses, pigtail fibre optic, butterfly module, response surface methodology, Integrated Design of Experiments (DoE), Finite Element Analysis (FEA), Monte Carlo simulation, particle swarm optimisation algorithm

Mallik, A., Stoyanov, S. ORCID: 0000-0001-6091-1226, Bailey, C. ORCID: 0000-0002-9438-3879 and Firth, P. (2009) Design for reliability methodology for micro laser welding of pigtail fibres. In: Thermal, Mechanical and Multi-Physics simulation and Experiments in Microelectronics and Microsystems. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 1-7. ISBN 978-1-4244-4161-7 (electronic), 978-1-4244-4160-0 (print) (doi:https://doi.org/10.1109/ESIME.2009.4938409)

flip chip, optimization, reliability, underfill

Stoyanov, S. ORCID: 0000-0001-6091-1226, Bailey, C. ORCID: 0000-0002-9438-3879 and Cross, M. (2002) Optimisation modelling for flip-chip solder joint reliability. Soldering and Surface Mount Technology, 14 (1). pp. 49-58. ISSN 0954-0911 (doi:https://doi.org/10.1108/09540910210416477)

flip-chip assembly, isotropic conductive adhesives, (ICA), reliability modelling

Stoyanov, Stoyan ORCID: 0000-0001-6091-1226, Bailey, Christopher ORCID: 0000-0002-9438-3879, Kay, Robert, Durairaj, Rajkumar, Hendriksen, Mike, Desmuilliez, Marc and Ekere, Ndy (2004) Assembly and reliability of isotropic conductive adhesives for fine pitch flip-chip applications. In: TMS 2004 133rd TMS Annual Meeting & Exhibition 2004, 14-18 Mar 2004, Charlotte, North Carolina, USA. (Unpublished)

flip-chip assembly, no-flow underfill materials

Lu, H. ORCID: 0000-0002-4392-6562, Stoyanov, S. ORCID: 0000-0001-6091-1226, Bailey, C. ORCID: 0000-0002-9438-3879, Hung, K.C. and Chan, Y.C. (2001) A modelling and experimental analysis of the no-flow underfill process for flip-chip assembly. In: Proceedings of the 4th International Symposium on Electronic Packaging Technology. Institute of Electrical and Electronics Engineers, Inc., pp. 338-343. ISBN 0780398114

hot solder dip, (HSD), leaded components, copper, electronic packaging thermal management, predictive models, stress, thermal stresses, thermomechanical processes, wires

Stoyanov, Stoyan ORCID: 0000-0001-6091-1226, Best, Chris, Alam, Mohammad, Bailey, Christopher ORCID: 0000-0002-9438-3879, Tollafield, Peter, Parker, Mike and Scott, Jim (2012) Modelling and testing the impact of hot solder dip process on leaded components. In: 2012 35th International Spring Seminar on Electronics Technology. IEEE Conference Publications . Institute of Electrical and Electronic Engineers, Inc., Piscataway, N.J., USA, pp. 303-308. ISBN 978-1-4673-2241-6 (Print), 978-1-4673-2239-3 (Online) ISSN 2161-2528 (doi:https://doi.org/10.1109/ISSE.2012.6273091)

isotropic conductive adhesives (ICAs), flip-chip packaging, low temperature (T<100 C)

Stoyanov, Stoyan ORCID: 0000-0001-6091-1226, Kay, Robert W., Bailey, Christopher ORCID: 0000-0002-9438-3879 and Desmulliez, Marc P.Y. (2007) Computational modelling for reliable flip-chip packaging at sub-100 micron pitch using isotropic conductive adhesives. Microelectronics Reliability, 47 (1). pp. 132-141. ISSN 0026-2714 (doi:https://doi.org/10.1016/j.microrel.2006.01.004)

manufacturing systems, nanotechnology, modelling, finite element analysis, deformation, process efficiency

Stoyanov, Stoyan ORCID: 0000-0001-6091-1226, Tilford, Tim ORCID: 0000-0001-8307-6403, Amalou, Farid, Cargill, Scott, Bailey, Chris ORCID: 0000-0002-9438-3879 and Desmulliez, Marc (2011) Modelling and optimisation study on the fabrication of nano-structures using imprint forming process. Engineering Computations, 28 (1). pp. 93-111. ISSN 0264-4401 (doi:https://doi.org/10.1108/02644401111097046)

micro-BGA; solder joint reliability; compliant PCB; physics-of-failure; lifetime modelling; edgebond; underfill; SnPbAgCu quaternary solder alloy

Stoyanov, Stoyan ORCID: 0000-0001-6091-1226, Stewart†, Paul and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2021) Reliability optimisation and lifetime modelling of micro-BGA assemblies in harsh environment applications. In: 2021 23rd European Microelectronics and Packaging Conference & Exhibition (EMPC). 13-16 Sept. 2021. Gothenburg, Sweden. IEEE Xplore . Institute of Electrical and Electronics Engineers (IEEE), Piscataway, New Jersey, pp. 1-8. ISBN 978-0956808677 ; 978-1665423687 (doi:https://doi.org/10.23919/EMPC53418.2021.9584970)

microsystems, multiphysics, analytical techniques

Xue, Xiangdong, Bailey, Chris ORCID: 0000-0002-9438-3879, Lu, Hua ORCID: 0000-0002-4392-6562 and Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 (2011) Integration of analytical techniques in stochastic optimization of microsystem reliability. Microelectronics Reliability, 51 (5). pp. 936-945. ISSN 0026-2714 (doi:https://doi.org/10.1016/j.microrel.2011.01.008)

modelling methodology, thermal analysis, hot solder dip process, tin whiskers

Stoyanov, Stoyan ORCID: 0000-0001-6091-1226, Bailey, Chris ORCID: 0000-0002-9438-3879, Alam, M.O., Yin, Chunyan ORCID: 0000-0003-0298-0420, Best, Chris, Tollafield, Peter, Crawford, Rob, Parker, Mike and Scott, Jim (2013) Modelling methodology for thermal analysis of hot solder dip process. Microelectronics Reliability, 53 (8). pp. 1055-1067. ISSN 0026-2714 (doi:https://doi.org/10.1016/j.microrel.2013.02.018)

modelling technologies, analysis tools, nano-techology, microsystems, fabrication, packaging, testing

Bailey, Christopher ORCID: 0000-0002-9438-3879, Lu, Hua ORCID: 0000-0002-4392-6562, Stoyanov, Stoyan ORCID: 0000-0001-6091-1226, Tilford, Timothy, Xue, Xiangdong, Alam, M. O., Yin, Chunyan ORCID: 0000-0003-0298-0420 and Hughes, Michael (2008) Modelling technologies and applications. In: Morris, James E., (ed.) Nanopackaging: Nanotechnologies and Electronics Packaging. Springer Science+Business Media, LLC, New York, USA, pp. 15-38. ISBN 978-0-387-47325-3 (Print) 978-0-387-47326-0 (Online) (doi:https://doi.org/10.1007/978-0-387-47325-3_2)

modelling, prototyping, micro-probe

Stoyanov, Stoyan ORCID: 0000-0001-6091-1226, Bailey, Christopher ORCID: 0000-0002-9438-3879, Leach, Richard, Hughes, Ben, Wilson, Alan, O'Neill, William, Dorey, Robert, Shaw, Christopher, Underhill, Daniel and Almond, Heather (2008) Modelling and prototyping the conceptual design of 3D CMM micro-probe. 2nd Electronics System-Integration Technology Conference, 2008. ESTC 2008. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 193-198. ISBN 978-1-4244-2814-4 (Print), 978-1-4244-2813-7 (Online) (doi:https://doi.org/10.1109/ESTC.2008.4684348)

multi-physics, multi-scale simulations, computational modelling

Cross, Mark, Stoyanov, Stoyan ORCID: 0000-0001-6091-1226, Mouchmov, Apostol, Lu, Hua ORCID: 0000-0002-4392-6562, Croft, Nick, Slone, Avril, Williams, Alison, Bailey, Chris ORCID: 0000-0002-9438-3879 and Pericleous, Koulis ORCID: 0000-0002-7426-9999 (2003) Multi-physics-multi-scale simulation and optimisation: the next generation. In: NAFEMS World Congress, 2003, Orlando, Florida, USA.

nano-imprint forming (NIF), modelling methodology, 3D-miniaturised systems

Stoyanov, Stoyan ORCID: 0000-0001-6091-1226, Amalou, Farid, Sinclair, Keith I., Bailey, Christopher ORCID: 0000-0002-9438-3879 and Desmulliez, Marc P.Y. (2008) Modelling of nano-imprint forming process for the production of miniaturised 3D structures. International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems, 2008. EuroSimE 2008. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 497-504. ISBN 978-1-4244-2127-5 (doi:https://doi.org/10.1109/ESIME.2008.4525088)

novel micro-integrated products, failure, design process

Rajaguru, Pushpa ORCID: 0000-0002-6041-0517, Stoyanov, Stoyan ORCID: 0000-0001-6091-1226, Tang, Ying Kit, Bailey, Chris ORCID: 0000-0002-9438-3879, Claverley, James, Leach, Richard and Topham, David (2010) Numerical modelling methodology for design of miniaturised integrated products - an application to 3D CMM micro-probe development. 2010 11th International Conference on Thermal, Mechanical and Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems, EuroSimE 2010. IEEE Computer Society, Piscataway NJ. ISBN 9781424470266 (doi:https://doi.org/10.1109/ESIME.2010.5464573)

optimisation, methodology, micro and nano system, focused ion beam

Tang, Y.K., Stoyanov, S. ORCID: 0000-0001-6091-1226, Bailey, C. ORCID: 0000-0002-9438-3879 and Chan, Y.C. (2008) Optimisation methodology for risk mitigation in advanced micro-system electronics manufacturing. In: EngOpt 2008 - International Conference on Engineering Optimization. Universidade Federal do Rio de Janeiro, Rio de Janeiro, Brazil. ISBN 978-85-7650-152-7

optimization, techniques, prototypes, product reliability

Stoyanov, Stoyan ORCID: 0000-0001-6091-1226, Bailey, Chris ORCID: 0000-0002-9438-3879 and Desmulliez, Marc (2009) Optimisation modelling for thermal fatigue reliability of lead-free interconnects in fine-pitch flip-chip packaging. Soldering & Surface Mount Technology, 21 (1). pp. 11-24. ISSN 0954-0911 (doi:https://doi.org/10.1108/09540910910928265)

power electronics, data-driven prognostics, insulated gate bipolar transistors, mathematical model, monitoring, physics, predictive models, prognostics and health management

Kabir, Ahsanul, Bailey, Christopher ORCID: 0000-0002-9438-3879, Lu, Hua ORCID: 0000-0002-4392-6562 and Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 (2012) A review of data-driven prognostics in power electronics. In: 2012 35th International Spring Seminar on Electronics Technology. IEEE Conference Publications . Institute of Electrical and Electronic Engineers, Inc., Piscataway, N.J., USA, pp. 189-192. ISBN 978-1-4673-2241-6 (Print), 978-1-4673-2239-3 (Online) ISSN 2161-2528 (doi:https://doi.org/10.1109/ISSE.2012.6273136)

probabilities, prognostics framework, computer modelling, Cutty Sark, conservation

Rosunally, Y.Z., Stoyanov, S. ORCID: 0000-0001-6091-1226, Bailey, C. ORCID: 0000-0002-9438-3879, Mason, P., Campbell, S., Monger, G. and Bell, I. (2011) Fusion approach for prognostics framework of heritage structure. IEEE Transactions on Reliability, 60 (1):570453. pp. 3-13. ISSN 0018-9529 (doi:https://doi.org/10.1109/TR.2011.2104451)

product design, prototype, computational fluid dynamics, CFD, computational mechanics, numerical optimisation, statistical methods, computer modelling,

Stoyanov, Stoyan Kostadinov ORCID: 0000-0001-6091-1226 (2004) Optimisation modelling for microelectronics packaging and product design. PhD thesis, University of Greenwich.

prognostics framework, Bayesian networks, computer modelling, Cutty Sark, conservation, physics-of-failure,

Rosunally, Yasmine, Stoyanov, Stoyan ORCID: 0000-0001-6091-1226, Bailey, Christopher ORCID: 0000-0002-9438-3879, Mason, Peter, Campbell, Sheelagh, Monger, George and Bell, Ian (2010) Bayesian networks for predicting remaining life. International Journal of Performability Engineering, 6 (5). pp. 499-512. ISSN 0973-1318

prognostics framework, computer modelling, Cutty Sark, conservation, heritage structures,

Rosunally, Yasmine, Stoyanov, Stoyan ORCID: 0000-0001-6091-1226, Bailey, Christopher ORCID: 0000-0002-9438-3879, Mason, Peter, Campbell, Sheelagh, Monger, George and Bell, Ian (2010) Fusion approach for predictive maintenance of heritage structures. Prognostics & Health Management Conference, 2010, PHM '10. IEEE Conference Publications . IEEE, pp. 1-6. ISBN 978-1-4244-4756-5 (print), 978-1-4244-4758-9 (e-book) (doi:https://doi.org/10.1109/PHM.2010.5413403)

prognostics framework, computer modelling, materials damage, material degradation, prognostic fusion, Cutty Sark, heritage structure, conservation,

Rosunally, Yasmine, Stoyanov, Stoyan ORCID: 0000-0001-6091-1226, Bailey, Christopher ORCID: 0000-0002-9438-3879, Mason, Peter, Campbell, Sheelagh and Monger, George (2009) Prognostics framework for remaining life prediction of Cutty Sark iron structures. Annual Conference of the Prognostics and Health Management Society 2009. Prognostics and Health Management Society, 6 pages.

prognostics, reliability, light emitting diodes, LEDs, algorithms

Sutharssan, Thamo, Bailey, Chris ORCID: 0000-0002-9438-3879, Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 and Rosunally, Yasmine (2011) Prognostics and reliability assessment of light emitting diode packaging. In: Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), 2011 12th International Conference on. Institute of Electrical and Electronics Engineers, Piscataway, NJ, USA, pp. 1-7. ISBN 978-1-4577-1770-3 (print), 978-1-4577-1768-0 (eISBN) (doi:https://doi.org/10.1109/ICEPT.2011.6066984)

reduced order models, power electronic module, risk analysis, probabilistic optimisation, Kriging, radial basis, microsystems

Rajaguru, Pushparajah ORCID: 0000-0002-6041-0517, Stoyanov, Stoyan ORCID: 0000-0001-6091-1226, Lu, Hua ORCID: 0000-0002-4392-6562 and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2013) Application of Kriging and radial basis function for reliability optimization in power modules. Journal of Electronic Packaging, 135 (2):021009. ISSN 1528-9044 (Print), 1043-7398 (Online) (doi:https://doi.org/10.1115/1.4024056)

risk mitigation, manufacturing process, focused ion beam

Narania, Sailesh, Eshahawi, Tarek, Gindy, Nabil, Tang, Ying Kit, Stoyanov, Stoyan ORCID: 0000-0001-6091-1226, Ridout, Stephen and Bailey, Chris ORCID: 0000-0002-9438-3879 (2008) Risk mitigation framework for a robust design process. In: 2nd Electronics System-Integration Technology Conference, 2008. ESTC 2008. IEEE Conference Publications . Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 1075-1080. ISBN 978-1-4244-2814-4 (Print), 978-1-4244-2813-7 (Online) (doi:https://doi.org/10.1109/ESTC.2008.4684501)

statistical hypothesis testing, refinishing, hot solder dip, leaded component, lead-free

Yin, Chunyan ORCID: 0000-0003-0298-0420, Best, Chris, Bailey, Chris ORCID: 0000-0002-9438-3879 and Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 (2015) Statistical analysis of the impact of refinishing process on leaded components. Microelectronics Reliability, 55 (2). pp. 424-431. ISSN 0026-2714 (doi:https://doi.org/10.1016/j.microrel.2014.11.001)

thermal modelling, hot solder, microelectronics, analytical models, computed tomography, conductivity, heating, lead, materials, thermal analysis

Stoyanov, Stoyan ORCID: 0000-0001-6091-1226, Bailey, Christopher ORCID: 0000-0002-9438-3879, Tollafield, Peter, Crawford, Rob, Parker, Mike, Scott, Jim and Roulston, John (2012) Thermal modelling and optimisation of hot solder dip process. In: 2012 13th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE 2012). Institute of Electrical and Electronic Engineers, Inc., Piscataway, N.J., USA. ISBN 978-1-4673-1512-8 (doi:https://doi.org/10.1109/ESimE.2012.6191763)

three-dimensional miniaturised products, reduced order models, micro-probe

Stoyanov, Stoyan ORCID: 0000-0001-6091-1226, Rajaguru, Pushpa ORCID: 0000-0002-6041-0517, Tang, Ying Kit, Bailey, Chris ORCID: 0000-0002-9438-3879, Claverley, James and Leach, Richard (2010) Reduced order modelling for risk mitigation in design of miniaturised/integrated products. In: ISSE 2010 - 33rd International Spring Seminar on Electronics Technology: Polymer Electronics and Nanotechnologies: Towards System Integration - Conference Proceedings. IEEE Computer Society, Piscataway, USA, pp. 402-407. ISBN 9781424478491 (print), 9781424478507 (online) (doi:https://doi.org/10.1109/ISSE.2010.5547362)

This list was generated on Sat Jan 28 18:52:09 2023 UTC.