Items where Greenwich Author is "Stoyanov, Dr Stoyan"

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Number of items: 87.

3D-Mintegration consortium (supported under EPSRC fund EP/C534212/)

Bailey, Christopher ORCID: https://orcid.org/0000-0002-9438-3879, Lu, Hua ORCID: https://orcid.org/0000-0002-4392-6562, Stoyanov, Stoyan ORCID: https://orcid.org/0000-0001-6091-1226, Tilford, Timothy, Xue, Xiangdong, Alam, M. O., Yin, Chunyan ORCID: https://orcid.org/0000-0003-0298-0420 and Hughes, Michael (2008) Modelling technologies and applications. In: Morris, James E., (ed.) Nanopackaging: Nanotechnologies and Electronics Packaging. Springer Science+Business Media, LLC, New York, USA, pp. 15-38. ISBN 978-0-387-47325-3 (Print) 978-0-387-47326-0 (Online) (doi:10.1007/978-0-387-47325-3_2)

BAE Systems

Stoyanov, S. ORCID: https://orcid.org/0000-0001-6091-1226, Mackay, W., Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879, Jibb, D. and Gregson, C. (2004) Lifetime assessment of electronic components for high reliability aerospace applications. In: Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 324-329. ISBN 0780388216 (doi:10.1109/EPTC.2004.1396627)

British Council (UK/HK Joint Research Scheme - Project No: 9050143)

Lu, H. ORCID: https://orcid.org/0000-0002-4392-6562, Stoyanov, S. ORCID: https://orcid.org/0000-0001-6091-1226, Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879, Hung, K.C. and Chan, Y.C. (2001) A modelling and experimental analysis of the no-flow underfill process for flip-chip assembly. In: Proceedings of the 4th International Symposium on Electronic Packaging Technology. Institute of Electrical and Electronics Engineers, Inc., pp. 338-343. ISBN 0780398114

British Council (UK/HK Joint Research Scheme–Project No. 9050143)

Lu, H. ORCID: https://orcid.org/0000-0002-4392-6562, Hung, K.C., Stoyanov, S. ORCID: https://orcid.org/0000-0001-6091-1226, Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879 and Chan, Y.C. (2002) No-flow underfill flip chip assembly–an experimental and modeling analysis. Microelectronics Reliability, 42 (8). pp. 1205-1212. ISSN 0026-2714 (doi:10.1016/S0026-2714(02)00092-6)

Cassidian (Airbus Defence and Space)

Stoyanov, Stoyan ORCID: https://orcid.org/0000-0001-6091-1226, Bailey, Chris ORCID: https://orcid.org/0000-0002-9438-3879 and Tourloukis, Georgios (2016) Similarity approach for reducing qualification tests of electronic components. Microelectronics Reliability, 67. pp. 111-119. ISSN 0026-2714 (doi:10.1016/j.microrel.2016.10.017)

Cassidian Electronics

Stoyanov, Stoyan ORCID: https://orcid.org/0000-0001-6091-1226, Dabek, Alexander and Bailey, Chris ORCID: https://orcid.org/0000-0002-9438-3879 (2013) Thermo–mechanical sub–modelling of BGA components in PCB reflow. In: Proceedings of 36th International Spring Seminar on Electronics Technology, Alba Iulia, Romania, May 8-12, 2013, pp.1-8. Institute of Electrical and Electronics Engineers, Piscataway, NJ, USA, pp. 253-258. ISBN 9781479900367 ISSN 2161-2528 (doi:10.1109/ISSE.2013.6648252)

Stoyanov, Stoyan ORCID: https://orcid.org/0000-0001-6091-1226, Best, Chris, Alam, Mohammad, Bailey, Christopher ORCID: https://orcid.org/0000-0002-9438-3879, Tollafield, Peter, Parker, Mike and Scott, Jim (2012) Modelling and testing the impact of hot solder dip process on leaded components. In: 2012 35th International Spring Seminar on Electronics Technology. IEEE Conference Publications . Institute of Electrical and Electronic Engineers, Inc., Piscataway, N.J., USA, pp. 303-308. ISBN 978-1-4673-2241-6 (Print), 978-1-4673-2239-3 (Online) ISSN 2161-2528 (doi:10.1109/ISSE.2012.6273091)

Stoyanov, Stoyan ORCID: https://orcid.org/0000-0001-6091-1226, Bailey, Christopher ORCID: https://orcid.org/0000-0002-9438-3879, Tollafield, Peter, Crawford, Rob, Parker, Mike, Scott, Jim and Roulston, John (2012) Thermal modelling and optimisation of hot solder dip process. In: 2012 13th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE 2012). Institute of Electrical and Electronic Engineers, Inc., Piscataway, N.J., USA. ISBN 978-1-4673-1512-8 (doi:10.1109/ESimE.2012.6191763)

Cassidian-EADS Deutschland GmbH

Stoyanov, S. ORCID: https://orcid.org/0000-0001-6091-1226 and Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879 (2015) Modelling the impact of refinishing processes on COTS components for use in aerospace applications. Microelectronics Reliability, 55 (9-10). pp. 1271-1279. ISSN 0026-2714 (doi:10.1016/j.microrel.2015.07.030)

Cutty Sark Trust

Stoyanov, Stoyan ORCID: https://orcid.org/0000-0001-6091-1226, Mason, Peter and Bailey, Chris ORCID: https://orcid.org/0000-0002-9438-3879 (2010) Smeared shell modelling approach for structural analysis of heritage composite structures – An application to the Cutty Sark conservation. Computers & Structures, 88 (11-12). pp. 649-663. ISSN 0045-7949 (doi:10.1016/j.compstruc.2010.02.005)

Rosunally, Yasmine, Stoyanov, Stoyan ORCID: https://orcid.org/0000-0001-6091-1226, Bailey, Christopher ORCID: https://orcid.org/0000-0002-9438-3879, Mason, Peter, Campbell, Sheelagh and Monger, George (2009) Prognostics framework for remaining life prediction of Cutty Sark iron structures. Annual Conference of the Prognostics and Health Management Society 2009. Prognostics and Health Management Society, 6 pages.

Defense Microelectronics Activity (DMEA) (Grant No. H94003-04-D-0003)

Stoyanov, Stoyan ORCID: https://orcid.org/0000-0001-6091-1226, Bailey, Christopher ORCID: https://orcid.org/0000-0002-9438-3879, Stewart, Paul, Parker, Mike and Roulston, John F. (2020) Experimental and modelling study on delamination risks for refinished electronic packages under hot solder dip loads. IEEE Transactions on Components, Packaging and Manufacturing Technology, 10 (3). pp. 502-515. ISSN 2156-3950 (Print), 2156-3985 (Online) (doi:10.1109/TCPMT.2020.2972635)

Defense Microelectronics Activity (DMEA), USA

Yin, Chunyan ORCID: https://orcid.org/0000-0003-0298-0420, Stoyanov, Stoyan ORCID: https://orcid.org/0000-0001-6091-1226, Bailey, Christopher ORCID: https://orcid.org/0000-0002-9438-3879 and Stewart, Paul (2019) Thermo-mechanical analysis of conformally coated QFNs for high reliability applications. IEEE Transactions on Components, Packaging and Manufacturing Technology, 9 (11). pp. 2210-2218. ISSN 2156-3950 (Print), 2156-3985 (Online) (doi:10.1109/TCPMT.2019.2925874)

Direct Allocation grant (Project No. 7100205) of the City University of Hong Kong)

EPSRC

Yang, Xingyu, Zhang, Zijian, Li, Xinhua, Lin, Hungyen, Lawman, Samuel, Stoyanov, Stoyan ORCID: https://orcid.org/0000-0001-6091-1226, Tilford, Timothy ORCID: https://orcid.org/0000-0001-8307-6403, Hu, Yihua, Shen, Yaochun and Zheng, Yalin (2024) High-speed low-cost line-field spectral-domain optical coherence tomography for industrial applications. Optics and Lasers in Engineering, 184 (PART 1):108631. ISSN 0143-8166 (Print), 1873-0302 (Online) (doi:10.1016/j.optlaseng.2024.108631)

Xian, Jingwei, Xu, Yilun, Stoyanov, Stoyan ORCID: https://orcid.org/0000-0001-6091-1226, Coyle, Richard, Dunne, Fionn P. E. and Gourlay, Christopher (2024) The role of microstructure in the thermal fatigue of solder joints. Nature Communications, 15:4258. pp. 1-15. ISSN 2041-1723 (doi:10.1038/s41467-024-48532-6)

Stoyanov, Stoyan ORCID: https://orcid.org/0000-0001-6091-1226, Rajaguru, Pushpa ORCID: https://orcid.org/0000-0002-6041-0517, Tang, Ying Kit, Bailey, Chris ORCID: https://orcid.org/0000-0002-9438-3879, Claverley, James and Leach, Richard (2010) Reduced order modelling for risk mitigation in design of miniaturised/integrated products. In: ISSE 2010 - 33rd International Spring Seminar on Electronics Technology: Polymer Electronics and Nanotechnologies: Towards System Integration - Conference Proceedings. IEEE Computer Society, Piscataway, USA, pp. 402-407. ISBN 9781424478491 (print), 9781424478507 (online) (doi:10.1109/ISSE.2010.5547362)

EPSRC (EP/R004390/1)

Hassan, Sheikh ORCID: https://orcid.org/0000-0002-6215-7340, Rajaguru, Pushparajah ORCID: https://orcid.org/0000-0002-6041-0517, Stoyanov, Stoyan ORCID: https://orcid.org/0000-0001-6091-1226, Bailey, Chris and Tilford, Timothy ORCID: https://orcid.org/0000-0001-8307-6403 (2024) Coupled thermal-mechanical analysis of power electronic modules with finite element method and parametric model order reduction. Power Electronic Devices and Components:100063. ISSN 2772-3704 (Online) (doi:10.1016/j.pedc.2024.100063)

EPSRC (EP/W006642/1)

EPSRC (Grant No. EP/R004390/1; EP/W006642/1; EP/W006405/1; EP/W006308/1)

Stoyanov, Stoyan ORCID: https://orcid.org/0000-0001-6091-1226, Tilford, Tim ORCID: https://orcid.org/0000-0001-8307-6403, Shen, Yaochun and Hu, Yihua (2024) Reliability meta-modelling of power components. In: 2024 47th International Spring Seminar on Electronics Technology (ISSE). Institute of Electrical and Electronics Engineers (IEEE), New Jersey, USA, pp. 1-7. ISBN 979-8350385489 ISSN 2161-2536 (Print), 2161-2528 (Online) (doi:10.1109/ISSE61612.2024.10604175)

EPSRC (Grant No. EP/R018863/1; EP/R019207/1)

Xu, Yilun, Xian, Jingwei, Stoyanov, Stoyan ORCID: https://orcid.org/0000-0001-6091-1226, Bailey, Christopher ORCID: https://orcid.org/0000-0002-9438-3879, Coyle, Richard, Gourlay, Christopher and Dunne, Fionn (2022) A multi-scale approach to microstructure-sensitive thermal fatigue in solder joints. International Journal of Plasticity, 155:103308. ISSN 0749-6419 (doi:10.1016/j.ijplas.2022.103308)

EPSRC (Grant No. EP/W006642/1)

Zhang, Xiaotian, Hu, Yihua, Zhang, Jingwei, Esfahani, Mohammad Nasr, Tilford, Tim ORCID: https://orcid.org/0000-0001-8307-6403 and Stoyanov, Stoyan ORCID: https://orcid.org/0000-0001-6091-1226 (2024) IGBT module DPT efficiency enhancement via multimodal fusion networks and graph convolution networks. IEEE Transactions on Industrial Electronics. ISSN 0278-0046 (Print), 1557-9948 (Online) (doi:10.1109/TIE.2024.3368165)

EPSRC - (3D-MINTEGRATION project under grant EP/C534212/1)

Stoyanov, S. ORCID: https://orcid.org/0000-0001-6091-1226, Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879, Tang, Y.K., Marson, S., Dyer, A., Allen, D. and Desmulliez, M. (2010) Computational modelling and optimisation of the fabrication of nano-structures using focused ion beam and imprint forming technologies. Journal of Physics: Conference Series (JPCS), 253 (1):012008. ISSN 1742-6588 (Print), 1742-6596 (Online) (doi:10.1088/1742-6596/252/1/012008)

EPSRC funded UK Grand Challenge Project 3D-Mintegration (www.3d-mintegration.com) reference EP/C534212/1,

Rajaguru, Pushpa ORCID: https://orcid.org/0000-0002-6041-0517, Stoyanov, Stoyan ORCID: https://orcid.org/0000-0001-6091-1226, Tang, Ying Kit, Bailey, Chris ORCID: https://orcid.org/0000-0002-9438-3879, Claverley, James, Leach, Richard and Topham, David (2010) Numerical modelling methodology for design of miniaturised integrated products - an application to 3D CMM micro-probe development. 2010 11th International Conference on Thermal, Mechanical and Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems, EuroSimE 2010. IEEE Computer Society, Piscataway NJ. ISBN 9781424470266 (doi:10.1109/ESIME.2010.5464573)

ESPRC 3D- MINTEGRATION project under EP/C534212/1.

Stoyanov, Stoyan ORCID: https://orcid.org/0000-0001-6091-1226, Tang, Ying Kit, Bailey, Christopher ORCID: https://orcid.org/0000-0002-9438-3879, Evans, Robert, Marson, Silvia and Allen, David (2009) Modelling and process capability analysis of focused ion beam. ISSE 2009: 32nd International Spring Seminar on Electronics Technology: Hetero System Integration, the path to New Solutions in the Modern Electronics - Conference Proceedings. IEEE Computer Society, Piscataway, NJ USA. ISBN 97814244 42607 (Print) (doi:10.1109/ISSE.2009.5206925)

Engineering and Physical Sciences Research Council (EPSRC)

Stoyanov, Stoyan ORCID: https://orcid.org/0000-0001-6091-1226, Strusevitch, Nadia, Rizvi, Jahir, Georgel, Vincent, Yannou, Jean-Marc and Bailey, Chris ORCID: https://orcid.org/0000-0002-9438-3879 (2008) Design for reliability for wafer level system in package. In: 2nd Electronics System-Integration Technology Conference, 2008. ESTC 2008. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 293-298. ISBN 978-1-4244-2814-4 (Print), 978-1-4244-2813-7 (Online) (doi:10.1109/ESTC.2008.4684364)

Stoyanov, Stoyan ORCID: https://orcid.org/0000-0001-6091-1226, Bailey, Christopher ORCID: https://orcid.org/0000-0002-9438-3879, Leach, Richard, Hughes, Ben, Wilson, Alan, O'Neill, William, Dorey, Robert, Shaw, Christopher, Underhill, Daniel and Almond, Heather (2008) Modelling and prototyping the conceptual design of 3D CMM micro-probe. 2nd Electronics System-Integration Technology Conference, 2008. ESTC 2008. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 193-198. ISBN 978-1-4244-2814-4 (Print), 978-1-4244-2813-7 (Online) (doi:10.1109/ESTC.2008.4684348)

Narania, Sailesh, Eshahawi, Tarek, Gindy, Nabil, Tang, Ying Kit, Stoyanov, Stoyan ORCID: https://orcid.org/0000-0001-6091-1226, Ridout, Stephen and Bailey, Chris ORCID: https://orcid.org/0000-0002-9438-3879 (2008) Risk mitigation framework for a robust design process. In: 2nd Electronics System-Integration Technology Conference, 2008. ESTC 2008. IEEE Conference Publications . Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 1075-1080. ISBN 978-1-4244-2814-4 (Print), 978-1-4244-2813-7 (Online) (doi:10.1109/ESTC.2008.4684501)

Tang, Ying Kit, Stoyanov, S. ORCID: https://orcid.org/0000-0001-6091-1226, Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879 and Chan, Y.C. (2008) Uncertainty analysis to minimise risk in designing micro-electronics manufacturing processes. In: 2nd Electronics System-Integration Technology Conference, 2008. ESTC 2008. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 941-946. ISBN 978-1-4244-2814-4 (Print), 978-1-4244-2813-7 (Electronic) (doi:10.1109/ESTC.2008.4684478)

Stoyanov, Stoyan ORCID: https://orcid.org/0000-0001-6091-1226, Amalou, Farid, Sinclair, Keith I., Bailey, Christopher ORCID: https://orcid.org/0000-0002-9438-3879 and Desmulliez, Marc P.Y. (2008) Minimising the risk of defects in nano-imprint forming. 31st International Spring Seminar on Electronics Technology, 2008. ISSE '08. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 367-372. ISBN 978-1-4244-3972-0 (doi:10.1109/ISSE.2008.5276670)

Engineering and Physical Sciences Research Council (EPSRC) (Grant No. EP/R004390/1; EP/W006642/1)

Rajaguru, Pushpa ORCID: https://orcid.org/0000-0002-6041-0517, Tilford, Tim ORCID: https://orcid.org/0000-0001-8307-6403, Bailey, Chris ORCID: https://orcid.org/0000-0002-9438-3879 and Stoyanov, Stoyan ORCID: https://orcid.org/0000-0001-6091-1226 (2023) Damage mechanics-based failure prediction of wirebond in power electronic module. IEEE Access. ISSN 2169-3536 (doi:10.1109/ACCESS.2023.3342689)

Engineering and Physical Sciences Research Council (EPSRC) UK British Funding Agency

Stoyanov, Stoyan ORCID: https://orcid.org/0000-0001-6091-1226, Kay, Robert W., Bailey, Christopher ORCID: https://orcid.org/0000-0002-9438-3879 and Desmulliez, Marc P.Y. (2007) Computational modelling for reliable flip-chip packaging at sub-100 micron pitch using isotropic conductive adhesives. Microelectronics Reliability, 47 (1). pp. 132-141. ISSN 0026-2714 (doi:10.1016/j.microrel.2006.01.004)

Engineering and Physical Sciences Research Council (EPSRC) through project grant EP/R004390/1 and the multi-institutional grants EP/W006642/1, EP/W006405/1, EP/W006308/1sd

Hassan, Sheikh ORCID: https://orcid.org/0000-0002-6215-7340, Stoyanov, Stoyan ORCID: https://orcid.org/0000-0001-6091-1226, Rajaguru, Pushparajah ORCID: https://orcid.org/0000-0002-6041-0517 and Bailey, Christopher ORCID: https://orcid.org/0000-0002-9438-3879 (2024) Reduced-order modelling for coupled thermal-mechanical analysis and reliability assessment of power electronic modules with nonlinear material behaviours. In: 2024 IEEE 10th Electronics System-Integration Technology Conference (ESTC). Electronics System-Integration Technology Conference, ESTC . Institute of Electrical and Electronics Engineers (IEEE), Berlin, Germany; Piscataway, New Jersey, pp. 1-8. ISBN 979-8350390360 ISSN 2687-9700 (Print), 2687-9727 (Online) (doi:10.1109/ESTC60143.2024.10712079)

Engineering and Physical Sciences Research Council (ESPRC)

Tang, Y.K., Stoyanov, S. ORCID: https://orcid.org/0000-0001-6091-1226, Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879 and Chan, Y.C. (2008) Optimisation methodology for risk mitigation in advanced micro-system electronics manufacturing. In: EngOpt 2008 - International Conference on Engineering Optimization. Universidade Federal do Rio de Janeiro, Rio de Janeiro, Brazil. ISBN 978-85-7650-152-7

Stoyanov, Stoyan ORCID: https://orcid.org/0000-0001-6091-1226, Amalou, Farid, Sinclair, Keith I., Bailey, Christopher ORCID: https://orcid.org/0000-0002-9438-3879 and Desmulliez, Marc P.Y. (2008) Modelling of nano-imprint forming process for the production of miniaturised 3D structures. International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems, 2008. EuroSimE 2008. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 497-504. ISBN 978-1-4244-2127-5 (doi:10.1109/ESIME.2008.4525088)

Engineering and Physical Sciences Research Council (ESPRC) UK

Stoyanov, Stoyan ORCID: https://orcid.org/0000-0001-6091-1226, Yannou, J.-M., Bailey, Christopher ORCID: https://orcid.org/0000-0002-9438-3879 and Strusevitch, Nadia (2007) Reliability based design optimisation for system-in-package. In: Ernst, L.J., Zhang, G.Q., Rodgers, P., Meuwissen, M., Marco, S., Van Driel, W.D. and De Saint Leger, O., (eds.) EUROSIME 2007: Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, Proceedings. Institute of Electrical and Electronics Engineers, Inc., New York, pp. 289-296. ISBN 9781424411054 (doi:10.1109/ESIME.2007.359948)

Engineering and Physical Sciences Research Council (Grant No. EP/R004390/1)

Stoyanov, Stoyan ORCID: https://orcid.org/0000-0001-6091-1226, Tilford, Timothy ORCID: https://orcid.org/0000-0001-8307-6403, Zhang, Xiaotian, Hu, Yihua, Yang, Xingyu and Shen, Yaochun (2024) Physics-informed Machine Learning for predicting fatigue damage of wire bonds in power electronic modules. In: 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE). IEEE Xplore (IEEE digital library) . Institute of Electrical and Electronics Engineers (IEEE), Piscataway, New Jersey, pp. 1-8. ISBN 979-8350393644 ISSN 2833-8596 (Print), 2833-8553 (Online) (doi:10.1109/EuroSimE60745.2024.10491522)

Engineering and Physical Sciences Research Council (Grant No. EP/W006308/1)

Engineering and Physical Sciences Research Council (Grant No. EP/W006405/1)

Engineering and Physical Sciences Research Council (Grant No. EP/W006642/1)

European Community's 7th Framework (FP7/2007-2013) under Grant No. 608985

Tilford, Tim ORCID: https://orcid.org/0000-0001-8307-6403, Stoyanov, Stoyan ORCID: https://orcid.org/0000-0001-6091-1226, Braun, Jessica, Janhsen, Jan Cristophe, Burgard, Matthias, Birch, Richard and Bailey, Chris ORCID: https://orcid.org/0000-0002-9438-3879 (2018) Design, manufacture and test for reliable 3D printed electronics packaging. Microelectronics Reliability, 85. pp. 109-117. ISSN 0026-2714 (doi:10.1016/j.microrel.2018.04.008)

European Community´s 7th Framework Programme (FP7/2007-2013) under grant agreement No. 608985

Tilford, T. ORCID: https://orcid.org/0000-0001-8307-6403, Stoyanov, S. ORCID: https://orcid.org/0000-0001-6091-1226, Tourloukis, G. and Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879 (2016) Numerical analysis of droplet deposition in inkjet printed electronics assembly. In: 2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE). IEEE, pp. 1-7. ISBN 978-1-5090-2106-2 (doi:10.1109/EuroSimE.2016.7463358)

European Community’s 7th Framework (FP7/2007-2013); Grant Agreement No. 608985

Stoyanov, Stoyan ORCID: https://orcid.org/0000-0001-6091-1226 and Bailey, Christopher ORCID: https://orcid.org/0000-0002-9438-3879 (2017) Machine learning for additive manufacturing of electronics. In: Proceedings 2017 40th International Spring Seminar on Electronics Technology (ISSE). IEEE. ISBN 978-1-5386-0583-7 ISSN 2161-2536 (Online) (doi:10.1109/ISSE.2017.8000936)

European Community’s 7th Framework (Grant No. 608985)

Tilford, Tim ORCID: https://orcid.org/0000-0001-8307-6403, Stoyanov, Stoyan ORCID: https://orcid.org/0000-0001-6091-1226, Braun, Jessica, Janhsen, Jan Christoph, Patel, Mayur K. and Bailey, Chris ORCID: https://orcid.org/0000-0002-9438-3879 (2021) Comparative reliability of inkjet-printed electronics packaging. IEEE Transactions on Components, Packaging and Manufacturing Technology, 11 (2). pp. 351-362. ISSN 2156-3950 (Print), 2156-3985 (Online) (doi:10.1109/TCPMT.2021.3049952)

General Dynamics

Grand Challenge Project 3D-Mintegration (www.3dmintegration.com), reference EP/C534212/1.

Innovate UK (Grant No. 103439)

Stoyanov, Stoyan ORCID: https://orcid.org/0000-0001-6091-1226 and Bailey, Chris (2023) Modeling Insights into the assembly challenges of focal plane arrays. IEEE Access. pp. 35207-35219. ISSN 2169-3536 (Online) (doi:10.1109/ACCESS.2023.3264806)

Innovate-UK (Grant No. 103439)

Stoyanov, Stoyan ORCID: https://orcid.org/0000-0001-6091-1226, Bailey, Christopher ORCID: https://orcid.org/0000-0002-9438-3879, Waite, Rhys, Hicks, Christopher and Golding, Terry (2020) Packaging challenges and reliability performance of compound semiconductor focal plane arrays. In: 2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC). IEEE, pp. 1-8. ISBN 978-0956808660 (doi:10.23919/EMPC44848.2019.8951842)

Innovative Electronics Manufacturing Research Centre

Stoyanov, Stoyan ORCID: https://orcid.org/0000-0001-6091-1226, Bailey, Christopher ORCID: https://orcid.org/0000-0002-9438-3879, Strusevitch, Nadia and Yannou, J.-M. (2007) Computational approach for reliable and robust system-in-package design. 2007 30th International Spring Seminar On Electronics Technology. International Spring Seminar on Electronics Technology ISSE . Institute of Electrical and Electronics Engineers, Inc., New York, pp. 40-45. ISBN 9781424412174 (doi:10.1109/ISSE.2007.4432818)

Innovative electronics Manufacturing Research Centre (IeMRC)

Leonardo UK Ltd

Stoyanov, Stoyan ORCID: https://orcid.org/0000-0001-6091-1226, Stewart†, Paul and Bailey, Christopher ORCID: https://orcid.org/0000-0002-9438-3879 (2021) Reliability optimisation and lifetime modelling of micro-BGA assemblies in harsh environment applications. In: 2021 23rd European Microelectronics and Packaging Conference & Exhibition (EMPC). 13-16 Sept. 2021. Gothenburg, Sweden. IEEE Xplore . Institute of Electrical and Electronics Engineers (IEEE), Piscataway, New Jersey, pp. 1-8. ISBN 978-0956808677 ; 978-1665423687 (doi:10.23919/EMPC53418.2021.9584970)

MRC CiC

Medway queen preservation society

Rajaguru, Pushparajah ORCID: https://orcid.org/0000-0002-6041-0517, Mason, Peter, Bailey, Christopher ORCID: https://orcid.org/0000-0002-9438-3879 and Stoyanov, Stoyan ORCID: https://orcid.org/0000-0001-6091-1226 (2012) Structural Analysis on the Riveted Hull of the Paddle Steamer Medway Queen. In: Historic Ships Conference 2012. Royal Institution of Naval Architects (RINA).

Micross Components Ltd

Micross Components Ltd.

Rolls Royce

Royal Academy of Engineering

Selex ES

Selex Galileo

South east England development agency (SEEDA)

The Cutty Sark Trust

Rosunally, Yasmine, Stoyanov, Stoyan ORCID: https://orcid.org/0000-0001-6091-1226, Bailey, Christopher ORCID: https://orcid.org/0000-0002-9438-3879, Mason, Peter, Campbell, Sheelagh, Monger, George and Bell, Ian (2010) Bayesian networks for predicting remaining life. International Journal of Performability Engineering, 6 (5). pp. 499-512. ISSN 0973-1318

UK Department of Trade and Industry (DTI)

UK Engineering and Physical Sciences Research Council (EPRSC). Grant GR/R09190 - Microsystems Assembly Technology for the 21st Century (MAT21)

Desmulliez, M.P.Y., Kay, R.W., Stoyanov, S. ORCID: https://orcid.org/0000-0001-6091-1226 and Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879 (2004) Stencil printing at sub-100 microns pitch. In: Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 354-358. ISBN 0780388216 (doi:10.1109/EPTC.2004.1396633)

UK Engineering and Physical Sciences Research Council (EPRSC). Grant GR/R09190 entitled Microsystems Assembly Technology for the 21" Century (MAT21)

UK Engineering and Physical Sciences Research Council (EPSRC). Grant GR/R09190 - Microsystems Assembly Technology for the 21st Century (MAT21)

Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879, Stoyanov, S. ORCID: https://orcid.org/0000-0001-6091-1226 and Lu, H. ORCID: https://orcid.org/0000-0002-4392-6562 (2004) Reliability predictions for high density packaging. In: Proceeding of The Sixth IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis (HDP'04). Institute of Electrical and Electronics Engineers, Inc., Piscataway, N.J., U.S.A., pp. 121-128. ISBN 0780386205 (doi:10.1109/HPD.2004.1346684)

UK Engineering and Physical Sciences Research Council (EPSRC). Grant No. GRR09190, “Microsystems Assembly Technology for the 21” Century (MAT21)”.

Stoyanov, S. ORCID: https://orcid.org/0000-0001-6091-1226, Kay, R., Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879, Desmuilliez, M. and Hendriksen, M. (2003) Ultra-fine pitch flip-chip assembly using isotropic conductive adhesives. In: Proceedings of 5th Electronics Packaging Technology Conference (EPTC 2003). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 797-802. ISBN 0780382056 (doi:10.1109/EPTC.2003.1271627)

UK Engineering and Physics Research Council (EPSRC) - EP/ C534212/1

Xue, Xiangdong, Bailey, Chris ORCID: https://orcid.org/0000-0002-9438-3879, Lu, Hua ORCID: https://orcid.org/0000-0002-4392-6562 and Stoyanov, Stoyan ORCID: https://orcid.org/0000-0001-6091-1226 (2011) Integration of analytical techniques in stochastic optimization of microsystem reliability. Microelectronics Reliability, 51 (5). pp. 936-945. ISSN 0026-2714 (doi:10.1016/j.microrel.2011.01.008)

Stoyanov, Stoyan ORCID: https://orcid.org/0000-0001-6091-1226, Tilford, Tim ORCID: https://orcid.org/0000-0001-8307-6403, Amalou, Farid, Cargill, Scott, Bailey, Chris ORCID: https://orcid.org/0000-0002-9438-3879 and Desmulliez, Marc (2011) Modelling and optimisation study on the fabrication of nano-structures using imprint forming process. Engineering Computations, 28 (1). pp. 93-111. ISSN 0264-4401 (doi:10.1108/02644401111097046)

US Government

Yin, Chunyan ORCID: https://orcid.org/0000-0003-0298-0420, Best, Chris, Bailey, Chris ORCID: https://orcid.org/0000-0002-9438-3879 and Stoyanov, Stoyan ORCID: https://orcid.org/0000-0001-6091-1226 (2015) Statistical analysis of the impact of refinishing process on leaded components. Microelectronics Reliability, 55 (2). pp. 424-431. ISSN 0026-2714 (doi:10.1016/j.microrel.2014.11.001)

US Government (Grant no. H94003-04-D-003-0056/10178956)

Well come Trust (UK)

This list was generated on Tue Dec 3 17:29:35 2024 UTC.