Items where Greenwich Author is "Stoyanov, Dr Stoyan"

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Number of items: 104.

Article

Yang, Xingyu, Zhang, Zijian, Li, Xinhua, Lin, Hungyen, Lawman, Samuel, Stoyanov, Stoyan ORCID: https://orcid.org/0000-0001-6091-1226, Tilford, Timothy ORCID: https://orcid.org/0000-0001-8307-6403, Hu, Yihua, Shen, Yaochun and Zheng, Yalin (2024) High-speed low-cost line-field spectral-domain optical coherence tomography for industrial applications. Optics and Lasers in Engineering, 184 (PART 1):108631. ISSN 0143-8166 (Print), 1873-0302 (Online) (doi:10.1016/j.optlaseng.2024.108631)

Rawal, Aditi ORCID: https://orcid.org/0000-0001-6546-8577, Mason, Peter, Stoyanov, Stoyan ORCID: https://orcid.org/0000-0001-6091-1226, Bailey, Chris and Huber, Jurgen (2024) A prognostic and health management approach using colour fade to determine the condition of silk in a museum display environment. Journal of the Institute of Conservation. pp. 1-20. ISSN 1945-5224 (Print), 1945-5232 (Online) (doi:10.1080/19455224.2024.2347202)

Xian, Jingwei, Xu, Yilun, Stoyanov, Stoyan ORCID: https://orcid.org/0000-0001-6091-1226, Coyle, Richard, Dunne, Fionn P. E. and Gourlay, Christopher (2024) The role of microstructure in the thermal fatigue of solder joints. Nature Communications, 15:4258. pp. 1-15. ISSN 2041-1723 (doi:10.1038/s41467-024-48532-6)

Abdul Kareem, Razia Sulthana ORCID: https://orcid.org/0000-0001-5331-1310, Tilford, Timothy ORCID: https://orcid.org/0000-0001-8307-6403 and Stoyanov, Stoyan ORCID: https://orcid.org/0000-0001-6091-1226 (2024) Fine-grained food image classification and recipe extraction using a customised Deep Neural Network and NLP. Computers in Biology and Medicine. ISSN 0010-4825 (Print), 1879-0534 (Online) (doi:10.1016/j.compbiomed.2024.108528)

Zhang, Xiaotian, Hu, Yihua, Zhang, Jingwei, Esfahani, Mohammad Nasr, Tilford, Tim ORCID: https://orcid.org/0000-0001-8307-6403 and Stoyanov, Stoyan ORCID: https://orcid.org/0000-0001-6091-1226 (2024) IGBT module DPT efficiency enhancement via multimodal fusion networks and graph convolution networks. IEEE Transactions on Industrial Electronics. ISSN 0278-0046 (Print), 1557-9948 (Online) (doi:10.1109/TIE.2024.3368165)

Rajaguru, Pushpa ORCID: https://orcid.org/0000-0002-6041-0517, Tilford, Tim ORCID: https://orcid.org/0000-0001-8307-6403, Bailey, Chris ORCID: https://orcid.org/0000-0002-9438-3879 and Stoyanov, Stoyan ORCID: https://orcid.org/0000-0001-6091-1226 (2023) Damage mechanics-based failure prediction of wirebond in power electronic module. IEEE Access. ISSN 2169-3536 (doi:10.1109/ACCESS.2023.3342689)

Roy, Probir Kumar, Shahjalal, Mohammad, Shams, Tamanna, Fly, Ashley, Stoyanov, Stoyan ORCID: https://orcid.org/0000-0001-6091-1226, Ahsan, Mominul and Haider, Julfikar (2023) A critical review on battery aging and state estimation technologies of lithium-ion batteries: prospects and issues. Electronics, 12 (19):4105. pp. 1-30. ISSN 2079-9292 (Online) (doi:10.3390/electronics12194105)

Stoyanov, Stoyan ORCID: https://orcid.org/0000-0001-6091-1226 and Bailey, Chris (2023) Modeling Insights into the assembly challenges of focal plane arrays. IEEE Access. pp. 35207-35219. ISSN 2169-3536 (Online) (doi:10.1109/ACCESS.2023.3264806)

Xu, Yilun, Xian, Jingwei, Stoyanov, Stoyan ORCID: https://orcid.org/0000-0001-6091-1226, Bailey, Christopher ORCID: https://orcid.org/0000-0002-9438-3879, Coyle, Richard, Gourlay, Christopher and Dunne, Fionn (2022) A multi-scale approach to microstructure-sensitive thermal fatigue in solder joints. International Journal of Plasticity, 155:103308. ISSN 0749-6419 (doi:10.1016/j.ijplas.2022.103308)

Tilford, Tim ORCID: https://orcid.org/0000-0001-8307-6403, Stoyanov, Stoyan ORCID: https://orcid.org/0000-0001-6091-1226, Braun, Jessica, Janhsen, Jan Christoph, Patel, Mayur K. and Bailey, Chris ORCID: https://orcid.org/0000-0002-9438-3879 (2021) Comparative reliability of inkjet-printed electronics packaging. IEEE Transactions on Components, Packaging and Manufacturing Technology, 11 (2). pp. 351-362. ISSN 2156-3950 (Print), 2156-3985 (Online) (doi:10.1109/TCPMT.2021.3049952)

Stoyanov, Stoyan ORCID: https://orcid.org/0000-0001-6091-1226, Bailey, Christopher ORCID: https://orcid.org/0000-0002-9438-3879, Stewart, Paul, Parker, Mike and Roulston, John F. (2020) Experimental and modelling study on delamination risks for refinished electronic packages under hot solder dip loads. IEEE Transactions on Components, Packaging and Manufacturing Technology, 10 (3). pp. 502-515. ISSN 2156-3950 (Print), 2156-3985 (Online) (doi:10.1109/TCPMT.2020.2972635)

Ahsan, M., Stoyanov, S. ORCID: https://orcid.org/0000-0001-6091-1226, Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879 and Albarbar, A. (2020) Developing computational intelligence for smart qualification testing of electronic products. IEEE Access, 8. pp. 16922-16933. ISSN 2169-3536 (Online) (doi:10.1109/ACCESS.2020.2967858)

Hinojosa Herrera, Ana Elsa ORCID: https://orcid.org/0000-0002-0636-1881, Stoyanov, Stoyan ORCID: https://orcid.org/0000-0001-6091-1226, Bailey, Christopher ORCID: https://orcid.org/0000-0002-9438-3879, Walshaw, Christopher ORCID: https://orcid.org/0000-0003-0253-7779 and Yin, Chunyan ORCID: https://orcid.org/0000-0003-0298-0420 (2019) Data analytics to reduce stop-on-fail test in electronics manufacturing. Open Computer Sciences, 9 (1). pp. 200-211. ISSN 2299-1093 (Online) (doi:10.1515/comp-2019-0014)

Yin, Chunyan ORCID: https://orcid.org/0000-0003-0298-0420, Stoyanov, Stoyan ORCID: https://orcid.org/0000-0001-6091-1226, Bailey, Christopher ORCID: https://orcid.org/0000-0002-9438-3879 and Stewart, Paul (2019) Thermo-mechanical analysis of conformally coated QFNs for high reliability applications. IEEE Transactions on Components, Packaging and Manufacturing Technology, 9 (11). pp. 2210-2218. ISSN 2156-3950 (Print), 2156-3985 (Online) (doi:10.1109/TCPMT.2019.2925874)

Stoyanov, Stoyan ORCID: https://orcid.org/0000-0001-6091-1226, Ahsan, Mominul, Bailey, Chris ORCID: https://orcid.org/0000-0002-9438-3879, Wotherspoon, Tracy and Hunt, Craig (2019) Predictive analytics methodology for smart qualification testing of electronic components. Journal of Intelligent Manufacturing, 30 (3). pp. 1497-1514. ISSN 0956-5515 (Print), 1572-8145 (Online) (doi:10.1007/s10845-018-01462-9)

Tilford, Tim ORCID: https://orcid.org/0000-0001-8307-6403, Stoyanov, Stoyan ORCID: https://orcid.org/0000-0001-6091-1226, Braun, Jessica, Janhsen, Jan Cristophe, Burgard, Matthias, Birch, Richard and Bailey, Chris ORCID: https://orcid.org/0000-0002-9438-3879 (2018) Design, manufacture and test for reliable 3D printed electronics packaging. Microelectronics Reliability, 85. pp. 109-117. ISSN 0026-2714 (doi:10.1016/j.microrel.2018.04.008)

Stoyanov, Stoyan ORCID: https://orcid.org/0000-0001-6091-1226, Bailey, Chris ORCID: https://orcid.org/0000-0002-9438-3879 and Tourloukis, Georgios (2016) Similarity approach for reducing qualification tests of electronic components. Microelectronics Reliability, 67. pp. 111-119. ISSN 0026-2714 (doi:10.1016/j.microrel.2016.10.017)

Stoyanov, S. ORCID: https://orcid.org/0000-0001-6091-1226 and Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879 (2015) Modelling the impact of refinishing processes on COTS components for use in aerospace applications. Microelectronics Reliability, 55 (9-10). pp. 1271-1279. ISSN 0026-2714 (doi:10.1016/j.microrel.2015.07.030)

Yin, Chunyan ORCID: https://orcid.org/0000-0003-0298-0420, Best, Chris, Bailey, Chris ORCID: https://orcid.org/0000-0002-9438-3879 and Stoyanov, Stoyan ORCID: https://orcid.org/0000-0001-6091-1226 (2015) Statistical analysis of the impact of refinishing process on leaded components. Microelectronics Reliability, 55 (2). pp. 424-431. ISSN 0026-2714 (doi:10.1016/j.microrel.2014.11.001)

Rajaguru, Pushparajah ORCID: https://orcid.org/0000-0002-6041-0517, Mason, Peter, Bailey, Chris ORCID: https://orcid.org/0000-0002-9438-3879 and Stoyanov, Stoyan ORCID: https://orcid.org/0000-0001-6091-1226 (2014) Buckling analysis on the hull of the historic paddle steamer ‘Medway Queen’. Ships and Offshore Structures, 9 (6). pp. 643-654. ISSN 1744-5302 (Print), 1754-212X (Online) (doi:10.1080/17445302.2013.849065)

Stoyanov, Stoyan ORCID: https://orcid.org/0000-0001-6091-1226, Bailey, Chris ORCID: https://orcid.org/0000-0002-9438-3879, Alam, M.O., Yin, Chunyan ORCID: https://orcid.org/0000-0003-0298-0420, Best, Chris, Tollafield, Peter, Crawford, Rob, Parker, Mike and Scott, Jim (2013) Modelling methodology for thermal analysis of hot solder dip process. Microelectronics Reliability, 53 (8). pp. 1055-1067. ISSN 0026-2714 (doi:10.1016/j.microrel.2013.02.018)

Rajaguru, Pushparajah ORCID: https://orcid.org/0000-0002-6041-0517, Stoyanov, Stoyan ORCID: https://orcid.org/0000-0001-6091-1226, Lu, Hua ORCID: https://orcid.org/0000-0002-4392-6562 and Bailey, Christopher ORCID: https://orcid.org/0000-0002-9438-3879 (2013) Application of Kriging and radial basis function for reliability optimization in power modules. Journal of Electronic Packaging, 135 (2):021009. ISSN 1528-9044 (Print), 1043-7398 (Online) (doi:10.1115/1.4024056)

Sutharssan, Thamo, Stoyanov, Stoyan ORCID: https://orcid.org/0000-0001-6091-1226, Bailey, Christopher ORCID: https://orcid.org/0000-0002-9438-3879 and Rosunally, Yasmine (2012) Prognostics and health monitoring of high power LED. Micromachines, 3 (1). pp. 78-100. ISSN 2072-666X (doi:10.3390/mi3010078)

Xue, Xiangdong, Bailey, Chris ORCID: https://orcid.org/0000-0002-9438-3879, Lu, Hua ORCID: https://orcid.org/0000-0002-4392-6562 and Stoyanov, Stoyan ORCID: https://orcid.org/0000-0001-6091-1226 (2011) Integration of analytical techniques in stochastic optimization of microsystem reliability. Microelectronics Reliability, 51 (5). pp. 936-945. ISSN 0026-2714 (doi:10.1016/j.microrel.2011.01.008)

Rosunally, Y.Z., Stoyanov, S. ORCID: https://orcid.org/0000-0001-6091-1226, Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879, Mason, P., Campbell, S., Monger, G. and Bell, I. (2011) Fusion approach for prognostics framework of heritage structure. IEEE Transactions on Reliability, 60 (1):570453. pp. 3-13. ISSN 0018-9529 (doi:10.1109/TR.2011.2104451)

Stoyanov, Stoyan ORCID: https://orcid.org/0000-0001-6091-1226, Tilford, Tim ORCID: https://orcid.org/0000-0001-8307-6403, Amalou, Farid, Cargill, Scott, Bailey, Chris ORCID: https://orcid.org/0000-0002-9438-3879 and Desmulliez, Marc (2011) Modelling and optimisation study on the fabrication of nano-structures using imprint forming process. Engineering Computations, 28 (1). pp. 93-111. ISSN 0264-4401 (doi:10.1108/02644401111097046)

Rosunally, Yasmine, Stoyanov, Stoyan ORCID: https://orcid.org/0000-0001-6091-1226, Bailey, Christopher ORCID: https://orcid.org/0000-0002-9438-3879, Mason, Peter, Campbell, Sheelagh, Monger, George and Bell, Ian (2010) Bayesian networks for predicting remaining life. International Journal of Performability Engineering, 6 (5). pp. 499-512. ISSN 0973-1318

Stoyanov, Stoyan ORCID: https://orcid.org/0000-0001-6091-1226, Mason, Peter and Bailey, Chris ORCID: https://orcid.org/0000-0002-9438-3879 (2010) Smeared shell modelling approach for structural analysis of heritage composite structures – An application to the Cutty Sark conservation. Computers & Structures, 88 (11-12). pp. 649-663. ISSN 0045-7949 (doi:10.1016/j.compstruc.2010.02.005)

Stoyanov, S. ORCID: https://orcid.org/0000-0001-6091-1226, Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879, Tang, Y.K., Marson, S., Dyer, A., Allen, D. and Desmulliez, M. (2010) Computational modelling and optimisation of the fabrication of nano-structures using focused ion beam and imprint forming technologies. Journal of Physics: Conference Series (JPCS), 253 (1):012008. ISSN 1742-6588 (Print), 1742-6596 (Online) (doi:10.1088/1742-6596/252/1/012008)

Stoyanov, Stoyan ORCID: https://orcid.org/0000-0001-6091-1226, Bailey, Chris ORCID: https://orcid.org/0000-0002-9438-3879 and Desmulliez, Marc (2009) Optimisation modelling for thermal fatigue reliability of lead-free interconnects in fine-pitch flip-chip packaging. Soldering & Surface Mount Technology, 21 (1). pp. 11-24. ISSN 0954-0911 (doi:10.1108/09540910910928265)

Stoyanov, Stoyan ORCID: https://orcid.org/0000-0001-6091-1226, Kay, Robert W., Bailey, Christopher ORCID: https://orcid.org/0000-0002-9438-3879 and Desmulliez, Marc P.Y. (2007) Computational modelling for reliable flip-chip packaging at sub-100 micron pitch using isotropic conductive adhesives. Microelectronics Reliability, 47 (1). pp. 132-141. ISSN 0026-2714 (doi:10.1016/j.microrel.2006.01.004)

Richardson, Andrew, Bailey, Christopher ORCID: https://orcid.org/0000-0002-9438-3879, Yanou, Jean Marc, Dumas, Norbert, Liu, Dongsheng, Stoyanov, Stoyan ORCID: https://orcid.org/0000-0001-6091-1226 and Strusevitch, Nadia (2007) "System in package technology" - design for manufacture challenges. Circuit World, 33 (1). pp. 36-46. ISSN 0305-6120 (doi:10.1108/03056120710723706)

Kay, Robert W., Stoyanov, Stoyan ORCID: https://orcid.org/0000-0001-6091-1226, Glinski, Greg P., Bailey, Christopher ORCID: https://orcid.org/0000-0002-9438-3879 and Desmulliez, Marc P.Y. (2007) Ultra-fine pitch stencil printing for a low cost and low temperature flip-chip assembly process. IEEE Transactions on Components and Packaging Technologies, 30 (1). pp. 129-136. ISSN 1521-3331 (doi:10.1109/TCAPT.2007.892085)

Lu, H. ORCID: https://orcid.org/0000-0002-4392-6562, Hung, K.C., Stoyanov, S. ORCID: https://orcid.org/0000-0001-6091-1226, Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879 and Chan, Y.C. (2002) No-flow underfill flip chip assembly–an experimental and modeling analysis. Microelectronics Reliability, 42 (8). pp. 1205-1212. ISSN 0026-2714 (doi:10.1016/S0026-2714(02)00092-6)

Stoyanov, S. ORCID: https://orcid.org/0000-0001-6091-1226, Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879 and Cross, M. (2002) Optimisation modelling for flip-chip solder joint reliability. Soldering and Surface Mount Technology, 14 (1). pp. 49-58. ISSN 0954-0911 (doi:10.1108/09540910210416477)

Book Section

Rajaguru, Pushpa ORCID: https://orcid.org/0000-0002-6041-0517, Stoyanov, Stoyan ORCID: https://orcid.org/0000-0001-6091-1226, Tang, Ying Kit, Bailey, Chris ORCID: https://orcid.org/0000-0002-9438-3879, Claverley, James, Leach, Richard and Topham, David (2010) Numerical modelling methodology for design of miniaturised integrated products - an application to 3D CMM micro-probe development. 2010 11th International Conference on Thermal, Mechanical and Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems, EuroSimE 2010. IEEE Computer Society, Piscataway NJ. ISBN 9781424470266 (doi:10.1109/ESIME.2010.5464573)

Rosunally, Yasmine, Stoyanov, Stoyan ORCID: https://orcid.org/0000-0001-6091-1226, Bailey, Christopher ORCID: https://orcid.org/0000-0002-9438-3879, Mason, Peter, Campbell, Sheelagh, Monger, George and Bell, Ian (2010) Fusion approach for predictive maintenance of heritage structures. Prognostics & Health Management Conference, 2010, PHM '10. IEEE Conference Publications . IEEE, pp. 1-6. ISBN 978-1-4244-4756-5 (print), 978-1-4244-4758-9 (e-book) (doi:10.1109/PHM.2010.5413403)

Stoyanov, Stoyan ORCID: https://orcid.org/0000-0001-6091-1226, Tang, Ying Kit, Bailey, Christopher ORCID: https://orcid.org/0000-0002-9438-3879, Evans, Robert, Marson, Silvia and Allen, David (2009) Modelling and process capability analysis of focused ion beam. ISSE 2009: 32nd International Spring Seminar on Electronics Technology: Hetero System Integration, the path to New Solutions in the Modern Electronics - Conference Proceedings. IEEE Computer Society, Piscataway, NJ USA. ISBN 97814244 42607 (Print) (doi:10.1109/ISSE.2009.5206925)

Rosunally, Yasmine, Stoyanov, Stoyan ORCID: https://orcid.org/0000-0001-6091-1226, Bailey, Christopher ORCID: https://orcid.org/0000-0002-9438-3879, Mason, Peter, Campbell, Sheelagh and Monger, George (2009) Prognostics framework for remaining life prediction of Cutty Sark iron structures. Annual Conference of the Prognostics and Health Management Society 2009. Prognostics and Health Management Society, 6 pages.

Bailey, Christopher ORCID: https://orcid.org/0000-0002-9438-3879, Lu, Hua ORCID: https://orcid.org/0000-0002-4392-6562, Stoyanov, Stoyan ORCID: https://orcid.org/0000-0001-6091-1226, Tilford, Timothy, Xue, Xiangdong, Alam, M. O., Yin, Chunyan ORCID: https://orcid.org/0000-0003-0298-0420 and Hughes, Michael (2008) Modelling technologies and applications. In: Morris, James E., (ed.) Nanopackaging: Nanotechnologies and Electronics Packaging. Springer Science+Business Media, LLC, New York, USA, pp. 15-38. ISBN 978-0-387-47325-3 (Print) 978-0-387-47326-0 (Online) (doi:10.1007/978-0-387-47325-3_2)

Stoyanov, Stoyan ORCID: https://orcid.org/0000-0001-6091-1226, Bailey, Christopher ORCID: https://orcid.org/0000-0002-9438-3879, Leach, Richard, Hughes, Ben, Wilson, Alan, O'Neill, William, Dorey, Robert, Shaw, Christopher, Underhill, Daniel and Almond, Heather (2008) Modelling and prototyping the conceptual design of 3D CMM micro-probe. 2nd Electronics System-Integration Technology Conference, 2008. ESTC 2008. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 193-198. ISBN 978-1-4244-2814-4 (Print), 978-1-4244-2813-7 (Online) (doi:10.1109/ESTC.2008.4684348)

Stoyanov, Stoyan ORCID: https://orcid.org/0000-0001-6091-1226, Amalou, Farid, Sinclair, Keith I., Bailey, Christopher ORCID: https://orcid.org/0000-0002-9438-3879 and Desmulliez, Marc P.Y. (2008) Minimising the risk of defects in nano-imprint forming. 31st International Spring Seminar on Electronics Technology, 2008. ISSE '08. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 367-372. ISBN 978-1-4244-3972-0 (doi:10.1109/ISSE.2008.5276670)

Stoyanov, Stoyan ORCID: https://orcid.org/0000-0001-6091-1226, Amalou, Farid, Sinclair, Keith I., Bailey, Christopher ORCID: https://orcid.org/0000-0002-9438-3879 and Desmulliez, Marc P.Y. (2008) Modelling of nano-imprint forming process for the production of miniaturised 3D structures. International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems, 2008. EuroSimE 2008. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 497-504. ISBN 978-1-4244-2127-5 (doi:10.1109/ESIME.2008.4525088)

Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879, Stoyanov, S. ORCID: https://orcid.org/0000-0001-6091-1226, Strusevich, N. and Yannou, J.-M. (2007) Reliability analysis of SiP structures. HDP'07: Proceedings of the 2007 International Symposium on High Density Packaging and Microsystem Integration. Institute of Electrical and Electronics Engineers, Inc., New York, p. 38. ISBN 9781424412525 (doi:10.1109/HDP.2007.4283556)

Stoyanov, Stoyan ORCID: https://orcid.org/0000-0001-6091-1226, Yannou, J.-M., Bailey, Christopher ORCID: https://orcid.org/0000-0002-9438-3879 and Strusevitch, Nadia (2007) Reliability based design optimisation for system-in-package. In: Ernst, L.J., Zhang, G.Q., Rodgers, P., Meuwissen, M., Marco, S., Van Driel, W.D. and De Saint Leger, O., (eds.) EUROSIME 2007: Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, Proceedings. Institute of Electrical and Electronics Engineers, Inc., New York, pp. 289-296. ISBN 9781424411054 (doi:10.1109/ESIME.2007.359948)

Stoyanov, Stoyan ORCID: https://orcid.org/0000-0001-6091-1226, Bailey, Christopher ORCID: https://orcid.org/0000-0002-9438-3879, Strusevitch, Nadia and Yannou, J.-M. (2007) Computational approach for reliable and robust system-in-package design. 2007 30th International Spring Seminar On Electronics Technology. International Spring Seminar on Electronics Technology ISSE . Institute of Electrical and Electronics Engineers, Inc., New York, pp. 40-45. ISBN 9781424412174 (doi:10.1109/ISSE.2007.4432818)

Tang, Y.K., Stoyanov, Stoyan ORCID: https://orcid.org/0000-0001-6091-1226, Bailey, Christopher ORCID: https://orcid.org/0000-0002-9438-3879 and Lu, Hua ORCID: https://orcid.org/0000-0002-4392-6562 (2006) Decision support systems for eco-friendly electronic products. Electronic Materials and Packaging, 2006. EMAP 2006. International Conference on. IEEE, Piscataway, N.J., pp. 77-84. ISBN 1424408342; 9781424408344 (doi:10.1109/EMAP.2006.4430580)

Stoyanov, Stoyan ORCID: https://orcid.org/0000-0001-6091-1226, Mason, P. and Bailey, Christopher ORCID: https://orcid.org/0000-0002-9438-3879 (2006) Finite element modelling of an historic ship structure - the Cutty Sark. In: Armstrong, Cecil G., (ed.) Proceedings of a joint conference of the Association for Computational Mechanics in Engineering (UK) and the Irish Society for Scientific and Engineeering Computation. 19th-20th April 2006, Queen's University Belfast. ACME/ISSEC, pp. 35-38.

Strusevitch, Nadia, Stoyanov, Stoyan ORCID: https://orcid.org/0000-0001-6091-1226, Liu, D., Bailey, Christopher ORCID: https://orcid.org/0000-0002-9438-3879, Richardson, A., Dumas, N., Yannou, J.M. and Georgel, V. (2006) Modelling the behavior of solder joints for wafer level SiP. In: Pang, J.H.L., Vaidyanathan, K., Wong, S.C.K. and Tee, T.Y., (eds.) 2006 8th Electronics Packaging Technology Conference (EPTC 2006) : 6-8 December 2006, Singapore. IEEE, Picsataway, N.J., pp. 127-132. ISBN 1424406641; 142440665X (doi:10.1109/EPTC.2006.342703)

Stoyanov, Stoyan ORCID: https://orcid.org/0000-0001-6091-1226 and Bailey, Christopher ORCID: https://orcid.org/0000-0002-9438-3879 (2006) Optimisation modelling for design of advanced interconnects. 1st Electronics Systemintegration Technology Conference. Dresden, Saxony, Germany. 2006 proceedings. IEEE, Piscataway, NJ, USA, pp. 1108-1117. ISBN 1424405521 (doi:10.1109/ESTC.2006.280148)

Stoyanov, S. ORCID: https://orcid.org/0000-0001-6091-1226, Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879, Lu, H. ORCID: https://orcid.org/0000-0002-4392-6562 and Cross, M. (2002) Integrated computational mechanics and optimization for design of electronic components. In: Parmee, Ian C. and Hajela, Prabhat, (eds.) Optimization In Industry. Springer Verlag, pp. 57-71. ISBN 9781852338342

Book

Bailey, Christopher ORCID: https://orcid.org/0000-0002-9438-3879, Stoyanov, Stoyan ORCID: https://orcid.org/0000-0001-6091-1226 and Lu, Hua ORCID: https://orcid.org/0000-0002-4392-6562 (2017) Co-design And Modelling For Advanced Integration And Packaging: Manufacturing And Reliability. Wspc Series In Advanced Integration And Packaging . World Scientific Publishing. ISBN 978-9814740203 ISSN 2315-473X (doi:10.1142/9900)

Conference Proceedings

Hassan, Sheikh ORCID: https://orcid.org/0000-0002-6215-7340, Stoyanov, Stoyan ORCID: https://orcid.org/0000-0001-6091-1226, Rajaguru, Pushparajah ORCID: https://orcid.org/0000-0002-6041-0517 and Bailey, Christopher ORCID: https://orcid.org/0000-0002-9438-3879 (2024) Reduced-order modelling for coupled thermal-mechanical analysis and reliability assessment of power electronic modules with nonlinear material behaviours. In: 2024 IEEE 10th Electronics System-Integration Technology Conference (ESTC). Electronics System-Integration Technology Conference, ESTC . Institute of Electrical and Electronics Engineers (IEEE), Berlin, Germany; Piscataway, New Jersey, pp. 1-8. ISBN 979-8350390360 ISSN 2687-9700 (Print), 2687-9727 (Online) (doi:10.1109/ESTC60143.2024.10712079)

Stoyanov, Stoyan ORCID: https://orcid.org/0000-0001-6091-1226, Tilford, Tim ORCID: https://orcid.org/0000-0001-8307-6403, Shen, Yaochun and Hu, Yihua (2024) Reliability meta-modelling of power components. In: 2024 47th International Spring Seminar on Electronics Technology (ISSE). Institute of Electrical and Electronics Engineers (IEEE), New Jersey, USA, pp. 1-7. ISBN 979-8350385489 ISSN 2161-2536 (Print), 2161-2528 (Online) (doi:10.1109/ISSE61612.2024.10604175)

Stoyanov, Stoyan ORCID: https://orcid.org/0000-0001-6091-1226, Tilford, Timothy ORCID: https://orcid.org/0000-0001-8307-6403, Zhang, Xiaotian, Hu, Yihua, Yang, Xingyu and Shen, Yaochun (2024) Physics-informed Machine Learning for predicting fatigue damage of wire bonds in power electronic modules. In: 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE). IEEE Xplore (IEEE digital library) . Institute of Electrical and Electronics Engineers (IEEE), Piscataway, New Jersey, pp. 1-8. ISBN 979-8350393644 ISSN 2833-8596 (Print), 2833-8553 (Online) (doi:10.1109/EuroSimE60745.2024.10491522)

Hassan, Sheikh ORCID: https://orcid.org/0000-0002-6215-7340, Rajaguru, Pushparajah ORCID: https://orcid.org/0000-0002-6041-0517, Stoyanov, Stoyan ORCID: https://orcid.org/0000-0001-6091-1226 and Bailey, Christopher ORCID: https://orcid.org/0000-0002-9438-3879 (2024) Thermal-mechanical analysis of a power module with parametric model order reduction. In: 24th European Microelectronics and Packaging Conference & Exhibition (EMPC). 11-14 September 2023. Cambridge, United Kingdom. IEEE Xplore . The Institute of Electrical and Electronics Engineers (IEEE), Piscataway, New Jersey, pp. 1-6. ISBN 978-0956808691; 978-1665487368 (doi:10.23919/EMPC55870.2023.10418328)

Hassan, Sheikh ORCID: https://orcid.org/0000-0002-6215-7340, Rajaguru, Pushparajah ORCID: https://orcid.org/0000-0002-6041-0517, Stoyanov, Stoyan ORCID: https://orcid.org/0000-0001-6091-1226 and Bailey, Christopher ORCID: https://orcid.org/0000-0002-9438-3879 (2023) Parametrising temperature dependent properties in thermal-mechanical analysis of power electronics modules using parametric Model Order Reduction. In: 2023 46th International Spring Seminar on Electronics Technology (ISSE). 10th - 14th May 2023. Timisoara, Romania. IEEE Xplore . Institute of Electrical and Electronics Engineers IEEE, Piscataway, NJ, pp. 1-7. ISBN 979-8350334845; 979-8350334852 ISSN 2161-2528 (Print), 2161-2536 (Online) (doi:10.1109/ISSE57496.2023.10168468)

Stoyanov, Stoyan ORCID: https://orcid.org/0000-0001-6091-1226 and Bailey, Chris ORCID: https://orcid.org/0000-0002-9438-3879 (2022) Deep learning modelling for composite properties of PCB conductive layers. In: 2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE). Institute of Electrical and Electronics Engineers (IEEE), Piscataway, New Jersey, pp. 1-7. ISBN 978-1665458375 (doi:10.1109/EuroSimE54907.2022.9758885)

Stoyanov, Stoyan ORCID: https://orcid.org/0000-0001-6091-1226, Stewart†, Paul and Bailey, Christopher ORCID: https://orcid.org/0000-0002-9438-3879 (2021) Reliability optimisation and lifetime modelling of micro-BGA assemblies in harsh environment applications. In: 2021 23rd European Microelectronics and Packaging Conference & Exhibition (EMPC). 13-16 Sept. 2021. Gothenburg, Sweden. IEEE Xplore . Institute of Electrical and Electronics Engineers (IEEE), Piscataway, New Jersey, pp. 1-8. ISBN 978-0956808677 ; 978-1665423687 (doi:10.23919/EMPC53418.2021.9584970)

Stoyanov, Stoyan ORCID: https://orcid.org/0000-0001-6091-1226, Bailey, Christopher ORCID: https://orcid.org/0000-0002-9438-3879, Waite, Rhys, Hicks, Christopher and Golding, Terry (2020) Packaging challenges and reliability performance of compound semiconductor focal plane arrays. In: 2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC). IEEE, pp. 1-8. ISBN 978-0956808660 (doi:10.23919/EMPC44848.2019.8951842)

Hinojosa Herrera, Ana Elsa ORCID: https://orcid.org/0000-0002-0636-1881 and Stoyanov, Stoyan ORCID: https://orcid.org/0000-0001-6091-1226 (2019) Data driven predictive model to compact a production stop-on-fail test set for an electronic device. In: Proceedings of the 2018 International Conference on Computing, Electronics & Communications Engineering (iCCECE). IEEE Xplore, pp. 59-64. ISBN 9781538649046 (doi:10.1109/iCCECOME.2018.8658941)

Ahsan, Mominul, Stoyanov, Stoyan ORCID: https://orcid.org/0000-0001-6091-1226 and Bailey, Christopher ORCID: https://orcid.org/0000-0002-9438-3879 (2018) Data driven prognostics for failure of power semiconductor packages. In: Proceedings of 41st Spring Seminar on Electronics Technology (ISSE). IEEE Xplore, pp. 1-6. ISBN 978-1-5386-5730-0 ISSN 2161-2536 (Online) (doi:10.1109/ISSE.2018.8443612)

Stoyanov, Stoyan ORCID: https://orcid.org/0000-0001-6091-1226, Ahsan, Mominuil and Bailey, Chris ORCID: https://orcid.org/0000-0002-9438-3879 (2018) Data analytics approach for optimal qualification testing of electronic components. In: Proceedings EuroSimE 2018. 2018 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) . IEEE Xplore, pp. 1-9. ISBN 978-1-5386-2358-9 (doi:10.1109/EuroSimE.2018.8369926)

Yin, Chunyan ORCID: https://orcid.org/0000-0003-0298-0420, Stoyanov, Stoyan ORCID: https://orcid.org/0000-0001-6091-1226, Bailey, Christopher ORCID: https://orcid.org/0000-0002-9438-3879 and Stewart, Paul (2017) Modelling the impact of conformal coating penetration on QFN reliability. In: 2017 18th International Conference on Electronic Packaging Technology (ICEPT). IEEE, pp. 1021-1026. ISBN 978-1-5386-2973-4 (doi:10.1109/ICEPT.2017.8046616)

Stoyanov, Stoyan ORCID: https://orcid.org/0000-0001-6091-1226 and Bailey, Christopher ORCID: https://orcid.org/0000-0002-9438-3879 (2017) Machine learning for additive manufacturing of electronics. In: Proceedings 2017 40th International Spring Seminar on Electronics Technology (ISSE). IEEE. ISBN 978-1-5386-0583-7 ISSN 2161-2536 (Online) (doi:10.1109/ISSE.2017.8000936)

Tilford, T. ORCID: https://orcid.org/0000-0001-8307-6403, Stoyanov, S. ORCID: https://orcid.org/0000-0001-6091-1226, Tourloukis, G. and Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879 (2016) Numerical analysis of droplet deposition in inkjet printed electronics assembly. In: 2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE). IEEE, pp. 1-7. ISBN 978-1-5090-2106-2 (doi:10.1109/EuroSimE.2016.7463358)

Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879, Stoyanov, S. ORCID: https://orcid.org/0000-0001-6091-1226, Tilford, T. and Tourloukis, G. (2016) Modelling methodologies for quality assessment of 3D inkjet printed electronic products. In: 3rd Fraunhofer Direct Digital Manufacturing Conference, DDMC 2016. Proceedings. Fraunhofer Verlag, Stuttgart. ISBN 978-3-8396-9128-1 ISSN 978-3-8396-1001-5 (Online)

Stoyanov, Stoyan ORCID: https://orcid.org/0000-0001-6091-1226, Dabek, Alexander and Bailey, Chris ORCID: https://orcid.org/0000-0002-9438-3879 (2014) Hot nitrogen deballing of Ball Grid Arrays. In: Proceedings of the 2014 37th International Spring Seminar on Electronics Technology. Institute of Electrical and Electronics Engineers Inc., Piscataway, NJ, USA, pp. 44-49. ISBN 978-147994455-2 (doi:10.1109/ISSE.2014.6887559)

Stoyanov, Stoyan ORCID: https://orcid.org/0000-0001-6091-1226, Bailey, Chris ORCID: https://orcid.org/0000-0002-9438-3879, Roulston, John, Stewart, Paul and Tollafield, Peter (2014) Study of impact of thermal refinishing process on reliability of COTS components. In: 20th International Workshop on Thermal Investigations of ICs and Systems. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA. ISBN 9781479954155 (doi:10.1109/THERMINIC.2014.6972531)

Stoyanov, Stoyan ORCID: https://orcid.org/0000-0001-6091-1226, Dabek, Alexander and Bailey, Chris ORCID: https://orcid.org/0000-0002-9438-3879 (2013) Thermo–mechanical sub–modelling of BGA components in PCB reflow. In: Proceedings of 36th International Spring Seminar on Electronics Technology, Alba Iulia, Romania, May 8-12, 2013, pp.1-8. Institute of Electrical and Electronics Engineers, Piscataway, NJ, USA, pp. 253-258. ISBN 9781479900367 ISSN 2161-2528 (doi:10.1109/ISSE.2013.6648252)

Rajaguru, Pushparajah ORCID: https://orcid.org/0000-0002-6041-0517, Mason, Peter, Bailey, Christopher ORCID: https://orcid.org/0000-0002-9438-3879 and Stoyanov, Stoyan ORCID: https://orcid.org/0000-0001-6091-1226 (2012) Structural Analysis on the Riveted Hull of the Paddle Steamer Medway Queen. In: Historic Ships Conference 2012. Royal Institution of Naval Architects (RINA).

Stoyanov, Stoyan ORCID: https://orcid.org/0000-0001-6091-1226, Best, Chris, Alam, Mohammad, Bailey, Christopher ORCID: https://orcid.org/0000-0002-9438-3879, Tollafield, Peter, Parker, Mike and Scott, Jim (2012) Modelling and testing the impact of hot solder dip process on leaded components. In: 2012 35th International Spring Seminar on Electronics Technology. IEEE Conference Publications . Institute of Electrical and Electronic Engineers, Inc., Piscataway, N.J., USA, pp. 303-308. ISBN 978-1-4673-2241-6 (Print), 978-1-4673-2239-3 (Online) ISSN 2161-2528 (doi:10.1109/ISSE.2012.6273091)

Kabir, Ahsanul, Bailey, Christopher ORCID: https://orcid.org/0000-0002-9438-3879, Lu, Hua ORCID: https://orcid.org/0000-0002-4392-6562 and Stoyanov, Stoyan ORCID: https://orcid.org/0000-0001-6091-1226 (2012) A review of data-driven prognostics in power electronics. In: 2012 35th International Spring Seminar on Electronics Technology. IEEE Conference Publications . Institute of Electrical and Electronic Engineers, Inc., Piscataway, N.J., USA, pp. 189-192. ISBN 978-1-4673-2241-6 (Print), 978-1-4673-2239-3 (Online) ISSN 2161-2528 (doi:10.1109/ISSE.2012.6273136)

Stoyanov, Stoyan ORCID: https://orcid.org/0000-0001-6091-1226, Bailey, Christopher ORCID: https://orcid.org/0000-0002-9438-3879, Tollafield, Peter, Crawford, Rob, Parker, Mike, Scott, Jim and Roulston, John (2012) Thermal modelling and optimisation of hot solder dip process. In: 2012 13th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE 2012). Institute of Electrical and Electronic Engineers, Inc., Piscataway, N.J., USA. ISBN 978-1-4673-1512-8 (doi:10.1109/ESimE.2012.6191763)

Sutharssan, Thamo, Bailey, ChriS ORCID: https://orcid.org/0000-0002-9438-3879 and Stoyanov, Stoyan ORCID: https://orcid.org/0000-0001-6091-1226 (2012) A comparison study of the prognostics approaches to light emitting diodes under accelerated aging. In: 2012 13th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems. Institute of Electrical and Electronic Engineers, Inc, Piscataway, N.J., USA. ISBN 978-1-4673-1512-8 (doi:10.1109/ESimE.2012.6191783)

Sutharssan, T., Stoyanov, S. ORCID: https://orcid.org/0000-0001-6091-1226, Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879 and Rosunally, Y. (2012) Data analysis techniques for real-time prognostics and health management of semiconductor devices. In: Microelectronics and Packaging. Institute of Electrical and Electronic Engineers, Inc, Piscataway, NJ, USA, pp. 1-7. ISBN 978-1-4673-0694-2 (print)

Stoyanov, Stoyan ORCID: https://orcid.org/0000-0001-6091-1226, Best, Chris, Yin, Chunyan ORCID: https://orcid.org/0000-0003-0298-0420, Alam, M.O., Bailey, Chris ORCID: https://orcid.org/0000-0002-9438-3879 and Tollafield, Peter (2012) Experimental and modelling study on the effects of refinishing lead-free microelectronic components. In: 2012 4th Electronic System-Integration Technology Conference (ESTC). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA. ISBN 9781467346450 (doi:10.1109/ESTC.2012.6542213)

Sutharssan, Thamo, Bailey, Chris ORCID: https://orcid.org/0000-0002-9438-3879, Stoyanov, Stoyan ORCID: https://orcid.org/0000-0001-6091-1226 and Rosunally, Yasmine (2011) Prognostics and reliability assessment of light emitting diode packaging. In: Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), 2011 12th International Conference on. Institute of Electrical and Electronics Engineers, Piscataway, NJ, USA, pp. 1-7. ISBN 978-1-4577-1770-3 (print), 978-1-4577-1768-0 (eISBN) (doi:10.1109/ICEPT.2011.6066984)

Stoyanov, Stoyan ORCID: https://orcid.org/0000-0001-6091-1226 and Marson, Silvia (2011) Model assisted process control in micro- and nano-fabrication using focused ion beam. In: Electronics Technology (ISSE), 2011 34th International Spring Seminar on. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 424-429. ISBN 978-1-4577-2111-3 ISSN 2161-2528 (doi:10.1109/ISSE.2011.6053900)

Stoyanov, Stoyan ORCID: https://orcid.org/0000-0001-6091-1226, Rajaguru, Pushpa ORCID: https://orcid.org/0000-0002-6041-0517, Tang, Ying Kit, Bailey, Chris ORCID: https://orcid.org/0000-0002-9438-3879, Claverley, James and Leach, Richard (2010) Reduced order modelling for risk mitigation in design of miniaturised/integrated products. In: ISSE 2010 - 33rd International Spring Seminar on Electronics Technology: Polymer Electronics and Nanotechnologies: Towards System Integration - Conference Proceedings. IEEE Computer Society, Piscataway, USA, pp. 402-407. ISBN 9781424478491 (print), 9781424478507 (online) (doi:10.1109/ISSE.2010.5547362)

Stoyanov, Stoyan ORCID: https://orcid.org/0000-0001-6091-1226, Rajaguru, Pushpa ORCID: https://orcid.org/0000-0002-6041-0517 and Bailey, Chris ORCID: https://orcid.org/0000-0002-9438-3879 (2010) Reduced order modelling for reliability optimisation of advanced micro-systems. In: EngOpt2010 2nd International Conference on Engineering Optimization. International Conference on Engineering Optimization (2). EngOpt2010, pp. 1-10.

Mallik, A., Stoyanov, S. ORCID: https://orcid.org/0000-0001-6091-1226, Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879 and Firth, P. (2009) Design for reliability methodology for micro laser welding of pigtail fibres. In: Thermal, Mechanical and Multi-Physics simulation and Experiments in Microelectronics and Microsystems. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 1-7. ISBN 978-1-4244-4161-7 (electronic), 978-1-4244-4160-0 (print) (doi:10.1109/ESIME.2009.4938409)

Rosunally, Yasmine, Stoyanov, Stoyan ORCID: https://orcid.org/0000-0001-6091-1226, Bailey, Chris ORCID: https://orcid.org/0000-0002-9438-3879, Mason, Peter, Campbell, Sheelagh, Monger, George and Bell, Ian (2009) Development of a prognostics framework for the iron structural material of the s.v. Cutty Sark. In: Proceedings of Sixth International Conference on Condition Monitoring and Machinery Failure Prevention Technologies – CM/MFPT 2009. The British Institute of Non-Destructive Testing / Coxmoor Publishing, Northampton, UK, pp. 674-685.

Stoyanov, Stoyan ORCID: https://orcid.org/0000-0001-6091-1226, Strusevitch, Nadia, Rizvi, Jahir, Georgel, Vincent, Yannou, Jean-Marc and Bailey, Chris ORCID: https://orcid.org/0000-0002-9438-3879 (2008) Design for reliability for wafer level system in package. In: 2nd Electronics System-Integration Technology Conference, 2008. ESTC 2008. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 293-298. ISBN 978-1-4244-2814-4 (Print), 978-1-4244-2813-7 (Online) (doi:10.1109/ESTC.2008.4684364)

Narania, Sailesh, Eshahawi, Tarek, Gindy, Nabil, Tang, Ying Kit, Stoyanov, Stoyan ORCID: https://orcid.org/0000-0001-6091-1226, Ridout, Stephen and Bailey, Chris ORCID: https://orcid.org/0000-0002-9438-3879 (2008) Risk mitigation framework for a robust design process. In: 2nd Electronics System-Integration Technology Conference, 2008. ESTC 2008. IEEE Conference Publications . Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 1075-1080. ISBN 978-1-4244-2814-4 (Print), 978-1-4244-2813-7 (Online) (doi:10.1109/ESTC.2008.4684501)

Tang, Ying Kit, Stoyanov, S. ORCID: https://orcid.org/0000-0001-6091-1226, Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879 and Chan, Y.C. (2008) Uncertainty analysis to minimise risk in designing micro-electronics manufacturing processes. In: 2nd Electronics System-Integration Technology Conference, 2008. ESTC 2008. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 941-946. ISBN 978-1-4244-2814-4 (Print), 978-1-4244-2813-7 (Electronic) (doi:10.1109/ESTC.2008.4684478)

Tang, Y.K., Stoyanov, S. ORCID: https://orcid.org/0000-0001-6091-1226, Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879 and Chan, Y.C. (2008) Optimisation methodology for risk mitigation in advanced micro-system electronics manufacturing. In: EngOpt 2008 - International Conference on Engineering Optimization. Universidade Federal do Rio de Janeiro, Rio de Janeiro, Brazil. ISBN 978-85-7650-152-7

Stoyanov, S. ORCID: https://orcid.org/0000-0001-6091-1226, Mason, P. and Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879 (2006) Computational methodology for analysis of historic composite structures. In: Proceedings of the 5th International Conference on Engineering Computational Technology. Civil-Comp Press, Stirlingshire, UK. ISBN 1905088116 ISSN 1759-3433 (doi:10.4203/ccp.84.132)

Stoyanov, S. ORCID: https://orcid.org/0000-0001-6091-1226, Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879, Saxena, N. and Adams, S. (2005) Optimising the wave soldering process for lead free solders. In: Proceeding of 2005 International Conference on Asian Green Electronics - Design for Manufacturability and Reliability - (2005 AGEC). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 125-128. ISBN 0780388062 (doi:10.1109/AGEC.2005.1452331)

Stoyanov, S. ORCID: https://orcid.org/0000-0001-6091-1226, Mackay, W., Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879, Jibb, D. and Gregson, C. (2004) Lifetime assessment of electronic components for high reliability aerospace applications. In: Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 324-329. ISBN 0780388216 (doi:10.1109/EPTC.2004.1396627)

Stoyanov, S. ORCID: https://orcid.org/0000-0001-6091-1226, Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879, Saxena, N. and Adams, S. (2004) Modelling the wave soldering process. In: Proceedings of the 6th International Conference on Electronics Materials and Packaging (EMAP 2004). Institute of Electrical and Electronics Engineers, pp. 553-558. ISBN 983251486X

Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879, Stoyanov, S. ORCID: https://orcid.org/0000-0001-6091-1226 and Lu, H. ORCID: https://orcid.org/0000-0002-4392-6562 (2004) Reliability predictions for high density packaging. In: Proceeding of The Sixth IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis (HDP'04). Institute of Electrical and Electronics Engineers, Inc., Piscataway, N.J., U.S.A., pp. 121-128. ISBN 0780386205 (doi:10.1109/HPD.2004.1346684)

Desmulliez, M.P.Y., Kay, R.W., Stoyanov, S. ORCID: https://orcid.org/0000-0001-6091-1226 and Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879 (2004) Stencil printing at sub-100 microns pitch. In: Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 354-358. ISBN 0780388216 (doi:10.1109/EPTC.2004.1396633)

Stoyanov, S. ORCID: https://orcid.org/0000-0001-6091-1226 and Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879 (2003) Optimization and finite element analysis for reliable electronic packaging. In: Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-electronics and Micro-systems. Proceedings of EuroSimE 2003. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 391-399. ISBN 0780370546

Stoyanov, S. ORCID: https://orcid.org/0000-0001-6091-1226, Kay, R., Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879, Desmuilliez, M. and Hendriksen, M. (2003) Ultra-fine pitch flip-chip assembly using isotropic conductive adhesives. In: Proceedings of 5th Electronics Packaging Technology Conference (EPTC 2003). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 797-802. ISBN 0780382056 (doi:10.1109/EPTC.2003.1271627)

Stoyanov, S. ORCID: https://orcid.org/0000-0001-6091-1226 and Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879 (2002) Response Surface Modeling and Optimisation for Reliable Electronic Products. In: The Fifth International IEEE Symposium on High Density Packaging and Component Failure Analysis in Electronics Manufacturing. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 49-57. ISBN 0780398238

Stoyanov, S. ORCID: https://orcid.org/0000-0001-6091-1226, Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879 and Cross, M. (2001) Integrating computational mechanics and numerical optimization for the design of material properties in electronic packages. In: Computational Modeling of Materials, Minerals and Metals Processing [Conference Proceedings]. The Mineral, Metals and Materials Society (TMS), Warrendale, PA, USA, pp. 551-562. ISBN 0873395131

Lu, H. ORCID: https://orcid.org/0000-0002-4392-6562, Stoyanov, S. ORCID: https://orcid.org/0000-0001-6091-1226, Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879, Hung, K.C. and Chan, Y.C. (2001) A modelling and experimental analysis of the no-flow underfill process for flip-chip assembly. In: Proceedings of the 4th International Symposium on Electronic Packaging Technology. Institute of Electrical and Electronics Engineers, Inc., pp. 338-343. ISBN 0780398114

Conference or Conference Paper

Stoyanov, Stoyan ORCID: https://orcid.org/0000-0001-6091-1226, Bailey, Christopher ORCID: https://orcid.org/0000-0002-9438-3879, Kay, Robert, Durairaj, Rajkumar, Hendriksen, Mike, Desmuilliez, Marc and Ekere, Ndy (2004) Assembly and reliability of isotropic conductive adhesives for fine pitch flip-chip applications. In: TMS 2004 133rd TMS Annual Meeting & Exhibition 2004, 14-18 Mar 2004, Charlotte, North Carolina, USA. (Unpublished)

Cross, Mark, Stoyanov, Stoyan ORCID: https://orcid.org/0000-0001-6091-1226, Mouchmov, Apostol, Lu, Hua ORCID: https://orcid.org/0000-0002-4392-6562, Croft, Nick, Slone, Avril, Williams, Alison, Bailey, Chris ORCID: https://orcid.org/0000-0002-9438-3879 and Pericleous, Koulis ORCID: https://orcid.org/0000-0002-7426-9999 (2003) Multi-physics-multi-scale simulation and optimisation: the next generation. In: NAFEMS World Congress, 2003, Orlando, Florida, USA.

Stoyanov, S. ORCID: https://orcid.org/0000-0001-6091-1226, Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879 and Lu, H. ORCID: https://orcid.org/0000-0002-4392-6562 (2001) Optimisation tools for flip-chip design. In: The pacific RlM/ASME International Electronic Packaging Technical Conference and Exhibition, JuIy 8-13 2001, Maui, Hawaii, USA.

Thesis

Stoyanov, Stoyan Kostadinov ORCID: https://orcid.org/0000-0001-6091-1226 (2004) Optimisation modelling for microelectronics packaging and product design. PhD thesis, University of Greenwich.

This list was generated on Tue Dec 3 17:29:35 2024 UTC.