Items where Author is "Desmulliez, Marc P.Y."
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3D biochip separator
Xue, Xiangdong, Marson, Silvia, Patel, Mayur K., Attia, Usama M., Bailey, Chris ORCID: 0000-0002-9438-3879 , O'Neill, William, Topham, David and Desmulliez, Marc P.Y. (2010) Biofluid behaviour in 3D microchannel systems: Numerical analysis and design development of 3D microchannel biochip separators. In: 2010 Proceedings 60th Electronic Components and Technology Conference ECTC. Institute of Electrical and Electronics Engineers Inc., Piscataway, NJ, USA, pp. 1021-1030. ISBN 978-1-4244-6410-4 (print), 978-1-4244-6411-1 (electronic) ISSN 0569-5503 (doi:https://doi.org/10.1109/ECTC.2010.5490827)
3D microfluidic device
Xue, Xiangdong, Marson, Silvia, Patel, Mayur K., Bailey, Chris ORCID: 0000-0002-9438-3879 , O'Neill, William, Topham, David, Kay, Robert W. and Desmulliez, Marc P.Y. (2011) Progress towards the design and numerical analysis of a 3D microchannel biochip separator. International Journal for Numerical Methods in Biomedical Engineering, 27 (11). pp. 1771-1792. ISSN 2040-7939 (Print), 2040-7947 (Online) (doi:https://doi.org/10.1002/cnm.1439)
3D-miniaturised systems
Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Amalou, Farid, Sinclair, Keith I., Bailey, Christopher ORCID: 0000-0002-9438-3879 and Desmulliez, Marc P.Y. (2008) Modelling of nano-imprint forming process for the production of miniaturised 3D structures. International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems, 2008. EuroSimE 2008. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 497-504. ISBN 978-1-4244-2127-5 (doi:https://doi.org/10.1109/ESIME.2008.4525088)
acoustic streaming
Strusevich, Nadezhda, Desmulliez, Marc P.Y., Abraham, Eitan, Flynn, David, Jones, Thomas, Patel, Mayur and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2013) Electroplating for high aspect ratio vias in PCB manufacturing: enhancement capabilities of acoustic streaming. Advances in Manufacturing, 1 (3). pp. 211-217. ISSN 2095-3127 (Print), 2195-3597 (Online) (doi:https://doi.org/10.1007/s40436-013-0039-9)
adhesive materials
Goussetis, George, Sinclair, Keith I., Sangster, Alan J., Desmulliez, Marc P.Y., Tilford, Tim, Parrott, Kevin and Bailey, Christopher (2007) Microwave curing for high density package. 2007 International Symposium on High Density Design Packaging and Microsystem Integration. Institute of Electrical and Electronics Engineers, Inc., New York, p. 1. ISBN 9781424412525 (doi:https://doi.org/10.1109/HDP.2007.4283552)
agitation method
Kaufmann, Jens Georg, Desmulliez, Marc P.Y., Tian, Yingtao, Price, Dennis, Hughes, Mike, Strusevitch, Nadia, Bailey, Chris ORCID: 0000-0002-9438-3879 , Liu, Changqing and Hutt, David (2009) Megasonic agitation for enhanced electrodeposition of copper. Microsystem Technologies, 15 (8). pp. 1245-1254. ISSN 0946-7076 (Print), 1432-1858 (Online) (doi:https://doi.org/10.1007/s00542-009-0886-2)
assembly
Sinclair, Keith I., Goussetis, George, Desmulliez, Marc P.Y., Sangster, Alan J., Tilford, Tim, Bailey, Chris ORCID: 0000-0002-9438-3879 and Parrott, Kevin (2009) Polymer curing within an optimised open-ended microwave oven. In: European Microwave Week 2008, “Bridging Gaps”, Conference Proceedings,. Institute of Electrical and Electronics Engineers, Inc., Piscataway, N.J., USA, pp. 17-20. ISBN 978-2874870064 (doi:https://doi.org/10.1109/EUMC.2008.4751375)
assembly process technology
Tilford, Tim, Bailey, Christopher, Parrott, Kevin, Rizvi, M.J., Yin, Chunyan, Sinclair, Keith I. and Desmulliez, Marc P.Y. (2008) Impact of assembly process technologies on electronic packaging materials. International Conference on Electronic Packaging Technology & High Density Packaging, 2008. ICEPT-HDP 2008. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 1-6. ISBN 978-1-4244-2739-0 (online) 978-1-4244-2740-6 (print) (doi:https://doi.org/10.1109/ICEPT.2008.4607039)
biofluid behavior
Xue, Xiangdong, Patel, Mayur K., Bailey, Chris ORCID: 0000-0002-9438-3879 , Kersaudy-Kerhoas, Maïwenn and Desmulliez, Marc P.Y. (2009) Parametrical modeling and design optimization of blood plasma separation device with microchannel mechanism. In: Electronic Components and Technology. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, 1970 -1976. ISBN 978-1-4244-4476-2 (doi:https://doi.org/10.1109/ECTC.2009.5074291)
biofluid behaviour
Xue, Xiangdong, Patel, Mayur, Kersaudy-Kerhoas, Maïwenn, Bailey, Christopher ORCID: 0000-0002-9438-3879 , Desmulliez, Marc P.Y. and Topham, David (2009) Effect of fluid dynamics and device mechanism on biofluid behaviour in microchannel systems: modelling biofluids in a microchannel biochip separator. International Conference on Electronic Packaging Technology & High Density Packaging, 2009. ICEPT-HDP '09. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 179-186. ISBN 978-1-4244-4659-9 (doi:https://doi.org/10.1109/ICEPT.2009.5270767)
blood fluid separation
Xue, Xiangdong, Patel, Mayur K., Bailey, Chris ORCID: 0000-0002-9438-3879 and Desmulliez, Marc P.Y. (2011) Geometrical optimisation of a biochip microchannel fluidic separator. Computer Methods in Biomechanics and Biomedical Engineering, 15 (9). pp. 981-991. ISSN 1025-5842 (Print), 1476-8259 (Online) (doi:https://doi.org/10.1080/10255842.2011.569501)
Xue, Xiangdong, Patel, Mayur, Kersaudy-Kerhoas, Maïwenn, Bailey, Christopher ORCID: 0000-0002-9438-3879 and Desmulliez, Marc P.Y. (2011) Modelling and simulation of the behaviour of a biofluid in a microchannel biochip separator. Computer Methods in Biomechanics and Biomedical Engineering, 14 (6). pp. 549-560. ISSN 1025-5842 (Print), 1476-8259 (Online) (doi:https://doi.org/10.1080/10255842.2010.485570)
blood plasma separation
Xue, Xiangdong, Patel, Mayur, Kersaudy-Kerhoas, Maïwenn, Bailey, Christopher ORCID: 0000-0002-9438-3879 , Desmulliez, Marc P.Y. and Topham, David (2009) Effect of fluid dynamics and device mechanism on biofluid behaviour in microchannel systems: modelling biofluids in a microchannel biochip separator. International Conference on Electronic Packaging Technology & High Density Packaging, 2009. ICEPT-HDP '09. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 179-186. ISBN 978-1-4244-4659-9 (doi:https://doi.org/10.1109/ICEPT.2009.5270767)
Xue, Xiangdong, Patel, Mayur K., Bailey, Chris ORCID: 0000-0002-9438-3879 , Kersaudy-Kerhoas, Maïwenn and Desmulliez, Marc P.Y. (2009) Parametrical modeling and design optimization of blood plasma separation device with microchannel mechanism. In: Electronic Components and Technology. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, 1970 -1976. ISBN 978-1-4244-4476-2 (doi:https://doi.org/10.1109/ECTC.2009.5074291)
blood preparation
Kersaudy-Kerhoas, Maïwenn, Kavanagh, Deirdre, Xue, Xiangdong, Patel, Mayur, Bailey, Christopher, Dhariwal, Resham and Desmulliez, Marc P.Y. (2008) Integrated biomedical device for blood preparation. 2nd Electronics System-Integration Technology Conference, 2008. ESTC 2008. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 447-452. ISBN 978-1-4244-2814-4 (Print) 978-1-4244-2813-7 (Online) (doi:https://doi.org/10.1109/ESTC.2008.4684389)
bumps
Goussetis, George, Sinclair, Keith I., Sangster, Alan J., Desmulliez, Marc P.Y., Tilford, Tim, Parrott, Kevin and Bailey, Christopher (2007) Microwave curing for high density package. 2007 International Symposium on High Density Design Packaging and Microsystem Integration. Institute of Electrical and Electronics Engineers, Inc., New York, p. 1. ISBN 9781424412525 (doi:https://doi.org/10.1109/HDP.2007.4283552)
CFD
Hughes, Michael, Strussevich, Nadia, Bailey, Christopher ORCID: 0000-0002-9438-3879 , McManus, Kevin, Kaufmann, Jens, Flynn, David and Desmulliez, Marc P.Y. (2009) Numerical algorithms for modelling electrodeposition: Tracking the deposition front under forced convection from megasonic agitation. International Journal for Numerical Methods in Fluids, 64 (3). pp. 237-268. ISSN 0271-2091 (Print), 1097-0363 (Online) (doi:https://doi.org/10.1002/fld.2140)
Tilford, Tim, Sinclair, Keith I., Bailey, Christopher, Desmulliez, Marc P.Y., Parrott, Kevin and Sangster, Alan J. (2007) Multiphysics simulation of microwave curing of polymer materials in micro-electronics packaging applications. In: Silaghi, Alexandru Marius and Gordan, Ioan Mircea, (eds.) Proceedings book 11th International Conference on Microwave and High Frequency Heating, Oradea, Romania, September, 3-6 2007. University of Oradea, Romania, Oradea, Romania, pp. 189-192. ISBN 9789737593337
chip-on-board (COB) assembly
Tilford, Tim ORCID: 0000-0001-8307-6403 , Pavuluri, S., Bailey, Christopher ORCID: 0000-0002-9438-3879 and Desmulliez, Marc P.Y. (2009) On variable frequency microwave processing of heterogeneous chip-on-board assemblies. International Conference on Electronic Packaging Technology & High Density Packaging, 2009. ICEPT-HDP '09. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 927-931. ISBN 978-1-4244-4659-9 (doi:https://doi.org/10.1109/ICEPT.2009.5270558)
computational fluid dynamics
Xue, Xiangdong, Patel, Mayur K., Bailey, Chris ORCID: 0000-0002-9438-3879 , Kersaudy-Kerhoas, Maïwenn and Desmulliez, Marc P.Y. (2008) Challenges in modelling biofluids in microchannels. In: 2nd Electronics System-Integration Technology Conference, 2008. ESTC 2008. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 287-292. ISBN 978-1-4244-2814-4 (Print) 978-1-4244-2813-7 (Online) (doi:https://doi.org/10.1109/ESTC.2008.4684363)
computational fluid dynamics (CFD)
Kay, Robert W., Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Glinski, Greg P., Bailey, Christopher ORCID: 0000-0002-9438-3879 and Desmulliez, Marc P.Y. (2007) Ultra-fine pitch stencil printing for a low cost and low temperature flip-chip assembly process. IEEE Transactions on Components and Packaging Technologies, 30 (1). pp. 129-136. ISSN 1521-3331 (doi:https://doi.org/10.1109/TCAPT.2007.892085)
convection oven
Tilford, Tim ORCID: 0000-0001-8307-6403 , Sinclair, Keith I., Goussetis, George, Bailey, Christopher ORCID: 0000-0002-9438-3879 , Desmulliez, Marc P.Y., Parrott, Kevin and Sangster, Alan J. (2008) Comparison of encapsulant curing with convention and microwave systems. 33rd IEEE/CPMT International Electronic Manufacturing Technology Symposium (IEMT), 2008. IEEE, Piscataway, NJ, USA. ISBN 9781424433926 (print) 9781424433933 (electronic) (doi:https://doi.org/10.1109/IEMT.2008.5507869)
copper
Kaufmann, Jens Georg, Desmulliez, Marc P.Y., Tian, Yingtao, Price, Dennis, Hughes, Mike, Strusevitch, Nadia, Bailey, Chris ORCID: 0000-0002-9438-3879 , Liu, Changqing and Hutt, David (2009) Megasonic agitation for enhanced electrodeposition of copper. Microsystem Technologies, 15 (8). pp. 1245-1254. ISSN 0946-7076 (Print), 1432-1858 (Online) (doi:https://doi.org/10.1007/s00542-009-0886-2)
coupled simulation
Tilford, Tim, Sinclair, Keith I., Bailey, Christopher, Desmulliez, Marc P.Y., Parrott, Kevin and Sangster, Alan J. (2007) Coupled FDTD-FVM simulation of microwave heating of polymer materials for micro-systems packaging applications. Annual microwave heating symposium (41st). pp. 7-11. ISSN 1070-0129
Tilford, Tim, Sinclair, Keith I., Bailey, Christopher, Desmulliez, Marc P.Y., Parrott, Kevin and Sangster, Alan J. (2007) Multiphysics simulation of microwave curing of polymer materials in micro-electronics packaging applications. In: Silaghi, Alexandru Marius and Gordan, Ioan Mircea, (eds.) Proceedings book 11th International Conference on Microwave and High Frequency Heating, Oradea, Romania, September, 3-6 2007. University of Oradea, Romania, Oradea, Romania, pp. 189-192. ISBN 9789737593337
cross flow filtration
Xue, Xiangdong, Patel, Mayur K., Bailey, Chris ORCID: 0000-0002-9438-3879 and Desmulliez, Marc P.Y. (2011) Geometrical optimisation of a biochip microchannel fluidic separator. Computer Methods in Biomechanics and Biomedical Engineering, 15 (9). pp. 981-991. ISSN 1025-5842 (Print), 1476-8259 (Online) (doi:https://doi.org/10.1080/10255842.2011.569501)
cross-flow filtration
Xue, Xiangdong, Patel, Mayur, Kersaudy-Kerhoas, Maïwenn, Bailey, Christopher ORCID: 0000-0002-9438-3879 and Desmulliez, Marc P.Y. (2011) Modelling and simulation of the behaviour of a biofluid in a microchannel biochip separator. Computer Methods in Biomechanics and Biomedical Engineering, 14 (6). pp. 549-560. ISSN 1025-5842 (Print), 1476-8259 (Online) (doi:https://doi.org/10.1080/10255842.2010.485570)
cross-flow filtration
Xue, Xiangdong, Patel, Mayur K., Kersaudy-Kerhoas, Maïwenn, Desmulliez, Marc P.Y., Bailey, Chris ORCID: 0000-0002-9438-3879 and Topham, David (2012) Analysis of fluid separation in microfluidic T-channels. Applied Mathematical Modelling, 36 (2). pp. 743-755. ISSN 0307-904X (doi:https://doi.org/10.1016/j.apm.2011.07.009)
cure process
Sinclair, Keith I., Tilford, Tim ORCID: 0000-0001-8307-6403 , Goussetis, George, Bailey, Christopher ORCID: 0000-0002-9438-3879 , Desmulliez, Marc P.Y., Parrott, Kevin and Sangster, Alan J. (2008) Advanced microwave oven for rapid curing of encapsulant. 2nd Electronics System-Integration Technology Conference, 2008. ESTC 2008. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 551-556. ISBN 978-1-4244-2814-4 (print) 978-1-4244-2813-7 (online) (doi:https://doi.org/10.1109/ESTC.2008.4684409)
curing
Sinclair, Keith I., Goussetis, George, Desmulliez, Marc P.Y., Sangster, Alan J., Tilford, Tim, Bailey, Chris ORCID: 0000-0002-9438-3879 and Parrott, Kevin (2009) Polymer curing within an optimised open-ended microwave oven. In: European Microwave Week 2008, “Bridging Gaps”, Conference Proceedings,. Institute of Electrical and Electronics Engineers, Inc., Piscataway, N.J., USA, pp. 17-20. ISBN 978-2874870064 (doi:https://doi.org/10.1109/EUMC.2008.4751375)
Tilford, Tim ORCID: 0000-0001-8307-6403 , Sinclair, Keith I., Goussetis, George, Bailey, Christopher ORCID: 0000-0002-9438-3879 , Desmulliez, Marc P.Y., Parrott, Kevin and Sangster, Alan J. (2008) Comparison of encapsulant curing with convention and microwave systems. 33rd IEEE/CPMT International Electronic Manufacturing Technology Symposium (IEMT), 2008. IEEE, Piscataway, NJ, USA. ISBN 9781424433926 (print) 9781424433933 (electronic) (doi:https://doi.org/10.1109/IEMT.2008.5507869)
Tilford, Tim, Sinclair, Keith I., Bailey, Christopher, Desmulliez, Marc P.Y., Parrott, Kevin and Sangster, Alan J. (2007) Multiphysics simulation of microwave curing of polymer materials in micro-electronics packaging applications. In: Silaghi, Alexandru Marius and Gordan, Ioan Mircea, (eds.) Proceedings book 11th International Conference on Microwave and High Frequency Heating, Oradea, Romania, September, 3-6 2007. University of Oradea, Romania, Oradea, Romania, pp. 189-192. ISBN 9789737593337
curing processes
Tilford, Tim, Sinclair, Keith I., Bailey, Christopher, Pavuluri, S. and Desmulliez, Marc P.Y. (2009) On the application of variable frequency microwave technology for processing of individual surface mount components. In: 2009 International Conference on Electronics Packaging.
DC-DC
Flynn, David, Lu, Hua ORCID: 0000-0002-4392-6562 , Bailey, Christopher ORCID: 0000-0002-9438-3879 and Desmulliez, Marc P.Y. (2006) Assessment of microInductors for DC-DC converters. Proceedings of 2006 International Conference on Electronic Materials and Packaging (EMAP 2006). IEEE. ISBN 978-1-4244-0834-4
DC-DC power converter
Flynn, David, Lu, Hua ORCID: 0000-0002-4392-6562 , Bailey, Chris ORCID: 0000-0002-9438-3879 and Desmulliez, Marc P.Y. (2008) Design, modeling and characterization of a microinductor for future DC-DC power converters. In: 2nd Electronics System-Integration Technology Conference, 2008. ESTC 2008. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 577-582. ISBN 978-1-4244-2814-4 (print), 978-1-4244-2813-7 (online) (doi:https://doi.org/10.1109/ESTC.2008.4684414)
design optimisation
Xue, Xiangdong, Patel, Mayur K., Bailey, Chris ORCID: 0000-0002-9438-3879 and Desmulliez, Marc P.Y. (2011) Geometrical optimisation of a biochip microchannel fluidic separator. Computer Methods in Biomechanics and Biomedical Engineering, 15 (9). pp. 981-991. ISSN 1025-5842 (Print), 1476-8259 (Online) (doi:https://doi.org/10.1080/10255842.2011.569501)
design optimization
Xue, Xiangdong, Patel, Mayur K., Bailey, Chris ORCID: 0000-0002-9438-3879 , Kersaudy-Kerhoas, Maïwenn and Desmulliez, Marc P.Y. (2009) Parametrical modeling and design optimization of blood plasma separation device with microchannel mechanism. In: Electronic Components and Technology. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, 1970 -1976. ISBN 978-1-4244-4476-2 (doi:https://doi.org/10.1109/ECTC.2009.5074291)
device design
Xue, Xiangdong, Marson, Silvia, Patel, Mayur K., Bailey, Chris ORCID: 0000-0002-9438-3879 , O'Neill, William, Topham, David, Kay, Robert W. and Desmulliez, Marc P.Y. (2011) Progress towards the design and numerical analysis of a 3D microchannel biochip separator. International Journal for Numerical Methods in Biomedical Engineering, 27 (11). pp. 1771-1792. ISSN 2040-7939 (Print), 2040-7947 (Online) (doi:https://doi.org/10.1002/cnm.1439)
die attach
Goussetis, George, Sinclair, Keith I., Sangster, Alan J., Desmulliez, Marc P.Y., Tilford, Tim, Parrott, Kevin and Bailey, Christopher (2007) Microwave curing for high density package. 2007 International Symposium on High Density Design Packaging and Microsystem Integration. Institute of Electrical and Electronics Engineers, Inc., New York, p. 1. ISBN 9781424412525 (doi:https://doi.org/10.1109/HDP.2007.4283552)
dielectric losses
Sinclair, Keith I., Goussetis, George, Desmulliez, Marc P.Y., Sangster, Alan J., Tilford, Tim, Bailey, Chris ORCID: 0000-0002-9438-3879 and Parrott, Kevin (2009) Polymer curing within an optimised open-ended microwave oven. In: European Microwave Week 2008, “Bridging Gaps”, Conference Proceedings,. Institute of Electrical and Electronics Engineers, Inc., Piscataway, N.J., USA, pp. 17-20. ISBN 978-2874870064 (doi:https://doi.org/10.1109/EUMC.2008.4751375)
dielectric materials
Sinclair, Keith I., Goussetis, George, Desmulliez, Marc P.Y., Sangster, Alan J., Tilford, Tim, Bailey, Chris ORCID: 0000-0002-9438-3879 and Parrott, Kevin (2009) Polymer curing within an optimised open-ended microwave oven. In: European Microwave Week 2008, “Bridging Gaps”, Conference Proceedings,. Institute of Electrical and Electronics Engineers, Inc., Piscataway, N.J., USA, pp. 17-20. ISBN 978-2874870064 (doi:https://doi.org/10.1109/EUMC.2008.4751375)
electrodeposition
Hughes, Michael, Strussevich, Nadia, Bailey, Christopher ORCID: 0000-0002-9438-3879 , McManus, Kevin, Kaufmann, Jens, Flynn, David and Desmulliez, Marc P.Y. (2009) Numerical algorithms for modelling electrodeposition: Tracking the deposition front under forced convection from megasonic agitation. International Journal for Numerical Methods in Fluids, 64 (3). pp. 237-268. ISSN 0271-2091 (Print), 1097-0363 (Online) (doi:https://doi.org/10.1002/fld.2140)
Kaufmann, Jens Georg, Desmulliez, Marc P.Y., Tian, Yingtao, Price, Dennis, Hughes, Mike, Strusevitch, Nadia, Bailey, Chris ORCID: 0000-0002-9438-3879 , Liu, Changqing and Hutt, David (2009) Megasonic agitation for enhanced electrodeposition of copper. Microsystem Technologies, 15 (8). pp. 1245-1254. ISSN 0946-7076 (Print), 1432-1858 (Online) (doi:https://doi.org/10.1007/s00542-009-0886-2)
Kaufmann, Jens, Desmulliez, Marc P.Y., Price, Dennis, Hughes, Mike, Strusevitch, Nadia and Bailey, Chris ORCID: 0000-0002-9438-3879 (2008) Influence of megasonic agitation on the electrodeposition of high aspect ratio blind vias. 2nd Electronics System-Integration Technology Conference, 2008. ESTC 2008. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 1235-1240. ISBN 978-1-4244-2813-7 (doi:https://doi.org/10.1109/ESTC.2008.4684530)
electromagnetic heating
Sinclair, Keith I., Goussetis, George, Desmulliez, Marc P.Y., Sangster, Alan J., Tilford, Tim, Bailey, Chris ORCID: 0000-0002-9438-3879 and Parrott, Kevin (2009) Polymer curing within an optimised open-ended microwave oven. In: European Microwave Week 2008, “Bridging Gaps”, Conference Proceedings,. Institute of Electrical and Electronics Engineers, Inc., Piscataway, N.J., USA, pp. 17-20. ISBN 978-2874870064 (doi:https://doi.org/10.1109/EUMC.2008.4751375)
electronic engineering
Tilford, Tim ORCID: 0000-0001-8307-6403 , Sinclair, Keith I., Bailey, Christopher ORCID: 0000-0002-9438-3879 , Desmulliez, Marc P.Y., Goussetis, George, Parrott, Kevin and Sangster, Alan J. (2007) Multiphysics simulation of microwave curing in micro-electronics packaging applications. Soldering & Surface Mount Technology, 19 (3). pp. 26-33. ISSN 0954-0911 (doi:https://doi.org/10.1108/09540910710843757)
electronic packaging
Tilford, Tim, Bailey, Christopher, Parrott, Kevin, Rizvi, M.J., Yin, Chunyan, Sinclair, Keith I. and Desmulliez, Marc P.Y. (2008) Impact of assembly process technologies on electronic packaging materials. International Conference on Electronic Packaging Technology & High Density Packaging, 2008. ICEPT-HDP 2008. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 1-6. ISBN 978-1-4244-2739-0 (online) 978-1-4244-2740-6 (print) (doi:https://doi.org/10.1109/ICEPT.2008.4607039)
electronic products
Goussetis, George, Sinclair, Keith I., Sangster, Alan J., Desmulliez, Marc P.Y., Tilford, Tim, Parrott, Kevin and Bailey, Christopher (2007) Microwave curing for high density package. 2007 International Symposium on High Density Design Packaging and Microsystem Integration. Institute of Electrical and Electronics Engineers, Inc., New York, p. 1. ISBN 9781424412525 (doi:https://doi.org/10.1109/HDP.2007.4283552)
electronics manufacturing
Strusevich, Nadezhda, Desmulliez, Marc P.Y., Abraham, Eitan, Flynn, David, Jones, Thomas, Patel, Mayur and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2013) Electroplating for high aspect ratio vias in PCB manufacturing: enhancement capabilities of acoustic streaming. Advances in Manufacturing, 1 (3). pp. 211-217. ISSN 2095-3127 (Print), 2195-3597 (Online) (doi:https://doi.org/10.1007/s40436-013-0039-9)
electroplating
Strusevich, Nadezhda, Desmulliez, Marc P.Y., Abraham, Eitan, Flynn, David, Jones, Thomas, Patel, Mayur and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2013) Electroplating for high aspect ratio vias in PCB manufacturing: enhancement capabilities of acoustic streaming. Advances in Manufacturing, 1 (3). pp. 211-217. ISSN 2095-3127 (Print), 2195-3597 (Online) (doi:https://doi.org/10.1007/s40436-013-0039-9)
Kaufmann, Jens Georg, Desmulliez, Marc P.Y., Tian, Yingtao, Price, Dennis, Hughes, Mike, Strusevitch, Nadia, Bailey, Chris ORCID: 0000-0002-9438-3879 , Liu, Changqing and Hutt, David (2009) Megasonic agitation for enhanced electrodeposition of copper. Microsystem Technologies, 15 (8). pp. 1245-1254. ISSN 0946-7076 (Print), 1432-1858 (Online) (doi:https://doi.org/10.1007/s00542-009-0886-2)
Kaufmann, Jens, Desmulliez, Marc P.Y., Price, Dennis, Hughes, Mike, Strusevitch, Nadia and Bailey, Chris ORCID: 0000-0002-9438-3879 (2008) Influence of megasonic agitation on the electrodeposition of high aspect ratio blind vias. 2nd Electronics System-Integration Technology Conference, 2008. ESTC 2008. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 1235-1240. ISBN 978-1-4244-2813-7 (doi:https://doi.org/10.1109/ESTC.2008.4684530)
end-fed probes
Sinclair, Keith I., Sangster, Alan J., Goussetis, George, Desmulliez, Marc P.Y., Tilford, Tim, Parrott, Kevin and Bailey, Christopher (2007) Open ended microwave oven for flip-chip assembly. 2007 European Microwave Conference. Institute of Electrical and Electronics Engineers, Inc., New York, pp. 620-623. ISBN 9782874870019
fabrication
Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Amalou, Farid, Sinclair, Keith I., Bailey, Christopher ORCID: 0000-0002-9438-3879 and Desmulliez, Marc P.Y. (2008) Minimising the risk of defects in nano-imprint forming. 31st International Spring Seminar on Electronics Technology, 2008. ISSE '08. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 367-372. ISBN 978-1-4244-3972-0 (doi:https://doi.org/10.1109/ISSE.2008.5276670)
FDTD
Tilford, Tim, Sinclair, Keith I., Bailey, Christopher, Desmulliez, Marc P.Y., Parrott, Kevin and Sangster, Alan J. (2007) Multiphysics simulation of microwave curing of polymer materials in micro-electronics packaging applications. In: Silaghi, Alexandru Marius and Gordan, Ioan Mircea, (eds.) Proceedings book 11th International Conference on Microwave and High Frequency Heating, Oradea, Romania, September, 3-6 2007. University of Oradea, Romania, Oradea, Romania, pp. 189-192. ISBN 9789737593337
Finite Element Analysis
Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Amalou, Farid, Sinclair, Keith I., Bailey, Christopher ORCID: 0000-0002-9438-3879 and Desmulliez, Marc P.Y. (2008) Minimising the risk of defects in nano-imprint forming. 31st International Spring Seminar on Electronics Technology, 2008. ISSE '08. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 367-372. ISBN 978-1-4244-3972-0 (doi:https://doi.org/10.1109/ISSE.2008.5276670)
flip-chip assembly
Sinclair, Keith I., Sangster, Alan J., Goussetis, George, Desmulliez, Marc P.Y., Tilford, Tim, Parrott, Kevin and Bailey, Christopher (2007) Open ended microwave oven for flip-chip assembly. 2007 European Microwave Conference. Institute of Electrical and Electronics Engineers, Inc., New York, pp. 620-623. ISBN 9782874870019
flip-chip packaging
Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Kay, Robert W., Bailey, Christopher ORCID: 0000-0002-9438-3879 and Desmulliez, Marc P.Y. (2007) Computational modelling for reliable flip-chip packaging at sub-100 micron pitch using isotropic conductive adhesives. Microelectronics Reliability, 47 (1). pp. 132-141. ISSN 0026-2714 (doi:https://doi.org/10.1016/j.microrel.2006.01.004)
flip-chip underfills
Goussetis, George, Sinclair, Keith I., Sangster, Alan J., Desmulliez, Marc P.Y., Tilford, Tim, Parrott, Kevin and Bailey, Christopher (2007) Microwave curing for high density package. 2007 International Symposium on High Density Design Packaging and Microsystem Integration. Institute of Electrical and Electronics Engineers, Inc., New York, p. 1. ISBN 9781424412525 (doi:https://doi.org/10.1109/HDP.2007.4283552)
flow behaviour
Xue, Xiangdong, Marson, Silvia, Patel, Mayur K., Attia, Usama M., Bailey, Chris ORCID: 0000-0002-9438-3879 , O'Neill, William, Topham, David and Desmulliez, Marc P.Y. (2010) Biofluid behaviour in 3D microchannel systems: Numerical analysis and design development of 3D microchannel biochip separators. In: 2010 Proceedings 60th Electronic Components and Technology Conference ECTC. Institute of Electrical and Electronics Engineers Inc., Piscataway, NJ, USA, pp. 1021-1030. ISBN 978-1-4244-6410-4 (print), 978-1-4244-6411-1 (electronic) ISSN 0569-5503 (doi:https://doi.org/10.1109/ECTC.2010.5490827)
flow fields
Xue, Xiangdong, Marson, Silvia, Patel, Mayur K., Attia, Usama M., Bailey, Chris ORCID: 0000-0002-9438-3879 , O'Neill, William, Topham, David and Desmulliez, Marc P.Y. (2010) Biofluid behaviour in 3D microchannel systems: Numerical analysis and design development of 3D microchannel biochip separators. In: 2010 Proceedings 60th Electronic Components and Technology Conference ECTC. Institute of Electrical and Electronics Engineers Inc., Piscataway, NJ, USA, pp. 1021-1030. ISBN 978-1-4244-6410-4 (print), 978-1-4244-6411-1 (electronic) ISSN 0569-5503 (doi:https://doi.org/10.1109/ECTC.2010.5490827)
fluid separator
Xue, Xiangdong, Patel, Mayur K., Kersaudy-Kerhoas, Maïwenn, Desmulliez, Marc P.Y., Bailey, Chris ORCID: 0000-0002-9438-3879 and Topham, David (2012) Analysis of fluid separation in microfluidic T-channels. Applied Mathematical Modelling, 36 (2). pp. 743-755. ISSN 0307-904X (doi:https://doi.org/10.1016/j.apm.2011.07.009)
frequency agile microwave oven bonding system (FAMOBS)
Tilford, Tim ORCID: 0000-0001-8307-6403 , Pavuluri, S., Bailey, Christopher ORCID: 0000-0002-9438-3879 and Desmulliez, Marc P.Y. (2009) On variable frequency microwave processing of heterogeneous chip-on-board assemblies. International Conference on Electronic Packaging Technology & High Density Packaging, 2009. ICEPT-HDP '09. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 927-931. ISBN 978-1-4244-4659-9 (doi:https://doi.org/10.1109/ICEPT.2009.5270558)
glob top
Goussetis, George, Sinclair, Keith I., Sangster, Alan J., Desmulliez, Marc P.Y., Tilford, Tim, Parrott, Kevin and Bailey, Christopher (2007) Microwave curing for high density package. 2007 International Symposium on High Density Design Packaging and Microsystem Integration. Institute of Electrical and Electronics Engineers, Inc., New York, p. 1. ISBN 9781424412525 (doi:https://doi.org/10.1109/HDP.2007.4283552)
heat sensitive film
Sinclair, Keith I., Sangster, Alan J., Goussetis, George, Desmulliez, Marc P.Y., Tilford, Tim, Parrott, Kevin and Bailey, Christopher (2007) Open ended microwave oven for flip-chip assembly. 2007 European Microwave Conference. Institute of Electrical and Electronics Engineers, Inc., New York, pp. 620-623. ISBN 9782874870019
high aspect ratio microvia
Strusevich, Nadezhda, Desmulliez, Marc P.Y., Abraham, Eitan, Flynn, David, Jones, Thomas, Patel, Mayur and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2013) Electroplating for high aspect ratio vias in PCB manufacturing: enhancement capabilities of acoustic streaming. Advances in Manufacturing, 1 (3). pp. 211-217. ISSN 2095-3127 (Print), 2195-3597 (Online) (doi:https://doi.org/10.1007/s40436-013-0039-9)
high density interconnection technology
Kaufmann, Jens, Desmulliez, Marc P.Y., Price, Dennis, Hughes, Mike, Strusevitch, Nadia and Bailey, Chris ORCID: 0000-0002-9438-3879 (2008) Influence of megasonic agitation on the electrodeposition of high aspect ratio blind vias. 2nd Electronics System-Integration Technology Conference, 2008. ESTC 2008. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 1235-1240. ISBN 978-1-4244-2813-7 (doi:https://doi.org/10.1109/ESTC.2008.4684530)
individual surface mount components
Tilford, Tim, Sinclair, Keith I., Bailey, Christopher, Pavuluri, S. and Desmulliez, Marc P.Y. (2009) On the application of variable frequency microwave technology for processing of individual surface mount components. In: 2009 International Conference on Electronics Packaging.
isotropic conductive adhesives (ICAs)
Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Kay, Robert W., Bailey, Christopher ORCID: 0000-0002-9438-3879 and Desmulliez, Marc P.Y. (2007) Computational modelling for reliable flip-chip packaging at sub-100 micron pitch using isotropic conductive adhesives. Microelectronics Reliability, 47 (1). pp. 132-141. ISSN 0026-2714 (doi:https://doi.org/10.1016/j.microrel.2006.01.004)
Kay, Robert W., Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Glinski, Greg P., Bailey, Christopher ORCID: 0000-0002-9438-3879 and Desmulliez, Marc P.Y. (2007) Ultra-fine pitch stencil printing for a low cost and low temperature flip-chip assembly process. IEEE Transactions on Components and Packaging Technologies, 30 (1). pp. 129-136. ISSN 1521-3331 (doi:https://doi.org/10.1109/TCAPT.2007.892085)
lab-on-a-chip
Kersaudy-Kerhoas, Maïwenn, Kavanagh, Deirdre, Xue, Xiangdong, Patel, Mayur, Bailey, Christopher, Dhariwal, Resham and Desmulliez, Marc P.Y. (2008) Integrated biomedical device for blood preparation. 2nd Electronics System-Integration Technology Conference, 2008. ESTC 2008. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 447-452. ISBN 978-1-4244-2814-4 (Print) 978-1-4244-2813-7 (Online) (doi:https://doi.org/10.1109/ESTC.2008.4684389)
level set method
Hughes, Michael, Strussevich, Nadia, Bailey, Christopher ORCID: 0000-0002-9438-3879 , McManus, Kevin, Kaufmann, Jens, Flynn, David and Desmulliez, Marc P.Y. (2009) Numerical algorithms for modelling electrodeposition: Tracking the deposition front under forced convection from megasonic agitation. International Journal for Numerical Methods in Fluids, 64 (3). pp. 237-268. ISSN 0271-2091 (Print), 1097-0363 (Online) (doi:https://doi.org/10.1002/fld.2140)
LIGA
Hughes, Michael, Strussevich, Nadia, Bailey, Christopher ORCID: 0000-0002-9438-3879 , McManus, Kevin, Kaufmann, Jens, Flynn, David and Desmulliez, Marc P.Y. (2009) Numerical algorithms for modelling electrodeposition: Tracking the deposition front under forced convection from megasonic agitation. International Journal for Numerical Methods in Fluids, 64 (3). pp. 237-268. ISSN 0271-2091 (Print), 1097-0363 (Online) (doi:https://doi.org/10.1002/fld.2140)
low power tests
Sinclair, Keith I., Sangster, Alan J., Goussetis, George, Desmulliez, Marc P.Y., Tilford, Tim, Parrott, Kevin and Bailey, Christopher (2007) Open ended microwave oven for flip-chip assembly. 2007 European Microwave Conference. Institute of Electrical and Electronics Engineers, Inc., New York, pp. 620-623. ISBN 9782874870019
low temperature (T<100 C)
Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Kay, Robert W., Bailey, Christopher ORCID: 0000-0002-9438-3879 and Desmulliez, Marc P.Y. (2007) Computational modelling for reliable flip-chip packaging at sub-100 micron pitch using isotropic conductive adhesives. Microelectronics Reliability, 47 (1). pp. 132-141. ISSN 0026-2714 (doi:https://doi.org/10.1016/j.microrel.2006.01.004)
low-loss dielectric
Sinclair, Keith I., Sangster, Alan J., Goussetis, George, Desmulliez, Marc P.Y., Tilford, Tim, Parrott, Kevin and Bailey, Christopher (2007) Open ended microwave oven for flip-chip assembly. 2007 European Microwave Conference. Institute of Electrical and Electronics Engineers, Inc., New York, pp. 620-623. ISBN 9782874870019
manufacturing processes
Flynn, David, Lu, Hua ORCID: 0000-0002-4392-6562 , Bailey, Christopher ORCID: 0000-0002-9438-3879 and Desmulliez, Marc P.Y. (2006) Assessment of microInductors for DC-DC converters. Proceedings of 2006 International Conference on Electronic Materials and Packaging (EMAP 2006). IEEE. ISBN 978-1-4244-0834-4
megasonic acoustic streaming
Kaufmann, Jens Georg, Desmulliez, Marc P.Y., Tian, Yingtao, Price, Dennis, Hughes, Mike, Strusevitch, Nadia, Bailey, Chris ORCID: 0000-0002-9438-3879 , Liu, Changqing and Hutt, David (2009) Megasonic agitation for enhanced electrodeposition of copper. Microsystem Technologies, 15 (8). pp. 1245-1254. ISSN 0946-7076 (Print), 1432-1858 (Online) (doi:https://doi.org/10.1007/s00542-009-0886-2)
Megasonic Agitation
Jones, Thomas D.A., Flynn, David, Desmulliez, Marc P.Y., Price, Dennis, Beadel, Matthew, Strusevich, Nadia, Patel, Mayur, Bailey, Chris ORCID: 0000-0002-9438-3879 and Costello, Suzanne (2016) Morphology and acoustic artefacts of copper deposits electroplated using megasonic assisted agitation. Circuit World, 42 (3). pp. 127-140. ISSN 0305-6120 (doi:https://doi.org/10.1108/CW-03-2016-0006)
Strusevich, Nadezhda, Desmulliez, Marc P.Y., Abraham, Eitan, Flynn, David, Jones, Thomas, Patel, Mayur and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2013) Electroplating for high aspect ratio vias in PCB manufacturing: enhancement capabilities of acoustic streaming. Advances in Manufacturing, 1 (3). pp. 211-217. ISSN 2095-3127 (Print), 2195-3597 (Online) (doi:https://doi.org/10.1007/s40436-013-0039-9)
Hughes, Michael, Strussevich, Nadia, Bailey, Christopher ORCID: 0000-0002-9438-3879 , McManus, Kevin, Kaufmann, Jens, Flynn, David and Desmulliez, Marc P.Y. (2009) Numerical algorithms for modelling electrodeposition: Tracking the deposition front under forced convection from megasonic agitation. International Journal for Numerical Methods in Fluids, 64 (3). pp. 237-268. ISSN 0271-2091 (Print), 1097-0363 (Online) (doi:https://doi.org/10.1002/fld.2140)
Kaufmann, Jens, Desmulliez, Marc P.Y., Price, Dennis, Hughes, Mike, Strusevitch, Nadia and Bailey, Chris ORCID: 0000-0002-9438-3879 (2008) Influence of megasonic agitation on the electrodeposition of high aspect ratio blind vias. 2nd Electronics System-Integration Technology Conference, 2008. ESTC 2008. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 1235-1240. ISBN 978-1-4244-2813-7 (doi:https://doi.org/10.1109/ESTC.2008.4684530)
metals
Kaufmann, Jens Georg, Desmulliez, Marc P.Y., Tian, Yingtao, Price, Dennis, Hughes, Mike, Strusevitch, Nadia, Bailey, Chris ORCID: 0000-0002-9438-3879 , Liu, Changqing and Hutt, David (2009) Megasonic agitation for enhanced electrodeposition of copper. Microsystem Technologies, 15 (8). pp. 1245-1254. ISSN 0946-7076 (Print), 1432-1858 (Online) (doi:https://doi.org/10.1007/s00542-009-0886-2)
micro-electronics manufacture
Sinclair, Keith I., Tilford, Tim ORCID: 0000-0001-8307-6403 , Goussetis, George, Bailey, Christopher ORCID: 0000-0002-9438-3879 , Desmulliez, Marc P.Y., Parrott, Kevin and Sangster, Alan J. (2008) Advanced microwave oven for rapid curing of encapsulant. 2nd Electronics System-Integration Technology Conference, 2008. ESTC 2008. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 551-556. ISBN 978-1-4244-2814-4 (print) 978-1-4244-2813-7 (online) (doi:https://doi.org/10.1109/ESTC.2008.4684409)
micro-manufactured
Lu, Hua ORCID: 0000-0002-4392-6562 , Flynn, David, Bailey, Christopher ORCID: 0000-0002-9438-3879 and Desmulliez, Marc P.Y. (2006) Computer modeling of a micro-manufactured one-turn inductor. Proceedings of the Sixth IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, 2006. IEEE. ISBN 1 4244 0489 4 (doi:https://doi.org/10.1109/HDP.2006.1707562)
microchannel biochip separator
Xue, Xiangdong, Patel, Mayur, Kersaudy-Kerhoas, Maïwenn, Bailey, Christopher ORCID: 0000-0002-9438-3879 , Desmulliez, Marc P.Y. and Topham, David (2009) Effect of fluid dynamics and device mechanism on biofluid behaviour in microchannel systems: modelling biofluids in a microchannel biochip separator. International Conference on Electronic Packaging Technology & High Density Packaging, 2009. ICEPT-HDP '09. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 179-186. ISBN 978-1-4244-4659-9 (doi:https://doi.org/10.1109/ICEPT.2009.5270767)
microchannel device
Xue, Xiangdong, Patel, Mayur K., Kersaudy-Kerhoas, Maïwenn, Desmulliez, Marc P.Y., Bailey, Chris ORCID: 0000-0002-9438-3879 and Topham, David (2012) Analysis of fluid separation in microfluidic T-channels. Applied Mathematical Modelling, 36 (2). pp. 743-755. ISSN 0307-904X (doi:https://doi.org/10.1016/j.apm.2011.07.009)
Xue, Xiangdong, Marson, Silvia, Patel, Mayur K., Bailey, Chris ORCID: 0000-0002-9438-3879 , O'Neill, William, Topham, David, Kay, Robert W. and Desmulliez, Marc P.Y. (2011) Progress towards the design and numerical analysis of a 3D microchannel biochip separator. International Journal for Numerical Methods in Biomedical Engineering, 27 (11). pp. 1771-1792. ISSN 2040-7939 (Print), 2040-7947 (Online) (doi:https://doi.org/10.1002/cnm.1439)
Xue, Xiangdong, Patel, Mayur, Kersaudy-Kerhoas, Maïwenn, Bailey, Christopher ORCID: 0000-0002-9438-3879 and Desmulliez, Marc P.Y. (2011) Modelling and simulation of the behaviour of a biofluid in a microchannel biochip separator. Computer Methods in Biomechanics and Biomedical Engineering, 14 (6). pp. 549-560. ISSN 1025-5842 (Print), 1476-8259 (Online) (doi:https://doi.org/10.1080/10255842.2010.485570)
Xue, Xiangdong, Patel, Mayur K., Bailey, Chris ORCID: 0000-0002-9438-3879 , Kersaudy-Kerhoas, Maïwenn and Desmulliez, Marc P.Y. (2009) Parametrical modeling and design optimization of blood plasma separation device with microchannel mechanism. In: Electronic Components and Technology. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, 1970 -1976. ISBN 978-1-4244-4476-2 (doi:https://doi.org/10.1109/ECTC.2009.5074291)
microchannel systems
Xue, Xiangdong, Patel, Mayur, Kersaudy-Kerhoas, Maïwenn, Bailey, Christopher ORCID: 0000-0002-9438-3879 , Desmulliez, Marc P.Y. and Topham, David (2009) Effect of fluid dynamics and device mechanism on biofluid behaviour in microchannel systems: modelling biofluids in a microchannel biochip separator. International Conference on Electronic Packaging Technology & High Density Packaging, 2009. ICEPT-HDP '09. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 179-186. ISBN 978-1-4244-4659-9 (doi:https://doi.org/10.1109/ICEPT.2009.5270767)
microchannels
Kersaudy-Kerhoas, Maïwenn, Kavanagh, Deirdre, Xue, Xiangdong, Patel, Mayur, Bailey, Christopher, Dhariwal, Resham and Desmulliez, Marc P.Y. (2008) Integrated biomedical device for blood preparation. 2nd Electronics System-Integration Technology Conference, 2008. ESTC 2008. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 447-452. ISBN 978-1-4244-2814-4 (Print) 978-1-4244-2813-7 (Online) (doi:https://doi.org/10.1109/ESTC.2008.4684389)
microelectronics
Tilford, Tim, Sinclair, Keith I., Bailey, Christopher, Desmulliez, Marc P.Y., Parrott, Kevin and Sangster, Alan J. (2007) Coupled FDTD-FVM simulation of microwave heating of polymer materials for micro-systems packaging applications. Annual microwave heating symposium (41st). pp. 7-11. ISSN 1070-0129
microelectronics packaging
Ferenets, M., Tilford, Tim, Sinclair, Keith I., Bailey, Christopher and Desmulliez, Marc P.Y. (2009) Microwave curing of thermosetting polymer materials in microelectronics applications. In: Baltic Polymer Symposium 2009, 22-25 September 2009, Ventspils, Latvia.
microfluidic device
Xue, Xiangdong, Patel, Mayur K., Kersaudy-Kerhoas, Maïwenn, Desmulliez, Marc P.Y., Bailey, Chris ORCID: 0000-0002-9438-3879 and Topham, David (2012) Analysis of fluid separation in microfluidic T-channels. Applied Mathematical Modelling, 36 (2). pp. 743-755. ISSN 0307-904X (doi:https://doi.org/10.1016/j.apm.2011.07.009)
Xue, Xiangdong, Patel, Mayur K., Bailey, Chris ORCID: 0000-0002-9438-3879 and Desmulliez, Marc P.Y. (2011) Geometrical optimisation of a biochip microchannel fluidic separator. Computer Methods in Biomechanics and Biomedical Engineering, 15 (9). pp. 981-991. ISSN 1025-5842 (Print), 1476-8259 (Online) (doi:https://doi.org/10.1080/10255842.2011.569501)
Xue, Xiangdong, Patel, Mayur, Kersaudy-Kerhoas, Maïwenn, Bailey, Christopher ORCID: 0000-0002-9438-3879 and Desmulliez, Marc P.Y. (2011) Modelling and simulation of the behaviour of a biofluid in a microchannel biochip separator. Computer Methods in Biomechanics and Biomedical Engineering, 14 (6). pp. 549-560. ISSN 1025-5842 (Print), 1476-8259 (Online) (doi:https://doi.org/10.1080/10255842.2010.485570)
microfluidics
Xue, Xiangdong, Patel, Mayur K., Kersaudy-Kerhoas, Maïwenn, Desmulliez, Marc P.Y., Bailey, Chris ORCID: 0000-0002-9438-3879 and Topham, David (2012) Analysis of fluid separation in microfluidic T-channels. Applied Mathematical Modelling, 36 (2). pp. 743-755. ISSN 0307-904X (doi:https://doi.org/10.1016/j.apm.2011.07.009)
microinductor
Flynn, David, Lu, Hua ORCID: 0000-0002-4392-6562 , Bailey, Chris ORCID: 0000-0002-9438-3879 and Desmulliez, Marc P.Y. (2008) Design, modeling and characterization of a microinductor for future DC-DC power converters. In: 2nd Electronics System-Integration Technology Conference, 2008. ESTC 2008. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 577-582. ISBN 978-1-4244-2814-4 (print), 978-1-4244-2813-7 (online) (doi:https://doi.org/10.1109/ESTC.2008.4684414)
microinductors
Flynn, David, Lu, Hua ORCID: 0000-0002-4392-6562 , Bailey, Christopher ORCID: 0000-0002-9438-3879 and Desmulliez, Marc P.Y. (2006) Assessment of microInductors for DC-DC converters. Proceedings of 2006 International Conference on Electronic Materials and Packaging (EMAP 2006). IEEE. ISBN 978-1-4244-0834-4
microsystems
Hughes, Michael, Strussevich, Nadia, Bailey, Christopher ORCID: 0000-0002-9438-3879 , McManus, Kevin, Kaufmann, Jens, Flynn, David and Desmulliez, Marc P.Y. (2009) Numerical algorithms for modelling electrodeposition: Tracking the deposition front under forced convection from megasonic agitation. International Journal for Numerical Methods in Fluids, 64 (3). pp. 237-268. ISSN 0271-2091 (Print), 1097-0363 (Online) (doi:https://doi.org/10.1002/fld.2140)
microvias
Kaufmann, Jens, Desmulliez, Marc P.Y., Price, Dennis, Hughes, Mike, Strusevitch, Nadia and Bailey, Chris ORCID: 0000-0002-9438-3879 (2008) Influence of megasonic agitation on the electrodeposition of high aspect ratio blind vias. 2nd Electronics System-Integration Technology Conference, 2008. ESTC 2008. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 1235-1240. ISBN 978-1-4244-2813-7 (doi:https://doi.org/10.1109/ESTC.2008.4684530)
microwave
Tilford, Tim ORCID: 0000-0001-8307-6403 , Sinclair, Keith I., Rajaguru, P.R., Morris, James E., Desmulliez, Marc P.Y. and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2009) Numerical optimisation of polymer curing using a dual-section microwave system. Annual microwave heating symposium (43rd). pp. 129-136. ISSN 1070-0129
Tilford, Tim, Sinclair, Keith I., Bailey, Christopher, Desmulliez, Marc P.Y., Parrott, Kevin and Sangster, Alan J. (2007) Coupled FDTD-FVM simulation of microwave heating of polymer materials for micro-systems packaging applications. Annual microwave heating symposium (41st). pp. 7-11. ISSN 1070-0129
Tilford, Tim, Sinclair, Keith I., Bailey, Christopher, Desmulliez, Marc P.Y., Parrott, Kevin and Sangster, Alan J. (2007) Multiphysics simulation of microwave curing of polymer materials in micro-electronics packaging applications. In: Silaghi, Alexandru Marius and Gordan, Ioan Mircea, (eds.) Proceedings book 11th International Conference on Microwave and High Frequency Heating, Oradea, Romania, September, 3-6 2007. University of Oradea, Romania, Oradea, Romania, pp. 189-192. ISBN 9789737593337
microwave curing
Ferenets, M., Tilford, Tim, Sinclair, Keith I., Bailey, Christopher and Desmulliez, Marc P.Y. (2009) Microwave curing of thermosetting polymer materials in microelectronics applications. In: Baltic Polymer Symposium 2009, 22-25 September 2009, Ventspils, Latvia.
Sinclair, Keith I., Sangster, Alan J., Goussetis, George, Desmulliez, Marc P.Y., Tilford, Tim, Parrott, Kevin and Bailey, Christopher (2007) Open ended microwave oven for flip-chip assembly. 2007 European Microwave Conference. Institute of Electrical and Electronics Engineers, Inc., New York, pp. 620-623. ISBN 9782874870019
microwave devices
Sinclair, Keith I., Goussetis, George, Desmulliez, Marc P.Y., Sangster, Alan J., Tilford, Tim, Bailey, Chris ORCID: 0000-0002-9438-3879 and Parrott, Kevin (2009) Polymer curing within an optimised open-ended microwave oven. In: European Microwave Week 2008, “Bridging Gaps”, Conference Proceedings,. Institute of Electrical and Electronics Engineers, Inc., Piscataway, N.J., USA, pp. 17-20. ISBN 978-2874870064 (doi:https://doi.org/10.1109/EUMC.2008.4751375)
microwave oven
Pavuluri, S.K., Goussetis, George, Desmulliez, Marc P.Y., Adamietz, R., Tilford, Tim ORCID: 0000-0001-8307-6403 , Ferenets, M., Muller, G., Eicher, F. and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2011) Open-ended single mode resonant applicator for microelectronics packaging applications. Proceedings of the Microwave Heating and Processing of Materials Seminar 2011. IET, pp. 89-91. ISBN 978 1 84919 310 8
microwave ovens
Sinclair, Keith I., Goussetis, George, Desmulliez, Marc P.Y., Sangster, Alan J., Tilford, Tim, Bailey, Chris ORCID: 0000-0002-9438-3879 and Parrott, Kevin (2009) Polymer curing within an optimised open-ended microwave oven. In: European Microwave Week 2008, “Bridging Gaps”, Conference Proceedings,. Institute of Electrical and Electronics Engineers, Inc., Piscataway, N.J., USA, pp. 17-20. ISBN 978-2874870064 (doi:https://doi.org/10.1109/EUMC.2008.4751375)
microwave radiation
Goussetis, George, Sinclair, Keith I., Sangster, Alan J., Desmulliez, Marc P.Y., Tilford, Tim, Parrott, Kevin and Bailey, Christopher (2007) Microwave curing for high density package. 2007 International Symposium on High Density Design Packaging and Microsystem Integration. Institute of Electrical and Electronics Engineers, Inc., New York, p. 1. ISBN 9781424412525 (doi:https://doi.org/10.1109/HDP.2007.4283552)
microwave system
Tilford, Tim ORCID: 0000-0001-8307-6403 , Sinclair, Keith I., Goussetis, George, Bailey, Christopher ORCID: 0000-0002-9438-3879 , Desmulliez, Marc P.Y., Parrott, Kevin and Sangster, Alan J. (2008) Comparison of encapsulant curing with convention and microwave systems. 33rd IEEE/CPMT International Electronic Manufacturing Technology Symposium (IEMT), 2008. IEEE, Piscataway, NJ, USA. ISBN 9781424433926 (print) 9781424433933 (electronic) (doi:https://doi.org/10.1109/IEMT.2008.5507869)
microwave systems
Sinclair, Keith I., Tilford, Tim ORCID: 0000-0001-8307-6403 , Goussetis, George, Bailey, Christopher ORCID: 0000-0002-9438-3879 , Desmulliez, Marc P.Y., Parrott, Kevin and Sangster, Alan J. (2008) Advanced microwave oven for rapid curing of encapsulant. 2nd Electronics System-Integration Technology Conference, 2008. ESTC 2008. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 551-556. ISBN 978-1-4244-2814-4 (print) 978-1-4244-2813-7 (online) (doi:https://doi.org/10.1109/ESTC.2008.4684409)
microwaves
Tilford, Tim ORCID: 0000-0001-8307-6403 , Sinclair, Keith I., Bailey, Christopher ORCID: 0000-0002-9438-3879 , Desmulliez, Marc P.Y., Goussetis, George, Parrott, Kevin and Sangster, Alan J. (2007) Multiphysics simulation of microwave curing in micro-electronics packaging applications. Soldering & Surface Mount Technology, 19 (3). pp. 26-33. ISSN 0954-0911 (doi:https://doi.org/10.1108/09540910710843757)
modelling
Xue, Xiangdong, Patel, Mayur, Kersaudy-Kerhoas, Maïwenn, Bailey, Christopher ORCID: 0000-0002-9438-3879 , Desmulliez, Marc P.Y. and Topham, David (2009) Effect of fluid dynamics and device mechanism on biofluid behaviour in microchannel systems: modelling biofluids in a microchannel biochip separator. International Conference on Electronic Packaging Technology & High Density Packaging, 2009. ICEPT-HDP '09. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 179-186. ISBN 978-1-4244-4659-9 (doi:https://doi.org/10.1109/ICEPT.2009.5270767)
modelling and simulation
Xue, Xiangdong, Patel, Mayur K., Kersaudy-Kerhoas, Maïwenn, Desmulliez, Marc P.Y., Bailey, Chris ORCID: 0000-0002-9438-3879 and Topham, David (2012) Analysis of fluid separation in microfluidic T-channels. Applied Mathematical Modelling, 36 (2). pp. 743-755. ISSN 0307-904X (doi:https://doi.org/10.1016/j.apm.2011.07.009)
Xue, Xiangdong, Patel, Mayur K., Bailey, Chris ORCID: 0000-0002-9438-3879 and Desmulliez, Marc P.Y. (2011) Geometrical optimisation of a biochip microchannel fluidic separator. Computer Methods in Biomechanics and Biomedical Engineering, 15 (9). pp. 981-991. ISSN 1025-5842 (Print), 1476-8259 (Online) (doi:https://doi.org/10.1080/10255842.2011.569501)
Xue, Xiangdong, Marson, Silvia, Patel, Mayur K., Bailey, Chris ORCID: 0000-0002-9438-3879 , O'Neill, William, Topham, David, Kay, Robert W. and Desmulliez, Marc P.Y. (2011) Progress towards the design and numerical analysis of a 3D microchannel biochip separator. International Journal for Numerical Methods in Biomedical Engineering, 27 (11). pp. 1771-1792. ISSN 2040-7939 (Print), 2040-7947 (Online) (doi:https://doi.org/10.1002/cnm.1439)
Xue, Xiangdong, Patel, Mayur, Kersaudy-Kerhoas, Maïwenn, Bailey, Christopher ORCID: 0000-0002-9438-3879 and Desmulliez, Marc P.Y. (2011) Modelling and simulation of the behaviour of a biofluid in a microchannel biochip separator. Computer Methods in Biomechanics and Biomedical Engineering, 14 (6). pp. 549-560. ISSN 1025-5842 (Print), 1476-8259 (Online) (doi:https://doi.org/10.1080/10255842.2010.485570)
modelling biofluids
Xue, Xiangdong, Patel, Mayur K., Bailey, Chris ORCID: 0000-0002-9438-3879 , Kersaudy-Kerhoas, Maïwenn and Desmulliez, Marc P.Y. (2008) Challenges in modelling biofluids in microchannels. In: 2nd Electronics System-Integration Technology Conference, 2008. ESTC 2008. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 287-292. ISBN 978-1-4244-2814-4 (Print) 978-1-4244-2813-7 (Online) (doi:https://doi.org/10.1109/ESTC.2008.4684363)
modelling methodology
Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Amalou, Farid, Sinclair, Keith I., Bailey, Christopher ORCID: 0000-0002-9438-3879 and Desmulliez, Marc P.Y. (2008) Modelling of nano-imprint forming process for the production of miniaturised 3D structures. International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems, 2008. EuroSimE 2008. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 497-504. ISBN 978-1-4244-2127-5 (doi:https://doi.org/10.1109/ESIME.2008.4525088)
multiphysics
Tilford, Tim ORCID: 0000-0001-8307-6403 , Sinclair, Keith I., Rajaguru, P.R., Morris, James E., Desmulliez, Marc P.Y. and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2009) Numerical optimisation of polymer curing using a dual-section microwave system. Annual microwave heating symposium (43rd). pp. 129-136. ISSN 1070-0129
Tilford, Tim, Sinclair, Keith I., Bailey, Christopher, Desmulliez, Marc P.Y., Parrott, Kevin and Sangster, Alan J. (2007) Multiphysics simulation of microwave curing of polymer materials in micro-electronics packaging applications. In: Silaghi, Alexandru Marius and Gordan, Ioan Mircea, (eds.) Proceedings book 11th International Conference on Microwave and High Frequency Heating, Oradea, Romania, September, 3-6 2007. University of Oradea, Romania, Oradea, Romania, pp. 189-192. ISBN 9789737593337
multiphysics modelling
Tilford, Tim ORCID: 0000-0001-8307-6403 , Pavuluri, S., Bailey, Christopher ORCID: 0000-0002-9438-3879 and Desmulliez, Marc P.Y. (2009) On variable frequency microwave processing of heterogeneous chip-on-board assemblies. International Conference on Electronic Packaging Technology & High Density Packaging, 2009. ICEPT-HDP '09. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 927-931. ISBN 978-1-4244-4659-9 (doi:https://doi.org/10.1109/ICEPT.2009.5270558)
Nano-Imprint Forming (NIF)
Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Amalou, Farid, Sinclair, Keith I., Bailey, Christopher ORCID: 0000-0002-9438-3879 and Desmulliez, Marc P.Y. (2008) Minimising the risk of defects in nano-imprint forming. 31st International Spring Seminar on Electronics Technology, 2008. ISSE '08. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 367-372. ISBN 978-1-4244-3972-0 (doi:https://doi.org/10.1109/ISSE.2008.5276670)
Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Amalou, Farid, Sinclair, Keith I., Bailey, Christopher ORCID: 0000-0002-9438-3879 and Desmulliez, Marc P.Y. (2008) Modelling of nano-imprint forming process for the production of miniaturised 3D structures. International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems, 2008. EuroSimE 2008. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 497-504. ISBN 978-1-4244-2127-5 (doi:https://doi.org/10.1109/ESIME.2008.4525088)
numerical modelling
Strusevich, Nadezhda, Desmulliez, Marc P.Y., Abraham, Eitan, Flynn, David, Jones, Thomas, Patel, Mayur and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2013) Electroplating for high aspect ratio vias in PCB manufacturing: enhancement capabilities of acoustic streaming. Advances in Manufacturing, 1 (3). pp. 211-217. ISSN 2095-3127 (Print), 2195-3597 (Online) (doi:https://doi.org/10.1007/s40436-013-0039-9)
one turn inductor
Lu, Hua ORCID: 0000-0002-4392-6562 , Flynn, David, Bailey, Christopher ORCID: 0000-0002-9438-3879 and Desmulliez, Marc P.Y. (2006) Computer modeling of a micro-manufactured one-turn inductor. Proceedings of the Sixth IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, 2006. IEEE. ISBN 1 4244 0489 4 (doi:https://doi.org/10.1109/HDP.2006.1707562)
open-ended applicator
Pavuluri, S.K., Goussetis, George, Desmulliez, Marc P.Y., Adamietz, R., Tilford, Tim ORCID: 0000-0001-8307-6403 , Ferenets, M., Muller, G., Eicher, F. and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2011) Open-ended single mode resonant applicator for microelectronics packaging applications. Proceedings of the Microwave Heating and Processing of Materials Seminar 2011. IET, pp. 89-91. ISBN 978 1 84919 310 8
open-ended microwave curing system
Tilford, Tim, Sinclair, Keith I., Goussetis, George, Bailey, Christopher, Desmulliez, Marc P.Y., Parrott, Kevin and Sangster, Alan J. (2007) Variable frequency microwave curing of polymer materials in microelectronics packaging applications. 2007 9th Electronics Packaging Technology Conference. Electronics Packaging Technology Conference Proceedings . Institute of Electrical and Electronics Engineers, Inc., New York, pp. 791-796. ISBN 9781424413232 (doi:https://doi.org/10.1109/EPTC.2007.446975)
open-ended microwave oven
Sinclair, Keith I., Sangster, Alan J., Goussetis, George, Desmulliez, Marc P.Y., Tilford, Tim, Parrott, Kevin and Bailey, Christopher (2007) Open ended microwave oven for flip-chip assembly. 2007 European Microwave Conference. Institute of Electrical and Electronics Engineers, Inc., New York, pp. 620-623. ISBN 9782874870019
open-oven
Goussetis, George, Sinclair, Keith I., Sangster, Alan J., Desmulliez, Marc P.Y., Tilford, Tim, Parrott, Kevin and Bailey, Christopher (2007) Microwave curing for high density package. 2007 International Symposium on High Density Design Packaging and Microsystem Integration. Institute of Electrical and Electronics Engineers, Inc., New York, p. 1. ISBN 9781424412525 (doi:https://doi.org/10.1109/HDP.2007.4283552)
optimisation
Tilford, Tim ORCID: 0000-0001-8307-6403 , Sinclair, Keith I., Rajaguru, P.R., Morris, James E., Desmulliez, Marc P.Y. and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2009) Numerical optimisation of polymer curing using a dual-section microwave system. Annual microwave heating symposium (43rd). pp. 129-136. ISSN 1070-0129
opto-electronic assembly
Goussetis, George, Sinclair, Keith I., Sangster, Alan J., Desmulliez, Marc P.Y., Tilford, Tim, Parrott, Kevin and Bailey, Christopher (2007) Microwave curing for high density package. 2007 International Symposium on High Density Design Packaging and Microsystem Integration. Institute of Electrical and Electronics Engineers, Inc., New York, p. 1. ISBN 9781424412525 (doi:https://doi.org/10.1109/HDP.2007.4283552)
organic light emitting diodes (OLED)
Kay, Robert W., Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Glinski, Greg P., Bailey, Christopher ORCID: 0000-0002-9438-3879 and Desmulliez, Marc P.Y. (2007) Ultra-fine pitch stencil printing for a low cost and low temperature flip-chip assembly process. IEEE Transactions on Components and Packaging Technologies, 30 (1). pp. 129-136. ISSN 1521-3331 (doi:https://doi.org/10.1109/TCAPT.2007.892085)
packaging
Sinclair, Keith I., Goussetis, George, Desmulliez, Marc P.Y., Sangster, Alan J., Tilford, Tim, Bailey, Chris ORCID: 0000-0002-9438-3879 and Parrott, Kevin (2009) Polymer curing within an optimised open-ended microwave oven. In: European Microwave Week 2008, “Bridging Gaps”, Conference Proceedings,. Institute of Electrical and Electronics Engineers, Inc., Piscataway, N.J., USA, pp. 17-20. ISBN 978-2874870064 (doi:https://doi.org/10.1109/EUMC.2008.4751375)
particle liquid separation
Xue, Xiangdong, Patel, Mayur K., Bailey, Chris ORCID: 0000-0002-9438-3879 , Kersaudy-Kerhoas, Maïwenn and Desmulliez, Marc P.Y. (2009) Parametrical modeling and design optimization of blood plasma separation device with microchannel mechanism. In: Electronic Components and Technology. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, 1970 -1976. ISBN 978-1-4244-4476-2 (doi:https://doi.org/10.1109/ECTC.2009.5074291)
plasma blood separation
Xue, Xiangdong, Marson, Silvia, Patel, Mayur K., Bailey, Chris ORCID: 0000-0002-9438-3879 , O'Neill, William, Topham, David, Kay, Robert W. and Desmulliez, Marc P.Y. (2011) Progress towards the design and numerical analysis of a 3D microchannel biochip separator. International Journal for Numerical Methods in Biomedical Engineering, 27 (11). pp. 1771-1792. ISSN 2040-7939 (Print), 2040-7947 (Online) (doi:https://doi.org/10.1002/cnm.1439)
plating rate
Kaufmann, Jens Georg, Desmulliez, Marc P.Y., Tian, Yingtao, Price, Dennis, Hughes, Mike, Strusevitch, Nadia, Bailey, Chris ORCID: 0000-0002-9438-3879 , Liu, Changqing and Hutt, David (2009) Megasonic agitation for enhanced electrodeposition of copper. Microsystem Technologies, 15 (8). pp. 1245-1254. ISSN 0946-7076 (Print), 1432-1858 (Online) (doi:https://doi.org/10.1007/s00542-009-0886-2)
polymer
Tilford, Tim ORCID: 0000-0001-8307-6403 , Sinclair, Keith I., Rajaguru, P.R., Morris, James E., Desmulliez, Marc P.Y. and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2009) Numerical optimisation of polymer curing using a dual-section microwave system. Annual microwave heating symposium (43rd). pp. 129-136. ISSN 1070-0129
polymer curing
Tilford, Tim, Sinclair, Keith I., Bailey, Christopher, Desmulliez, Marc P.Y., Parrott, Kevin and Sangster, Alan J. (2007) Coupled FDTD-FVM simulation of microwave heating of polymer materials for micro-systems packaging applications. Annual microwave heating symposium (41st). pp. 7-11. ISSN 1070-0129
polymer encapsulant
Tilford, Tim ORCID: 0000-0001-8307-6403 , Sinclair, Keith I., Goussetis, George, Bailey, Christopher ORCID: 0000-0002-9438-3879 , Desmulliez, Marc P.Y., Parrott, Kevin and Sangster, Alan J. (2008) Comparison of encapsulant curing with convention and microwave systems. 33rd IEEE/CPMT International Electronic Manufacturing Technology Symposium (IEMT), 2008. IEEE, Piscataway, NJ, USA. ISBN 9781424433926 (print) 9781424433933 (electronic) (doi:https://doi.org/10.1109/IEMT.2008.5507869)
polymer materials curing
Tilford, Tim, Sinclair, Keith I., Goussetis, George, Bailey, Christopher, Desmulliez, Marc P.Y., Parrott, Kevin and Sangster, Alan J. (2007) Variable frequency microwave curing of polymer materials in microelectronics packaging applications. 2007 9th Electronics Packaging Technology Conference. Electronics Packaging Technology Conference Proceedings . Institute of Electrical and Electronics Engineers, Inc., New York, pp. 791-796. ISBN 9781424413232 (doi:https://doi.org/10.1109/EPTC.2007.446975)
polymers
Sinclair, Keith I., Goussetis, George, Desmulliez, Marc P.Y., Sangster, Alan J., Tilford, Tim, Bailey, Chris ORCID: 0000-0002-9438-3879 and Parrott, Kevin (2009) Polymer curing within an optimised open-ended microwave oven. In: European Microwave Week 2008, “Bridging Gaps”, Conference Proceedings,. Institute of Electrical and Electronics Engineers, Inc., Piscataway, N.J., USA, pp. 17-20. ISBN 978-2874870064 (doi:https://doi.org/10.1109/EUMC.2008.4751375)
Tilford, Tim ORCID: 0000-0001-8307-6403 , Sinclair, Keith I., Bailey, Christopher ORCID: 0000-0002-9438-3879 , Desmulliez, Marc P.Y., Goussetis, George, Parrott, Kevin and Sangster, Alan J. (2007) Multiphysics simulation of microwave curing in micro-electronics packaging applications. Soldering & Surface Mount Technology, 19 (3). pp. 26-33. ISSN 0954-0911 (doi:https://doi.org/10.1108/09540910710843757)
potting cure
Goussetis, George, Sinclair, Keith I., Sangster, Alan J., Desmulliez, Marc P.Y., Tilford, Tim, Parrott, Kevin and Bailey, Christopher (2007) Microwave curing for high density package. 2007 International Symposium on High Density Design Packaging and Microsystem Integration. Institute of Electrical and Electronics Engineers, Inc., New York, p. 1. ISBN 9781424412525 (doi:https://doi.org/10.1109/HDP.2007.4283552)
power supply circuits
Lu, Hua ORCID: 0000-0002-4392-6562 , Flynn, David, Bailey, Christopher ORCID: 0000-0002-9438-3879 and Desmulliez, Marc P.Y. (2006) Computer modeling of a micro-manufactured one-turn inductor. Proceedings of the Sixth IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, 2006. IEEE. ISBN 1 4244 0489 4 (doi:https://doi.org/10.1109/HDP.2006.1707562)
Printed Circuit Board Fabrication
Jones, Thomas D.A., Flynn, David, Desmulliez, Marc P.Y., Price, Dennis, Beadel, Matthew, Strusevich, Nadia, Patel, Mayur, Bailey, Chris ORCID: 0000-0002-9438-3879 and Costello, Suzanne (2016) Morphology and acoustic artefacts of copper deposits electroplated using megasonic assisted agitation. Circuit World, 42 (3). pp. 127-140. ISSN 0305-6120 (doi:https://doi.org/10.1108/CW-03-2016-0006)
relative permittivity
Sinclair, Keith I., Sangster, Alan J., Goussetis, George, Desmulliez, Marc P.Y., Tilford, Tim, Parrott, Kevin and Bailey, Christopher (2007) Open ended microwave oven for flip-chip assembly. 2007 European Microwave Conference. Institute of Electrical and Electronics Engineers, Inc., New York, pp. 620-623. ISBN 9782874870019
RF-ID tag bonding
Goussetis, George, Sinclair, Keith I., Sangster, Alan J., Desmulliez, Marc P.Y., Tilford, Tim, Parrott, Kevin and Bailey, Christopher (2007) Microwave curing for high density package. 2007 International Symposium on High Density Design Packaging and Microsystem Integration. Institute of Electrical and Electronics Engineers, Inc., New York, p. 1. ISBN 9781424412525 (doi:https://doi.org/10.1109/HDP.2007.4283552)
simulation
Tilford, Tim ORCID: 0000-0001-8307-6403 , Sinclair, Keith I., Rajaguru, P.R., Morris, James E., Desmulliez, Marc P.Y. and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2009) Numerical optimisation of polymer curing using a dual-section microwave system. Annual microwave heating symposium (43rd). pp. 129-136. ISSN 1070-0129
Tilford, Tim ORCID: 0000-0001-8307-6403 , Sinclair, Keith I., Bailey, Christopher ORCID: 0000-0002-9438-3879 , Desmulliez, Marc P.Y., Goussetis, George, Parrott, Kevin and Sangster, Alan J. (2007) Multiphysics simulation of microwave curing in micro-electronics packaging applications. Soldering & Surface Mount Technology, 19 (3). pp. 26-33. ISSN 0954-0911 (doi:https://doi.org/10.1108/09540910710843757)
structural bonding
Goussetis, George, Sinclair, Keith I., Sangster, Alan J., Desmulliez, Marc P.Y., Tilford, Tim, Parrott, Kevin and Bailey, Christopher (2007) Microwave curing for high density package. 2007 International Symposium on High Density Design Packaging and Microsystem Integration. Institute of Electrical and Electronics Engineers, Inc., New York, p. 1. ISBN 9781424412525 (doi:https://doi.org/10.1109/HDP.2007.4283552)
T-microchannel device
Xue, Xiangdong, Patel, Mayur K., Bailey, Chris ORCID: 0000-0002-9438-3879 , Kersaudy-Kerhoas, Maïwenn and Desmulliez, Marc P.Y. (2009) Parametrical modeling and design optimization of blood plasma separation device with microchannel mechanism. In: Electronic Components and Technology. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, 1970 -1976. ISBN 978-1-4244-4476-2 (doi:https://doi.org/10.1109/ECTC.2009.5074291)
Xue, Xiangdong, Patel, Mayur K., Bailey, Chris ORCID: 0000-0002-9438-3879 , Kersaudy-Kerhoas, Maïwenn and Desmulliez, Marc P.Y. (2008) Challenges in modelling biofluids in microchannels. In: 2nd Electronics System-Integration Technology Conference, 2008. ESTC 2008. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 287-292. ISBN 978-1-4244-2814-4 (Print) 978-1-4244-2813-7 (Online) (doi:https://doi.org/10.1109/ESTC.2008.4684363)
thermal modeling
Flynn, David, Lu, Hua ORCID: 0000-0002-4392-6562 , Bailey, Chris ORCID: 0000-0002-9438-3879 and Desmulliez, Marc P.Y. (2008) Design, modeling and characterization of a microinductor for future DC-DC power converters. In: 2nd Electronics System-Integration Technology Conference, 2008. ESTC 2008. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 577-582. ISBN 978-1-4244-2814-4 (print), 978-1-4244-2813-7 (online) (doi:https://doi.org/10.1109/ESTC.2008.4684414)
thermal processing
Pavuluri, S.K., Goussetis, George, Desmulliez, Marc P.Y., Adamietz, R., Tilford, Tim ORCID: 0000-0001-8307-6403 , Ferenets, M., Muller, G., Eicher, F. and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2011) Open-ended single mode resonant applicator for microelectronics packaging applications. Proceedings of the Microwave Heating and Processing of Materials Seminar 2011. IET, pp. 89-91. ISBN 978 1 84919 310 8
thermosetting polymer materials
Ferenets, M., Tilford, Tim, Sinclair, Keith I., Bailey, Christopher and Desmulliez, Marc P.Y. (2009) Microwave curing of thermosetting polymer materials in microelectronics applications. In: Baltic Polymer Symposium 2009, 22-25 September 2009, Ventspils, Latvia.
Sinclair, Keith I., Tilford, Tim ORCID: 0000-0001-8307-6403 , Goussetis, George, Bailey, Christopher ORCID: 0000-0002-9438-3879 , Desmulliez, Marc P.Y., Parrott, Kevin and Sangster, Alan J. (2008) Advanced microwave oven for rapid curing of encapsulant. 2nd Electronics System-Integration Technology Conference, 2008. ESTC 2008. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 551-556. ISBN 978-1-4244-2814-4 (print) 978-1-4244-2813-7 (online) (doi:https://doi.org/10.1109/ESTC.2008.4684409)
uniformity
Kaufmann, Jens Georg, Desmulliez, Marc P.Y., Tian, Yingtao, Price, Dennis, Hughes, Mike, Strusevitch, Nadia, Bailey, Chris ORCID: 0000-0002-9438-3879 , Liu, Changqing and Hutt, David (2009) Megasonic agitation for enhanced electrodeposition of copper. Microsystem Technologies, 15 (8). pp. 1245-1254. ISSN 0946-7076 (Print), 1432-1858 (Online) (doi:https://doi.org/10.1007/s00542-009-0886-2)
variable frequency microwave (VFM)
Tilford, Tim ORCID: 0000-0001-8307-6403 , Pavuluri, S., Bailey, Christopher ORCID: 0000-0002-9438-3879 and Desmulliez, Marc P.Y. (2009) On variable frequency microwave processing of heterogeneous chip-on-board assemblies. International Conference on Electronic Packaging Technology & High Density Packaging, 2009. ICEPT-HDP '09. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 927-931. ISBN 978-1-4244-4659-9 (doi:https://doi.org/10.1109/ICEPT.2009.5270558)
Variable Frequency Microwave (VFM) heating
Tilford, Tim, Bailey, Christopher, Parrott, Kevin, Rizvi, M.J., Yin, Chunyan, Sinclair, Keith I. and Desmulliez, Marc P.Y. (2008) Impact of assembly process technologies on electronic packaging materials. International Conference on Electronic Packaging Technology & High Density Packaging, 2008. ICEPT-HDP 2008. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 1-6. ISBN 978-1-4244-2739-0 (online) 978-1-4244-2740-6 (print) (doi:https://doi.org/10.1109/ICEPT.2008.4607039)
variable frequency microwave technology
Tilford, Tim, Sinclair, Keith I., Bailey, Christopher, Pavuluri, S. and Desmulliez, Marc P.Y. (2009) On the application of variable frequency microwave technology for processing of individual surface mount components. In: 2009 International Conference on Electronics Packaging.
Tilford, Tim, Sinclair, Keith I., Goussetis, George, Bailey, Christopher, Desmulliez, Marc P.Y., Parrott, Kevin and Sangster, Alan J. (2007) Variable frequency microwave curing of polymer materials in microelectronics packaging applications. 2007 9th Electronics Packaging Technology Conference. Electronics Packaging Technology Conference Proceedings . Institute of Electrical and Electronics Engineers, Inc., New York, pp. 791-796. ISBN 9781424413232 (doi:https://doi.org/10.1109/EPTC.2007.446975)
wafer processing
Goussetis, George, Sinclair, Keith I., Sangster, Alan J., Desmulliez, Marc P.Y., Tilford, Tim, Parrott, Kevin and Bailey, Christopher (2007) Microwave curing for high density package. 2007 International Symposium on High Density Design Packaging and Microsystem Integration. Institute of Electrical and Electronics Engineers, Inc., New York, p. 1. ISBN 9781424412525 (doi:https://doi.org/10.1109/HDP.2007.4283552)
wafer scale level packaging
Sinclair, Keith I., Sangster, Alan J., Goussetis, George, Desmulliez, Marc P.Y., Tilford, Tim, Parrott, Kevin and Bailey, Christopher (2007) Open ended microwave oven for flip-chip assembly. 2007 European Microwave Conference. Institute of Electrical and Electronics Engineers, Inc., New York, pp. 620-623. ISBN 9782874870019
waveguide cavity resonator
Sinclair, Keith I., Sangster, Alan J., Goussetis, George, Desmulliez, Marc P.Y., Tilford, Tim, Parrott, Kevin and Bailey, Christopher (2007) Open ended microwave oven for flip-chip assembly. 2007 European Microwave Conference. Institute of Electrical and Electronics Engineers, Inc., New York, pp. 620-623. ISBN 9782874870019
waveguide components
Sinclair, Keith I., Goussetis, George, Desmulliez, Marc P.Y., Sangster, Alan J., Tilford, Tim, Bailey, Chris ORCID: 0000-0002-9438-3879 and Parrott, Kevin (2009) Polymer curing within an optimised open-ended microwave oven. In: European Microwave Week 2008, “Bridging Gaps”, Conference Proceedings,. Institute of Electrical and Electronics Engineers, Inc., Piscataway, N.J., USA, pp. 17-20. ISBN 978-2874870064 (doi:https://doi.org/10.1109/EUMC.2008.4751375)