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Number of items: 21.

Alam, M.O., Chan, Y.C. and Hung, K.C. (2002) Reliability study of the electroless Ni–P layer against solder alloy. Microelectronics Reliability, 42 (7). pp. 1065-1073. ISSN 0026-2714 (doi:10.1016/S0026-2714(02)00068-9)

Ekpu, Mathias, Bhatti, Raj, Okereke, Michael I., Mallik, Sabuj and Otiaba, Kenny (2014) Fatigue life of lead-free solder thermal interface materials at varying bond line thickness in microelectronics. Microelectronics Reliability, 54 (1). 239 - 244. ISSN 0026-2714 (doi:10.1016/j.microrel.2013.08.006)

Kamara, E., Lu, H., Bailey, C., Hunt, C., Di Maio, D. and Thomas, O. (2010) A multi-disciplinary study of vibration based reliability of lead-free electronic interconnects. Microelectronics Reliability, 50 (9-11). pp. 1706-1710. ISSN 0026-2714 (doi:10.1016/j.microrel.2010.07.152)

Lu, H., Hung, K.C., Stoyanov, S., Bailey, C. and Chan, Y.C. (2002) No-flow underfill flip chip assembly–an experimental and modeling analysis. Microelectronics Reliability, 42 (8). pp. 1205-1212. ISSN 0026-2714 (doi:10.1016/S0026-2714(02)00092-6)

Lu, Hua, Bailey, Chris and Yin, Chunyan (2009) Design for reliability of power electronics modules. Microelectronics Reliability, 49 (9-11). pp. 1250-1255. ISSN 0026-2714 (doi:10.1016/j.microrel.2009.07.055)

Otiaba, K.C., Ekere, N.N., Bhatti, R.S., Mallik, S., Alam, M.O. and Amalu, E.H. (2011) Thermal interface materials for automotive electronic control unit: Trends, technology and R&D challenges. Microelectronics Reliability, 51 (12). pp. 2031-2043. ISSN 0026-2714 (doi:10.1016/j.microrel.2011.05.001)

Otiaba, Kenny C., Bhatti, R.S., Ekere, N.N., Mallik, S., Alam, M.O., Amalu, E.H. and Ekpu, M. (2012) Numerical study on thermal impacts of different void patterns on performance of chip-scale packaged power device. Microelectronics Reliability, 52 (7). pp. 1409-1419. ISSN 0026-2714 (doi:10.1016/j.microrel.2012.01.015)

Rajaguru, P., Lu, H., Bailey, C., Castellazzi, A., Pathirana, V., Udugampola, N. and Udrea, F. (2018) Impact of underfill and other physical dimensions on Silicon Lateral IGBT package reliability using computer model with discrete and continuous design variables. Microelectronics Reliability, 83. pp. 146-156. ISSN 0026-2714 (doi:10.1016/j.microrel.2018.02.024)

Rajaguru, P., Lu, H., Bailey, C., Ortiz-Gonzalez, J. and Alatise, O. (2016) Evaluation of the impact of the physical dimensions and material of the semiconductor chip on the reliability of Sn3.5Ag solder interconnect in power electronic module: A finite element analysis perspective. Microelectronics Reliability, 68. pp. 77-85. ISSN 0026-2714 (doi:10.1016/j.microrel.2016.12.002)

Rajaguru, Pushparajah, Lu, Hua and Bailey, Chris (2015) Sintered silver finite element modelling and reliability based design optimisation in power electronic module. Microelectronics Reliability, 55 (6). pp. 919-930. ISSN 0026-2714 (doi:10.1016/j.microrel.2015.03.011)

Rajaguru, Pushparajah, Lu, Hua and Bailey, Christopher (2015) A time dependent damage indicator model for Sn3.5Ag solder layer in power electronic module. Microelectronics Reliability, 55 (11). pp. 2371-2381. ISSN 0026-2714 (doi:10.1016/j.microrel.2015.07.047)

Ridout, Stephen, Dusek, Milos, Bailey, Christopher and Hunt, Chris (2006) Assessing the performance of crack detection tests for solder joints. Microelectronics Reliability, 46 (12). pp. 2122-2130. ISSN 0026-2714 (doi:10.1016/j.microrel.2006.05.001)

Rizvi, M.J., Chan, Y.C., Bailey, Christopher and Lu, Hua (2005) Study of Anisotropic Conductive Adhesive Joint Behaviour under 3-Point Bending. Microelectronics Reliability, 4 (5). pp. 589-596. ISSN 0026-2714 (doi:10.1016/j.microrel.2004.10.015)

Stoyanov, S. and Bailey, C. (2015) Modelling the impact of refinishing processes on COTS components for use in aerospace applications. Microelectronics Reliability, 55 (9-10). pp. 1271-1279. ISSN 00262714 (doi:10.1016/j.microrel.2015.07.030)

Stoyanov, Stoyan, Bailey, Chris, Alam, M.O., Yin, Chunyan, Best, Chris, Tollafield, Peter, Crawford, Rob, Parker, Mike and Scott, Jim (2013) Modelling methodology for thermal analysis of hot solder dip process. Microelectronics Reliability, 53 (8). pp. 1055-1067. ISSN 0026-2714 (doi:10.1016/j.microrel.2013.02.018)

Stoyanov, Stoyan, Bailey, Chris and Tourloukis, Georgios (2016) Similarity approach for reducing qualification tests of electronic components. Microelectronics Reliability, 67. pp. 111-119. ISSN 0026-2714 (doi:10.1016/j.microrel.2016.10.017)

Stoyanov, Stoyan, Kay, Robert W., Bailey, Christopher and Desmulliez, Marc P.Y. (2007) Computational modelling for reliable flip-chip packaging at sub-100 micron pitch using isotropic conductive adhesives. Microelectronics Reliability, 47 (1). pp. 132-141. ISSN 0026-2714 (doi:10.1016/j.microrel.2006.01.004)

Tilford, Timothy, Stoyanov, Stoyan, Braun, Jessica, Janhsen, Jan Cristophe, Burgard, Matthias, Birch, Richard and Bailey, Christopher (2018) Design, manufacture and test for reliable 3D printed electronics packaging. Microelectronics Reliability, 85. pp. 109-117. ISSN 0026-2714 (doi:10.1016/j.microrel.2018.04.008)

Xue, Xiangdong, Bailey, Chris, Lu, Hua and Stoyanov, Stoyan (2011) Integration of analytical techniques in stochastic optimization of microsystem reliability. Microelectronics Reliability, 51 (5). pp. 936-945. ISSN 0026-2714 (doi:10.1016/j.microrel.2011.01.008)

Yin, C.Y., Alam, M.O., Chan, Y.C., Bailey, C. and Lu, Hua (2003) The effect of reflow process on the contact resistance and reliability of anisotropic conductive film interconnection for flip chip on flex applications. Microelectronics Reliability, 43 (4). pp. 625-633. ISSN 0026-2714 (doi:10.1016/S0026-2714(02)00348-7)

Yin, Chunyan, Best, Chris, Bailey, Chris and Stoyanov, Stoyan (2015) Statistical analysis of the impact of refinishing process on leaded components. Microelectronics Reliability, 55 (2). pp. 424-431. ISSN 0026-2714 (doi:10.1016/j.microrel.2014.11.001)

This list was generated on Mon Jun 18 02:44:56 2018 BST.