Browse by Journal Title
![]() | Up a level |
3D printing
Tilford, Tim
ORCID: 0000-0001-8307-6403
, Stoyanov, Stoyan
ORCID: 0000-0001-6091-1226
, Braun, Jessica, Janhsen, Jan Cristophe, Burgard, Matthias, Birch, Richard and Bailey, Chris
ORCID: 0000-0002-9438-3879
(2018)
Design, manufacture and test for reliable 3D printed electronics packaging.
Microelectronics Reliability, 85.
pp. 109-117.
ISSN 0026-2714
(doi:https://doi.org/10.1016/j.microrel.2018.04.008)
aging evaluation
Li, Ling-Ling, Liu, Zhi-Feng, Tseng, Ming-Lang, Zhou, Li
ORCID: 0000-0001-7132-5935
and Qi, Fu-Dong
(2019)
Prediction of IGBT power module remaining lifetime using the aging state approach.
Microelectronics Reliability, 102:113476.
ISSN 0026-2714
(doi:https://doi.org/10.1016/j.microrel.2019.113476)
analytical techniques
Xue, Xiangdong, Bailey, Chris
ORCID: 0000-0002-9438-3879
, Lu, Hua
ORCID: 0000-0002-4392-6562
and Stoyanov, Stoyan
ORCID: 0000-0001-6091-1226
(2011)
Integration of analytical techniques in stochastic optimization of microsystem reliability.
Microelectronics Reliability, 51 (5).
pp. 936-945.
ISSN 0026-2714
(doi:https://doi.org/10.1016/j.microrel.2011.01.008)
anisotropic conductive film (ACF)
Yin, C.Y.
ORCID: 0000-0003-0298-0420
, Alam, M.O., Chan, Y.C., Bailey, C.
ORCID: 0000-0002-9438-3879
and Lu, Hua
ORCID: 0000-0002-4392-6562
(2003)
The effect of reflow process on the contact resistance and reliability of anisotropic conductive film interconnection for flip chip on flex applications.
Microelectronics Reliability, 43 (4).
pp. 625-633.
ISSN 0026-2714
(doi:https://doi.org/10.1016/S0026-2714(02)00348-7)
automotive
Otiaba, K.C., Ekere, N.N., Bhatti, R.S., Mallik, S., Alam, M.O. and Amalu, E.H. (2011) Thermal interface materials for automotive electronic control unit: Trends, technology and R&D challenges. Microelectronics Reliability, 51 (12). pp. 2031-2043. ISSN 0026-2714 (doi:https://doi.org/10.1016/j.microrel.2011.05.001)
chip scale package (CSP) technology
Otiaba, Kenny C., Bhatti, R.S., Ekere, N.N., Mallik, S., Alam, M.O., Amalu, E.H. and Ekpu, M. (2012) Numerical study on thermal impacts of different void patterns on performance of chip-scale packaged power device. Microelectronics Reliability, 52 (7). pp. 1409-1419. ISSN 0026-2714 (doi:https://doi.org/10.1016/j.microrel.2012.01.015)
commercial off-the shelf components
Stoyanov, S.
ORCID: 0000-0001-6091-1226
and Bailey, C.
ORCID: 0000-0002-9438-3879
(2015)
Modelling the impact of refinishing processes on COTS components for use in aerospace applications.
Microelectronics Reliability, 55 (9-10).
pp. 1271-1279.
ISSN 0026-2714
(doi:https://doi.org/10.1016/j.microrel.2015.07.030)
computer modelling
Ridout, Stephen, Dusek, Milos, Bailey, Christopher
ORCID: 0000-0002-9438-3879
and Hunt, Chris
(2006)
Assessing the performance of crack detection tests for solder joints.
Microelectronics Reliability, 46 (12).
pp. 2122-2130.
ISSN 0026-2714
(doi:https://doi.org/10.1016/j.microrel.2006.05.001)
computer simulation
Lu, H.
ORCID: 0000-0002-4392-6562
, Hung, K.C., Stoyanov, S.
ORCID: 0000-0001-6091-1226
, Bailey, C.
ORCID: 0000-0002-9438-3879
and Chan, Y.C.
(2002)
No-flow underfill flip chip assembly–an experimental
and modeling analysis.
Microelectronics Reliability, 42 (8).
pp. 1205-1212.
ISSN 0026-2714
(doi:https://doi.org/10.1016/S0026-2714(02)00092-6)
contact resistance
Yin, C.Y.
ORCID: 0000-0003-0298-0420
, Alam, M.O., Chan, Y.C., Bailey, C.
ORCID: 0000-0002-9438-3879
and Lu, Hua
ORCID: 0000-0002-4392-6562
(2003)
The effect of reflow process on the contact resistance and reliability of anisotropic conductive film interconnection for flip chip on flex applications.
Microelectronics Reliability, 43 (4).
pp. 625-633.
ISSN 0026-2714
(doi:https://doi.org/10.1016/S0026-2714(02)00348-7)
curing
Lu, H.
ORCID: 0000-0002-4392-6562
, Hung, K.C., Stoyanov, S.
ORCID: 0000-0001-6091-1226
, Bailey, C.
ORCID: 0000-0002-9438-3879
and Chan, Y.C.
(2002)
No-flow underfill flip chip assembly–an experimental
and modeling analysis.
Microelectronics Reliability, 42 (8).
pp. 1205-1212.
ISSN 0026-2714
(doi:https://doi.org/10.1016/S0026-2714(02)00092-6)
Damage
Rajaguru, Pushparajah
ORCID: 0000-0002-6041-0517
, Lu, Hua
ORCID: 0000-0002-4392-6562
and Bailey, Christopher
ORCID: 0000-0002-9438-3879
(2015)
A time dependent damage indicator model for Sn3.5Ag solder layer in power electronic module.
Microelectronics Reliability, 55 (11).
pp. 2371-2381.
ISSN 0026-2714
(doi:https://doi.org/10.1016/j.microrel.2015.07.047)
defective metallisation
Otiaba, Kenny C., Bhatti, R.S., Ekere, N.N., Mallik, S., Alam, M.O., Amalu, E.H. and Ekpu, M. (2012) Numerical study on thermal impacts of different void patterns on performance of chip-scale packaged power device. Microelectronics Reliability, 52 (7). pp. 1409-1419. ISSN 0026-2714 (doi:https://doi.org/10.1016/j.microrel.2012.01.015)
delamination
Lu, H.
ORCID: 0000-0002-4392-6562
, Hung, K.C., Stoyanov, S.
ORCID: 0000-0001-6091-1226
, Bailey, C.
ORCID: 0000-0002-9438-3879
and Chan, Y.C.
(2002)
No-flow underfill flip chip assembly–an experimental
and modeling analysis.
Microelectronics Reliability, 42 (8).
pp. 1205-1212.
ISSN 0026-2714
(doi:https://doi.org/10.1016/S0026-2714(02)00092-6)
Design tools
Tilford, Tim
ORCID: 0000-0001-8307-6403
, Stoyanov, Stoyan
ORCID: 0000-0001-6091-1226
, Braun, Jessica, Janhsen, Jan Cristophe, Burgard, Matthias, Birch, Richard and Bailey, Chris
ORCID: 0000-0002-9438-3879
(2018)
Design, manufacture and test for reliable 3D printed electronics packaging.
Microelectronics Reliability, 85.
pp. 109-117.
ISSN 0026-2714
(doi:https://doi.org/10.1016/j.microrel.2018.04.008)
effect of reflow process
Yin, C.Y.
ORCID: 0000-0003-0298-0420
, Alam, M.O., Chan, Y.C., Bailey, C.
ORCID: 0000-0002-9438-3879
and Lu, Hua
ORCID: 0000-0002-4392-6562
(2003)
The effect of reflow process on the contact resistance and reliability of anisotropic conductive film interconnection for flip chip on flex applications.
Microelectronics Reliability, 43 (4).
pp. 625-633.
ISSN 0026-2714
(doi:https://doi.org/10.1016/S0026-2714(02)00348-7)
electroless Ni–P layer
Alam, M.O., Chan, Y.C. and Hung, K.C. (2002) Reliability study of the electroless Ni–P layer against solder alloy. Microelectronics Reliability, 42 (7). pp. 1065-1073. ISSN 0026-2714 (doi:https://doi.org/10.1016/S0026-2714(02)00068-9)
Electronic Packaging
Stoyanov, Stoyan
ORCID: 0000-0001-6091-1226
, Bailey, Chris
ORCID: 0000-0002-9438-3879
and Tourloukis, Georgios
(2016)
Similarity approach for reducing qualification tests of electronic components.
Microelectronics Reliability, 67.
pp. 111-119.
ISSN 0026-2714
(doi:https://doi.org/10.1016/j.microrel.2016.10.017)
electronic unit
Otiaba, K.C., Ekere, N.N., Bhatti, R.S., Mallik, S., Alam, M.O. and Amalu, E.H. (2011) Thermal interface materials for automotive electronic control unit: Trends, technology and R&D challenges. Microelectronics Reliability, 51 (12). pp. 2031-2043. ISSN 0026-2714 (doi:https://doi.org/10.1016/j.microrel.2011.05.001)
Electronics packaging
Tilford, Tim
ORCID: 0000-0001-8307-6403
, Stoyanov, Stoyan
ORCID: 0000-0001-6091-1226
, Braun, Jessica, Janhsen, Jan Cristophe, Burgard, Matthias, Birch, Richard and Bailey, Chris
ORCID: 0000-0002-9438-3879
(2018)
Design, manufacture and test for reliable 3D printed electronics packaging.
Microelectronics Reliability, 85.
pp. 109-117.
ISSN 0026-2714
(doi:https://doi.org/10.1016/j.microrel.2018.04.008)
external parameter
Li, Ling-Ling, Liu, Zhi-Feng, Tseng, Ming-Lang, Zhou, Li
ORCID: 0000-0001-7132-5935
and Qi, Fu-Dong
(2019)
Prediction of IGBT power module remaining lifetime using the aging state approach.
Microelectronics Reliability, 102:113476.
ISSN 0026-2714
(doi:https://doi.org/10.1016/j.microrel.2019.113476)
fatigue
Ekpu, Mathias, Bhatti, Raj, Okereke, Michael I.
ORCID: 0000-0002-2104-012X
, Mallik, Sabuj and Otiaba, Kenny
(2014)
Fatigue life of lead-free solder thermal interface materials at varying bond line thickness in microelectronics.
Microelectronics Reliability, 54 (1).
239 - 244.
ISSN 0026-2714
(doi:https://doi.org/10.1016/j.microrel.2013.08.006)
Rajaguru, Pushparajah
ORCID: 0000-0002-6041-0517
, Lu, Hua
ORCID: 0000-0002-4392-6562
and Bailey, Christopher
ORCID: 0000-0002-9438-3879
(2015)
A time dependent damage indicator model for Sn3.5Ag solder layer in power electronic module.
Microelectronics Reliability, 55 (11).
pp. 2371-2381.
ISSN 0026-2714
(doi:https://doi.org/10.1016/j.microrel.2015.07.047)
fatigue of materials
Lu, H.
ORCID: 0000-0002-4392-6562
, Hung, K.C., Stoyanov, S.
ORCID: 0000-0001-6091-1226
, Bailey, C.
ORCID: 0000-0002-9438-3879
and Chan, Y.C.
(2002)
No-flow underfill flip chip assembly–an experimental
and modeling analysis.
Microelectronics Reliability, 42 (8).
pp. 1205-1212.
ISSN 0026-2714
(doi:https://doi.org/10.1016/S0026-2714(02)00092-6)
Finite element analysis
Rajaguru, P.
ORCID: 0000-0002-6041-0517
, Lu, H.
ORCID: 0000-0002-4392-6562
, Bailey, C.
ORCID: 0000-0002-9438-3879
, Ortiz-Gonzalez, J. and Alatise, O.
(2016)
Evaluation of the impact of the physical dimensions and material of the semiconductor chip on the reliability of Sn3.5Ag solder interconnect in power electronic module: A finite element analysis perspective.
Microelectronics Reliability, 68.
pp. 77-85.
ISSN 0026-2714
(doi:https://doi.org/10.1016/j.microrel.2016.12.002)
finite element analysis (FEA)
Otiaba, Kenny C., Bhatti, R.S., Ekere, N.N., Mallik, S., Alam, M.O., Amalu, E.H. and Ekpu, M. (2012) Numerical study on thermal impacts of different void patterns on performance of chip-scale packaged power device. Microelectronics Reliability, 52 (7). pp. 1409-1419. ISSN 0026-2714 (doi:https://doi.org/10.1016/j.microrel.2012.01.015)
flip chip devices
Lu, H.
ORCID: 0000-0002-4392-6562
, Hung, K.C., Stoyanov, S.
ORCID: 0000-0001-6091-1226
, Bailey, C.
ORCID: 0000-0002-9438-3879
and Chan, Y.C.
(2002)
No-flow underfill flip chip assembly–an experimental
and modeling analysis.
Microelectronics Reliability, 42 (8).
pp. 1205-1212.
ISSN 0026-2714
(doi:https://doi.org/10.1016/S0026-2714(02)00092-6)
flip-chip packaging
Stoyanov, Stoyan
ORCID: 0000-0001-6091-1226
, Kay, Robert W., Bailey, Christopher
ORCID: 0000-0002-9438-3879
and Desmulliez, Marc P.Y.
(2007)
Computational modelling for reliable flip-chip packaging at sub-100 micron pitch using isotropic conductive adhesives.
Microelectronics Reliability, 47 (1).
pp. 132-141.
ISSN 0026-2714
(doi:https://doi.org/10.1016/j.microrel.2006.01.004)
hot solder dip
Yin, Chunyan
ORCID: 0000-0003-0298-0420
, Best, Chris, Bailey, Chris
ORCID: 0000-0002-9438-3879
and Stoyanov, Stoyan
ORCID: 0000-0001-6091-1226
(2015)
Statistical analysis of the impact of refinishing process on leaded components.
Microelectronics Reliability, 55 (2).
pp. 424-431.
ISSN 0026-2714
(doi:https://doi.org/10.1016/j.microrel.2014.11.001)
hot solder dip process
Stoyanov, Stoyan
ORCID: 0000-0001-6091-1226
, Bailey, Chris
ORCID: 0000-0002-9438-3879
, Alam, M.O., Yin, Chunyan
ORCID: 0000-0003-0298-0420
, Best, Chris, Tollafield, Peter, Crawford, Rob, Parker, Mike and Scott, Jim
(2013)
Modelling methodology for thermal analysis of hot solder dip process.
Microelectronics Reliability, 53 (8).
pp. 1055-1067.
ISSN 0026-2714
(doi:https://doi.org/10.1016/j.microrel.2013.02.018)
IGBT power modules
Li, Ling-Ling, Liu, Zhi-Feng, Tseng, Ming-Lang, Zhou, Li
ORCID: 0000-0001-7132-5935
and Qi, Fu-Dong
(2019)
Prediction of IGBT power module remaining lifetime using the aging state approach.
Microelectronics Reliability, 102:113476.
ISSN 0026-2714
(doi:https://doi.org/10.1016/j.microrel.2019.113476)
interface
Otiaba, K.C., Ekere, N.N., Bhatti, R.S., Mallik, S., Alam, M.O. and Amalu, E.H. (2011) Thermal interface materials for automotive electronic control unit: Trends, technology and R&D challenges. Microelectronics Reliability, 51 (12). pp. 2031-2043. ISSN 0026-2714 (doi:https://doi.org/10.1016/j.microrel.2011.05.001)
interfaces (materials)
Lu, H.
ORCID: 0000-0002-4392-6562
, Hung, K.C., Stoyanov, S.
ORCID: 0000-0001-6091-1226
, Bailey, C.
ORCID: 0000-0002-9438-3879
and Chan, Y.C.
(2002)
No-flow underfill flip chip assembly–an experimental
and modeling analysis.
Microelectronics Reliability, 42 (8).
pp. 1205-1212.
ISSN 0026-2714
(doi:https://doi.org/10.1016/S0026-2714(02)00092-6)
isotropic conductive adhesives (ICAs)
Stoyanov, Stoyan
ORCID: 0000-0001-6091-1226
, Kay, Robert W., Bailey, Christopher
ORCID: 0000-0002-9438-3879
and Desmulliez, Marc P.Y.
(2007)
Computational modelling for reliable flip-chip packaging at sub-100 micron pitch using isotropic conductive adhesives.
Microelectronics Reliability, 47 (1).
pp. 132-141.
ISSN 0026-2714
(doi:https://doi.org/10.1016/j.microrel.2006.01.004)
Kriging
Rajaguru, Pushparajah
ORCID: 0000-0002-6041-0517
, Lu, Hua
ORCID: 0000-0002-4392-6562
and Bailey, Chris
ORCID: 0000-0002-9438-3879
(2015)
Sintered silver finite element modelling and reliability based design optimisation in power electronic module.
Microelectronics Reliability, 55 (6).
pp. 919-930.
ISSN 0026-2714
(doi:https://doi.org/10.1016/j.microrel.2015.03.011)
Lateral IGBT
Rajaguru, P.
ORCID: 0000-0002-6041-0517
, Lu, H.
ORCID: 0000-0002-4392-6562
, Bailey, C.
ORCID: 0000-0002-9438-3879
, Castellazzi, A., Pathirana, V., Udugampola, N. and Udrea, F.
(2018)
Impact of underfill and other physical dimensions on Silicon Lateral IGBT
package reliability using computer model with discrete and continuous
design variables.
Microelectronics Reliability, 83.
pp. 146-156.
ISSN 0026-2714
(doi:https://doi.org/10.1016/j.microrel.2018.02.024)
lead-free
Ekpu, Mathias, Bhatti, Raj, Okereke, Michael I.
ORCID: 0000-0002-2104-012X
, Mallik, Sabuj and Otiaba, Kenny
(2014)
Fatigue life of lead-free solder thermal interface materials at varying bond line thickness in microelectronics.
Microelectronics Reliability, 54 (1).
239 - 244.
ISSN 0026-2714
(doi:https://doi.org/10.1016/j.microrel.2013.08.006)
Yin, Chunyan
ORCID: 0000-0003-0298-0420
, Best, Chris, Bailey, Chris
ORCID: 0000-0002-9438-3879
and Stoyanov, Stoyan
ORCID: 0000-0001-6091-1226
(2015)
Statistical analysis of the impact of refinishing process on leaded components.
Microelectronics Reliability, 55 (2).
pp. 424-431.
ISSN 0026-2714
(doi:https://doi.org/10.1016/j.microrel.2014.11.001)
lead-free solders
Kamara, E., Lu, H.
ORCID: 0000-0002-4392-6562
, Bailey, C.
ORCID: 0000-0002-9438-3879
, Hunt, C., Di Maio, D. and Thomas, O.
(2010)
A multi-disciplinary study of vibration based reliability of lead-free electronic interconnects.
Microelectronics Reliability, 50 (9-11).
pp. 1706-1710.
ISSN 0026-2714
(doi:https://doi.org/10.1016/j.microrel.2010.07.152)
leaded component
Yin, Chunyan
ORCID: 0000-0003-0298-0420
, Best, Chris, Bailey, Chris
ORCID: 0000-0002-9438-3879
and Stoyanov, Stoyan
ORCID: 0000-0001-6091-1226
(2015)
Statistical analysis of the impact of refinishing process on leaded components.
Microelectronics Reliability, 55 (2).
pp. 424-431.
ISSN 0026-2714
(doi:https://doi.org/10.1016/j.microrel.2014.11.001)
LED
Rajaguru, P.
ORCID: 0000-0002-6041-0517
, Lu, H.
ORCID: 0000-0002-4392-6562
, Bailey, C.
ORCID: 0000-0002-9438-3879
, Castellazzi, A., Pathirana, V., Udugampola, N. and Udrea, F.
(2018)
Impact of underfill and other physical dimensions on Silicon Lateral IGBT
package reliability using computer model with discrete and continuous
design variables.
Microelectronics Reliability, 83.
pp. 146-156.
ISSN 0026-2714
(doi:https://doi.org/10.1016/j.microrel.2018.02.024)
low temperature (T<100 C)
Stoyanov, Stoyan
ORCID: 0000-0001-6091-1226
, Kay, Robert W., Bailey, Christopher
ORCID: 0000-0002-9438-3879
and Desmulliez, Marc P.Y.
(2007)
Computational modelling for reliable flip-chip packaging at sub-100 micron pitch using isotropic conductive adhesives.
Microelectronics Reliability, 47 (1).
pp. 132-141.
ISSN 0026-2714
(doi:https://doi.org/10.1016/j.microrel.2006.01.004)
microelectronic processing
Lu, H.
ORCID: 0000-0002-4392-6562
, Hung, K.C., Stoyanov, S.
ORCID: 0000-0001-6091-1226
, Bailey, C.
ORCID: 0000-0002-9438-3879
and Chan, Y.C.
(2002)
No-flow underfill flip chip assembly–an experimental
and modeling analysis.
Microelectronics Reliability, 42 (8).
pp. 1205-1212.
ISSN 0026-2714
(doi:https://doi.org/10.1016/S0026-2714(02)00092-6)
microsystems
Xue, Xiangdong, Bailey, Chris
ORCID: 0000-0002-9438-3879
, Lu, Hua
ORCID: 0000-0002-4392-6562
and Stoyanov, Stoyan
ORCID: 0000-0001-6091-1226
(2011)
Integration of analytical techniques in stochastic optimization of microsystem reliability.
Microelectronics Reliability, 51 (5).
pp. 936-945.
ISSN 0026-2714
(doi:https://doi.org/10.1016/j.microrel.2011.01.008)
model order reduction
Rajaguru, Pushpa
ORCID: 0000-0002-6041-0517
, Lu, Hua
ORCID: 0000-0002-4392-6562
, Bailey, Chris
ORCID: 0000-0002-9438-3879
and Bella, Martina
(2020)
Modelling and analysis of vibration on power electronic module structure and application of model order reduction.
Microelectronics Reliability, 110:113697.
ISSN 0026-2714
(doi:https://doi.org/10.1016/j.microrel.2020.113697)
modelling
Stoyanov, S.
ORCID: 0000-0001-6091-1226
and Bailey, C.
ORCID: 0000-0002-9438-3879
(2015)
Modelling the impact of refinishing processes on COTS components for use in aerospace applications.
Microelectronics Reliability, 55 (9-10).
pp. 1271-1279.
ISSN 0026-2714
(doi:https://doi.org/10.1016/j.microrel.2015.07.030)
Stoyanov, Stoyan
ORCID: 0000-0001-6091-1226
, Bailey, Chris
ORCID: 0000-0002-9438-3879
and Tourloukis, Georgios
(2016)
Similarity approach for reducing qualification tests of electronic components.
Microelectronics Reliability, 67.
pp. 111-119.
ISSN 0026-2714
(doi:https://doi.org/10.1016/j.microrel.2016.10.017)
Tilford, Tim
ORCID: 0000-0001-8307-6403
, Stoyanov, Stoyan
ORCID: 0000-0001-6091-1226
, Braun, Jessica, Janhsen, Jan Cristophe, Burgard, Matthias, Birch, Richard and Bailey, Chris
ORCID: 0000-0002-9438-3879
(2018)
Design, manufacture and test for reliable 3D printed electronics packaging.
Microelectronics Reliability, 85.
pp. 109-117.
ISSN 0026-2714
(doi:https://doi.org/10.1016/j.microrel.2018.04.008)
modelling methodology
Stoyanov, Stoyan
ORCID: 0000-0001-6091-1226
, Bailey, Chris
ORCID: 0000-0002-9438-3879
, Alam, M.O., Yin, Chunyan
ORCID: 0000-0003-0298-0420
, Best, Chris, Tollafield, Peter, Crawford, Rob, Parker, Mike and Scott, Jim
(2013)
Modelling methodology for thermal analysis of hot solder dip process.
Microelectronics Reliability, 53 (8).
pp. 1055-1067.
ISSN 0026-2714
(doi:https://doi.org/10.1016/j.microrel.2013.02.018)
Multi-objective optimization
Nwanoro, Kenneth, Lu, Hua
ORCID: 0000-0002-4392-6562
, Yin, Chunyan
ORCID: 0000-0003-0298-0420
and Bailey, Chris
ORCID: 0000-0002-9438-3879
(2018)
An analysis of the reliability and design optimization of aluminium ribbon bonds in power electronics modules using computer simulation method.
Microelectronics Reliability, 87.
pp. 1-14.
ISSN 0026-2714
(doi:https://doi.org/10.1016/j.microrel.2018.05.013)
multiphysics
Xue, Xiangdong, Bailey, Chris
ORCID: 0000-0002-9438-3879
, Lu, Hua
ORCID: 0000-0002-4392-6562
and Stoyanov, Stoyan
ORCID: 0000-0001-6091-1226
(2011)
Integration of analytical techniques in stochastic optimization of microsystem reliability.
Microelectronics Reliability, 51 (5).
pp. 936-945.
ISSN 0026-2714
(doi:https://doi.org/10.1016/j.microrel.2011.01.008)
out-gassing phenomenon
Otiaba, Kenny C., Bhatti, R.S., Ekere, N.N., Mallik, S., Alam, M.O., Amalu, E.H. and Ekpu, M. (2012) Numerical study on thermal impacts of different void patterns on performance of chip-scale packaged power device. Microelectronics Reliability, 52 (7). pp. 1409-1419. ISSN 0026-2714 (doi:https://doi.org/10.1016/j.microrel.2012.01.015)
packaging
Lu, Hua
ORCID: 0000-0002-4392-6562
, Bailey, Chris
ORCID: 0000-0002-9438-3879
and Yin, Chunyan
ORCID: 0000-0003-0298-0420
(2009)
Design for reliability of power electronics modules.
Microelectronics Reliability, 49 (9-11).
pp. 1250-1255.
ISSN 0026-2714
(doi:https://doi.org/10.1016/j.microrel.2009.07.055)
Particle Swarm Optimisation
Rajaguru, Pushparajah
ORCID: 0000-0002-6041-0517
, Lu, Hua
ORCID: 0000-0002-4392-6562
and Bailey, Chris
ORCID: 0000-0002-9438-3879
(2015)
Sintered silver finite element modelling and reliability based design optimisation in power electronic module.
Microelectronics Reliability, 55 (6).
pp. 919-930.
ISSN 0026-2714
(doi:https://doi.org/10.1016/j.microrel.2015.03.011)
power cycles experiment
Li, Ling-Ling, Liu, Zhi-Feng, Tseng, Ming-Lang, Zhou, Li
ORCID: 0000-0001-7132-5935
and Qi, Fu-Dong
(2019)
Prediction of IGBT power module remaining lifetime using the aging state approach.
Microelectronics Reliability, 102:113476.
ISSN 0026-2714
(doi:https://doi.org/10.1016/j.microrel.2019.113476)
Power cycling
Nwanoro, Kenneth, Lu, Hua
ORCID: 0000-0002-4392-6562
, Yin, Chunyan
ORCID: 0000-0003-0298-0420
and Bailey, Chris
ORCID: 0000-0002-9438-3879
(2018)
An analysis of the reliability and design optimization of aluminium ribbon bonds in power electronics modules using computer simulation method.
Microelectronics Reliability, 87.
pp. 1-14.
ISSN 0026-2714
(doi:https://doi.org/10.1016/j.microrel.2018.05.013)
Power electronic module
Rajaguru, P.
ORCID: 0000-0002-6041-0517
, Lu, H.
ORCID: 0000-0002-4392-6562
, Bailey, C.
ORCID: 0000-0002-9438-3879
, Ortiz-Gonzalez, J. and Alatise, O.
(2016)
Evaluation of the impact of the physical dimensions and material of the semiconductor chip on the reliability of Sn3.5Ag solder interconnect in power electronic module: A finite element analysis perspective.
Microelectronics Reliability, 68.
pp. 77-85.
ISSN 0026-2714
(doi:https://doi.org/10.1016/j.microrel.2016.12.002)
Rajaguru, Pushparajah
ORCID: 0000-0002-6041-0517
, Lu, Hua
ORCID: 0000-0002-4392-6562
and Bailey, Chris
ORCID: 0000-0002-9438-3879
(2015)
Sintered silver finite element modelling and reliability based design optimisation in power electronic module.
Microelectronics Reliability, 55 (6).
pp. 919-930.
ISSN 0026-2714
(doi:https://doi.org/10.1016/j.microrel.2015.03.011)
Rajaguru, Pushparajah
ORCID: 0000-0002-6041-0517
, Lu, Hua
ORCID: 0000-0002-4392-6562
and Bailey, Christopher
ORCID: 0000-0002-9438-3879
(2015)
A time dependent damage indicator model for Sn3.5Ag solder layer in power electronic module.
Microelectronics Reliability, 55 (11).
pp. 2371-2381.
ISSN 0026-2714
(doi:https://doi.org/10.1016/j.microrel.2015.07.047)
power electronics
Lu, Hua
ORCID: 0000-0002-4392-6562
, Bailey, Chris
ORCID: 0000-0002-9438-3879
and Yin, Chunyan
ORCID: 0000-0003-0298-0420
(2009)
Design for reliability of power electronics modules.
Microelectronics Reliability, 49 (9-11).
pp. 1250-1255.
ISSN 0026-2714
(doi:https://doi.org/10.1016/j.microrel.2009.07.055)
Nwanoro, Kenneth, Lu, Hua
ORCID: 0000-0002-4392-6562
, Yin, Chunyan
ORCID: 0000-0003-0298-0420
and Bailey, Chris
ORCID: 0000-0002-9438-3879
(2018)
An analysis of the reliability and design optimization of aluminium ribbon bonds in power electronics modules using computer simulation method.
Microelectronics Reliability, 87.
pp. 1-14.
ISSN 0026-2714
(doi:https://doi.org/10.1016/j.microrel.2018.05.013)
prognostic methods
Lu, Hua
ORCID: 0000-0002-4392-6562
, Bailey, Chris
ORCID: 0000-0002-9438-3879
and Yin, Chunyan
ORCID: 0000-0003-0298-0420
(2009)
Design for reliability of power electronics modules.
Microelectronics Reliability, 49 (9-11).
pp. 1250-1255.
ISSN 0026-2714
(doi:https://doi.org/10.1016/j.microrel.2009.07.055)
radial basis
Rajaguru, Pushparajah
ORCID: 0000-0002-6041-0517
, Lu, Hua
ORCID: 0000-0002-4392-6562
and Bailey, Chris
ORCID: 0000-0002-9438-3879
(2015)
Sintered silver finite element modelling and reliability based design optimisation in power electronic module.
Microelectronics Reliability, 55 (6).
pp. 919-930.
ISSN 0026-2714
(doi:https://doi.org/10.1016/j.microrel.2015.03.011)
reduced order models
Rajaguru, Pushparajah
ORCID: 0000-0002-6041-0517
, Lu, Hua
ORCID: 0000-0002-4392-6562
and Bailey, Chris
ORCID: 0000-0002-9438-3879
(2015)
Sintered silver finite element modelling and reliability based design optimisation in power electronic module.
Microelectronics Reliability, 55 (6).
pp. 919-930.
ISSN 0026-2714
(doi:https://doi.org/10.1016/j.microrel.2015.03.011)
refinishing
Stoyanov, S.
ORCID: 0000-0001-6091-1226
and Bailey, C.
ORCID: 0000-0002-9438-3879
(2015)
Modelling the impact of refinishing processes on COTS components for use in aerospace applications.
Microelectronics Reliability, 55 (9-10).
pp. 1271-1279.
ISSN 0026-2714
(doi:https://doi.org/10.1016/j.microrel.2015.07.030)
Yin, Chunyan
ORCID: 0000-0003-0298-0420
, Best, Chris, Bailey, Chris
ORCID: 0000-0002-9438-3879
and Stoyanov, Stoyan
ORCID: 0000-0001-6091-1226
(2015)
Statistical analysis of the impact of refinishing process on leaded components.
Microelectronics Reliability, 55 (2).
pp. 424-431.
ISSN 0026-2714
(doi:https://doi.org/10.1016/j.microrel.2014.11.001)
reliability
Kamara, E., Lu, H.
ORCID: 0000-0002-4392-6562
, Bailey, C.
ORCID: 0000-0002-9438-3879
, Hunt, C., Di Maio, D. and Thomas, O.
(2010)
A multi-disciplinary study of vibration based reliability of lead-free electronic interconnects.
Microelectronics Reliability, 50 (9-11).
pp. 1706-1710.
ISSN 0026-2714
(doi:https://doi.org/10.1016/j.microrel.2010.07.152)
Lu, Hua
ORCID: 0000-0002-4392-6562
, Bailey, Chris
ORCID: 0000-0002-9438-3879
and Yin, Chunyan
ORCID: 0000-0003-0298-0420
(2009)
Design for reliability of power electronics modules.
Microelectronics Reliability, 49 (9-11).
pp. 1250-1255.
ISSN 0026-2714
(doi:https://doi.org/10.1016/j.microrel.2009.07.055)
Nwanoro, Kenneth, Lu, Hua
ORCID: 0000-0002-4392-6562
, Yin, Chunyan
ORCID: 0000-0003-0298-0420
and Bailey, Chris
ORCID: 0000-0002-9438-3879
(2018)
An analysis of the reliability and design optimization of aluminium ribbon bonds in power electronics modules using computer simulation method.
Microelectronics Reliability, 87.
pp. 1-14.
ISSN 0026-2714
(doi:https://doi.org/10.1016/j.microrel.2018.05.013)
Stoyanov, S.
ORCID: 0000-0001-6091-1226
and Bailey, C.
ORCID: 0000-0002-9438-3879
(2015)
Modelling the impact of refinishing processes on COTS components for use in aerospace applications.
Microelectronics Reliability, 55 (9-10).
pp. 1271-1279.
ISSN 0026-2714
(doi:https://doi.org/10.1016/j.microrel.2015.07.030)
Stoyanov, Stoyan
ORCID: 0000-0001-6091-1226
, Bailey, Chris
ORCID: 0000-0002-9438-3879
and Tourloukis, Georgios
(2016)
Similarity approach for reducing qualification tests of electronic components.
Microelectronics Reliability, 67.
pp. 111-119.
ISSN 0026-2714
(doi:https://doi.org/10.1016/j.microrel.2016.10.017)
Tilford, Tim
ORCID: 0000-0001-8307-6403
, Stoyanov, Stoyan
ORCID: 0000-0001-6091-1226
, Braun, Jessica, Janhsen, Jan Cristophe, Burgard, Matthias, Birch, Richard and Bailey, Chris
ORCID: 0000-0002-9438-3879
(2018)
Design, manufacture and test for reliable 3D printed electronics packaging.
Microelectronics Reliability, 85.
pp. 109-117.
ISSN 0026-2714
(doi:https://doi.org/10.1016/j.microrel.2018.04.008)
reliability study
Alam, M.O., Chan, Y.C. and Hung, K.C. (2002) Reliability study of the electroless Ni–P layer against solder alloy. Microelectronics Reliability, 42 (7). pp. 1065-1073. ISSN 0026-2714 (doi:https://doi.org/10.1016/S0026-2714(02)00068-9)
remaining lifetime
Li, Ling-Ling, Liu, Zhi-Feng, Tseng, Ming-Lang, Zhou, Li
ORCID: 0000-0001-7132-5935
and Qi, Fu-Dong
(2019)
Prediction of IGBT power module remaining lifetime using the aging state approach.
Microelectronics Reliability, 102:113476.
ISSN 0026-2714
(doi:https://doi.org/10.1016/j.microrel.2019.113476)
risk analysis
Rajaguru, Pushparajah
ORCID: 0000-0002-6041-0517
, Lu, Hua
ORCID: 0000-0002-4392-6562
and Bailey, Chris
ORCID: 0000-0002-9438-3879
(2015)
Sintered silver finite element modelling and reliability based design optimisation in power electronic module.
Microelectronics Reliability, 55 (6).
pp. 919-930.
ISSN 0026-2714
(doi:https://doi.org/10.1016/j.microrel.2015.03.011)
scanning acoustic microscopes
Lu, H.
ORCID: 0000-0002-4392-6562
, Hung, K.C., Stoyanov, S.
ORCID: 0000-0001-6091-1226
, Bailey, C.
ORCID: 0000-0002-9438-3879
and Chan, Y.C.
(2002)
No-flow underfill flip chip assembly–an experimental
and modeling analysis.
Microelectronics Reliability, 42 (8).
pp. 1205-1212.
ISSN 0026-2714
(doi:https://doi.org/10.1016/S0026-2714(02)00092-6)
Sensitivity analysis
Rajaguru, P.
ORCID: 0000-0002-6041-0517
, Lu, H.
ORCID: 0000-0002-4392-6562
, Bailey, C.
ORCID: 0000-0002-9438-3879
, Ortiz-Gonzalez, J. and Alatise, O.
(2016)
Evaluation of the impact of the physical dimensions and material of the semiconductor chip on the reliability of Sn3.5Ag solder interconnect in power electronic module: A finite element analysis perspective.
Microelectronics Reliability, 68.
pp. 77-85.
ISSN 0026-2714
(doi:https://doi.org/10.1016/j.microrel.2016.12.002)
solder alloy
Alam, M.O., Chan, Y.C. and Hung, K.C. (2002) Reliability study of the electroless Ni–P layer against solder alloy. Microelectronics Reliability, 42 (7). pp. 1065-1073. ISSN 0026-2714 (doi:https://doi.org/10.1016/S0026-2714(02)00068-9)
Solder joint
Rajaguru, Pushparajah
ORCID: 0000-0002-6041-0517
, Lu, Hua
ORCID: 0000-0002-4392-6562
and Bailey, Christopher
ORCID: 0000-0002-9438-3879
(2015)
A time dependent damage indicator model for Sn3.5Ag solder layer in power electronic module.
Microelectronics Reliability, 55 (11).
pp. 2371-2381.
ISSN 0026-2714
(doi:https://doi.org/10.1016/j.microrel.2015.07.047)
solder joints
Ridout, Stephen, Dusek, Milos, Bailey, Christopher
ORCID: 0000-0002-9438-3879
and Hunt, Chris
(2006)
Assessing the performance of crack detection tests for solder joints.
Microelectronics Reliability, 46 (12).
pp. 2122-2130.
ISSN 0026-2714
(doi:https://doi.org/10.1016/j.microrel.2006.05.001)
solder thermal interface materials (STIMs)
Otiaba, Kenny C., Bhatti, R.S., Ekere, N.N., Mallik, S., Alam, M.O., Amalu, E.H. and Ekpu, M. (2012) Numerical study on thermal impacts of different void patterns on performance of chip-scale packaged power device. Microelectronics Reliability, 52 (7). pp. 1409-1419. ISSN 0026-2714 (doi:https://doi.org/10.1016/j.microrel.2012.01.015)
soldered joints
Lu, H.
ORCID: 0000-0002-4392-6562
, Hung, K.C., Stoyanov, S.
ORCID: 0000-0001-6091-1226
, Bailey, C.
ORCID: 0000-0002-9438-3879
and Chan, Y.C.
(2002)
No-flow underfill flip chip assembly–an experimental
and modeling analysis.
Microelectronics Reliability, 42 (8).
pp. 1205-1212.
ISSN 0026-2714
(doi:https://doi.org/10.1016/S0026-2714(02)00092-6)
solders
Ekpu, Mathias, Bhatti, Raj, Okereke, Michael I.
ORCID: 0000-0002-2104-012X
, Mallik, Sabuj and Otiaba, Kenny
(2014)
Fatigue life of lead-free solder thermal interface materials at varying bond line thickness in microelectronics.
Microelectronics Reliability, 54 (1).
239 - 244.
ISSN 0026-2714
(doi:https://doi.org/10.1016/j.microrel.2013.08.006)
statistical hypothesis testing
Yin, Chunyan
ORCID: 0000-0003-0298-0420
, Best, Chris, Bailey, Chris
ORCID: 0000-0002-9438-3879
and Stoyanov, Stoyan
ORCID: 0000-0001-6091-1226
(2015)
Statistical analysis of the impact of refinishing process on leaded components.
Microelectronics Reliability, 55 (2).
pp. 424-431.
ISSN 0026-2714
(doi:https://doi.org/10.1016/j.microrel.2014.11.001)
Surrogate models
Rajaguru, P.
ORCID: 0000-0002-6041-0517
, Lu, H.
ORCID: 0000-0002-4392-6562
, Bailey, C.
ORCID: 0000-0002-9438-3879
, Ortiz-Gonzalez, J. and Alatise, O.
(2016)
Evaluation of the impact of the physical dimensions and material of the semiconductor chip on the reliability of Sn3.5Ag solder interconnect in power electronic module: A finite element analysis perspective.
Microelectronics Reliability, 68.
pp. 77-85.
ISSN 0026-2714
(doi:https://doi.org/10.1016/j.microrel.2016.12.002)
thermal
Otiaba, K.C., Ekere, N.N., Bhatti, R.S., Mallik, S., Alam, M.O. and Amalu, E.H. (2011) Thermal interface materials for automotive electronic control unit: Trends, technology and R&D challenges. Microelectronics Reliability, 51 (12). pp. 2031-2043. ISSN 0026-2714 (doi:https://doi.org/10.1016/j.microrel.2011.05.001)
thermal analysis
Stoyanov, Stoyan
ORCID: 0000-0001-6091-1226
, Bailey, Chris
ORCID: 0000-0002-9438-3879
, Alam, M.O., Yin, Chunyan
ORCID: 0000-0003-0298-0420
, Best, Chris, Tollafield, Peter, Crawford, Rob, Parker, Mike and Scott, Jim
(2013)
Modelling methodology for thermal analysis of hot solder dip process.
Microelectronics Reliability, 53 (8).
pp. 1055-1067.
ISSN 0026-2714
(doi:https://doi.org/10.1016/j.microrel.2013.02.018)
Thermal cycling
Nwanoro, Kenneth, Lu, Hua
ORCID: 0000-0002-4392-6562
, Yin, Chunyan
ORCID: 0000-0003-0298-0420
and Bailey, Chris
ORCID: 0000-0002-9438-3879
(2018)
An analysis of the reliability and design optimization of aluminium ribbon bonds in power electronics modules using computer simulation method.
Microelectronics Reliability, 87.
pp. 1-14.
ISSN 0026-2714
(doi:https://doi.org/10.1016/j.microrel.2018.05.013)
thermal interface materials
Ekpu, Mathias, Bhatti, Raj, Okereke, Michael I.
ORCID: 0000-0002-2104-012X
, Mallik, Sabuj and Otiaba, Kenny
(2014)
Fatigue life of lead-free solder thermal interface materials at varying bond line thickness in microelectronics.
Microelectronics Reliability, 54 (1).
239 - 244.
ISSN 0026-2714
(doi:https://doi.org/10.1016/j.microrel.2013.08.006)
tin whiskers
Stoyanov, Stoyan
ORCID: 0000-0001-6091-1226
, Bailey, Chris
ORCID: 0000-0002-9438-3879
, Alam, M.O., Yin, Chunyan
ORCID: 0000-0003-0298-0420
, Best, Chris, Tollafield, Peter, Crawford, Rob, Parker, Mike and Scott, Jim
(2013)
Modelling methodology for thermal analysis of hot solder dip process.
Microelectronics Reliability, 53 (8).
pp. 1055-1067.
ISSN 0026-2714
(doi:https://doi.org/10.1016/j.microrel.2013.02.018)
Underfill
Rajaguru, P.
ORCID: 0000-0002-6041-0517
, Lu, H.
ORCID: 0000-0002-4392-6562
, Bailey, C.
ORCID: 0000-0002-9438-3879
, Castellazzi, A., Pathirana, V., Udugampola, N. and Udrea, F.
(2018)
Impact of underfill and other physical dimensions on Silicon Lateral IGBT
package reliability using computer model with discrete and continuous
design variables.
Microelectronics Reliability, 83.
pp. 146-156.
ISSN 0026-2714
(doi:https://doi.org/10.1016/j.microrel.2018.02.024)
vibration
Kamara, E., Lu, H.
ORCID: 0000-0002-4392-6562
, Bailey, C.
ORCID: 0000-0002-9438-3879
, Hunt, C., Di Maio, D. and Thomas, O.
(2010)
A multi-disciplinary study of vibration based reliability of lead-free electronic interconnects.
Microelectronics Reliability, 50 (9-11).
pp. 1706-1710.
ISSN 0026-2714
(doi:https://doi.org/10.1016/j.microrel.2010.07.152)
Rajaguru, Pushpa
ORCID: 0000-0002-6041-0517
, Lu, Hua
ORCID: 0000-0002-4392-6562
, Bailey, Chris
ORCID: 0000-0002-9438-3879
and Bella, Martina
(2020)
Modelling and analysis of vibration on power electronic module structure and application of model order reduction.
Microelectronics Reliability, 110:113697.
ISSN 0026-2714
(doi:https://doi.org/10.1016/j.microrel.2020.113697)
Wire/ribbon bond
Nwanoro, Kenneth, Lu, Hua
ORCID: 0000-0002-4392-6562
, Yin, Chunyan
ORCID: 0000-0003-0298-0420
and Bailey, Chris
ORCID: 0000-0002-9438-3879
(2018)
An analysis of the reliability and design optimization of aluminium ribbon bonds in power electronics modules using computer simulation method.
Microelectronics Reliability, 87.
pp. 1-14.
ISSN 0026-2714
(doi:https://doi.org/10.1016/j.microrel.2018.05.013)
X ray microscopes
Lu, H.
ORCID: 0000-0002-4392-6562
, Hung, K.C., Stoyanov, S.
ORCID: 0000-0001-6091-1226
, Bailey, C.
ORCID: 0000-0002-9438-3879
and Chan, Y.C.
(2002)
No-flow underfill flip chip assembly–an experimental
and modeling analysis.
Microelectronics Reliability, 42 (8).
pp. 1205-1212.
ISSN 0026-2714
(doi:https://doi.org/10.1016/S0026-2714(02)00092-6)