Skip navigation

Browse by Journal Title

Browse by Journal Title

Up a level
Export as [feed] RSS
Group by: Creators | Item Type | Uncontrolled Keywords | No Grouping
3D printing aging evaluation analytical techniques anisotropic conductive film (ACF) automotive chip scale package (CSP) technology commercial off-the shelf components computer modelling computer simulation contact resistance curing Damage defective metallisation delamination Design tools effect of reflow process electroless Ni–P layer Electronic Packaging electronic unit Electronics packaging external parameter fatigue fatigue of materials Finite element analysis finite element analysis (FEA) flip chip devices flip-chip packaging hot solder dip hot solder dip process IGBT power modules interface interfaces (materials) isotropic conductive adhesives (ICAs) Kriging Lateral IGBT lead-free lead-free solders leaded component LED low temperature (T<100 C) microelectronic processing microsystems model order reduction modelling modelling methodology Multi-objective optimization multiphysics out-gassing phenomenon packaging Particle Swarm Optimisation power cycles experiment Power cycling Power electronic module power electronics prognostic methods radial basis reduced order models refinishing reliability reliability study remaining lifetime risk analysis scanning acoustic microscopes Sensitivity analysis solder alloy Solder joint solder joints solder thermal interface materials (STIMs) soldered joints solders statistical hypothesis testing Surrogate models thermal thermal analysis Thermal cycling thermal interface materials tin whiskers Underfill vibration Wire/ribbon bond X ray microscopes
Number of items: 95.

3D printing

Tilford, Tim ORCID: 0000-0001-8307-6403, Stoyanov, Stoyan ORCID: 0000-0001-6091-1226, Braun, Jessica, Janhsen, Jan Cristophe, Burgard, Matthias, Birch, Richard and Bailey, Chris ORCID: 0000-0002-9438-3879 (2018) Design, manufacture and test for reliable 3D printed electronics packaging. Microelectronics Reliability, 85. pp. 109-117. ISSN 0026-2714 (doi:https://doi.org/10.1016/j.microrel.2018.04.008)

aging evaluation

Li, Ling-Ling, Liu, Zhi-Feng, Tseng, Ming-Lang, Zhou, Li ORCID: 0000-0001-7132-5935 and Qi, Fu-Dong (2019) Prediction of IGBT power module remaining lifetime using the aging state approach. Microelectronics Reliability, 102:113476. ISSN 0026-2714 (doi:https://doi.org/10.1016/j.microrel.2019.113476)

analytical techniques

Xue, Xiangdong, Bailey, Chris ORCID: 0000-0002-9438-3879, Lu, Hua ORCID: 0000-0002-4392-6562 and Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 (2011) Integration of analytical techniques in stochastic optimization of microsystem reliability. Microelectronics Reliability, 51 (5). pp. 936-945. ISSN 0026-2714 (doi:https://doi.org/10.1016/j.microrel.2011.01.008)

anisotropic conductive film (ACF)

Yin, C.Y. ORCID: 0000-0003-0298-0420, Alam, M.O., Chan, Y.C., Bailey, C. ORCID: 0000-0002-9438-3879 and Lu, Hua ORCID: 0000-0002-4392-6562 (2003) The effect of reflow process on the contact resistance and reliability of anisotropic conductive film interconnection for flip chip on flex applications. Microelectronics Reliability, 43 (4). pp. 625-633. ISSN 0026-2714 (doi:https://doi.org/10.1016/S0026-2714(02)00348-7)

automotive

Otiaba, K.C., Ekere, N.N., Bhatti, R.S., Mallik, S., Alam, M.O. and Amalu, E.H. (2011) Thermal interface materials for automotive electronic control unit: Trends, technology and R&D challenges. Microelectronics Reliability, 51 (12). pp. 2031-2043. ISSN 0026-2714 (doi:https://doi.org/10.1016/j.microrel.2011.05.001)

chip scale package (CSP) technology

Otiaba, Kenny C., Bhatti, R.S., Ekere, N.N., Mallik, S., Alam, M.O., Amalu, E.H. and Ekpu, M. (2012) Numerical study on thermal impacts of different void patterns on performance of chip-scale packaged power device. Microelectronics Reliability, 52 (7). pp. 1409-1419. ISSN 0026-2714 (doi:https://doi.org/10.1016/j.microrel.2012.01.015)

commercial off-the shelf components

Stoyanov, S. ORCID: 0000-0001-6091-1226 and Bailey, C. ORCID: 0000-0002-9438-3879 (2015) Modelling the impact of refinishing processes on COTS components for use in aerospace applications. Microelectronics Reliability, 55 (9-10). pp. 1271-1279. ISSN 0026-2714 (doi:https://doi.org/10.1016/j.microrel.2015.07.030)

computer modelling

Ridout, Stephen, Dusek, Milos, Bailey, Christopher ORCID: 0000-0002-9438-3879 and Hunt, Chris (2006) Assessing the performance of crack detection tests for solder joints. Microelectronics Reliability, 46 (12). pp. 2122-2130. ISSN 0026-2714 (doi:https://doi.org/10.1016/j.microrel.2006.05.001)

computer simulation

Lu, H. ORCID: 0000-0002-4392-6562, Hung, K.C., Stoyanov, S. ORCID: 0000-0001-6091-1226, Bailey, C. ORCID: 0000-0002-9438-3879 and Chan, Y.C. (2002) No-flow underfill flip chip assembly–an experimental and modeling analysis. Microelectronics Reliability, 42 (8). pp. 1205-1212. ISSN 0026-2714 (doi:https://doi.org/10.1016/S0026-2714(02)00092-6)

contact resistance

Yin, C.Y. ORCID: 0000-0003-0298-0420, Alam, M.O., Chan, Y.C., Bailey, C. ORCID: 0000-0002-9438-3879 and Lu, Hua ORCID: 0000-0002-4392-6562 (2003) The effect of reflow process on the contact resistance and reliability of anisotropic conductive film interconnection for flip chip on flex applications. Microelectronics Reliability, 43 (4). pp. 625-633. ISSN 0026-2714 (doi:https://doi.org/10.1016/S0026-2714(02)00348-7)

curing

Lu, H. ORCID: 0000-0002-4392-6562, Hung, K.C., Stoyanov, S. ORCID: 0000-0001-6091-1226, Bailey, C. ORCID: 0000-0002-9438-3879 and Chan, Y.C. (2002) No-flow underfill flip chip assembly–an experimental and modeling analysis. Microelectronics Reliability, 42 (8). pp. 1205-1212. ISSN 0026-2714 (doi:https://doi.org/10.1016/S0026-2714(02)00092-6)

Damage

Rajaguru, Pushparajah ORCID: 0000-0002-6041-0517, Lu, Hua ORCID: 0000-0002-4392-6562 and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2015) A time dependent damage indicator model for Sn3.5Ag solder layer in power electronic module. Microelectronics Reliability, 55 (11). pp. 2371-2381. ISSN 0026-2714 (doi:https://doi.org/10.1016/j.microrel.2015.07.047)

defective metallisation

Otiaba, Kenny C., Bhatti, R.S., Ekere, N.N., Mallik, S., Alam, M.O., Amalu, E.H. and Ekpu, M. (2012) Numerical study on thermal impacts of different void patterns on performance of chip-scale packaged power device. Microelectronics Reliability, 52 (7). pp. 1409-1419. ISSN 0026-2714 (doi:https://doi.org/10.1016/j.microrel.2012.01.015)

delamination

Lu, H. ORCID: 0000-0002-4392-6562, Hung, K.C., Stoyanov, S. ORCID: 0000-0001-6091-1226, Bailey, C. ORCID: 0000-0002-9438-3879 and Chan, Y.C. (2002) No-flow underfill flip chip assembly–an experimental and modeling analysis. Microelectronics Reliability, 42 (8). pp. 1205-1212. ISSN 0026-2714 (doi:https://doi.org/10.1016/S0026-2714(02)00092-6)

Design tools

Tilford, Tim ORCID: 0000-0001-8307-6403, Stoyanov, Stoyan ORCID: 0000-0001-6091-1226, Braun, Jessica, Janhsen, Jan Cristophe, Burgard, Matthias, Birch, Richard and Bailey, Chris ORCID: 0000-0002-9438-3879 (2018) Design, manufacture and test for reliable 3D printed electronics packaging. Microelectronics Reliability, 85. pp. 109-117. ISSN 0026-2714 (doi:https://doi.org/10.1016/j.microrel.2018.04.008)

effect of reflow process

Yin, C.Y. ORCID: 0000-0003-0298-0420, Alam, M.O., Chan, Y.C., Bailey, C. ORCID: 0000-0002-9438-3879 and Lu, Hua ORCID: 0000-0002-4392-6562 (2003) The effect of reflow process on the contact resistance and reliability of anisotropic conductive film interconnection for flip chip on flex applications. Microelectronics Reliability, 43 (4). pp. 625-633. ISSN 0026-2714 (doi:https://doi.org/10.1016/S0026-2714(02)00348-7)

electroless Ni–P layer

Alam, M.O., Chan, Y.C. and Hung, K.C. (2002) Reliability study of the electroless Ni–P layer against solder alloy. Microelectronics Reliability, 42 (7). pp. 1065-1073. ISSN 0026-2714 (doi:https://doi.org/10.1016/S0026-2714(02)00068-9)

Electronic Packaging

Stoyanov, Stoyan ORCID: 0000-0001-6091-1226, Bailey, Chris ORCID: 0000-0002-9438-3879 and Tourloukis, Georgios (2016) Similarity approach for reducing qualification tests of electronic components. Microelectronics Reliability, 67. pp. 111-119. ISSN 0026-2714 (doi:https://doi.org/10.1016/j.microrel.2016.10.017)

electronic unit

Otiaba, K.C., Ekere, N.N., Bhatti, R.S., Mallik, S., Alam, M.O. and Amalu, E.H. (2011) Thermal interface materials for automotive electronic control unit: Trends, technology and R&D challenges. Microelectronics Reliability, 51 (12). pp. 2031-2043. ISSN 0026-2714 (doi:https://doi.org/10.1016/j.microrel.2011.05.001)

Electronics packaging

Tilford, Tim ORCID: 0000-0001-8307-6403, Stoyanov, Stoyan ORCID: 0000-0001-6091-1226, Braun, Jessica, Janhsen, Jan Cristophe, Burgard, Matthias, Birch, Richard and Bailey, Chris ORCID: 0000-0002-9438-3879 (2018) Design, manufacture and test for reliable 3D printed electronics packaging. Microelectronics Reliability, 85. pp. 109-117. ISSN 0026-2714 (doi:https://doi.org/10.1016/j.microrel.2018.04.008)

external parameter

Li, Ling-Ling, Liu, Zhi-Feng, Tseng, Ming-Lang, Zhou, Li ORCID: 0000-0001-7132-5935 and Qi, Fu-Dong (2019) Prediction of IGBT power module remaining lifetime using the aging state approach. Microelectronics Reliability, 102:113476. ISSN 0026-2714 (doi:https://doi.org/10.1016/j.microrel.2019.113476)

fatigue

Ekpu, Mathias, Bhatti, Raj, Okereke, Michael I. ORCID: 0000-0002-2104-012X, Mallik, Sabuj and Otiaba, Kenny (2014) Fatigue life of lead-free solder thermal interface materials at varying bond line thickness in microelectronics. Microelectronics Reliability, 54 (1). 239 - 244. ISSN 0026-2714 (doi:https://doi.org/10.1016/j.microrel.2013.08.006)

Rajaguru, Pushparajah ORCID: 0000-0002-6041-0517, Lu, Hua ORCID: 0000-0002-4392-6562 and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2015) A time dependent damage indicator model for Sn3.5Ag solder layer in power electronic module. Microelectronics Reliability, 55 (11). pp. 2371-2381. ISSN 0026-2714 (doi:https://doi.org/10.1016/j.microrel.2015.07.047)

fatigue of materials

Lu, H. ORCID: 0000-0002-4392-6562, Hung, K.C., Stoyanov, S. ORCID: 0000-0001-6091-1226, Bailey, C. ORCID: 0000-0002-9438-3879 and Chan, Y.C. (2002) No-flow underfill flip chip assembly–an experimental and modeling analysis. Microelectronics Reliability, 42 (8). pp. 1205-1212. ISSN 0026-2714 (doi:https://doi.org/10.1016/S0026-2714(02)00092-6)

Finite element analysis

Rajaguru, P. ORCID: 0000-0002-6041-0517, Lu, H. ORCID: 0000-0002-4392-6562, Bailey, C. ORCID: 0000-0002-9438-3879, Ortiz-Gonzalez, J. and Alatise, O. (2016) Evaluation of the impact of the physical dimensions and material of the semiconductor chip on the reliability of Sn3.5Ag solder interconnect in power electronic module: A finite element analysis perspective. Microelectronics Reliability, 68. pp. 77-85. ISSN 0026-2714 (doi:https://doi.org/10.1016/j.microrel.2016.12.002)

finite element analysis (FEA)

Otiaba, Kenny C., Bhatti, R.S., Ekere, N.N., Mallik, S., Alam, M.O., Amalu, E.H. and Ekpu, M. (2012) Numerical study on thermal impacts of different void patterns on performance of chip-scale packaged power device. Microelectronics Reliability, 52 (7). pp. 1409-1419. ISSN 0026-2714 (doi:https://doi.org/10.1016/j.microrel.2012.01.015)

flip chip devices

Lu, H. ORCID: 0000-0002-4392-6562, Hung, K.C., Stoyanov, S. ORCID: 0000-0001-6091-1226, Bailey, C. ORCID: 0000-0002-9438-3879 and Chan, Y.C. (2002) No-flow underfill flip chip assembly–an experimental and modeling analysis. Microelectronics Reliability, 42 (8). pp. 1205-1212. ISSN 0026-2714 (doi:https://doi.org/10.1016/S0026-2714(02)00092-6)

flip-chip packaging

Stoyanov, Stoyan ORCID: 0000-0001-6091-1226, Kay, Robert W., Bailey, Christopher ORCID: 0000-0002-9438-3879 and Desmulliez, Marc P.Y. (2007) Computational modelling for reliable flip-chip packaging at sub-100 micron pitch using isotropic conductive adhesives. Microelectronics Reliability, 47 (1). pp. 132-141. ISSN 0026-2714 (doi:https://doi.org/10.1016/j.microrel.2006.01.004)

hot solder dip

Yin, Chunyan ORCID: 0000-0003-0298-0420, Best, Chris, Bailey, Chris ORCID: 0000-0002-9438-3879 and Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 (2015) Statistical analysis of the impact of refinishing process on leaded components. Microelectronics Reliability, 55 (2). pp. 424-431. ISSN 0026-2714 (doi:https://doi.org/10.1016/j.microrel.2014.11.001)

hot solder dip process

Stoyanov, Stoyan ORCID: 0000-0001-6091-1226, Bailey, Chris ORCID: 0000-0002-9438-3879, Alam, M.O., Yin, Chunyan ORCID: 0000-0003-0298-0420, Best, Chris, Tollafield, Peter, Crawford, Rob, Parker, Mike and Scott, Jim (2013) Modelling methodology for thermal analysis of hot solder dip process. Microelectronics Reliability, 53 (8). pp. 1055-1067. ISSN 0026-2714 (doi:https://doi.org/10.1016/j.microrel.2013.02.018)

IGBT power modules

Li, Ling-Ling, Liu, Zhi-Feng, Tseng, Ming-Lang, Zhou, Li ORCID: 0000-0001-7132-5935 and Qi, Fu-Dong (2019) Prediction of IGBT power module remaining lifetime using the aging state approach. Microelectronics Reliability, 102:113476. ISSN 0026-2714 (doi:https://doi.org/10.1016/j.microrel.2019.113476)

interface

Otiaba, K.C., Ekere, N.N., Bhatti, R.S., Mallik, S., Alam, M.O. and Amalu, E.H. (2011) Thermal interface materials for automotive electronic control unit: Trends, technology and R&D challenges. Microelectronics Reliability, 51 (12). pp. 2031-2043. ISSN 0026-2714 (doi:https://doi.org/10.1016/j.microrel.2011.05.001)

interfaces (materials)

Lu, H. ORCID: 0000-0002-4392-6562, Hung, K.C., Stoyanov, S. ORCID: 0000-0001-6091-1226, Bailey, C. ORCID: 0000-0002-9438-3879 and Chan, Y.C. (2002) No-flow underfill flip chip assembly–an experimental and modeling analysis. Microelectronics Reliability, 42 (8). pp. 1205-1212. ISSN 0026-2714 (doi:https://doi.org/10.1016/S0026-2714(02)00092-6)

isotropic conductive adhesives (ICAs)

Stoyanov, Stoyan ORCID: 0000-0001-6091-1226, Kay, Robert W., Bailey, Christopher ORCID: 0000-0002-9438-3879 and Desmulliez, Marc P.Y. (2007) Computational modelling for reliable flip-chip packaging at sub-100 micron pitch using isotropic conductive adhesives. Microelectronics Reliability, 47 (1). pp. 132-141. ISSN 0026-2714 (doi:https://doi.org/10.1016/j.microrel.2006.01.004)

Kriging

Rajaguru, Pushparajah ORCID: 0000-0002-6041-0517, Lu, Hua ORCID: 0000-0002-4392-6562 and Bailey, Chris ORCID: 0000-0002-9438-3879 (2015) Sintered silver finite element modelling and reliability based design optimisation in power electronic module. Microelectronics Reliability, 55 (6). pp. 919-930. ISSN 0026-2714 (doi:https://doi.org/10.1016/j.microrel.2015.03.011)

Lateral IGBT

Rajaguru, P. ORCID: 0000-0002-6041-0517, Lu, H. ORCID: 0000-0002-4392-6562, Bailey, C. ORCID: 0000-0002-9438-3879, Castellazzi, A., Pathirana, V., Udugampola, N. and Udrea, F. (2018) Impact of underfill and other physical dimensions on Silicon Lateral IGBT package reliability using computer model with discrete and continuous design variables. Microelectronics Reliability, 83. pp. 146-156. ISSN 0026-2714 (doi:https://doi.org/10.1016/j.microrel.2018.02.024)

lead-free

Ekpu, Mathias, Bhatti, Raj, Okereke, Michael I. ORCID: 0000-0002-2104-012X, Mallik, Sabuj and Otiaba, Kenny (2014) Fatigue life of lead-free solder thermal interface materials at varying bond line thickness in microelectronics. Microelectronics Reliability, 54 (1). 239 - 244. ISSN 0026-2714 (doi:https://doi.org/10.1016/j.microrel.2013.08.006)

Yin, Chunyan ORCID: 0000-0003-0298-0420, Best, Chris, Bailey, Chris ORCID: 0000-0002-9438-3879 and Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 (2015) Statistical analysis of the impact of refinishing process on leaded components. Microelectronics Reliability, 55 (2). pp. 424-431. ISSN 0026-2714 (doi:https://doi.org/10.1016/j.microrel.2014.11.001)

lead-free solders

Kamara, E., Lu, H. ORCID: 0000-0002-4392-6562, Bailey, C. ORCID: 0000-0002-9438-3879, Hunt, C., Di Maio, D. and Thomas, O. (2010) A multi-disciplinary study of vibration based reliability of lead-free electronic interconnects. Microelectronics Reliability, 50 (9-11). pp. 1706-1710. ISSN 0026-2714 (doi:https://doi.org/10.1016/j.microrel.2010.07.152)

leaded component

Yin, Chunyan ORCID: 0000-0003-0298-0420, Best, Chris, Bailey, Chris ORCID: 0000-0002-9438-3879 and Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 (2015) Statistical analysis of the impact of refinishing process on leaded components. Microelectronics Reliability, 55 (2). pp. 424-431. ISSN 0026-2714 (doi:https://doi.org/10.1016/j.microrel.2014.11.001)

LED

Rajaguru, P. ORCID: 0000-0002-6041-0517, Lu, H. ORCID: 0000-0002-4392-6562, Bailey, C. ORCID: 0000-0002-9438-3879, Castellazzi, A., Pathirana, V., Udugampola, N. and Udrea, F. (2018) Impact of underfill and other physical dimensions on Silicon Lateral IGBT package reliability using computer model with discrete and continuous design variables. Microelectronics Reliability, 83. pp. 146-156. ISSN 0026-2714 (doi:https://doi.org/10.1016/j.microrel.2018.02.024)

low temperature (T<100 C)

Stoyanov, Stoyan ORCID: 0000-0001-6091-1226, Kay, Robert W., Bailey, Christopher ORCID: 0000-0002-9438-3879 and Desmulliez, Marc P.Y. (2007) Computational modelling for reliable flip-chip packaging at sub-100 micron pitch using isotropic conductive adhesives. Microelectronics Reliability, 47 (1). pp. 132-141. ISSN 0026-2714 (doi:https://doi.org/10.1016/j.microrel.2006.01.004)

microelectronic processing

Lu, H. ORCID: 0000-0002-4392-6562, Hung, K.C., Stoyanov, S. ORCID: 0000-0001-6091-1226, Bailey, C. ORCID: 0000-0002-9438-3879 and Chan, Y.C. (2002) No-flow underfill flip chip assembly–an experimental and modeling analysis. Microelectronics Reliability, 42 (8). pp. 1205-1212. ISSN 0026-2714 (doi:https://doi.org/10.1016/S0026-2714(02)00092-6)

microsystems

Xue, Xiangdong, Bailey, Chris ORCID: 0000-0002-9438-3879, Lu, Hua ORCID: 0000-0002-4392-6562 and Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 (2011) Integration of analytical techniques in stochastic optimization of microsystem reliability. Microelectronics Reliability, 51 (5). pp. 936-945. ISSN 0026-2714 (doi:https://doi.org/10.1016/j.microrel.2011.01.008)

model order reduction

Rajaguru, Pushpa ORCID: 0000-0002-6041-0517, Lu, Hua ORCID: 0000-0002-4392-6562, Bailey, Chris ORCID: 0000-0002-9438-3879 and Bella, Martina (2020) Modelling and analysis of vibration on power electronic module structure and application of model order reduction. Microelectronics Reliability, 110:113697. ISSN 0026-2714 (doi:https://doi.org/10.1016/j.microrel.2020.113697)

modelling

Stoyanov, S. ORCID: 0000-0001-6091-1226 and Bailey, C. ORCID: 0000-0002-9438-3879 (2015) Modelling the impact of refinishing processes on COTS components for use in aerospace applications. Microelectronics Reliability, 55 (9-10). pp. 1271-1279. ISSN 0026-2714 (doi:https://doi.org/10.1016/j.microrel.2015.07.030)

Stoyanov, Stoyan ORCID: 0000-0001-6091-1226, Bailey, Chris ORCID: 0000-0002-9438-3879 and Tourloukis, Georgios (2016) Similarity approach for reducing qualification tests of electronic components. Microelectronics Reliability, 67. pp. 111-119. ISSN 0026-2714 (doi:https://doi.org/10.1016/j.microrel.2016.10.017)

Tilford, Tim ORCID: 0000-0001-8307-6403, Stoyanov, Stoyan ORCID: 0000-0001-6091-1226, Braun, Jessica, Janhsen, Jan Cristophe, Burgard, Matthias, Birch, Richard and Bailey, Chris ORCID: 0000-0002-9438-3879 (2018) Design, manufacture and test for reliable 3D printed electronics packaging. Microelectronics Reliability, 85. pp. 109-117. ISSN 0026-2714 (doi:https://doi.org/10.1016/j.microrel.2018.04.008)

modelling methodology

Stoyanov, Stoyan ORCID: 0000-0001-6091-1226, Bailey, Chris ORCID: 0000-0002-9438-3879, Alam, M.O., Yin, Chunyan ORCID: 0000-0003-0298-0420, Best, Chris, Tollafield, Peter, Crawford, Rob, Parker, Mike and Scott, Jim (2013) Modelling methodology for thermal analysis of hot solder dip process. Microelectronics Reliability, 53 (8). pp. 1055-1067. ISSN 0026-2714 (doi:https://doi.org/10.1016/j.microrel.2013.02.018)

Multi-objective optimization

Nwanoro, Kenneth, Lu, Hua ORCID: 0000-0002-4392-6562, Yin, Chunyan ORCID: 0000-0003-0298-0420 and Bailey, Chris ORCID: 0000-0002-9438-3879 (2018) An analysis of the reliability and design optimization of aluminium ribbon bonds in power electronics modules using computer simulation method. Microelectronics Reliability, 87. pp. 1-14. ISSN 0026-2714 (doi:https://doi.org/10.1016/j.microrel.2018.05.013)

multiphysics

Xue, Xiangdong, Bailey, Chris ORCID: 0000-0002-9438-3879, Lu, Hua ORCID: 0000-0002-4392-6562 and Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 (2011) Integration of analytical techniques in stochastic optimization of microsystem reliability. Microelectronics Reliability, 51 (5). pp. 936-945. ISSN 0026-2714 (doi:https://doi.org/10.1016/j.microrel.2011.01.008)

out-gassing phenomenon

Otiaba, Kenny C., Bhatti, R.S., Ekere, N.N., Mallik, S., Alam, M.O., Amalu, E.H. and Ekpu, M. (2012) Numerical study on thermal impacts of different void patterns on performance of chip-scale packaged power device. Microelectronics Reliability, 52 (7). pp. 1409-1419. ISSN 0026-2714 (doi:https://doi.org/10.1016/j.microrel.2012.01.015)

packaging

Lu, Hua ORCID: 0000-0002-4392-6562, Bailey, Chris ORCID: 0000-0002-9438-3879 and Yin, Chunyan ORCID: 0000-0003-0298-0420 (2009) Design for reliability of power electronics modules. Microelectronics Reliability, 49 (9-11). pp. 1250-1255. ISSN 0026-2714 (doi:https://doi.org/10.1016/j.microrel.2009.07.055)

Particle Swarm Optimisation

Rajaguru, Pushparajah ORCID: 0000-0002-6041-0517, Lu, Hua ORCID: 0000-0002-4392-6562 and Bailey, Chris ORCID: 0000-0002-9438-3879 (2015) Sintered silver finite element modelling and reliability based design optimisation in power electronic module. Microelectronics Reliability, 55 (6). pp. 919-930. ISSN 0026-2714 (doi:https://doi.org/10.1016/j.microrel.2015.03.011)

power cycles experiment

Li, Ling-Ling, Liu, Zhi-Feng, Tseng, Ming-Lang, Zhou, Li ORCID: 0000-0001-7132-5935 and Qi, Fu-Dong (2019) Prediction of IGBT power module remaining lifetime using the aging state approach. Microelectronics Reliability, 102:113476. ISSN 0026-2714 (doi:https://doi.org/10.1016/j.microrel.2019.113476)

Power cycling

Nwanoro, Kenneth, Lu, Hua ORCID: 0000-0002-4392-6562, Yin, Chunyan ORCID: 0000-0003-0298-0420 and Bailey, Chris ORCID: 0000-0002-9438-3879 (2018) An analysis of the reliability and design optimization of aluminium ribbon bonds in power electronics modules using computer simulation method. Microelectronics Reliability, 87. pp. 1-14. ISSN 0026-2714 (doi:https://doi.org/10.1016/j.microrel.2018.05.013)

Power electronic module

Rajaguru, P. ORCID: 0000-0002-6041-0517, Lu, H. ORCID: 0000-0002-4392-6562, Bailey, C. ORCID: 0000-0002-9438-3879, Ortiz-Gonzalez, J. and Alatise, O. (2016) Evaluation of the impact of the physical dimensions and material of the semiconductor chip on the reliability of Sn3.5Ag solder interconnect in power electronic module: A finite element analysis perspective. Microelectronics Reliability, 68. pp. 77-85. ISSN 0026-2714 (doi:https://doi.org/10.1016/j.microrel.2016.12.002)

Rajaguru, Pushparajah ORCID: 0000-0002-6041-0517, Lu, Hua ORCID: 0000-0002-4392-6562 and Bailey, Chris ORCID: 0000-0002-9438-3879 (2015) Sintered silver finite element modelling and reliability based design optimisation in power electronic module. Microelectronics Reliability, 55 (6). pp. 919-930. ISSN 0026-2714 (doi:https://doi.org/10.1016/j.microrel.2015.03.011)

Rajaguru, Pushparajah ORCID: 0000-0002-6041-0517, Lu, Hua ORCID: 0000-0002-4392-6562 and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2015) A time dependent damage indicator model for Sn3.5Ag solder layer in power electronic module. Microelectronics Reliability, 55 (11). pp. 2371-2381. ISSN 0026-2714 (doi:https://doi.org/10.1016/j.microrel.2015.07.047)

power electronics

Lu, Hua ORCID: 0000-0002-4392-6562, Bailey, Chris ORCID: 0000-0002-9438-3879 and Yin, Chunyan ORCID: 0000-0003-0298-0420 (2009) Design for reliability of power electronics modules. Microelectronics Reliability, 49 (9-11). pp. 1250-1255. ISSN 0026-2714 (doi:https://doi.org/10.1016/j.microrel.2009.07.055)

Nwanoro, Kenneth, Lu, Hua ORCID: 0000-0002-4392-6562, Yin, Chunyan ORCID: 0000-0003-0298-0420 and Bailey, Chris ORCID: 0000-0002-9438-3879 (2018) An analysis of the reliability and design optimization of aluminium ribbon bonds in power electronics modules using computer simulation method. Microelectronics Reliability, 87. pp. 1-14. ISSN 0026-2714 (doi:https://doi.org/10.1016/j.microrel.2018.05.013)

prognostic methods

Lu, Hua ORCID: 0000-0002-4392-6562, Bailey, Chris ORCID: 0000-0002-9438-3879 and Yin, Chunyan ORCID: 0000-0003-0298-0420 (2009) Design for reliability of power electronics modules. Microelectronics Reliability, 49 (9-11). pp. 1250-1255. ISSN 0026-2714 (doi:https://doi.org/10.1016/j.microrel.2009.07.055)

radial basis

Rajaguru, Pushparajah ORCID: 0000-0002-6041-0517, Lu, Hua ORCID: 0000-0002-4392-6562 and Bailey, Chris ORCID: 0000-0002-9438-3879 (2015) Sintered silver finite element modelling and reliability based design optimisation in power electronic module. Microelectronics Reliability, 55 (6). pp. 919-930. ISSN 0026-2714 (doi:https://doi.org/10.1016/j.microrel.2015.03.011)

reduced order models

Rajaguru, Pushparajah ORCID: 0000-0002-6041-0517, Lu, Hua ORCID: 0000-0002-4392-6562 and Bailey, Chris ORCID: 0000-0002-9438-3879 (2015) Sintered silver finite element modelling and reliability based design optimisation in power electronic module. Microelectronics Reliability, 55 (6). pp. 919-930. ISSN 0026-2714 (doi:https://doi.org/10.1016/j.microrel.2015.03.011)

refinishing

Stoyanov, S. ORCID: 0000-0001-6091-1226 and Bailey, C. ORCID: 0000-0002-9438-3879 (2015) Modelling the impact of refinishing processes on COTS components for use in aerospace applications. Microelectronics Reliability, 55 (9-10). pp. 1271-1279. ISSN 0026-2714 (doi:https://doi.org/10.1016/j.microrel.2015.07.030)

Yin, Chunyan ORCID: 0000-0003-0298-0420, Best, Chris, Bailey, Chris ORCID: 0000-0002-9438-3879 and Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 (2015) Statistical analysis of the impact of refinishing process on leaded components. Microelectronics Reliability, 55 (2). pp. 424-431. ISSN 0026-2714 (doi:https://doi.org/10.1016/j.microrel.2014.11.001)

reliability

Kamara, E., Lu, H. ORCID: 0000-0002-4392-6562, Bailey, C. ORCID: 0000-0002-9438-3879, Hunt, C., Di Maio, D. and Thomas, O. (2010) A multi-disciplinary study of vibration based reliability of lead-free electronic interconnects. Microelectronics Reliability, 50 (9-11). pp. 1706-1710. ISSN 0026-2714 (doi:https://doi.org/10.1016/j.microrel.2010.07.152)

Lu, Hua ORCID: 0000-0002-4392-6562, Bailey, Chris ORCID: 0000-0002-9438-3879 and Yin, Chunyan ORCID: 0000-0003-0298-0420 (2009) Design for reliability of power electronics modules. Microelectronics Reliability, 49 (9-11). pp. 1250-1255. ISSN 0026-2714 (doi:https://doi.org/10.1016/j.microrel.2009.07.055)

Nwanoro, Kenneth, Lu, Hua ORCID: 0000-0002-4392-6562, Yin, Chunyan ORCID: 0000-0003-0298-0420 and Bailey, Chris ORCID: 0000-0002-9438-3879 (2018) An analysis of the reliability and design optimization of aluminium ribbon bonds in power electronics modules using computer simulation method. Microelectronics Reliability, 87. pp. 1-14. ISSN 0026-2714 (doi:https://doi.org/10.1016/j.microrel.2018.05.013)

Stoyanov, S. ORCID: 0000-0001-6091-1226 and Bailey, C. ORCID: 0000-0002-9438-3879 (2015) Modelling the impact of refinishing processes on COTS components for use in aerospace applications. Microelectronics Reliability, 55 (9-10). pp. 1271-1279. ISSN 0026-2714 (doi:https://doi.org/10.1016/j.microrel.2015.07.030)

Stoyanov, Stoyan ORCID: 0000-0001-6091-1226, Bailey, Chris ORCID: 0000-0002-9438-3879 and Tourloukis, Georgios (2016) Similarity approach for reducing qualification tests of electronic components. Microelectronics Reliability, 67. pp. 111-119. ISSN 0026-2714 (doi:https://doi.org/10.1016/j.microrel.2016.10.017)

Tilford, Tim ORCID: 0000-0001-8307-6403, Stoyanov, Stoyan ORCID: 0000-0001-6091-1226, Braun, Jessica, Janhsen, Jan Cristophe, Burgard, Matthias, Birch, Richard and Bailey, Chris ORCID: 0000-0002-9438-3879 (2018) Design, manufacture and test for reliable 3D printed electronics packaging. Microelectronics Reliability, 85. pp. 109-117. ISSN 0026-2714 (doi:https://doi.org/10.1016/j.microrel.2018.04.008)

reliability study

Alam, M.O., Chan, Y.C. and Hung, K.C. (2002) Reliability study of the electroless Ni–P layer against solder alloy. Microelectronics Reliability, 42 (7). pp. 1065-1073. ISSN 0026-2714 (doi:https://doi.org/10.1016/S0026-2714(02)00068-9)

remaining lifetime

Li, Ling-Ling, Liu, Zhi-Feng, Tseng, Ming-Lang, Zhou, Li ORCID: 0000-0001-7132-5935 and Qi, Fu-Dong (2019) Prediction of IGBT power module remaining lifetime using the aging state approach. Microelectronics Reliability, 102:113476. ISSN 0026-2714 (doi:https://doi.org/10.1016/j.microrel.2019.113476)

risk analysis

Rajaguru, Pushparajah ORCID: 0000-0002-6041-0517, Lu, Hua ORCID: 0000-0002-4392-6562 and Bailey, Chris ORCID: 0000-0002-9438-3879 (2015) Sintered silver finite element modelling and reliability based design optimisation in power electronic module. Microelectronics Reliability, 55 (6). pp. 919-930. ISSN 0026-2714 (doi:https://doi.org/10.1016/j.microrel.2015.03.011)

scanning acoustic microscopes

Lu, H. ORCID: 0000-0002-4392-6562, Hung, K.C., Stoyanov, S. ORCID: 0000-0001-6091-1226, Bailey, C. ORCID: 0000-0002-9438-3879 and Chan, Y.C. (2002) No-flow underfill flip chip assembly–an experimental and modeling analysis. Microelectronics Reliability, 42 (8). pp. 1205-1212. ISSN 0026-2714 (doi:https://doi.org/10.1016/S0026-2714(02)00092-6)

Sensitivity analysis

Rajaguru, P. ORCID: 0000-0002-6041-0517, Lu, H. ORCID: 0000-0002-4392-6562, Bailey, C. ORCID: 0000-0002-9438-3879, Ortiz-Gonzalez, J. and Alatise, O. (2016) Evaluation of the impact of the physical dimensions and material of the semiconductor chip on the reliability of Sn3.5Ag solder interconnect in power electronic module: A finite element analysis perspective. Microelectronics Reliability, 68. pp. 77-85. ISSN 0026-2714 (doi:https://doi.org/10.1016/j.microrel.2016.12.002)

solder alloy

Alam, M.O., Chan, Y.C. and Hung, K.C. (2002) Reliability study of the electroless Ni–P layer against solder alloy. Microelectronics Reliability, 42 (7). pp. 1065-1073. ISSN 0026-2714 (doi:https://doi.org/10.1016/S0026-2714(02)00068-9)

Solder joint

Rajaguru, Pushparajah ORCID: 0000-0002-6041-0517, Lu, Hua ORCID: 0000-0002-4392-6562 and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2015) A time dependent damage indicator model for Sn3.5Ag solder layer in power electronic module. Microelectronics Reliability, 55 (11). pp. 2371-2381. ISSN 0026-2714 (doi:https://doi.org/10.1016/j.microrel.2015.07.047)

solder joints

Ridout, Stephen, Dusek, Milos, Bailey, Christopher ORCID: 0000-0002-9438-3879 and Hunt, Chris (2006) Assessing the performance of crack detection tests for solder joints. Microelectronics Reliability, 46 (12). pp. 2122-2130. ISSN 0026-2714 (doi:https://doi.org/10.1016/j.microrel.2006.05.001)

solder thermal interface materials (STIMs)

Otiaba, Kenny C., Bhatti, R.S., Ekere, N.N., Mallik, S., Alam, M.O., Amalu, E.H. and Ekpu, M. (2012) Numerical study on thermal impacts of different void patterns on performance of chip-scale packaged power device. Microelectronics Reliability, 52 (7). pp. 1409-1419. ISSN 0026-2714 (doi:https://doi.org/10.1016/j.microrel.2012.01.015)

soldered joints

Lu, H. ORCID: 0000-0002-4392-6562, Hung, K.C., Stoyanov, S. ORCID: 0000-0001-6091-1226, Bailey, C. ORCID: 0000-0002-9438-3879 and Chan, Y.C. (2002) No-flow underfill flip chip assembly–an experimental and modeling analysis. Microelectronics Reliability, 42 (8). pp. 1205-1212. ISSN 0026-2714 (doi:https://doi.org/10.1016/S0026-2714(02)00092-6)

solders

Ekpu, Mathias, Bhatti, Raj, Okereke, Michael I. ORCID: 0000-0002-2104-012X, Mallik, Sabuj and Otiaba, Kenny (2014) Fatigue life of lead-free solder thermal interface materials at varying bond line thickness in microelectronics. Microelectronics Reliability, 54 (1). 239 - 244. ISSN 0026-2714 (doi:https://doi.org/10.1016/j.microrel.2013.08.006)

statistical hypothesis testing

Yin, Chunyan ORCID: 0000-0003-0298-0420, Best, Chris, Bailey, Chris ORCID: 0000-0002-9438-3879 and Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 (2015) Statistical analysis of the impact of refinishing process on leaded components. Microelectronics Reliability, 55 (2). pp. 424-431. ISSN 0026-2714 (doi:https://doi.org/10.1016/j.microrel.2014.11.001)

Surrogate models

Rajaguru, P. ORCID: 0000-0002-6041-0517, Lu, H. ORCID: 0000-0002-4392-6562, Bailey, C. ORCID: 0000-0002-9438-3879, Ortiz-Gonzalez, J. and Alatise, O. (2016) Evaluation of the impact of the physical dimensions and material of the semiconductor chip on the reliability of Sn3.5Ag solder interconnect in power electronic module: A finite element analysis perspective. Microelectronics Reliability, 68. pp. 77-85. ISSN 0026-2714 (doi:https://doi.org/10.1016/j.microrel.2016.12.002)

thermal

Otiaba, K.C., Ekere, N.N., Bhatti, R.S., Mallik, S., Alam, M.O. and Amalu, E.H. (2011) Thermal interface materials for automotive electronic control unit: Trends, technology and R&D challenges. Microelectronics Reliability, 51 (12). pp. 2031-2043. ISSN 0026-2714 (doi:https://doi.org/10.1016/j.microrel.2011.05.001)

thermal analysis

Stoyanov, Stoyan ORCID: 0000-0001-6091-1226, Bailey, Chris ORCID: 0000-0002-9438-3879, Alam, M.O., Yin, Chunyan ORCID: 0000-0003-0298-0420, Best, Chris, Tollafield, Peter, Crawford, Rob, Parker, Mike and Scott, Jim (2013) Modelling methodology for thermal analysis of hot solder dip process. Microelectronics Reliability, 53 (8). pp. 1055-1067. ISSN 0026-2714 (doi:https://doi.org/10.1016/j.microrel.2013.02.018)

Thermal cycling

Nwanoro, Kenneth, Lu, Hua ORCID: 0000-0002-4392-6562, Yin, Chunyan ORCID: 0000-0003-0298-0420 and Bailey, Chris ORCID: 0000-0002-9438-3879 (2018) An analysis of the reliability and design optimization of aluminium ribbon bonds in power electronics modules using computer simulation method. Microelectronics Reliability, 87. pp. 1-14. ISSN 0026-2714 (doi:https://doi.org/10.1016/j.microrel.2018.05.013)

thermal interface materials

Ekpu, Mathias, Bhatti, Raj, Okereke, Michael I. ORCID: 0000-0002-2104-012X, Mallik, Sabuj and Otiaba, Kenny (2014) Fatigue life of lead-free solder thermal interface materials at varying bond line thickness in microelectronics. Microelectronics Reliability, 54 (1). 239 - 244. ISSN 0026-2714 (doi:https://doi.org/10.1016/j.microrel.2013.08.006)

tin whiskers

Stoyanov, Stoyan ORCID: 0000-0001-6091-1226, Bailey, Chris ORCID: 0000-0002-9438-3879, Alam, M.O., Yin, Chunyan ORCID: 0000-0003-0298-0420, Best, Chris, Tollafield, Peter, Crawford, Rob, Parker, Mike and Scott, Jim (2013) Modelling methodology for thermal analysis of hot solder dip process. Microelectronics Reliability, 53 (8). pp. 1055-1067. ISSN 0026-2714 (doi:https://doi.org/10.1016/j.microrel.2013.02.018)

Underfill

Rajaguru, P. ORCID: 0000-0002-6041-0517, Lu, H. ORCID: 0000-0002-4392-6562, Bailey, C. ORCID: 0000-0002-9438-3879, Castellazzi, A., Pathirana, V., Udugampola, N. and Udrea, F. (2018) Impact of underfill and other physical dimensions on Silicon Lateral IGBT package reliability using computer model with discrete and continuous design variables. Microelectronics Reliability, 83. pp. 146-156. ISSN 0026-2714 (doi:https://doi.org/10.1016/j.microrel.2018.02.024)

vibration

Kamara, E., Lu, H. ORCID: 0000-0002-4392-6562, Bailey, C. ORCID: 0000-0002-9438-3879, Hunt, C., Di Maio, D. and Thomas, O. (2010) A multi-disciplinary study of vibration based reliability of lead-free electronic interconnects. Microelectronics Reliability, 50 (9-11). pp. 1706-1710. ISSN 0026-2714 (doi:https://doi.org/10.1016/j.microrel.2010.07.152)

Rajaguru, Pushpa ORCID: 0000-0002-6041-0517, Lu, Hua ORCID: 0000-0002-4392-6562, Bailey, Chris ORCID: 0000-0002-9438-3879 and Bella, Martina (2020) Modelling and analysis of vibration on power electronic module structure and application of model order reduction. Microelectronics Reliability, 110:113697. ISSN 0026-2714 (doi:https://doi.org/10.1016/j.microrel.2020.113697)

Wire/ribbon bond

Nwanoro, Kenneth, Lu, Hua ORCID: 0000-0002-4392-6562, Yin, Chunyan ORCID: 0000-0003-0298-0420 and Bailey, Chris ORCID: 0000-0002-9438-3879 (2018) An analysis of the reliability and design optimization of aluminium ribbon bonds in power electronics modules using computer simulation method. Microelectronics Reliability, 87. pp. 1-14. ISSN 0026-2714 (doi:https://doi.org/10.1016/j.microrel.2018.05.013)

X ray microscopes

Lu, H. ORCID: 0000-0002-4392-6562, Hung, K.C., Stoyanov, S. ORCID: 0000-0001-6091-1226, Bailey, C. ORCID: 0000-0002-9438-3879 and Chan, Y.C. (2002) No-flow underfill flip chip assembly–an experimental and modeling analysis. Microelectronics Reliability, 42 (8). pp. 1205-1212. ISSN 0026-2714 (doi:https://doi.org/10.1016/S0026-2714(02)00092-6)

This list was generated on Mon Oct 25 10:01:19 2021 UTC.