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3D printing aging evaluation analytical techniques anisotropic conductive film (ACF) automotive chip scale package (CSP) technology commercial off-the shelf components computer modelling computer simulation contact resistance curing Damage defective metallisation delamination Design tools effect of reflow process electroless Ni–P layer Electronic Packaging electronic unit Electronics packaging external parameter fatigue fatigue of materials Finite element analysis finite element analysis (FEA) flip chip devices flip-chip packaging hot solder dip hot solder dip process IGBT power modules interface interfaces (materials) isotropic conductive adhesives (ICAs) Kriging Lateral IGBT lead-free lead-free solders leaded component LED low temperature (T<100 C) microelectronic processing microsystems model order reduction modelling modelling methodology Multi-objective optimization multiphysics out-gassing phenomenon packaging Particle Swarm Optimisation power cycles experiment Power cycling Power electronic module power electronics prognostic methods radial basis reduced order models refinishing reliability reliability study remaining lifetime risk analysis scanning acoustic microscopes Sensitivity analysis solder alloy Solder joint solder joints solder thermal interface materials (STIMs) soldered joints solders statistical hypothesis testing Surrogate models thermal thermal analysis Thermal cycling thermal interface materials tin whiskers Underfill vibration Wire/ribbon bond X ray microscopes

Number of items: 95.

3D printing

Tilford, Tim ORCID: 0000-0001-8307-6403 , Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Braun, Jessica, Janhsen, Jan Cristophe, Burgard, Matthias, Birch, Richard and Bailey, Chris ORCID: 0000-0002-9438-3879 (2018) Design, manufacture and test for reliable 3D printed electronics packaging. Microelectronics Reliability, 85. pp. 109-117. ISSN 0026-2714 (doi:https://doi.org/10.1016/j.microrel.2018.04.008)

aging evaluation

Li, Ling-Ling, Liu, Zhi-Feng, Tseng, Ming-Lang, Zhou, Li ORCID: 0000-0001-7132-5935 and Qi, Fu-Dong (2019) Prediction of IGBT power module remaining lifetime using the aging state approach. Microelectronics Reliability, 102:113476. ISSN 0026-2714 (doi:https://doi.org/10.1016/j.microrel.2019.113476)

analytical techniques

Xue, Xiangdong, Bailey, Chris ORCID: 0000-0002-9438-3879 , Lu, Hua ORCID: 0000-0002-4392-6562 and Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 (2011) Integration of analytical techniques in stochastic optimization of microsystem reliability. Microelectronics Reliability, 51 (5). pp. 936-945. ISSN 0026-2714 (doi:https://doi.org/10.1016/j.microrel.2011.01.008)

anisotropic conductive film (ACF)

Yin, C.Y. ORCID: 0000-0003-0298-0420 , Alam, M.O., Chan, Y.C., Bailey, C. ORCID: 0000-0002-9438-3879 and Lu, Hua ORCID: 0000-0002-4392-6562 (2003) The effect of reflow process on the contact resistance and reliability of anisotropic conductive film interconnection for flip chip on flex applications. Microelectronics Reliability, 43 (4). pp. 625-633. ISSN 0026-2714 (doi:https://doi.org/10.1016/S0026-2714(02)00348-7)

automotive

Otiaba, K.C., Ekere, N.N., Bhatti, R.S., Mallik, S., Alam, M.O. and Amalu, E.H. (2011) Thermal interface materials for automotive electronic control unit: Trends, technology and R&D challenges. Microelectronics Reliability, 51 (12). pp. 2031-2043. ISSN 0026-2714 (doi:https://doi.org/10.1016/j.microrel.2011.05.001)

chip scale package (CSP) technology

Otiaba, Kenny C., Bhatti, R.S., Ekere, N.N., Mallik, S., Alam, M.O., Amalu, E.H. and Ekpu, M. (2012) Numerical study on thermal impacts of different void patterns on performance of chip-scale packaged power device. Microelectronics Reliability, 52 (7). pp. 1409-1419. ISSN 0026-2714 (doi:https://doi.org/10.1016/j.microrel.2012.01.015)

commercial off-the shelf components

Stoyanov, S. ORCID: 0000-0001-6091-1226 and Bailey, C. ORCID: 0000-0002-9438-3879 (2015) Modelling the impact of refinishing processes on COTS components for use in aerospace applications. Microelectronics Reliability, 55 (9-10). pp. 1271-1279. ISSN 0026-2714 (doi:https://doi.org/10.1016/j.microrel.2015.07.030)

computer modelling

Ridout, Stephen, Dusek, Milos, Bailey, Christopher ORCID: 0000-0002-9438-3879 and Hunt, Chris (2006) Assessing the performance of crack detection tests for solder joints. Microelectronics Reliability, 46 (12). pp. 2122-2130. ISSN 0026-2714 (doi:https://doi.org/10.1016/j.microrel.2006.05.001)

computer simulation

Lu, H. ORCID: 0000-0002-4392-6562 , Hung, K.C., Stoyanov, S. ORCID: 0000-0001-6091-1226 , Bailey, C. ORCID: 0000-0002-9438-3879 and Chan, Y.C. (2002) No-flow underfill flip chip assembly–an experimental and modeling analysis. Microelectronics Reliability, 42 (8). pp. 1205-1212. ISSN 0026-2714 (doi:https://doi.org/10.1016/S0026-2714(02)00092-6)

contact resistance

curing

Damage

Rajaguru, Pushparajah ORCID: 0000-0002-6041-0517 , Lu, Hua ORCID: 0000-0002-4392-6562 and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2015) A time dependent damage indicator model for Sn3.5Ag solder layer in power electronic module. Microelectronics Reliability, 55 (11). pp. 2371-2381. ISSN 0026-2714 (doi:https://doi.org/10.1016/j.microrel.2015.07.047)

defective metallisation

delamination

Design tools

effect of reflow process

electroless Ni–P layer

Alam, M.O., Chan, Y.C. and Hung, K.C. (2002) Reliability study of the electroless Ni–P layer against solder alloy. Microelectronics Reliability, 42 (7). pp. 1065-1073. ISSN 0026-2714 (doi:https://doi.org/10.1016/S0026-2714(02)00068-9)

Electronic Packaging

Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Bailey, Chris ORCID: 0000-0002-9438-3879 and Tourloukis, Georgios (2016) Similarity approach for reducing qualification tests of electronic components. Microelectronics Reliability, 67. pp. 111-119. ISSN 0026-2714 (doi:https://doi.org/10.1016/j.microrel.2016.10.017)

electronic unit

Electronics packaging

external parameter

fatigue

Ekpu, Mathias, Bhatti, Raj, Okereke, Michael I. ORCID: 0000-0002-2104-012X , Mallik, Sabuj and Otiaba, Kenny (2014) Fatigue life of lead-free solder thermal interface materials at varying bond line thickness in microelectronics. Microelectronics Reliability, 54 (1). 239 - 244. ISSN 0026-2714 (doi:https://doi.org/10.1016/j.microrel.2013.08.006)

fatigue of materials

Finite element analysis

Rajaguru, P. ORCID: 0000-0002-6041-0517 , Lu, H. ORCID: 0000-0002-4392-6562 , Bailey, C. ORCID: 0000-0002-9438-3879 , Ortiz-Gonzalez, J. and Alatise, O. (2016) Evaluation of the impact of the physical dimensions and material of the semiconductor chip on the reliability of Sn3.5Ag solder interconnect in power electronic module: A finite element analysis perspective. Microelectronics Reliability, 68. pp. 77-85. ISSN 0026-2714 (doi:https://doi.org/10.1016/j.microrel.2016.12.002)

finite element analysis (FEA)

flip chip devices

flip-chip packaging

Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Kay, Robert W., Bailey, Christopher ORCID: 0000-0002-9438-3879 and Desmulliez, Marc P.Y. (2007) Computational modelling for reliable flip-chip packaging at sub-100 micron pitch using isotropic conductive adhesives. Microelectronics Reliability, 47 (1). pp. 132-141. ISSN 0026-2714 (doi:https://doi.org/10.1016/j.microrel.2006.01.004)

hot solder dip

Yin, Chunyan ORCID: 0000-0003-0298-0420 , Best, Chris, Bailey, Chris ORCID: 0000-0002-9438-3879 and Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 (2015) Statistical analysis of the impact of refinishing process on leaded components. Microelectronics Reliability, 55 (2). pp. 424-431. ISSN 0026-2714 (doi:https://doi.org/10.1016/j.microrel.2014.11.001)

hot solder dip process

Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Bailey, Chris ORCID: 0000-0002-9438-3879 , Alam, M.O., Yin, Chunyan ORCID: 0000-0003-0298-0420 , Best, Chris, Tollafield, Peter, Crawford, Rob, Parker, Mike and Scott, Jim (2013) Modelling methodology for thermal analysis of hot solder dip process. Microelectronics Reliability, 53 (8). pp. 1055-1067. ISSN 0026-2714 (doi:https://doi.org/10.1016/j.microrel.2013.02.018)

IGBT power modules

interface

interfaces (materials)

isotropic conductive adhesives (ICAs)

Kriging

Rajaguru, Pushparajah ORCID: 0000-0002-6041-0517 , Lu, Hua ORCID: 0000-0002-4392-6562 and Bailey, Chris ORCID: 0000-0002-9438-3879 (2015) Sintered silver finite element modelling and reliability based design optimisation in power electronic module. Microelectronics Reliability, 55 (6). pp. 919-930. ISSN 0026-2714 (doi:https://doi.org/10.1016/j.microrel.2015.03.011)

Lateral IGBT

Rajaguru, P. ORCID: 0000-0002-6041-0517 , Lu, H. ORCID: 0000-0002-4392-6562 , Bailey, C. ORCID: 0000-0002-9438-3879 , Castellazzi, A., Pathirana, V., Udugampola, N. and Udrea, F. (2018) Impact of underfill and other physical dimensions on Silicon Lateral IGBT package reliability using computer model with discrete and continuous design variables. Microelectronics Reliability, 83. pp. 146-156. ISSN 0026-2714 (doi:https://doi.org/10.1016/j.microrel.2018.02.024)

lead-free

lead-free solders

Kamara, E., Lu, H. ORCID: 0000-0002-4392-6562 , Bailey, C. ORCID: 0000-0002-9438-3879 , Hunt, C., Di Maio, D. and Thomas, O. (2010) A multi-disciplinary study of vibration based reliability of lead-free electronic interconnects. Microelectronics Reliability, 50 (9-11). pp. 1706-1710. ISSN 0026-2714 (doi:https://doi.org/10.1016/j.microrel.2010.07.152)

leaded component

LED

low temperature (T<100 C)

microelectronic processing

microsystems

model order reduction

Rajaguru, Pushpa ORCID: 0000-0002-6041-0517 , Lu, Hua ORCID: 0000-0002-4392-6562 , Bailey, Chris ORCID: 0000-0002-9438-3879 and Bella, Martina (2020) Modelling and analysis of vibration on power electronic module structure and application of model order reduction. Microelectronics Reliability, 110:113697. ISSN 0026-2714 (doi:https://doi.org/10.1016/j.microrel.2020.113697)

modelling

modelling methodology

Multi-objective optimization

Nwanoro, Kenneth, Lu, Hua ORCID: 0000-0002-4392-6562 , Yin, Chunyan ORCID: 0000-0003-0298-0420 and Bailey, Chris ORCID: 0000-0002-9438-3879 (2018) An analysis of the reliability and design optimization of aluminium ribbon bonds in power electronics modules using computer simulation method. Microelectronics Reliability, 87. pp. 1-14. ISSN 0026-2714 (doi:https://doi.org/10.1016/j.microrel.2018.05.013)

multiphysics

out-gassing phenomenon

packaging

Lu, Hua ORCID: 0000-0002-4392-6562 , Bailey, Chris ORCID: 0000-0002-9438-3879 and Yin, Chunyan ORCID: 0000-0003-0298-0420 (2009) Design for reliability of power electronics modules. Microelectronics Reliability, 49 (9-11). pp. 1250-1255. ISSN 0026-2714 (doi:https://doi.org/10.1016/j.microrel.2009.07.055)

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