Items where Author is "Bailey, Chris"

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(ACF) (FE) (HSD) (QFP) 3D biochip separator 3D microfluidic device 3D printing accelerated stress test acoustics additive manufacturing adhesives agitation method algorithms analytical techniques anisotropic conductive film anisotropic media ANSYS assembling assembly ball grid array Ball grid arrays beam finite element BGA bifurcation effect Big Data biofluid behavior biofluid separation Black Box blood fluid separation blood plasma separation bonding buckling failure butt joints ceramic packaging ceramics CFD circuit reliability circuit simulation circuit simulator Classification coatings composite properties composite structures compound semiconductors compression bonding simulation computational fluid dynamics computational fluid dynamics (CFD) computational modelling computer aided conservation computer based simulation computer modelling condition monitoring conductive layer constriction effect convection oven convolutional neural network copper copper pattern crack detection creep cross flow filtration cross-flow filtration curing Cutty Sark damage data analytics data mining Data Validity Data Veracity data-driven prognostics DC-DC converter DC-DC power converter defects deformation degradation design engineers design for manufacture Design for Reliability modelling design optimisation design optimization design process Design tools design-for-reliability device design dielectric losses dielectric materials diffraction experiments dispersion display ductility electric-thermal electrical power electro-thermal design electro-thermal model electrodeposition electromagnetic compatibility electromagnetic heating electromigration electronic applications electronic components electronic design automation electronic package Electronic Packaging Electronics Manufacturing Electronics packaging electronics product qualification electroplating electrothermal design encapsulation engineering design European Synchrotron Radiation Facility (ESRF) failure Failure analysis failure based reliability failure mechanisms fatigue fatigue failure FEA feature engineering Feature Selection Finite Element finite element analysis Finite Element Analysis (FEA) Finite Element Method (FEM) finite element modeling flip chip technology flip-chip devices Flotherm XT flow behaviour flow fields fluid flow fluid separator FMEA Focal Plane Array focused ion beam fracture mechanics frequency fusion approach genetic algorithm Geologic Measurements heat sink heat sink design heat transfer high density interconnection technology hot solder dip hot solder dip process IGBT module IGBT power module indium joints industrial partners inkjet printing insulated gate bipolar transistors integrated circuit interconnections integrated circuit modelling integrated circuit reliability integrated optoelectronics intelligent manufacturing intermetallic intermetallic compound intermetallic compounds (IMCs) IR detectors isothermal fatigue test KNN Kriging lead lead-free lead-free solder lead-free solders leaded component LEDs level-set method life cycle costing life estimation life prediction light emitting diodes liquid crystal displays lLifetime estimation longitudinal bending machine learning manufacturing process manufacturing systems mapping mechanical testing printed circuit testing Medway Queen megasonic acoustic streaming Megasonic Agitation mesh generation metals micro-probe microchannel device microelectronics microelectronics fabrication microelectronics packaging microfluidic device microfluidics microinductor microsystems microvia fabrication microvias microwave curing microwave devices microwave ovens Microwave Propagation minium wires model order reduction Model Order Reduction (MOR) modeling modelling modelling and simulation modelling biofluids modelling methodology modelling tools modules moisture morphology Multi-objective optimization multi-physics multi-scale simulations multichip modules multiphysics Multiphysics modelling nanotechnology natural convection Nitrogen Non-Destructive Testing non-invasive and non-destructive methodology novel micro-integrated products numerical analysis numerical modelling numerical software NXP open-ended oven optimisation optimization packaging parameters parametric Model Order Reduction (pMOR) particle liquid separation Particle Swarm Optimisation pb-free PCB Permittivity physics-of-failure plasma blood separation plastic deformation plating rate PoF polymers power converters power cycling power electronic module power electronic modules Power electronics power electronics components power electronics devices Power Electronics Module (PEM) power module power module components power modules predictive models Press-Pack Press-Pack assembly printed circuit board Printed Circuit Board Fabrication printed circuit board reflow printed circuit boards printed circuit design probabilistic optimisation process efficiency product reliability prognostic prognostic methods prognostics prognostics and health management prognostics framework prognostics modelling prognostics prediction methodology prototypes Quad Flat Package Quality Assurance quality control Radar Applications Radar Measurements radial basis redistribution layer reduced order models refinishing reflow self-alignment modeling reflow soldering reliability reliability assessment reliability prediction techniques reliability testing remaining life remaining useful life residual stress resistors risk analysis risk management risk mitigation semiconductor technology sensitivity analysis shape optimisation ship modelling shunt Silicon Carbide silk colour fade simulation smart qualification testing smart test smeared shell approach solder solder interconnect solder joint solder joint failure solder joints soldering solders statistical hypothesis testing Statistics Stepwise strain strain measurement strain on solder joints stress analysis stress intensity factor surface morphology surface mount technology surface topography surface treatment synchrotron system-in-package System-in-Package (SiP) structures T-microchannel device techniques temperature Test Limits Optimisation thermal analysis thermal cycles Thermal cycling thermal degradation thermal diffusivity thermal expansion thermal management thermal management (packaging) thermal modeling thermal stress cracking thermal stresses thermal-mechanical analysis thermo-mechanical analysis thermo-mechanical behaviors three-dimensional miniaturised products Tin alloys tin whiskers topological optimization topology optimization transport systems turbulence models ultra-fine pitch flip chip assembly uniformity Veracity vibration virtual prototyping viscoplastic behaviour viscoplasticity Wafer Level Packaging (WLP) waveguide components whiskers (crystal) wide area wire Wire/ribbon bond wirebond X-ray diffraction (XRD) x-rays zinc

Number of items: 480.

(ACF)

Yin, Chunyan ORCID: https://orcid.org/0000-0003-0298-0420, Lu, Hua ORCID: https://orcid.org/0000-0002-4392-6562, Bailey, Chris ORCID: https://orcid.org/0000-0002-9438-3879 and Chan, Yan-Cheong (2005) Moisture effects on the reliability of ACF interconnections. Electronics World, 111 (1836). pp. 20-24. ISSN 1365-4675

(FE)

Ridout, Stephen, Dusek, Milos, Bailey, Chris ORCID: https://orcid.org/0000-0002-9438-3879 and Hunt, Chris (2004) The effect of thermal cycle profiles on solder joint damage. In: Proceedings of the 6th International Conference on Electronics Materials and Packaging (EMAP 2004). Institute of Electrical and Electronics Engineers, pp. 436-441. ISBN 983251486X

(HSD)

Stoyanov, Stoyan ORCID: https://orcid.org/0000-0001-6091-1226, Best, Chris, Yin, Chunyan ORCID: https://orcid.org/0000-0003-0298-0420, Alam, M.O., Bailey, Chris ORCID: https://orcid.org/0000-0002-9438-3879 and Tollafield, Peter (2012) Experimental and modelling study on the effects of refinishing lead-free microelectronic components. In: 2012 4th Electronic System-Integration Technology Conference (ESTC). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA. ISBN 9781467346450 (doi:10.1109/ESTC.2012.6542213)

(QFP)

3D biochip separator

Xue, Xiangdong, Marson, Silvia, Patel, Mayur K., Attia, Usama M., Bailey, Chris ORCID: https://orcid.org/0000-0002-9438-3879, O'Neill, William, Topham, David and Desmulliez, Marc P.Y. (2010) Biofluid behaviour in 3D microchannel systems: Numerical analysis and design development of 3D microchannel biochip separators. In: 2010 Proceedings 60th Electronic Components and Technology Conference ECTC. Institute of Electrical and Electronics Engineers Inc., Piscataway, NJ, USA, pp. 1021-1030. ISBN 978-1-4244-6410-4 (print), 978-1-4244-6411-1 (electronic) ISSN 0569-5503 (doi:10.1109/ECTC.2010.5490827)

3D microfluidic device

Xue, Xiangdong, Marson, Silvia, Patel, Mayur K., Bailey, Chris ORCID: https://orcid.org/0000-0002-9438-3879, O'Neill, William, Topham, David, Kay, Robert W. and Desmulliez, Marc P.Y. (2011) Progress towards the design and numerical analysis of a 3D microchannel biochip separator. International Journal for Numerical Methods in Biomedical Engineering, 27 (11). pp. 1771-1792. ISSN 2040-7939 (Print), 2040-7947 (Online) (doi:10.1002/cnm.1439)

3D printing

Tilford, Tim ORCID: https://orcid.org/0000-0001-8307-6403, Stoyanov, Stoyan ORCID: https://orcid.org/0000-0001-6091-1226, Braun, Jessica, Janhsen, Jan Cristophe, Burgard, Matthias, Birch, Richard and Bailey, Chris ORCID: https://orcid.org/0000-0002-9438-3879 (2018) Design, manufacture and test for reliable 3D printed electronics packaging. Microelectronics Reliability, 85. pp. 109-117. ISSN 0026-2714 (doi:10.1016/j.microrel.2018.04.008)

accelerated stress test

Desmulliez, Marc P.Y, Adamietz, Raphael, Pavuluri, Sumanth K., Tilford, Tim ORCID: https://orcid.org/0000-0001-8307-6403, Bailey, Chris ORCID: https://orcid.org/0000-0002-9438-3879, Schreier-Alt, Thomas and Warmuth, Jens (2018) Reliability testing and stress measurement of QFN packages encapsulated by an open-ended microwave curing system. IEEE Transactions on Components, Packaging and Manufacturing Technology, 9 (1). pp. 173-180. ISSN 2156-3950 (Print), 2156-3985 (Online) (doi:10.1109/TCPMT.2018.2859031)

acoustics

Xu, Sha, Chan, Yan Cheong, Zhu, Xiaoxin, Lu, Hua ORCID: https://orcid.org/0000-0002-4392-6562 and Bailey, Chris ORCID: https://orcid.org/0000-0002-9438-3879 (2014) Effective method to disperse and incorporate carbon nanotubes in electroless Ni-P deposits. In: 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) Proceedings. Curran Associates, Stoughton, WI, USA, pp. 1342-1347. ISBN 9781479924080 (doi:10.1109/ECTC.2014.6897466)

additive manufacturing

Tilford, Tim ORCID: https://orcid.org/0000-0001-8307-6403, Stoyanov, Stoyan ORCID: https://orcid.org/0000-0001-6091-1226, Braun, Jessica, Janhsen, Jan Christoph, Patel, Mayur K. and Bailey, Chris ORCID: https://orcid.org/0000-0002-9438-3879 (2021) Comparative reliability of inkjet-printed electronics packaging. IEEE Transactions on Components, Packaging and Manufacturing Technology, 11 (2). pp. 351-362. ISSN 2156-3950 (Print), 2156-3985 (Online) (doi:10.1109/TCPMT.2021.3049952)

adhesives

Yin, Chunyan ORCID: https://orcid.org/0000-0003-0298-0420, Lu, Hua ORCID: https://orcid.org/0000-0002-4392-6562, Bailey, Chris ORCID: https://orcid.org/0000-0002-9438-3879 and Chan, Yan-Cheong (2004) Effects of solder reflow on the reliability of flip-chip on flex interconnections using anisotropic conductive adhesives. IEEE Transactions on Electronics Packaging Manufacturing, 27 (4). pp. 254-259. ISSN 1521-334X (doi:10.1109/TEPM.2004.843152)

agitation method

Kaufmann, Jens Georg, Desmulliez, Marc P.Y., Tian, Yingtao, Price, Dennis, Hughes, Mike, Strusevitch, Nadia, Bailey, Chris ORCID: https://orcid.org/0000-0002-9438-3879, Liu, Changqing and Hutt, David (2009) Megasonic agitation for enhanced electrodeposition of copper. Microsystem Technologies, 15 (8). pp. 1245-1254. ISSN 0946-7076 (Print), 1432-1858 (Online) (doi:10.1007/s00542-009-0886-2)

algorithms

Sutharssan, Thamo, Bailey, Chris ORCID: https://orcid.org/0000-0002-9438-3879, Stoyanov, Stoyan ORCID: https://orcid.org/0000-0001-6091-1226 and Rosunally, Yasmine (2011) Prognostics and reliability assessment of light emitting diode packaging. In: Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), 2011 12th International Conference on. Institute of Electrical and Electronics Engineers, Piscataway, NJ, USA, pp. 1-7. ISBN 978-1-4577-1770-3 (print), 978-1-4577-1768-0 (eISBN) (doi:10.1109/ICEPT.2011.6066984)

analytical techniques

Xue, Xiangdong, Bailey, Chris ORCID: https://orcid.org/0000-0002-9438-3879, Lu, Hua ORCID: https://orcid.org/0000-0002-4392-6562 and Stoyanov, Stoyan ORCID: https://orcid.org/0000-0001-6091-1226 (2011) Integration of analytical techniques in stochastic optimization of microsystem reliability. Microelectronics Reliability, 51 (5). pp. 936-945. ISSN 0026-2714 (doi:10.1016/j.microrel.2011.01.008)

anisotropic conductive film

anisotropic media

Yin, Chunyan ORCID: https://orcid.org/0000-0003-0298-0420, Lu, Hua ORCID: https://orcid.org/0000-0002-4392-6562, Bailey, Chris ORCID: https://orcid.org/0000-0002-9438-3879 and Chan, Yan-Cheong (2004) Effects of solder reflow on the reliability of flip-chip on flex interconnections using anisotropic conductive adhesives. IEEE Transactions on Electronics Packaging Manufacturing, 27 (4). pp. 254-259. ISSN 1521-334X (doi:10.1109/TEPM.2004.843152)

ANSYS

Nwanoro, Kenneth C., Lu, Hua ORCID: https://orcid.org/0000-0002-4392-6562, Yin, Chunyan ORCID: https://orcid.org/0000-0003-0298-0420 and Bailey, Chris ORCID: https://orcid.org/0000-0002-9438-3879 (2018) Using FloTHERM XT and ANSYS workbench to perform Thermo-Mechanical analysis. In: Engineers Edge: Mentor Graphics. (Unpublished)

assembling

Bailey, Chris ORCID: https://orcid.org/0000-0002-9438-3879 (2003) Modelling the effect of temperature on product reliability. In: 2003 Proceedings, Nineteenth IEEE Semiconductor Thermal Measurement and Management Symposium. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 324-331. ISBN 0780377931 ISSN 1065-2221 (doi:10.1109/STHERM.2003.1194380)

assembly

Sinclair, Keith I., Goussetis, George, Desmulliez, Marc P.Y., Sangster, Alan J., Tilford, Tim, Bailey, Chris ORCID: https://orcid.org/0000-0002-9438-3879 and Parrott, Kevin (2009) Polymer curing within an optimised open-ended microwave oven. In: European Microwave Week 2008, “Bridging Gaps”, Conference Proceedings,. Institute of Electrical and Electronics Engineers, Inc., Piscataway, N.J., USA, pp. 17-20. ISBN 978-2874870064 (doi:10.1109/EUMC.2008.4751375)

Bailey, Chris ORCID: https://orcid.org/0000-0002-9438-3879, Wheeler, Daniel and Cross, Mark (1998) Numerical modelling of solder joint formation. Soldering & Surface Mount Technology, 10 (2). pp. 6-13. ISSN 0954-0911 (doi:10.1108/09540919810219912)

ball grid array

Stoyanov, Stoyan ORCID: https://orcid.org/0000-0001-6091-1226, Dabek, Alexander and Bailey, Chris ORCID: https://orcid.org/0000-0002-9438-3879 (2013) Thermo–mechanical sub–modelling of BGA components in PCB reflow. In: Proceedings of 36th International Spring Seminar on Electronics Technology, Alba Iulia, Romania, May 8-12, 2013, pp.1-8. Institute of Electrical and Electronics Engineers, Piscataway, NJ, USA, pp. 253-258. ISBN 9781479900367 ISSN 2161-2528 (doi:10.1109/ISSE.2013.6648252)

Ball grid arrays

Stoyanov, Stoyan ORCID: https://orcid.org/0000-0001-6091-1226, Dabek, Alexander and Bailey, Chris ORCID: https://orcid.org/0000-0002-9438-3879 (2014) Hot nitrogen deballing of Ball Grid Arrays. In: Proceedings of the 2014 37th International Spring Seminar on Electronics Technology. Institute of Electrical and Electronics Engineers Inc., Piscataway, NJ, USA, pp. 44-49. ISBN 978-147994455-2 (doi:10.1109/ISSE.2014.6887559)

beam finite element

Rajaguru, Pushparajah ORCID: https://orcid.org/0000-0002-6041-0517, Mason, Peter, Bailey, Chris ORCID: https://orcid.org/0000-0002-9438-3879 and Stoyanov, Stoyan ORCID: https://orcid.org/0000-0001-6091-1226 (2014) Buckling analysis on the hull of the historic paddle steamer ‘Medway Queen’. Ships and Offshore Structures, 9 (6). pp. 643-654. ISSN 1744-5302 (Print), 1754-212X (Online) (doi:10.1080/17445302.2013.849065)

BGA

Alam, M.O., Lu, H. ORCID: https://orcid.org/0000-0002-4392-6562, Bailey, Chris ORCID: https://orcid.org/0000-0002-9438-3879 and Chan, Y.C. (2009) Fracture mechanics analysis of solder joint intermetallic compounds in shear test. Computational Materials Science, 45 (2). pp. 576-583. ISSN 0927-0256 (doi:10.1016/j.commatsci.2008.12.001)

bifurcation effect

Xue, Xiangdong, Bailey, Chris ORCID: https://orcid.org/0000-0002-9438-3879 and Patel, Mayur K. (2010) Design modification of a biochip microchannel separator with integrated curve constrictions for enhanced separation behaviour. In: Proceedings - 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2010. Association for Computing Machinery, New York, pp. 691-697. ISBN 9781424481408 (doi:10.1109/ICEPT.2010.5582861)

Big Data

Hinojosa Herrera, Ana ORCID: https://orcid.org/0000-0002-0636-1881, Walshaw, Chris ORCID: https://orcid.org/0000-0003-0253-7779 and Bailey, Chris ORCID: https://orcid.org/0000-0002-9438-3879 (2020) Failure mode & effect analysis and another methodology for improving data veracity and validity. Annals of Emerging Technologies in Computing (AETiC), 4 (3). pp. 9-16. ISSN 2516-0281 (doi:10.33166/AETiC.2020.03.002)

Hinojosa Herrera, Ana Elsa ORCID: https://orcid.org/0000-0002-0636-1881, Walshaw, Chris ORCID: https://orcid.org/0000-0003-0253-7779, Bailey, Chris ORCID: https://orcid.org/0000-0002-9438-3879 and Yin, Chunyan ORCID: https://orcid.org/0000-0003-0298-0420 (2019) Failure mode & effect analysis for improving data veracity and validity. In: Proceedings of the IEEE International Conference on Computing, Electronics & Communications Engineering 2019 (IEEE iCCECE '19). IEEE, pp. 100-105. ISBN 978-1728121383 (doi:10.1109/iCCECE46942.2019.8941849)

biofluid behavior

Xue, Xiangdong, Patel, Mayur K., Bailey, Chris ORCID: https://orcid.org/0000-0002-9438-3879, Kersaudy-Kerhoas, Maïwenn and Desmulliez, Marc P.Y. (2009) Parametrical modeling and design optimization of blood plasma separation device with microchannel mechanism. In: Electronic Components and Technology. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, 1970 -1976. ISBN 978-1-4244-4476-2 (doi:10.1109/ECTC.2009.5074291)

biofluid separation

Black Box

Hinojosa Herrera, Ana Elsa ORCID: https://orcid.org/0000-0002-0636-1881, Walshaw, Chris ORCID: https://orcid.org/0000-0003-0253-7779 and Bailey, Chris ORCID: https://orcid.org/0000-0002-9438-3879 (2020) Improving Black Box Classification Model Veracity for Electronics Anomaly Detection. In: 2020 15th IEEE Conference on Industrial Electronics and Applications (ICIEA). IEEE, pp. 1092-1097. ISBN 978-1728151694 ISSN 2156-2318 (Print), 2158-2297 (Online) (doi:10.1109/ICIEA48937.2020.9248258)

blood fluid separation

Xue, Xiangdong, Patel, Mayur K., Bailey, Chris ORCID: https://orcid.org/0000-0002-9438-3879 and Desmulliez, Marc P.Y. (2011) Geometrical optimisation of a biochip microchannel fluidic separator. Computer Methods in Biomechanics and Biomedical Engineering, 15 (9). pp. 981-991. ISSN 1025-5842 (Print), 1476-8259 (Online) (doi:10.1080/10255842.2011.569501)

blood plasma separation

bonding

Patil, Nishad, Das, Diganta, Yin, Chunyan ORCID: https://orcid.org/0000-0003-0298-0420, Lu, Hua ORCID: https://orcid.org/0000-0002-4392-6562, Bailey, Chris ORCID: https://orcid.org/0000-0002-9438-3879 and Pecht, Michael (2009) A fusion approach to IGBT power module prognostics. In: 10th International Conference on Thermal, Mechanical and Multi-Physics simulation and Experiments in Microelectronics and Microsystems, 2009. EuroSimE 2009. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 195-199. ISBN 9781424441600 (doi:10.1109/ESIME.2009.4938491)

buckling failure

butt joints

ceramic packaging

Warner, Matt, Parry, John, Bailey, Chris ORCID: https://orcid.org/0000-0002-9438-3879 and Lu, Hua ORCID: https://orcid.org/0000-0002-4392-6562 (2004) Solder life prediction in a thermal analysis software environment. In: The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena In Electronic Systems (ITHERM 2004) [Proceedings]. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 391-396. ISBN 0780383575 ISSN 1089-9870 (doi:10.1109/ITHERM.2004.1318309)

ceramics

CFD

Santhanakrishnan, Mani Sekara, Tilford, Tim ORCID: https://orcid.org/0000-0001-8307-6403 and Bailey, Chris ORCID: https://orcid.org/0000-0002-9438-3879 (2021) Multi-objective NSGA-II based shape optimisation of the cross-sectional shape of passively cooled heat sinks. International Journal of Numerical Methods for Heat and Fluid Flow, 32 (3). pp. 1025-1045. ISSN 0961-5539 (doi:10.1108/HFF-10-2020-0656)

Parry, John, Marooney, Chris, Warner, Matt, Bailey, Chris ORCID: https://orcid.org/0000-0002-9438-3879 and Pericleous, Koulis ORCID: https://orcid.org/0000-0002-7426-9999 (2002) An integrated approach to flow, thermal and mechanical modeling of electronics devices. In: ITHERM 2002. The Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems [Proceedings]. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, U.S.A., pp. 862-868. ISBN 0780371526 ISSN 1089-9870 (doi:10.1109/ITHERM.2002.1012545)

circuit reliability

Parry, John, Bailey, Chris ORCID: https://orcid.org/0000-0002-9438-3879 and Addison, Chris (2000) Multiphysics modelling for electronics design. In: ITherm Proceedings. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 86-93. ISBN 0780359127 ISSN 0189-9870 (doi:10.1109/ITHERM.2000.866175)

circuit simulation

circuit simulator

Shahjalal, Mohammad, Rishad Ahmed, MD, Lu, Hua ORCID: https://orcid.org/0000-0002-4392-6562, Bailey, Chris ORCID: https://orcid.org/0000-0002-9438-3879 and Forsyth, Andrew (2020) An analysis of the thermal interaction between components in power converter applications. IEEE Transactions on Power Electronics, 35 (9). pp. 9082-9094. ISSN 0885-8993 (Print), 1941-0107 (Online) (doi:10.1109/TPEL.2020.2969350)

Classification

coatings

composite properties

Stoyanov, Stoyan ORCID: https://orcid.org/0000-0001-6091-1226 and Bailey, Chris ORCID: https://orcid.org/0000-0002-9438-3879 (2022) Deep learning modelling for composite properties of PCB conductive layers. In: 2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE). Institute of Electrical and Electronics Engineers (IEEE), Piscataway, New Jersey, pp. 1-7. ISBN 978-1665458375 (doi:10.1109/EuroSimE54907.2022.9758885)

composite structures

Stoyanov, Stoyan ORCID: https://orcid.org/0000-0001-6091-1226, Mason, Peter and Bailey, Chris ORCID: https://orcid.org/0000-0002-9438-3879 (2010) Smeared shell modelling approach for structural analysis of heritage composite structures – An application to the Cutty Sark conservation. Computers & Structures, 88 (11-12). pp. 649-663. ISSN 0045-7949 (doi:10.1016/j.compstruc.2010.02.005)

compound semiconductors

Stoyanov, Stoyan ORCID: https://orcid.org/0000-0001-6091-1226 and Bailey, Chris (2023) Modeling Insights into the assembly challenges of focal plane arrays. IEEE Access. pp. 35207-35219. ISSN 2169-3536 (Online) (doi:10.1109/ACCESS.2023.3264806)

compression bonding simulation

computational fluid dynamics

Xue, Xiangdong, Patel, Mayur K., Bailey, Chris ORCID: https://orcid.org/0000-0002-9438-3879, Kersaudy-Kerhoas, Maïwenn and Desmulliez, Marc P.Y. (2008) Challenges in modelling biofluids in microchannels. In: 2nd Electronics System-Integration Technology Conference, 2008. ESTC 2008. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 287-292. ISBN 978-1-4244-2814-4 (Print) 978-1-4244-2813-7 (Online) (doi:10.1109/ESTC.2008.4684363)

computational fluid dynamics (CFD)

Dhinsa, Kulvir, Bailey, Chris ORCID: https://orcid.org/0000-0002-9438-3879 and Pericleous, Koulis ORCID: https://orcid.org/0000-0002-7426-9999 (2005) Investigation into the performance of turbulence models for fluid flow and heat transfer phenomena in electronic applications. IEEE Transactions on Components and Packaging Technologies, 28 (4). pp. 686-699. ISSN 1521-3331 (doi:10.1109/TCAPT.2005.859758)

computational modelling

Cross, Mark, Stoyanov, Stoyan ORCID: https://orcid.org/0000-0001-6091-1226, Mouchmov, Apostol, Lu, Hua ORCID: https://orcid.org/0000-0002-4392-6562, Croft, Nick, Slone, Avril, Williams, Alison, Bailey, Chris ORCID: https://orcid.org/0000-0002-9438-3879 and Pericleous, Koulis ORCID: https://orcid.org/0000-0002-7426-9999 (2003) Multi-physics-multi-scale simulation and optimisation: the next generation. In: NAFEMS World Congress, 2003, Orlando, Florida, USA.

computer aided conservation

computer based simulation

Shahjalal, Mohammad, Lu, Hua ORCID: https://orcid.org/0000-0002-4392-6562 and Bailey, Chris ORCID: https://orcid.org/0000-0002-9438-3879 (2014) A review of the computer based simulation of electro-thermal design of power electronics devices. In: 20th International Workshop on Thermal Investigations of ICs and Systems. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA. ISBN 9781479954155 (doi:10.1109/THERMINIC.2014.6972515)

computer modelling

Rosunally, Yasmine, Stoyanov, Stoyan ORCID: https://orcid.org/0000-0001-6091-1226, Bailey, Chris ORCID: https://orcid.org/0000-0002-9438-3879, Mason, Peter, Campbell, Sheelagh, Monger, George and Bell, Ian (2009) Development of a prognostics framework for the iron structural material of the s.v. Cutty Sark. In: Proceedings of Sixth International Conference on Condition Monitoring and Machinery Failure Prevention Technologies – CM/MFPT 2009. The British Institute of Non-Destructive Testing / Coxmoor Publishing, Northampton, UK, pp. 674-685.

condition monitoring

conductive layer

constriction effect

convection oven

convolutional neural network

copper

Lu, Hua ORCID: https://orcid.org/0000-0002-4392-6562 and Bailey, Chris ORCID: https://orcid.org/0000-0002-9438-3879 (2003) Modelling the performance of lead-Free solder interconnects for copper bumped flip-chip devices. In: ASME 2003 International Electronic Packaging Technical Conference and Exhibition. American Society of Mechanical Engineers, New York, USA, pp. 605-610. ISBN 0-7918-3690-8 (doi:10.1115/IPACK2003-35356)

copper pattern

crack detection

Ridout, Stephen, Dusek, Milos, Bailey, Chris ORCID: https://orcid.org/0000-0002-9438-3879 and Hunt, Chris (2004) Finite element modelling of crack detection tests. In: Proceedings of the 5th International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems EuroSimE 2004. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 141-146. ISBN 0780384202 (doi:10.1109/ESIME.2004.1304033)

creep

Rajaguru, Pushpa ORCID: https://orcid.org/0000-0002-6041-0517, Tilford, Tim ORCID: https://orcid.org/0000-0001-8307-6403, Bailey, Chris ORCID: https://orcid.org/0000-0002-9438-3879 and Stoyanov, Stoyan ORCID: https://orcid.org/0000-0001-6091-1226 (2023) Damage mechanics-based failure prediction of wirebond in power electronic module. IEEE Access. ISSN 2169-3536 (doi:10.1109/ACCESS.2023.3342689)

cross flow filtration

cross-flow filtration

Xue, Xiangdong, Patel, Mayur K., Kersaudy-Kerhoas, Maïwenn, Desmulliez, Marc P.Y., Bailey, Chris ORCID: https://orcid.org/0000-0002-9438-3879 and Topham, David (2012) Analysis of fluid separation in microfluidic T-channels. Applied Mathematical Modelling, 36 (2). pp. 743-755. ISSN 0307-904X (doi:10.1016/j.apm.2011.07.009)

curing

Cutty Sark

damage

Rajaguru, Pushpa ORCID: https://orcid.org/0000-0002-6041-0517, Lu, Hua ORCID: https://orcid.org/0000-0002-4392-6562 and Bailey, Chris ORCID: https://orcid.org/0000-0002-9438-3879 (2019) Time integration damage model for Sn3.5Ag solder interconnect in power electronic module. IEEE Transactions on Device and Materials Reliability, 19 (1). ISSN 1530-4388 (Print), 1558-2574 (Online) (doi:10.1109/TDMR.2019.2891949)

data analytics

Stoyanov, Stoyan ORCID: https://orcid.org/0000-0001-6091-1226, Ahsan, Mominuil and Bailey, Chris ORCID: https://orcid.org/0000-0002-9438-3879 (2018) Data analytics approach for optimal qualification testing of electronic components. In: Proceedings EuroSimE 2018. 2018 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) . IEEE Xplore, pp. 1-9. ISBN 978-1-5386-2358-9 (doi:10.1109/EuroSimE.2018.8369926)

data mining

Stoyanov, Stoyan ORCID: https://orcid.org/0000-0001-6091-1226, Ahsan, Mominul, Bailey, Chris ORCID: https://orcid.org/0000-0002-9438-3879, Wotherspoon, Tracy and Hunt, Craig (2019) Predictive analytics methodology for smart qualification testing of electronic components. Journal of Intelligent Manufacturing, 30 (3). pp. 1497-1514. ISSN 0956-5515 (Print), 1572-8145 (Online) (doi:10.1007/s10845-018-01462-9)

Musallam, Mahera, Johnson, C. Mark, Yin, Chunyan ORCID: https://orcid.org/0000-0003-0298-0420, Lu, Hua ORCID: https://orcid.org/0000-0002-4392-6562 and Bailey, Chris ORCID: https://orcid.org/0000-0002-9438-3879 (2008) Real-time life expectancy estimation in power modules. In: 2nd Electronics System Integration Technology Conference, Greenwich, UK. IEEE Conference Publications, 1 . Institute of Electrical and Electronics Engineers, Inc, Piscataway, NJ, USA, pp. 231-236. ISBN 978-1-4244-2813-7 (Print), 978-1-4244-2814-4 (Electronic) (doi:10.1109/ESTC.2008.4684355)

Data Validity

Data Veracity

data-driven prognostics

DC-DC converter

DC-DC power converter

Flynn, David, Lu, Hua ORCID: https://orcid.org/0000-0002-4392-6562, Bailey, Chris ORCID: https://orcid.org/0000-0002-9438-3879 and Desmulliez, Marc P.Y. (2008) Design, modeling and characterization of a microinductor for future DC-DC power converters. In: 2nd Electronics System-Integration Technology Conference, 2008. ESTC 2008. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 577-582. ISBN 978-1-4244-2814-4 (print), 978-1-4244-2813-7 (online) (doi:10.1109/ESTC.2008.4684414)

defects

deformation

Stoyanov, Stoyan ORCID: https://orcid.org/0000-0001-6091-1226, Tilford, Tim ORCID: https://orcid.org/0000-0001-8307-6403, Amalou, Farid, Cargill, Scott, Bailey, Chris ORCID: https://orcid.org/0000-0002-9438-3879 and Desmulliez, Marc (2011) Modelling and optimisation study on the fabrication of nano-structures using imprint forming process. Engineering Computations, 28 (1). pp. 93-111. ISSN 0264-4401 (doi:10.1108/02644401111097046)

degradation

design engineers

Bailey, Chris ORCID: https://orcid.org/0000-0002-9438-3879, Lu, Hua ORCID: https://orcid.org/0000-0002-4392-6562 and Yin, Chunyan ORCID: https://orcid.org/0000-0003-0298-0420 (2010) Modelling reliability of power electronics packaging. In: Proceedings of the ASME InterPack Conference 2009, IPACK2009. American Society of Mechanical Engineers, New York, USA, pp. 215-220. ISBN 9780791843604 (doi:10.1115/InterPACK2009-89430)

design for manufacture

Bailey, Chris ORCID: https://orcid.org/0000-0002-9438-3879, Lu, Hua ORCID: https://orcid.org/0000-0002-4392-6562, Yin, Chunyan and Tilford, Timothy (2008) Integrated reliability and prognostics prediction methodology for power electronic modules. In: IET Seminar on Aircraft Health Management for New Operational and Enterprise Solutions. IET Digest, 2008/1 . The Institution of Engineering and Technology, Stevenage, UK, pp. 1-39. ISBN 978-0-86341-936-2 ISSN 0537-9989 (doi:10.1049/ic:20080638)

Design for Reliability modelling

Stoyanov, Stoyan ORCID: https://orcid.org/0000-0001-6091-1226, Strusevitch, Nadia, Rizvi, Jahir, Georgel, Vincent, Yannou, Jean-Marc and Bailey, Chris ORCID: https://orcid.org/0000-0002-9438-3879 (2008) Design for reliability for wafer level system in package. In: 2nd Electronics System-Integration Technology Conference, 2008. ESTC 2008. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 293-298. ISBN 978-1-4244-2814-4 (Print), 978-1-4244-2813-7 (Online) (doi:10.1109/ESTC.2008.4684364)

design optimisation

design optimization

design process

Rajaguru, Pushpa ORCID: https://orcid.org/0000-0002-6041-0517, Stoyanov, Stoyan ORCID: https://orcid.org/0000-0001-6091-1226, Tang, Ying Kit, Bailey, Chris ORCID: https://orcid.org/0000-0002-9438-3879, Claverley, James, Leach, Richard and Topham, David (2010) Numerical modelling methodology for design of miniaturised integrated products - an application to 3D CMM micro-probe development. 2010 11th International Conference on Thermal, Mechanical and Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems, EuroSimE 2010. IEEE Computer Society, Piscataway NJ. ISBN 9781424470266 (doi:10.1109/ESIME.2010.5464573)

Design tools

design-for-reliability

device design

dielectric losses

dielectric materials

diffraction experiments

Hoo, Nick, Jackson, Gavin, Hendriksen, Mike, Lu, Hua ORCID: https://orcid.org/0000-0002-4392-6562, Durairaj, Rajkumar, Bailey, Chris ORCID: https://orcid.org/0000-0002-9438-3879, Ekere, Ndy and Wright, Jonathon (2004) In-situ synchrotron x-ray diffraction during melting and solidification of a lead-free solder paste. In: TMS 2004 133rd TMS Annual Meeting & Exhibition 2004, 14-18 Mar 2004, Charlotte, North Carolina, USA. (Unpublished)

dispersion

display

Bailey, Chris ORCID: https://orcid.org/0000-0002-9438-3879, Lu, Hua ORCID: https://orcid.org/0000-0002-4392-6562, Yin, Chunyan ORCID: https://orcid.org/0000-0003-0298-0420 and Lee, Yek (2010) Multi-physics modelling for packaging of liquid crystal displays in harsh environments. In: Electronics System Integration Technology Conference, ESTC 2010 - Proceedings. IEEE Computer Society, Piscataway, USA, pp. 1-6. ISBN 9781424485536 (Print), 9781424485543 (Online) (doi:10.1109/ESTC.2010.5642898)

ductility

electric-thermal

Evans, Paul, Castellazzi, Alberto, Johnson, C. Mark, Lu, Hua ORCID: https://orcid.org/0000-0002-4392-6562 and Bailey, Chris ORCID: https://orcid.org/0000-0002-9438-3879 (2014) The optimization of thermal performance in power electronics modules. In: 2014 15th International Conference on Electronic Packaging Technology. Institute of Electrical and Electronics, Inc., Piscataway, NJ, USA, pp. 734-739. ISBN 978-1-4799-4707-2 (doi:10.1109/ICEPT.2014.6922755)

electrical power

electro-thermal design

electro-thermal model

electrodeposition

Kaufmann, Jens, Desmulliez, Marc P.Y., Price, Dennis, Hughes, Mike, Strusevitch, Nadia and Bailey, Chris ORCID: https://orcid.org/0000-0002-9438-3879 (2008) Influence of megasonic agitation on the electrodeposition of high aspect ratio blind vias. 2nd Electronics System-Integration Technology Conference, 2008. ESTC 2008. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 1235-1240. ISBN 978-1-4244-2813-7 (doi:10.1109/ESTC.2008.4684530)

electromagnetic compatibility

electromagnetic heating

electromigration

Zhu, Xiao, Kotadia, Hiren, Xu, Sha, Lu, Hua ORCID: https://orcid.org/0000-0002-4392-6562, Mannan, Samjid, Bailey, Chris ORCID: https://orcid.org/0000-0002-9438-3879 and Chan, Yancheong (2013) Modelling electromigration for microelectronics design. Journal of Computational Science and Technology, 7 (2). pp. 251-264. ISSN 1881-6894 (doi:10.1299/jcst.7.251)

electronic applications

electronic components

electronic design automation

electronic package

Electronic Packaging

Rajaguru, Pushparajah ORCID: https://orcid.org/0000-0002-6041-0517, Ortiz-Gonzalez, Jose Angel, Lu, Hua ORCID: https://orcid.org/0000-0002-4392-6562, Bailey, Chris ORCID: https://orcid.org/0000-0002-9438-3879 and Alatise, Olawiwola (2017) A multiphysics modeling and experimental analysis of pressure contacts in power electronics applications. IEEE Transactions on Components, Packaging and Manufacturing Technology, 7 (6). pp. 893-900. ISSN 2156-3950 (Print), 2156-3985 (Online) (doi:10.1109/TCPMT.2017.2688021)

Stoyanov, Stoyan ORCID: https://orcid.org/0000-0001-6091-1226, Bailey, Chris ORCID: https://orcid.org/0000-0002-9438-3879 and Tourloukis, Georgios (2016) Similarity approach for reducing qualification tests of electronic components. Microelectronics Reliability, 67. pp. 111-119. ISSN 0026-2714 (doi:10.1016/j.microrel.2016.10.017)

Shishido, Nobuyuki, Kanno, Toshifumi, Kawahara, Shinya, Ikeda, Toru, Miyazaki, Noriyuki, Lu, Hua ORCID: https://orcid.org/0000-0002-4392-6562, Bailey, Chris ORCID: https://orcid.org/0000-0002-9438-3879, Thomas, Owen, Di Maio, Davide and Hunt, Chris (2010) An analysis of local deformation of SnAgCu solder joint using digital image correlation. In: Proceedings - 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2010. Association for Computing Machinery, New York, pp. 376-381. ISBN 9781424481408 (doi:10.1109/ICEPT.2010.5582845)

Electronics Manufacturing

Electronics packaging

electronics product qualification

electroplating

Strusevich, Nadia, Bailey, Chris ORCID: https://orcid.org/0000-0002-9438-3879, Costello, Suzanne, Patel, Mayur and Desmulliez, Marc (2013) Numerical modeling of the electroplating process for microvia fabrication. In: 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2013. Institute of Electrical and Electronics Engineers, Piscataway, NJ, USA. ISBN 9781467361385 (doi:10.1109/EuroSimE.2013.6529989)

electrothermal design

encapsulation

engineering design

Santhanakrishnan, Mani sekaran, Tilford, Tim ORCID: https://orcid.org/0000-0001-8307-6403 and Bailey, Chris ORCID: https://orcid.org/0000-0002-9438-3879 (2019) Multi-material heatsink design using level-set topology optimization. IEEE Transactions on Components, Packaging and Manufacturing Technology, 9 (8). pp. 1504-1513. ISSN 2156-3950 (Print), 2156-3985 (Online) (doi:10.1109/TCPMT.2019.2929017)

European Synchrotron Radiation Facility (ESRF)

Jackson, Gavin J., Lu, Hua ORCID: https://orcid.org/0000-0002-4392-6562, Durairaj, Raj, Hoo, Nick, Bailey, Chris ORCID: https://orcid.org/0000-0002-9438-3879, Ekere, Ndy N. and Wright, Jon (2004) Intermetallic phase detection in lead-free solders using synchrotron X-ray diffraction. Journal of Electronic Materials, 33 (12). pp. 1524-1529. ISSN 0361-5235 (Print), 1543-186X (Online) (doi:10.1007/s11664-004-0094-x)

failure

Kamara, Elisha, Lu, Hua ORCID: https://orcid.org/0000-0002-4392-6562, Bailey, Chris ORCID: https://orcid.org/0000-0002-9438-3879, Hunt, Chris, Di Maio, Davide and Thomas, Owen (2010) Computer simulation and design of a solder joint vibration test machine. In: 2010 11th International Conference on Thermal, Mechanical and Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems, EuroSimE 2010. IEEE Conference Publications . Institute of Electrical and Electronic Engineers, Inc., Piscataway, NJ, USA. ISBN 978-1-4244-7026-6 (doi:10.1109/ESIME.2010.5464587)

Failure analysis

Stoyanov, Stoyan ORCID: https://orcid.org/0000-0001-6091-1226, Bailey, Chris ORCID: https://orcid.org/0000-0002-9438-3879, Roulston, John, Stewart, Paul and Tollafield, Peter (2014) Study of impact of thermal refinishing process on reliability of COTS components. In: 20th International Workshop on Thermal Investigations of ICs and Systems. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA. ISBN 9781479954155 (doi:10.1109/THERMINIC.2014.6972531)

Alam, M.O., Lu, Hua ORCID: https://orcid.org/0000-0002-4392-6562, Bailey, Chris ORCID: https://orcid.org/0000-0002-9438-3879 and Chan, Y.C (2009) Finite-element simulation of stress intensity factors in solder joint intermetallic compounds. IEEE Transactions on Device and Materials Reliability, 9 (1). pp. 40-48. ISSN 1530-4388 (doi:10.1109/TDMR.2008.2010595)

failure based reliability

failure mechanisms

fatigue

fatigue failure

FEA

feature engineering

Feature Selection

Finite Element

finite element analysis

Yin, Chunyan ORCID: https://orcid.org/0000-0003-0298-0420, Lu, Hua ORCID: https://orcid.org/0000-0002-4392-6562, Bailey, Chris ORCID: https://orcid.org/0000-0002-9438-3879 and Chan, Yan-Cheong (2004) Effects of solder reflow on the reliability of flip-chip on flex interconnections using anisotropic conductive adhesives. IEEE Transactions on Electronics Packaging Manufacturing, 27 (4). pp. 254-259. ISSN 1521-334X (doi:10.1109/TEPM.2004.843152)

Finite Element Analysis (FEA)

Finite Element Method (FEM)

Hassan, Sheikh ORCID: https://orcid.org/0000-0002-6215-7340, Rajaguru, Pushparajah ORCID: https://orcid.org/0000-0002-6041-0517, Stoyanov, Stoyan ORCID: https://orcid.org/0000-0001-6091-1226, Bailey, Chris and Tilford, Timothy ORCID: https://orcid.org/0000-0001-8307-6403 (2024) Coupled thermal-mechanical analysis of power electronic modules with finite element method and parametric model order reduction. Power Electronic Devices and Components:100063. ISSN 2772-3704 (Online) (doi:10.1016/j.pedc.2024.100063)

finite element modeling

flip chip technology

flip-chip devices

Yin, Chunyan ORCID: https://orcid.org/0000-0003-0298-0420, Lu, Hua ORCID: https://orcid.org/0000-0002-4392-6562, Bailey, Chris ORCID: https://orcid.org/0000-0002-9438-3879 and Chan, Yan-Cheong (2004) Effects of solder reflow on the reliability of flip-chip on flex interconnections using anisotropic conductive adhesives. IEEE Transactions on Electronics Packaging Manufacturing, 27 (4). pp. 254-259. ISSN 1521-334X (doi:10.1109/TEPM.2004.843152)

Flotherm XT

flow behaviour

flow fields

fluid flow

fluid separator

FMEA

Focal Plane Array

focused ion beam

Narania, Sailesh, Eshahawi, Tarek, Gindy, Nabil, Tang, Ying Kit, Stoyanov, Stoyan ORCID: https://orcid.org/0000-0001-6091-1226, Ridout, Stephen and Bailey, Chris ORCID: https://orcid.org/0000-0002-9438-3879 (2008) Risk mitigation framework for a robust design process. In: 2nd Electronics System-Integration Technology Conference, 2008. ESTC 2008. IEEE Conference Publications . Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 1075-1080. ISBN 978-1-4244-2814-4 (Print), 978-1-4244-2813-7 (Online) (doi:10.1109/ESTC.2008.4684501)

fracture mechanics

frequency

fusion approach

genetic algorithm

Geologic Measurements

Blanche, Jamie, Flynn, David, Lewis, Helen, Couples, Gary, Buckman, Jim, Bailey, Chris ORCID: https://orcid.org/0000-0002-9438-3879 and Tilford, Timothy ORCID: https://orcid.org/0000-0001-8307-6403 (2018) Analysis of sandstone pore space fluid saturation and mineralogy variation via application of monostatic K-band frequency modulated continuous wave radar. IEEE Access, 6. pp. 44376-44389. ISSN 2169-3536 (Online) (doi:10.1109/ACCESS.2018.2863024)

heat sink

Rajaguru, Pushparajah ORCID: https://orcid.org/0000-0002-6041-0517, Santhanakrishnan, Manisekaran, Tilford, Tim ORCID: https://orcid.org/0000-0001-8307-6403 and Bailey, Chris ORCID: https://orcid.org/0000-0002-9438-3879 (2019) Design of additively manufactured heatsinks for power electronics thermal management using adjoint level-set topology optimization. In: 2019 25th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC). IEEE. ISBN 978-1728120782 ISSN 2474-1515 (Print), 2474-1523 (Online) (doi:10.1109/THERMINIC.2019.8923530)

heat sink design

heat transfer

high density interconnection technology

hot solder dip

Yin, Chunyan ORCID: https://orcid.org/0000-0003-0298-0420, Best, Chris, Bailey, Chris ORCID: https://orcid.org/0000-0002-9438-3879 and Stoyanov, Stoyan ORCID: https://orcid.org/0000-0001-6091-1226 (2015) Statistical analysis of the impact of refinishing process on leaded components. Microelectronics Reliability, 55 (2). pp. 424-431. ISSN 0026-2714 (doi:10.1016/j.microrel.2014.11.001)

hot solder dip process

Stoyanov, Stoyan ORCID: https://orcid.org/0000-0001-6091-1226, Bailey, Chris ORCID: https://orcid.org/0000-0002-9438-3879, Alam, M.O., Yin, Chunyan ORCID: https://orcid.org/0000-0003-0298-0420, Best, Chris, Tollafield, Peter, Crawford, Rob, Parker, Mike and Scott, Jim (2013) Modelling methodology for thermal analysis of hot solder dip process. Microelectronics Reliability, 53 (8). pp. 1055-1067. ISSN 0026-2714 (doi:10.1016/j.microrel.2013.02.018)

IGBT module

IGBT power module

indium joints

industrial partners

inkjet printing

insulated gate bipolar transistors

integrated circuit interconnections

Yin, Chunyan ORCID: https://orcid.org/0000-0003-0298-0420, Lu, Hua ORCID: https://orcid.org/0000-0002-4392-6562, Bailey, Chris ORCID: https://orcid.org/0000-0002-9438-3879 and Chan, Yan-Cheong (2004) Effects of solder reflow on the reliability of flip-chip on flex interconnections using anisotropic conductive adhesives. IEEE Transactions on Electronics Packaging Manufacturing, 27 (4). pp. 254-259. ISSN 1521-334X (doi:10.1109/TEPM.2004.843152)

integrated circuit modelling

integrated circuit reliability

Yin, Chunyan ORCID: https://orcid.org/0000-0003-0298-0420, Lu, Hua ORCID: https://orcid.org/0000-0002-4392-6562, Bailey, Chris ORCID: https://orcid.org/0000-0002-9438-3879 and Chan, Yan-Cheong (2004) Effects of solder reflow on the reliability of flip-chip on flex interconnections using anisotropic conductive adhesives. IEEE Transactions on Electronics Packaging Manufacturing, 27 (4). pp. 254-259. ISSN 1521-334X (doi:10.1109/TEPM.2004.843152)

integrated optoelectronics

intelligent manufacturing

intermetallic

intermetallic compound

intermetallic compounds (IMCs)

IR detectors

isothermal fatigue test

Ridout, Stephen, Dusek, Milos, Bailey, Chris ORCID: https://orcid.org/0000-0002-9438-3879 and Hunt, Chris (2005) Modeling and experiments on an isothermal fatigue test for solder joints. In: Proceedings of the 6th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2005. EuroSimE 2005. IEEE, Piscataway, NJ, USA, pp. 478-482. ISBN 0-7803-9062-8 (doi:10.1109/ESIME.2005.1502852)

KNN

Kriging

Rajaguru, Pushparajah ORCID: https://orcid.org/0000-0002-6041-0517, Lu, Hua ORCID: https://orcid.org/0000-0002-4392-6562 and Bailey, Chris ORCID: https://orcid.org/0000-0002-9438-3879 (2015) Sintered silver finite element modelling and reliability based design optimisation in power electronic module. Microelectronics Reliability, 55 (6). pp. 919-930. ISSN 0026-2714 (doi:10.1016/j.microrel.2015.03.011)

Rajaguru, Pushparajah ORCID: https://orcid.org/0000-0002-6041-0517, Lu, Hua ORCID: https://orcid.org/0000-0002-4392-6562 and Bailey, Chris ORCID: https://orcid.org/0000-0002-9438-3879 (2012) Application of Kriging and radial basis function in power electronic module wire bond structure reliability under various amplitude loading. International Journal of Fatigue, 45. pp. 61-70. ISSN 0142-1123 (doi:10.1016/j.ijfatigue.2012.06.013)

lead

Djambazov, George Stefanov ORCID: https://orcid.org/0000-0001-8812-1269, Bailey, Chris ORCID: https://orcid.org/0000-0002-9438-3879, Patel, Mayur K. and Shrimpton, Jennifer (2004) Numerical simulation of vacuum dezincing of lead alloy. In: TMS 2004 133rd TMS Annual Meeting & Exhibition 2004, 14-18 Mar 2004, Charlotte, North Carolina, USA. (Unpublished)

lead-free

lead-free solder

lead-free solders

leaded component

LEDs

level-set method

life cycle costing

life estimation

life prediction

Rajaguru, Pushparajah ORCID: https://orcid.org/0000-0002-6041-0517, Lu, Hua ORCID: https://orcid.org/0000-0002-4392-6562 and Bailey, Chris ORCID: https://orcid.org/0000-0002-9438-3879 (2012) Application of Kriging and radial basis function in power electronic module wire bond structure reliability under various amplitude loading. International Journal of Fatigue, 45. pp. 61-70. ISSN 0142-1123 (doi:10.1016/j.ijfatigue.2012.06.013)

light emitting diodes

liquid crystal displays

lLifetime estimation

longitudinal bending

machine learning

manufacturing process

manufacturing systems

mapping

mechanical testing printed circuit testing

Medway Queen

megasonic acoustic streaming

Megasonic Agitation

Jones, Thomas D.A., Flynn, David, Desmulliez, Marc P.Y., Price, Dennis, Beadel, Matthew, Strusevich, Nadia, Patel, Mayur, Bailey, Chris ORCID: https://orcid.org/0000-0002-9438-3879 and Costello, Suzanne (2016) Morphology and acoustic artefacts of copper deposits electroplated using megasonic assisted agitation. Circuit World, 42 (3). pp. 127-140. ISSN 0305-6120 (doi:10.1108/CW-03-2016-0006)

mesh generation

metals

micro-probe

Stoyanov, Stoyan ORCID: https://orcid.org/0000-0001-6091-1226, Rajaguru, Pushpa ORCID: https://orcid.org/0000-0002-6041-0517, Tang, Ying Kit, Bailey, Chris ORCID: https://orcid.org/0000-0002-9438-3879, Claverley, James and Leach, Richard (2010) Reduced order modelling for risk mitigation in design of miniaturised/integrated products. In: ISSE 2010 - 33rd International Spring Seminar on Electronics Technology: Polymer Electronics and Nanotechnologies: Towards System Integration - Conference Proceedings. IEEE Computer Society, Piscataway, USA, pp. 402-407. ISBN 9781424478491 (print), 9781424478507 (online) (doi:10.1109/ISSE.2010.5547362)

microchannel device

microelectronics

microelectronics fabrication

microelectronics packaging

microfluidic device

microfluidics

microinductor

microsystems

Rajaguru, Pushparajah ORCID: https://orcid.org/0000-0002-6041-0517, Lu, Hua ORCID: https://orcid.org/0000-0002-4392-6562 and Bailey, Chris ORCID: https://orcid.org/0000-0002-9438-3879 (2012) Application of Kriging and radial basis function in power electronic module wire bond structure reliability under various amplitude loading. International Journal of Fatigue, 45. pp. 61-70. ISSN 0142-1123 (doi:10.1016/j.ijfatigue.2012.06.013)

Stoyanov, Stoyan ORCID: https://orcid.org/0000-0001-6091-1226, Rajaguru, Pushpa ORCID: https://orcid.org/0000-0002-6041-0517 and Bailey, Chris ORCID: https://orcid.org/0000-0002-9438-3879 (2010) Reduced order modelling for reliability optimisation of advanced micro-systems. In: EngOpt2010 2nd International Conference on Engineering Optimization. International Conference on Engineering Optimization (2). EngOpt2010, pp. 1-10.

microvia fabrication

microvias

microwave curing

microwave devices

microwave ovens

Microwave Propagation

minium wires

model order reduction

Rajaguru, Pushpa ORCID: https://orcid.org/0000-0002-6041-0517, Lu, Hua ORCID: https://orcid.org/0000-0002-4392-6562, Bailey, Chris ORCID: https://orcid.org/0000-0002-9438-3879 and Bella, Martina (2020) Modelling and analysis of vibration on power electronic module structure and application of model order reduction. Microelectronics Reliability, 110:113697. ISSN 0026-2714 (doi:10.1016/j.microrel.2020.113697)

Model Order Reduction (MOR)

modeling

modelling

Rawal, Aditi ORCID: https://orcid.org/0000-0001-6546-8577, Mason, Peter, Stoyanov, Stoyan ORCID: https://orcid.org/0000-0001-6091-1226, Bailey, Chris and Huber, Jurgen (2024) A prognostic and health management approach using colour fade to determine the condition of silk in a museum display environment. Journal of the Institute of Conservation. pp. 1-20. ISSN 1945-5224 (Print), 1945-5232 (Online) (doi:10.1080/19455224.2024.2347202)

modelling and simulation

modelling biofluids

modelling methodology

modelling tools

modules

moisture

morphology

Multi-objective optimization

Nwanoro, Kenneth, Lu, Hua ORCID: https://orcid.org/0000-0002-4392-6562, Yin, Chunyan ORCID: https://orcid.org/0000-0003-0298-0420 and Bailey, Chris ORCID: https://orcid.org/0000-0002-9438-3879 (2018) An analysis of the reliability and design optimization of aluminium ribbon bonds in power electronics modules using computer simulation method. Microelectronics Reliability, 87. pp. 1-14. ISSN 0026-2714 (doi:10.1016/j.microrel.2018.05.013)

multi-physics

multi-scale simulations

multichip modules

multiphysics

Multiphysics modelling

nanotechnology

natural convection

Nitrogen

Non-Destructive Testing

non-invasive and non-destructive methodology

novel micro-integrated products

numerical analysis

numerical modelling

numerical software

NXP

open-ended oven

optimisation

optimization

Stoyanov, Stoyan ORCID: https://orcid.org/0000-0001-6091-1226, Bailey, Chris ORCID: https://orcid.org/0000-0002-9438-3879 and Desmulliez, Marc (2009) Optimisation modelling for thermal fatigue reliability of lead-free interconnects in fine-pitch flip-chip packaging. Soldering & Surface Mount Technology, 21 (1). pp. 11-24. ISSN 0954-0911 (doi:10.1108/09540910910928265)

packaging

Lu, Hua ORCID: https://orcid.org/0000-0002-4392-6562, Bailey, Chris ORCID: https://orcid.org/0000-0002-9438-3879 and Yin, Chunyan ORCID: https://orcid.org/0000-0003-0298-0420 (2009) Design for reliability of power electronics modules. Microelectronics Reliability, 49 (9-11). pp. 1250-1255. ISSN 0026-2714 (doi:10.1016/j.microrel.2009.07.055)

parameters

parametric Model Order Reduction (pMOR)

particle liquid separation

Particle Swarm Optimisation

pb-free

PCB

Permittivity

physics-of-failure

Yin, Chunyan ORCID: https://orcid.org/0000-0003-0298-0420, Lu, Hua ORCID: https://orcid.org/0000-0002-4392-6562, Musallam, Mahera, Bailey, Chris ORCID: https://orcid.org/0000-0002-9438-3879 and Johnson, C. Mark (2010) Prognostic reliability analysis of power electronics modules. International Journal of Performability Engineering, 6 (5):10. pp. 513-524. ISSN 0973-1318

plasma blood separation

plastic deformation

plating rate

PoF

polymers

power converters

power cycling

power electronic module

Rajaguru, Pushparajah ORCID: https://orcid.org/0000-0002-6041-0517, Lu, Hua ORCID: https://orcid.org/0000-0002-4392-6562 and Bailey, Chris ORCID: https://orcid.org/0000-0002-9438-3879 (2012) Application of Kriging and radial basis function in power electronic module wire bond structure reliability under various amplitude loading. International Journal of Fatigue, 45. pp. 61-70. ISSN 0142-1123 (doi:10.1016/j.ijfatigue.2012.06.013)

power electronic modules

Power electronics

power electronics components

power electronics devices

Power Electronics Module (PEM)

power module

power module components

power modules

predictive models

Press-Pack

Ortiz Gonzalez, Jose, Alatise, Olayiwola, Aliyu, Attahir, Rajaguru, Pushparajah ORCID: https://orcid.org/0000-0002-6041-0517, Castellazzi, Alberto, Ran, Li, Mawby, Philip and Bailey, Chris ORCID: https://orcid.org/0000-0002-9438-3879 (2017) Evaluation of SiC Schottky diodes using pressure contacts. IEEE Transactions on Industrial Electronics, 64 (10). 8213 -8223. ISSN 0278-0046 (Print), 1557-9948 (Online) (doi:10.1109/TIE.2017.2677348)

Press-Pack assembly

printed circuit board

Printed Circuit Board Fabrication

printed circuit board reflow

printed circuit boards

printed circuit design

probabilistic optimisation

process efficiency

product reliability

prognostic

prognostic methods

prognostics

prognostics and health management

prognostics framework

prognostics modelling

prognostics prediction methodology

prototypes

Quad Flat Package

Quality Assurance

quality control

Radar Applications

Radar Measurements

radial basis

Rajaguru, Pushparajah ORCID: https://orcid.org/0000-0002-6041-0517, Lu, Hua ORCID: https://orcid.org/0000-0002-4392-6562 and Bailey, Chris ORCID: https://orcid.org/0000-0002-9438-3879 (2012) Application of Kriging and radial basis function in power electronic module wire bond structure reliability under various amplitude loading. International Journal of Fatigue, 45. pp. 61-70. ISSN 0142-1123 (doi:10.1016/j.ijfatigue.2012.06.013)

redistribution layer

reduced order models

Rajaguru, Pushparajah ORCID: https://orcid.org/0000-0002-6041-0517, Lu, Hua ORCID: https://orcid.org/0000-0002-4392-6562 and Bailey, Chris ORCID: https://orcid.org/0000-0002-9438-3879 (2012) Application of Kriging and radial basis function in power electronic module wire bond structure reliability under various amplitude loading. International Journal of Fatigue, 45. pp. 61-70. ISSN 0142-1123 (doi:10.1016/j.ijfatigue.2012.06.013)

refinishing

reflow self-alignment modeling

reflow soldering

Yin, Chunyan ORCID: https://orcid.org/0000-0003-0298-0420, Lu, Hua ORCID: https://orcid.org/0000-0002-4392-6562, Bailey, Chris ORCID: https://orcid.org/0000-0002-9438-3879 and Chan, Yan-Cheong (2004) Effects of solder reflow on the reliability of flip-chip on flex interconnections using anisotropic conductive adhesives. IEEE Transactions on Electronics Packaging Manufacturing, 27 (4). pp. 254-259. ISSN 1521-334X (doi:10.1109/TEPM.2004.843152)

reliability

reliability assessment

reliability prediction techniques

reliability testing

remaining life

remaining useful life

residual stress

resistors

risk analysis

risk management

risk mitigation

semiconductor technology

sensitivity analysis

shape optimisation

ship modelling

shunt

Silicon Carbide

silk colour fade

simulation

smart qualification testing

smart test

smeared shell approach

solder

solder interconnect

solder joint

solder joint failure

solder joints

soldering

solders

statistical hypothesis testing

Statistics

Stepwise

strain

strain measurement

strain on solder joints

stress analysis

stress intensity factor

surface morphology

surface mount technology

surface topography

surface treatment

synchrotron

system-in-package

System-in-Package (SiP) structures

T-microchannel device

techniques

temperature

Test Limits Optimisation

thermal analysis

thermal cycles

Thermal cycling

thermal degradation

thermal diffusivity

thermal expansion

Yin, Chunyan ORCID: https://orcid.org/0000-0003-0298-0420, Lu, Hua ORCID: https://orcid.org/0000-0002-4392-6562, Bailey, Chris ORCID: https://orcid.org/0000-0002-9438-3879 and Chan, Yan-Cheong (2004) Effects of solder reflow on the reliability of flip-chip on flex interconnections using anisotropic conductive adhesives. IEEE Transactions on Electronics Packaging Manufacturing, 27 (4). pp. 254-259. ISSN 1521-334X (doi:10.1109/TEPM.2004.843152)