Coatings, Analytical models, Integrated circuit modeling, Solid modeling, Materials reliability

Yin, Chunyan ORCID: 0000-0003-0298-0420 , Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Bailey, Christopher ORCID: 0000-0002-9438-3879 and Stewart, Paul (2017) Modelling the impact of conformal coating penetration on QFN reliability. In: 2017 18th International Conference on Electronic Packaging Technology (ICEPT). IEEE, pp. 1021-1026. ISBN 978-1-5386-2973-4 (doi:https://doi.org/10.1109/ICEPT.2017.8046616)

Electrothermal models; Life consumption; Mission profile; Physics of failure; Power electronics; real time

Musallam, Mahera, Yin, Chunyan ORCID: 0000-0003-0298-0420 , Bailey, Christopher ORCID: 0000-0002-9438-3879 and Johnson, Mark (2014) Mission profile-based reliability design and real-time life consumption estimation in power electronics. IEEE Transactions on Power Electronics, 30 (5). pp. 2601-2613. ISSN 0885-8993 (Print), 1941-0107 (Online) (doi:https://doi.org/10.1109/TPEL.2014.2358555)

FMEA, feature engineering, big data, data veracity, data validity, electronics manufacturing

Hinojosa Herrera, Ana Elsa ORCID: 0000-0002-0636-1881 , Walshaw, Chris ORCID: 0000-0003-0253-7779 , Bailey, Chris ORCID: 0000-0002-9438-3879 and Yin, Chunyan ORCID: 0000-0003-0298-0420 (2019) Failure mode & effect analysis for improving data veracity and validity. In: Proceedings of the IEEE International Conference on Computing, Electronics & Communications Engineering 2019 (IEEE iCCECE '19). IEEE, pp. 100-105. ISBN 978-1728121383 (doi:https://doi.org/10.1109/iCCECE46942.2019.8941849)

Hot Solder Dip, (HSD), electronic components, Quad Flat Package, (QFP)

Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Best, Chris, Yin, Chunyan ORCID: 0000-0003-0298-0420 , Alam, M.O., Bailey, Chris ORCID: 0000-0002-9438-3879 and Tollafield, Peter (2012) Experimental and modelling study on the effects of refinishing lead-free microelectronic components. In: 2012 4th Electronic System-Integration Technology Conference (ESTC). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA. ISBN 9781467346450 (doi:https://doi.org/10.1109/ESTC.2012.6542213)

IGBT power modules, rainflow algorithm, recursive algorithm, compact thermal models,

Musallam, M., Johnson, C.M., Yin, Chunyan ORCID: 0000-0003-0298-0420 , Bailey, Christopher ORCID: 0000-0002-9438-3879 and Mermet-Guyennet, M. (2010) Real-time life consumption power modules prognosis using on-line rainflow algorithm in metro applications. In: Energy Conversion Congress and Exposition (ECCE), 2010 IEEE. IEEE Xplore Digital Library, Atlanta GA, pp. 970-977. ISBN 978-1-4244-5286-6 (print) ISSN 978-1-4244-5287-3 (online) (doi:https://doi.org/10.1109/ECCE.2010.5617883)

Numerical methods, layered structures, plastic strain.

Nwanoro, Kenneth C., Lu, Hua ORCID: 0000-0002-4392-6562 , Yin, Chunyan ORCID: 0000-0003-0298-0420 and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2018) An approximate numerical method for the prediction of plastic strain in layered structures. In: 2018 7th Electronic System-Integration Technology Conference (ESTC 2018). IEEE, pp. 181-187. ISBN 978-1538668153

Numerical software, Mapping, Thermo-mechanical analysis, Power cycling, FEA, CFD, ANSYS, Flotherm XT

Nwanoro, Kenneth C., Lu, Hua ORCID: 0000-0002-4392-6562 , Yin, Chunyan ORCID: 0000-0003-0298-0420 and Bailey, Chris ORCID: 0000-0002-9438-3879 (2018) Using FloTHERM XT and ANSYS workbench to perform Thermo-Mechanical analysis. Engineering Edge. (In Press)

Offshore renewable energy; Subsea cables; degradation; prognostics; life expectancy; abrasion; wear; corrosion; scour

Bailey, Christopher ORCID: 0000-0002-9438-3879 , Yin, Chunyan ORCID: 0000-0003-0298-0420 and Rajaguru, Pushparajah ORCID: 0000-0002-6041-0517 (2019) Predicting damage and life expectancy of subsea power cables in offshore renewable energy applications. IEEE ACCESS, 7. pp. 54658-54669. ISSN 2169-3536 (Online) (doi:https://doi.org/10.1109/ACCESS.2019.2911260)

Power Electronic Module (PEM), predictive reliability, risk assessment

Bailey, C. ORCID: 0000-0002-9438-3879 , Lu, H. ORCID: 0000-0002-4392-6562 , Yin, C. ORCID: 0000-0003-0298-0420 and Ridout, S. (2008) Predictive reliability, prognostics and risk assessment for power modules. CIPS 2008: 5th International Conference on Integrated Power Electronics Systems. Proceedings, March, 11-13, 2008 Nuremberg/Germany. ETG-Fachbericht (111). VDE Verlag GmbH, Berlin-Offenbach, Germany, pp. 19-26. ISBN 9783800730896

Power electronics, IGBT, Numerical simulation, CFD, FEA, Reliability

Nwanoro, Kenneth Chimezie, Lu, Hua ORCID: 0000-0002-4392-6562 , Yin, Chunyan ORCID: 0000-0003-0298-0420 and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2018) Numerical simulation of the junction temperature, the coolant flow rate and the reliability of an IGBT module. In: 2018 24th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC 2018). IEEE, pp. 250-255. ISBN 978-1538667606

Power electronics, reliability, finite element analysis, wire/ribbon bond

Nwanoro, Kenneth Chimezie, Lu, Hua ORCID: 0000-0002-4392-6562 , Yin, Chunyan ORCID: 0000-0003-0298-0420 and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2017) Computer simulation of the reliability of wire bonds and ribbon bonds in power electronics modules. In: 2017 23rd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC). IEEE, pp. 1-6. ISBN 978-1-5386-1929-2 ISSN 2474-1523 (Online) (doi:https://doi.org/10.1109/THERMINIC.2017.8233827)

QFN, conformal coating, reliability, finite element analysis, thermal cycling

Yin, Chunyan ORCID: 0000-0003-0298-0420 , Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Bailey, Christopher ORCID: 0000-0002-9438-3879 and Stewart, Paul (2019) Thermo-mechanical analysis of conformally coated QFNs for high reliability applications. IEEE Transactions on Components, Packaging and Manufacturing Technology, 9 (11). pp. 2210-2218. ISSN 2156-3950 (Print), 2156-3985 (Online) (doi:https://doi.org/10.1109/TCPMT.2019.2925874)

Reliability, Wire/ribbon bond, Power electronics, Power cycling, Thermal cycling, Multi-objective optimization

Nwanoro, Kenneth, Lu, Hua ORCID: 0000-0002-4392-6562 , Yin, Chunyan ORCID: 0000-0003-0298-0420 and Bailey, Chris ORCID: 0000-0002-9438-3879 (2018) An analysis of the reliability and design optimization of aluminium ribbon bonds in power electronics modules using computer simulation method. Microelectronics Reliability, 87. pp. 1-14. ISSN 0026-2714 (doi:https://doi.org/10.1016/j.microrel.2018.05.013)

adhesive bonding, contact resistance, finite element, analysis, flip-chip devices, integrated circuit, interconnections, integrated circuit reliability, reflow soldering

Yin, C.Y. ORCID: 0000-0003-0298-0420 , Lu, H. ORCID: 0000-0002-4392-6562 , Bailey, C. ORCID: 0000-0002-9438-3879 and Chan, Y.C. (2004) Effects of reflow process on the reliability of flip chip on flex interconnections using anisotropic conductive adhesives. In: 2004 International IEEE Conference on Asian Green Electronics (AGEC) [Proceedings]. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 240-245. ISBN 0-7803-8203-X (doi:https://doi.org/10.1109/AGEC.2004.1290912)

adhesives, anisotropic media, finite element analysis, flip-chip devices, integrated circuit interconnections, integrated circuit reliability, reflow soldering, thermal expansion

Yin, Chunyan ORCID: 0000-0003-0298-0420 , Lu, Hua ORCID: 0000-0002-4392-6562 , Bailey, Chris ORCID: 0000-0002-9438-3879 and Chan, Yan-Cheong (2004) Effects of solder reflow on the reliability of flip-chip on flex interconnections using anisotropic conductive adhesives. IEEE Transactions on Electronics Packaging Manufacturing, 27 (4). pp. 254-259. ISSN 1521-334X (doi:https://doi.org/10.1109/TEPM.2004.843152)

anisotropic conductive film (ACF), moisture absorption, flip chip on flex

Yin, C.Y. ORCID: 0000-0003-0298-0420 , Lu, H. ORCID: 0000-0002-4392-6562 , Bailey, C. ORCID: 0000-0002-9438-3879 and Chan, Y.C. (2013) Effects of moisture absorption on anisotropic conductive films interconnection for flip chip on flex applications. Microelectronic Engineering, 107. pp. 17-22. ISSN 0167-9317 (doi:https://doi.org/10.1016/j.mee.2013.02.070)

anisotropic conductive film, (ACF), moisture, flip chip technology

Yin, Chunyan ORCID: 0000-0003-0298-0420 , Lu, Hua ORCID: 0000-0002-4392-6562 , Bailey, Chris ORCID: 0000-0002-9438-3879 and Chan, Yan-Cheong (2005) Moisture effects on the reliability of ACF interconnections. Electronics World, 111 (1836). pp. 20-24. ISSN 1365-4675

anisotropic conductive film, ACF, mathematical modelling, modelling analysis, finite element analysis, FEA, electronics, manufactures, technology

Yin, Chunyan ORCID: 0000-0003-0298-0420 (2006) Experimental and modelling analysis on the performance of anisotropic conductive films as used in electronics packaging. PhD thesis, University of Greenwich.

anisotropic conductive films, anisotropic magnetoresistance, assembly, conductive adhesives, contact resistance, flip chip, polymer films, semiconductor device modeling, stress, temperature

Yin, C.Y. ORCID: 0000-0003-0298-0420 , Lu, H. ORCID: 0000-0002-4392-6562 , Bailey, C. ORCID: 0000-0002-9438-3879 and Chan, Y.C. (2003) Experimental and modeling analysis of the reliability of the anisotropic conductive films. In: 2003 Proceedings 53rd Electronic Components & Technology Conference. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 698-702. ISBN 0780377915 ISSN 0569-5503 (doi:https://doi.org/10.1109/ECTC.2003.1216359)

backlight units, design environment, finite element analysis, human vision models, junction temperatures, just-noticeable difference, key parameters, LED backlighting devices , multi-disciplinary analysis, multi-physics, optical performance, optical simulation, ray tracing calculations, solid state lighting, solid state lighting systems, viewability

Bailey, C. ORCID: 0000-0002-9438-3879 , Yin, C. ORCID: 0000-0003-0298-0420 , Lu, H. ORCID: 0000-0002-4392-6562 and Cartwright, C. (2011) Multi-physics and multi-disciplinary analysis for solid state lighting. In: 2011 12th Int. Conf. on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2011. IEEE Computer Society, Piscataway, USA. ISBN 9781457701078 (doi:https://doi.org/10.1109/ESIME.2011.5765859)

bridge circuits, failure analysis, insulated gate bipolar transistors, integrated circuit interconnections, integrated circuit modelling, integrated circuit reliability, modules, plastic deformation, power bipolar transistors, power integrated circuits, semiconductor device, reliability, soldering, physics of failure (PoF)

Yin, C.Y, ORCID: 0000-0003-0298-0420 , Lu, H. ORCID: 0000-0002-4392-6562 , Musallam, M., Bailey, C. ORCID: 0000-0002-9438-3879 and Johnson, C.M. (2008) A physics-of-failure based prognostic method for power modules. In: 10th Electronics Packaging Technology Conference (EPTC 2008). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 1190-1195. ISBN 9781424421176 (doi:https://doi.org/10.1109/EPTC.2008.4763591)

data mining, frequency, life estimation, lLifetime estimation, multichip modules, power electronics, predictive models, temperature, thermal degradation, wire

Musallam, Mahera, Johnson, C. Mark, Yin, Chunyan ORCID: 0000-0003-0298-0420 , Lu, Hua ORCID: 0000-0002-4392-6562 and Bailey, Chris ORCID: 0000-0002-9438-3879 (2008) Real-time life expectancy estimation in power modules. In: 2nd Electronics System Integration Technology Conference, Greenwich, UK. IEEE Conference Publications, 1 . Institute of Electrical and Electronics Engineers, Inc, Piscataway, NJ, USA, pp. 231-236. ISBN 978-1-4244-2813-7 (Print), 978-1-4244-2814-4 (Electronic) (doi:https://doi.org/10.1109/ESTC.2008.4684355)

decision tree, logistic regression, random forest, incomplete dataset, electronic device

Hinojosa Herrera, Ana Elsa ORCID: 0000-0002-0636-1881 , Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Bailey, Christopher ORCID: 0000-0002-9438-3879 , Walshaw, Christopher ORCID: 0000-0003-0253-7779 and Yin, Chunyan ORCID: 0000-0003-0298-0420 (2019) Data analytics to reduce stop-on-fail test in electronics manufacturing. Open Computer Sciences, 9 (1). pp. 200-211. ISSN 2299-1093 (Online) (doi:https://doi.org/10.1515/comp-2019-0014)

effect of reflow process, contact resistance, anisotropic conductive film (ACF)

Yin, C.Y. ORCID: 0000-0003-0298-0420 , Alam, M.O., Chan, Y.C., Bailey, C. ORCID: 0000-0002-9438-3879 and Lu, Hua ORCID: 0000-0002-4392-6562 (2003) The effect of reflow process on the contact resistance and reliability of anisotropic conductive film interconnection for flip chip on flex applications. Microelectronics Reliability, 43 (4). pp. 625-633. ISSN 0026-2714 (doi:https://doi.org/10.1016/S0026-2714(02)00348-7)

electrical connections, modelling, moisture

Yin, Chunyan ORCID: 0000-0003-0298-0420 , Lu, Hua ORCID: 0000-0002-4392-6562 , Bailey, Christopher ORCID: 0000-0002-9438-3879 and Chan, Y.C. (2006) Macro-micro modelling of moisture induced stresses in an ACF flip chip assembly. Soldering & Surface Mount Technology, 18 (2). pp. 27-32. ISSN 0954-0911 (doi:https://doi.org/10.1108/09540910610665107)

electro-migration, metal migration, thermo-mechanical loading

Bailey, C. ORCID: 0000-0002-9438-3879 , Zhu, X., Lu, H. ORCID: 0000-0002-4392-6562 and Yin, C. ORCID: 0000-0003-0298-0420 (2012) Modelling metal migration for high reliability components when subjected to thermo-mechanical loading. In: Proceedings of the 2012 IEEE 14th Electronics Packaging Technology Conference. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 474-478. ISBN 9781467345538 (doi:https://doi.org/10.1109/EPTC.2012.6507130)

ferroelectric, piezoelectric, pyroelectric, lead zirconate titanate (PZT), electroceramics, microelectromechanical systems (MEMS), micro-optics, memory devices, nanorods, nanodevices, PZT thin films, Ti/Pt coated Si wafers

Dou, Guangbin, Holmes, Andrew S., Yeatman, Eric M., Wright, Robert V., Kirby, Paul B. and Yin, Chunyan ORCID: 0000-0003-0298-0420 (2011) Transfer of functional ceramic thin films using a thermal release process. Advanced Materials, 23 (10). pp. 1252-1256. ISSN 0935-9648 (Print), 1521-4095 (Online) (doi:https://doi.org/10.1002/adma.201004391)

flexible substrates, lead free applications

Yin, Chunyan ORCID: 0000-0003-0298-0420 , Lu, Hua ORCID: 0000-0002-4392-6562 , Bailey, Christopher ORCID: 0000-0002-9438-3879 and Chan, Y. (2006) Analyzing the performance of flexible substrates for lead-free applications. Proceedings of EuroSime 2006 : 7th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems. IEEE, pp. 539-544. ISBN 1 4244 0276 X (doi:https://doi.org/10.1109/ESIME.2006.1644052)

flexible substrates, thermo-mechanical, lead free solder

Yin, Chunyan ORCID: 0000-0003-0298-0420 , Rizvi, M.J., Lu, Hua ORCID: 0000-0002-4392-6562 and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2006) Thermal-mechanical analysis of flexible substrates during lead-free solder reflow. Proceedings of the 1st Electronics Systemintegration Technology Conference, 2006. IEEE, pp. 1007-1011. ISBN 1 4244 0552 1 (doi:https://doi.org/10.1109/ESTC.2006.280134)

flexible-substrates, Flex-No-Lead project, lead-free soldering

Rizvi, M.J., Yin, C.Y ORCID: 0000-0003-0298-0420 , Bailey, C. ORCID: 0000-0002-9438-3879 and Lu, H. ORCID: 0000-0002-4392-6562 (2007) Performance and reliability of flexible substrates when subjected to lead-free processing. In: 16th European Microelectronics and Packaging Conference and Exhibition 2007(EMPC 2007). Curran Associates, Inc., Red Hook, NY, USA, pp. 589-594. ISBN 9781622764662

fusion approach, failure mechanisms, parameters, bonding, ceramics, condition monitoring, copper, degradation, failure analysis, fatigue, insulated gate bipolar transistors, multichip modules, wire

Patil, Nishad, Das, Diganta, Yin, Chunyan ORCID: 0000-0003-0298-0420 , Lu, Hua ORCID: 0000-0002-4392-6562 , Bailey, Chris ORCID: 0000-0002-9438-3879 and Pecht, Michael (2009) A fusion approach to IGBT power module prognostics. In: 10th International Conference on Thermal, Mechanical and Multi-Physics simulation and Experiments in Microelectronics and Microsystems, 2009. EuroSimE 2009. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 195-199. ISBN 9781424441600 (doi:https://doi.org/10.1109/ESIME.2009.4938491)

light emitting diodes (LEDs), thermal management, optical and thermal modelling techniques, luminance, ruggedized electronic display, LED, LCD, backlights

Bailey, C. ORCID: 0000-0002-9438-3879 , Lee, Y., Lu, H. ORCID: 0000-0002-4392-6562 , Strusevich, N. and Yin, C. ORCID: 0000-0003-0298-0420 (2010) Packaging of LED backlights for ruggedised displays. In: International Symposium on Advanced Packaging Materials: Microtech, 2010. APM '10. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 98-101. ISBN 9781424467563 (doi:https://doi.org/10.1109/ISAPM.2010.5441377)

liquid crystal displays, light emitting diodes, display

Bailey, Chris ORCID: 0000-0002-9438-3879 , Lu, Hua ORCID: 0000-0002-4392-6562 , Yin, Chunyan ORCID: 0000-0003-0298-0420 and Lee, Yek (2010) Multi-physics modelling for packaging of liquid crystal displays in harsh environments. In: Electronics System Integration Technology Conference, ESTC 2010 - Proceedings. IEEE Computer Society, Piscataway, USA, pp. 1-6. ISBN 9781424485536 (Print), 9781424485543 (Online) (doi:https://doi.org/10.1109/ESTC.2010.5642898)

minium wires, design engineers, electrical power, industrial partners, modelling tools, power electronics devices, remaining life, semiconductor technology, solder joints, thermal management, thermo-mechanical behaviors, transport systems, wide area

Bailey, Chris ORCID: 0000-0002-9438-3879 , Lu, Hua ORCID: 0000-0002-4392-6562 and Yin, Chunyan ORCID: 0000-0003-0298-0420 (2010) Modelling reliability of power electronics packaging. In: Proceedings of the ASME InterPack Conference 2009, IPACK2009. American Society of Mechanical Engineers, New York, USA, pp. 215-220. ISBN 9780791843604 (doi:https://doi.org/10.1115/InterPACK2009-89430)

modelling methodology, thermal analysis, hot solder dip process, tin whiskers

Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Bailey, Chris ORCID: 0000-0002-9438-3879 , Alam, M.O., Yin, Chunyan ORCID: 0000-0003-0298-0420 , Best, Chris, Tollafield, Peter, Crawford, Rob, Parker, Mike and Scott, Jim (2013) Modelling methodology for thermal analysis of hot solder dip process. Microelectronics Reliability, 53 (8). pp. 1055-1067. ISSN 0026-2714 (doi:https://doi.org/10.1016/j.microrel.2013.02.018)

modelling technologies, analysis tools, nano-techology, microsystems, fabrication, packaging, testing

Bailey, Christopher ORCID: 0000-0002-9438-3879 , Lu, Hua ORCID: 0000-0002-4392-6562 , Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Tilford, Timothy, Xue, Xiangdong, Alam, M. O., Yin, Chunyan ORCID: 0000-0003-0298-0420 and Hughes, Michael (2008) Modelling technologies and applications. In: Morris, James E., (ed.) Nanopackaging: Nanotechnologies and Electronics Packaging. Springer Science+Business Media, LLC, New York, USA, pp. 15-38. ISBN 978-0-387-47325-3 (Print) 978-0-387-47326-0 (Online) (doi:https://doi.org/10.1007/978-0-387-47325-3_2)

multi-physics, multi-disciplinary design,

Bailey, C. ORCID: 0000-0002-9438-3879 , Lu, H. ORCID: 0000-0002-4392-6562 , Tilford, T. ORCID: 0000-0001-8307-6403 , Rizvi, J. and Yin, C. ORCID: 0000-0003-0298-0420 (2009) Co-design and multi-physics analysis for power electronic modules. In: 2009 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2009. IEEE Computer Society, Piscataway, NJ USA. ISBN 9781424441600 (doi:https://doi.org/10.1109/ESIME.2009.4938505)

packaging, reliability, prognostic methods, power electronics

Lu, Hua ORCID: 0000-0002-4392-6562 , Bailey, Chris ORCID: 0000-0002-9438-3879 and Yin, Chunyan ORCID: 0000-0003-0298-0420 (2009) Design for reliability of power electronics modules. Microelectronics Reliability, 49 (9-11). pp. 1250-1255. ISSN 0026-2714 (doi:https://doi.org/10.1016/j.microrel.2009.07.055)

power electronics modules (PEMs), reliability prediction, prognostic and health management (PHM)systems, Physics-of-failure (PoF) model, Bayesian Networks (BN)

Yin, C.Y. ORCID: 0000-0003-0298-0420 , Lu, H. ORCID: 0000-0002-4392-6562 , Musallam, M., Bailey, C. ORCID: 0000-0002-9438-3879 and Johnson, C. M. (2008) A prognostic assessment method for power electronics modules. In: 2nd Electronics System-Integration Technology Conference, 2008. ESTC 2008. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 1353-1358. ISBN 978-1-4244-2814-4 (Print), 978-1-4244-2813-7 (Online) (doi:https://doi.org/10.1109/ESTC.2008.4684552)

power electronics modules, solder joint fatigue, reliability

Yin, Chunyan ORCID: 0000-0003-0298-0420 , Lu, Hua ORCID: 0000-0002-4392-6562 , Musallam, M., Bailey, Christopher ORCID: 0000-0002-9438-3879 and Johnson, C.M. (2010) In-service reliability assessment of solder interconnect in power electronics modules. In: 2010 Prognostics and System Health Management Conference, PHM '10. IEEE Conference Publications . Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA. ISBN 9781424447565 (Print), 9781424447589 (Online) (doi:https://doi.org/10.1109/PHM.2010.5413346)

prognostic, reliability, power modules, physics-of-failure

Yin, Chunyan ORCID: 0000-0003-0298-0420 , Lu, Hua ORCID: 0000-0002-4392-6562 , Musallam, Mahera, Bailey, Chris ORCID: 0000-0002-9438-3879 and Johnson, C. Mark (2010) Prognostic reliability analysis of power electronics modules. International Journal of Performability Engineering, 6 (5):10. pp. 513-524. ISSN 0973-1318

reliability targets, power modules, wear-out mechanisms, wire-bond lifting, solder degradation, load-induced thermal cycling, real-time thermal models, real-time health management

Musallam, M., Johnson, C.M., Yin, Chunyan ORCID: 0000-0003-0298-0420 , Lu, Hua ORCID: 0000-0002-4392-6562 and Bailey, C. ORCID: 0000-0002-9438-3879 (2009) Real-time comparison of power module failure modes under in-service conditions. In: 2009 13th European Conference on Power Electronics and Applications, EPE '09. Institute of Electrical and Electronic Engineers, Inc, Piscataway, NJ, USA, pp. 1-10. ISBN 978-90-75815-13-9 (electronic), 978-1-4244-4432-8 (print)

solder, joints, computer modelling, flexible substrates, reliability

Rizvi, M.J., Yin, Chunyan ORCID: 0000-0003-0298-0420 and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2006) Modeling the effect of lead-free soldering on flexible substrates. Electronic Materials and Packaging, 2006, EMAP 2006, International Conference on 11-14 Dec. 2006. IEEE, Piscataway, NJ, USA, pp. 1038-1042. ISBN 1424408334; 1424408342 (doi:https://doi.org/10.1109/EMAP.2006.4430695)

statistical hypothesis testing, refinishing, hot solder dip, leaded component, lead-free

Yin, Chunyan ORCID: 0000-0003-0298-0420 , Best, Chris, Bailey, Chris ORCID: 0000-0002-9438-3879 and Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 (2015) Statistical analysis of the impact of refinishing process on leaded components. Microelectronics Reliability, 55 (2). pp. 424-431. ISSN 0026-2714 (doi:https://doi.org/10.1016/j.microrel.2014.11.001)

subsea cable scoring, corrosion

Flynn, David, Bailey, Christopher ORCID: 0000-0002-9438-3879 , Rajaguru, Pushpa ORCID: 0000-0002-6041-0517 , Wenshuo, Tang and Yin, Chunyan ORCID: 0000-0003-0298-0420 (2019) Prognostics and health management of subsea cables. In: Goodman, Douglas, Hofmeister, James P. and Szidarovszky, Ferenc, (eds.) Prognostics and Health Management: A Practical Approach to Improving System Reliability Using Condition-Based Data. Quality and Reliability Engineering Series . Wiley-Blackwell. ISBN 978-1119356653