Items where Greenwich Author is "Yin, Chunyan"

Group by: Item Type | Date | Funders | Uncontrolled Keywords | No Grouping

Jump to: 3D-Mintegration consortium (supported under EPSRC fund EP/C534212/) | CALCE Prognostics and Health Management Consortium at the University of Maryland, College Park | City University of Hong Kong | City University of Hong Kong (ITF Project-Conductive Adhesive Technology Program for Fine Pitch Electronic Packaging Project No: lTS/182/00) | Defense Microelectronics Activity (DMEA), USA | EPSRC - Innovative Electronics Manufacturing Research Center (IeMRC) (UK) | Engineering and Physical Sciences Research Council (EPSRC) | Hong Kong Innovation and Technology Commission for Conductive Adhesive Technology Program for Fine Pitch Electronic Interconnect (Project no. ITS/182/00) | Hong Kong Research Grant Council fund for Cooperative Research Center on Conductive Adhesive Technology for High Density Electronic Packaging (Project no. 8720003) | IeMRC (Innovative Electronics Manufacturing Research Centre) | Innovative Electronics Manufacturing Centre (IeMRC) | Innovative Electronics Manufacturing Research Centre | Innovative electronics Manufacturing Research Centre (IeMRC) | Innovative electronics Manufacturing Research Centre (IeMRC) - A Prognostic and Diagnostic Environment for High Reliability Electronic Systems Project: [SP/06/03] | Innovative electronics Manufacturing Research Centre (IeMRC) - Power Electronics Flagship Project: [FS/05/01] | SP/06/03 (A Prognostic and Diagnostic Environment for High Reliability Electronic Systems) | SSE plc | Technology Strategy Board | Technology Strategy Board (TSB) | Technology Strategy Board (TSB) - [TP/3/DSM/6/I/16796] | Technology Strategy Board for the ENDVIEW project (ProjectTP11/LLD/6/I/AFOO5K) | The Engineering and Physical Sciences Research Council (EPSRC) | U.K. Engineering and Physical Sciences Research Council (EPSRC) (under Grant EP/H03014X/1) | UK Engineering and Physical Sciences Research Council (EPSRC) | US Government | University of Greenwich

Number of items: 29.

3D-Mintegration consortium (supported under EPSRC fund EP/C534212/)

Bailey, Christopher ORCID: https://orcid.org/0000-0002-9438-3879, Lu, Hua ORCID: https://orcid.org/0000-0002-4392-6562, Stoyanov, Stoyan ORCID: https://orcid.org/0000-0001-6091-1226, Tilford, Timothy, Xue, Xiangdong, Alam, M. O., Yin, Chunyan ORCID: https://orcid.org/0000-0003-0298-0420 and Hughes, Michael (2008) Modelling technologies and applications. In: Morris, James E., (ed.) Nanopackaging: Nanotechnologies and Electronics Packaging. Springer Science+Business Media, LLC, New York, USA, pp. 15-38. ISBN 978-0-387-47325-3 (Print) 978-0-387-47326-0 (Online) (doi:10.1007/978-0-387-47325-3_2)

CALCE Prognostics and Health Management Consortium at the University of Maryland, College Park

Patil, Nishad, Das, Diganta, Yin, Chunyan ORCID: https://orcid.org/0000-0003-0298-0420, Lu, Hua ORCID: https://orcid.org/0000-0002-4392-6562, Bailey, Chris ORCID: https://orcid.org/0000-0002-9438-3879 and Pecht, Michael (2009) A fusion approach to IGBT power module prognostics. In: 10th International Conference on Thermal, Mechanical and Multi-Physics simulation and Experiments in Microelectronics and Microsystems, 2009. EuroSimE 2009. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 195-199. ISBN 9781424441600 (doi:10.1109/ESIME.2009.4938491)

City University of Hong Kong

Yin, C.Y. ORCID: https://orcid.org/0000-0003-0298-0420, Lu, H. ORCID: https://orcid.org/0000-0002-4392-6562, Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879 and Chan, Y.C. (2004) Effects of reflow process on the reliability of flip chip on flex interconnections using anisotropic conductive adhesives. In: 2004 International IEEE Conference on Asian Green Electronics (AGEC) [Proceedings]. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 240-245. ISBN 0-7803-8203-X (doi:10.1109/AGEC.2004.1290912)

City University of Hong Kong (ITF Project-Conductive Adhesive Technology Program for Fine Pitch Electronic Packaging Project No: lTS/182/00)

Yin, C.Y. ORCID: https://orcid.org/0000-0003-0298-0420, Lu, H. ORCID: https://orcid.org/0000-0002-4392-6562, Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879 and Chan, Y.C. (2003) Experimental and modeling analysis of the reliability of the anisotropic conductive films. In: 2003 Proceedings 53rd Electronic Components & Technology Conference. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 698-702. ISBN 0780377915 ISSN 0569-5503 (doi:10.1109/ECTC.2003.1216359)

Defense Microelectronics Activity (DMEA), USA

Yin, Chunyan ORCID: https://orcid.org/0000-0003-0298-0420, Stoyanov, Stoyan ORCID: https://orcid.org/0000-0001-6091-1226, Bailey, Christopher ORCID: https://orcid.org/0000-0002-9438-3879 and Stewart, Paul (2019) Thermo-mechanical analysis of conformally coated QFNs for high reliability applications. IEEE Transactions on Components, Packaging and Manufacturing Technology, 9 (11). pp. 2210-2218. ISSN 2156-3950 (Print), 2156-3985 (Online) (doi:10.1109/TCPMT.2019.2925874)

EPSRC - Innovative Electronics Manufacturing Research Center (IeMRC) (UK)

Musallam, Mahera, Johnson, C. Mark, Yin, Chunyan ORCID: https://orcid.org/0000-0003-0298-0420, Lu, Hua ORCID: https://orcid.org/0000-0002-4392-6562 and Bailey, Chris ORCID: https://orcid.org/0000-0002-9438-3879 (2008) Real-time life expectancy estimation in power modules. In: 2nd Electronics System Integration Technology Conference, Greenwich, UK. IEEE Conference Publications, 1 . Institute of Electrical and Electronics Engineers, Inc, Piscataway, NJ, USA, pp. 231-236. ISBN 978-1-4244-2813-7 (Print), 978-1-4244-2814-4 (Electronic) (doi:10.1109/ESTC.2008.4684355)

Engineering and Physical Sciences Research Council (EPSRC)

Hong Kong Innovation and Technology Commission for Conductive Adhesive Technology Program for Fine Pitch Electronic Interconnect (Project no. ITS/182/00)

Yin, C.Y. ORCID: https://orcid.org/0000-0003-0298-0420, Alam, M.O., Chan, Y.C., Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879 and Lu, Hua ORCID: https://orcid.org/0000-0002-4392-6562 (2003) The effect of reflow process on the contact resistance and reliability of anisotropic conductive film interconnection for flip chip on flex applications. Microelectronics Reliability, 43 (4). pp. 625-633. ISSN 0026-2714 (doi:10.1016/S0026-2714(02)00348-7)

Hong Kong Research Grant Council fund for Cooperative Research Center on Conductive Adhesive Technology for High Density Electronic Packaging (Project no. 8720003)

IeMRC (Innovative Electronics Manufacturing Research Centre)

Yin, Chunyan ORCID: https://orcid.org/0000-0003-0298-0420, Lu, Hua ORCID: https://orcid.org/0000-0002-4392-6562, Musallam, Mahera, Bailey, Chris ORCID: https://orcid.org/0000-0002-9438-3879 and Johnson, C. Mark (2010) Prognostic reliability analysis of power electronics modules. International Journal of Performability Engineering, 6 (5):10. pp. 513-524. ISSN 0973-1318

Innovative Electronics Manufacturing Centre (IeMRC)

Yin, C.Y. ORCID: https://orcid.org/0000-0003-0298-0420, Lu, H. ORCID: https://orcid.org/0000-0002-4392-6562, Musallam, M., Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879 and Johnson, C. M. (2008) A prognostic assessment method for power electronics modules. In: 2nd Electronics System-Integration Technology Conference, 2008. ESTC 2008. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 1353-1358. ISBN 978-1-4244-2814-4 (Print), 978-1-4244-2813-7 (Online) (doi:10.1109/ESTC.2008.4684552)

Innovative Electronics Manufacturing Research Centre

Musallam, Mahera, Yin, Chunyan ORCID: https://orcid.org/0000-0003-0298-0420, Bailey, Christopher ORCID: https://orcid.org/0000-0002-9438-3879 and Johnson, Mark (2014) Mission profile-based reliability design and real-time life consumption estimation in power electronics. IEEE Transactions on Power Electronics, 30 (5). pp. 2601-2613. ISSN 0885-8993 (Print), 1941-0107 (Online) (doi:10.1109/TPEL.2014.2358555)

Yin, Chunyan ORCID: https://orcid.org/0000-0003-0298-0420, Lu, Hua ORCID: https://orcid.org/0000-0002-4392-6562, Musallam, M., Bailey, Christopher ORCID: https://orcid.org/0000-0002-9438-3879 and Johnson, C.M. (2010) In-service reliability assessment of solder interconnect in power electronics modules. In: 2010 Prognostics and System Health Management Conference, PHM '10. IEEE Conference Publications . Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA. ISBN 9781424447565 (Print), 9781424447589 (Online) (doi:10.1109/PHM.2010.5413346)

Innovative electronics Manufacturing Research Centre (IeMRC)

Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879, Lu, H. ORCID: https://orcid.org/0000-0002-4392-6562, Yin, C. ORCID: https://orcid.org/0000-0003-0298-0420 and Ridout, S. (2008) Predictive reliability, prognostics and risk assessment for power modules. CIPS 2008: 5th International Conference on Integrated Power Electronics Systems. Proceedings, March, 11-13, 2008 Nuremberg/Germany. ETG-Fachbericht (111). VDE Verlag GmbH, Berlin-Offenbach, Germany, pp. 19-26. ISBN 9783800730896

Yin, C.Y, ORCID: https://orcid.org/0000-0003-0298-0420, Lu, H. ORCID: https://orcid.org/0000-0002-4392-6562, Musallam, M., Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879 and Johnson, C.M. (2008) A physics-of-failure based prognostic method for power modules. In: 10th Electronics Packaging Technology Conference (EPTC 2008). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 1190-1195. ISBN 9781424421176 (doi:10.1109/EPTC.2008.4763591)

Innovative electronics Manufacturing Research Centre (IeMRC) - A Prognostic and Diagnostic Environment for High Reliability Electronic Systems Project: [SP/06/03]

Lu, Hua ORCID: https://orcid.org/0000-0002-4392-6562, Bailey, Chris ORCID: https://orcid.org/0000-0002-9438-3879 and Yin, Chunyan ORCID: https://orcid.org/0000-0003-0298-0420 (2009) Design for reliability of power electronics modules. Microelectronics Reliability, 49 (9-11). pp. 1250-1255. ISSN 0026-2714 (doi:10.1016/j.microrel.2009.07.055)

Innovative electronics Manufacturing Research Centre (IeMRC) - Power Electronics Flagship Project: [FS/05/01]

SP/06/03 (A Prognostic and Diagnostic Environment for High Reliability Electronic Systems)

SSE plc

Bailey, Christopher ORCID: https://orcid.org/0000-0002-9438-3879, Yin, Chunyan ORCID: https://orcid.org/0000-0003-0298-0420 and Rajaguru, Pushparajah ORCID: https://orcid.org/0000-0002-6041-0517 (2019) Predicting damage and life expectancy of subsea power cables in offshore renewable energy applications. IEEE ACCESS, 7. pp. 54658-54669. ISSN 2169-3536 (Online) (doi:10.1109/ACCESS.2019.2911260)

Technology Strategy Board

Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879, Lee, Y., Lu, H. ORCID: https://orcid.org/0000-0002-4392-6562, Strusevich, N. and Yin, C. ORCID: https://orcid.org/0000-0003-0298-0420 (2010) Packaging of LED backlights for ruggedised displays. In: International Symposium on Advanced Packaging Materials: Microtech, 2010. APM '10. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 98-101. ISBN 9781424467563 (doi:10.1109/ISAPM.2010.5441377)

Technology Strategy Board (TSB)

Technology Strategy Board (TSB) - [TP/3/DSM/6/I/16796]

Technology Strategy Board for the ENDVIEW project (ProjectTP11/LLD/6/I/AFOO5K)

Bailey, Chris ORCID: https://orcid.org/0000-0002-9438-3879, Lu, Hua ORCID: https://orcid.org/0000-0002-4392-6562, Yin, Chunyan ORCID: https://orcid.org/0000-0003-0298-0420 and Lee, Yek (2010) Multi-physics modelling for packaging of liquid crystal displays in harsh environments. In: Electronics System Integration Technology Conference, ESTC 2010 - Proceedings. IEEE Computer Society, Piscataway, USA, pp. 1-6. ISBN 9781424485536 (Print), 9781424485543 (Online) (doi:10.1109/ESTC.2010.5642898)

The Engineering and Physical Sciences Research Council (EPSRC)

U.K. Engineering and Physical Sciences Research Council (EPSRC) (under Grant EP/H03014X/1)

UK Engineering and Physical Sciences Research Council (EPSRC)

Dou, Guangbin, Holmes, Andrew S., Yeatman, Eric M., Wright, Robert V., Kirby, Paul B. and Yin, Chunyan ORCID: https://orcid.org/0000-0003-0298-0420 (2011) Transfer of functional ceramic thin films using a thermal release process. Advanced Materials, 23 (10). pp. 1252-1256. ISSN 0935-9648 (Print), 1521-4095 (Online) (doi:10.1002/adma.201004391)

US Government

Yin, Chunyan ORCID: https://orcid.org/0000-0003-0298-0420, Best, Chris, Bailey, Chris ORCID: https://orcid.org/0000-0002-9438-3879 and Stoyanov, Stoyan ORCID: https://orcid.org/0000-0001-6091-1226 (2015) Statistical analysis of the impact of refinishing process on leaded components. Microelectronics Reliability, 55 (2). pp. 424-431. ISSN 0026-2714 (doi:10.1016/j.microrel.2014.11.001)

University of Greenwich

Yin, C.Y. ORCID: https://orcid.org/0000-0003-0298-0420, Lu, H. ORCID: https://orcid.org/0000-0002-4392-6562, Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879 and Chan, Y.C. (2003) Experimental and modeling analysis of the reliability of the anisotropic conductive films. In: 2003 Proceedings 53rd Electronic Components & Technology Conference. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 698-702. ISBN 0780377915 ISSN 0569-5503 (doi:10.1109/ECTC.2003.1216359)

This list was generated on Sun Feb 23 09:36:12 2025 UTC.