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Items where Author is "Pathirana, V."

Items where Author is "Pathirana, V."

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Number of items: 4.

Article

Rajaguru, P. ORCID logoORCID: https://orcid.org/0000-0002-6041-0517, Lu, H. ORCID logoORCID: https://orcid.org/0000-0002-4392-6562, Bailey, C. ORCID logoORCID: https://orcid.org/0000-0002-9438-3879, Castellazzi, A., Pathirana, V., Udugampola, N. and Udrea, F. (2018) Impact of underfill and other physical dimensions on Silicon Lateral IGBT package reliability using computer model with discrete and continuous design variables. Microelectronics Reliability, 83. pp. 146-156. ISSN 0026-2714 (doi:10.1016/j.microrel.2018.02.024)

Conference Proceedings

Bailey, C. ORCID logoORCID: https://orcid.org/0000-0002-9438-3879, Rajaguru, P. ORCID logoORCID: https://orcid.org/0000-0002-6041-0517, Lu, H. ORCID logoORCID: https://orcid.org/0000-0002-4392-6562, Castellazzi, A., Antonini, M., Pathirana, V., Udugampola, N., Udrea, F., Mitchelson, P. D. and Aldhaher, S. (2018) Mechanical modelling of high power lateral IGBT for LED driver applications. In: IEEE Electronic Components and Technology Conference (ECTC). IEEE Electronics Packaging Society (formerly CPMT), pp. 1375-1381. ISBN 978-1-5386-5000-4 ISSN 2377-5726 (Online) (doi:10.1109/ECTC.2018.00210)

Rajaguru, P. ORCID logoORCID: https://orcid.org/0000-0002-6041-0517, Bailey, C. ORCID logoORCID: https://orcid.org/0000-0002-9438-3879, Lu, H. ORCID logoORCID: https://orcid.org/0000-0002-4392-6562, Aliyu, A. M., Castellazzi, A., Pathirana, V., Udugampola, N., Trajkovic, T., Udrea, F., Mitcheson, P. D. and Elliott, A. D. T. (2017) Co-design/simulation of flip-chip assembly for high voltage IGBT packages. In: 23rd International workshop on Thermal Investigations of ICs and Systems (THERMINIC). THERMINIC, pp. 1-5.

Aliyu, A. M., Mouawad, B., Castellazzi, A., Rajaguru, P. ORCID logoORCID: https://orcid.org/0000-0002-6041-0517, Bailey, C. ORCID logoORCID: https://orcid.org/0000-0002-9438-3879, Pathirana, V., Uduampola, N., Trajkovic, T. and Ubrea, F. (2017) Chip-on-board assembly of 800V Si LIGBTs for high performance ultra-compact LED drivers. In: Proceedings of the 2017 29th International Symposium on Power Semiconductor Devices and IC's (ISPSD). IEEE, pp. 431-434. ISBN 978-4-88686-094-1 ISSN 1946-0201 (Online) (doi:10.23919/ISPSD.2017.7988976)

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