Items where Author is "Parrott, Kevin"

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adaptive time\-stepping adhesive materials American option pricing Asian American Options assembly assembly process technology ATLAS bumps CFD cloud cluster cognition convection oven coordinate transformation coupled electromagnetic and heat transfer computations coupled simulation credit scheduler cure process curing die attach dielectric losses dielectric materials dispersion relations edge elements electromagnetic heating electronic engineering electronic packaging electronic products end-fed probes FDTD finite difference finite difference method flip-chip assembly flip-chip underfills glob top grid heat sensitive film heat transfer HPC information visualisation interaction design job scheduling low power tests low-loss dielectric Maxwell's equations micro-electronics manufacture microelectronics microwave microwave curing microwave devices microwave heating microwave ovens microwave radiation microwave system microwave systems microwave thawing of frozen food microwaves moving meshes multigrid multiphysics numerical modelling numerical simulation numerical simulations open-ended microwave curing system open-ended microwave oven open-oven opto-electronic assembly packaging parallel computing performance pilot jobs polymer curing polymer encapsulant polymer materials curing polymers portability potting cure predictability relative permittivity RF-ID tag bonding rotation semi-Lagrange time integration simulation stochastic volatility strike\-price related transformation structural bonding tetrahedral meshes thawing thermosetting polymer materials Variable Frequency Microwave (VFM) heating variable frequency microwave technology virtualization visual impairment wafer processing wafer scale level packaging waveguide cavity resonator waveguide components Xen

Number of items: 120.

adaptive time\-stepping

Clarke, Nigel and Parrott, Kevin (1999) Multigrid for American option pricing with stochastic volatility. Applied Mathematical Finance, 6 (3). pp. 177-195. ISSN 1350-486X (Print), 1466-4313 (Online) (doi:https://doi.org/10.1080/135048699334528)

adhesive materials

Goussetis, George, Sinclair, Keith I., Sangster, Alan J., Desmulliez, Marc P.Y., Tilford, Tim, Parrott, Kevin and Bailey, Christopher (2007) Microwave curing for high density package. 2007 International Symposium on High Density Design Packaging and Microsystem Integration. Institute of Electrical and Electronics Engineers, Inc., New York, p. 1. ISBN 9781424412525 (doi:https://doi.org/10.1109/HDP.2007.4283552)

American option pricing

Asian American Options

Parrott, Kevin and Rout, Sweta (2006) Semi-Lagrange time integration for PDE models of asian options. Progress in Industrial Mathematics at ECMI 2004. Mathematics in Industry, 8 . Springer Berlin / Heidelberg, Berlin, pp. 432-436. ISBN 9783540280729 (doi:https://doi.org/10.1007/3-540-28073-1)

assembly

Sinclair, Keith I., Goussetis, George, Desmulliez, Marc P.Y., Sangster, Alan J., Tilford, Tim, Bailey, Chris ORCID: 0000-0002-9438-3879 and Parrott, Kevin (2009) Polymer curing within an optimised open-ended microwave oven. In: European Microwave Week 2008, “Bridging Gaps”, Conference Proceedings,. Institute of Electrical and Electronics Engineers, Inc., Piscataway, N.J., USA, pp. 17-20. ISBN 978-2874870064 (doi:https://doi.org/10.1109/EUMC.2008.4751375)

assembly process technology

Tilford, Tim, Bailey, Christopher, Parrott, Kevin, Rizvi, M.J., Yin, Chunyan, Sinclair, Keith I. and Desmulliez, Marc P.Y. (2008) Impact of assembly process technologies on electronic packaging materials. International Conference on Electronic Packaging Technology & High Density Packaging, 2008. ICEPT-HDP 2008. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 1-6. ISBN 978-1-4244-2739-0 (online) 978-1-4244-2740-6 (print) (doi:https://doi.org/10.1109/ICEPT.2008.4607039)

ATLAS

Khalid, Omer, Maljevic, Ivo, Anthony, Richard, Petridis, Miltos, Parrott, Kevin and Schulz, Markus (2010) Deadline aware virtual machine scheduler for grid and cloud computing. In: Proceedings: 24th IEEE International Conference on Advanced Information Networking and Applications Workshops WAINA 2010. IEEE Computer Society, Conference Publications Services, Los Alamitos, CA, USA, pp. 85-90. ISBN 978 0 7695 4019 1 (doi:https://doi.org/10.1109/WAINA.2010.107)

Khalid, Omer, Maljevic, Ivo, Anthony, Richard, Petridis, Miltos, Parrott, Kevin and Schulz, Markus (2009) Dynamic scheduling of virtual machines running HPC workloads in scientific grids. 3rd International Conference on New Technologies, Mobility and Security, NTMS 2009. IEEE Computer Society, Piscataway, NJ USA. ISBN 97814244 6273 5 (doi:https://doi.org/10.1109/NTMS.2009.5384725)

Khalid, Omer, Anthony, Richard, Nilsson, Paul, Keahey, Kate, Schulz, Markus, Parrott, Kevin and Petridis, Miltos (2009) Enabling and optimizing pilot jobs using xen based virtual machines for the HPC grid applications. In: Virtualization technologies in distributed computing. ACM, New York, NY, USA, pp. 1-8. ISBN 9781605585802 (doi:https://doi.org/10.1145/1555336.1555338)

bumps

CFD

Tilford, Tim, Sinclair, Keith I., Bailey, Christopher, Desmulliez, Marc P.Y., Parrott, Kevin and Sangster, Alan J. (2007) Multiphysics simulation of microwave curing of polymer materials in micro-electronics packaging applications. In: Silaghi, Alexandru Marius and Gordan, Ioan Mircea, (eds.) Proceedings book 11th International Conference on Microwave and High Frequency Heating, Oradea, Romania, September, 3-6 2007. University of Oradea, Romania, Oradea, Romania, pp. 189-192. ISBN 9789737593337

cloud

cluster

cognition

Parrott, Kevin and Tilford, Tim (2007) Numerical simulation of microwave thawing using a coupled solver approach. PAMM - Proceedings in Applied Mathematics and Mechanics, 7 (1). pp. 1150601-1150602. ISSN 1617-7061 (online) (doi:https://doi.org/10.1002/pamm.200700212)

convection oven

Tilford, Tim ORCID: 0000-0001-8307-6403 , Sinclair, Keith I., Goussetis, George, Bailey, Christopher ORCID: 0000-0002-9438-3879 , Desmulliez, Marc P.Y., Parrott, Kevin and Sangster, Alan J. (2008) Comparison of encapsulant curing with convention and microwave systems. 33rd IEEE/CPMT International Electronic Manufacturing Technology Symposium (IEMT), 2008. IEEE, Piscataway, NJ, USA. ISBN 9781424433926 (print) 9781424433933 (electronic) (doi:https://doi.org/10.1109/IEMT.2008.5507869)

coordinate transformation

coupled electromagnetic and heat transfer computations

Tilford, Timothy ORCID: 0000-0001-8307-6403 , Baginski, E., Kelder, J., Pericleous, Koulis A. ORCID: 0000-0002-7426-9999 and Parrott, Kevin (2006) Microwave modeling and validation in food applications. Annual microwave heating symposium (40th). pp. 208-212. ISSN 1070-0129

coupled simulation

Tilford, Tim, Sinclair, Keith I., Bailey, Christopher, Desmulliez, Marc P.Y., Parrott, Kevin and Sangster, Alan J. (2007) Coupled FDTD-FVM simulation of microwave heating of polymer materials for micro-systems packaging applications. Annual microwave heating symposium (41st). pp. 7-11. ISSN 1070-0129

credit scheduler

cure process

Sinclair, Keith I., Tilford, Tim ORCID: 0000-0001-8307-6403 , Goussetis, George, Bailey, Christopher ORCID: 0000-0002-9438-3879 , Desmulliez, Marc P.Y., Parrott, Kevin and Sangster, Alan J. (2008) Advanced microwave oven for rapid curing of encapsulant. 2nd Electronics System-Integration Technology Conference, 2008. ESTC 2008. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 551-556. ISBN 978-1-4244-2814-4 (print) 978-1-4244-2813-7 (online) (doi:https://doi.org/10.1109/ESTC.2008.4684409)

curing

die attach

dielectric losses

dielectric materials

dispersion relations

Monk, Peter and Parrott, Kevin (2001) Phase-accuracy comparisons and improved far-field estimates for 3-D edge elements on tetrahedral meshes. Journal of Computational Physics, 170 (2). pp. 614-641. ISSN 0021-9991 (doi:https://doi.org/10.1006/jcph.2001.6753)

edge elements

electromagnetic heating

electronic engineering

Tilford, Tim ORCID: 0000-0001-8307-6403 , Sinclair, Keith I., Bailey, Christopher ORCID: 0000-0002-9438-3879 , Desmulliez, Marc P.Y., Goussetis, George, Parrott, Kevin and Sangster, Alan J. (2007) Multiphysics simulation of microwave curing in micro-electronics packaging applications. Soldering & Surface Mount Technology, 19 (3). pp. 26-33. ISSN 0954-0911 (doi:https://doi.org/10.1108/09540910710843757)

electronic packaging

electronic products

end-fed probes

Sinclair, Keith I., Sangster, Alan J., Goussetis, George, Desmulliez, Marc P.Y., Tilford, Tim, Parrott, Kevin and Bailey, Christopher (2007) Open ended microwave oven for flip-chip assembly. 2007 European Microwave Conference. Institute of Electrical and Electronics Engineers, Inc., New York, pp. 620-623. ISBN 9782874870019

FDTD

finite difference

finite difference method

flip-chip assembly

flip-chip underfills

glob top

grid

heat sensitive film

heat transfer

Tilford, Tim ORCID: 0000-0001-8307-6403 , Baginski, Ed, Kelder, Jasper, Parrott, Kevin and Pericleous, Koulis A. ORCID: 0000-0002-7426-9999 (2007) Microwave modelling and validation in food thawing applications. Journal of Microwave Power & Electromagnetic Energy, 41 (4). pp. 30-45. ISSN 0832-7823

HPC

information visualisation

interaction design

job scheduling

low power tests

low-loss dielectric

Maxwell's equations

micro-electronics manufacture

microelectronics

microwave

microwave curing

microwave devices

microwave heating

microwave ovens

microwave radiation

microwave system

microwave systems

microwave thawing of frozen food

microwaves

moving meshes

multigrid

multiphysics

numerical modelling

numerical simulation

numerical simulations

open-ended microwave curing system

Tilford, Tim, Sinclair, Keith I., Goussetis, George, Bailey, Christopher, Desmulliez, Marc P.Y., Parrott, Kevin and Sangster, Alan J. (2007) Variable frequency microwave curing of polymer materials in microelectronics packaging applications. 2007 9th Electronics Packaging Technology Conference. Electronics Packaging Technology Conference Proceedings . Institute of Electrical and Electronics Engineers, Inc., New York, pp. 791-796. ISBN 9781424413232 (doi:https://doi.org/10.1109/EPTC.2007.446975)

open-ended microwave oven

open-oven

opto-electronic assembly

packaging

parallel computing

Reed, Joy, Parrott, Kevin and Lanfear, Tim (1996) Portability, predictability and performance for parallel computing: BSP in practice. Concurrency: Practice and Experience, 8 (10). pp. 799-812. ISSN 1040-3108 (Print), 1096-9128 (Online) (doi:https://doi.org/10.1002/(SICI)1096-9128(199612)8:10<799::AID-CPE274>3.0.CO;2-7)

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