Article

Li, H., Yu, W., Zhang, L., Liu, Z., Brown, K.E., Abraham, E., Cargill, S., Tonry, C., Patel, M.K., Bailey, C. ORCID: 0000-0002-9438-3879 and Desmulliez, M.P.Y. (2013) Simulation and modelling of sub-30 nm polymeric channels fabricated by electrostatic induced lithography. RSC Advances, 3 (29). pp. 11839-11845. ISSN 2046-2069 (doi:https://doi.org/10.1039/c3ra40188j)

Costello, S., Strusevich, N., Flynn, D., Kay, R.W., Patel, M.K., Bailey, C., Price, D., Bennet, M., Jones, A.C. and Desmulliez, M.P.Y. (2013) Electrodeposition of copper into high aspect ratio PCB micro-via using megasonic agitation. Microsystem Technologies, 19 (6). pp. 783-790. ISSN 0946-7076 (Print), 1432-1858 (Online) (doi:https://doi.org/10.1007/s00542-013-1746-7)

Chen, H., Yu, W., Cargill, S., Patel, M.K., Bailey, C. ORCID: 0000-0002-9438-3879 , Tonry, C. and Desmulliez, M.P.Y. (2012) Self-encapsulated hollow microstructures formed by electric field-assisted capillarity. Microfluidics and Nanofluidics, 13 (1). pp. 75-82. ISSN 1613-4982 (Print), 1613-4990 (Online) (doi:https://doi.org/10.1007/s10404-012-0942-6)

Pavuluri, S.K., Ferenets, M., Goussetis, G., Desmulliez, M.P.Y., Tilford, T. ORCID: 0000-0001-8307-6403 , Adamietz, R., Muller, G., Eicher, F. and Bailey, C. ORCID: 0000-0002-9438-3879 (2012) Encapsulation of microelectronic components using open-ended microwave oven. IEEE Transactions on Components, Packaging and Manufacturing Technology, 2 (5). pp. 799-806. ISSN 2156-3950 (doi:https://doi.org/10.1109/TCPMT.2011.2177524)

Tilford, T., Ferenets, M., Morris, J.E., Krumme, A., Pavuluri, S., Rajaguru, P.R. ORCID: 0000-0002-6041-0517 , Desmulliez, M.P.Y. and Bailey, C. ORCID: 0000-0002-9438-3879 (2010) Application of particle swarm optimisation to evaluation of polymer cure kinetics models. Journal of Algorithms & Computational Technology, 4 (1). pp. 121-146. ISSN 1748-3018 (doi:https://doi.org/10.1260/1748-3018.4.1.121)

Sinclair, K.I., Goussetis, G., Desmulliez, M.P.Y., Sangster, A.J., Tilford, T. ORCID: 0000-0001-8307-6403 , Bailey, C. ORCID: 0000-0002-9438-3879 and Parrott, A.K. (2008) Optimization of an open-ended microwave oven for microelectronics packaging. IEEE Transactions on Microwave Theory and Techniques, 56 (11). pp. 2635-2641. ISSN 0018-9480 (doi:https://doi.org/10.1109/TMTT.2008.2005925)

Conference Proceedings

Pavuluri, S.K., Desmulliez, M.P.Y., Goussetis, G., Arrighi, V., Johnston, K., Adamietz, R., Tilford, T. and Bailey, C. ORCID: 0000-0002-9438-3879 (2012) Post cure behaviour of ancapsulants for QFN packages processed by an open-ended single mode resonant microwave applicator. In: Electronics Packaging Technology Conference (EPTC), 2011 13th. Institute of Electrical and Electronics Engineers, Piscataway, NJ, USA, pp. 573-578. ISBN 978-1-4577-1983-7 (Print), 978-1-4577-1981-3 (Online) (doi:https://doi.org/10.1109/EPTC.2011.6184486)

Costello, S., Strusevich, N., Flyyn, D., Kay, R.W., Patel, M.K., Bailey, C. ORCID: 0000-0002-9438-3879 , Price, D., Bennet, M., Jones, A.C. and Desmulliez, M.P.Y. (2012) Electrodeposition of copper into high aspect ratio PCB micro-via using megasonic agitation. In: DTIP 2012 Conference 2012: Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS. EDA Publishing Association, Grenoble, France, pp. 98-102. ISBN 9782355000201

Costello, S., Strusevich, N., Patel, M.K., Bailey, C. ORCID: 0000-0002-9438-3879 , Flynn, D., Kay, R.W., Price, D., Bennett, M., Jones, A.C., Habeshaw, R., Demore, C., Cochran, S. and Desmulliez, M.P.Y. (2011) Characterisation of ion transportation during electroplating of high aspect ratio microvias using megasonic agitation. In: EMPC-2011: 18th European Microelectronics and Packaging Conference. Proceedings. IEEE Conference Publications . Institute of Electrical and Electronic Engineers, Inc., Piscataway, NJ, USA, pp. 1-7. ISBN 9780956808606

Costello, S., Flynn, D., Kay, R.W., Desmulliez, M.P.Y., Strusevich, N., Patel, M.K., Bailey, C. ORCID: 0000-0002-9438-3879 , Jones, A.C., Bennett, M., Price, D., Habeshaw, R., Demore, C. and Cochran, S. (2011) Electrodeposition of copper into PCB vias under megasonic agitation. In: MME 2011. Proceedings of the 22nd Micromechanics and Microsystems Technology Europe Workshop. MME2011, Norway, pp. 266-269. ISBN 9788278602249

Pavuluri, S.K., Ferenets, M., Goussetis, G., Desmulliez, M.P.Y., Tilford, T. ORCID: 0000-0001-8307-6403 , Adamietz, R., Muller, G., Eicher, F. and Bailey, C. ORCID: 0000-0002-9438-3879 (2010) Experimental investigation of open-ended microwave oven assisted encapsulation process. In: Electronics System Integration Technology Conference, ESTC 2010 - Proceedings. IEEE Computer Society, Piscataway, NJ, USA, pp. 1-6. ISBN 978-1-4244-8553-6 (print), 978-1-4244-8554-3 (online) (doi:https://doi.org/10.1109/ESTC.2010.5643015)

Tilford, T. ORCID: 0000-0001-8307-6403 , Ferenets, M., Adamietz, R., Pavuluri, S.K., Morris, J.E., Desmulliez, M.P.Y. and Bailey, C. ORCID: 0000-0002-9438-3879 (2010) Numerical analysis of microwave underfill cure in ball-grid packages. In: Electronics System Integration Technology Conference, ESTC 2010 - Proceedings. IEEE Computer Society, Piscataway, USA, pp. 1-6. ISBN 9781424485536 (Print), 9781424485543 (Online) (doi:https://doi.org/10.1109/ESTC.2010.5642822)

Tilford, T., Morris, J.E., Ferenets, M., Rajaguru, P.R. ORCID: 0000-0002-6041-0517 , Pavuluri, S.K., Desmulliez, M.P.Y. and Bailey, C. ORCID: 0000-0002-9438-3879 (2010) On model fitting methods for modeling polymer cure kinetics in microelectronics assembly applications. In: Electronics System Integration Technology Conference, ESTC 2010 - Proceedings. IEEE Computer Society, Piscataway, USA, pp. 1-6. ISBN 9781424485536 (Print), 9781424485543 (Online) (doi:https://doi.org/10.1109/ESTC.2010.5642820)

Tilford, T., Morris, J.E., Ferenets, M., Rajaguru, P.R. ORCID: 0000-0002-6041-0517 , Pavuluri, S., Desmulliez, M.P.Y. and Bailey, C. ORCID: 0000-0002-9438-3879 (2010) Numerical analysis of polymer cure kinetics in isotropic conductive adhesives. In: 33rd International Spring Seminar on Electronics Technology (ISSE), 2010. Polymer Electronics and Nanotechnologies: Towards System Integration . IEEE Xplore, Sovereign House, London, N3 1QB, UK, pp. 412-416. ISBN 978-1-4244-7849-1 (print), 978-1-4244-7850-7 (e-ISBN) (doi:https://doi.org/10.1109/ISSE.2010.5547360)

Pavuluri, S.K., Tilford, T., Goussetis, G., Desmulliez, M.P.Y., Ferenets, M., Adamietz, R., Eicher, F. and Bailey, C. ORCID: 0000-0002-9438-3879 (2010) Advances in the design and test of a novel open ended microwave oven. In: Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2010. IEEE Computer Society, Piscataway, USA, pp. 247-252. ISBN 9781424466368 (Print), 9782355000119 (Online)

Tilford, T., Ferenets, M., Adamietz, R., Pavuluri, S., Morris, J.E., Desmulliez, M.P.Y. and Bailey, C. ORCID: 0000-0002-9438-3879 (2010) Numerical analysis of microwave-assisted encapsulation processes for ball grid array packages. In: International Microwave Power Institute’s 44th Annual Symposium: 2010 Proceedings. International Microwave Power Institute (IMPI), Mechanicsville, VA, USA, pp. 30-35. ISSN 1070-0129

Morris, J.E., Tilford, T. ORCID: 0000-0001-8307-6403 , Bailey, C. ORCID: 0000-0002-9438-3879 , Sinclair, K.I. and Desmulliez, M.P.Y. (2009) Polymer cure modeling for microelectronics applications. In: 32nd International Spring Seminar on Electronics Technology, 2009. ISSE 2009. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA. ISBN 978-1-4244-4260-7 (print) (doi:https://doi.org/10.1109/ISSE.2009.5206929)

Tilford, T., Sinclair, K.I., Goussetis, G., Bailey, C. ORCID: 0000-0002-9438-3879 , Desmulliez, M.P.Y., Parrott, A.K. and Sangster, A.J. (2008) Numerical analysis of thermal stresses induced during VFM encapsulant curing. In: 31st International Spring Seminar on Electronics Technology, 2008. ISSE '08. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 348-353. ISBN 978-1-4244-3972-0 (doi:https://doi.org/10.1109/ISSE.2008.5276666)

Tilford, T., Sinclair, K.I., Goussetis, G., Bailey, C. ORCID: 0000-0002-9438-3879 , Desmulliez, M.P.Y., Parrott, A.K. and Sangster, A.J. (2008) Numerical simulation of encapsulant curing within a variable frequency microwave processing system. In: Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems, 2008. EuroSimE 2008. International Conference on. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 447-454. ISBN 978-1-4244-2127-5 (doi:https://doi.org/10.1109/ESIME.2008.4525086)

Desmulliez, M.P.Y., Kay, R.W., Stoyanov, S. ORCID: 0000-0001-6091-1226 and Bailey, C. ORCID: 0000-0002-9438-3879 (2004) Stencil printing at sub-100 microns pitch. In: Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 354-358. ISBN 0780388216 (doi:https://doi.org/10.1109/EPTC.2004.1396633)

Desmulliez, M.P.Y., Kay, R.W., Stoyanov, S. ORCID: 0000-0001-6091-1226 and Bailey, C. ORCID: 0000-0002-9438-3879 (2004) Stencil printing at sub-100 microns pitch. In: Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 354-358. ISBN 0780388216 (doi:https://doi.org/10.1109/EPTC.2004.1396633)

Conference or Conference Paper

Tilford, T., Ferenets, M., Morris, J., Rajaguru, P.R. ORCID: 0000-0002-6041-0517 , Pavuluri, S., Desmulliez, M.P.Y. and Bailey, C. ORCID: 0000-0002-9438-3879 (2010) Evaluation of polymer cure models in microelectronics packaging applications. In: International Conference on Electronics Packaging (ICEP2010), 12-14 May 2010, Sapporo, Hokkaido, Japan. (Unpublished)

Adamietz, R., Tilford, T. ORCID: 0000-0001-8307-6403 , Ferenets, M., Desmulliez, M.P.Y., Muller, G., Othman, N and Eicher, F. (2010) Modular microwave-based system for packaging applications. In: International Conference on Electronics Packaging (ICEP2010), 12-14 May 2010, Sapporo, Hokkaido, Japan. (Unpublished)