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Items where Greenwich Author is "Strusevich, Nadezhda"

Items where Greenwich Author is "Strusevich, Nadezhda"

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Jump to: CCFL, LEDs, thermal, mechanical, optical behaviour | CFD, electrodeposition, level set method, megasonic agitation, microsystems, LIGA | Design for Reliability modelling, System-in-Package (SiP) structures, NXP, Wafer Level Packaging (WLP), Finite Element Analysis (FEA) | Megasonic Agitation; Printed Circuit Board Fabrication | SiP structure, package design parameters, thermo-mechanical behaviour, non-linear transient finite element simulations | SiP structure, thermo-mechanical behaviour, reduced order models (ROM) | SiP technology, thermo-mechanical reliability analysis, stacked die, side-by-side dies, embedded die, finite element analysis, numerical optimisation, uncertainty analysis, lead free solder interconnects, accelerated temperature cycle, fatigue life-time, warpage | SiP, packaging design, solder joints, numerical modelling | agitation method, megasonic acoustic streaming, plating rate, uniformity, electroplating, electrodeposition, metals, copper | circuits, electromechanical devices, electronics industry, reliability management | electrodeposition, electroplating, megasonic agitation, acoustic streaming, aspect ratio | electrodeposition, micro-particle imaging velocimetry (micro-PIV), fluid flow, electrodeposition of copper, megasonic agitation | electrodeposition, microvias, current density, electrolytes, electroplating, printed circuits, vias | electrodeposition, numerical modelling | electrolyte fluid flow, micro-particle imaging velocimetry (micro-PIV), fibre optic hydrophone, printed circuit board (PCB), high aspect ratio microvias | electronics manufacturing, numerical modelling, high aspect ratio microvia, electroplating, megasonic agitation, acoustic streaming | electroplating, electrodeposition, megasonic agitation, high density interconnection technology, microvias | granular material, core flow, segregation, continuum modeling, micro-physical parametrizations, | granular materials, continuum modelling, micro-mechanical parametrizations, segregation, degradation, caking | lase welding, plates | light emitting diodes (LEDs), ruggedized electronic display | light emitting diodes (LEDs), thermal management, optical and thermal modelling techniques, luminance, ruggedized electronic display, LED, LCD, backlights | micro-particle imaging velocimetry (micro-PIV), fluid flow, electrodeposition of copper, megasonic agitation | microelectronics; microvias; electrodeposition; enhanced ion transport; megasonic agitation; acoustic streaming; | microvia fabrication, electroplating | numerical modeling, high aspect ratio microvia, electroplating, megasonic agitation, acoustic streaming | welding distortion, thick section welding, weldpool dynamics, shipbuilding | welding phenomena, fluid dynamics, solid mechanics, finite volume methods
Number of items: 28.

CCFL, LEDs, thermal, mechanical, optical behaviour

Lee, Yek Bing, Strusevich, N., Yan-Yin, Chun and Bailey, C. ORCID: 0000-0002-9438-3879 (2009) Analysis tools for thermal characterization, performance and reliability of rugged electronic displays. In: ISSE 2009: 32nd International Spring Seminar on Electronics Technology: Hetero System Integration, the path to New Solutions in the Modern Electronics - Conference Proceedings. Institute of Electrical and Electronics Engineers, Piscataway, NJ, USA, pp. 1-5. ISBN 978-1-4244-4260-7 (doi:https://doi.org/10.1109/ISSE.2009.5206926)

CFD, electrodeposition, level set method, megasonic agitation, microsystems, LIGA

Hughes, Michael, Strussevich, Nadia, Bailey, Christopher ORCID: 0000-0002-9438-3879, McManus, Kevin, Kaufmann, Jens, Flynn, David and Desmulliez, Marc P.Y. (2009) Numerical algorithms for modelling electrodeposition: Tracking the deposition front under forced convection from megasonic agitation. International Journal for Numerical Methods in Fluids, 64 (3). pp. 237-268. ISSN 0271-2091 (Print), 1097-0363 (Online) (doi:https://doi.org/10.1002/fld.2140)

Design for Reliability modelling, System-in-Package (SiP) structures, NXP, Wafer Level Packaging (WLP), Finite Element Analysis (FEA)

Stoyanov, Stoyan ORCID: 0000-0001-6091-1226, Strusevitch, Nadia, Rizvi, Jahir, Georgel, Vincent, Yannou, Jean-Marc and Bailey, Chris ORCID: 0000-0002-9438-3879 (2008) Design for reliability for wafer level system in package. In: 2nd Electronics System-Integration Technology Conference, 2008. ESTC 2008. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 293-298. ISBN 978-1-4244-2814-4 (Print), 978-1-4244-2813-7 (Online) (doi:https://doi.org/10.1109/ESTC.2008.4684364)

Megasonic Agitation; Printed Circuit Board Fabrication

Jones, Thomas D.A., Flynn, David, Desmulliez, Marc P.Y., Price, Dennis, Beadel, Matthew, Strusevich, Nadia, Patel, Mayur, Bailey, Chris ORCID: 0000-0002-9438-3879 and Costello, Suzanne (2016) Morphology and acoustic artefacts of copper deposits electroplated using megasonic assisted agitation. Circuit World, 42 (3). pp. 127-140. ISSN 0305-6120 (doi:https://doi.org/10.1108/CW-03-2016-0006)

SiP structure, package design parameters, thermo-mechanical behaviour, non-linear transient finite element simulations

Stoyanov, Stoyan ORCID: 0000-0001-6091-1226, Bailey, Christopher ORCID: 0000-0002-9438-3879, Strusevitch, Nadia and Yannou, J.-M. (2007) Computational approach for reliable and robust system-in-package design. 2007 30th International Spring Seminar On Electronics Technology. International Spring Seminar on Electronics Technology ISSE . Institute of Electrical and Electronics Engineers, Inc., New York, pp. 40-45. ISBN 9781424412174 (doi:https://doi.org/10.1109/ISSE.2007.4432818)

SiP structure, thermo-mechanical behaviour, reduced order models (ROM)

Stoyanov, Stoyan ORCID: 0000-0001-6091-1226, Yannou, J.-M., Bailey, Christopher ORCID: 0000-0002-9438-3879 and Strusevitch, Nadia (2007) Reliability based design optimisation for system-in-package. In: Ernst, L.J., Zhang, G.Q., Rodgers, P., Meuwissen, M., Marco, S., Van Driel, W.D. and De Saint Leger, O., (eds.) EUROSIME 2007: Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, Proceedings. Institute of Electrical and Electronics Engineers, Inc., New York, pp. 289-296. ISBN 9781424411054 (doi:https://doi.org/10.1109/ESIME.2007.359948)

SiP technology, thermo-mechanical reliability analysis, stacked die, side-by-side dies, embedded die, finite element analysis, numerical optimisation, uncertainty analysis, lead free solder interconnects, accelerated temperature cycle, fatigue life-time, warpage

Bailey, C. ORCID: 0000-0002-9438-3879, Stoyanov, S. ORCID: 0000-0001-6091-1226, Strusevich, N. and Yannou, J.-M. (2007) Reliability analysis of SiP structures. HDP'07: Proceedings of the 2007 International Symposium on High Density Packaging and Microsystem Integration. Institute of Electrical and Electronics Engineers, Inc., New York, p. 38. ISBN 9781424412525 (doi:https://doi.org/10.1109/HDP.2007.4283556)

SiP, packaging design, solder joints, numerical modelling

Strusevitch, Nadia, Stoyanov, Stoyan ORCID: 0000-0001-6091-1226, Liu, D., Bailey, Christopher ORCID: 0000-0002-9438-3879, Richardson, A., Dumas, N., Yannou, J.M. and Georgel, V. (2006) Modelling the behavior of solder joints for wafer level SiP. In: Pang, J.H.L., Vaidyanathan, K., Wong, S.C.K. and Tee, T.Y., (eds.) 2006 8th Electronics Packaging Technology Conference (EPTC 2006) : 6-8 December 2006, Singapore. IEEE, Picsataway, N.J., pp. 127-132. ISBN 1424406641; 142440665X (doi:https://doi.org/10.1109/EPTC.2006.342703)

agitation method, megasonic acoustic streaming, plating rate, uniformity, electroplating, electrodeposition, metals, copper

Kaufmann, Jens Georg, Desmulliez, Marc P.Y., Tian, Yingtao, Price, Dennis, Hughes, Mike, Strusevitch, Nadia, Bailey, Chris ORCID: 0000-0002-9438-3879, Liu, Changqing and Hutt, David (2009) Megasonic agitation for enhanced electrodeposition of copper. Microsystem Technologies, 15 (8). pp. 1245-1254. ISSN 0946-7076 (Print), 1432-1858 (Online) (doi:https://doi.org/10.1007/s00542-009-0886-2)

circuits, electromechanical devices, electronics industry, reliability management

Richardson, Andrew, Bailey, Christopher ORCID: 0000-0002-9438-3879, Yanou, Jean Marc, Dumas, Norbert, Liu, Dongsheng, Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 and Strusevitch, Nadia (2007) "System in package technology" - design for manufacture challenges. Circuit World, 33 (1). pp. 36-46. ISSN 0305-6120 (doi:https://doi.org/10.1108/03056120710723706)

electrodeposition, electroplating, megasonic agitation, acoustic streaming, aspect ratio

Costello, S., Flynn, D., Kay, R.W., Desmulliez, M.P.Y., Strusevich, N., Patel, M.K., Bailey, C. ORCID: 0000-0002-9438-3879, Jones, A.C., Bennett, M., Price, D., Habeshaw, R., Demore, C. and Cochran, S. (2011) Electrodeposition of copper into PCB vias under megasonic agitation. In: MME 2011. Proceedings of the 22nd Micromechanics and Microsystems Technology Europe Workshop. MME2011, Norway, pp. 266-269. ISBN 9788278602249

electrodeposition, micro-particle imaging velocimetry (micro-PIV), fluid flow, electrodeposition of copper, megasonic agitation

Costello, S., Strusevich, N., Flyyn, D., Kay, R.W., Patel, M.K., Bailey, C. ORCID: 0000-0002-9438-3879, Price, D., Bennet, M., Jones, A.C. and Desmulliez, M.P.Y. (2012) Electrodeposition of copper into high aspect ratio PCB micro-via using megasonic agitation. In: DTIP 2012 Conference 2012: Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS. EDA Publishing Association, Grenoble, France, pp. 98-102. ISBN 9782355000201

electrodeposition, microvias, current density, electrolytes, electroplating, printed circuits, vias

Strusevich, Nadezhda, Patel, Mayur and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2012) Parametric modeling study of basic electrodeposition in microvias. In: The 14th International Conference on Electronic Materials and Packaging, 13-16 December 2012, Citygate, Lantau Island, Hong Kong. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 145-149. ISBN 9781467349444 (doi:https://doi.org/10.1109/EMAP.2012.6507864)

electrodeposition, numerical modelling

Strusevitch, Nadia, Hughes, Michael, Bailey, Christopher ORCID: 0000-0002-9438-3879 and Djambazov, Georgi (2008) Numerical modelling of electrodeposition phenomena. 2nd Electronics System-Integration Technology Conference, Greenwich, UK, 1-4 September 2008. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 281-286. ISBN 978-1-4244-2813-7 (Print) 978-1-4244-2813-7 (Online) (doi:https://doi.org/10.1109/ESTC.2008.4684362)

electrolyte fluid flow, micro-particle imaging velocimetry (micro-PIV), fibre optic hydrophone, printed circuit board (PCB), high aspect ratio microvias

Costello, S., Strusevich, N., Patel, M.K., Bailey, C. ORCID: 0000-0002-9438-3879, Flynn, D., Kay, R.W., Price, D., Bennett, M., Jones, A.C., Habeshaw, R., Demore, C., Cochran, S. and Desmulliez, M.P.Y. (2011) Characterisation of ion transportation during electroplating of high aspect ratio microvias using megasonic agitation. In: EMPC-2011: 18th European Microelectronics and Packaging Conference. Proceedings. IEEE Conference Publications . Institute of Electrical and Electronic Engineers, Inc., Piscataway, NJ, USA, pp. 1-7. ISBN 9780956808606

electronics manufacturing, numerical modelling, high aspect ratio microvia, electroplating, megasonic agitation, acoustic streaming

Strusevich, Nadezhda, Desmulliez, Marc P.Y., Abraham, Eitan, Flynn, David, Jones, Thomas, Patel, Mayur and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2013) Electroplating for high aspect ratio vias in PCB manufacturing: enhancement capabilities of acoustic streaming. Advances in Manufacturing, 1 (3). pp. 211-217. ISSN 2095-3127 (Print), 2195-3597 (Online) (doi:https://doi.org/10.1007/s40436-013-0039-9)

electroplating, electrodeposition, megasonic agitation, high density interconnection technology, microvias

Kaufmann, Jens, Desmulliez, Marc P.Y., Price, Dennis, Hughes, Mike, Strusevitch, Nadia and Bailey, Chris ORCID: 0000-0002-9438-3879 (2008) Influence of megasonic agitation on the electrodeposition of high aspect ratio blind vias. 2nd Electronics System-Integration Technology Conference, 2008. ESTC 2008. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 1235-1240. ISBN 978-1-4244-2813-7 (doi:https://doi.org/10.1109/ESTC.2008.4684530)

granular material, core flow, segregation, continuum modeling, micro-physical parametrizations,

Christakis, Nicholas, Chapelle, Pierre, Strusevich, Nadezhda, Bridle, Ian, Baxter, John, Patel, Mayur K., Cross, Mark, Tüzün, Ugur, Reed, Alan R. and Bradley, Michael S. A. (2006) A hybrid numerical model for predicting segregation during core flow discharge. Advanced Powder Technology, 17 (6). pp. 641-662. ISSN 0921-8831 (doi:https://doi.org/10.1163/156855206778917715)

granular materials, continuum modelling, micro-mechanical parametrizations, segregation, degradation, caking

Chapelle, P., Christakis, N., Wang, J., Strusevich, N., Patel, M.K., Cross, M., Abou-Chakra, H., Baxter, J. and Tuzun, U. (2005) Application of simulation technologies in the analysis of granular material behaviour during transport and storage. Proceedings of the Institution of Mechanical Engineers, Part E: Journal of Process Mechanical Engineering, 219 (1). pp. 43-52. ISSN 0954-4089 (Print), 2041-3009 (Online) (doi:https://doi.org/10.1243/095440805X7044)

lase welding, plates

Strusevich, Nadezhda V., Pericleous, Koulis ORCID: 0000-0002-7426-9999 and Hughes, Michael (2002) Characterisation of weldpool shapes in the laser welding of thick plates. In: Mathematical Modelling of Weld Phenomena. Materials Modelling, 6 . Maney Publishing for the Institute of Materials, Minerals and Mining, London, England, UK, pp. 83-92. ISBN 9781902653563

light emitting diodes (LEDs), ruggedized electronic display

Yek, Bing Lee, Strusevich, N., Bailey, C. ORCID: 0000-0002-9438-3879, Chun-Yan, Yin and Cartwright, C. (2009) Packaging of light emitting diodes for display backlights: Need for multi-disciplinary design tools. In: Electronic Packaging Technology & High Density Packaging, 2009. Institute of Electrical and Electronic Engineers, Inc, Piscataway, NJ, USA, pp. 205-208. ISBN 978-1-4244-4659-9 (online), 978-1-4244-4658-2 (print) (doi:https://doi.org/10.1109/ICEPT.2009.5270764)

light emitting diodes (LEDs), thermal management, optical and thermal modelling techniques, luminance, ruggedized electronic display, LED, LCD, backlights

Bailey, C. ORCID: 0000-0002-9438-3879, Lee, Y., Lu, H. ORCID: 0000-0002-4392-6562, Strusevich, N. and Yin, C. ORCID: 0000-0003-0298-0420 (2010) Packaging of LED backlights for ruggedised displays. In: International Symposium on Advanced Packaging Materials: Microtech, 2010. APM '10. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 98-101. ISBN 9781424467563 (doi:https://doi.org/10.1109/ISAPM.2010.5441377)

micro-particle imaging velocimetry (micro-PIV), fluid flow, electrodeposition of copper, megasonic agitation

Costello, S., Strusevich, N., Flynn, D., Kay, R.W., Patel, M.K., Bailey, C., Price, D., Bennet, M., Jones, A.C. and Desmulliez, M.P.Y. (2013) Electrodeposition of copper into high aspect ratio PCB micro-via using megasonic agitation. Microsystem Technologies, 19 (6). pp. 783-790. ISSN 0946-7076 (Print), 1432-1858 (Online) (doi:https://doi.org/10.1007/s00542-013-1746-7)

microelectronics; microvias; electrodeposition; enhanced ion transport; megasonic agitation; acoustic streaming;

Strusevich, Nadezhda (2013) Numerical modelling of electrodeposition process for printed circuit boards manufacturing. PhD thesis, University of Greenwich.

microvia fabrication, electroplating

Strusevich, Nadia, Bailey, Chris ORCID: 0000-0002-9438-3879, Costello, Suzanne, Patel, Mayur and Desmulliez, Marc (2013) Numerical modeling of the electroplating process for microvia fabrication. In: 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2013. Institute of Electrical and Electronics Engineers, Piscataway, NJ, USA. ISBN 9781467361385 (doi:https://doi.org/10.1109/EuroSimE.2013.6529989)

numerical modeling, high aspect ratio microvia, electroplating, megasonic agitation, acoustic streaming

Strusevich, N., Bailey, C. ORCID: 0000-0002-9438-3879 and Patel, M.K. (2013) Computational modeling of electrodepostion in small features under megasonic agitation. In: 2013 European Microelectronics Packaging Conference (EMPC). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA.

welding distortion, thick section welding, weldpool dynamics, shipbuilding

Tsirkas, S.A., Papanikos, P., Pericleous, K. ORCID: 0000-0002-7426-9999, Strusevitch, N., Boitout, F. and Bergheau, J.M. (2003) Evaluation of distortions in laser welded shipbuilding parts using local-global finite element approach. Science and Technology of Welding and Joining, 8 (2). pp. 79-88. ISSN 1362-1718 (Print), 1743-2936 (Online) (doi:https://doi.org/10.1179/136217103225010899)

welding phenomena, fluid dynamics, solid mechanics, finite volume methods

Taylor, Gareth A., Hughes, Michael, Strusevich, Nadia and Pericleous, Koulis ORCID: 0000-0002-7426-9999 (2002) Finite volume methods applied to the computational modelling of welding phenomena. Applied Mathematical Modelling, 26 (2). pp. 311-322. ISSN 0307-904X (doi:https://doi.org/10.1016/S0307-904X(01)00063-4)

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