2016

Jones, Thomas D.A., Flynn, David, Desmulliez, Marc P.Y., Price, Dennis, Beadel, Matthew, Strusevich, Nadia, Patel, Mayur, Bailey, Chris ORCID: https://orcid.org/0000-0002-9438-3879 and Costello, Suzanne (2016) Morphology and acoustic artefacts of copper deposits electroplated using megasonic assisted agitation. Circuit World, 42 (3). pp. 127-140. ISSN 0305-6120 (doi:10.1108/CW-03-2016-0006)

2013

Strusevich, Nadezhda, Desmulliez, Marc P.Y., Abraham, Eitan, Flynn, David, Jones, Thomas, Patel, Mayur and Bailey, Christopher ORCID: https://orcid.org/0000-0002-9438-3879 (2013) Electroplating for high aspect ratio vias in PCB manufacturing: enhancement capabilities of acoustic streaming. Advances in Manufacturing, 1 (3). pp. 211-217. ISSN 2095-3127 (Print), 2195-3597 (Online) (doi:10.1007/s40436-013-0039-9)

Strusevich, Nadezhda (2013) Numerical modelling of electrodeposition process for printed circuit boards manufacturing. PhD thesis, University of Greenwich.

Costello, S., Strusevich, N., Flynn, D., Kay, R.W., Patel, M.K., Bailey, C., Price, D., Bennet, M., Jones, A.C. and Desmulliez, M.P.Y. (2013) Electrodeposition of copper into high aspect ratio PCB micro-via using megasonic agitation. Microsystem Technologies, 19 (6). pp. 783-790. ISSN 0946-7076 (Print), 1432-1858 (Online) (doi:10.1007/s00542-013-1746-7)

Strusevich, N., Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879 and Patel, M.K. (2013) Computational modeling of electrodepostion in small features under megasonic agitation. In: 2013 European Microelectronics Packaging Conference (EMPC). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA.

Strusevich, Nadia, Bailey, Chris ORCID: https://orcid.org/0000-0002-9438-3879, Costello, Suzanne, Patel, Mayur and Desmulliez, Marc (2013) Numerical modeling of the electroplating process for microvia fabrication. In: 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2013. Institute of Electrical and Electronics Engineers, Piscataway, NJ, USA. ISBN 9781467361385 (doi:10.1109/EuroSimE.2013.6529989)

2012

Costello, S., Strusevich, N., Flyyn, D., Kay, R.W., Patel, M.K., Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879, Price, D., Bennet, M., Jones, A.C. and Desmulliez, M.P.Y. (2012) Electrodeposition of copper into high aspect ratio PCB micro-via using megasonic agitation. In: DTIP 2012 Conference 2012: Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS. EDA Publishing Association, Grenoble, France, pp. 98-102. ISBN 9782355000201

Strusevich, Nadezhda, Patel, Mayur and Bailey, Christopher ORCID: https://orcid.org/0000-0002-9438-3879 (2012) Parametric modeling study of basic electrodeposition in microvias. In: The 14th International Conference on Electronic Materials and Packaging, 13-16 December 2012, Citygate, Lantau Island, Hong Kong. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 145-149. ISBN 9781467349444 (doi:10.1109/EMAP.2012.6507864)

2011

Costello, S., Strusevich, N., Patel, M.K., Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879, Flynn, D., Kay, R.W., Price, D., Bennett, M., Jones, A.C., Habeshaw, R., Demore, C., Cochran, S. and Desmulliez, M.P.Y. (2011) Characterisation of ion transportation during electroplating of high aspect ratio microvias using megasonic agitation. In: EMPC-2011: 18th European Microelectronics and Packaging Conference. Proceedings. IEEE Conference Publications . Institute of Electrical and Electronic Engineers, Inc., Piscataway, NJ, USA, pp. 1-7. ISBN 9780956808606

Costello, S., Flynn, D., Kay, R.W., Desmulliez, M.P.Y., Strusevich, N., Patel, M.K., Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879, Jones, A.C., Bennett, M., Price, D., Habeshaw, R., Demore, C. and Cochran, S. (2011) Electrodeposition of copper into PCB vias under megasonic agitation. In: MME 2011. Proceedings of the 22nd Micromechanics and Microsystems Technology Europe Workshop. MME2011, Norway, pp. 266-269. ISBN 9788278602249

2010

Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879, Lee, Y., Lu, H. ORCID: https://orcid.org/0000-0002-4392-6562, Strusevich, N. and Yin, C. ORCID: https://orcid.org/0000-0003-0298-0420 (2010) Packaging of LED backlights for ruggedised displays. In: International Symposium on Advanced Packaging Materials: Microtech, 2010. APM '10. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 98-101. ISBN 9781424467563 (doi:10.1109/ISAPM.2010.5441377)

2009

Hughes, Michael, Strussevich, Nadia, Bailey, Christopher ORCID: https://orcid.org/0000-0002-9438-3879, McManus, Kevin, Kaufmann, Jens, Flynn, David and Desmulliez, Marc P.Y. (2009) Numerical algorithms for modelling electrodeposition: Tracking the deposition front under forced convection from megasonic agitation. International Journal for Numerical Methods in Fluids, 64 (3). pp. 237-268. ISSN 0271-2091 (Print), 1097-0363 (Online) (doi:10.1002/fld.2140)

Yek, Bing Lee, Strusevich, N., Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879, Chun-Yan, Yin and Cartwright, C. (2009) Packaging of light emitting diodes for display backlights: Need for multi-disciplinary design tools. In: Electronic Packaging Technology & High Density Packaging, 2009. Institute of Electrical and Electronic Engineers, Inc, Piscataway, NJ, USA, pp. 205-208. ISBN 978-1-4244-4659-9 (online), 978-1-4244-4658-2 (print) (doi:10.1109/ICEPT.2009.5270764)

Kaufmann, Jens Georg, Desmulliez, Marc P.Y., Tian, Yingtao, Price, Dennis, Hughes, Mike, Strusevitch, Nadia, Bailey, Chris ORCID: https://orcid.org/0000-0002-9438-3879, Liu, Changqing and Hutt, David (2009) Megasonic agitation for enhanced electrodeposition of copper. Microsystem Technologies, 15 (8). pp. 1245-1254. ISSN 0946-7076 (Print), 1432-1858 (Online) (doi:10.1007/s00542-009-0886-2)

Lee, Yek Bing, Strusevich, N., Yan-Yin, Chun and Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879 (2009) Analysis tools for thermal characterization, performance and reliability of rugged electronic displays. In: ISSE 2009: 32nd International Spring Seminar on Electronics Technology: Hetero System Integration, the path to New Solutions in the Modern Electronics - Conference Proceedings. Institute of Electrical and Electronics Engineers, Piscataway, NJ, USA, pp. 1-5. ISBN 978-1-4244-4260-7 (doi:10.1109/ISSE.2009.5206926)

2008

Stoyanov, Stoyan ORCID: https://orcid.org/0000-0001-6091-1226, Strusevitch, Nadia, Rizvi, Jahir, Georgel, Vincent, Yannou, Jean-Marc and Bailey, Chris ORCID: https://orcid.org/0000-0002-9438-3879 (2008) Design for reliability for wafer level system in package. In: 2nd Electronics System-Integration Technology Conference, 2008. ESTC 2008. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 293-298. ISBN 978-1-4244-2814-4 (Print), 978-1-4244-2813-7 (Online) (doi:10.1109/ESTC.2008.4684364)

Kaufmann, Jens, Desmulliez, Marc P.Y., Price, Dennis, Hughes, Mike, Strusevitch, Nadia and Bailey, Chris ORCID: https://orcid.org/0000-0002-9438-3879 (2008) Influence of megasonic agitation on the electrodeposition of high aspect ratio blind vias. 2nd Electronics System-Integration Technology Conference, 2008. ESTC 2008. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 1235-1240. ISBN 978-1-4244-2813-7 (doi:10.1109/ESTC.2008.4684530)

Strusevitch, Nadia, Hughes, Michael, Bailey, Christopher ORCID: https://orcid.org/0000-0002-9438-3879 and Djambazov, Georgi (2008) Numerical modelling of electrodeposition phenomena. 2nd Electronics System-Integration Technology Conference, Greenwich, UK, 1-4 September 2008. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 281-286. ISBN 978-1-4244-2813-7 (Print) 978-1-4244-2813-7 (Online) (doi:10.1109/ESTC.2008.4684362)

2007

Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879, Stoyanov, S. ORCID: https://orcid.org/0000-0001-6091-1226, Strusevich, N. and Yannou, J.-M. (2007) Reliability analysis of SiP structures. HDP'07: Proceedings of the 2007 International Symposium on High Density Packaging and Microsystem Integration. Institute of Electrical and Electronics Engineers, Inc., New York, p. 38. ISBN 9781424412525 (doi:10.1109/HDP.2007.4283556)

Stoyanov, Stoyan ORCID: https://orcid.org/0000-0001-6091-1226, Yannou, J.-M., Bailey, Christopher ORCID: https://orcid.org/0000-0002-9438-3879 and Strusevitch, Nadia (2007) Reliability based design optimisation for system-in-package. In: Ernst, L.J., Zhang, G.Q., Rodgers, P., Meuwissen, M., Marco, S., Van Driel, W.D. and De Saint Leger, O., (eds.) EUROSIME 2007: Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, Proceedings. Institute of Electrical and Electronics Engineers, Inc., New York, pp. 289-296. ISBN 9781424411054 (doi:10.1109/ESIME.2007.359948)

Stoyanov, Stoyan ORCID: https://orcid.org/0000-0001-6091-1226, Bailey, Christopher ORCID: https://orcid.org/0000-0002-9438-3879, Strusevitch, Nadia and Yannou, J.-M. (2007) Computational approach for reliable and robust system-in-package design. 2007 30th International Spring Seminar On Electronics Technology. International Spring Seminar on Electronics Technology ISSE . Institute of Electrical and Electronics Engineers, Inc., New York, pp. 40-45. ISBN 9781424412174 (doi:10.1109/ISSE.2007.4432818)

Richardson, Andrew, Bailey, Christopher ORCID: https://orcid.org/0000-0002-9438-3879, Yanou, Jean Marc, Dumas, Norbert, Liu, Dongsheng, Stoyanov, Stoyan ORCID: https://orcid.org/0000-0001-6091-1226 and Strusevitch, Nadia (2007) "System in package technology" - design for manufacture challenges. Circuit World, 33 (1). pp. 36-46. ISSN 0305-6120 (doi:10.1108/03056120710723706)

2006

Strusevitch, Nadia, Stoyanov, Stoyan ORCID: https://orcid.org/0000-0001-6091-1226, Liu, D., Bailey, Christopher ORCID: https://orcid.org/0000-0002-9438-3879, Richardson, A., Dumas, N., Yannou, J.M. and Georgel, V. (2006) Modelling the behavior of solder joints for wafer level SiP. In: Pang, J.H.L., Vaidyanathan, K., Wong, S.C.K. and Tee, T.Y., (eds.) 2006 8th Electronics Packaging Technology Conference (EPTC 2006) : 6-8 December 2006, Singapore. IEEE, Picsataway, N.J., pp. 127-132. ISBN 1424406641; 142440665X (doi:10.1109/EPTC.2006.342703)

Christakis, Nicholas, Chapelle, Pierre, Strusevich, Nadezhda, Bridle, Ian, Baxter, John, Patel, Mayur K., Cross, Mark, Tüzün, Ugur, Reed, Alan R. and Bradley, Michael S. A. (2006) A hybrid numerical model for predicting segregation during core flow discharge. Advanced Powder Technology, 17 (6). pp. 641-662. ISSN 0921-8831 (doi:10.1163/156855206778917715)

2005

Chapelle, P., Christakis, N., Wang, J., Strusevich, N., Patel, M.K., Cross, M., Abou-Chakra, H., Baxter, J. and Tuzun, U. (2005) Application of simulation technologies in the analysis of granular material behaviour during transport and storage. Proceedings of the Institution of Mechanical Engineers, Part E: Journal of Process Mechanical Engineering, 219 (1). pp. 43-52. ISSN 0954-4089 (Print), 2041-3009 (Online) (doi:10.1243/095440805X7044)

2003

Tsirkas, S.A., Papanikos, P., Pericleous, K. ORCID: https://orcid.org/0000-0002-7426-9999, Strusevitch, N., Boitout, F. and Bergheau, J.M. (2003) Evaluation of distortions in laser welded shipbuilding parts using local-global finite element approach. Science and Technology of Welding and Joining, 8 (2). pp. 79-88. ISSN 1362-1718 (Print), 1743-2936 (Online) (doi:10.1179/136217103225010899)

2002

Strusevich, Nadezhda V., Pericleous, Koulis ORCID: https://orcid.org/0000-0002-7426-9999 and Hughes, Michael (2002) Characterisation of weldpool shapes in the laser welding of thick plates. In: Mathematical Modelling of Weld Phenomena. Materials Modelling, 6 . Maney Publishing for the Institute of Materials, Minerals and Mining, London, England, UK, pp. 83-92. ISBN 9781902653563

Taylor, Gareth A., Hughes, Michael, Strusevich, Nadia and Pericleous, Koulis ORCID: https://orcid.org/0000-0002-7426-9999 (2002) Finite volume methods applied to the computational modelling of welding phenomena. Applied Mathematical Modelling, 26 (2). pp. 311-322. ISSN 0307-904X (doi:10.1016/S0307-904X(01)00063-4)