3D printing; Electronics packaging; Design tools; Modelling; Reliability

Tilford, Tim ORCID: https://orcid.org/0000-0001-8307-6403, Stoyanov, Stoyan ORCID: https://orcid.org/0000-0001-6091-1226, Braun, Jessica, Janhsen, Jan Cristophe, Burgard, Matthias, Birch, Richard and Bailey, Chris ORCID: https://orcid.org/0000-0002-9438-3879 (2018) Design, manufacture and test for reliable 3D printed electronics packaging. Microelectronics Reliability, 85. pp. 109-117. ISSN 0026-2714 (doi:10.1016/j.microrel.2018.04.008)

Additive Manufacturing, Numerical Analysis, Microfluidics, Microelectronics

Tilford, T. ORCID: https://orcid.org/0000-0001-8307-6403, Bruan, J., Janhsen, J. C., Burgard, M. and Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879 (2018) SPH analysis of inkjet droplet impact dynamics. In: Proceedings of the 13th World Congress on Computational Mechanics (WCCM XIII) and 2nd Pan American Congress on Computational Mechanics (PANACM II). WCCM.

Geologic Measurements, Microwave Propagation, Non-Destructive Testing, Permittivity, Radar Applications, Radar Measurements

Blanche, Jamie, Flynn, David, Lewis, Helen, Couples, Gary, Buckman, Jim, Bailey, Chris ORCID: https://orcid.org/0000-0002-9438-3879 and Tilford, Timothy ORCID: https://orcid.org/0000-0001-8307-6403 (2018) Analysis of sandstone pore space fluid saturation and mineralogy variation via application of monostatic K-band frequency modulated continuous wave radar. IEEE Access, 6. pp. 44376-44389. ISSN 2169-3536 (Online) (doi:10.1109/ACCESS.2018.2863024)

Kernel, Numerical models, Analytical models, Microelectronics, Fluids, Graphics processing units, Surface tension

Tilford, T. ORCID: https://orcid.org/0000-0001-8307-6403, Stoyanov, S. ORCID: https://orcid.org/0000-0001-6091-1226, Tourloukis, G. and Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879 (2016) Numerical analysis of droplet deposition in inkjet printed electronics assembly. In: 2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE). IEEE, pp. 1-7. ISBN 978-1-5090-2106-2 (doi:10.1109/EuroSimE.2016.7463358)

Model Order Reduction (MOR); Finite Element Method (FEM); thermal-mechanical analysis; Power Electronics Module (PEM); reliability assessment; parametric Model Order Reduction (pMOR)

Hassan, Sheikh ORCID: https://orcid.org/0000-0002-6215-7340, Rajaguru, Pushparajah ORCID: https://orcid.org/0000-0002-6041-0517, Stoyanov, Stoyan ORCID: https://orcid.org/0000-0001-6091-1226, Bailey, Chris and Tilford, Timothy ORCID: https://orcid.org/0000-0001-8307-6403 (2024) Coupled thermal-mechanical analysis of power electronic modules with finite element method and parametric model order reduction. Power Electronic Devices and Components:100063. ISSN 2772-3704 (Online) (doi:10.1016/j.pedc.2024.100063)

Power components, Power electronics module, IGBT, Wire bonds, thermal fatigue, damage, reliability, machine learning, neural network, physics-informed data

Stoyanov, Stoyan ORCID: https://orcid.org/0000-0001-6091-1226, Sulthana, Razia ORCID: https://orcid.org/0000-0001-5331-1310, Tilford, Tim ORCID: https://orcid.org/0000-0001-8307-6403, Zhang, Xiaotian, Hu, Yihua, Yang, Xingyu, Shen, Yaochun and Wang, Yangang (2025) Modelling the fatigue damage in power components using machine learning technology. Power Electronic Devices and Components, 10:100079. ISSN 2772-3704 (Online) (doi:10.1016/j.pedc.2025.100079)

Topological Optimisation

Santhakrishnan, M., Tilford, T. ORCID: https://orcid.org/0000-0001-8307-6403 and Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879 (2016) On the Application of Topology Optimisation Techniques to Thermal Management of Microelectronics Systems. In: IEEE EuroSimE conference, 17-20 April, 2016, Montpellier, France.

Topology; optimisation; engineering design

Santhanakrishnan, Mani Sekaran, Tilford, Timothy ORCID: https://orcid.org/0000-0001-8307-6403 and Bailey, Christopher ORCID: https://orcid.org/0000-0002-9438-3879 (2018) Performance assessment of density and level-set topology optimisation methods for 3D heatsink design. Journal of Algorithms and Computational Technology, 12 (3). pp. 273-287. ISSN 1748-3018 (Print), 1748-3026 (Online) (doi:10.1177/1748301818779019)

additive manufacturing, inkjet printing, microelectronics fabrication, reliability, numerical analysis

Tilford, Tim ORCID: https://orcid.org/0000-0001-8307-6403, Stoyanov, Stoyan ORCID: https://orcid.org/0000-0001-6091-1226, Braun, Jessica, Janhsen, Jan Christoph, Patel, Mayur K. and Bailey, Chris ORCID: https://orcid.org/0000-0002-9438-3879 (2021) Comparative reliability of inkjet-printed electronics packaging. IEEE Transactions on Components, Packaging and Manufacturing Technology, 11 (2). pp. 351-362. ISSN 2156-3950 (Print), 2156-3985 (Online) (doi:10.1109/TCPMT.2021.3049952)

assembly, heating, material properties, temperature distribution, thermal conductivity

Tilford, Timothy ORCID: https://orcid.org/0000-0001-8307-6403, Cook, A., Lu, H. ORCID: https://orcid.org/0000-0002-4392-6562, Ramambasoa, A. and Conseil, F. (2014) Numerical analysis of the performance of highly oriented pyrolytic graphite heat spreader in thermal management of microelectronics assemblies. In: Electronics Systemintegration Technology Conference, 16-18 Sep 2014, Helsinki, Finland. (doi:10.1109/ESTC.2014.6962815)

cure kinetics models, encapsulant material,

Tilford, T. ORCID: https://orcid.org/0000-0001-8307-6403, Ferenets, M., Adamietz, R., Pavuluri, S. K., Desmulliez, M. P. Y. and Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879 (2012) Assessment of the accuracy of cure kinetics models and fitting approaches utilised in analysis of microelectronics encapsulation materials. In: Electronics Packaging Technology Conference (EPTC), 2011 13th. IEEE Conference Publications . Institute of Electrical and Electronics Engineers, Piscataway, NJ, USA, pp. 262-267. ISBN 978-1-4577-1983-7 (Print), 978-1-4577-1981-3 (Online) (doi:10.1109/EPTC.2011.6184428)

electromagnetic heating, encapsulation, packaging

Pavuluri, S.K., Ferenets, M., Goussetis, G., Desmulliez, M.P.Y., Tilford, T. ORCID: https://orcid.org/0000-0001-8307-6403, Adamietz, R., Muller, G., Eicher, F. and Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879 (2012) Encapsulation of microelectronic components using open-ended microwave oven. IEEE Transactions on Components, Packaging and Manufacturing Technology, 2 (5). pp. 799-806. ISSN 2156-3950 (doi:10.1109/TCPMT.2011.2177524)

electronic engineering, microwaves, polymers, simulation

Tilford, Tim ORCID: https://orcid.org/0000-0001-8307-6403, Sinclair, Keith I., Bailey, Christopher ORCID: https://orcid.org/0000-0002-9438-3879, Desmulliez, Marc P.Y., Goussetis, George, Parrott, Kevin and Sangster, Alan J. (2007) Multiphysics simulation of microwave curing in micro-electronics packaging applications. Soldering & Surface Mount Technology, 19 (3). pp. 26-33. ISSN 0954-0911 (doi:10.1108/09540910710843757)

electronics packaging, curing encapsulant materials

Adamietz, R., Tilford, T. ORCID: https://orcid.org/0000-0001-8307-6403, Ferenets, M., Desmulliez, M.P.Y., Muller, G., Othman, N and Eicher, F. (2010) Modular microwave-based system for packaging applications. In: International Conference on Electronics Packaging (ICEP2010), 12-14 May 2010, Sapporo, Hokkaido, Japan. (Unpublished)

electronics reliability; optimisation; heat transfer; Vortex generator; plate fin heat sink; response surface model; computational fluid; dynamics; heat exchanger

Santhanakrishnan, Mani Sekaran, Tilford, Timothy ORCID: https://orcid.org/0000-0001-8307-6403 and Bailey, Christopher ORCID: https://orcid.org/0000-0002-9438-3879 (2022) Heat transfer characteristics of plate fin heat sink with longitudinal vortex generators. International Journal of Numerical Methods for Heat and Fluid Flow, 33 (3). pp. 1203-1228. ISSN 0961-5539 (doi:10.1108/HFF-06-2022-0386)

encapsulation, microwave curing, microelectronics packaging, reliability testing, open-ended oven, residual stress, accelerated stress test, convection oven

Desmulliez, Marc P.Y, Adamietz, Raphael, Pavuluri, Sumanth K., Tilford, Tim ORCID: https://orcid.org/0000-0001-8307-6403, Bailey, Chris ORCID: https://orcid.org/0000-0002-9438-3879, Schreier-Alt, Thomas and Warmuth, Jens (2018) Reliability testing and stress measurement of QFN packages encapsulated by an open-ended microwave curing system. IEEE Transactions on Components, Packaging and Manufacturing Technology, 9 (1). pp. 173-180. ISSN 2156-3950 (Print), 2156-3985 (Online) (doi:10.1109/TCPMT.2018.2859031)

heat sink design, genetic algorithm, shape optimisation, natural convection, CFD

Santhanakrishnan, Mani Sekara, Tilford, Tim ORCID: https://orcid.org/0000-0001-8307-6403 and Bailey, Chris ORCID: https://orcid.org/0000-0002-9438-3879 (2021) Multi-objective NSGA-II based shape optimisation of the cross-sectional shape of passively cooled heat sinks. International Journal of Numerical Methods for Heat and Fluid Flow, 32 (3). pp. 1025-1045. ISSN 0961-5539 (doi:10.1108/HFF-10-2020-0656)

heating, microwave curing, resonant cavity, waveguide resonator

Sinclair, K.I., Goussetis, G., Desmulliez, M.P.Y., Sangster, A.J., Tilford, T. ORCID: https://orcid.org/0000-0001-8307-6403, Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879 and Parrott, A.K. (2008) Optimization of an open-ended microwave oven for microelectronics packaging. IEEE Transactions on Microwave Theory and Techniques, 56 (11). pp. 2635-2641. ISSN 0018-9480 (doi:10.1109/TMTT.2008.2005925)

image classification; ingredient identification; recipe extraction; Deep Neural Networks; domain ontology; natural language Processing

Abdul Kareem, Razia Sulthana ORCID: https://orcid.org/0000-0001-5331-1310, Tilford, Timothy ORCID: https://orcid.org/0000-0001-8307-6403 and Stoyanov, Stoyan ORCID: https://orcid.org/0000-0001-6091-1226 (2024) Fine-grained food image classification and recipe extraction using a customised Deep Neural Network and NLP. Computers in Biology and Medicine. ISSN 0010-4825 (Print), 1879-0534 (Online) (doi:10.1016/j.compbiomed.2024.108528)

jet impingement cooling system, power electronics modules (PEMs), cooling efficiency, numerical modelling

Rizvi, M.J., Skuriat, R., Tilford, Tim ORCID: https://orcid.org/0000-0001-8307-6403, Bailey, Christopher ORCID: https://orcid.org/0000-0002-9438-3879, Johnson, C. Mark and Lu, Hua ORCID: https://orcid.org/0000-0002-4392-6562 (2009) Modelling of jet-impingement cooling for power electronics. In: 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, 2009. EuroSimE 2009. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA. ISBN 978-1-4244-4160-0 (doi:10.1109/ESIME.2009.4938428)

manufacturing systems, nanotechnology, modelling, finite element analysis, deformation, process efficiency

Stoyanov, Stoyan ORCID: https://orcid.org/0000-0001-6091-1226, Tilford, Tim ORCID: https://orcid.org/0000-0001-8307-6403, Amalou, Farid, Cargill, Scott, Bailey, Chris ORCID: https://orcid.org/0000-0002-9438-3879 and Desmulliez, Marc (2011) Modelling and optimisation study on the fabrication of nano-structures using imprint forming process. Engineering Computations, 28 (1). pp. 93-111. ISSN 0264-4401 (doi:10.1108/02644401111097046)

microelectronics packaging, polymer cure models, differential scanning calorimetry (DSC), Fourier transform infra-red spectroscopy (FTIR)

Morris, J.E., Tilford, T. ORCID: https://orcid.org/0000-0001-8307-6403, Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879, Sinclair, K.I. and Desmulliez, M.P.Y. (2009) Polymer cure modeling for microelectronics applications. In: 32nd International Spring Seminar on Electronics Technology, 2009. ISSE 2009. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA. ISBN 978-1-4244-4260-7 (print) (doi:10.1109/ISSE.2009.5206929)

microwave energy, microwave curing system

Adamietz, R., Müller, G., Othman, N., Eicher, F., Tilford, T. ORCID: https://orcid.org/0000-0001-8307-6403, Ferenets, M., Pavuluri, S.K., Desmulliez, M. P.Y. and Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879 (2010) On the integration of microwave curing systems into microelectronics assembly processes. In: Electronics System Integration Technology Conference, ESTC 2010 - Proceedings. IEEE Computer Society, Piscataway, USA, pp. 1-6. ISBN 9781424485536 (Print), 9781424485543 (Online) (doi:10.1109/ESTC.2010.5642827)

microwave heating, thawing, rotation, Maxwell's equations, heat transfer, numerical simulations, moving meshes

Tilford, Tim ORCID: https://orcid.org/0000-0001-8307-6403, Baginski, Ed, Kelder, Jasper, Parrott, Kevin and Pericleous, Koulis A. ORCID: https://orcid.org/0000-0002-7426-9999 (2007) Microwave modelling and validation in food thawing applications. Journal of Microwave Power & Electromagnetic Energy, 41 (4). pp. 30-45. ISSN 0832-7823

microwave oven, curing process, thermomechanical stress development

Tilford, T. ORCID: https://orcid.org/0000-0001-8307-6403, Ferenets, M., Adamietz, R., Pavuluri, S.K., Morris, J.E., Desmulliez, M.P.Y. and Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879 (2010) Numerical analysis of microwave underfill cure in ball-grid packages. In: Electronics System Integration Technology Conference, ESTC 2010 - Proceedings. IEEE Computer Society, Piscataway, USA, pp. 1-6. ISBN 9781424485536 (Print), 9781424485543 (Online) (doi:10.1109/ESTC.2010.5642822)

microwave systems, micro-electronics manufacture, cure process, thermosetting polymer materials

Sinclair, Keith I., Tilford, Tim ORCID: https://orcid.org/0000-0001-8307-6403, Goussetis, George, Bailey, Christopher ORCID: https://orcid.org/0000-0002-9438-3879, Desmulliez, Marc P.Y., Parrott, Kevin and Sangster, Alan J. (2008) Advanced microwave oven for rapid curing of encapsulant. 2nd Electronics System-Integration Technology Conference, 2008. ESTC 2008. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 551-556. ISBN 978-1-4244-2814-4 (print) 978-1-4244-2813-7 (online) (doi:10.1109/ESTC.2008.4684409)

microwave, polymer, optimisation, multiphysics, simulation

Tilford, Tim ORCID: https://orcid.org/0000-0001-8307-6403, Sinclair, Keith I., Rajaguru, P.R., Morris, James E., Desmulliez, Marc P.Y. and Bailey, Christopher ORCID: https://orcid.org/0000-0002-9438-3879 (2009) Numerical optimisation of polymer curing using a dual-section microwave system. Annual microwave heating symposium (43rd). pp. 129-136. ISSN 1070-0129

multi-physics, multi-disciplinary design,

Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879, Lu, H. ORCID: https://orcid.org/0000-0002-4392-6562, Tilford, T. ORCID: https://orcid.org/0000-0001-8307-6403, Rizvi, J. and Yin, C. ORCID: https://orcid.org/0000-0003-0298-0420 (2009) Co-design and multi-physics analysis for power electronic modules. In: 2009 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2009. IEEE Computer Society, Piscataway, NJ USA. ISBN 9781424441600 (doi:10.1109/ESIME.2009.4938505)

numerical simulation, numerical modelling, microwave thawing of frozen food, coupled electromagnetic and heat transfer computations

Tilford, Timothy ORCID: https://orcid.org/0000-0001-8307-6403, Baginski, E., Kelder, J., Pericleous, Koulis A. ORCID: https://orcid.org/0000-0002-7426-9999 and Parrott, Kevin (2006) Microwave modeling and validation in food applications. Annual microwave heating symposium (40th). pp. 208-212. ISSN 1070-0129

open-ended microwave oven, curing

Pavuluri, S.K., Ferenets, M., Goussetis, G., Desmulliez, M.P.Y., Tilford, T. ORCID: https://orcid.org/0000-0001-8307-6403, Adamietz, R., Muller, G., Eicher, F. and Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879 (2010) Experimental investigation of open-ended microwave oven assisted encapsulation process. In: Electronics System Integration Technology Conference, ESTC 2010 - Proceedings. IEEE Computer Society, Piscataway, NJ, USA, pp. 1-6. ISBN 978-1-4244-8553-6 (print), 978-1-4244-8554-3 (online) (doi:10.1109/ESTC.2010.5643015)

optical coherence tomography, low-cost, non-destructive evaluation, 3D imaging, high-speed, simulation

Yang, Xingyu, Zhang, Zijian, Li, Xinhua, Lin, Hungyen, Lawman, Samuel, Stoyanov, Stoyan ORCID: https://orcid.org/0000-0001-6091-1226, Tilford, Timothy ORCID: https://orcid.org/0000-0001-8307-6403, Hu, Yihua, Shen, Yaochun and Zheng, Yalin (2024) High-speed low-cost line-field spectral-domain optical coherence tomography for industrial applications. Optics and Lasers in Engineering, 184 (PART 1):108631. ISSN 0143-8166 (Print), 1873-0302 (Online) (doi:10.1016/j.optlaseng.2024.108631)

polymer encapsulant, curing, convection oven, microwave system

Tilford, Tim ORCID: https://orcid.org/0000-0001-8307-6403, Sinclair, Keith I., Goussetis, George, Bailey, Christopher ORCID: https://orcid.org/0000-0002-9438-3879, Desmulliez, Marc P.Y., Parrott, Kevin and Sangster, Alan J. (2008) Comparison of encapsulant curing with convention and microwave systems. 33rd IEEE/CPMT International Electronic Manufacturing Technology Symposium (IEMT), 2008. IEEE, Piscataway, NJ, USA. ISBN 9781424433926 (print) 9781424433933 (electronic) (doi:10.1109/IEMT.2008.5507869)

pome fruits, apples, fungal infections, mass spectrometry, machine learning, neural networks

Abdul Kareem, Razia Sulthana ORCID: https://orcid.org/0000-0001-5331-1310, Frost, Nageena, Goodall, Iain, Tilford, Timothy ORCID: https://orcid.org/0000-0001-8307-6403 and Palacios, Ana Paula (2024) Machine learning to detect fungal infections in stored pome fruits via mass spectrometry data: industry, economic, and social implications. Journal of Advances in Information Technology, 15 (10). pp. 1174-1183. ISSN 1798-2340 (Print), 1798-2340 (Online) (doi:10.12720/jait.15.10.1174-1183)

power components, IGBT, reliability, solder interconnects, metamodels, thermal fatigue, damage, machine learning

Stoyanov, Stoyan ORCID: https://orcid.org/0000-0001-6091-1226, Tilford, Tim ORCID: https://orcid.org/0000-0001-8307-6403, Shen, Yaochun and Hu, Yihua (2024) Reliability meta-modelling of power components. In: 2024 47th International Spring Seminar on Electronics Technology (ISSE). Institute of Electrical and Electronics Engineers (IEEE), New Jersey, USA, pp. 1-7. ISBN 979-8350385489 ISSN 2161-2536 (Print), 2161-2528 (Online) (doi:10.1109/ISSE61612.2024.10604175)

power electronic module; reliability; machine learning; ML; metamodel; wire bonds; failure; finite element analysis; damage modelling

Stoyanov, Stoyan ORCID: https://orcid.org/0000-0001-6091-1226, Tilford, Timothy ORCID: https://orcid.org/0000-0001-8307-6403, Zhang, Xiaotian, Hu, Yihua, Yang, Xingyu and Shen, Yaochun (2024) Physics-informed Machine Learning for predicting fatigue damage of wire bonds in power electronic modules. In: 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE). IEEE Xplore (IEEE digital library) . Institute of Electrical and Electronics Engineers (IEEE), Piscataway, New Jersey, pp. 1-8. ISBN 979-8350393644 ISSN 2833-8596 (Print), 2833-8553 (Online) (doi:10.1109/EuroSimE60745.2024.10491522)

power electronic module; wirebond; damage; fatigue failure; viscoplastic behaviour; creep

Rajaguru, Pushpa ORCID: https://orcid.org/0000-0002-6041-0517, Tilford, Tim ORCID: https://orcid.org/0000-0001-8307-6403, Bailey, Chris ORCID: https://orcid.org/0000-0002-9438-3879 and Stoyanov, Stoyan ORCID: https://orcid.org/0000-0001-6091-1226 (2023) Damage mechanics-based failure prediction of wirebond in power electronic module. IEEE Access. ISSN 2169-3536 (doi:10.1109/ACCESS.2023.3342689)

power electronic modules, packaging technology, reliability prediction

Tilford, Tim ORCID: https://orcid.org/0000-0001-8307-6403, Lu, Hua ORCID: https://orcid.org/0000-0002-4392-6562 and Bailey, Christopher ORCID: https://orcid.org/0000-0002-9438-3879 (2006) Thermo-mechanical modelling of power electronics module structures. 2006 8th Electronics Packaging Technology Conference (EPTC 2006) : 6-8 December 2006, Singapore. IEEE, Picsataway, N.J., pp. 214-219. ISBN 1424406641 (doi:10.1109/EPTC.2006.342718)

power electronics; reliability; numerical analysis

Zhang, Xiaotian, Hu, Yihua, Zhang, Jingwei, Esfahani, Mohammad Nasr, Tilford, Tim ORCID: https://orcid.org/0000-0001-8307-6403 and Stoyanov, Stoyan ORCID: https://orcid.org/0000-0001-6091-1226 (2024) IGBT module DPT efficiency enhancement via multimodal fusion networks and graph convolution networks. IEEE Transactions on Industrial Electronics. ISSN 0278-0046 (Print), 1557-9948 (Online) (doi:10.1109/TIE.2024.3368165)

thermal processing, open-ended applicator, microwave oven

Pavuluri, S.K., Goussetis, George, Desmulliez, Marc P.Y., Adamietz, R., Tilford, Tim ORCID: https://orcid.org/0000-0001-8307-6403, Ferenets, M., Muller, G., Eicher, F. and Bailey, Christopher ORCID: https://orcid.org/0000-0002-9438-3879 (2011) Open-ended single mode resonant applicator for microelectronics packaging applications. Proceedings of the Microwave Heating and Processing of Materials Seminar 2011. IET, pp. 89-91. ISBN 978 1 84919 310 8

topological optimization, microelectronics, thermal management, engineering design, level-set method

Santhanakrishnan, Mani sekaran, Tilford, Tim ORCID: https://orcid.org/0000-0001-8307-6403 and Bailey, Chris ORCID: https://orcid.org/0000-0002-9438-3879 (2019) Multi-material heatsink design using level-set topology optimization. IEEE Transactions on Components, Packaging and Manufacturing Technology, 9 (8). pp. 1504-1513. ISSN 2156-3950 (Print), 2156-3985 (Online) (doi:10.1109/TCPMT.2019.2929017)

topology optimization, level-set method, heat sink, thermal diffusivity

Rajaguru, Pushparajah ORCID: https://orcid.org/0000-0002-6041-0517, Santhanakrishnan, Manisekaran, Tilford, Tim ORCID: https://orcid.org/0000-0001-8307-6403 and Bailey, Chris ORCID: https://orcid.org/0000-0002-9438-3879 (2019) Design of additively manufactured heatsinks for power electronics thermal management using adjoint level-set topology optimization. In: 2019 25th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC). IEEE. ISBN 978-1728120782 ISSN 2474-1515 (Print), 2474-1523 (Online) (doi:10.1109/THERMINIC.2019.8923530)

variable frequency microwave (VFM), chip-on-board (COB) assembly, multiphysics modelling, frequency agile microwave oven bonding system (FAMOBS)

Tilford, Tim ORCID: https://orcid.org/0000-0001-8307-6403, Pavuluri, S., Bailey, Christopher ORCID: https://orcid.org/0000-0002-9438-3879 and Desmulliez, Marc P.Y. (2009) On variable frequency microwave processing of heterogeneous chip-on-board assemblies. International Conference on Electronic Packaging Technology & High Density Packaging, 2009. ICEPT-HDP '09. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 927-931. ISBN 978-1-4244-4659-9 (doi:10.1109/ICEPT.2009.5270558)